CN110767083A - Support film, attachment method thereof and display device - Google Patents
Support film, attachment method thereof and display device Download PDFInfo
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- CN110767083A CN110767083A CN201810837072.XA CN201810837072A CN110767083A CN 110767083 A CN110767083 A CN 110767083A CN 201810837072 A CN201810837072 A CN 201810837072A CN 110767083 A CN110767083 A CN 110767083A
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- adhesive layer
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- film
- light irradiation
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000012790 adhesive layer Substances 0.000 claims abstract description 83
- 238000010438 heat treatment Methods 0.000 claims abstract description 60
- 239000003292 glue Substances 0.000 claims abstract description 34
- 239000010410 layer Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 26
- 230000001070 adhesive effect Effects 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 57
- 238000005452 bending Methods 0.000 claims description 51
- 230000001681 protective effect Effects 0.000 claims description 16
- 230000001678 irradiating effect Effects 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000012528 membrane Substances 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the invention discloses a support film, an attaching method thereof and a display device. Wherein, the support membrane includes: the glue layer and the base material are arranged in a stacked mode; the adhesive size of the adhesive layer before heating or light irradiation treatment is different from the adhesive size after heating or light irradiation treatment. The technical scheme provided by the embodiment of the invention can solve the problems of complex attachment and low attachment efficiency of the conventional support film.
Description
Technical Field
The embodiment of the invention relates to the technical field of organic light emitting display, in particular to a support film, an attaching method thereof and a display device.
Background
With the development requirements of flexible display panel products, the overall screen structure design is more and more sought by users. In order to realize a larger screen ratio, the width of a lower frame of a display screen is shortened, and an Outer Lead Bonding (OLB) area of a flexible display panel is bent. And bending the chip bound on the flexible display panel to the back of the flexible display panel. For the flexible display panel, the back surface of the flexible substrate needs to be provided with a support film to reinforce and support the flexible substrate, so that the flexible substrate is prevented from being damaged due to external collision, and the flexible display panel is prevented from being out of function.
In order to make the OLB region easier to bend, the support film of the OLB region needs to be removed. Therefore, when attaching the support film to the flexible display panel, the support film needs to be punched first, the support film in the OLB region needs to be removed, and then the remaining two portions of the support film need to be attached to the flexible substrate. The whole attaching process of the support film is very complicated, and the attaching efficiency is low.
Disclosure of Invention
The invention provides a support film, an attaching method thereof and a display device, and aims to solve the problems that the existing support film is complex in attaching and low in attaching efficiency.
In a first aspect, an embodiment of the present invention provides a support film, including: the glue layer and the base material are arranged in a stacked mode;
the adhesive size of the adhesive layer before heating or light irradiation treatment is different from the adhesive size after heating or light irradiation treatment.
Optionally, the glue layer is thermosetting glue or ultraviolet glue.
Optionally, the temperature of the heat treatment is 20 to 80 °.
Optionally, the wavelength range of the light for the light irradiation treatment is 345nm to 365 nm.
Optionally, the adhesive range of the adhesive layer before heating or light irradiation treatment is 2 g/mm-3 g/mm; the viscosity of the adhesive layer after heating or light irradiation treatment is not less than 1000 g/mm; or the viscosity of the adhesive layer before heating or light irradiation treatment is not less than 1000 g/mm; the viscosity range of the adhesive layer after heating or light irradiation treatment is 2 g/mm-3 g/mm.
Optionally, the support film further comprises: a release film and a protective film; the protective film is attached to one side, away from the adhesive layer, of the base material, and the release film is attached to one side, away from the base material, of the adhesive layer.
In a second aspect, an embodiment of the present invention further provides a method for attaching a support film, including: attaching the adhesive layer to a flexible substrate of a display panel; the display panel comprises a display area, a chip binding area and a bending area, wherein the chip binding area is folded to the non-display side of the display area after the bending area is bent;
removing the support film of the bending area, and heating or irradiating the support film of the display area and the chip binding area by light; wherein the viscosity of the adhesive layer before heating or light irradiation treatment is less than the viscosity after heating or light irradiation treatment;
or heating or irradiating the support film of the bending area by light, and removing the support film of the bending area; wherein the viscosity of the adhesive layer before heating or light irradiation treatment is greater than the viscosity after heating or light irradiation treatment.
