CN110799021B - Heat sink and converter - Google Patents
Heat sink and converter Download PDFInfo
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- CN110799021B CN110799021B CN201911125164.6A CN201911125164A CN110799021B CN 110799021 B CN110799021 B CN 110799021B CN 201911125164 A CN201911125164 A CN 201911125164A CN 110799021 B CN110799021 B CN 110799021B
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- heat dissipation
- heat
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- sink
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 254
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 238000009434 installation Methods 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 5
- 230000005855 radiation Effects 0.000 description 13
- 238000001816 cooling Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明公开了一种散热装置及变流器，所述散热装置包括：基板和散热组件；所述基板具有用于安装功率器件的第一散热区和与所述第一散热区相邻的第二散热区；所述散热组件设于所述基板，所述散热组件具有对应所述第一散热区设置的第一散热部和对应所述第二散热区设置的第二散热部，所述第一散热部的散热能力大于所述第二散热部的散热能力。本发明技术方案中，通过设置不同散热能力的散热部解决了散热器散热不均匀的问题。
The present invention discloses a heat dissipation device and a converter, wherein the heat dissipation device comprises: a substrate and a heat dissipation assembly; the substrate has a first heat dissipation area for mounting a power device and a second heat dissipation area adjacent to the first heat dissipation area; the heat dissipation assembly is arranged on the substrate, and the heat dissipation assembly has a first heat dissipation part arranged corresponding to the first heat dissipation area and a second heat dissipation part arranged corresponding to the second heat dissipation area, and the heat dissipation capacity of the first heat dissipation part is greater than the heat dissipation capacity of the second heat dissipation part. In the technical solution of the present invention, the problem of uneven heat dissipation of the radiator is solved by arranging heat dissipation parts with different heat dissipation capacities.
Description
Technical Field
The present invention relates to the field of heat dissipation devices, and in particular, to a heat dissipation device and a current transformer.
Background
Along with the development of economy and technological progress, more and more electric equipment is driven into life and work of people. Among them, the heat dissipation problem related to the service life of the electric equipment is widely focused. At present, an air-cooled radiator is often used for radiating heat of electric equipment. In the related art, the air-cooled radiator is generally provided with an air inlet and an air outlet, and cold air is blown to the air outlet from the air inlet, so that heat generated in the use process of electric equipment is taken away. But because the air temperature at the air inlet is lower, more heat can be taken away, and the higher the air temperature at the air outlet is, the less heat can be taken away. Thereby make the heat dissipation of whole radiator inhomogeneous, lead to whole radiator temperature inhomogeneous, and then lead to the heat dissipation inhomogeneous of the consumer that sets up towards the air outlet direction along the air intake direction, seriously influence the life of consumer.
Disclosure of Invention
The invention mainly aims to provide a heat dissipation device and a converter, and aims to solve the problem of uneven heat dissipation of a radiator in the related art.
In order to achieve the above object, the present invention provides a heat dissipating device comprising:
A substrate having a first heat dissipation area for mounting a power device and a second heat dissipation area adjacent to the first heat dissipation area;
The heat dissipation assembly is arranged on the substrate and is provided with a first heat dissipation part corresponding to the first heat dissipation area and a second heat dissipation part corresponding to the second heat dissipation area, and the heat dissipation capacity of the first heat dissipation part is larger than that of the second heat dissipation part.
Further, the heat dissipation assembly comprises heat dissipation fins, the heat dissipation fins comprise a plurality of first heat dissipation fins used for forming a first heat dissipation portion and a plurality of second heat dissipation fins used for forming a second heat dissipation portion, the second heat dissipation portion is arranged on one side of the first heat dissipation portion, the heat dissipation area of the first heat dissipation fins is larger than that of the second heat dissipation fins, and the heat dissipation areas of at least two second heat dissipation fins are gradually shortened in a direction away from the first heat dissipation portion.
