CN110763061A - Vapor chamber and processing method thereof - Google Patents
Vapor chamber and processing method thereof Download PDFInfo
- Publication number
- CN110763061A CN110763061A CN201911052849.2A CN201911052849A CN110763061A CN 110763061 A CN110763061 A CN 110763061A CN 201911052849 A CN201911052849 A CN 201911052849A CN 110763061 A CN110763061 A CN 110763061A
- Authority
- CN
- China
- Prior art keywords
- metal
- foam
- layer
- copper powder
- upper cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention provides a soaking plate and a processing method thereof, wherein the soaking plate comprises an upper cover, a lower cover, a liquid absorption core and a working medium, the upper cover and the lower cover are welded into a box body with a cavity, the liquid absorption core and the working medium are arranged in the cavity of the box body, the liquid absorption core is foam metal or fluid copper powder, and the foam metal or the fluid copper powder is adhered in the upper cover. The invention further strengthens the heat dissipation effect by sintering the foam metal or the fluid copper powder, has the advantages of simple structure, good heat dissipation effect and low cost, and meets the requirements of lightness and thinness of portable electronic products.
Description
Technical Field
The invention belongs to the technical field of heat dissipation, and particularly relates to a vapor chamber and a processing method thereof.
Background
Portable terminal devices such as mobile phones are widely used in daily life. With the development of network technology, particularly with the popularization of 5G technology, the data transmission amount and data processing amount of portable terminal devices have increased explosively. Since the portable device is a portable device, the portable device is naturally required to have a lightweight property, and particularly, electronic products such as mobile phones are required to be light and thin, and under the trend, a very severe requirement is imposed on the thickness of the product. Materials and structural members used in portable electronic products such as mobile phones are required to be thinner and better under the condition of meeting performance requirements. With the explosive increase of data volume caused by the popularization of technologies such as 5G and the like, the processor performance and the data transmission chip performance of the mobile phone are required to be increased by times, and accordingly, the heat of corresponding components is improved. On one hand, the requirement of lightness and thinness of portable electronic products is met, and on the other hand, the improvement of the power consumption of a single component and the whole machine caused by the single component causes that the conventional heat dissipation material cannot meet the temperature requirement of high heat flow density in a short time. Forcing higher performance heat conducting parts such as: heat pipes and VC (vapor chamber) have been becoming ultra-thin. The common ultrathin heat pipe and the ultrathin VC in the market are 0.4mm most common at present. The heat-removing capability of the ultrathin VC exceeds that of the ultrathin heat pipe, but the use of the product still has a plurality of problems and still has a plurality of places needing to be improved. The product performance should be further improved, the product volume should be smaller, and the product price should be lower. The three problems correspond to three serious defects of the existing product, firstly, the copper mesh is utilized to generate capillary force, the two main positions of the capillary force are generated, one is the mutual lap joint between copper wires, and the other is the contact between the copper wires and the VC wall surface, and the capillary force generated by the two is far inferior to the porous capillary structure generated by sintering the traditional copper powder. Secondly, due to the adoption of the copper mesh structure, the wall surfaces of the VC are made of copper, the strength of the copper is limited, and the interior of the VC needs to be vacuumized, so that the VC is further thinned and extremely difficult, and the wall surfaces of the VC made thinner have to be made of metals with higher strength, such as stainless steel, titanium alloy and the like. Thirdly, the capillary structure manufactured by the through-mesh sintering is adopted, so that the sintered copper mesh is easy to fall off in the subsequent welding process. The structure is low in strength, the air path is easy to block, and the yield is low. Lower yields mean higher costs. The use of copper foam capillary structures will improve these three existing problems.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a soaking plate with good heat dissipation effect and a processing method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a soaking plate, includes upper cover, lower cover, imbibition core and working medium, the upper cover with the lower cover welding is the box body that has the cavity, imbibition core with working medium establishes in the cavity of box body, the imbibition core is foam metal or fluid copper powder, foam metal or fluid copper powder bonds in the upper cover.
For the improvement of the invention, the foam metal comprises a first layer of foam metal and a second layer of foam metal, the first layer of foam metal is arranged on the capillary wick side, the porosity of the first layer of foam metal is more than 50%, and the surface of the first layer of foam metal is hydrophilic; the second layer of foam metal is arranged on the side of the steam cavity, the porosity of the second layer of foam metal is larger than 85%, and the surface of the second layer of foam metal is hydrophobic.
For the improvement of the invention, the foam metal is fully filled in the cavity of the box body, and the foam metal is provided with a steam flow channel.
For the improvement of the invention, the foam metal is foam copper, foam stainless steel and foam titanium alloy.
