CN110767736A - Display panel, preparation method thereof and display device - Google Patents
Display panel, preparation method thereof and display device Download PDFInfo
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- CN110767736A CN110767736A CN201911076067.2A CN201911076067A CN110767736A CN 110767736 A CN110767736 A CN 110767736A CN 201911076067 A CN201911076067 A CN 201911076067A CN 110767736 A CN110767736 A CN 110767736A
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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Abstract
The invention provides a display panel, a preparation method thereof and a display device, wherein the display panel comprises: the pixel structure comprises a substrate, a driving circuit layer, a flat layer, a pixel definition layer, a gap supporting layer, a cathode etching layer and a cathode layer. The preparation method of the display panel comprises the following steps: the manufacturing method comprises a substrate setting step, a driving circuit layer manufacturing step, a flat layer manufacturing step, a pixel definition layer manufacturing step, a gap supporting layer manufacturing step, a cathode layer manufacturing step and a cathode etching layer manufacturing step. The invention has the technical effects of improving the visible light transmittance of the camera area and improving the imaging quality of the camera under the screen.
Description
Technical Field
The invention relates to the field of display, in particular to a display panel, a preparation method thereof and a display device.
Background
Mobile electronic terminals, particularly mobile phones, seek the advantages of both portability and large-screen display, which requires electronic products with the highest screen occupation ratio possible. However, the positions of various optical electronic components (such as a receiver, a front camera and an infrared sensor) are often required to be reserved around the display screen of the mobile phone, so that the reduction of the screen frame is limited, and the higher screen occupation ratio is difficult to realize.
In order to minimize the non-display area, a series of under-screen built-in device technologies are now being developed. Such as underscreen fingerprint recognition, underscreen sensing, and the like. The development of the under-screen camera technology faces many problems.
As shown in fig. 1, taking the off-screen display of the AMOLED display screen as an example, since the image capturing device 110 is disposed below the display, the external light needs to penetrate the display to be received by the image capturing device 110. Therefore, the transmittance of the display to the external light is a key factor affecting the imaging quality of the image capturing device 110.
One important factor affecting the transmittance of the display is the absorption and reflection of the cathode layer 500 to the external light, and in general, the cathode layer 500 is made of a low work function metal such as mg-ag alloy, and the transmittance of visible light is lower than 50%. The magnesium-silver alloy is generally deposited by a whole-surface evaporation process, and cannot be patterned by a yellow light etching process. Therefore, developing a suitable process to remove the cathode layer in the corresponding region of the image capturing device becomes a key point for improving the visible light transmittance and the imaging quality of the image capturing device.
Disclosure of Invention
The invention aims to solve the technical problem of low visible light transmittance in the conventional under-screen camera display device.
In order to achieve the above object, the present invention provides a display panel having a transparent region and a display region, the display panel including: a substrate; the driving circuit layer is arranged on the surface of one side of the substrate; the flat layer is arranged on the surface of one side, away from the substrate, of the driving circuit layer; the flat layer is provided with at least one first through hole; the pixel defining layer is arranged on the surface of one side of the flat layer, which is far away from the driving circuit layer; the pixel definition layer is provided with a second through hole which is opposite to the first through hole; the gap supporting layer is arranged on the surface of one side, away from the flat layer, of the pixel defining layer; the gap supporting layer is provided with a third through hole which is opposite to the second through hole; the cathode etching layer is arranged in the first through hole; the cathode layer is arranged on the surfaces of the pixel defining layer, the flat layer and the gap supporting layer, which are far away from one side of the substrate; the cathode layer is provided with a fourth through hole which is arranged opposite to the third through hole; wherein the first through hole, the second through hole, the third through hole, the fourth through hole and the cathode etching layer are arranged in the transparent region.
Further, the cathode etching layer is arranged in the first through hole and extends to the second through hole.
Furthermore, the display panel further comprises an encapsulation layer arranged on the surfaces of the cathode layer and the cathode etching layer far away from one side of the substrate.