Optionally, the support film further comprises a release film and a protective film; the protective film is attached to one side of the base material, which is far away from the adhesive layer, and the release film is attached to one side of the adhesive layer, which is far away from the base material; before the glue layer is attached to the flexible substrate of the display panel, the method further comprises the following steps: and removing the release film of the support film.
Optionally, the support film in the bending region is removed by using a laser half-cut process.
Optionally, attaching the glue layer to the flexible substrate of the display panel includes: attaching the adhesive layer to a flexible substrate of a display panel motherboard; the display panel motherboard comprises a plurality of display panels arranged in an array.
In a third aspect, an embodiment of the present invention further provides a display device, and the method for attaching a support film according to any embodiment of the present invention is used to attach a support film on a flexible substrate of a display panel to prepare the display device.
According to the technical scheme provided by the embodiment of the invention, the support film is attached to the flexible substrate of the display panel, the support film comprises the glue layer and the base material which are arranged in a stacked mode, the glue layer is used for attaching the base material to the flexible substrate, the viscosity of the glue layer before and after heating or light irradiation treatment is different, the support film can be attached to the flexible substrate, the viscosity of the support film attached to the bending area of the flexible substrate is reduced through heating or light irradiation treatment, and therefore the support film in the bending area is removed, and the support films in two parts of non-bending areas are not required to be respectively attached to the flexible substrate, so that the attaching process is saved, the production cost is reduced, the production efficiency is improved, and the problems that the existing support film is complex to attach and low.
Drawings
Fig. 1 is a schematic structural view of a display panel with a support film attached thereto in the prior art;
FIG. 2 is a schematic diagram of a process of attaching a support film according to the prior art;
FIG. 3 is a schematic structural diagram of a support film according to an embodiment of the present invention;
FIG. 4 is a flow chart of a method for attaching a support film according to an embodiment of the present invention;
fig. 5 is a structural diagram illustrating a display panel with a support film attached thereon in a bent state according to an embodiment of the present invention;
fig. 6 is a schematic structural view illustrating a glue layer attached to a display panel according to an embodiment of the invention;
fig. 7 is a schematic structural diagram of a display panel with a bending region supporting film removed according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a process of heating or irradiating a support film with light according to an embodiment of the present invention;
fig. 9 is a schematic view of another structure for attaching a glue layer to a display panel according to an embodiment of the invention;
FIG. 10 is a schematic structural diagram of a heating or light irradiation process for a bending region according to an embodiment of the present invention;
FIG. 11 is a schematic structural diagram of another display panel with a bending region supporting film removed according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of a display panel mother board with a support film attached thereon according to an embodiment of the present invention;
fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Referring to fig. 1 in the prior art, fig. 1 is a schematic structural diagram of a display panel with a support film attached thereto in the prior art, in order to make a bending region C of a flexible display panel 2 easier to bend, the support film 1 is not attached to the bending region C, and the support film 1 is attached to each of a display region a and a chip bonding region B. Referring to fig. 2, fig. 2 is a schematic diagram illustrating a process of attaching a support film in the prior art. The support film 1 comprises a substrate 11, a glue layer 12 and a release film 13, and before the support film 1 is attached to the display panel 2, the support film 1 is subjected to punching processing by using a cutting die, so that the substrate 11 and the glue layer 12 in the bending area C are removed; then attaching a protective film 14 for protecting the substrate 11 to the substrate 11; finally, tear the release film 13 on the supporting film 1 again and remove, attach the display area A and the chip binding area B of glue film 12 to display panel 2 respectively on, accomplish the attached process of whole supporting film 1, but such attached process is comparatively loaded down with trivial details, and attached efficiency is lower.
Based on the foregoing drawbacks of the attachment of the support film 1, an embodiment of the present invention provides a support film 1, and referring to fig. 3, fig. 3 is a schematic structural diagram of a support film provided in an embodiment of the present invention, where the support film 1 includes: a laminated adhesive layer 12 and a base material 11;
wherein, the viscosity of the adhesive layer 12 before heating or light irradiation treatment is different from the viscosity after heating or light irradiation treatment.