For the improvement of the present invention, the fluid copper powder comprises copper powder and a binder.
For the improvement of the invention, a plurality of copper columns are arranged in the lower cover, and the copper columns are abutted with the liquid absorption core.
Correspondingly, the invention also provides a processing method of the soaking plate, which comprises the following steps:
manufacturing an upper cover and a lower cover, wherein the upper cover or the lower cover is provided with an exhaust hole;
the liquid absorption core is made of foam metal or fluid copper powder;
positioning, namely fixing the foam metal or the fluid copper powder in the upper cover;
sintering, namely sintering the foam metal or the fluid copper powder serving as a liquid absorption part to generate stronger capillary force;
welding, namely welding the upper cover and the lower cover into a box body, and inserting a vacuum tube into the exhaust hole;
injecting working medium into the box body from the vacuumizing pipe;
degassing and fixing the length, pumping out the air in the box body to ensure that the box body is in a vacuum state, cutting off the vacuumizing air pipe according to a preset length, and welding the vacuumizing air pipe.
For the improvement of the invention, the foam metal comprises a first layer of foam metal and a second layer of foam metal, the porosity of the first layer of foam metal is more than 50%, the porosity of the second layer of foam metal is more than 85%, the first layer of foam metal is arranged on the capillary wick side, and the second layer of foam metal is arranged on the steam cavity side.
For the improvement of the present invention, the fluid copper powder comprises copper powder and a binder.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a soaking plate and a processing method thereof, wherein the soaking plate comprises an upper cover, a lower cover, a liquid absorption core and a working medium, the upper cover and the lower cover are welded into a box body with a cavity, the liquid absorption core and the working medium are arranged in the cavity of the box body, the liquid absorption core is foam metal or fluid copper powder, and the foam metal or the fluid copper powder is adhered in the upper cover. The invention further strengthens the heat dissipation effect by sintering the foam metal or the fluid copper powder, has the advantages of simple structure, good heat dissipation effect and low cost, and meets the requirements of lightness and thinness of portable electronic products.
Drawings
FIG. 1 is a schematic plan view of the vapor chamber of the present invention;
FIG. 2 is a schematic cross-sectional view taken along line A-A of FIG. 1;
fig. 3 is a schematic plan view of the upper cover and wick in the vapor chamber of the present invention.
Detailed Description
In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1 to 3, the vapor chamber provided by the invention comprises an upper cover 1, a lower cover 2, a liquid absorption core 3 and a working medium 4, wherein the upper cover 1 and the lower cover 2 are welded to form a box body with a cavity, the liquid absorption core 3 and the working medium 4 are arranged in the cavity of the box body, the liquid absorption core 3 is foam metal or fluid copper powder, and the foam metal or the fluid copper powder is bonded in the upper cover 1. Assuming that a capillary wick 3 of 0.1mm is to be sintered, copper foam with a porosity greater than 50% (specific values of porosity are referenced to production data and comparative tests) is used, with a thickness selected from 0.15 to 0.2 mm. And positioning the foam copper on a copper sheet, putting the copper sheet into a furnace for sintering, and selecting temperature and time trial production according to a conventional copper mesh sintering parameter determination method to obtain optimal parameters. At the moment, a capillary porous structure similar to that generated by sintering copper powder can be obtained, the capacity of the capillary liquid absorption core 3 is greatly improved, and the performance of the product is improved.
Preferably, in order to further improve the yield of VC and further reduce the thickness of VC, the following method is required. Namely, the upper and lower layers of foam copper with different porosities are adopted. The copper foam on the capillary wick 3 side adopts the copper foam parameters and manufacturing parameters, and the copper foam with the capillary rate of more than 85% is adopted on the steam cavity side and is used as a steam circulation channel. The key points for ensuring the good effect of the whole VC by adopting the mode are two, one is the control of VC water injection quantity, the other is the different treatment modes of the upper and lower layers of foam copper, so as to facilitate the function of the foam copper, wherein the foam metal at the side of the capillary wick is sintered to ensure that the surface of the foam metal is hydrophilic. The metal foam surface of the vapor channel should be rendered hydrophobic, e.g., passivated, by a surface treatment; specifically, the metal foams comprise a first layer of metal foam 31 and a second layer of metal foam 32, the first layer of metal foam 31 is arranged on the capillary wick 3 side, the porosity of the first layer of metal foam 31 is greater than 50%, and the surface of the first layer of metal foam 31 is hydrophilic; the second layer of metal foam 32 is arranged on the side of the steam cavity, the porosity of the second layer of metal foam 32 is more than 85%, and the surface of the second layer of metal foam 32 is hydrophobic.
