CN110488431A - A kind of optical module - Google Patents
A kind of optical module Download PDFInfo
- Publication number
- CN110488431A CN110488431A CN201910722007.7A CN201910722007A CN110488431A CN 110488431 A CN110488431 A CN 110488431A CN 201910722007 A CN201910722007 A CN 201910722007A CN 110488431 A CN110488431 A CN 110488431A
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- optical module
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- 230000003287 optical effect Effects 0.000 title claims abstract description 96
- 235000011449 Rosa Nutrition 0.000 claims abstract 17
- 230000005693 optoelectronics Effects 0.000 claims description 52
- 230000001681 protective effect Effects 0.000 claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 239000000835 fiber Substances 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 7
- 230000000452 restraining effect Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 11
- 238000004891 communication Methods 0.000 description 5
- 239000013307 optical fiber Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000019800 disodium phosphate Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The embodiment of the present application discloses a kind of optical module, comprising: photoelectric subassembly and shell component, the photoelectric subassembly are arranged in the shell component internal；Wherein, the photoelectric subassembly includes: light emitting secondary module TOSA component and light-receiving secondary module ROSA component；The TOSA component includes the TOSA protection cap at least having electromagnetic wave shielding function；The ROSA component includes the ROSA protection cap at least having electromagnetic wave shielding function.
Description
Technical Field
The present application relates to the field of optical communication technologies, and in particular, to an optical module.
Background
With the rapid development of optical communication and interconnection networks in recent years, the market demand for networks is increasing dramatically, resulting in the rapid increase of traffic of the telecommunication backbone network. In order to meet the market demand for high-speed data transmission, the transmission speed of optical modules is also rapidly increasing, and currently, optical modules gradually evolve from 100G to 400G, however, compared with 100G optical modules, 400G optical modules require Digital Signal Processing (DSP) and various complex auxiliary circuits. Therefore, how to deal with the problems of heat dissipation, miniaturization, electromagnetic interference and the like caused by the improvement of the transmission speed of the optical module becomes a problem to be solved urgently.
Disclosure of Invention
In order to achieve the above purpose, the technical solution of the embodiment of the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides an optical module, including: the photoelectric component is arranged inside the tube shell component; wherein,
the photovoltaic module includes: a Transmitter Optical Subassembly (TOSA) module and a Receiver Optical Subassembly (ROSA) module; the TOSA assembly comprises a TOSA protective cover at least having an electromagnetic wave shielding function; the ROSA assembly comprises a ROSA protective cover at least having the function of shielding electromagnetic waves.
In an optional implementation, the TOSA assembly further includes a TOSA optoelectronic element, wherein the TOSA protective cover covers the TOSA optoelectronic element for protecting the TOSA optoelectronic element and shielding electromagnetic waves of the TOSA optoelectronic element.
In an optional embodiment, the ROSA module further includes a ROSA optoelectronic element, wherein the ROSA protective cover covers the ROSA optoelectronic element for protecting the ROSA optoelectronic element and shielding electromagnetic waves of the ROSA optoelectronic element.
In an alternative embodiment, the TOSA and ROSA assemblies are pigtailed devices, the TOSA assembly further includes a first pigtail ferrule, the ROSA assembly further includes a second pigtail ferrule; wherein,
the TOSA protective cover is used for restraining the disc fiber path corresponding to the first tail fiber clamping sleeve, and the ROSA protective cover is used for restraining the disc fiber path corresponding to the second tail fiber clamping sleeve.
In an alternative embodiment, the optoelectronic assembly further comprises: a PCB board and a heat sink copper plate; wherein,
the heat sink copper plate is used as a heat dissipation substrate of the TOSA assembly and is arranged on the lower surface of the PCB.
In an alternative embodiment, the cartridge assembly comprises: the upper cover is arranged at the upper part of the photoelectric component; the base is arranged at the lower part of the photoelectric assembly; wherein,
the upper cover and the base are fixed together through a connecting piece to form an accommodating space, and the accommodating space is used for arranging the photoelectric assembly.