Furthermore, the flat layer surrounding the first through hole, the pixel defining layer surrounding the second through hole and the gap supporting layer surrounding the third through hole form an annular retaining wall together.
Further, the display panel further comprises an anode layer embedded in the surface of the flat layer on the side far away from the driving circuit layer; and the organic light-emitting layer is embedded into the pixel definition layer and is correspondingly connected to the anode layer.
In order to achieve the above object, the present invention further provides a display device, comprising the display panel described above; the display device also comprises an image acquisition device which is arranged opposite to the transparent area of the display panel.
Further, the inner diameter of the first through hole of the display panel is smaller than or equal to the width of the image acquisition device.
In order to achieve the above object, the present invention further provides a method for manufacturing a display panel, including the steps of: a substrate providing step of providing a substrate; a driving circuit layer preparation step, namely preparing a driving circuit layer on the upper surface of the substrate; a flat layer preparation step, namely preparing a flat layer on the upper surface of the driving circuit layer; the flat layer is provided with a first through hole; a step of preparing a pixel definition layer, wherein the pixel definition layer is prepared on the upper surface of the flat layer; the pixel definition layer is provided with a second through hole which is opposite to the first through hole; a gap supporting layer preparation step, namely preparing a gap supporting layer on the upper surface of the pixel defining layer; the gap supporting layer is provided with a third through hole which is opposite to the second through hole; preparing a cathode layer on the upper surfaces of the pixel defining layer, the flat layer and the gap supporting layer; the cathode layer is provided with a fourth through hole which is arranged opposite to the third through hole; and a step of preparing a cathode etching layer, wherein the cathode etching layer is prepared in the first through hole.
Further, after the step of preparing the flat layer, the method also comprises a step of preparing an anode layer, wherein a groove is formed downwards in the upper surface of the flat layer, and the anode layer is prepared in the groove; and/or, after the step of preparing the pixel definition layer, the method also comprises a step of preparing an organic light-emitting layer, and the organic light-emitting layer is prepared on the pixel definition layer.
Further, in the step of preparing the cathode etching layer, cathode etching glue is dripped into the first transparent display area, the cathode etching glue reacts with the cathode layer in the transparent display area, the cathode layer in the transparent display area is removed, and the reacted cathode etching glue is cured to form the cathode etching layer.
The invention has the technical effects that cathode etching glue is filled in the through hole of the transparent area on the display panel opposite to the camera, and the cathode layer in the through hole is removed by etching, wherein the cathode etching glue has higher visible light transmittance, so that the visible light transmittance of the transparent area can be improved, the imaging quality of the camera under the screen is further improved, and the display effect of the display device is improved.
Drawings
Fig. 1 is a schematic structural diagram of an off-screen camera display panel in the prior art;
fig. 2 is a schematic structural diagram of a display device according to embodiment 1 of the present invention;
fig. 3 is an exploded view of the structure of the retaining wall according to embodiment 1 or 2 of the present invention;
fig. 4 is a flowchart of a method for manufacturing a display panel according to embodiment 1 or 2 of the present invention;
FIG. 5 is a schematic view of a display panel after a gap support layer manufacturing step according to embodiment 1 or 2 of the present invention;
fig. 6 is a schematic view of the display panel after the cathode layer preparation step described in embodiment 1 or 2 of the present invention;
FIG. 7 is a schematic view of a display panel after a step of preparing a cathode etching layer according to embodiment 1 or 2 of the present invention;
fig. 8 is a schematic structural diagram of a display device according to embodiment 2 of the present invention;
fig. 9 is a top view of the retaining wall according to embodiment 2 of the present invention.
The identification of the partial components is as follows:
1. a substrate; 2. a driving circuit layer;
3. a planarization layer; 31. an anode layer; 32. a first through hole;
4. a pixel defining layer; 41. an organic light emitting layer; 42. a second through hole;
5. a gap support layer; 51. a third through hole;
6. a cathode layer; 61. etching the layer at the cathode;
7. a packaging layer; 8. a touch layer; 9. a polarizing layer; 10. a cover plate; 11. an image acquisition device; 12. an annular retaining wall;
100. a substrate; 200. a driving circuit layer; 300. a planarization layer; 400. an anode layer; 500. a cathode layer;
600. a packaging layer; 700. a touch layer; 800. a polarizing layer; 900. a cover plate; 110. an image acquisition device.
