CN110460747A - Array camera module and electronic equipment and image processing method with array camera module - Google Patents
Array camera module and electronic equipment and image processing method with array camera module Download PDFInfo
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- CN110460747A CN110460747A CN201810429600.8A CN201810429600A CN110460747A CN 110460747 A CN110460747 A CN 110460747A CN 201810429600 A CN201810429600 A CN 201810429600A CN 110460747 A CN110460747 A CN 110460747A
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- image information
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/95—Computational photography systems, e.g. light-field imaging systems
- H04N23/951—Computational photography systems, e.g. light-field imaging systems by using two or more images to influence resolution, frame rate or aspect ratio
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- Computing Systems (AREA)
- Theoretical Computer Science (AREA)
- Color Television Image Signal Generators (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Abstract
Array camera module and electronic equipment and image processing method with array camera module, wherein the array camera module includes one first camera module, one second camera module, and, a circuit board.First camera module and second camera module are electrically connected in the circuit board.First camera module is including one first sensitive chip and corresponds to one first optical lens of the first sensitive chip.First camera module is including one first sensitive chip and corresponds to one first optical lens of the first sensitive chip, wherein, the equivalent focal length f1 of first optical lens is less than the equivalent focal length f2 of second optical lens, the field angle FOV1 of first optical lens is greater than the field angle FOV2 of second optical lens, wherein, first sensitive chip is a color sensitive chip and second sensitive chip is a black and white sensitive chip.
Description
Technical field
The present invention relates to a camera module field more particularly to an array camera module and with array camera module
Electronic equipment and image processing method.
Background technique
With advances in technology and expanding economy, people require the camera function of portable electronic device higher
It is higher, for example, tablet computer, video camera, smart phone etc..Under this trend, array camera module comes into being.Gu Mingsi
Justice, array camera module include two or more camera modules, compared to traditional single photography/videography mould group, by two or with
The function of many characteristics may be implemented in cooperation between upper camera module, for example, the camera module by two kinds of different focal lengths is real
The effect of existing " optical zoom ".
More specifically, the existing array camera module with " optical zoom " function comprising two focal length differences
Camera module, respectively (focal length is big, visual field for a wide-angle imaging mould group (focal length is small, and field angle is big) and a focal length camera module
Angle is small).The optical lens viewfinder range of wide-angle imaging mould group is wider, but is difficult shooting and understands that distant objects, focal length are taken the photograph
As the optical lens viewfinder range of mould group is narrow, but relatively farther object can be taken, to pass through wide-angle and focal length
The complementary collocation of camera module, and using the corresponding image processing algorithm in backstage, realize the function of " optical zoom ".
However, leading to the entirety of the array camera module since focal length camera module has relatively large height dimension
Product height is difficult to decrease.This application to array camera module, such as an electronic equipment is assembled in as its Image Acquisition work
Tool, causes great obstruction, is especially difficult to meet the development trend of electronic equipment slimization instantly.
Further, the existing array camera module with " optical zoom " function, focal length camera module and wide-angle
The corresponding sensitive chip of camera module is all color sensitive chip.During Image Acquisition, focal length camera module is due to certainly
Body height limitation, light-inletting quantity is insufficient, along with the photoperceptivity of color sensitive chip is relatively weak, focal length is caused to image mould
Group color image obfuscation collected.This defect, ambient light than it is darker in the case where, more obviously.
Therefore, more existing that there is " optical zoom " function array camera module, it is not able to select the dark-state the case where
Focal length camera module is closed in lower selection, and it is in running order that wide-angle imaging mould group is only arranged.That is, existing some battle arrays
Column camera module, in dark-state shooting, though there is the name of array camera module, it is real without array camera module, it is unable to fully send out
Wave the imaging advantage of array camera module.
Further, since the size limitations of focal length camera module, the existing array with " optical zoom " function images mould
Group, " optical zoom " multiple usually having are 2 times.When the multiplying power for the optical zoom for wanting to be promoted the array camera module
When, the height dimension of focal length camera module needs to increase, and cause the integral product height of the array camera module that can increase accordingly,
Lose its value of industrial utilization.
Summary of the invention
It is an object of the present invention to provide an array camera module and the electronic equipment with array camera module and
Image processing method, wherein the array camera module include one first camera module and one second camera module, described first
The equivalent focal length f1 of camera module is less than the equivalent focal length f2 of second camera module, wherein first camera module
One first sensitive chip is a color sensitive chip, and one second sensitive chip of second camera module is that a black and white is photosensitive
Chip is to reinforce the capturing ability of light.
Another object of the present invention is to provide an array camera module and the electronic equipment with array camera module and
Image processing method, wherein the second sensitive chip by second camera module is a black and white sensitive chip, compared to coloured silk
The area of color sensation optical chip, the unit pixel of the black and white sensitive chip can be contracted by, thus meeting equal pixel quantity
Under it is required that, the size of second sensitive chip can correspondingly be reduced, so that described the second of second camera module
Sensitive chip may be placed at more adjacent to second optical lens.That is, after needed for second camera module
Coke reduces, so that the overall height dimension of the array camera module can be contracted by.
Another object of the present invention is to provide an array camera module and the electronic equipment with array camera module and
Image processing method can reduce institute wherein the second sensitive chip by second camera module is a black and white sensitive chip
The technical characteristic of the overall height dimension of array camera module is stated, so as in the height gauge for ensuring the array camera module
It is very little meet certain size demand under the premise of, the appropriate equivalent focal length f2 for increasing by the second camera module is taken the photograph with improving the array
As " optical zoom " multiplying power of mould group, for example, more than 2 times " optical zoom ".
Another object of the present invention is to provide an array camera module and the electronic equipment with array camera module and
Image processing method, wherein the unit pixel size of the black and white sensitive chip can be reduced to less than 1.0 * 1.0um, thus
Compared to color sensitive chip, the black and white sensitive chip of equal pixel quantity has relatively small size, in favor of the battle array
The reduction of column camera module overall height dimension.
Another object of the present invention is to provide an array camera module and the electronic equipment with array camera module and
Image processing method, since the black and white sensitive chip has relatively good details expressive ability, thus by described the
When two camera modules shoot measured target relatively far away from, have by the second camera module acquired image opposite
Better minutia, in favor of improving the visual effect of subsequent image synthesis.
Another object of the present invention is to provide an array camera module and the electronic equipment with array camera module and
Image processing method, wherein the sensitive chip of first camera module is a color sensitive chip and the second camera shooting mould
The sensitive chip of group is a black and white sensitive chip, and the black and white sensitive chip pixel density (under same shooting angle CRA) is higher than
Or the pixel equal to the color sensitive chip, in favor of during subsequent progress " optical zoom ", by described second
The measured target image of camera module relatively distant place collected opposite can maintain higher clarity horizontal.
Another object of the present invention is to provide an array camera module and the electronic equipment with array camera module and
Image processing method, wherein by first camera module, one first image collected and by the second camera shooting mould
Group one second image collected, can be merged according to preset image interfusion method, with the vision of realization " optical zoom "
Effect.
By following description, other advantages of the invention and feature will be become apparent, and can pass through right
The means and combination particularly pointed out in claim are accomplished.
According to the present invention, aforementioned and other purposes and advantage can be implemented by an array camera module comprising:
One first camera module;
One second camera module;With
One circuit board, wherein first camera module and second camera module are electrically connected in the circuit
Plate, wherein first camera module includes one first sensitive chip and one first light corresponding to first sensitive chip
Camera lens is learned, wherein second camera module includes one second sensitive chip and corresponding to the one the of first sensitive chip
One optical lens, wherein the focal length f1 of first optical lens is less than the focal length f2 of second optical lens, described first
The field angle FOV1 of optical lens is greater than the field angle FOV2 of second optical lens, wherein first sensitive chip is
One color sensitive chip and second sensitive chip are a black and white sensitive chip.
In one embodiment of this invention, the unit pixel point area of the black and white sensitive chip is less than color sensitive core
The unit pixel point area of piece, so that the size of second sensitive chip is opposite to be subtracted under equal pixel quantitative requirement
It is small, so that second optical lens relatively more can neighboringly be installed on the top side of second sensitive chip.
In one embodiment of this invention, the unit pixel size of the black and white sensitive chip is set less than 1.0*
1.0um.
In one embodiment of this invention, the circuit board includes a first circuit board and a second circuit board, wherein institute
The first circuit board can be conductively installed on by stating the first camera module, and second camera module can conductively be installed on institute
State second circuit board.
In one embodiment of this invention, the array camera module further includes a bracket, wherein the bracket is fixed on
The peripheral part of first camera module and second camera module, for positioning first camera module and described second
Camera module.
In one embodiment of this invention, first camera module further includes one first pedestal, the first pedestal peace
Loaded on the circuit board, and one first light hole being formed, first light hole corresponds to first sensitive chip, wherein
First optical lens is installed on the top side of first pedestal and is held in the photosensitive path of first sensitive chip;
Second camera module further includes one second pedestal, and second pedestal is installed on the circuit board, and it is logical to form one second
Unthreaded hole, second light hole corresponds to second sensitive chip, wherein second optical lens is installed on described second
The top side of pedestal and the photosensitive path for being held in second sensitive chip.
In one embodiment of this invention, first pedestal integrally extends second pedestal.
According to another aspect of the present invention, the present invention also provides an array camera modules comprising:
One first camera module;
One second camera module;With
One circuit board, wherein first camera module and second camera module are electrically connected in the circuit
Plate, wherein first camera module is including one first sensitive chip and corresponds to one first optics of the first sensitive chip
Camera lens, wherein first camera module is including one first sensitive chip and corresponds to one first light of the first sensitive chip
Camera lens is learned, wherein the focal length f1 of first optical lens is less than the focal length f2 of second optical lens, first optics
The field angle FOV1 of camera lens is greater than the field angle FOV2 of second optical lens, wherein first sensitive chip is one color
Color sensation optical chip and second sensitive chip are a black and white sensitive chip, wherein the pixel face of the black and white sensitive chip
Product is less than the pixel point areas of the color sensitive chip, thus in the case where meeting equal pixel requirement, second sense
The size of optical chip is reduced relatively, so that second optical lens relatively more can neighboringly be installed on described second
The top side of sensitive chip.
