CN110808270A - Organic light-emitting panel packaging structure - Google Patents
Organic light-emitting panel packaging structure Download PDFInfo
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- CN110808270A CN110808270A CN201911101267.9A CN201911101267A CN110808270A CN 110808270 A CN110808270 A CN 110808270A CN 201911101267 A CN201911101267 A CN 201911101267A CN 110808270 A CN110808270 A CN 110808270A
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- insulating layer
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- organic light
- substrate
- light emitting
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides an organic light-emitting panel packaging structure, which comprises a first substrate (210) and organic packaging glue (270); the first substrate (210) includes, in order, a driving part (230), an organic insulating layer (250), an inorganic insulating layer (260), and an organic light emitting diode (240) electrically contacted with the driving part (230) through a via hole penetrating the organic insulating layer (250) and the inorganic insulating layer (260); characterized in that the organic insulating layer (250) comprises a horizontal portion (2501) and a protruding portion (2502) located at an edge of the horizontal portion (2501) on a side away from the first substrate (210); the protruding portion (2502) surrounds the organic light emitting diode (240), and the horizontal portion (2501) extends throughout the first substrate (210); the vertical section of the protruding part (2502) is trapezoidal, and a step is arranged on the side surface of the protruding part (250). The organic light-emitting panel packaging structure can not improve the packaging effect of the organic light-emitting panel as much as possible, but also can reduce the width of a packaging frame.
Description
Technical Field
The invention relates to the technical field of organic light emitting, in particular to an organic light emitting panel packaging structure.
Background
The organic light emitting diode has the advantages of simple preparation process, diversified materials, flexibility, surface light emission, low cost and the like, and is more and more concerned by the lighting industry as a novel lighting source technology. Since the organic light emitting diode is very sensitive to air and water vapor, it is generally required to package the organic light emitting diode substrate 110 and the encapsulation substrate 120 together using an organic encapsulation adhesive 130, as shown in fig. 1. Since the thickness of the organic encapsulation adhesive 130 is almost equal to that of the organic light emitting panel, a large area of the organic encapsulation adhesive 130 is exposed to the outside air. Oxygen and water vapor in the external air may permeate into the sealing space through the holes and defects in the organic encapsulation paste 130, so that the electrical performance of the organic light emitting diode in the sealing space is deteriorated. In addition, in order to improve the sealing effect of the package structure, the width W of the organic encapsulation adhesive 130 in the package structure of fig. 1 generally needs to be increased. However, the increase in the width of the organic encapsulation paste 130 is obviously disadvantageous for narrow bezel illumination.
Disclosure of Invention
In view of the above problems, the present invention provides an organic light emitting panel package structure, which can not only improve the organic light emitting panel package effect, but also reduce the width of the package frame.
The invention provides an organic light-emitting panel packaging structure, which comprises a first substrate 210 and organic packaging glue 270; the first substrate 210 sequentially includes a driving part 230, an organic insulating layer 250, an inorganic insulating layer 260, and an organic light emitting diode 240 electrically contacted with the driving part 230 by penetrating through holes in the organic insulating layer 250 and the inorganic insulating layer 260; wherein the organic insulating layer 250 includes a horizontal portion 2501 and a protruding portion 2502 located at an edge of the horizontal portion 2501 on a side away from the first substrate 210; the protruding portion 2502 surrounds the organic light emitting diode 240, and the horizontal portion 2501 extends throughout the first substrate 210; the vertical section of the protruding portion 2502 is trapezoidal, and a step is arranged on the side surface of the protruding portion 250; the inorganic insulating layer 260 covers the entire organic insulating layer 250; the organic encapsulation adhesive 270 is disposed on the inorganic insulating layer 260 on the top of the protrusion portion 2502, on the side away from the first substrate 210, and surrounds the entire organic light emitting diode 240.
The driving part 230 may be a thin film transistor TFT, or a metal electrode, among others.
The material of the organic insulating layer 250 may be polyimide or resin.
The material of the inorganic insulating layer 260 may be silicon oxide SiOx, silicon nitride SiNx, or silicon oxynitride SiNxOy.