Detailed Description
The following detailed description of the preferred embodiments of the present invention is provided to enable those skilled in the art to make and use the present invention in a complete manner, and is provided for illustration of the technical disclosure of the present invention so that the technical disclosure of the present invention will be more clearly understood and appreciated by those skilled in the art how to implement the present invention. The present invention may, however, be embodied in many different forms of embodiment, and the scope of the present invention should not be construed as limited to the embodiment set forth herein, but rather construed as being limited only by the following description of the embodiment.
The directional terms used in the present invention, such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", etc., are only directions in the drawings, and are used for explaining and explaining the present invention, but not for limiting the scope of the present invention.
In the drawings, structurally identical elements are represented by like reference numerals, and structurally or functionally similar elements are represented by like reference numerals throughout the several views. In addition, the size and thickness of each component shown in the drawings are arbitrarily illustrated for convenience of understanding and description, and the present invention is not limited to the size and thickness of each component.
When certain components are described as being "on" another component, the component can be directly on the other component; there may also be an intermediate component disposed on the intermediate component and the intermediate component disposed on another component. When an element is referred to as being "mounted to" or "connected to" another element, they are directly "mounted to" or "connected to" the other element or "mounted to" or "connected to" the other element through an intermediate element.
Example 1
As shown in fig. 2, the present embodiment provides a display device including: the display device comprises a substrate 1, a driving circuit layer 2, a flat layer 3, a pixel defining layer 4, a gap supporting layer 5, a cathode layer 6, a cathode etching layer 61, a packaging layer 7, a touch layer 8, a polarizing layer 9, a cover plate 10 and an image acquisition device 11. The display device is provided with a transparent area 101 and a display area.
The substrate 1 serves to protect the entire display panel. The driving circuit layer 2 is disposed on the upper surface of the substrate 1, and provides circuit support for the entire display panel.
The flat layer 3 is disposed on the upper surface of the driving circuit layer 3, and a first through hole 32 is disposed on the flat layer 3 and penetrates through the flat layer 3. The anode layer 31 is disposed on the flat layer 3, the anode layer 31 is embedded into the flat layer 3, and the anode layer 31 is electrically connected to the driving circuit layer 2 for transmitting electrical signals.
The pixel defining layer 4 is disposed on the upper surface of the planarization layer 3 for defining the organic light emitting layer 41. The pixel defining layer 4 is provided with a second through hole 42, and the second through hole 42 is disposed opposite to the first through hole 32. The pixel definition layer 4 is provided with an organic light emitting layer 41, the organic light emitting layer 41 is disposed opposite to the anode layer 31, and the organic light emitting layer 41 passes through the pixel definition layer 4 and is connected to the anode layer 31, so that the organic light emitting layer 41 obtains an electrical signal for emitting light.
The gap supporting layer 5 is disposed on the upper surface of the pixel defining layer 4, and plays a supporting role to prevent the cathode etching layer 61 in the via hole from overflowing to affect other film layers. The gap support layer 5 is provided with a third through hole 51, and the third through hole 51 is opposite to the second through hole 42.
The planarization layer surrounding the first via 32, the pixel defining layer surrounding the second via 42, and the gap supporting layer surrounding the third via 51 together form a circular dam (see fig. 3). The third through hole 51, the second through hole 42 and the first through hole 32 form a mesa-shaped through hole structure with gradually decreasing inner diameter from top to bottom, and the inner side surfaces of the flat layer 3, the pixel defining layer 4 and the gap supporting layer 5 are in the same curved surface with the inner side surface of the mesa-shaped through hole structure, the retaining wall is convenient for the arrangement of the cathode etching layer 61, and the cathode etching glue is prevented from overflowing to influence the normal use of other films.