Further, the lengths of the first radiating fins are larger than the lengths of the second radiating fins, and the lengths of at least two second radiating fins are gradually reduced in a direction away from the first radiating portion.
Further, one end of the first heat sink is flush with one end of the second heat sink.
Further, the width of the first heat sink is larger than the width of the second heat sink, and the widths of at least two of the second heat sinks gradually decrease in a direction away from the first heat sink.
Further, the thickness of the radiating fins ranges from 0.3mm to 1.5mm, and the distance between two adjacent radiating fins ranges from 1mm to 5mm.
Further, two second heat dissipation portions are provided, and the two second heat dissipation portions are respectively arranged on two sides of the first heat dissipation portion.
Further, the heat dissipation assembly includes a heat dissipation fin including a plurality of first heat dissipation fins for forming a first heat dissipation portion and a plurality of second heat dissipation fins for forming a second heat dissipation portion, wherein the thickness of the first heat dissipation fins is smaller than the thickness of the second heat dissipation fins, so that the distribution density of the heat dissipation fins of the first heat dissipation portion is greater than the distribution density of the heat dissipation fins of the second heat dissipation portion.
Further, the heat dissipation assembly comprises heat dissipation fins, wherein the heat dissipation fins comprise a plurality of first heat dissipation fins used for forming first heat dissipation parts and a plurality of second heat dissipation fins used for forming second heat dissipation parts, and gaps between two adjacent first heat dissipation fins are smaller than gaps between two adjacent second heat dissipation fins, so that the heat dissipation fin distribution density of the first heat dissipation parts is larger than that of the second heat dissipation parts.
Further, the heat dissipating device further comprises an air guide piece, the air guide piece is arranged on the base plate, an installation cavity with two open ends is formed between the air guide piece and the base plate, and the heat dissipating component is arranged in the installation cavity.
Further, the heat dissipation device further comprises a heat dissipation tube, the heat dissipation tube is arranged on one side of the substrate, which is away from the heat dissipation assembly, and the heat dissipation tube is arranged between the substrate and the power device; and/or the number of the groups of groups,
The surface of base plate is equipped with the heat conduction layer, the heat conduction layer is located the base plate deviate from the one side of radiator unit.
The invention also provides a converter comprising the heat dissipation device.
Compared with the prior art, the invention has the following beneficial effects:
According to the technical scheme, the radiating parts with different radiating capacities are arranged to radiate the substrate provided with the heating device in a targeted manner, so that the uniform temperature radiation of the radiator is realized, the radiator radiates the power device more uniformly, and the service life of the power device is prolonged. Meanwhile, the heat radiator is subjected to targeted heat radiation setting in the scheme of the invention, so that the heat radiator can take away heat energy generated by the power device at the fastest speed with the minimum cold energy, energy is saved, and heat radiation efficiency is greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a heat dissipating device according to an embodiment of the present invention;
FIG. 2 is a schematic view of a portion of the heat dissipating device shown in FIG. 1;
FIG. 3 is another view of FIG. 2;
FIG. 4 is a schematic view of a portion of a heat dissipating device according to another embodiment of the present invention;
Fig. 5 is another view of fig. 4.
Reference numerals illustrate:
| Reference numerals | Name of the name | Reference numerals | Name of the name |
| 100 | Heat dissipation device | 121 | First radiating fin |
| 110 | Substrate board | 122 | Second radiating fin |
| 111 | Mounting hole | 130 | Wind guide |
| 120 | Heat dissipation assembly | 200 | Power device |
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The invention provides a heat dissipation device which is suitable for electrical equipment with heating power devices, such as a converter or a frequency converter.