Preferably, the foam metal is fully filled in the cavity of the box body, when the foam metal is fully filled, a supporting copper column structure is not needed to be added in the cavity, the traditional soaking plate with the supporting copper column structure is used for preventing the deformation and the depression of the soaking plate, and a space supported by the supporting copper column is used as a steam flow channel; however, the second layer of foam metal 32 is not only used for heat dissipation, but also has the function of circulating the working medium 4 by adopting hydrophobic surface treatment, and the foam metal is provided with a steam flow channel. The vapor channels may be not only cavities but also porous hydrophobic materials (such as the second layer of metal foam 32). The hydrophobic material includes, but is not limited to, a metal foam after being subjected to a hydrophobic treatment. Hydrophobic treatments of the metal foam include, but are not limited to, passivation.
Preferably, the foam metal is foam copper, foam stainless steel, foam titanium alloy. The copper foam is the optimal choice, and is a novel multifunctional material with a large number of communicated or non-communicated holes uniformly distributed in a copper matrix.
Preferably, the fluid copper powder comprises copper powder and a binder.
Preferably, still be equipped with a plurality of copper post in the lower cover 2, a plurality of copper post with wick 3 butt.
Correspondingly, the invention also provides a processing method of the soaking plate, which comprises the following steps:
manufacturing an upper cover and a lower cover, wherein the upper cover or the lower cover is provided with an exhaust hole; the upper and lower covers are typically fabricated using an etching process,
the liquid absorption core is made of foam metal or fluid copper powder;
positioning, namely fixing the foam metal or the fluid copper powder in the upper cover;
sintering, namely sintering the foam metal or the fluid copper powder serving as a liquid absorption part to generate stronger capillary force;
welding, namely welding the upper cover and the lower cover into a box body, and inserting a vacuum tube into the exhaust hole;
injecting working medium into the box body from the vacuumizing pipe;
degassing and fixing the length, pumping out the air in the box body to enable the box body to be in a vacuum state, cutting off the vacuumizing tube according to a preset length, and welding the vacuumizing tube.
Preferably, the foam metal comprises a first layer of foam metal and a second layer of foam metal, the porosity of the first layer of foam metal is more than 50%, the porosity of the second layer of foam metal is more than 85%, the first layer of foam metal is arranged on the capillary wick side, and the second layer of foam metal is arranged on the steam cavity side.
Preferably, the fluid copper powder comprises copper powder and a binder.
In summary, the manufacturing process of the invention is as follows:
manufacturing an upper cover and a lower cover by adopting an etching process, wherein an exhaust hole is reserved after the upper cover and the lower cover are closed, fixing a liquid absorption core in the upper cover, putting the liquid absorption core into a furnace for sintering to enable the liquid absorption core to have strong capillary force, spot-welding paste on the edge of the upper cover or the lower cover, then welding the upper cover and the lower cover to form a box body with a cavity, welding a vacuum tube at the exhaust hole, and leading the cavity to the outside through the vacuum tube; according to the big or small proportion of imbibition core calculates, follows evacuation pipe department is in pour into working medium into in the box body, at last, adopts evacuation equipment to follow evacuation pipe takes out the air in the cavity, makes in the cavity be in vacuum state, adopts clamping equipment will evacuation pipe's end presss from both sides tightly, cuts out evacuation pipe and welding outside the predetermined length, so the soaking plate is accomplished basically, and follow-up polishing still makes the soaking plate surface be the copper true qualities to and carry out the test and the inspection of thermal properties such as heat dissipation power and thermal resistance, guarantee the quality of soaking plate.
It should be understood that equivalents and modifications of the technical solution and inventive concept thereof may occur to those skilled in the art, and all such modifications and alterations should fall within the scope of the appended claims.
Claims (9)
1. The utility model provides a soaking plate, includes upper cover, lower cover, imbibition core and working medium, the upper cover with the lower cover welding is the box body that has the cavity, imbibition core with working medium establishes in the cavity of box body, its characterized in that, imbibition core is foam metal or fluid copper powder, foam metal or fluid copper powder bonds in the upper cover.
2. The soaking plate according to claim 1, wherein the metal foams comprise a first layer of metal foam and a second layer of metal foam, the first layer of metal foam is provided on the capillary wick side, the first layer of metal foam has a porosity of more than 50%, and the surface of the first layer of metal foam is hydrophilic; the second layer of foam metal is arranged on the side of the steam cavity, the porosity of the second layer of foam metal is larger than 85%, and the surface of the second layer of foam metal is hydrophobic.