The cathode layer 6 is disposed on the upper surfaces of the pixel defining layer 4, the planarization layer 3 and the gap supporting layer 5, and the cathode layer 6 is provided with a fourth through hole opposite to the third through hole 51. The cathode layer 6 is made of a low work function metal, such as mg-ag alloy, and the transmittance of mg-ag alloy for visible light is generally lower than 50%. The cathode etch layer 61 is disposed in the first via 32 and extends to the second via 42.
The first through hole 32, the second through hole 42, the third through hole 51, the fourth through hole and the cathode etching layer 61 are arranged in the transparent region 101, the transparent region 101 is a non-display region, the transparency of the cathode etching layer 61 is high, and the visible light transmittance of each film layer below the first through hole 32 is enhanced, so that the image acquisition device 11 arranged opposite to the first through hole 32 obtains more visible light, and the imaging quality of the image acquisition device 11 is improved.
The packaging layer 7 covers the upper part of the cathode layer 6 level cathode etching layer 61, so that the influence of external water and oxygen on the display panel is blocked, and the packaging effect is ensured.
The touch layer 8 is disposed on the upper surface of the package layer 7 for touch control, and serves as an indispensable film layer of the existing touch panel.
The polarizing layer 9 is disposed on the upper surface of the touch layer 8, and has a strong polarizing property for polarizing light.
The cover plate 10 is arranged on the upper surface of the polarizing layer 9, plays a role in protecting the top of the display panel and completes the assembly of the whole display panel.
The image acquisition device 11 is disposed on the lower surface of the substrate 1 and is disposed opposite to the transparent area 101, in this embodiment, the inner diameter of the first through hole 32 is equal to the width of the image acquisition device 11, the entire transparent area 101 is light-transmissive, the image acquisition device 11 can obtain more visible light, and the imaging quality of the image acquisition device 11 is improved.
The display device has the technical effects that the cathode etching layer is additionally arranged in the first through hole, and the transparency of the cathode etching layer is high, so that the transmittance of visible light can be improved, and the imaging quality of the camera under the screen can be further improved.
As shown in fig. 4, the present embodiment further provides a method for manufacturing a display panel, which includes steps S1 to S13.
S1A step of arranging a substrate.
S2 step of preparing a driving circuit layer, which is prepared on the upper surface of the substrate to provide electrical signals to the display panel.
S3 flat layer preparation, namely preparing a flat layer on the upper surface of the driving circuit layer, and forming a first through hole on the flat layer, wherein the first through hole completely penetrates through the flat layer, and the inner diameter of the first through hole is gradually reduced from top to bottom to form a platform-shaped through hole.
And S4, preparing an anode layer on the flat layer to ensure the electric connection between the driving circuit layer and the subsequent organic light-emitting layer.
And S5 preparing a pixel definition layer, namely preparing the pixel definition layer on the upper surface of the flat layer to define the organic light-emitting layer, and forming a second through hole on the pixel definition layer, wherein the second through hole is opposite to the first through hole and is mutually communicated with the first through hole. The inner diameter of the second through hole is gradually reduced from top to bottom, the second through hole is in a shape of a table, and the minimum inner diameter of the second through hole is larger than the maximum inner diameter of the first through hole.
S6 a step of preparing an organic light emitting layer on the pixel defining layer, wherein the organic light emitting layer is connected to the anode layer so that the organic light emitting layer emits light by receiving an electrical signal.
S7 step of preparing a gap support layer, in which a gap support layer 5 is prepared on the upper surface of the pixel defining layer 4, and the gap support layer 5 plays a role of supporting and blocking, so as to prevent the cathode etching layer in the first through hole from overflowing, thereby affecting other films. And a third through hole is formed in the gap supporting layer 5, the third through hole and the second through hole are oppositely arranged, the inner diameter of the third through hole is gradually reduced from top to bottom to form a platform-shaped through hole, and the minimum inner diameter of the third through hole is larger than the maximum inner diameter of the second through hole. The third through hole, the second through hole and the second through hole form a mesa structure with gradually reduced inner diameter from top to bottom, so that a cathode etching layer can be conveniently placed subsequently (see fig. 5).
