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CN110416729B - Isolation degree adjusting method, circuit board and television - Google Patents

Isolation degree adjusting method, circuit board and television Download PDF

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Publication number
CN110416729B
CN110416729B CN201910721765.7A CN201910721765A CN110416729B CN 110416729 B CN110416729 B CN 110416729B CN 201910721765 A CN201910721765 A CN 201910721765A CN 110416729 B CN110416729 B CN 110416729B
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conductive medium
wireless modules
isolation
adjacent
module
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CN110416729A (en
Inventor
刘晓颖
王安恺
王克强
程文强
程丽华
黄瑞雪
孙静
王洪明
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Qingdao Zhidong Seiko Electronic Co ltd
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Qingdao Zhidong Seiko Electronic Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N21/00Selective content distribution, e.g. interactive television or video on demand [VOD]
    • H04N21/40Client devices specifically adapted for the reception of or interaction with content, e.g. set-top-box [STB]; Operations thereof
    • H04N21/41Structure of client; Structure of client peripherals
    • H04N21/426Internal components of the client ; Characteristics thereof

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  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)

Abstract

The embodiment of the application provides an isolation adjusting method, which is applied to at least two wireless modules, wherein the wireless modules are arranged at intervals, a conductive medium is arranged in an interval area between the adjacent wireless modules, the conductive medium is separated from the wireless modules and is communicated with the grounding end of the wireless modules, and the isolation between the two wireless modules adjacent to the conductive medium is adjusted by adjusting the impedance of the arranged conductive medium and/or the mutual impedance of the conductive medium and the adjacent wireless modules. The adjustment of the isolation between the wireless modules is realized.