The support film 1 includes a base material 11 for supporting a flexible substrate of the display panel 2, and a glue layer 12 for attaching the base material 11 to the flexible substrate. The adhesive layer 12 may change its adhesiveness to the flexible substrate under the condition of heat or light irradiation. The accessible is to the control of the condition of heating or light irradiation, change the viscidity of glue film 12, and under the less strong condition of viscidity, will attach the support membrane 1 of the district C of buckling that attaches at the flexible substrate, then can not attach the support membrane 1 respectively to the display area A of flexible substrate and chip binding district B, can attach the whole piece of support membrane 1 with the display area A of flexible substrate, chip binding district B and buckling district C is whole, tear the support membrane 1 of buckling district C under the less strong condition of glue film 12 viscidity again, reduced the attached number of times of support membrane 1, save the attaching process.
Alternatively, the adhesive layer 12 may be a thermosetting adhesive or an ultraviolet adhesive. When the adhesive layer 12 is a thermosetting adhesive, the viscosity of the adhesive layer 12 can be changed by heat treatment, for example, if the current adhesive layer 12 has weak viscosity, the viscosity of the adhesive layer 12 is enhanced after heat treatment; or the adhesive property of the adhesive layer 12 is weakened after the heat treatment because the adhesive property of the front adhesive layer 12 is stronger. When the adhesive layer 12 is an ultraviolet adhesive, the viscosity of the adhesive layer 12 can be changed by ultraviolet light irradiation treatment, for example, if the current adhesive layer 12 has weak viscosity, the viscosity of the adhesive layer 12 is enhanced after the light irradiation treatment; or the adhesive property of the adhesive layer 12 is weakened after the light irradiation treatment because the adhesive property of the adhesive layer 12 is stronger.
Alternatively, when the viscosity of the adhesive layer 12 is changed by the heat treatment, the temperature of the heat treatment may be 20 ° to 80 °. If the initial state of the adhesive layer 12 is weak in adhesiveness, the adhesiveness increases when heated at this temperature, and if the initial state of the adhesive layer 12 is strong in adhesiveness, the adhesiveness decreases when heated at this temperature.
Alternatively, when the viscosity of the adhesive layer 12 is changed by the light irradiation treatment, the wavelength range of the light irradiation treatment may be 345nm to 365 nm. If the initial state of the adhesive layer 12 is weak in adhesiveness, the adhesiveness is increased under the irradiation of ultraviolet light in this wavelength range, and if the initial state of the adhesive layer 12 is strong in adhesiveness, the adhesiveness is decreased under the irradiation of ultraviolet light in this wavelength range.
The support film provided by the embodiment of the invention comprises the glue layer and the base material which are arranged in a stacked mode, wherein the glue layer is used for attaching the base material to the flexible substrate, the viscosity of the glue layer before and after heating or light irradiation treatment is different, the support film can be attached to the flexible substrate, the viscosity of the support film attached to the bending area of the flexible substrate is reduced through the heating or light irradiation treatment, and therefore the support film in the bending area is removed, the support films in two non-bending areas do not need to be attached to the flexible substrate respectively, the attachment process is saved, the production cost is reduced, the production efficiency is improved, and the problems that the existing support film is complex to attach and low in attachment efficiency are solved.
On the basis of the above embodiment, the adhesive layer 12 has a viscosity range of 2g/mm to 3g/mm before being heated or irradiated with light; the viscosity of the adhesive layer 12 after heating or light irradiation treatment is not less than 1000 g/mm; or the viscosity of the adhesive layer 12 before heating or light irradiation treatment is not less than 1000 g/mm; the adhesive range of the adhesive layer 12 after heating or light irradiation treatment is 2g/mm to 3 g/mm.
When the adhesive layer 12 has weak adhesiveness, the adhesiveness may be in the range of 2g/mm to 3g/mm, so that the adhesive layer 12 can bond the substrate 11 and the display panel 1 together and can be easily torn off; when the adhesive layer 12 has strong adhesiveness, the adhesiveness is not less than 1000g/mm, so that the base material 11 can be firmly attached to the display panel 1 by the adhesive layer 12 to support and protect the flexible substrate of the display panel.