3. The soaking plate according to claim 1 or 2, wherein the foamed metal is completely filled in the cavity of the box body, and the foamed metal is provided with a steam flow channel.
4. Soaking plate according to claim 1 or 2, wherein the foamed metal is copper foam, foamed stainless steel, foamed titanium alloy.
5. The soaking plate according to claim 1, wherein the fluid copper powder comprises copper powder and a binder.
6. The soaking plate according to claim 1, wherein a plurality of copper columns are further arranged in the lower cover, and the plurality of copper columns are abutted with the liquid absorbing core.
7. A method for processing a soaking plate is characterized by comprising the following steps:
manufacturing an upper cover and a lower cover, wherein the upper cover or the lower cover is provided with an exhaust hole;
the liquid absorption core is made of foam metal or fluid copper powder;
positioning, namely fixing the foam metal or the fluid copper powder in the upper cover;
sintering, namely sintering the foam metal or the fluid copper powder serving as a liquid absorption part to generate stronger capillary force;
welding, namely welding the upper cover and the lower cover into a box body, and inserting a vacuum tube into the exhaust hole;
injecting working medium into the box body from the vacuumizing pipe;
degassing and fixing the length, pumping out the air in the box body to ensure that the box body is in a vacuum state, cutting off the vacuumizing air pipe according to a preset length, and welding the vacuumizing air pipe.
8. The method for processing a soaking plate according to claim 7, wherein said metal foams comprise a first layer of metal foam and a second layer of metal foam, said first layer of metal foam has a porosity of more than 50%, said second layer of metal foam has a porosity of more than 85%, said first layer of metal foam is provided on the capillary wick side, and said second layer of metal foam is provided on the vapor chamber side.
9. The method for processing a soaking plate according to claim 7, wherein the fluid copper powder comprises copper powder and a binder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911052849.2A CN110763061A (en) | 2019-10-31 | 2019-10-31 | Vapor chamber and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911052849.2A CN110763061A (en) | 2019-10-31 | 2019-10-31 | Vapor chamber and processing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110763061A true CN110763061A (en) | 2020-02-07 |
Family
ID=69335139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911052849.2A Pending CN110763061A (en) | 2019-10-31 | 2019-10-31 | Vapor chamber and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110763061A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111231450A (en) * | 2020-02-24 | 2020-06-05 | 中南大学 | Multilayer composite material for thermal diffusion of vapor chamber and preparation method thereof |
| CN111442674A (en) * | 2020-03-17 | 2020-07-24 | 广州视源电子科技股份有限公司 | Method for processing heat dissipation plate |
| CN111683501A (en) * | 2020-06-10 | 2020-09-18 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| CN112087920A (en) * | 2020-08-12 | 2020-12-15 | 东莞领杰金属精密制造科技有限公司 | Stainless steel soaking plate and manufacturing method thereof |
| CN112247152A (en) * | 2020-10-23 | 2021-01-22 | 广东思泉新材料股份有限公司 | Preparation method of super-hydrophilic foam copper with capillary effect and sandwich structure |
| CN112566459A (en) * | 2020-11-30 | 2021-03-26 | 瑞声科技（南京）有限公司 | Manufacturing method of heat dissipation device and heat dissipation device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1895011A (en) * | 2003-12-16 | 2007-01-10 | Ls电线有限公司 | Flat plate heat transfer device and method for manufacturing the same |
| CN103687455A (en) * | 2013-12-31 | 2014-03-26 | 上海交通大学 | Vapor chamber |
| CN104266519A (en) * | 2013-02-17 | 2015-01-07 | 上海交通大学 | Heat exchange device of gradually-varied hole density of through hole metal foam heat pipe |
| CN104896983A (en) * | 2014-03-07 | 2015-09-09 | 江苏格业新材料科技有限公司 | Manufacturing method of soaking plate with ultrathin foam silver as liquid absorbing core |
| CN104976907A (en) * | 2014-04-08 | 2015-10-14 | 丰田自动车株式会社 | Heat pipe |
| CN107764116A (en) * | 2017-10-16 | 2018-03-06 | 华南理工大学 | Ultrathin flexible soaking plate and its manufacture method |
| CN109193005A (en) * | 2018-08-10 | 2019-01-11 | 清华大学 | Foamed metal flow fields plate and fuel cell including the foamed metal flow fields plate |
-
2019