According to another aspect of the present invention, the present invention also provides the image processing method of an array camera module,
In, described image processing method comprising steps of
By one first camera module, one first image information of a measured target is obtained;
By one second camera module, one second image information of a measured target is obtained, wherein the first camera shooting mould
The field angle FOV1 of group is greater than the field angle FOV2 of second camera module;With
The first image information and second image information are merged, to obtain a third image information, wherein institute
It states third image information and is associated with the first image information and second image information.By to subsequent description and attached
The understanding of figure, further aim of the present invention and advantage will be fully demonstrated.
These and other objects of the invention, feature and advantage, pass through following detailed descriptions, drawings and claims
It is fully demonstrated.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of an array camera module of one first preferred embodiment according to the present invention.
Fig. 2 is the perspective view of the explosion of the array camera module according to above-mentioned preferred embodiment.
Fig. 3 show one first sensitive chip and one of double photography/videography mould groups according to above-mentioned preferred embodiment
The amagnified partial perspective perspective view of the explosion of two sensitive chips.
Fig. 4, which is illustrated that, to be worked as corresponding second sensitive chip of second camera module by color sensitive chip
When replacing with black and white sensitive chip, the relative distance variation between second optical lens and second sensitive chip is (certainly
H1 to h2) and the second optical lens change in size schematic diagram.
Fig. 5, which is illustrated that, to be worked as corresponding second sensitive chip of second camera module by color sensitive chip
When replacing with black and white sensitive chip, the relative distance variation between second optical lens and second sensitive chip is (certainly
The diagrammatic cross-section of h1 to h2).
Fig. 6 is a diagrammatic cross-section of the array camera module according to above-mentioned preferred embodiment.
Fig. 7 is a variant embodiment of the array camera module according to above-mentioned preferred embodiment.
Fig. 8 is another variant embodiment of the array camera module according to above-mentioned preferred embodiment.
Fig. 9 is the another variant embodiment of the array camera module according to above-mentioned preferred embodiment.
Figure 10 is the another variant embodiment of the array camera module according to above-mentioned preferred embodiment.
Figure 11 is the another variant embodiment of the array camera module according to above-mentioned preferred embodiment.
Figure 12 is the another variant embodiment of the array camera module according to above-mentioned preferred embodiment.
Figure 13 is the another variant embodiment of the array camera module according to above-mentioned preferred embodiment.
Figure 14 is the another variant embodiment of the array camera module according to above-mentioned preferred embodiment, signal
The optical lens for being the most top side of second optical lens of second camera module is a glass lens.
Figure 15 is a diagrammatic cross-section of an array camera module of one second preferred embodiment according to the present invention.
It is the figure of the array camera module of above-mentioned first preferred embodiment and the second preferred embodiment shown in Figure 16
As collection effect schematic diagram.
Figure 17 is the block diagram representation of an image processing method of provided an array camera module according to the present invention.
Figure 18 is the block diagram representation of the step S3 of provided described image processing method according to the present invention.
Figure 19 is the block diagram representation of the step S31 of provided described image processing method according to the present invention.
Figure 20 is the block diagram representation of the step S33 of provided described image processing method according to the present invention.
Be shown in Figure 21 the step S311 of described image processing method provided by the present invention pixelated array with
The example of one of corresponding relationship between imaging unit.
It is that each imaging is single in the step S311 of described image processing method provided by the present invention shown in Figure 22
The RGB information solution relationship corresponding with corresponding array pixel of member.
Be shown in Figure 23 the step S311 of described image processing method provided by the present invention pixelated array with
Two example of the corresponding relationship between imaging unit.
It is the pixelated array of the step S311A of described image processing method provided by the present invention shown in Figure 24
The example of corresponding relationship between imaging unit.
For according to described image processing method processing array camera module one first figure collected shown in Figure 25
The process schematic of picture and one second image.
Illustrated in Figure 26 is the array camera module of above-mentioned first preferred embodiment and the second preferred embodiment
Another schematic diagram of Image Acquisition effect.
Figure 27 corresponds to the frame of an image processing method of the Image Acquisition effect of the array camera module of Figure 26
Diagram is intended to.
Figure 28 corresponds to the block diagram of the described image processing method of the Image Acquisition effect of the array camera module of Figure 27
Schematic diagram.
For according to the described image processing method of meaning shown in Figure 27 processing array camera module institute shown in Figure 29
One first image of acquisition and the process schematic of one second image.
Figure 30 illustrates that the array camera module is assembled in the stereoscopic schematic diagram of an electronic equipment.
Figure 31 illustrates that the array camera module is assembled in another stereoscopic schematic diagram of an electronic equipment.
Specific embodiment
It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.In being described below
Preferred embodiment is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.Boundary in the following description
Fixed basic principle of the invention can be applied to other embodiments, deformation scheme, improvement project, equivalent program and not have
There is the other technologies scheme away from the spirit and scope of the present invention.
It will be understood by those skilled in the art that in exposure of the invention, term " longitudinal direction ", " transverse direction ", "upper",
The orientation or position of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside"
Relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, rather than
The device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation, therefore above-mentioned
Term is not considered as limiting the invention.
It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment, one
The quantity of element can be one, and in a further embodiment, the quantity of the element can be it is multiple, term " one " cannot
It is interpreted as the limitation to quantity.
As Fig. 1 to as shown in figure 3, according to invention one first preferred embodiment an array camera module be elucidated with, wherein
The array camera module includes one first camera module 10 and one second camera module 20, to pass through the first camera shooting mould
Group 10 and second camera module 20 cooperation, realize the imaging function of " optical zoom ".Particularly, in the present invention, described
The equivalent focal length f2 less than second camera module 20, correspondingly, institute is set in the equivalent focal length f1 of first camera module 10
The field angle FOV1 for stating the first camera module 10 is greater than the field angle FOV2 of second camera module 20.That is, at this
In invention, as shown in Figure 1, first camera module 10 is configured as a wide-angle imaging mould group, second camera module
20 are configured as a focal length camera module, and in shooting process, the wide-angle imaging mould group viewfinder range is wider, still
It is difficult the details that shooting understands distant objects, the optical lens viewfinder range of the focal length camera module is narrow, but can clap
Relatively farther object is taken the photograph, to arrange in pairs or groups by the wide-angle and the complementary of the focal length camera module, and utilizes backstage phase
The image processing algorithm answered realizes the function of " optical zoom ".
The existing array camera module with " optical zoom " function, since its focal length camera module has relatively
Big height dimension causes its product whole height that can not decline.Limitation in this size greatly restricts the array
The application of camera module is especially unable to satisfy the growth requirement of electronic equipment slimization instantly.Meanwhile it is as previously mentioned, existing
The array camera module with " optical zoom " function, focal length camera module and the corresponding photosensitive core of wide-angle imaging mould group
Piece is all color sensitive chip.During Image Acquisition, focal length camera module is since oneself height limits, light-inletting quantity
Deficiency leads to focal length camera module color image hair collected along with the photoperceptivity of color sensitive chip is relatively weak
Secretly.This defect, ambient light than it is darker in the case where, more obviously, cause by focal length camera module coloured silk collected
Chromatic graph piece is unsuitable in subsequent composograph even adversely affecting image synthesis.
Correspondingly, the array camera module provided by the present invention is dedicated to solving the array camera module whole
The technical problem of body size and imaging effect etc., to better adapt to the trend of electronic equipment instantly.
More specifically, as shown in figure 3, in the preferred embodiment of the invention, first camera module 10 includes
One first sensitive chip 11 and one first optical lens 12, first optical lens 12 are held in the described first photosensitive core
The photosensitive path of piece 11, thus can be along this by the imaging ray of first optical lens 12 measured target collected
Photosensitive path is supported to first sensitive chip 11, and imaging reaction occurs at first sensitive chip 11.Described second
Camera module 20 includes one second sensitive chip 21 and one second optical lens 22, analogously, second optical lens 22
It is held in the photosensitive path of second sensitive chip 21, thus by the second optics measured target collected
Imaging ray can be supported along the photosensitive path to second sensitive chip 21, and be occurred at second sensitive chip 21
Imaging reaction.
Particularly, in the preferred embodiment of the invention, first optical lens 12 is corresponding described first photosensitive
Chip 11 is a color sensitive chip 110, and corresponding second sensitive chip 21 of second optical lens 22 is a black and white
Sensitive chip 210.That is, in the present invention, the sensitive chip of the focal length camera module is by an existing color sensitive
Chip replaces with a black and white sensitive chip, compared to color sensitive chip, the unit pixel of the black and white sensitive chip 210
2130 sizes can be contracted by, thus in the case where meeting equal pixel quantitative requirement, the ruler of the black and white sensitive chip 210
It is very little, the color sensitive chip of equal pixel quantity is compared, can be contracted by.Correspondingly, described in second camera module 20
When the size of second sensitive chip 21 is contracted by, second optical lens 22 of second camera module 20 can be more adjacent
Near-earth is installed on the top side of second sensitive chip 21.At this point, from visual effect, second optical lens 22
Installation site can more sink so that the overall height dimension of the array camera module can effectively be reduced.