At this time, the flat layer surrounding the first through hole 32, the pixel defining layer surrounding the second through hole 42, and the gap supporting layer surrounding the third through hole 51 together form an annular barrier wall to separate the area above the camera and the display area where the organic light emitting layer is located, and prevent the cathode etching layer in the area above the camera from penetrating into the display area, thereby affecting the display effect of the display panel.
S8 step of preparing cathode layer, preparing cathode layer 6 (see fig. 6) on the upper surface of the pixel defining layer 4, the flat layer 3, the gap supporting layer 5 and the inner sidewall of the annular retaining wall, wherein a fourth through hole is formed on the cathode layer 6 and is opposite to the third through hole 51, the cathode layer 6 is made of low work function metal, such as magnesium-silver alloy, and the transmittance of the magnesium-silver alloy to visible light is generally lower than 50%.
And S9, preparing a cathode etching layer, namely dripping cathode etching glue into the first through hole to react with the cathode layer in the first through hole, removing the original cathode layer after full reaction, and forming the cathode etching layer 61 after curing the remaining solution, wherein the curing step can adopt modes such as UV light fixed-point radiation and the like. A cathode etch layer 61 is provided in the first via and extends to the second via (see fig. 7).
And S10, preparing a packaging layer, namely packaging the upper surfaces of the cathode layer and the cathode etching layer to form the packaging layer, wherein the packaging layer can protect each prepared film layer and block external water and oxygen.
S11 step of preparing a touch layer, which is prepared on the top surface of the package layer for touch control. The touch layer can be prepared independently, is arranged above the packaging layer after being prepared, and can also be directly prepared on the upper surface of the packaging layer.
And S12 preparing a polarizing layer, namely preparing the polarizing layer on the upper surface of the touch layer, wherein the polarizing layer can be independently prepared and arranged above the touch layer after being prepared, and can also be directly prepared on the upper surface of the touch layer.
And S13, arranging a cover plate on the upper surface of the polarizing layer to finish the preparation of the display panel.
An image acquisition device (namely a camera) can be arranged below the substrate of the prepared display panel, so that the function of shooting under the screen of the display panel is realized. The step of mounting the image capturing device may be performed after the step of preparing the cathode etching layer, or may be performed after the step of disposing the cover plate.
The manufacturing method of the display panel has the technical effects that the cathode etching layer is manufactured in the first through hole, the original cathode layer in the first through hole is removed, and the transparency of the cathode etching layer is higher than that of the cathode layer, so that the transmittance of visible light can be improved, and the imaging quality of the camera under the screen is further improved.
Example 2
As shown in fig. 8, the present embodiment provides a display device including: the display device comprises a substrate 1, a driving circuit layer 2, a flat layer 3, a pixel defining layer 4, a gap supporting layer 5, a cathode layer 6, a cathode etching layer 61, a packaging layer 7, a touch layer 8, a polarizing layer 9, a cover plate 10 and an image acquisition device 11. The display device is provided with a transparent area 101 and a display area.
The substrate 1 serves to protect the entire display panel. The driving circuit layer 2 is disposed on the upper surface of the substrate 1, and provides circuit support for the entire display panel.
The flat layer 3 is disposed on the upper surface of the driving circuit layer 3, a plurality of first through holes 32 are disposed on the flat layer 3, each first through hole 32 is disposed in the transparent region 101, and the first through holes 32 penetrate through the flat layer 3. The anode layer 31 is disposed on the flat layer 3, the anode layer 31 is embedded into the flat layer 3, and the anode layer 31 is electrically connected to the driving circuit layer 2 for transmitting electrical signals.
The pixel defining layer 4 is disposed on the upper surface of the planarization layer 3 for defining the organic light emitting layer 41. The pixel defining layer 4 is provided with a plurality of second through holes 42, and the second through holes 42 are opposite to the first through holes 32. The pixel definition layer 4 is provided with an organic light emitting layer 41, the organic light emitting layer 41 is disposed opposite to the anode layer 31, and the organic light emitting layer 41 passes through the pixel definition layer 4 and is connected to the anode layer 31, so that the organic light emitting layer 41 obtains an electrical signal for emitting light.
