CN110740002A

CN110740002A - kinds of electronic equipment

Info

Publication number: CN110740002A
Application number: CN201911021427.9A
Authority: CN
Inventors: 贾玉虎
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-10-25
Filing date: 2019-10-25
Publication date: 2020-01-31

Abstract

The invention provides electronic equipment which comprises a shell, a millimeter wave antenna module and a processing module, wherein the millimeter wave antenna module and the processing module are positioned in the shell, the processing module comprises a processing component and a metal piece arranged at the periphery of the processing component, and the millimeter wave antenna module is arranged at any position of the periphery of the metal piece.

Description

kinds of electronic equipment

Technical Field

The application relates to the technical field of electronics, in particular to kinds of electronic equipment.

Background

The 5G NR uses mainly two-stage frequencies: FR1 frequency band and FR2 frequency band. The frequency range of the FR1 frequency band is 450 MHz-6 GHz, also called sub-6GHz frequency band; the frequency range of the FR2 frequency band is 24.25GHz to 52.6GHz, commonly called millimeter wave (mmWave). For the design of the mobile phone antenna, the sub-6GHz from 1G to 5G is basically an increase in quantity (e.g., the number of frequency bands and the number of antennas), that is, a refinement and optimization of the antenna design, such as an increase in the number of wireless communication frequency bands and an increase in the number of antennas, whereas for the design of the millimeter-wave band antenna, the design is a qualitative jump (e.g., array design and beam forming) for the mobile phone antenna.

In order to achieve better beam forming and spatial coverage of , is designed by matching antenna types (e.g., broadside radiation and end-fire radiation) complementary to radiation beams (e.g., Patchantenna and quasi-Yagi antenna), and based on proper design of antenna feed points, dual polarization (vertical and horizontal polarization) is achieved to increase wireless communication connection capability, and an RFIC (radio frequency chip) is welded upside down to shorten antenna feed lines as much as possible, so as to reduce high path loss caused by high frequency transmission, so that the millimeter wave antenna array has higher radiation gain, and better EIRP (effective isotropic radiation power) and coverage strength are achieved.

Disclosure of Invention

The invention provides kinds of electronic equipment, which are used for solving the problem that the radiation performance of a millimeter wave antenna module in the electronic equipment is difficult to regulate and control in the prior art.

In order to achieve the above purpose, the invention provides electronic devices, which include a housing, a millimeter wave antenna module and a processing module, wherein the millimeter wave antenna module and the processing module are located in the housing, the processing module includes a processing component and a metal component disposed at the periphery of the processing component, and the millimeter wave antenna module is disposed at any position of the periphery of the metal component.

, the processing module is a camera module, the camera module comprises an imaging component and a bracket for accommodating the imaging component, and the bracket is the metal piece.

, the processing module is an audio module, the audio module comprises a sound-producing unit and a housing for housing the sound-producing unit, and the housing is the metal piece.

, the processing module is a central processing module, the central processing module comprises a central processing module and a shielding cover arranged at the periphery of the central processing module, and the shielding cover is the metal piece.

, the outer surface of the metal piece is corrugated.

, the millimeter wave antenna module has a wavelength λ, and the distance between the millimeter wave antenna module and the processing module is (0.5-1) λ.

, the electronic device further comprises a motherboard, the millimeter wave antenna module is flatly placed on the motherboard, and the upper end surface of the millimeter wave antenna module is located between the upper end surface of the processing module and the lower end surface of the processing module.

step by step, the electronic equipment still includes the mainboard, the slope of millimeter wave antenna module is placed on the mainboard, millimeter wave antenna module include with the relative last inclined plane of metalwork slant and with the lower inclined plane that goes up the inclined plane and is relative, go up the inclined plane and be located the up end of handling the module with handle between the lower terminal surface of module.

, the millimeter wave antenna module is arranged on the side of the metal piece.

, the millimeter wave antenna modules are symmetrically arranged on two sides of the metal piece.