More specifically, those skilled in the art will be appreciated that, as shown in figure 3, the color sensitive chip 110 has
Multilayered structure, including a microlens layer 111, a color filter layer 112 and a photosensitive layer 113, wherein by first light
The measured target light collected of camera lens 12 is learned when supporting the extremely color sensitive chip 110, which first penetrates described micro-
Mirror layer 111, and be filtered by the color filter layer 112, it is final to support to each pixel 1130 of the photosensitive layer 113
The light be monochromatic light (red, green or blue).Those skilled in the art will be appreciated that, during later period imaging, need with
The pixel 1130 of color sensitive chip 110 described in one group constructs an imaging unit, such as with the every 4 color sensitive cores
The pixel 1130 of piece 110 constitutes an imaging unit, and the colour information of measured target script is restored by corresponding algorithm.
Based on such imaging speciality, existing color sensitive chip, the size of unit pixel is typically larger than 1*1um or more, such as
1.2*1.2um, to ensure that each pixel 1130 can collect corresponding monochromatic optical information.
In simple terms, compared to the color sensitive chip 110, the black and white sensitive chip 210 and the color sensitive
The difference of chip 110 is only that the black and white sensitive chip 210 between the microlens layer 211 and the photosensitive layer 213
It is not provided with the color filter layer.That is, final support to each pixel 2130 of the black and white sensitive chip 210
The light is white light.In addition, not having the colour information of acquisition measured target for the black and white sensitive chip 210
Function, the pixel 2130 of each black and white sensitive chip 2130 is directly to be imaged, without being similar to the colored sense
A certain number of pixels 1130 need to be constituted an imaging unit to carry out color image information synthesis operation by optical chip 110.
Based on this photosensitive speciality, the black and white sensitive chip 210 can be under the premise of ensuring imaging, 2130 size of unit pixel
1130 size of unit pixel of the relatively described color sensitive chip 110 can be contracted by, to realize the reduction second photosensitive core
The purpose of chip size.
More particularly, such as Fig. 4 and as shown in figure 5, existing color sensitive chip 210P, unit pixel size base
This is in 1.0*1.0um or more, and 2130 size of unit pixel of the black and white sensitive chip 210 can be lower than 1.0*1.0um, example
Such as 0.8*0.8um, 0.9*0.9um etc..That is, when second camera module 20 second sensitive chip 21 from
When existing color sensitive chip 210P replaces with the black and white sensitive chip 210, the size of second sensitive chip 21 can phase
To being reduced, thus second optical lens 22 and second sensitive chip 21 of second camera module 20 it
Between relative distance can reduce, to reduce the whole height of the array camera module.
As shown in figure 5, working as the area of second sensitive chip 21, when especially imaging region reduces, ambient light passes through
Optical path needed for second optical lens 22 exposes to the correspondence photosensitive region of second sensitive chip 21 can be contracted
Subtract (h1-h2), so that the overall height dimension of the array camera module can effectively be reduced.Also, work as second light
When learning the diminution of the corresponding imaging region of camera lens 22, the off-axis aberration of second optical lens 22 influences smaller.At the same time,
(such as 0.6 visual field) position to evaluate certain field range of lens imaging ability can be closer to the described second photosensitive core
The center of piece 21, so that the absolute size of the field angle of second optical lens 22 can also be reduced, further to drop
Low lens design difficulty.It is also understood that under same quality requirement, for smaller chip (second sensitive chip
21) or for smaller imaging surface, the size of camera lens (second optical lens 21) can be smaller, as shown in Figure 4.It should be appreciated that
, distance h1 between attached drawing 4 and attached second optical lens 22P shown in fig. 5 and second sensitive chip 21P with
The distance between second optical lens 22 and second sensitive chip 21 h2, only illustrate, to show when described second
When the size of sensitive chip 21 reduces, the distance between second optical lens 22 and second sensitive chip 21 can quilts
Reduction and, when the size of second sensitive chip 21 is reduced, second optical lens 22 compares existing length
Burnt optical lens, overall dimensions can be contracted by, so that the overall dimensions of the array camera module can further reduce
Technology may and technical effect.
Further, since the black and white sensitive chip 210 is not provided with the color filter layer 112, such as Bayer filter,
Therefore, the light for being radiated to second sensitive chip 21 does not filter reduction by the color filter layer 112, and still has
There is relatively high luminous intensity.Therefore, even if light-inletting quantity is insufficient, but can be stronger photosensitive by the black and white sensitive chip 210
Performance is as making up, so that still having relatively high light and shade pair by 20 acquired image of the second camera module
Than degree information.That is, when to be configured as a black and white photosensitive for second sensitive chip 21 of second camera module 20
When chip 210, the array camera module has relatively that preferably dark-state shoots performance, thus even if shooting in the dark state, institute
The visual effect for stating array camera module still and having " optical zoom " of relatively high quality, it is more existing without being similar to
The focal length camera module is closed in array camera module selection with " optical zoom " function.
It is noted that those skilled in the art will be appreciated that, " optical zoom " times of so-called array camera module
Rate, depending between the equivalent focal length f1 of first camera module 10 and the equivalent focal length f2 of second camera module 20
Relativeness.The existing array camera module with " optical zoom " function, " optical zoom " multiplying power will not usually surpass
2 times are crossed, which is because, second camera shooting need to be promoted when wanting to promote " optical zoom " multiplying power of array camera module
The equivalent focal length f2 of mould group 20.However, the promotion of the equivalent focal length f2 of second camera module 20, it is meant that described second
The height dimension of second optical lens 22 of camera module 20 need to be elongated, this is undoubtedly not suitable for array camera module ruler
The very little demand that need to reduce.
However, in the preferred embodiment of the invention, second sensitive chip 21 of second camera module 20
It is implemented as a black and white sensitive chip 210, compared to color sensitive chip, the size of the black and white sensitive chip 210 is with respect to quilt
Reduction, so that second optical lens 22 of second camera module 20 can be more adjacent to second sensitive chip
21.Therefore, in the present invention, " optical zoom " multiplying power of the array camera module is settable more than 2 times, such as 3 times, only
Need to meet by second optical lens 22 brought by the black and white sensitive chip 210 height dimension reduction (including
The reduction of the 22 oneself height size of installation deflection (h1-h2) and second optical lens of second optical lens 22
Amount) it is greater than the length incrementss caused since the equivalent focal length f2 of second optical lens 22 need to be promoted.
It should also be mentioned that image is able to carry out " nothing in order to during subsequent progress imagery optical zoom
Damage zoom ", that is, during optical zoom, the clarity of the image keeps higher level.Preferably, second sense
21 unit field angle pixel density of optical chip is greater than or equal to the pixel of first sensitive chip 11., it will be appreciated that working as institute
When stating the second 21 pixel with higher of sensitive chip, second sensitive chip 21 is able to achieve the function of similar " super-sampling ",
Thus during carrying out optical zoom, even if the image is correspondingly handled, such as cuts or amplifies etc., the figure
As being able to maintain relatively high clarity level, to realize the technical effect of " lossless zoom " in visual effect.However,
This imagination is but difficult to carry out, which is because, when should in the existing array camera module with " optical zoom " function
When the pixel of second sensitive chip 21P need to increase, the size of second sensitive chip 210P need to be increase accordingly, to correspond to
Second optical lens 22P visual field corner characteristics of second camera module 20P, the bottom surface of optical lens 22P need far from this
Two sensitive chip 21P, meanwhile, the size of second optical lens 22P itself also needs to expand, this all will lead to array camera shooting
The whole height of mould group is further promoted.
Correspondingly, in the preferred embodiment of the invention, second sensitive chip 21 uses black and white sensitive chip
210 substitution color sensitive chip 210P.Just as previously mentioned, by the black and white sensitive chip 210 photosensitive imaging feature, institute
2130 size of unit pixel for stating black and white sensitive chip 210 compares the unit pixel 2130P area of color sensitive chip 210P,
It can be contracted by.Therefore, in the preferred embodiment of invention, the pixel of second sensitive chip 21 can be suitably promoted, simultaneously
The size for meeting second sensitive chip 21 is less than the size that the second sensitive chip 21P is color sensitive chip 210P, with
So that, on the one hand, the size of second sensitive chip 21 can be contracted by, to reduce the installation of second optical lens 22
Highly;On the other hand, the pixel of second sensitive chip 21 is suitably promoted, so that at subsequent progress optical zoom
During reason, opposite it can be maintained by the measured target image of second camera module 20 relatively distant place collected
Higher clarity is horizontal.Figuratively, it is the technical solution of black and white sensitive chip by second sensitive chip 21, gives
The more design parameter selections of designer have been given, have preferably been put down so that it can be obtained in imaging effect and terms of overall dimensions
Weighing apparatus.
Further, in the preferred embodiment of the invention, the array camera module is that integral type array images mould
Group.As shown in fig. 6, first camera module 10 and second camera module 20 can conductively be installed on same circuit board
30, to be that first camera module 10 and second camera module 20 provide a location and installation by the circuit board 30
Basal plane.During subsequent installation calibration, basal plane set by the circuit board 30 can be used as calibration first camera shooting
The basal plane parallel with 20 optical axis of the second camera module of mould group 10.
It answers it is contemplated that in other embodiment of the present invention, as shown in fig. 7, the array camera module can quilt
It is embodied as a split type array camera module, wherein first camera module 10 and second camera module 20 respectively can
Conductively it is installed on a first circuit board 31 and a second circuit board 32.Correspondingly, in order to ensure first camera module 10
Meet certain relationship with the relative mounting location of second camera module 20, such as the two optical axis is parallel or interval is default
Distance, the array camera module further includes a bracket 40, and the bracket 40 combines glue-line by one, is fixed on described the
The peripheral part of one camera module 10 and second camera module 20, for positioning first camera module 10 and described second
Camera module 20.
In order to further limit and consolidate the phase between first camera module 10 and second camera module 20
To positional relationship, in some embodiments of the invention, as shown in figure 8, the array camera module further includes that a connection is set a roof beam in place
60, wherein the connection frame beam 60 extends between first camera module 10 and second camera module 20, to institute
The first camera module 10 and second camera module 20 is stated further to limit and consolidate.