- 2019-10-31 CN CN201911052849.2A patent/CN110763061A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1895011A (en) * | 2003-12-16 | 2007-01-10 | Ls电线有限公司 | Flat plate heat transfer device and method for manufacturing the same |
| CN104266519A (en) * | 2013-02-17 | 2015-01-07 | 上海交通大学 | Heat exchange device of gradually-varied hole density of through hole metal foam heat pipe |
| CN103687455A (en) * | 2013-12-31 | 2014-03-26 | 上海交通大学 | Vapor chamber |
| CN104896983A (en) * | 2014-03-07 | 2015-09-09 | 江苏格业新材料科技有限公司 | Manufacturing method of soaking plate with ultrathin foam silver as liquid absorbing core |
| CN104976907A (en) * | 2014-04-08 | 2015-10-14 | 丰田自动车株式会社 | Heat pipe |
| CN107764116A (en) * | 2017-10-16 | 2018-03-06 | 华南理工大学 | Ultrathin flexible soaking plate and its manufacture method |
| CN109193005A (en) * | 2018-08-10 | 2019-01-11 | 清华大学 | Foamed metal flow fields plate and fuel cell including the foamed metal flow fields plate |
Non-Patent Citations (1)
| Title |
|---|
| 中国工程热物理学会编: "《中国工程热物理学会传热传质学学术会议论文集 上册》", 31 December 2007 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111231450A (en) * | 2020-02-24 | 2020-06-05 | 中南大学 | Multilayer composite material for thermal diffusion of vapor chamber and preparation method thereof |
| CN111442674A (en) * | 2020-03-17 | 2020-07-24 | 广州视源电子科技股份有限公司 | Method for processing heat dissipation plate |
| CN111442674B (en) * | 2020-03-17 | 2021-10-26 | 广州视源电子科技股份有限公司 | Method for processing heat dissipation plate |
| CN111683501A (en) * | 2020-06-10 | 2020-09-18 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| CN112087920A (en) * | 2020-08-12 | 2020-12-15 | 东莞领杰金属精密制造科技有限公司 | Stainless steel soaking plate and manufacturing method thereof |
| CN112247152A (en) * | 2020-10-23 | 2021-01-22 | 广东思泉新材料股份有限公司 | Preparation method of super-hydrophilic foam copper with capillary effect and sandwich structure |
| CN112247152B (en) * | 2020-10-23 | 2021-12-10 | 广东思泉新材料股份有限公司 | Preparation method of super-hydrophilic foam copper with capillary effect and sandwich structure |
| CN112566459A (en) * | 2020-11-30 | 2021-03-26 | 瑞声科技（南京）有限公司 | Manufacturing method of heat dissipation device and heat dissipation device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110763061A (en) | Vapor chamber and processing method thereof | |
| CN112087920A (en) | Stainless steel soaking plate and manufacturing method thereof | |
| CN105352352A (en) | Ultra-thin even-temperature plate device and manufacturing method thereof | |
| CN215261347U (en) | Temperature equalizing plate | |
| CN111829380A (en) | High-strength light ultrathin soaking plate | |
| CN103556193A (en) | Method for preparing super-hydrophilic structure on red copper surface and red copper micro-heat tube manufactured by using same | |
| CN110530184A (en) | The temperature-uniforming plate and its manufacturing method that aluminum bronze combines | |
| CN111194160A (en) | Ultra-thin asymmetric soaking plate based on foamy copper | |
| CN112648870A (en) | Manufacturing process of lightweight uniform temperature plate and uniform temperature plate | |
| CN212658107U (en) | High-strength light ultrathin soaking plate | |
| CN213028997U (en) | Semi-punching ultra-thin soaking plate | |
| CN113115576A (en) | Ultrathin soaking plate and manufacturing method thereof | |
| CN109411431A (en) | A kind of heat exchange structure and preparation method thereof | |
| CN215832540U (en) | Ultra-light high-performance copper-aluminum composite soaking plate | |
| CN112857109A (en) | Ultra-thin copper temperature-uniforming plate | |
| CN213028996U (en) | Stainless steel copper plating soaking plate | |
| CN212006863U (en) | Ultra-thin temperature-uniforming plate structure | |
| CN113465429A (en) | Ultra-light high-performance copper-aluminum composite soaking plate and preparation method thereof | |
| CN113894504A (en) | Ultrathin uniform temperature plate and manufacturing method thereof | |
| CN111843394A (en) | Groove type ultrathin aluminum-based soaking plate and preparation method thereof | |
| CN210892822U (en) | Novel soaking plate | |
| CN116723679A (en) | Ceramic-based soaking plate and preparation method and application thereof | |
| CN113446884B (en) | Method for manufacturing vapor chamber | |
| CN116147391A (en) | Ultra-thin samming board | |
| CN212658106U (en) | Ultra-thin vapor chamber of gas-liquid channel separation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200207 |
|
| WD01 | Invention patent application deemed withdrawn after publication |