Referring to fig. 1 and 2, the present invention proposes a heat dissipating device 100, the heat dissipating device 100 comprising:
a substrate 110 having a first heat dissipation area for mounting the power device 200 and a second heat dissipation area adjacent to the first heat dissipation area;
the heat dissipation assembly 120 is disposed on the substrate 110, and the heat dissipation assembly 120 has a first heat dissipation portion corresponding to the first heat dissipation area and a second heat dissipation portion corresponding to the second heat dissipation area, where the heat dissipation capacity of the first heat dissipation portion is greater than that of the second heat dissipation portion.
In the present embodiment, in order to realize support and heat dissipation of the power device 200, the substrate 110 is provided. The substrate 110 is disposed at the bottom of the power device 200. It should be understood that a large amount of heat is generated by the power device 200 during the operation process, if the heat is not treated in time, the parts of the power device 200 are aged, the service life of the parts is greatly shortened, and even the internal circuit of the power device 200 is short-circuited due to the retention of a large amount of heat on the power device 200, so that a safety accident is caused. Therefore, in this embodiment, in order to reduce the damage of the heat to the power device 200, the heat dissipation assembly 120 is provided. The heat dissipation assembly 120 can quickly remove the heat generated by the power device 200, and shorten the natural heat balance time.
Further, due to the nature of heat source propagation, the heat propagated to the place where the power device 200 is in direct contact with the substrate 110 (i.e. the first heat dissipation portion) is larger, so as to save cold energy and improve the heat dissipation efficiency of the heat dissipation device 100, to pertinently dissipate heat of the substrate 110, i.e. the first heat dissipation portion is provided with a larger heat dissipation capability, so that more heat can be taken away; the second heat dissipation part has smaller heat dissipation capacity, so as to save cold energy and raw materials of the heat dissipation assembly 120 and save cost. Meanwhile, by performing targeted heat dissipation on the substrate 110, the temperature on the whole substrate 110 can be kept basically consistent, so that the temperature at the bottom of the power device 200 is kept consistent, the uniform temperature heat dissipation effect of the power device 200 is enhanced, the heat dissipation effect of the whole power device 200 is more balanced, and the service life of the power device 200 can be greatly prolonged.
In one embodiment, in order to achieve tight connection between the power device 200 and the substrate 110, to prevent the power device 200 from being misplaced and separated from the substrate 110 during use, mounting holes 111 for mounting the power device 200 are provided in the substrate 110. It should be understood that the power device 200 is provided with a mounting member that is matched with the mounting hole 111, and the mounting member is matched with the mounting hole 111.
Alternatively, a plurality of the power devices 200 are provided, and in this case, a plurality of the mounting holes 111 are also provided, and the mounting holes 111 are provided in one-to-one correspondence with the power devices 200.
From the above, the working principle of the heat dissipating device 100 in the embodiment of the present invention is as follows: (for better explanation of the working principle of the embodiment, the air-cooled heat dissipation device 100 is selected as an example to perform heat dissipation explanation), the embodiment of the present invention has at least three layers of heat dissipation effects. The first layer is to disperse the heat at the bottom of the power device 200 onto the substrate 110; the second layer is to disperse the heat received on the substrate 110 onto the heat dissipation component 120; the third layer is to take the heat received by the heat dissipating component 120 out of the heat dissipating device 100 by air cooling, and to take the heat dissipating component 120 and the substrate 110 out of the cold source by air cooling. Meanwhile, in order to protect the working parts of the heat dissipating device 100 to the greatest extent and prolong the service life of the working parts, the embodiment of the invention aims to realize the uniform temperature heat dissipation of the heat dissipating device 100 by combining the three heat dissipating approaches with the specific structure of the heat dissipating device 100 applied for protection in the embodiment of the invention through a new scheme of setting different heat dissipating capacities for different heat dissipating parts.
Further, referring to fig. 2 to 5, the heat dissipation assembly 120 includes heat dissipation fins including a plurality of first heat dissipation fins 121 for forming a first heat dissipation portion and a plurality of second heat dissipation fins 122 for forming a second heat dissipation portion, the second heat dissipation portion being disposed at one side of the first heat dissipation portion, the heat dissipation area of the first heat dissipation fins 121 being larger than the heat dissipation area of the second heat dissipation fins 122, and the heat dissipation areas of at least two of the second heat dissipation fins 122 being gradually reduced in a direction away from the first heat dissipation portion.