Further, in the preferred embodiment of the invention, first camera module 10 further includes one first pedestal
51, first pedestal 51 is installed on the circuit board 30, wherein first optical lens 12 is installed on first pedestal
51 top side, first optical lens 12 is held in first sensitive chip 11 by first pedestal 51
Photosensitive path.It should be noted that first pedestal 51 forms one first light hole 510, first light hole 510 is corresponding
In at least photosensitive region of first sensitive chip 11, to pass through the optical lens, the formation of the first light hole 510
The photosensitive path of first sensitive chip 11.Similarly, second camera module 20 further includes one second pedestal 52, institute
It states the second pedestal 52 and is installed on the circuit board 30, wherein second optical lens 22 is installed on second pedestal 52
Top side, second optical lens 22 is held in the photosensitive of second sensitive chip 21 by second pedestal 52
Path.It should be noted that second pedestal 52 forms one second light hole 520, second light hole 520 corresponds to institute
At least photosensitive region of the second sensitive chip 21 is stated, with by the optical lens, second light hole 520 forms described
The photosensitive path of second sensitive chip 21.
, it will be appreciated that in the present invention, first pedestal 51 and second pedestal 52 can be implemented as integral type
Structure or split type structure.As shown in figure 3, when first pedestal 51 and second pedestal 52 have integral structure,
First pedestal 51 integrally extends second pedestal 52, to pass through first pedestal 51 and second base
The integral structure of seat 52, can further limit first camera module 10 and second camera module 20.Ying Ling
Can, when first pedestal 51 and second pedestal have integral structure, first pedestal 51 and described
Second pedestal 52 can be integrally formed, such as by mould pressing process or moulding technology etc., to improve industrial functions.Certainly, in order to just
In can relatively more moving freely through for first camera module 10 and second camera module 20, first pedestal
51 and second pedestal 52 it is implementable be split type structure, i.e., described first pedestal 51 and second pedestal 52 are independent
Component, as shown in Figure 6.
It is described during specifically assembling and encapsulating first camera module 10 and the second camera module 20
First sensitive chip 11 and second sensitive chip 21 can be mounted on institute by traditional COB (Chop On Board technique)
Circuit board 30 is stated, and is respectively turned on first sensitive chip 11 and the circuit board 30 and described second by one group of lead
Sensitive chip 21 and the circuit board 30.Certainly, in other embodiments of the present invention, 11 He of the first sensitive chip
Second sensitive chip 21 can be mounted by other modes and is connected in the circuit board 30, such as FC (Flip Chip) work
Skill etc..
Correspondingly, the side of traditional gluing can be used in the pedestal 50 (first pedestal 51 and second pedestal 52)
Formula is installed on the circuit board 30, provides corresponding installation for first optical lens 12 and second optical lens 22
Basal plane.Certainly, in other embodiment of the present invention, such as Fig. 9 or as shown in Figure 10,50 (first pedestal 51 of pedestal
With second pedestal 52) it can be installed on the corresponding position of the circuit board 30 by other means, such as pass through molding or mould
Technique is pressed to be integrally formed the corresponding of pedestal 50 (first pedestal 51 and second pedestal 52) the Yu Suoshu circuit board 30
Position.More specifically, it in the technical process that specific implementation molding or mould pressing process form the pedestal 50, can be used
MOB (Molding On board), MOC (Molding On Chip) or MOG (Molding On Glass) etc. techniques are formed
The pedestal 50 (first pedestal 51 and second pedestal 52)., it will be appreciated that 50 (first base of pedestal
Seat 51 and second pedestal 52) first light hole 510 and second light hole 520 it is (described in the pedestal 50
First pedestal 51 and second pedestal 52) molding when, it is synchronous to be formed.
Further, in the preferred embodiment of invention, first camera module 10 may also include one first camera lens
Load-carrying unit 13, wherein first optical lens 12 is installed on the first camera lens load-carrying unit 13, first camera lens is held
It carries element 13 and is installed on first pedestal 51, in this way, keep first optical lens 12 in described first
The photosensitive path of sensitive chip 11.Similarly, second camera module 20 further includes one second camera lens load-carrying unit 23,
Described in the second optical lens 22 be installed on the second camera lens load-carrying unit 23, the second camera lens load-carrying unit 23 is installed
In second pedestal 52, in this way, keep second optical lens 22 in second sensitive chip 21
Photosensitive path.
It is noted that in the present invention, the camera lens load-carrying unit 13,23 can be implemented as a support lens barrel
13A, 23A are so that corresponding camera module 10,20 is implemented as a fixed-focus camera module or the camera lens load-carrying unit
13,23 can be implemented as driving element a 13B, 23B so that corresponding camera module 10,20 is implemented as a dynamic burnt camera shooting
Mould group., it will be appreciated that in the present invention, first camera module 10 of the array camera module and described second is taken the photograph
As the type of mould group 20 and combination can be any form, if Figure 10 is to as shown in figure 13.In this regard, not limited to by the present invention.
Further, in the preferred embodiment of the invention, optical lens (12 He of the first optical lens
Second optical lens 22) it can be integral type optical lens or split type optical lens.Particularly, when the optical lens
When (first optical lens 12 and second optical lens 22) is split type optical lens, the optical lens includes
At least two optical lens monomers form the optical lens (described the with the assembling by at least two optical lens monomers
One optical lens 12 and second optical lens 22)., it will be appreciated that first optical lens 12 and second light
The respective type of camera lens 22 and the combination of the two are learned, it can be according to specific first camera module 10 and described second
The imaging of camera module 20 and size requirements do corresponding adjustment, in this regard, not limited to by the present invention.
It is noted that optical lens (the first optical lens 12 and second optical lens 22) packet
An at least optical lens (120,220) is included, wherein an at least optical lens (120,220) installs preset optical system
It is successively arranged in the optical lens.Particularly, as shown in figure 14, in the preferred embodiment of the invention, it is located at described
One optical lens 220 at 22 top of the second optical lens is a glass lens 211., it will be appreciated that due to the glass lens
211 have relatively high refractive index, and compared to plastic lens, the glass lens 211 is stronger to the aggregate capabilities of light,
To other lenses vertical optical axis direction size can scaled-back, for guarantee lens curvature it is constant, it is accordingly, described
Lens optical axis direction size can also scaled-back so that the overall height dimension of second optical lens is reduced.
Further, as shown in figure 3, in the preferred embodiment, first camera module 10 further includes one
First filter element 14, such as infrared filtering element etc., wherein first filter element 14 be installed on the optical lens and
Between first sensitive chip 11, and it is held in the photosensitive path of first sensitive chip 11, by first filter
Optical element 14 makes 10 acquired image of the first camera module closer to human eye vision effect.Analogously, described
Second camera module 20 further includes one second filter element 24, such as infrared filtering element, wherein second filter element 24
It is installed between the optical lens and first sensitive chip 11, and is held in the photosensitive of first sensitive chip 11
Path, to make 20 acquired image of the second camera module closer to human eye by second filter element 24
Visual effect.
It is noted that in the present invention, the introduction about the construction of the array camera module is only for example, in order to this
Field technical staff can more fully understand the technical characteristic of the array camera module provided by the present invention, right
This, those skilled in the art answers acceptant.
As shown in figure 15, an array camera module of one second preferred embodiment is elucidated with according to the present invention, wherein described
The array camera module that second preferred embodiment is illustrated is a variant embodiment of above-mentioned first preferred embodiment.It is special
Not, in second preferred embodiment of the invention, the array camera module is implemented as periscopic array camera shooting
Mould group comprising one first camera module 10A and one second camera module 20A, wherein the knot of the first camera module 10A
Structure and mounting means are consistent with first camera module 10 of above-mentioned first preferred embodiment, second camera module
20A is implemented as " periscopic " camera module.Figuratively, so-called " periscopic " camera module indicates second camera shooting
Mould group is installed in a manner of " accumbency ", so that the overall height dimension of the second camera module 20A depends on it in length and width
Size on direction.
Analogously, in the preferred embodiment of the invention, the first camera module 10A includes one first photosensitive
Chip 11A and one first optical lens 12A, wherein the first camera module 10A is installed in a manner of longitudinally, so that institute
State the photosensitive path that the first optical lens 12A is longitudinally held in the first sensitive chip 11A.Correspondingly, described second
Camera module 20A includes one second sensitive chip 21A and one second optical lens 22A, wherein the second camera module 20A
Relatively described first camera module is laterally arranged, so that the second optical lens 22A is laterally held in described
The photosensitive path of two sensitive chip 21A.Particularly, in the preferred embodiment of the invention, the institute of first camera module
Stating the first sensitive chip 11A is a color sensitive chip 110A, the second sensitive chip 21A of second camera module
For a black and white sensitive chip 210A.Just as previously mentioned, compared to color sensitive chip 210P, the black and white sensitive chip 210A
Unit pixel 2130A size can be contracted by, so that the black and white is photosensitive in the case where meeting equal pixel quantitative requirement
The size of chip 210A is compared the color sensitive chip 210P of equal pixel quantity, can be contracted by.Due to being somebody's turn to do in of the invention
In preferred embodiment, the second camera module 20A is implemented as " periscopic " camera module, that is, the second camera shooting mould
Group 20A is installed in a manner of " accumbency ", so that the overall height dimension of the second camera module 20A depends on it in length
Size in wide direction.Therefore, in the preferred embodiment of the invention, when described the of the second camera module 20A
When two sensitive chip 20A replace with the black and white sensitive chip 210A by existing color sensitive chip, second camera shooting
The overall height dimension of mould group 20A can directly be reduced.