In an optional implementation manner, a first groove is formed in the bottom surface of the base, and the first groove is used for avoiding the electronic device on the lower surface of the PCB.
In an optional implementation manner, a second groove is formed in the bottom surface of the base, and the second groove is used for avoiding the heat sink copper plate on the lower surface of the PCB.
In an alternative embodiment, an optical interface is disposed on one side of the accommodating space formed by the upper cover and the base, and a horizontal central axis of the optical interface is higher than an upper surface of the PCB board.
In an alternative embodiment, the upper cover includes: an electromagnetic shield ring for shielding electromagnetic waves;
wherein, the electromagnetic shielding ring is arranged at the joint of the upper cover and the base.
In an alternative embodiment, the electromagnetic shield includes:
the annular wall spigot is used for blocking a transmission channel of electromagnetic waves;
and the shielding glue groove is used for enabling the upper cover to be tightly attached to the base.
In an alternative embodiment, the ROSA protective cover is provided with a vent hole, and the ROSA component dissipates heat through the vent hole.
An optical module provided in an embodiment of the present application includes: the photoelectric component is arranged inside the tube shell component; wherein the optoelectronic assembly comprises: a Transmitter Optical Subassembly (TOSA) assembly and a receiver optical subassembly (ROSA assembly); the TOSA assembly comprises a TOSA protective cover at least having an electromagnetic wave shielding function; the ROSA assembly comprises a ROSA protective cover at least having the function of shielding electromagnetic waves. The embodiment of the application realizes the protection, electromagnetic shielding and heat dissipation of the TOSA assembly and the ROSA assembly element, and simultaneously realizes the restraint and protection of optical fibers inside the optical module.
Drawings
Fig. 1 is a perspective view of an optical module provided in an embodiment of the present application;
fig. 2 is a perspective view of an optoelectronic module in an optical module provided in an embodiment of the present application;
fig. 3 is an exploded view of a structure of an optoelectronic module in an optical module according to an embodiment of the present disclosure;
fig. 4 is an exploded view of a tube housing assembly in an optical module according to an embodiment of the present disclosure;
fig. 5 is a perspective view of a base in an optical module provided in an embodiment of the present application;
fig. 6 is a perspective view of an upper cover in an optical module provided in an embodiment of the present application;
fig. 7 is a side cross-sectional view of an optical module provided in an embodiment of the present application;
fig. 8 is a perspective view of a pull ring in an optical module provided in an embodiment of the present application;
description of reference numerals:
100-an optical module; 200-an optoelectronic component; 210-a TOSA assembly; 211-TOSA protective cover; 212-TOSA optoelectronic component; 213-first pigtail ferrule; 220-a ROSA component; 221-ROSA protective cover; 222-a ROSA optoelectronic element; 223-a second pigtail ferrule; 230-a PCB board; 231-U-shaped through holes; 240-IC chip; 250-heat sink copper plate; 300-cartridge assembly; 310-upper cover; 311-electromagnetic shielding ring; 3111-ring wall seam allowance; 3112-a shielding glue tank; 312 — a first boss; 313-a second boss; 314-a third boss; 315-third arc groove; 316-fourth arc groove; 320-a base; 321-a first groove; 322-a second groove; 323-optical interface; 324-PCB board support posts; 325-a via hole; 326-screw hole; 327-a first arc groove; 328-a second arc groove; 329-a fourth boss; 330-a pull ring; 331-brake pad; 332-a ring pull handle; 341-first screw; 342-a second screw; 343-a third screw; 344-fourth screw.
Detailed Description
So that the manner in which the features and elements of the present embodiments can be understood in detail, a more particular description of the embodiments, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings.