Wherein, the thickness of the organic insulating layer 250 is 5 to 20 micrometers, and the thickness of the inorganic insulating layer 260 is 5 to 550 nanometers.
The invention also provides a preparation method of the organic light-emitting panel packaging structure, which comprises the following steps:
s1, forming a driving part 230 on the first substrate 210;
s2, forming an organic insulating layer 250 on the driving part 230, the organic insulating layer 250 covering not only the driving part 230 but also other regions of the first substrate 210 except the driving part 230;
s3, patterning the organic insulation layer 250 by using a photolithography technique and an etching process, such that the organic insulation layer 250 includes a horizontal portion 2501 and a protruding portion 2502 located on a side of the horizontal portion 2501 away from the first substrate 210, and the protruding portion 2502 is located at an edge of the horizontal portion 2501;
s4, etching a step on the side of the protrusion 2502 using photolithography and etching processes;
s5, preparing an inorganic insulating layer 260 on the organic insulating layer 250;
s6, etching a through hole penetrating the inorganic insulating layer 260 and the organic insulating layer 250 at the position of the horizontal portion 2501 of the organic insulating layer 250 using photolithography and etching processes, the bottom of the through hole reaching the driving part 230;
s7, an organic light emitting diode 240 is formed on the surface of the inorganic insulating layer 260 at the position of the horizontal portion 2501, and the first electrode 2401 of the organic light emitting diode 240 is connected to the driving part 230 through a via hole.
The driving part 230 may be a thin film transistor TFT, or a metal electrode, among others.
The material of the organic insulating layer 250 may be polyimide or resin.
The material of the inorganic insulating layer 260 may be silicon oxide SiOx, silicon nitride SiNx, or silicon oxynitride SiNxOy.
Wherein, the thickness of the organic insulating layer 250 is 5 to 20 micrometers, and the thickness of the inorganic insulating layer 260 is 5 to 550 nanometers.
Drawings
Fig. 1 is a schematic view of a conventional organic light emitting panel.
Fig. 2 is a schematic diagram of an organic light emitting panel package structure according to an embodiment of the present invention.
Fig. 3 to 9 are processes for manufacturing an organic light emitting panel package structure according to an embodiment of the present invention.
Detailed Description
Embodiments of the present application will be described in detail by examples, so that how to apply technical means to solve technical problems and achieve technical effects of the present application can be fully understood and implemented.
Fig. 2 is a schematic diagram of an organic light emitting panel package structure according to an embodiment of the present invention. The organic light emitting panel includes a first substrate 210 and an organic encapsulation adhesive 270. The first substrate 210 includes a driving part 230, an organic insulating layer 250, an inorganic insulating layer 260, and an organic light emitting diode 240 electrically contacted with the driving part 230 through a via hole penetrating the organic insulating layer 250 and the inorganic insulating layer 260, in this order. The driving part 230 may be a thin film transistor TFT, or a metal electrode. The material of the organic insulating layer 250 may be polyimide, resin, or the like. The material of the inorganic insulating layer 260 may be silicon oxide SiOx, silicon nitride SiNx, silicon oxynitride SiNxOy, or the like. The organic light emitting diode 240 includes a first electrode 2401, a second electrode 2403, and an organic light emitting layer 2402 between the first electrode 2401 and the second electrode 2403. The organic insulating layer 250 includes a horizontal portion 2501 and a protruding portion 2502 at an edge of a side of the horizontal portion 2501 away from the first substrate 210. The protruding portion 2502 surrounds the organic light emitting diode 240, and the horizontal portion 2501 extends throughout the first substrate 210. The vertical section of the protrusion 2502 is trapezoidal, and a step is provided on the side of the protrusion 250. The inorganic insulating layer 260 covers the entire organic insulating layer 250. The organic encapsulation adhesive 270 is disposed between the first substrate 210 and the second substrate 220. The organic encapsulation adhesive 270 is disposed on the inorganic insulating layer 260 on the top of the protrusion portion 2502, on the side away from the first substrate 210, and surrounds the entire organic light emitting diode 240.