Further, as shown in figure 15, it is implemented as the second camera module 20A of " periscopic " camera module also
Including the one turn of light unit 221A and driving unit 222A for turning light unit described in adjusting, wherein described to turn light unit 211A
Corresponding to the second optical lens 22A, and laterally it is held in the photosensitive path of the second sensitive chip 21A.Especially
Ground, the light unit 221A that turns has the function of directed change optical propagation direction, as shown in figure 15, in the specific course of work
In, it is longitudinally radiated to the imaging ray for turning light unit 221A and turns to turn at light unit 221A described, then laterally
Ground passes through the second optical lens 22A, and imaging reaction occurs at most finally the second sensitive chip 21A.
It should be noted that in the preferred embodiment of the invention, second sense of the second camera module 20A
Optical chip 21A is implemented as a black and white sensitive chip 210A, depending on the imaging features of the black and white sensitive chip 210A, institute
The overall dimensions for stating the second sensitive chip 21A can be reduced.Further, the view corresponding to the second optical lens 22A
Rink corner FOV2 and imaging region, the second optical lens 22A more can neighboringly be installed on the second sensitive chip 21A
Front side.From visual effect, the entire length size of second camera module is reduced.In addition, when described the
When the size of two sensitive chip 21A is reduced, in order to match the areas imaging of second sensitive chip 21, described second
Optical lens 22A compares existing focal length optical lens, and overall dimensions (length and width dimensions) can be contracted by, so that second takes the photograph
As the entire length size and height of mould group can further be reduced.
, it will be appreciated that as the second optical lens 22A of the second camera module 20A and described second photosensitive
When the overall dimensions of chip 21A are all reduced, other accessories of second camera module, for example, described turn light unit
221A, the driving unit 222A and the driving element (not shown) all can correspondingly be reduced, so that described
The overall dimensions of second camera module are effectively reduced.
Analogously, when the second sensitive chip 21A of the second camera module 20A is implemented as a black and white sense
When optical chip 210A, the dark-state of the array camera module shoots ability, " optical zoom " times of the array camera module
The performance of rate and the whole pixel quantity of the second sensitive chip 21A etc. can all be optimised, about in this respect
Content is consistent with aforementioned principles, and so it will not be repeated.
Further, the array camera module further includes an image processing system, and wherein described image processing system is pressed
It is operated according to a preset image processing method, to realize preset image synthesis function, such as " optical zoom " or " back
Scape virtualization " etc..
Particularly, in the preferable implementation of the invention, as shown in figure 17, array camera module image processing side
Method comprising steps of
S1 obtains one first image information of a measured target by first camera module;
S2 obtains one second image information of a measured target by second camera module;With
S3 merges the first image information and second image information, to generate a third image information, wherein
The third image information is associated with the first image information and second image information.
It should be noted that in the present invention, first camera module 10 of the array camera module, the visual field of 10A
Angle FOV1 is greater than second camera module 20, the field angle FOV2 of 20A, that is, first camera module 10,10A is set
For a wide-angle imaging mould group, second camera module 20,20A is arranged to a focal length camera module.As shown in figure 16, In
In shooting process, the wide-angle imaging mould group (first camera module 10,10A) is found a view wider, but takes less than remote
Locate the details of object, the focal length camera module (second camera module 20,20A) is found a view narrow, but can take
Relatively farther object, so that the first image information acquired in 10A includes institute by first camera module 10
State the second camera module 20, the measured target picture material of second image information acquired in 20A.Further, by
This imaging features, the array camera module can be based on the first image information and second image information, realize class
It is similar to other special imaging effects such as " optical zoom ".
Particularly, in the present invention, first camera module 10, first sensitive chip 11 corresponding to 10A,
11A is a color sensitive chip 110,110A.Those skilled in the art will be appreciated that, the color sensitive chip 110,110A
Including a color filter layer 112,112A, so that final support to the color sensitive chip 110, a photosensitive layer 113 of 110A
Each pixel 1130 of the upper pixelated array of 113A, the light of 1130A are monochromatic light.In order to facilitate understanding and illustrate, described in setting
First sensitive chip 11,11A include the pixelated array of a M*N, that is, at this point, the first image information includes by M*N array
Each pixel 1130 of pixel, 1130A monochromatic optical information collected.During subsequent image processing, it need to pass through
Corresponding synthesis operation, restores the colour information of measured target script.
Particularly, the color sensitive chip 110 is being utilized, during 110A obtains the colour information of the measured target,
Due to first sensitive chip 11, each pixel 1130 of 11A, 1130A is collected for monochromatic optical information, such as R,
G, B monochrome optical information.Therefore, in order to restore the colour information of measured target, need to setting one group of adjacent X*X, (X is more than or equal to 2
Positive integer) quantity the color sensitive chip 110, the pixel 1130 of 110A, 1130A be an imaging unit, and by
The monochromatic optical information of pixel 1130 in the imaging unit, 1130A synthesizes and restores the colour information of measured target.Accordingly
Ground, by calculating it is found that if setting the color sensitive chip 110 of each group of adjacent X*X quantity, the pixel of 110A
1130,1130A be an imaging unit be condition, then can obtain the array imaging element of (M-X+1) * (N-X+1), wherein
Each imaging unit ' include the measured target colour information (RGB color information).Particularly, in the preferable reality of the invention
It applies in example, sets the color chips 110 of every 4 adjacent (2*2), the pixel 1130 of 110A, 1130A is that an imaging is single
Member ', and pass through the array imaging element of one (M-1) * (N-1) of synthesis operation acquisition '.For example, the signal of attached drawing 21 is a 4*4
The color sensitive chip 110,110A, respectively include pixel Pixel11, Pixel 12 ... to Pixel 44, according to above-mentioned
The algorithm that pixel forms imaging unit can get the array imaging element of a 3*3, respectively include imaging unit 11, imaging unit
12, imaging unit 13 ... to imaging unit 33.Correspondingly, wherein imaging unit 11 by the color sensitive chip 110,
Synthesized by the pixel Pixel 11 of 110A, Pixel 12, Pixel 21 and Pixel 22, imaging unit 12 by Pixel 12,
Pixel 13, Pixel 22 and Pixel 23 is obtained, and carries out analogizing by this method can get the array imaging element.
The colour information of the measured target is being obtained using the color sensitive chip 110,110A for ease of description
Composition algorithm feature sets each pixel 1130, and the colour information of 1130A white light collected is EEE, (in 16 systems
In, E represents 14, puts in order as RGB), and the colour information of feux rouges is E00, and the colour information of green light is OEO, the colour of blue light
Information is 00E.For example, as Figure 22 institute's frame select imaging unit 11 in include one group of pixel Pixel 11, Pixel 12,
Pixel 21 and Pixel 22, is respectively G11, R12, B21, G22, wherein working as G11, R12, B21, G22 are respectively received phase
When the monochromatic light answered, then the calculation of the colour information of the imaging unit 11 is G11, R12, B21, each R in G22,
G, the average value of B component, be formulated as the imaging unit colour information: E00+00E+ (0E0+0E0)/2=EEE is (sequentially
For R, G, B component).Particularly, when wherein a certain pixel 1130, when 1130A is not received by corresponding monochromatic optical information, example
Such as when G11 or G22 are not received by green information, then setting is accordingly not received by corresponding monochromatic pixel 1130,
The colour information of 1130A is black information, is expressed as 000, then, and the colour information of the imaging unit: E00+00E+ (000+
0EO)/2=E7E.And so on, obtain the RGB color information of other imaging units.
It is noted that in other embodiment of the present invention, the color sensitive chip 110, the coloured silk of 110A
Color filter layer 112,112A can be implemented as other modes, such as the form of RGBW etc.., it will be appreciated that when the colored filter
Mirror layer 112, when 112A is implemented as other forms, the composition algorithm of each imaging unit RGB color information can't be sent out therewith
Raw to change, only the RGB color value of information corresponding to specific each imaging unit can be due to the different color filters
Layer 112,112A and change.Accordingly, with respect to when the color sensitive chip 110, the color filter layer of 110A
112,112A when changing, each imaging unit ' specific colour information composition algorithm repeats no more.
However, the building mode of each imaging unit, i.e., the color sensitive chip corresponding to each imaging unit
The combination of 110,110A pixel 1130,1130A can change accordingly.For example, in another embodiment of the present invention
In, as shown in figure 23, the optional color chips 110 for setting every 9 adjacent (3*3), the pixel 1130 of 110A,
1130A is an imaging unit, and the array imaging element of (M-2) * (N-2) is obtained by corresponding operation, wherein Mei Yicheng
As unit includes the RGB colour information of the measured target.Correspondingly, the RGB color information of each imaging unit is the imaging list
Each pixel 1130 included by member, the average value of 1130A R collected, G, B chrominance component information, wherein not photosensitive
Pixel 1130,1130A is set as black information.For example, the color sensitive chip that the signal of attached drawing 23 is a 5*5
110,110A, pixel Pixel11, Pixel 12 ... to Pixel 55 are respectively included, imaging unit is formed according to above-mentioned pixel
Algorithm can get the array imaging element of a 3*3, respectively include imaging unit 11, imaging unit 12, imaging unit 21 and imaging
Unit 22.Corresponding, imaging unit 11 is by the color sensitive chip 110, the pixel Pixel 11 of 110A, Pixel 12,
Synthesized by Pixel 13, Pixel 21, Pixel 22, Pixel 23, Pixel 31, Pixel 32 and Pixel 33, imaging is single
Member 12 is by Pixel 12, Pixel 13, Pixel 14, Pixel 22, Pixel 23, Pixel 24, Pixel 32, Pixel
Synthesized by 33 and Pixel 34, carry out analogizing by this method can get the array imaging element.