Compared with the prior art, the invention has the beneficial effects that: through setting up millimeter wave antenna module in the periphery department of handling the module, the module is handled to millimeter wave antenna module main radiation direction orientation, and when millimeter wave antenna module outwards radiated millimeter wave, the metalwork of handling the module is touched to the millimeter wave is reflected to make the main radiation direction of millimeter wave antenna module take place to deflect, changed the radiation direction and the scope of millimeter wave antenna module, utilize the metalwork of handling the module promptly to provide the means of regulation and control millimeter wave antenna directional diagram. By the technical scheme, the problem that the radiation performance of the millimeter wave antenna in the electronic equipment is difficult to regulate and control in the prior art is solved.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device in embodiment of the present application;

FIG. 2 is a cross-sectional view of FIG. 1;

fig. 3 is a schematic structural diagram of an electronic device according to embodiment of the present application;

FIG. 4 is a cross-sectional view of FIG. 3;

fig. 5 is a cross-sectional view of an electronic device according to a second embodiment of the present application.

Wherein the figures include the following reference numerals:

10. a housing; 20. a millimeter wave antenna module; 30. a processing module; 31. a processing component; 32. a metal piece.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the embodiments of the present invention will be described in detail and completely with reference to the accompanying drawings, it is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments.

Example :

referring to fig. 1-4, electronic devices include a housing 10, a millimeter wave antenna module 20, and a processing module 30, wherein the millimeter wave antenna module 20 and the processing module 30 are disposed in the housing 10, the processing module 30 includes a processing element 31 and a metal element 32 disposed at the periphery of the processing element 31, and the millimeter wave antenna module 20 is disposed at any position of the periphery of the metal element 32.

In the present invention, the millimeter wave antenna module 20 is disposed at the periphery of the processing module 30, the main radiation direction of the millimeter wave antenna module 20 faces the processing module 30, and when the millimeter wave antenna module 20 radiates the millimeter wave outwards, the millimeter wave hits the metal piece 32 of the processing module 30 and is reflected, so that the main radiation direction of the millimeter wave antenna module 20 is deflected, the radiation direction and range of the millimeter wave antenna module 20 are changed, that is, the metal piece of the processing module 30 is used to provide a means for adjusting and controlling the directional diagram of the millimeter wave antenna. By the technical scheme, the problem that the radiation performance of the millimeter wave antenna in the electronic equipment is difficult to regulate and control in the prior art is solved.

In this embodiment, the processing module 30 is a camera module, the camera module includes an imaging element and a bracket for receiving the imaging element, and the bracket is a metal element 32, it should be noted that the processing module 30 is not limited to the camera module, and further , the processing module 30 is an audio module, the audio module includes a sound unit and a housing for housing the sound unit, the housing is the metal element 32, that is, the millimeter wave antenna module 20 may be further disposed at the periphery of the audio module, and the housing is used for deflecting the main radiation direction of the millimeter wave antenna module 20, further , the processing module 30 may be a central processor module, the central processor module includes a central processor and a shielding cover disposed at the periphery of the central processor, and the shielding cover is the metal element 32, that is, the millimeter wave antenna module 20 is disposed at the periphery of the central processor module, that is, the millimeter wave antenna pattern can be reflected by the shielding cover, so as to achieve the adjustment and control of the millimeter wave antenna pattern by means of the equipped metal element 32 according to the arrangement and space allocation of the electronic device.

Preferably, the outer surface of the metal piece 32 is arranged in a corrugated structure. The reflection range of the millimeter wave can be increased by arranging the corrugated structure on the surface of the metal piece 32, and of course, the reflection range of the millimeter wave antenna module 20 is adjusted by roughening the outer surface of the metal piece 32 through other structures. The material of the metal member 32 is made of copper, stainless steel, aluminum alloy or other metal materials, and the reflection intensity of the millimeter wave can be changed by selecting the material of the metal member 32.

Preferably, when the wavelength of the millimeter wave antenna module 20 is λ, the distance between the millimeter wave antenna module 20 and the processing module 30 is (0.5-1) λ, and the distance between the millimeter wave antenna module 20 and the processing module 30 is set according to the wavelength of the millimeter wave, so as to ensure the radiation performance of the millimeter wave antenna module 20.