Since the organic encapsulation paste 270 is disposed on the top of the protrusion 2502, the thickness of the organic encapsulation paste 270 of the organic light emitting panel of the present invention is smaller than that of the organic encapsulation paste of the conventional organic light emitting panel (i.e., shown in fig. 1) under the same thickness of the organic light emitting panel, since the total area of the organic encapsulation paste exposed to the external environment is much smaller than that of the organic encapsulation paste of the conventional organic light emitting panel exposed to the air, the problem of permeation of oxygen and water vapor in the air through the pores and defects of the organic encapsulation paste can be prevented, and further, since organic materials like polyimide, resin, etc. can be easily prepared as thick as several tens of micrometers in engineering, only several hundred nanometers, even several tens of nanometers of inorganic insulating layers are required to cover the surface of the organic insulating layer to prevent permeation of oxygen and water vapor in the air into the sealed space through the pores and defects of the organic insulating layer, the stress in the inorganic insulating layer is small, no crack is generated, and further, since the thickness of the inorganic insulating layer disposed on the side of the protrusion 2502 is several hundred nanometers, the side of the protrusion and the step portion α is continuously reduced, and the width of the inorganic insulating layer is also ensured under the condition of a narrow frame.
Fig. 3 to 9 are processes for manufacturing an organic light emitting panel package structure according to an embodiment of the present invention. Reference numerals in fig. 3 to 9 are the same as those in fig. 2, and thus reference is made to fig. 2 while omitting reference numerals in fig. 3 to 9.
The preparation process comprises the following steps: s1, a driving part 230 is formed on the first substrate 210, as shown in fig. 3. S2, an organic insulating layer 250 is formed on the driving part 230, and the organic insulating layer 250 covers not only the driving part 230 but also other regions of the first substrate 210 except for the driving part 230, as shown in fig. 4. The organic insulating layer 250 has a thickness of 5 to 20 micrometers. S3, the organic insulation layer 250 is patterned by using a conventional photolithography technique and an etching process, such that the organic insulation layer 250 includes a horizontal portion 2501 and a protruding portion 2502 located on a side of the horizontal portion 2501 away from the first substrate 210, and the protruding portion 2502 is located at an edge of the horizontal portion 2501, as shown in fig. 5. S4, a step is etched on the side of the protrusion 2502 by photolithography and etching process, as shown in fig. 6. S5, an inorganic insulating layer 260 is formed on the organic insulating layer 250, as shown in fig. 7. The inorganic insulating layer 260 has a thickness of 5 to 550 nm. S6, a via hole penetrating the inorganic insulating layer 260 and the organic insulating layer 250 is etched at the position of the horizontal portion 2501 of the organic insulating layer 250 using a photolithography technique and an etching process, the bottom of the via hole reaching the driving part 230, as shown in fig. 8. S7, an organic light emitting diode 240 is formed on the surface of the inorganic insulating layer 260 at the position of the horizontal portion 2501, and the first electrode 2401 of the organic light emitting diode 240 is connected to the driving part 230 through a via hole, as shown in fig. 9. S8, the first substrate 210 and the second substrate 220 are sealed by an organic packaging adhesive 270, wherein the organic packaging adhesive 270 is located on the side of the inorganic insulating layer 260 away from the first substrate 210 on the top of the protrusion 2502 and surrounds the entire organic light emitting diode 240, as shown in fig. 2.
There are many other possible embodiments of the present invention, which are not listed here, and the embodiments claimed in the claims of the present invention can be implemented. Further, the contents not described in detail in the specification of the present application belong to the common general knowledge of those skilled in the art.