The gap supporting layer 5 is disposed on the upper surface of the pixel defining layer 4, and plays a supporting role to prevent the cathode etching layer 61 in the via hole from overflowing to affect other film layers. A plurality of third through holes 51 are formed in the gap supporting layer 5, and the third through holes 51 are arranged opposite to the second through holes 42.
The planarization layer surrounding the outermost first through holes 32, the pixel defining layer surrounding the outermost second through holes 42, and the gap supporting layer surrounding the outermost third through holes 51 together form a ring-shaped dam 12 (see fig. 3). The third through hole 51, the second through hole 42 and the first through hole 32 form a mesa-shaped through hole structure with gradually decreasing inner diameter from top to bottom, and the inner side surfaces of the flat layer 3, the pixel defining layer 4 and the gap supporting layer 5 are in the same curved surface with the inner side surface of the mesa-shaped through hole structure, the retaining wall is convenient for the arrangement of the cathode etching layer 61, and the cathode etching glue is prevented from overflowing to influence the normal use of other films.
The cathode layer 6 is disposed on the upper surfaces of the pixel defining layer 4, the planarization layer 3 and the gap supporting layer 5, and the cathode layer 6 is provided with a fourth through hole opposite to the third through hole 51. The cathode layer 6 is made of a low work function metal, such as mg-ag alloy, and the transmittance of mg-ag alloy for visible light is generally lower than 50%. The cathode etch layer 61 is disposed in the first via 32 and extends to the second via 42.
The transparent region 101 includes a transparent display region and a transparent non-display region, the first through holes 32, the second through holes 42, the third through holes 51, the fourth through holes and the cathode etching layers 61 are disposed in the transparent non-display region in the transparent region 101, only a portion of the through holes are shown in fig. 9, the transparency of the cathode etching layers 61 is high, and the visible light transmittance of each film layer below the first through holes 32 is enhanced, so that the image capturing device 11 disposed opposite to the transparent region 101 obtains more visible light, and the imaging quality of the image capturing device 11 is improved.
The packaging layer 7 covers the upper part of the cathode layer 6 level cathode etching layer 61, so that the influence of external water and oxygen on the display panel is blocked, and the packaging effect is ensured.
The touch layer 8 is disposed on the upper surface of the package layer 7 for touch control, and serves as an indispensable film layer of the existing touch panel.
The polarizing layer 9 is disposed on the upper surface of the touch layer 8, and has a strong polarizing property for polarizing light.
The cover plate 10 is arranged on the upper surface of the polarizing layer 9, plays a role in protecting the top of the display panel and completes the assembly of the whole display panel.
The image acquisition device 11 is disposed on the lower surface of the substrate 1 and is disposed opposite to the transparent area 101, in this embodiment, the inner diameter of each first through hole 32 is smaller than the width of the image acquisition device 11, and the entire transparent area 101 is not transparent to light, but is transparent to light transmitted by the internal medicine of the non-display area, and the image acquisition device 11 can obtain visible light, so that the image acquisition device 11 can realize an imaging function.
The display panel has the technical effects that the cathode etching layer is additionally arranged in the first through hole, and the transparency of the cathode etching layer is high, so that the transmittance of visible light can be improved, and the imaging quality of the camera under the screen can be further improved. And a transparent display area and a transparent non-display area are arranged in the transparent area, so that the transparent display area corresponding to the camera can also display images.
As shown in fig. 4, the present embodiment further provides a method for manufacturing a display panel, which includes steps S1 to S13.
S1A step of arranging a substrate.
S2 step of preparing a driving circuit layer, which is prepared on the upper surface of the substrate to provide electrical signals to the display panel.
S3 flat layer preparation, namely preparing a flat layer on the upper surface of the driving circuit layer, and forming a plurality of first through holes on the flat layer, wherein the first through holes completely penetrate through the flat layer, and the inner diameter of each first through hole is gradually reduced from top to bottom to form a platform-shaped through hole.