In the present embodiment, in order to realize different heat dissipation capacities of different heat dissipation portions, a plurality of first heat dissipation fins 121 and a plurality of second heat dissipation fins 122 are provided. The first heat sink 121 is disposed corresponding to a portion (i.e., the first heat dissipation portion) where the power device 200 directly contacts, and the second heat sink 122 is disposed at a portion (i.e., the second heat dissipation portion) where the power device 200 does not directly contact, that is, the heat received by the plurality of first heat sinks 121 is greater than the heat received by the plurality of second heat sinks 122. In order to form a heat radiation capability difference between the first heat radiation portion and the second heat radiation portion, the heat radiation area of the plurality of first heat radiation fins 121 located at the first heat radiation portion is larger than the heat radiation area of the plurality of second heat radiation fins 122 located at the second heat radiation portion. In this embodiment, the gradient distribution of heat dissipation capability is realized by the different areas of the heat dissipation fins on the different heat dissipation portions.
In an embodiment, the areas of the plurality of first heat sinks 121 are not equal, and the areas of the plurality of second heat sinks 122 are not equal. In the direction from the first heat dissipation portion to the second heat dissipation portion, the heat dissipation gradient distribution of gradually decreasing may be formed between the two heat dissipation fins, or the heat dissipation gradient distribution of jumping may be formed according to the actual setting position of the heat generating power device 200. In this way, the flexibility of the heat sink arrangement is enhanced.
In another embodiment, a part of the first heat dissipation fins 121 have the same area, and another part of the first heat dissipation fins 121 have different areas; some of the second heat sinks 122 have the same area, and the other of the second heat sinks 122 has different areas. The heat dissipation fins with the same heat dissipation area can be arranged together to form a heat dissipation part, and heat dissipation gradient distribution gradually decreasing step by step can be formed before different heat dissipation parts in the direction from the first heat dissipation part to the second heat dissipation part, and the heat dissipation gradient distribution can also be flexibly distributed according to the actual arrangement position of the heating power device 200; the radiating fins with the same part of radiating area can be arranged separately, and are flexibly arranged according to the arrangement position of the actual heating device and the heat required to radiate.
In yet another embodiment, a plurality of the heat sinks are integrally formed with the substrate 110. And different types of heat dissipation devices 100 are designed according to the number of the power devices 200 and the heat to be dissipated.
Specifically, the length of the first heat sink 121 is greater than the length of the second heat sink 122, and the lengths of at least two of the second heat sinks 122 gradually decrease in a direction away from the first heat sink.
In this embodiment, in order to achieve the area difference between the first heat sink 121 and the second heat sink 122 to achieve the heat dissipation capability difference between the first heat sink 121 and the second heat sink 122, when the width of the first heat sink 121 is equal to the width of the second heat sink 122, the length of the first heat sink 121 is set to be greater than the length of the second heat sink 122. Since the heat dissipating device 100 has an air inlet and an air outlet, in order to save raw materials and further directly transfer air cooling to one end of the air outlet of the heat dissipating device 100, the lengths of at least two second heat dissipating fins 122 are gradually decreased in a direction away from the first heat dissipating portion. It should be understood that, the length direction of the heat sink is the direction in which the heat sink is parallel to the contact direction of the substrate 110, and the width direction of the heat sink is the direction in which the heat sink is perpendicular to the substrate 110, which will be explained in detail below.
In one embodiment, one end of the first heat sink 121 is flush with one end of the second heat sink 122. The first heat sink 121 and the second heat sink 122 are flush at one end of the air outlet of the heat sink 100, and the first heat sink 121 and the second heat sink 122 are disposed in a stepped manner at one end of the air inlet of the heat sink 100.