Optionally, with continued reference to fig. 3, the support film 1 may further include: a release film 13 and a protective film 14; the protective film 14 is attached to the side of the substrate 11 away from the glue layer 12, and the release film 13 is attached to the side of the glue layer 12 away from the substrate 11.
The release film 13 is used for preventing dust and protecting the adhesive layer 12 before the adhesive layer 12 is attached to the display panel 2, and when the support film 1 is attached, the release film 13 is removed to attach the adhesive layer 12 to the flexible substrate of the display panel. The protective film 14 is attached to the base material 11 to protect the base material 11 and prevent damage to the base material 11 during the process flow and product transportation.
The embodiment of the present invention further provides a support film attaching method, which is applicable to the support film 1 provided in any embodiment of the present invention, and referring to fig. 4, fig. 4 is a flowchart of the support film attaching method provided in the embodiment of the present invention, and the support film attaching method includes:
and S410, attaching the glue layer to the flexible substrate of the display panel.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a display panel with a support film attached thereon in a bent state according to an embodiment of the present invention. The display panel 2 comprises a display area A, a chip binding area B and a bending area C, and the chip binding area B is turned to the non-display side of the display area A after the bending area C is bent. The display area A is provided with a chip on film for displaying pictures, the chip binding area B is bound with a driving chip of the chip on film and used for driving the chip on film to work, and the bending area C is connected with the display area A and the chip binding area B and bends the chip binding area B bound with the driving chip to the non-display side of the display area A.
When the chip bonding region B is not bent, the adhesive layer 12 on the support film 1 is attached to the flexible substrate of the display panel 2. Optionally, with continued reference to fig. 3, the support film 1 further includes a release film 13 and a protective film 14; the protective film 14 is attached to one side of the base material 11 away from the adhesive layer 12, and the release film 13 is attached to one side of the adhesive layer 12 away from the base material; before the adhesive layer 12 is attached to the flexible substrate of the display panel 1, the method further includes: the release film 13 supporting the film 1 is removed. The adhesive layer 12 can be attached to the flexible substrate of the display panel 2 only after the release film 13 is removed.
S420, removing the support film 1 in the bending area C, and heating or irradiating the support film 1 in the display area A and the chip binding area B by light, wherein the viscosity of the adhesive layer 12 before the heating or irradiating by light is smaller than the viscosity after the heating or irradiating by light; or heating or light irradiation processing is carried out on the support film 1 in the bending area C, and the support film 1 in the bending area C is removed, wherein the viscosity of the adhesive layer 12 before the heating or light irradiation processing is larger than that after the heating or light irradiation processing.
When the adhesive layer 12 is attached to the display panel 2, the adhesive layer 12 may be in a state of strong adhesiveness or in a state of weak adhesiveness.
Referring to fig. 6, when the initial state of the adhesive layer 12 attached to the display panel 2 is a state with weak viscosity, fig. 6 is a schematic structural diagram of attaching the adhesive layer to the display panel according to an embodiment of the present invention. Since the adhesive layer 12 is now weak in adhesiveness, similar to the above-mentioned adhesiveness range of 2g/mm to 3g/mm, the support film 1 in the bending region C can be directly peeled off, and optionally, referring to fig. 6, the support film 1 in the bending region C is removed by a laser half-cut process. Specifically, the protective film 14 and the substrate 11 in the bending region C may be cut off by a laser half-cutting process, because the adhesive property of the adhesive layer 12 is weak at this time, the adhesive layer 12 in the bending region C may be directly torn off through the protective film 14 and the substrate 11, and referring to fig. 7, fig. 7 is a schematic structural diagram of a display panel in which the support film in the bending region is removed according to an embodiment of the present invention. After the support film 1 in the bending region C is removed, in order to ensure strong adhesion between the support film 1 and the display panel 2, the viscosity of the glue layer 12 needs to be enhanced. Referring to fig. 8, fig. 8 is a schematic structural diagram illustrating a structure of a support film being heated or irradiated by light according to an embodiment of the present invention. The entire display panel 2 to which the support film 1 is attached is subjected to heating or light irradiation treatment by a heating device or an ultraviolet irradiation device to enhance the adhesiveness of the adhesive layer 12, illustratively, to increase the adhesiveness of the adhesive layer 12 to not less than 1000 g/mm. The support film 1 can be firmly adhered to the flexible substrate to protect the flexible substrate.