With the rapid development of optical communication and interconnection networks in recent years, the market demand for networks is increasing dramatically, resulting in the rapid increase of traffic of the telecommunication backbone network. In order to meet the market demand for high-speed data transmission, the transmission speed of optical modules is also rapidly increasing, and currently, optical modules gradually evolve from 100G to 400G, however, compared with 100G optical modules, 400G optical modules require DSPs and various complex auxiliary circuits. Therefore, how to deal with the problems of heat dissipation, miniaturization, electromagnetic interference and the like caused by the improvement of the transmission speed of the optical module becomes a problem to be solved urgently.
The existing high-speed optical module considers the problems of heat dissipation and electromagnetic compatibility in the aspects of optics, hardware, process, structure and the like, however, after the overall scheme and the device selection are determined, the aspects of optics, hardware and process are difficult to change, so that in terms of structural design, under the condition that the miniaturization of the packaging size of the high-speed optical module is ensured as much as possible, the problems of heat dissipation, electromagnetic compatibility and the like are considered while more optical elements are distributed in the optical module shell, and the problem becomes a great challenge in the industry.
Therefore, the following technical scheme of the embodiment of the application is provided.
An optical module provided in an embodiment of the present application includes: the photoelectric component is arranged inside the tube shell component; wherein the optoelectronic assembly comprises: a Transmitter Optical Subassembly (TOSA) assembly and a receiver optical subassembly (ROSA assembly); the TOSA assembly comprises a TOSA protective cover at least having an electromagnetic wave shielding function; the ROSA assembly comprises a ROSA protective cover at least having the function of shielding electromagnetic waves.
Fig. 1 is a perspective view of an optical module according to an embodiment of the present application, and as shown in fig. 1, the optical module according to the embodiment of the present application includes: an optoelectronic assembly 200 and a package assembly 300, the optoelectronic assembly 200 being disposed inside the package assembly 300; wherein the optoelectronic assembly 200 (shown in fig. 2) comprises: TOSA and ROSA assemblies 210 and 220; the TOSA module 210 (shown in fig. 3) includes a TOSA protective cover 211 at least having an electromagnetic wave shielding function; the ROSA module 220 includes a ROSA protective cover 221 having at least an electromagnetic wave shielding function.
Fig. 2 is a perspective view of an optical electrical component in an optical module provided in an embodiment of the present application, and fig. 3 is an exploded view of a structure of the optical electrical component in the optical module provided in the embodiment of the present application, as shown in fig. 2 and 3, an optical electrical component 200 in the optical module provided in the embodiment of the present application includes: TOSA assembly 210, ROSA assembly 220, PCB board 230, and IC chip 240. The TOSA assembly 210 includes: TOSA protective cover 211, TOSA optoelectronic component 212, and first pigtail ferrule 213. The ROSA assembly 220 includes: ROSA boot 221, ROSA optoelectronic component 222, and second pigtail ferrule 223.
Here, the TOSA protective cover 211 covers the TOSA optoelectronic element 212, for protecting the TOSA optoelectronic element 212 and shielding electromagnetic waves of the TOSA optoelectronic element 212.
Here, the TOSA assembly 210 is a pigtailed type device, the TOSA assembly 210 includes a first pigtail ferrule 213, and the TOSA protection cover 211 is configured to constrain a fiber routing path corresponding to the first pigtail ferrule 213.
Here, the optoelectronic assembly 200 further includes: a heat sink copper plate 250; the heat sink copper plate 250 is used as a heat dissipation substrate of the TOSA module 210 and is disposed on the lower surface of the PCB 230.
In a specific implementation, the heat sink copper plate 250 may serve as a heat dissipation supporting substrate for the TOSA optoelectronic element 212, the heat sink copper plate 250 may be fixed on the lower Surface of the PCB 230 by means of glue adhesion or Surface Mount Technology (SMT), wherein a through hole (not shown in fig. 3) having a certain shape is disposed at a bonding position between the PCB 230 and the heat sink copper plate 250, and the TOSA optoelectronic element 212 dissipates heat through the through hole. In specific implementation, the TOSA optoelectronic component 212 (such as a laser, a ceramic pad, a lens, a filter, etc.) may be attached to the heat sink copper plate 250 through the through hole, and the TOSA optoelectronic component 212 is electrically connected to the PCB 230 through gold wire bonding.