In another embodiment, due to process errors, one end of the first heat sink 121 and one end of the second heat sink 122 are disposed near the air outlet side of the heat sink.
Specifically, the width of the first heat sink 121 is greater than the width of the second heat sink 122, and the widths of at least two of the second heat sinks 122 gradually decrease in a direction away from the first heat sink.
In this embodiment, in order to achieve the area difference between the first heat sink 121 and the second heat sink 122 to achieve the heat dissipation capability difference between the first heat sink 121 and the second heat sink 122, when the length of the first heat sink 121 is greater than the length of the second heat sink 122, the width of the first heat sink 121 is set to be greater than the width of the second heat sink 122. This makes it possible to provide the plurality of first fins 121 and the plurality of second fins 122 with an area gradient in at least two directions, that is, a heat radiation capability gradient.
Further, two second heat dissipation portions are provided, and the two second heat dissipation portions are respectively arranged on two sides of the first heat dissipation portion.
In this embodiment, in order to sufficiently save the raw material of the heat sink, two second heat dissipation portions are provided, and two or more second heat sinks 122 are provided correspondingly. It should be understood that, in order to make the working environment of the power device 200 relatively stable during actual working, the power device 200 is generally disposed on the central axis of the substrate 110, and the heat source is distributed on the central axis of the substrate 110, so that in this embodiment, two second heat dissipation portions are disposed on two sides of the first heat dissipation portion. At this time, a plurality of the second heat sinks 122 are provided on both sides of a plurality of the first heat sinks 121.
Further, the heat dissipating assembly 120 includes heat dissipating fins including a plurality of first heat dissipating fins 121 for forming a first heat dissipating portion and a plurality of second heat dissipating fins 122 for forming a second heat dissipating portion, wherein the thickness of the first heat dissipating fins 121 is smaller than the thickness of the second heat dissipating fins 122, so that the heat dissipating fins of the first heat dissipating portion have a distribution density greater than that of the second heat dissipating portion.
In this embodiment, when the spacing between two adjacent heat dissipating fins is the same, the thickness of the first heat dissipating fin 121 is set to be greater than the thickness of the second heat dissipating fin 122 in order to enhance the heat dissipating fin distribution density of the first heat dissipating portion to enhance the heat dissipating capability. This enables a larger heat dissipation capacity per unit area of the substrate 110 to be achieved to form a different heat dissipation capacity gradient between the first heat sink 121 and the second heat sink 122.
In an embodiment, the thickness of each of the first heat sinks 121 is unevenly distributed, and the thickness of each of the second heat sinks 122 is unevenly distributed. And thicker radiating fins are arranged at positions corresponding to or close to the power device 200; at a position distant from the power device 200, a thinner heat sink is provided.
Further, the heat dissipation assembly 120 includes heat dissipation fins including a plurality of first heat dissipation fins 121 for forming a first heat dissipation portion and a plurality of second heat dissipation fins 122 for forming a second heat dissipation portion, and a gap between two adjacent first heat dissipation fins 121 is smaller than a gap between two adjacent second heat dissipation fins 122, so that a heat dissipation fin distribution density of the first heat dissipation portion is greater than a heat dissipation fin distribution density of the second heat dissipation portion.
In this embodiment, when the thickness of each of the heat dissipation fins is the same, in order to enhance the heat dissipation capability of the first heat dissipation portion, the spacing between two adjacent first heat dissipation fins 121 is smaller than the spacing between two adjacent second heat dissipation fins 122. Thus, the density distribution of the heat radiating fins of the first heat radiating portion is greater than that of the second heat radiating portion in a unit area of the substrate 110, so that the heat radiating capability thereof forms a gradient distribution.