When the initial state of the adhesive layer 12 attached to the display panel 2 is a state with strong adhesiveness, referring to fig. 9, fig. 9 is another schematic structural view of attaching the adhesive layer to the display panel according to the embodiment of the present invention, because the adhesive layer 12 has strong adhesiveness, the adhesiveness is not less than 1000g/mm, and it is not easy to directly tear off the support film 1 in the bending region C, the substrate 11 and the protection film 14 in the bending region C are first subjected to laser half-cut processing, as shown in fig. 9. Then, the bending region C needs to be processed by heating or light irradiation, and referring to fig. 10, fig. 10 is a schematic structural diagram of heating or light irradiation processing for the bending region according to an embodiment of the present invention. When the bending region C is heated by the heating device or the ultraviolet irradiation device or light is irradiated, the adhesive property of the adhesive layer 12 of the bending region C is weakened, and the support film 1 of the bending region C can be torn off, as shown in fig. 11, where fig. 11 is a schematic structural diagram of another display panel provided in the embodiment of the present invention, where the support film of the bending region is removed. In addition, the support film 1 in the bending region C may be subjected to a laser half-cut process after being subjected to a heating or light irradiation process, and the order of the laser half-cut process, the heating or light irradiation process may be changed.
In summary, regardless of whether the initial state of the adhesive layer 12 is a strong adhesive state or a weak adhesive state, the support film 1 in the bending region C needs to be removed when the adhesion of the support film 1 in the bending region C is weak.
According to the support film attaching method provided by the embodiment of the invention, the support film is attached to the flexible substrate of the display panel, the support film comprises the glue layer and the base material which are arranged in a stacked mode, the glue layer is used for attaching the base material to the flexible substrate, the viscosity of the glue layer before and after heating or light irradiation treatment is different, the support film can be attached to the flexible substrate, the viscosity of the support film attached to the bending area of the flexible substrate is reduced through heating or light irradiation treatment, so that the support film in the bending area is removed, the support films in two non-bending areas are not required to be attached to the flexible substrate respectively, the attaching process is saved, the production cost is reduced, the production efficiency is improved, and the problems that the existing support film is complex to attach and low in attaching efficiency are solved.
Alternatively, referring to fig. 12, fig. 12 is a schematic structural diagram of a display panel mother board with a support film attached thereon, where the glue layer 12 is attached to the flexible substrate of the display panel 2, and the method includes: attaching the adhesive layer 12 to a flexible substrate of a display panel motherboard; the display panel mother board comprises a plurality of display panels arranged in an array.
In the manufacturing process of the display panel 2, a display panel mother board including a plurality of display panels 2 is often disposed first, and then the display panel mother board is divided to obtain the display panel 2. Including at least one display panel 2 on the display panel mother board, under general conditions, 2 arrays of display panel arrange, then can set up supporting film and display panel mother board assorted size, when will supporting film 1 and attach to the flexible substrate of display panel mother board, be equivalent to and carry out the adhesion to a plurality of display panel 2 simultaneously, reduce the attached number of times of supporting film, improved attached efficiency. The support film 1 is then divided by cutting lines 5, optionally the cutting lines 5 may be formed by a laser cutting process. In another embodiment of the present invention, the support film 1 is divided together while the display panel 2 on the display panel mother board is divided, so that the manufacturing process of the display panel is saved, and the investment of production equipment is reduced.
Referring to fig. 13, fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present invention, and the display device is prepared by attaching a support film 1 on a flexible substrate 21 of a display panel 2 by using a support film attaching method according to any embodiment of the present invention.
Optionally, the flexible substrate 21 of the display panel 2 is further provided with an array of pixel circuit layers 22, and an organic light emitting layer 23 disposed on the pixel circuit layers 22, for implementing image display.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (11)
1. A support film, comprising: the glue layer and the base material are arranged in a stacked mode;
the adhesive size of the adhesive layer before heating or light irradiation treatment is different from the adhesive size after heating or light irradiation treatment.