In addition, be as shown in figure 24 another deformation implementation of the present invention, wherein in the deformation implementation, each imaging unit
The color sensitive chip 110 including one group of adjacent X*X (wherein X >=2) quantity, the pixel 1130,1130A of 110A, and
Each imaging unit ' included by pixel 1130, be not overlapped mutually between 1130A, so that finally obtaining (M/X) * (N/
X array imaging element), wherein each imaging unit includes the RGB color information of the measured target.For example, for example, attached drawing
The color sensitive chip 110,110A that 23 signals are a 4*4, respectively includes pixel Pixel11, Pixel 12 ... is extremely
Pixel 44 can get the array imaging element of a 2*2 according to the algorithm that above-mentioned pixel forms imaging unit, respectively include into
As unit 11, imaging unit 12, imaging unit 21 and imaging unit 22.Corresponding, imaging unit 11 is by the colored sense
Synthesized by optical chip 110, the pixel Pixel 11 of 110A, Pixel 12, Pixel 21 and Pixel 22, imaging unit 12 by
Synthesized by Pixel 13, Pixel 14, Pixel23 and Pixel 24, carry out analogizing by this method can get the array image-forming
Unit.
Those skilled in the art should be readily apparent that, in other embodiment of the present invention, the color sensitive chip
The combination of 110, the 110A imaging unit can make corresponding adjustment and variation according to practical application, and comparison is not
The present invention is limited to.
Correspondingly, as shown in figure 19, the step S3 is further comprised the steps of:
S31 solves the colour information of measured target from the first image information;
Further, as shown in figure 19, the step S31 is further comprised the steps of:
S311 sets the color sensitive chip of each group of adjacent X*X (X is the positive integer more than or equal to 2) quantity
110,110A pixel 1130,1130A are an imaging unit, to obtain the array image-forming list of (M-X+1) * (N-X+1)
Member, wherein M*N indicates first sensitive chip 11, the pixelated array of 11A;With
S312 solves the RGB color information of each imaging unit, wherein the RGB color information of each imaging unit is should
Imaging unit ' included by each pixel 1130,1130A R collected, G, the average value of B component information.
Alternatively, the step S31 is further comprised the steps of:
S311A sets the color sensitive chip of each group of adjacent X*X (X is the positive integer more than or equal to 2) quantity
110,110A pixel 1130,1130A are an imaging unit, and between pixel included by each imaging unit mutually not
It is overlapped, to obtain the array imaging element of (M/X) * (N/X), wherein M*N indicates first sensitive chip 11, the battle array of 11A
Column pixel;With
S312A solves the colour information of each imaging unit, wherein the colour information of each imaging unit is the imaging list
Each pixel 1130 that member includes, 1130A R collected, G, the average value of B component information.
, it will be appreciated that after executing the step S311 and S312 or step 311A and step S312A, described
One image information have measured target RGB color information, by (M-X+1) * (N-X+1) array imaging element or by
The RGB colour information of each imaging unit of the array imaging element of one (M/X) * (N/X) is formed.
Further, in the present invention, second camera module 20, second sensitive chip 21 corresponding to 20A
21A is 210 210A of a black and white sensitive chip.Those skilled in the art will be appreciated that, briefly, compared to color sensitive core
Piece, 210 210A of black and white sensitive chip are not provided with the color filter layer 112,112A, thus the photosensitive core of the black and white
Piece 210,210A only have the function of acquisition measured target luminance information (grayscale information).It is described black based on this imaging speciality
White sensitive chip 210,210A can be under the premise of guaranteeing imaging, unit pixel 2130, the relatively colored sense of 2130A size
The unit pixel size of optical chip can be contracted by, to meet the size requirements of the array camera module.
Analogously, the technical characteristic with the subsequent process steps for illustrating the step S3 for ease of description, sets institute
Stating 210 210A of black and white sensitive chip has a Q*P pixelated array, wherein Q >=M, P >=N.That is, being somebody's turn to do in of the invention
In preferred embodiment, the sum of all pixels of 210 210A of black and white sensitive chip is not less than the color sensitive chip 110,
The sum of all pixels of 110A.Correspondingly, second image information includes each pixel 2130 by Q*P pixelated array,
2130A grayscale information collected (luminance information).
As previously mentioned, the field angle FOV1 of first camera module is greater than institute in the preferred embodiment of the invention
The field angle FOV2 of the second camera module is stated, therefore, for the angle of image content, the first image information includes institute
State the image content of the second image information.Therefore, in the step of continuing image co-registration after execution, it need to identify and extract described the
The region being overlapped in one image information and second image information, to carry out image co-registration.
Correspondingly, in the preferred embodiment of the invention, as shown in figure 18, the step S3 is further comprised the steps of:
S32 identify and extract in the first image information with the equitant region of the second image information, wherein institute
State the first image information include the array imaging element by (M-X+1) * (N-X+1) or the array by (M/X) * (N/X) at
The RGB color information as possessed by each imaging unit of unit and second image information include by Q*P pixelated array
Each pixel 2130,2130A grayscale information collected (luminance information).
Those skilled in the art will be appreciated that, is overlapped orientation using calibration, fixes Interpolation Proportions, or with characteristic point
The mode of comparison identify and extract in the first image information with the equitant region of the second image information.Certainly, In
In the present invention, for identification and the calculation in the first image information with the equitant region of the second image information is extracted
Method can be implemented as any other suitable algorithm, in this regard, not limited to by the present invention.
For the ease of subsequent descriptions and understanding, set mutually be overlapped with second image information in the first image information
The ratio of the first image information shared by the area in folded region be α, then in the first image information with second figure
As the equitant region of information may be expressed as: the array imaging element or α * (M/X) * (N/X) of α * (M-X+1) * (N-X+1)
RGB color information possessed by each imaging unit of array imaging element.
Due in the first image information with the colour information in the equitant region of the second image information be RGB
Colour information.Those skilled in the art will be appreciated that the colour information of rgb format is demonstrated by the bright of measured target with mixing
Spend information, chrominance information and saturation infromation etc..Therefore, in order to making in the first image information with described second
The colour information in the equitant region of image information can be blended in second image information, need first by the first image
The colored letter of yuv format is converted into information with the colour information of the rgb format in the equitant region of the second image information
Breath, wherein Y represents luminance information, and UV represents chrominance information.
More specifically, in the present invention, the luminance information of each imaging unit can be set as Y, each imaging unit
Chrominance information is UV, then the formula converted may be expressed as:
Y=aR+bG+cB+d;…………………(1)
U=eR+fG+gB+h;…………………(2)
V=iR+jG+kB+l;………………….(3)
Wherein, the conversion formula meet (2) three groups of parameters of condition (1) a+b+c=1 and condition be formed by vector (a,
B, c), (e, f, g), mutually linear uncorrelated between (i, j, k).
Based on above-mentioned condition (1) and condition (2), it is preferable that conversion formula can be obtained:
Y=0.299*R+0.587*G+0.114*B;…………………(4)
U=-0.169*R-0.331*G+0.5*B+128;…………………(5)
V=0.5*R-0.419*G-0.081*B+128;…………………(6)
Correspondingly, according to above-mentioned formula it is found that equitant with second image information in the first image information
The chrominance information of each imaging unit in region can be converted into UVij=(Uij, Vij)=(- 0.169*Rij-0.331*Gij+
0.5*Bij+128,0.5*Rij-0.419*Gij-0.081*Bij+128), wherein UVij represents the i-th j in array imaging element
The chrominance information of a imaging unit, Uij represent the U chrominance information of i-th j imaging unit in array imaging element, and Vij is represented
The V chrominance information of i-th j imaging unit, analogizes by this method in array imaging element, by the first image information with
The RGB color information of each imaging unit in the equitant region of second image information is converted into the colored letter of yuv format
Breath.
It should be noted that at this point, can table with the equitant region of the second image information in the first image information
It is shown as: each imaging of the array imaging element of the array imaging element or α * (M/X) * (N/X) of α * (M-X+1) * (N-X+1)
YUV colour information possessed by unit.
Correspondingly, in the present invention, as shown in figure 18, the step S3, further comprises the steps of:
S33 will be merged in the first image information with the colour information in the equitant region of the second image information
In second image, to obtain one first blending image.
Correspondingly, as shown in figure 20, the step S33, further comprises the steps of:
S331 by the first image information with each imaging list in the equitant region of the second image information
Member RGB color information, be converted into the colour information of yuv format so that in the first image information with second figure
As the image information in the equitant region of information converts are as follows: the array imaging element or α * (M/X) * of α * (M-X+1) * (N-X+1)
(N/X) YUV colour information possessed by each imaging unit of array imaging element.
Further, in the preferred embodiment of the invention, second camera module 20, second sense of 20A
21 21A of optical chip is implemented as a black and white sensitive chip, and second image information includes each picture by Q*P pixelated array
Vegetarian refreshments 2130,2130A grayscale information collected (luminance information).It should be noted that second image information is included
The pixel quantity of pixelated array Q*P is more than in the first image information and the equitant region of the second image information
The quantity of imaging unit: the array imaging element of α * (M-X+1) * (N-X+1) or the array imaging element of α * (M/X) * (N/X).
Therefore, the colour information in the first image information with the equitant region of the second image information is being blended in institute
During stating the second image, interpolation arithmetic according to a certain percentage need to be carried out.In order to make it easy to understand, in the present invention, if
The fixed Interpolation Proportions are β, wherein β=(Q*P)/[α * (M-X+1) * (N-X+1)] or β=(Q*P)/[α * (M/X) * (N/
X)]。
Correspondingly, the step S33, further comprises the steps of:
S332 by the first image information with each imaging list in the equitant region of the second image information
Respectively with each pixel 2130 in second image information, the luminance information Y of 2130A inserts the UV chrominance information of member according to one
It is worth ratio beta and carries out interpolation.