In one embodiment, the heat sinks are arranged in consideration of the thickness of the heat sink, the distance between two adjacent heat sinks and the combination thereof. Thinner cooling fins and wider intervals between two adjacent cooling fins are arranged at the positions corresponding to or close to the power device 200, so that a space with larger flow is formed, more cold air quantity takes away heat on the cooling fins, and cold and hot alternation is realized rapidly.
In another embodiment, the thickness of the radiating fins ranges from 0.3mm to 1.5mm, and the distance between two adjacent radiating fins ranges from 1mm to 5mm.
Specifically, referring to fig. 1, the heat dissipating device 100 further includes an air guide 130, the air guide 130 is disposed on the base plate 110, a mounting cavity with two open ends is formed between the air guide 130 and the base plate 110, and the heat dissipating component 120 is disposed in the mounting cavity.
In this embodiment, in order to save cooling energy, more cooling energy is retained between the heat dissipation components 120 and takes away heat, and an air guide 130 is provided. Optionally, the air guide 130 has a U-shaped structure, and forms a mounting cavity with the base plate 110 for mounting the heat dissipation component 120. And the installation cavity is an air guide groove for introducing cold energy into the heat dissipating device 100. The two ends of the installation cavity are provided with openings, namely an air inlet and an air outlet of the air guide groove. It should be understood that the air duct between the heat dissipation components 120 is in the same direction as the air guiding slot.
Specifically, the heat dissipating device 100 further includes a heat dissipating tube (not shown in the drawing), which is disposed on a side of the substrate 110 facing away from the heat dissipating component 120, and is disposed between the substrate 110 and the power device 200.
In this embodiment, in order to further uniformly disperse the heat received on the substrate 110 and transferred from the power device 200, and further reduce the thermal diffusion resistance of the substrate 110, a heat dissipation tube is provided. The radiating pipe is disposed between the substrate 110 and the power device 200. It should be appreciated that, in order to maintain a stable use environment of the power device 200 mounted on the substrate 110, the heat dissipating tube is embedded in the substrate 110, and the substrate 110 is provided with a mounting groove matched with the heat dissipating tube.
In an embodiment, the heat dissipating tube is further coated with a heat conducting material, and the heat conducting material is uniformly coated around the heat dissipating tube, so as to reduce the contact thermal resistance between the power device 200 and the substrate 110, and accelerate the heat transfer from the power device 200 to the substrate 110 and be taken away by the heat dissipating component 120.
Specifically, in order to simplify the structure of the heat dissipating device 100, a heat conducting layer is disposed on the surface of the substrate 110, where the heat conducting layer is located between the substrate 110 and the power device 200, and is used to disperse the heat received from the power device 200 onto the substrate 110, so that the heat is taken away more quickly, and meanwhile, the temperature of the heat dissipating device 100 can be kept uniform.
The invention also proposes a current transformer comprising a heat sink 100 as described above. The detailed structure of the heat dissipating device 100 can refer to the above embodiments, and will not be described herein; it can be understood that, since the heat dissipating device 100 is used in the current transformer of the present invention, the embodiments of the current transformer of the present invention include all the technical solutions of all the embodiments of the heat dissipating device 100, and the achieved technical effects are identical, and are not described herein again.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911125164.6A CN110799021B (en) | 2019-11-15 | 2019-11-15 | Heat sink and converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911125164.6A CN110799021B (en) | 2019-11-15 | 2019-11-15 | Heat sink and converter |
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| Publication Number | Publication Date |
|---|---|
| CN110799021A CN110799021A (en) | 2020-02-14 |
| CN110799021B true CN110799021B (en) | 2024-11-15 |
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|---|---|---|---|---|
| CN204539700U (en) * | 2015-05-07 | 2015-08-05 | 广东美的暖通设备有限公司 | Radiator, electric-controlled box and air conditioner |
| CN211378583U (en) * | 2019-11-15 | 2020-08-28 | 阳光电源股份有限公司 | Heat dissipation device and converter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110799021A (en) | 2020-02-14 |
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