In specific implementation, the TOSA protective cover 211 may be fixed on the upper surface of the PCB 230 by glue. The TOSA protection cover 211 is provided with pins and raised features (not shown in fig. 3), the PCB 230 is correspondingly provided with hole and groove features (not shown in fig. 3), and the pins and raised features on the TOSA protection cover 211 are bonded with the corresponding hole and groove features on the PCB 230, so that accurate positioning of the TOSA protection cover 211 on the PCB 230 is ensured.
Here, the ROSA protective cover 221 covers the ROSA optoelectronic element 222, and protects the ROSA optoelectronic element 222 and shields electromagnetic waves of the ROSA optoelectronic element 222.
Here, the ROSA assembly 220 is a pigtailed device, the ROSA assembly 220 including a second pigtail ferrule 223; the ROSA protection cover 221 is configured to constrain the fiber winding path corresponding to the second pigtail ferrule 223.
Here, the ROSA protection cover 221 is further provided with a vent hole through which the ROSA module 220 radiates heat.
In specific implementation, the ROSA protective cover 221 is designed in a special structure, and the ROSA protective cover 221 is provided with a vent hole, and is further used for preventing water vapor generated during operation of a Photodiode (PD) and a transimpedance Amplifier (TIA) chip from condensing to influence optical performance indexes of the optical module.
Fig. 4 is an exploded view of a structure of a tube and shell assembly in an optical module according to an embodiment of the present disclosure, and as shown in fig. 4, a tube and shell assembly 300 of an optical module according to an embodiment of the present disclosure includes: an upper cover 310, a base 320 and a pull ring 330, the upper cover 310 being disposed on the upper portion of the optoelectronic assembly 200; the base 320 is arranged at the lower part of the optoelectronic assembly 200; wherein,
the upper cover 310 and the base 320 are fixed together by a connector to form an accommodating space for accommodating the optoelectronic assembly 200.
Fig. 5 is a perspective view of a base in an optical module provided in the embodiment of the present application, and as shown in fig. 5, a first groove 321 is arranged on a bottom surface of the base 320, and the first groove 321 is used for avoiding an electronic device on a lower surface of the PCB 230.
Here, a second groove 322 is disposed on the bottom surface of the base 320, and the second groove 322 is used for avoiding the heat sink copper plate 250 on the lower surface of the PCB 230.
Here, an optical interface 323 is provided on one side surface of the accommodating space formed by the upper cover 310 and the base 320, and as shown in fig. 5, the optical interface 323 is provided at the right end of the base 320. The horizontal central axis of the optical interface 323 is higher than the upper surface of the PCB board 230; the height difference between the horizontal central axis of the optical interface and the upper surface of the PCB is a fixed height, and the fixed height may be set to be 2mm, but is not limited to 2 mm. Such an arrangement may provide a larger layout area for PCB 230 (the contour end surface of PCB 230 is maximally close to optical interface 323), and also facilitate the fiber winding of optical fibers inside the optical module.
As shown in fig. 3 and 5, the optoelectronic module 200 is configured to convert an optical signal received by the optical module into an electrical signal or convert the electrical signal into an optical signal. The optoelectronic assembly 200 includes a first pigtail ferrule 213 and a second pigtail ferrule 223; the base 320 includes an optical interface 323; one end of the first pigtail ferrule 213 and one end of the second pigtail ferrule 223 are respectively connected to the TOSA component 210 and the ROSA component 220 through optical fibers, and the other end of the first pigtail ferrule 213 and the other end of the second pigtail ferrule 223 are connected to the optical interface 323. It should be noted that two interfaces corresponding to the first pigtail ferrule 213 and the second pigtail ferrule 223 are disposed in the optical interface 323, so as to be connected to the first pigtail ferrule 213 and the second pigtail ferrule 223, respectively. In specific implementation, the optical interface 323 is used for plug-in adaptation with an optical connector.