And S4, preparing an anode layer on the flat layer to ensure the electric connection between the driving circuit layer and the subsequent organic light-emitting layer.
And S5 preparing a pixel definition layer, namely preparing the pixel definition layer on the upper surface of the flat layer to define the organic light-emitting layer, and forming a plurality of second through holes on the pixel definition layer, wherein the second through holes are opposite to the first through holes and are mutually communicated. The inner diameter of the second through hole is gradually reduced from top to bottom, the second through hole is in a shape of a table, and the minimum inner diameter of the second through hole is larger than the maximum inner diameter of the first through hole.
S6 a step of preparing an organic light emitting layer on the pixel defining layer, wherein the organic light emitting layer is connected to the anode layer so that the organic light emitting layer emits light by receiving an electrical signal.
S7 step of preparing a gap support layer, in which a gap support layer 5 is prepared on the upper surface of the pixel defining layer 4, and the gap support layer 5 plays a role of supporting and blocking, so as to prevent the cathode etching layer in the first through hole from overflowing, thereby affecting other films. A plurality of third through holes are formed in the gap supporting layer 5, the third through holes and the second through holes are arranged oppositely, the inner diameter of each third through hole is gradually reduced from top to bottom to form a platform-shaped through hole, and the minimum inner diameter of each third through hole is larger than the maximum inner diameter of each second through hole. The third through hole, the second through hole and the second through hole form a mesa structure with gradually reduced inner diameter from top to bottom, so that a cathode etching layer can be conveniently placed subsequently (see fig. 5).
At this time, the flat layer surrounding the first through hole 32, the pixel defining layer surrounding the second through hole 42, and the gap supporting layer surrounding the third through hole 51 form a ring-shaped retaining wall together, and a transparent display region and a transparent non-display region are disposed in the transparent region, so that the transparent display region above the camera can also be used for displaying.
S8 step of preparing cathode layer, preparing cathode layer 6 (see fig. 6) on the upper surface of the pixel defining layer 4, the flat layer 3, the gap supporting layer 5 and the inner sidewall of the annular retaining wall, wherein the cathode layer 6 is provided with a plurality of fourth through holes opposite to the third through holes 51, the cathode layer 6 is made of low work function metal, such as magnesium-silver alloy, and the transmittance of the magnesium-silver alloy to visible light is generally lower than 50%.
And S9, preparing a cathode etching layer, namely dripping cathode etching glue into the first through hole to react with the cathode layer in the first through hole, removing the original cathode layer after full reaction, and forming the cathode etching layer 61 after curing the remaining solution, wherein the curing step can adopt modes such as UV light fixed-point radiation and the like. A cathode etch layer 61 is provided in the first via and extends to the second via (see fig. 7).
And S10, preparing a packaging layer, namely packaging the upper surfaces of the cathode layer and the cathode etching layer to form the packaging layer, wherein the packaging layer can protect each prepared film layer and block external water and oxygen.
S11 step of preparing a touch layer, which is prepared on the top surface of the package layer for touch control. The touch layer can be prepared independently, is arranged above the packaging layer after being prepared, and can also be directly prepared on the upper surface of the packaging layer.
And S12 preparing a polarizing layer, namely preparing the polarizing layer on the upper surface of the touch layer, wherein the polarizing layer can be independently prepared and arranged above the touch layer after being prepared, and can also be directly prepared on the upper surface of the touch layer.
And S13, arranging a cover plate on the upper surface of the polarizing layer to finish the preparation of the display panel.
An image acquisition device (namely a camera) can be arranged below the substrate of the prepared display panel, so that the function of shooting under the screen of the display panel is realized. The step of mounting the image capturing device may be performed after the step of preparing the cathode etching layer, or may be performed after the step of disposing the cover plate.