2. The support film of claim 1, wherein:
the glue layer is thermosetting glue or ultraviolet glue.
3. The support film of claim 1, wherein:
the temperature of the heat treatment is 20-80 degrees.
4. The support film of claim 1, wherein:
the wavelength range of the light rays irradiated by the light rays is 345 nm-365 nm.
5. The support film of claim 1, wherein:
the viscosity range of the adhesive layer before heating or light irradiation treatment is 2 g/mm-3 g/mm;
the viscosity of the adhesive layer after heating or light irradiation treatment is not less than 1000 g/mm;
or,
the viscosity of the adhesive layer before heating or light irradiation treatment is not less than 1000 g/mm;
the viscosity range of the adhesive layer after heating or light irradiation treatment is 2 g/mm-3 g/mm.
6. The support film of claim 1, further comprising: a release film and a protective film;
the protective film is attached to one side, away from the adhesive layer, of the base material, and the release film is attached to one side, away from the base material, of the adhesive layer.
7. A support film attaching method applied to the support film according to any one of claims 1 to 6, comprising:
attaching the adhesive layer to a flexible substrate of a display panel; the display panel comprises a display area, a chip binding area and a bending area, wherein the chip binding area is folded to the non-display side of the display area after the bending area is bent;
removing the support film of the bending area, and heating or irradiating the support film of the display area and the chip binding area by light; wherein the viscosity of the adhesive layer before heating or light irradiation treatment is less than the viscosity after heating or light irradiation treatment;
or,
heating or irradiating the support film of the bending area by light, and removing the support film of the bending area; wherein the viscosity of the adhesive layer before heating or light irradiation treatment is greater than the viscosity after heating or light irradiation treatment.
8. The support film attaching method according to claim 7, wherein the support film further includes a release film and a protective film; the protective film is attached to one side of the base material, which is far away from the adhesive layer, and the release film is attached to one side of the adhesive layer, which is far away from the base material;
before the glue layer is attached to the flexible substrate of the display panel, the method further comprises the following steps:
and removing the release film of the support film.
9. The method for attaching a support film according to claim 7, wherein the support film in the bending region is removed by a laser half-cut process.
10. The method of claim 7, wherein attaching the adhesive layer to the flexible substrate of the display panel comprises:
attaching the adhesive layer to a flexible substrate of a display panel motherboard;
the display panel motherboard comprises a plurality of display panels arranged in an array.
11. A display device, characterized in that the method of any one of claims 7 to 10 is used to attach a support film on a flexible substrate of a display panel.
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| CN201810837072.XA CN110767083A (en) | 2018-07-26 | 2018-07-26 | Support film, attachment method thereof and display device |
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| CN201810837072.XA CN110767083A (en) | 2018-07-26 | 2018-07-26 | Support film, attachment method thereof and display device |
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| CN111383536A (en) * | 2020-03-30 | 2020-07-07 | 昆山国显光电有限公司 | Flexible display panel and manufacturing method thereof |
| CN111489654A (en) * | 2020-05-28 | 2020-08-04 | 京东方科技集团股份有限公司 | Support film and forming method thereof, display panel and manufacturing method thereof |
| CN111584714A (en) * | 2020-05-27 | 2020-08-25 | 京东方科技集团股份有限公司 | OLED display structure preparation method and OLED display structure |
| CN111635709A (en) * | 2020-05-28 | 2020-09-08 | 云谷（固安）科技有限公司 | Protective film, screen assembly and screen laminating method |
| CN112863338A (en) * | 2021-01-12 | 2021-05-28 | 武汉华星光电半导体显示技术有限公司 | Display module and preparation method thereof |
| CN113112912A (en) * | 2021-03-17 | 2021-07-13 | 武汉华星光电半导体显示技术有限公司 | Substrate protection structure, display screen and preparation method thereof |
| WO2022052219A1 (en) * | 2020-09-09 | 2022-03-17 | 武汉华星光电半导体显示技术有限公司 | Composite film layer and display device |
| CN114373394A (en) * | 2022-01-20 | 2022-04-19 | 武汉华星光电半导体显示技术有限公司 | Display device and manufacturing method thereof |
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