Claims (10)
1. An organic light emitting panel packaging structure comprises a first substrate (210), organic packaging glue (270); the first substrate (210) includes, in order, a driving part (230), an organic insulating layer (250), an inorganic insulating layer (260), and an organic light emitting diode (240) electrically contacted with the driving part (230) through a via hole penetrating the organic insulating layer (250) and the inorganic insulating layer (260); characterized in that the organic insulating layer (250) comprises a horizontal portion (2501) and a protruding portion (2502) located at an edge of the horizontal portion (2501) on a side away from the first substrate (210); the protruding portion (2502) surrounds the organic light emitting diode (240), and the horizontal portion (2501) extends throughout the first substrate (210); the vertical section of the protruding part (2502) is trapezoidal, and a step is arranged on the side surface of the protruding part (250); the organic packaging adhesive (270) is positioned on the side of the inorganic insulating layer (260) on the top of the protruding portion (2502) far away from the first substrate (210), and surrounds the whole organic light emitting diode (240).
2. The organic light-emitting panel package structure according to claim 1, wherein the driving part (230) is a Thin Film Transistor (TFT), or a metal electrode.
3. The organic light-emitting panel package structure according to claim 1, wherein the material of the organic insulating layer (250) is polyimide, resin.
4. The organic light-emitting panel package structure according to claim 1, wherein the material of the inorganic insulating layer (260) is selected from the group consisting of silicon oxide SiOx, silicon nitride SiNx, and silicon oxynitride SiNxOy.
5. The organic light-emitting panel package structure according to claim 1, wherein the organic insulating layer (250) has a thickness of 5 to 20 μm, and the inorganic insulating layer (260) has a thickness of 5 to 550 nm.
6. A method of manufacturing an organic light emitting panel package structure according to claim 1, the method comprising:
s1, forming a driving component (230) on the first substrate (210);
s2, forming an organic insulating layer 250 on the driving part 230, wherein the organic insulating layer 250 not only covers the driving part 230, but also covers other areas of the first substrate 210 except the driving part 230;
s3, patterning the organic insulation layer (250) by using a photolithography technique and an etching process, such that the organic insulation layer (250) includes a horizontal portion (2501) and a protruding portion (2502) located on a side of the horizontal portion (2501) away from the first substrate (210), and the protruding portion (2502) is located at an edge of the horizontal portion (2501);
s4, etching a step on the side of the protrusion (2502) using photolithography and etching processes;
s5, preparing an inorganic insulating layer (260) on the organic insulating layer (250);
s6, etching a through hole penetrating the inorganic insulating layer (260) and the organic insulating layer (250) at the position of the horizontal part (2501) of the organic insulating layer (250) by utilizing the photoetching technology and the etching process, wherein the bottom of the through hole reaches the driving part (230);
s7, preparing an organic light emitting diode (240) on the surface of the inorganic insulating layer (260) at the position of the horizontal position (2501), and connecting a first electrode (2401) of the organic light emitting diode (240) with the driving part (230) through a through hole.
7. The method for manufacturing an organic light-emitting panel package structure according to claim 6, wherein the material of the organic insulating layer (250) is polyimide or resin.
8. The method of claim 6, wherein the inorganic insulating layer (260) is selected from the group consisting of SiOx, SiNx, and SiNxOy.
9. The method of claim 6, wherein the organic insulating layer (250) has a thickness of 5-20 μm and the inorganic insulating layer (260) has a thickness of 5-550 nm.
10. The method of claim 6, wherein the driving member (230) is a Thin Film Transistor (TFT) or a metal electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911101267.9A CN110808270A (en) | 2019-11-12 | 2019-11-12 | Organic light-emitting panel packaging structure |
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| CN201911101267.9A CN110808270A (en) | 2019-11-12 | 2019-11-12 | Organic light-emitting panel packaging structure |
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| CN110808270A true CN110808270A (en) | 2020-02-18 |
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2019
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| CN1671255A (en) * | 2004-03-16 | 2005-09-21 | 株式会社半导体能源研究所 | Display device |
| CN101136428A (en) * | 2006-08-30 | 2008-03-05 | 精工爱普生株式会社 | Organic electroluminescence device, manufacturing method therefor, and electronic apparatus |
| US20080211393A1 (en) * | 2007-02-02 | 2008-09-04 | Hiroyuki Yaegashi | Light emitting apparatus |
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Application publication date: 20200218 |