The manufacturing method of the display panel has the technical effects that the cathode etching layer is manufactured in the first through hole, the original cathode layer in the first through hole is removed, and the transparency of the cathode etching layer is higher than that of the cathode layer, so that the transmittance of visible light can be improved, and the imaging quality of the camera under the screen is further improved. A pixel definition layer and an organic light emitting layer are arranged in the annular retaining wall, so that an area corresponding to the camera can display images.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A display panel is provided with a transparent area and a display area, and is characterized by comprising;
a substrate;
the driving circuit layer is arranged on the surface of one side of the substrate;
the flat layer is arranged on the surface of one side, away from the substrate, of the driving circuit layer; the flat layer is provided with at least one first through hole;
the pixel defining layer is arranged on the surface of one side of the flat layer, which is far away from the driving circuit layer; the pixel definition layer is provided with a second through hole which is opposite to the first through hole;
the gap supporting layer is arranged on the surface of one side, away from the flat layer, of the pixel defining layer; the gap supporting layer is provided with a third through hole which is opposite to the second through hole;
the cathode etching layer is arranged in the first through hole; and
the cathode layer is arranged on the surfaces of the pixel defining layer, the flat layer and the gap supporting layer, which are far away from one side of the substrate; the cathode layer is provided with a fourth through hole which is arranged opposite to the third through hole;
wherein the first through hole, the second through hole, the third through hole, the fourth through hole and the cathode etching layer are arranged in the transparent region.
2. The display panel of claim 1,
the cathode etching layer is arranged in the first through hole and extends to the second through hole.
3. The display panel of claim 1, further comprising
And the packaging layer is arranged on the surfaces of the cathode layer and the cathode etching layer, which are far away from one side of the substrate.
4. The display panel of claim 1,
the flat layer surrounding the first through hole, the pixel defining layer surrounding the second through hole and the gap supporting layer surrounding the third through hole form an annular retaining wall together.
5. The display panel of claim 1, further comprising
The anode layer is embedded into the surface of one side of the flat layer far away from the driving circuit layer; and
and the organic light emitting layer is embedded into the pixel definition layer and is correspondingly connected to the anode layer.
6. A display device comprising the display panel according to any one of claims 1 to 5; the display device further comprises
And the image acquisition device is arranged opposite to the transparent area of the display panel.
7. The display device of claim 6,
the inner diameter of the first through hole of the display panel is smaller than or equal to the width of the image acquisition device.
8. A preparation method of a display panel is characterized by comprising the following steps:
a substrate providing step of providing a substrate;
a driving circuit layer preparation step, namely preparing a driving circuit layer on the upper surface of the substrate;
a flat layer preparation step, namely preparing a flat layer on the upper surface of the driving circuit layer; the flat layer is provided with a first through hole;
a step of preparing a pixel definition layer, wherein the pixel definition layer is prepared on the upper surface of the flat layer; the pixel definition layer is provided with a second through hole which is opposite to the first through hole;
a gap supporting layer preparation step, namely preparing a gap supporting layer on the upper surface of the pixel defining layer; the gap supporting layer is provided with a third through hole which is opposite to the second through hole;
preparing a cathode layer on the upper surfaces of the pixel defining layer, the flat layer and the gap supporting layer; the cathode layer is provided with a fourth through hole which is arranged opposite to the third through hole; and
and a step of preparing a cathode etching layer, wherein the cathode etching layer is prepared in the first through hole.
9. The method for manufacturing a display panel according to claim 8,
after the step of preparing the flat layer, the method further comprises
An anode layer preparation step, namely, slotting downwards on the upper surface of the flat layer and preparing an anode layer in the groove;
and/or the presence of a gas in the gas,
after the step of preparing the pixel definition layer, the method further comprises
And an organic light emitting layer preparing step of preparing an organic light emitting layer on the pixel defining layer.
10. The method for manufacturing a display panel according to claim 8,
in the step of preparing the cathode etch layer,
and dripping cathode etching glue into the first transparent display area, reacting the cathode etching glue with the cathode layer in the transparent display area, removing the cathode layer in the transparent display area, and curing the reacted cathode etching glue to form a cathode etching layer.
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