As shown in fig. 5, six PCB support columns 324 are disposed on the base 320, and the six PCB support columns 324 are symmetrically distributed along two sides of the base 320, and are used for supporting and limiting the PCB 230. Two U-shaped bosses are arranged on the base 320, two through holes 325 are arranged on the two U-shaped bosses, and two screw holes 326 are also arranged on the base 320; accordingly, the PCB 230 is provided with two U-shaped through holes 231 (as shown in fig. 2) at positions corresponding to the two through holes 325 on the U-shaped boss. The screws include a first screw 341, a second screw 342, a third screw 343, and a fourth screw 344 (shown in fig. 4). The PCB 230 is fixed to the six PCB support columns 324 by first, second, third and fourth screws 341, 342, 343 and 344. Accordingly, the upper cover 310 is provided with two through holes (as shown in fig. 4) at positions corresponding to the third screw 343 and the fourth screw 344 (and at positions corresponding to the two screw holes 326 of the base 320). Meanwhile, the upper cover 310 is also fixedly connected to the base 320 by a first screw 341, a second screw 342, a third screw 343, and a fourth screw 344. The U-shaped boss is used for limiting the PCB 230 in the transverse direction (the direction parallel to the PCB 230). In specific implementation, within an allowable range of the MSA protocol, a movement margin of ± 0.18mm may be left between the U-shaped boss on the base 320 and the U-shaped through hole 321 on the PCB 230, so that a worker may perform optical adjustment on the optical module, and after the optical module is adjusted, the gap of the movement margin may be filled with glue, so as to ensure that the PCB 230 is firmly fixed inside the package assembly 300.
As shown in fig. 5, the base 320 is further provided with two arc grooves, namely a first arc groove 327 and a second arc groove 328; accordingly, the upper cover 310 is provided with a third arc groove 315 and a fourth arc groove 316 (shown in fig. 6) at positions corresponding to the first arc groove 327 and the second arc groove 328. The first pigtail ferrule 213 is fixed in the receiving space formed by the upper cover 310 and the base 320, that is, the inside of the housing assembly 300, by the first circular arc groove 327 on the base 320 and the third circular arc groove 315 on the upper cover 310; the second fiber ferrule 223 is fixed in the receiving space formed by the upper cap 310 and the base 320, i.e. the inside of the cartridge assembly 300, by the second circular arc groove 328 on the base 320 and the fourth circular arc groove 316 on the upper cap 310. The first arc groove 327, the second arc groove 328, the third arc groove 315, and the fourth arc groove 316 are used for limiting the first pigtail ferrule 213 and the second pigtail ferrule 223, so as to ensure the normal plugging of the first pigtail ferrule 213 and the second pigtail ferrule 223 with an optical connector.
Fig. 6 is a perspective view of an upper cover in an optical module according to an embodiment of the present application, and as shown in fig. 6, the upper cover 310 includes: an electromagnetic shield ring 311 for shielding electromagnetic waves; wherein the electromagnetic shielding ring 311 is disposed at the connection between the upper cover 310 and the base 320. The electromagnetic shield ring 311 includes: a ringwall stop 3111 for blocking a transmission passage of electromagnetic waves; and a shielding glue groove 3112 for tightly attaching the upper cover 310 to the base 320.
In specific implementation, the higher the ring wall seam allowance 3111 on both sides of the upper cover 310 (on both sides in a direction parallel to the center line of the optical interface 323) is set, the tighter the matching with the side walls on both sides of the base 320 (on the side walls in a direction parallel to the center line of the optical interface 323), the better the electromagnetic shielding effect.