It is worth one to obtain, when β is by when being calculated as integer value, then it represents that included by second image information
Pixelated array Q*P and the array imaging element in the first image information with the equitant region of the second image information
α * (M-X+1) * (N-X+1)] or α * (M/X) * (N/X) between exactly match, the two there is no overlapping part.Figuratively,
When β is measured as integer value by calculating, in the first image information with the equitant region of the second image information
Array imaging element α * (M-X+1) * (N-X+1)] or α * (M/X) * (N/X) unit imaging unit ' density, be described the
The unit pixel 2130 of included pixelated array Q*P, the integral multiple of 2130A density in two image informations.In addition, when β is passed through
Calculating is crossed when being measured as non integer value, indicates pixelated array Q*P and first figure included in second image information
As array imaging element α * (M-X+1) * (N-X+1) in information with the equitant region of the second image information] or α *
(M/X) there is the region of overlapping between * (N/X).Preferably, the pixelated array of the lap in second image information
(array in the first image information with the equitant region of the second image information is compared according to each pixel accounting
The unit imaging unit of imaging unit) take the mode of weighted average and second image information to carry out interpolation.
In order to make it easy to understand, set by image acquired in step S332 as one first blending image, wherein described the
One blending image includes each pixel 2130 of the pixelated array of a Q*P, and 2130A includes respectively by the first image information
Each imaging unit ' provided by UV chrominance information and the Y brightness as provided by each pixel of the second image information letter
Breath.Further, it may be selected to convert first blending image with YUG format color information to described in rgb format
First blending image.
Correspondingly, according to aforementioned formula
Y=0.299*R+0.587*G+0.114*B;…………………(4)
U=-0.169*R-0.331*G+0.5*B+128;... ... ... ... (5) and
V=0.5*R-0.419*G-0.081*B+128;…………………(6)
Inverse operation can obtain:
R=Y+1.4075* (V-128);
G=Y-0.3455* (U-128) -0.7169* (V-128);With
B=Y+1.779* (U-128);
Correspondingly, described first with YUG format color information can be merged by YUV-RGB conversion formula
Image is converted into the first blending image information of rgb format.
Further, in some embodiments of the invention, as shown in figure 18, the step S3, further comprises the steps of:
S34 by first blending image with rgb format colour information be blended in the first image information with
The overlapping region of second image information, to obtain one second blending image, wherein second blending image is described the
Three image informations.
Particularly, as shown in figure 25, the third image information (second blending image) has merged second figure
As the luminance information (grayscale information) in information, so that the weight with second image information of the first image information
Folded region has relatively high details expressive ability, and maintains originally in other regions of the first image information
Characteristics of image, in this way, from the point of view of image imaging effect, that is, realize be similar to " optical zoom " and " background
The imaging function of virtualization ".
It is noted that actually utilizing first camera module 10,10A and second camera module 20,
When 20A acquires the first image information and second image information of measured target, it is limited to the array camera module
With the shooting distance of the measured target, i.e. object distance, the image content of second image information may not fully fall into described
In first image information.Particularly, as shown in figure 26, (micro- when being closer from the array camera module when measured target
Distance shooting), due to first camera module 10,10A and second camera module 20, exist between 20A it is certain between
Away from leading to second image information and not fully include by the first image information, that is to say, that described in part
Second image information is not in the first image information.
In such cases, above-mentioned steps S32, step S33 and step S34 need to do corresponding adjustment, to adapt to described
The variation of overlapped region between one image information and second image information.For the ease of subsequent descriptions and understanding, setting
The ratio of the first image information is accounted in the first image information with the area of the second image information overlapped region
For α ', then α ' * (M-X+1) * is represented by with the equitant region of the second image information in the first image information
(N-X+1) RGB possessed by each imaging unit of the array imaging element of array imaging element or α ' * (M/X) * (N/X)
Colour information.Correspondingly, it sets in second image information and accounts for institute with the area of the first image information overlapped region
State the second image information ratio be γ, then in second image information with the equitant area of the second image information described in this
Domain is represented by each pixel 1130 of γ * (Q*P) pixelated array, 1130A grayscale information collected (luminance information).
Further, by battle array that second image information and the first image information overlapped region are included
The quantity of the imaging unit of the quantity γ * (Q*P) and the first image and the second image overlapped region of column pixel
It is differed between α ' * (M-X+1) * (N-X+1) or α ' * (M/X) * (N/X), usual second image information and first figure
The quantity γ * (Q*P) for the pixelated array for being included as information overlapped region is more than the first image and second image
The amount alpha of the imaging unit of overlapped region ' * (M-X+1) * (N-X+1) or α ' * (M/X) * (N/X).Therefore, by described
Second image is blended in the equitant region of the second image information in one image information to overlap with the first image
Region during, interpolation arithmetic need to be carried out according to a certain percentage, wherein in order to facilitate understanding and explanation, set the interpolation
Ratio is β, wherein β=γ (Q*P)/[α ' * (M-X+1) * (N-X+1)] or β=γ (Q*P)/[α ' * (M/X) * (N/X)].
That is, in such cases, the face of the overlapping region of the first image information and second image information
Product can change, so as to cause inserting for merging between the first image information and the overlapping region of the second image information
Value ratio can also make corresponding adjustment.
Correspondingly, in such cases, as shown in figure 27, the step S32 is adjusted to:
S32 ' identify and extract in the first image information with the equitant region of second image information and described
In second image information with the equitant region of the first image information.
Correspondingly, the step S3 is adjusted to:
S33 ' will be merged in the first image information with the colour information in the equitant region of the second image information
In second image and the equitant region of the first image information.
Further, as shown in figure 28, the step S33 ' is further comprised the steps of:
S331 ' by the first image information with each imaging in the equitant region of the second image information
The RGB color information of unit, is converted into the colour information of yuv format, so that with described second in the first image information
The image information in the equitant region of image information converts are as follows: the array imaging element or α ' * of α ' * (M-X+1) * (N-X+1)
(M/X) YUV colour information possessed by each imaging unit of the array imaging element of * (N/X);With
S332 ' by the first image information with each imaging in the equitant region of the second image information
The UV chrominance information of unit respectively with each picture in second image information with the equitant region of the first image information
The luminance information Y of vegetarian refreshments 2130,2130A carries out interpolation according to an Interpolation Proportions β.
More specifically, in step S332 ', when β is measured as integer value by calculating, second image is indicated
Pixelated array γ (Q*P) included by information and the equitant region of the first image information and the first image information
In array imaging element α ' * (M-X+1) * (N-X+1) with the equitant region of the second image information] or α ' * (M/X) *
(N/X) it is exactly matched between, there is no the parts of overlapping for the two.Figuratively, when β is measured as integer value by calculating, institute
State array imaging element α * (M-X+1) * (N-X+ in the first image information with the equitant region of the second image information
It 1)] or the density of the unit imaging unit of α * (M/X) * (N/X), is second image information and the first image information
The integral multiple of the unit pixel density of pixelated array γ (Q*P) included by equitant region.In addition, when β is surveyed by calculating
When must be non integer value, battle array included by second image information and the equitant region of the first image information be indicated
Column pixel γ (Q*P) and the array image-forming list in the first image information with the equitant region of the second image information
First α ' * (M-X+1) * (N-X+1)] or α ' * (M/X) * (N/X) between exist overlapping region.Preferably, second image
The pixelated array for the lap that information and the equitant region of the first image information are included is according to each pixel accounting
(compare in the first image information with the unit of the array imaging element in the equitant region of the second image information at
As unit) take weighted average.
Correspondingly, the step 34 is adjusted to:
First blending image with rgb format colour information is blended in the first image information by S34 '
Overlapping region position with second image information is to obtain one second blending image, wherein second blending image is
The third image information.
It should be noted that as shown in figure 29, the brightness in the third image information fusion second image information
Information, so that the first image information has relatively high details with the overlapping region of second image information
Expressive ability, to realize the visual effect for being similar to " optical zoom " and " background blurring ".
It is noted that as described before it is found that in the present invention, described image processing method may be selected described in output
First blending image or second blending image (the third image information), that is, described image processing method may be selected defeated
Out the blending image information of the overlapped region between the first image information and second image information or output described in
First blending image information is blended in the first image information and the overlapping region position of second image information is formed
The second blending image information (the third image information).In this regard, not limited to by the present invention.
As shown in figure 30, the present invention also provides an electronic equipment 80, the electronic equipment 80 includes an electronic equipment ontology
81 and an array camera module 82.The array camera module 82 is assembled in the electronic equipment ontology 81, sets for the electronics
Standby 80 provide image collecting function., it will be appreciated that the array camera module 82 provided by the present invention takes the photograph zoom with double
Function improves the visual experience of user so that the electronic equipment 82 has special imaging performance.
Particularly, in 80 specific embodiment of electronic equipment provided by the present invention, the array images mould
Group 82 can be assembled in the front side of the electronic equipment ontology 81, that is to say, that the array camera module 82 is that the electronics is set
Standby 80 preposition camera module, as shown in figure 30.Alternatively, the array camera module 82 can be assembled in the electronic equipment sheet
The rear side of body 81, that is to say, that the array camera module 82 is the postposition camera module of the electronic equipment 80, such as Figure 31
It is shown.Certainly, in other embodiments of the present invention, the array camera module 82 be can be assembled in the electronic equipment
The other positions of ontology 81, in this regard, not limited to by the present invention.
It can thus be seen that the object of the invention can be efficiently accomplished sufficiently.It is used to explain the present invention function and structure principle
The embodiment absolutely proved and described, and the present invention is not by based on the change on these embodiment basis
Limitation.Therefore, the present invention includes all modifications covered within appended claims claimed range and spirit.
Claims (24)
1. an array camera module characterized by comprising
One first camera module;
One second camera module;With
One circuit board, wherein first camera module and second camera module are electrically connected in the circuit board,
Described in the first camera module include one first sensitive chip and correspond to one first optical lens of the first sensitive chip,
Described in the first camera module include one first sensitive chip and correspond to one first optical lens of the first sensitive chip,
Described in the first optical lens equivalent focal length f1 be less than second optical lens equivalent focal length f2, first optical frames
The field angle FOV1 of head is greater than the field angle FOV2 of second optical lens, wherein first sensitive chip is a colored sense
Optical chip and second sensitive chip are a black and white sensitive chip.