When the problem of the internal space of the electronic device is considered, the millimeter wave antenna module 20 can be arranged on the side of the processing module 30, so that the millimeter wave antenna module 20 is obliquely emitted to the metal piece 32 of the processing module 30 to be reflected, and the space coverage rate of the millimeter wave antenna module 20 is improved.

When the radiation range of the millimeter wave antenna module 20 is considered, referring to fig. 3 and fig. 4, the millimeter wave antenna modules 20 may be symmetrically disposed on two sides of the processing module 30, so that the directions of the two millimeter wave antenna modules 20 are opposite, not only the main radiation directions of the two millimeter wave antenna modules 20 are changed, but also the spatial coverage of the millimeter wave antenna modules 20 is greatly improved.

, the electronic device further includes a motherboard, the millimeter wave antenna module 20 is flatly placed on the motherboard, the upper end surface of the millimeter wave antenna module 20 is located between the upper end surface of the processing module 30 and the lower end surface of the processing module 30, and the reflection range of the millimeter wave can be properly enlarged by properly adjusting the angle, position, etc. between the millimeter wave antenna module 20 and the processing module 30.

Specifically, referring to fig. 5, when the space of the electronic device is abundant, it may be considered that the millimeter wave antenna module 20 is obliquely disposed on the motherboard, the millimeter wave antenna module 20 includes an upper inclined surface obliquely opposite to the metal component 32 and a lower inclined surface opposite to the upper inclined surface, the upper inclined surface is located between the upper end surface of the processing module 30 and the lower end surface of the processing module 30, similarly, the reflection range may be further expanded on by adjusting the inclination angle of the millimeter wave antenna module 20 relative to the processing module 30, and other structural components are the same as those in embodiment , and are not described herein again.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

In view of the above description of the electronic device provided in the present application, it will be apparent to those skilled in the art from this disclosure that various changes may be made in the embodiments and applications without departing from the spirit and scope of the invention, and therefore, the disclosure should not be limited to the embodiments and applications.

Claims

An electronic device of the type , comprising:

the millimeter wave antenna module and the processing module are located in the shell, the processing module comprises a processing assembly and a metal piece arranged on the periphery of the processing assembly, and the millimeter wave antenna module is arranged at any position of the periphery of the metal piece.
2. The electronic device of claim 1, wherein the processing module is a camera module, the camera module comprises an imaging component and a bracket for receiving the imaging component, and the bracket is the metal piece.
3. The electronic device according to claim 1, wherein the processing module is an audio module, the audio module includes a sound-emitting unit and a housing case for housing the sound-emitting unit, and the housing case is the metal member.
4. The electronic device of claim 1, wherein the processing module is a central processor module, the central processor module comprising a central processing unit and a shield cover disposed around the central processing unit, the shield cover being the metallic member.
5. The electronic device according to any of of claims 1-4, wherein an outer surface of the metallic article is configured in a corrugated configuration.
6. The electronic device of claim 5, wherein the millimeter wave antenna module has a wavelength λ and is located at a distance of (0.5-1) λ from the processing module.
7. The electronic device according to claim 6, further comprising a motherboard on which the millimeter wave antenna module lies, wherein an upper end surface of the millimeter wave antenna module is located between an upper end surface of the processing module and a lower end surface of the processing module.
8. The electronic device according to claim 6, further comprising a motherboard on which the millimeter wave antenna module is obliquely placed, wherein the millimeter wave antenna module comprises an upper inclined surface diagonally opposite to the metal member and a lower inclined surface diagonally opposite to the upper inclined surface, and the upper inclined surface is located between an upper end surface of the processing module and a lower end surface of the processing module.
9. The electronic device of claim 1, wherein the millimeter wave antenna module is disposed on an side of the metallic article.
10. The electronic device of claim 1, wherein the millimeter wave antenna modules are symmetrically disposed on two sides of the metal member.