As shown in fig. 6, a first boss 312 is disposed on the upper cover 310, and the first boss 312 is used for longitudinally limiting (perpendicular to the PCB 230) the PCB 230. In specific implementation, the surface of the first boss 312 is in non-rigid contact with the upper surface of the PCB 230, that is, a gap with a certain distance is reserved between the surface of the first boss 312 and the upper surface of the PCB 230, the distance may be 0.1mm (the distance satisfies the MSA protocol, which is not limited in the embodiment of the present application), and the maximum floating distance of the PCB 230 in the longitudinal direction is 0.1mm, so that the PCB 230 is limited in the longitudinal direction.
Here, the upper cover 310 is provided with a second boss 313, a heat conduction pad (not shown in fig. 6) is attached to the second boss 313, and the second boss 313 is disposed at a position on the upper cover 310 corresponding to the IC chip 240, so that the IC chip 240 can dissipate heat through the heat conduction pad attached to the second boss 313.
Fig. 7 is a side cross-sectional view of an optical module according to an embodiment of the present application, and as shown in fig. 7, an optical module 100 according to an embodiment of the present application includes: the upper cover 310, the optoelectronic assembly 200, and the base 320; wherein the upper cover 310 is disposed on an upper portion of the optoelectronic assembly 200; the base 320 is arranged at the lower part of the optoelectronic assembly 200; the upper cover 310 and the base 320 are fixed together by a connector to form an accommodating space for accommodating the optoelectronic assembly 200.
As shown in fig. 6 and 7, the upper cover 310 is further provided with a third boss 314, and the third boss 314 is used for cooperating with a fourth boss 329 at a corresponding position of the base 320, so as to ensure that the electronic device inside the package assembly 300 is isolated from the outside in the direction of the external electrical port (in the direction toward the gold finger).
As shown in fig. 7, the upper cover 310 is connected to the base 320, and encloses the optoelectronic device 200; the arc grooves (the first arc groove 327 and the second arc groove 328) on the base 320 and the arc grooves (the third arc groove 315 and the fourth arc groove 316) on the upper cover 310 are matched with each other to completely limit the pigtail ferrules (the first pigtail ferrule 213 and the second pigtail ferrule 223); the first bosses 312 of the upper cover 310 are matched with the base 320 to longitudinally limit the PCB 230.
Fig. 8 is a perspective view of a pull ring in a light module according to an embodiment of the present application, and as shown in fig. 8, the pull ring 330 includes: a catch 331 and a tab handle 332, an end of the catch 331 being encapsulated within the tab handle 332; the pull ring 330 is used for unlocking and locking the light module.
Here, in practical applications, the pull ring handle 332 may be made of plastic.
An optical module provided in an embodiment of the present application includes: the photoelectric component is arranged inside the tube shell component; wherein the optoelectronic assembly comprises: a Transmitter Optical Subassembly (TOSA) assembly and a receiver optical subassembly (ROSA assembly); the TOSA assembly comprises a TOSA protective cover at least having an electromagnetic wave shielding function; the ROSA assembly comprises a ROSA protective cover at least having the function of shielding electromagnetic waves. The embodiment of the application realizes element protection, electromagnetic shielding and heat dissipation of the TOSA assembly and the ROSA assembly, and simultaneously realizes constraint and protection of optical fibers inside the optical module.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that, in the various embodiments of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application. The above-mentioned serial numbers of the embodiments of the present application are merely for description and do not represent the merits of the embodiments.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. The above-described device embodiments are merely illustrative, for example, the division of the unit is only a logical functional division, and there may be other division ways in actual implementation, such as: multiple units or components may be combined, or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the coupling, direct coupling or communication connection between the components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between the devices or units may be electrical, mechanical or other forms.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed on a plurality of network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
The features disclosed in several of the apparatus embodiments provided in the present application may be combined arbitrarily, without conflict, to arrive at new apparatus embodiments.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (12)
1. A light module, comprising: the photoelectric component is arranged inside the tube shell component; wherein,
the photovoltaic module includes: a Transmitter Optical Subassembly (TOSA) assembly and a receiver optical subassembly (ROSA assembly); the TOSA assembly comprises a TOSA protective cover at least having an electromagnetic wave shielding function; the ROSA assembly comprises a ROSA protective cover at least having the function of shielding electromagnetic waves.