2. array camera module as described in claim 1, wherein the unit pixel point area of the black and white sensitive chip can quilt
Unit pixel point area less than the color sensitive chip is set, thus under equal pixel quantitative requirement, second sense
The size of optical chip is opposite to be reduced, so that second optical lens relatively more can neighboringly be installed on described second
The top side of sensitive chip.
3. array camera module as claimed in claim 2, wherein the unit pixel size of the black and white sensitive chip is set
Less than 1.0um*1.0um.
4. array camera module as claimed in claim 3, wherein corresponding second optical frames of the black and white sensitive chip
The equivalent focal length f2 of head is more than twice of the equivalent focal length f1 of corresponding first optical lens of the color sensitive chip.
5. the array camera module as described in Claims 1-4 is any, wherein the circuit board includes a first circuit board and one
Second circuit board, wherein first camera module can conductively be installed on the first circuit board, second camera module
The second circuit board can be conductively installed on.
6. array camera module as claimed in claim 5, wherein the array camera module further includes a bracket, wherein institute
The peripheral part that bracket is fixed on first camera module and second camera module is stated, for positioning first camera module
With second camera module.
7. the array camera module as described in Claims 1-4 is any, wherein first camera module further includes one first
Pedestal, first pedestal is installed on the circuit board, and forms one first light hole, and first light hole corresponds to described
First sensitive chip, wherein first optical lens is installed on the top side of first pedestal and to be held in described first photosensitive
The photosensitive path of chip;Second camera module further includes one second pedestal, and second pedestal is installed on the circuit board,
And one second light hole is formed, second light hole corresponds to second sensitive chip, wherein second optical lens
It is installed on the top side of second pedestal and is held in the photosensitive path of second sensitive chip.
8. array camera module as claimed in claim 7, wherein first pedestal integrally extends second pedestal.
9. the array camera module as described in Claims 1-4 is any, wherein second optical lens includes an at least light
Lens are learned, wherein the optical lens for being located at the second optical lens most top side is a glass lens.
10. the array camera module as described in Claims 1-4 is any, wherein first camera module further includes one first
Filter element, wherein first filter element is installed between first optical lens and first sensitive chip, and
It is held in the photosensitive path of first sensitive chip.
11. array camera module as claimed in claim 10, wherein second camera module further includes one second optical filtering member
Part wherein second filter element is installed between second optical lens and second sensitive chip, and is held in
The photosensitive path of second sensitive chip.
12. an array camera module characterized by comprising
One first camera module;
One second camera module;With
One circuit board, wherein first camera module and second camera module are electrically connected in the circuit board,
Described in the first camera module include one first sensitive chip and correspond to one first optical lens of the first sensitive chip,
Described in the first camera module include one first sensitive chip and correspond to one first optical lens of the first sensitive chip,
Described in the first optical lens focal length f1 be less than second optical lens focal length f2, the visual field of first optical lens
Angle FOV1 be greater than second optical lens field angle FOV2, wherein first sensitive chip be a color sensitive chip and
Second sensitive chip is a black and white sensitive chip, wherein the unit pixel point area of the black and white sensitive chip is less than colour
The unit pixel point area of sensitive chip, so that the size of second sensitive chip is opposite under equal pixel quantitative requirement
It is reduced, so that second optical lens relatively more can neighboringly be installed on the top side of second sensitive chip.
13. an electronic equipment, which is characterized in that including
One electronic equipment ontology;With
Binocular camera shooting mould group as described in claim 1 to 12 is any, wherein the binocular camera shooting module group assembling is in the electronics
Apparatus body.
14. electronic equipment as claimed in claim 13, wherein the binocular camera shooting module group assembling is in the electronic equipment ontology
One front side, to be configured as the preposition camera module of the electronic equipment.
15. electronic equipment as claimed in claim 13, wherein the binocular camera shooting module group assembling is in the electronic equipment ontology
One rear side, to be configured as the postposition camera module of the electronic equipment.
16. an image processing method, for handling by an array camera module one first image information collected and one second
Image information, which is characterized in that comprising steps of
S1 obtains one first image information of a measured target, wherein first camera module by one first camera module
Including one first sensitive chip, first sensitive chip is a color sensitive chip;
S2 obtains one second image information of a measured target, wherein second camera module by one second camera module
Including one second sensitive chip, second sensitive chip is a black and white sensitive chip;With
S3 merges the first image information and second image information, to generate a third image information, wherein described the
Three image informations are associated with the first image information and second image information.
17. image processing method as claimed in claim 16, wherein the step S3 is further comprised the steps of:
S31 solves the colour information of measured target from the first image information;
S32 identify and extract in the first image information with the equitant region of the second image information, wherein described
One image information includes the array imaging element by (M-X+1) * (N-X+1) or the array image-forming list by (M/X) * (N/X)
The colour information and second image information of each imaging unit of member include by the ash of each pixel of Q*P pixelated array
Spend information;With
S33 will be blended in described with the colour information in the equitant region of the second image information in the first image information
Second image, to obtain one first blending image, wherein first blending image is the third image information.
18. image processing method as claimed in claim 16, wherein the step S3 is further comprised the steps of:
S31 solves the colour information of measured target from the first image information;
S32 identify and extract in the first image information with the equitant region of the second image information, wherein described
One image information includes the array imaging element by (M-X+1) * (N-X+1) or the array image-forming list by (M/X) * (N/X)
The colour information and second image information of each imaging unit of member include by the ash of each pixel of Q*P pixelated array
Spend information;
S33 will be blended in described with the colour information in the equitant region of the second image information in the first image information
Second image, to obtain one first blending image;With
S34 first blending image with rgb format colour information is blended in the first image information with it is described
The overlapping region of second image information, to obtain one second blending image, wherein second blending image is the third figure
As information.
19. image processing method as claimed in claim 16, wherein the step S3 is further comprised the steps of:
S31 solves the colour information of measured target from the first image information;
S32 ' identify and extract in the first image information with the equitant region of second image information and described second
In image information with the equitant region of the first image information;With
Colour information in the first image information with the equitant region of the second image information is blended in institute by S33 '
The second image and the equitant region of the first image information are stated, to obtain one first blending image, wherein described first melts
Conjunction image is the third image information.
20. image processing method as claimed in claim 16, wherein the step S3 is further comprised the steps of:
S31 solves the colour information of measured target from the first image information;
S32 ' identify and extract in the first image information with the equitant region of second image information and described second
In image information with the equitant region of the first image information;With
Colour information in the first image information with the equitant region of the second image information is blended in institute by S33 '
The second image and the equitant region of the first image information are stated, to obtain one first blending image;With
First blending image is blended in the overlay region with second image information of the first image information by S34 '
Domain is to obtain one second blending image, wherein second blending image is the third image information.
21. claim 17 to claim 20 it is any as described in image processing method, wherein the step S31 further includes
Step:
S311 sets the pixel of the color sensitive chip of each group of adjacent X*X (X is the positive integer more than or equal to 2) quantity
For an imaging unit, to obtain the array imaging element of (M-X+1) * (N-X+1), wherein M*N indicates the first photosensitive core
The pixelated array of piece;With
S312 solves the RGB color information of each imaging unit, wherein the RGB color information of each imaging unit is the imaging
Unit ' included by each pixel R collected, G, the average value of B component information.
22. claim 17 to claim 20 it is any as described in image processing method, wherein the step S31 further includes
Step:
S311A sets the pixel of the color sensitive chip of each group of adjacent X*X (X is the positive integer more than or equal to 2) quantity
Point is an imaging unit, and is not overlapped mutually between pixel included by each imaging unit, to obtain (M/X) *'s (N/X)
Array imaging element, wherein M*N indicates the pixelated array of first sensitive chip;With
S312A solves the colour information of each imaging unit, wherein the colour information of each imaging unit is the imaging unit institute
Including each pixel R collected, G, the average value of B component information.
23. the image processing method as described in claim 17 or 18, wherein the step S33 is further comprised the steps of:
S331 by the first image information with each imaging unit in the equitant region of the second image information
RGB color information is converted into the colour information of yuv format, so that believing in the first image information with second image
Cease the image information conversion in equitant region are as follows: the array imaging element or α * (M/X) * (N/X) of α * (M-X+1) * (N-X+1)
Array imaging element each imaging unit possessed by YUV colour information, wherein α indicate the first image information in
The ratio of the first image information is accounted for the second image information overlapped region;With
S332 by the first image information with each imaging unit in the equitant region of the second image information
UV chrominance information carries out interpolation according to an Interpolation Proportions β with the luminance information Y of each pixel in second image information respectively,
Wherein, β=(Q*P)/[α * (M-X+1) * (N-X+1)] or β=(Q*P)/[α * (M/X) * (N/X)], wherein Q*P indicates institute
State the pixelated array of the second sensitive chip.
24. the image processing method as described in claim 19 or claim 20, wherein the step S33 ' further includes step
It is rapid:
S331 ' by the first image information with each imaging unit in the equitant region of the second image information
RGB color information is converted into the colour information of yuv format, so that believing in the first image information with second image
Cease the image information conversion in equitant region are as follows: the array imaging element or α ' * (M/X) * (N/ of α ' * (M-X+1) * (N-X+1)
X YUV colour information possessed by each imaging unit of array imaging element), wherein α indicates the first image information
In the ratio of the first image information is accounted for the second image information overlapped region;With
S332 ' by the first image information with each imaging unit in the equitant region of the second image information
UV chrominance information respectively in second image information with each pixel in the equitant region of the first image information
Luminance information Y carries out interpolation according to an Interpolation Proportions β, wherein and β=γ (Q*P)/[α ' * (M-X+1) * (N-X+1)] or β=
γ (Q*P)/[α ' * (M/X) * (N/X)], wherein γ indicates mutually be overlapped with the first image information in second image information
Folded region accounts for the ratio of second image information, and Q*P indicates the pixelated array of second sensitive chip.
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