2. The optical module of claim 1, wherein the TOSA assembly further comprises a TOSA optoelectronic element, wherein the TOSA protective cover covers the TOSA optoelectronic element for protecting the TOSA optoelectronic element and shielding electromagnetic waves of the TOSA optoelectronic element.
3. The optical module according to claim 1, wherein the ROSA module further includes a ROSA optoelectronic element, and wherein the ROSA protective cover covers the ROSA optoelectronic element, and protects the ROSA optoelectronic element and shields electromagnetic waves of the ROSA optoelectronic element.
4. The optical module of claim 2 or 3, wherein the TOSA and ROSA assemblies are pigtailed devices, the TOSA assembly further comprising a first pigtail ferrule, the ROSA assembly further comprising a second pigtail ferrule; wherein,
the TOSA protective cover is used for restraining the disc fiber path corresponding to the first tail fiber clamping sleeve, and the ROSA protective cover is used for restraining the disc fiber path corresponding to the second tail fiber clamping sleeve.
5. The optical module of claim 1, wherein the optoelectronic assembly further comprises: a PCB board and a heat sink copper plate; wherein,
the heat sink copper plate is used as a heat dissipation substrate of the TOSA assembly and is arranged on the lower surface of the PCB.
6. The optical module of claim 5, wherein the package assembly comprises: the upper cover is arranged at the upper part of the photoelectric component; the base is arranged at the lower part of the photoelectric assembly; wherein,
the upper cover and the base are fixed together through a connecting piece to form an accommodating space, and the accommodating space is used for arranging the photoelectric assembly.
7. The optical module of claim 6, wherein a first groove is formed on the bottom surface of the base, and the first groove is used for avoiding an electronic device on the lower surface of the PCB.
8. The optical module according to claim 6 or 7, wherein a second groove is formed in the bottom surface of the base, and the second groove is used for avoiding the heat sink copper plate on the lower surface of the PCB.
9. The optical module according to claim 6, wherein an optical interface is disposed on one side of the accommodating space formed by the upper cover and the base, and a horizontal central axis of the optical interface is higher than an upper surface of the PCB.
10. The light module of claim 6, wherein the upper cover comprises: an electromagnetic shield ring for shielding electromagnetic waves;
wherein, the electromagnetic shielding ring is arranged at the joint of the upper cover and the base.
11. The optical module of claim 10, wherein the electromagnetic shield comprises:
the annular wall spigot is used for blocking a transmission channel of electromagnetic waves;
and the shielding glue groove is used for enabling the upper cover to be tightly attached to the base.
12. The optical module of claim 1, wherein the ROSA protective cover is provided with a vent hole, and the ROSA component dissipates heat through the vent hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910722007.7A CN110488431A (en) | 2019-08-06 | 2019-08-06 | A kind of optical module |
| PCT/CN2019/125117 WO2021022749A1 (en) | 2019-08-06 | 2019-12-13 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910722007.7A CN110488431A (en) | 2019-08-06 | 2019-08-06 | A kind of optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110488431A true CN110488431A (en) | 2019-11-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910722007.7A Pending CN110488431A (en) | 2019-08-06 | 2019-08-06 | A kind of optical module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110488431A (en) |
| WO (1) | WO2021022749A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021022749A1 (en) * | 2019-08-06 | 2021-02-11 | 武汉光迅科技股份有限公司 | Optical module |
| CN113805285A (en) * | 2020-06-16 | 2021-12-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2022218045A1 (en) * | 2021-04-16 | 2022-10-20 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113253404A (en) * | 2021-06-23 | 2021-08-13 | 希烽光电科技(南京)有限公司 | Anti-electromagnetic interference optical module structure |
| CN113866919B (en) * | 2021-09-30 | 2023-08-15 | 武汉光迅科技股份有限公司 | Fiber coiling protective cover and PCB assembly |
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| WO2021022749A1 (en) | 2021-02-11 |
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