Description

Isolation degree adjusting method, circuit board and television
Technical Field
The application relates to the technical field of communication, in particular to an isolation adjusting method, a circuit board and a television.
Background
With the development of the internet of things technology, the WIFI module and the Bluetooth module are applied to the television to realize wireless transmission of the television. Based on the WIFI module in the television, the television can be accessed to the Internet to acquire audio and video resources in the Internet. Based on the bluetooth module in the television, the television can be interconnected with the bluetooth device, for example, connected with a bluetooth speaker, for playing audio.
However, when the television is simultaneously connected to the Internet and the Bluetooth speaker, it is found that frizzy sounds or katton occurs in the audio being played by the Bluetooth speaker.
The reason for this is that the working frequency bands of the WIFI module and the bluetooth module are both located at the 2.4GHz frequency band, and signal interference exists between the WIFI module and the bluetooth module, so that the throughput of the WIFI module and the bluetooth module is affected, wherein the throughput is the data volume successfully transmitted in unit time.
And the throughput of the WIFI module and the Bluetooth module is influenced by the isolation, so that the throughput of the WIFI module and the Bluetooth module can be improved by adjusting the isolation to reduce the influence of signal interference. However, for the television, when the WIFI module and the bluetooth module are determined, the isolation cannot be changed by changing the WIFI module or the bluetooth module.
Therefore, how to adjust the isolation between the wireless modules based on the determination of the wireless modules is an urgent technical problem to be solved in the prior art.
Disclosure of Invention
The embodiment of the application provides an isolation adjusting method, a circuit board and a television, and further adjustment of isolation between wireless modules is achieved.
Other features and advantages of the present application will be apparent from the following detailed description, or may be learned by practice of the application.
According to an aspect of the embodiments of the present application, there is provided an isolation adjusting method applied to at least two wireless modules, the wireless modules being installed at a distance from each other, a conductive medium being disposed in a spacing area between adjacent wireless modules in the at least two wireless modules, the conductive medium being spaced apart from the wireless modules and communicating with a ground terminal of the wireless modules, the isolation between two wireless modules adjacent to the conductive medium being adjusted by adjusting an impedance of the disposed conductive medium and/or a mutual impedance of the conductive medium and the adjacent wireless modules.
According to an aspect of the embodiments of the present application, there is provided a circuit board, on which at least two wireless modules are mounted at intervals, on which a conductive medium is disposed in a spacing area between two adjacent wireless modules of the at least two wireless modules, the conductive medium being spaced apart from the wireless modules and communicating with a ground terminal of the wireless modules, and the isolation between the two wireless modules adjacent to the conductive medium is adjusted by the method as described above.
According to an aspect of the embodiments of the present application, there is provided a television set including the circuit board as described above.
In the technical solutions provided in some embodiments of the present application, by disposing the conductive medium spaced apart from the wireless module in the spacing area between the two wireless modules and communicating the conductive medium with the ground terminal of the wireless module, the disposed conductive medium becomes a blocking channel for electromagnetic coupling with the ground plane, thereby changing the isolation between the two wireless modules. On the basis, the isolation between the two adjacent wireless modules can be changed by changing the conductive medium, and specifically, the isolation is adjusted by adjusting the impedance of the conductive medium and/or the mutual impedance between the conductive medium and the adjacent wireless modules.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
fig. 1 is a schematic diagram illustrating the routing of conductive media between two WIFI modules in accordance with a particular embodiment;
FIG. 2 is a schematic illustration of a shape of a conductive medium according to another particular embodiment;
FIG. 3 is a diagram illustrating a simulated shape of a conductive medium according to one particular embodiment;
FIG. 4 is a schematic illustration of the shape of a conductive medium as determined by simulation;
fig. 5 is a schematic diagram of an isolation circuit constructed by adding a microstrip line between two wireless modules in the prior art;
fig. 6 is a test data diagram of isolation between the bluetooth module and the WIFI module I when no conductive medium is disposed between the bluetooth module and the WIFI module I;
fig. 7 is a test data diagram of the isolation between the bluetooth module and the WIFI module I after the conductive medium is arranged between the bluetooth module and the WIFI module I and the isolation is adjusted according to the reduction of the isolation as a target;
fig. 8 is a test data diagram of the isolation between the bluetooth module and the WIFI module II when no conductive medium is disposed between the bluetooth module and the WIFI module II;
fig. 9 is a test data diagram of the isolation between the bluetooth module and the WIFI module II after the conductive medium is arranged between the bluetooth module and the WIFI module II and the isolation is adjusted to the target of reducing the isolation.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the subject matter of the present application can be practiced without one or more of the specific details, or with other methods, components, devices, steps, and so forth. In other instances, well-known methods, devices, implementations, or operations have not been shown or described in detail to avoid obscuring aspects of the application.
The technical scheme of the disclosure is provided for realizing the adjustment of the isolation between the two wireless modules.
In an embodiment of the present disclosure, a method for adjusting isolation is provided, where the method is applied to at least two wireless modules, each wireless module is installed at an interval, a conductive medium is arranged in an interval area between adjacent wireless modules, the conductive medium is separated from the wireless modules and is communicated with a ground terminal of the wireless module, and the isolation between two wireless modules adjacent to the conductive medium is adjusted by adjusting impedance of the arranged conductive medium and/or mutual impedance of the conductive medium and the adjacent wireless modules.
For a wireless module, the wireless transmission is realized based on the antenna of the wireless module, and thus, the isolation between two wireless modules essentially refers to the isolation between the antennas of the two wireless modules.
Therefore, the isolation between the two wireless modules is the isolation between the antennas of the two wireless modules. The antenna isolation refers to a ratio of power transmitted by the transmitting antenna to power received by the receiving antenna. The smaller the value of the isolation degree is, the smaller the interference of the receiving antenna by the transmitting antenna is, and the better the isolation effect between the two antennas is.
Wherein wireless module can be WIFI module or bluetooth module, that is to say that this disclosure can be applied to and adjust the isolation between two WIFI modules, between WIFI module and the bluetooth module, and between two bluetooth modules.
The conductive medium is arranged between two adjacent wireless modules and is separated from the wireless modules, namely a blocking channel is additionally arranged on the electromagnetic surface where the two wireless modules are located, and the conductive medium is communicated with the grounding end of the wireless modules, so that the conductive medium is electromagnetically coupled with the ground plane, and the blocking channel is excited to realize the isolation between the two wireless modules.
After the conductive medium is arranged between the two wireless modules according to the technical scheme of the disclosure, the conductive medium and any adjacent wireless module can be regarded as a dual-port network. The current, voltage relationship between the ports is expressed in terms of impedance as:
Figure BDA0002157462920000041
based on the layout position relationship between the two WIFI modules (WIFI module I, WIFI module II) and the conductive medium shown in fig. 1, the isolation between the WIFI module I and the conductive medium is calculated by taking the WIFI module I as an example of transmission and the conductive medium as an example of reception.
Then in equation 1, V1When the conductive medium is used for receiving the feed voltage of the WIFI module I, the load impedance Z is generated22Generating a voltage V on the conductive medium2,Z11Is the impedance of the antenna of the WIFI module I. Z12And Z21Is the mutual impedance of the WIFI module I and the conductive medium, when the medium is the same in nature, the electromagnetic field between the WIFI module I and the conductive medium is reciprocal, and has Z12And Z21Are equal.
According to formula 1, when I2When equal to 0, V1Maximum, at this time V2And (4) opening the circuit. Thus, according to equation 1, when I2When the value is 0:
Figure BDA0002157462920000051
as described above, the antenna isolation refers to the ratio of the power transmitted by the transmitting antenna to the power received by the receiving antenna, and therefore, the isolation parameters of the WIFI module I and the conductive medium are:
Figure BDA0002157462920000052
wherein, in formula 3, P1Transmitting power, P, for an antenna of a WIFI Module I2The conductive medium is equivalent to the power received by the antenna. R1Is Z11Real part of (R)2Is Z22A real part of (2), wherein R2/R1Is approximately equal to Z22/Z11. Therefore, substituting equation 3 into equation 2 yields:
Figure BDA0002157462920000053
as can be seen from equation 4, for WIFI module I, the impedance Z of the antenna of WIFI module I11Is constant, and therefore, in order to adjust the isolation parameter P between the WIFI module I and the conductive medium1/P2Can be modified by changing Z22And Z21To be implemented.
Further, as can be seen from equation 4, at Z11At a certain time, Z is decreased22And/or increasing Z21Can make P1/P2The value of (c) is reduced, i.e., isolation is reduced, thereby improving throughput.
The isolation between the WIFI module I and the conductive medium is reduced, and the fact that the conductive medium forms a blocking channel between the two WIFI modules to exert an isolation effect is shown, so that the isolation between the WIFI module I and the WIFI module II is correspondingly reduced, and the isolation effect between the WIFI module I and the WIFI module II is improved.
As described above, it is theoretically verified that, on the basis that the conductive medium is arranged between the two wireless modules and the conductive medium is communicated with the ground terminal of the wireless module, the isolation between the two wireless modules adjacent to the conductive medium can be adjusted by adjusting the impedance of the arranged conductive medium and/or the mutual impedance of the conductive medium and the adjacent wireless module.
Specifically, the isolation between two adjacent wireless modules of the conductive medium is reduced by reducing the impedance of the conductive medium and/or increasing the mutual impedance between the conductive medium and the adjacent wireless modules; conversely, the isolation between two adjacent wireless modules of the conducting medium is increased by increasing the impedance of the conducting medium and/or reducing the mutual impedance of the conducting medium and the adjacent wireless modules.
For the conductive medium, the impedance of the conductive medium is affected by the material, shape, size, and position in the arranged spaced area, and thus the impedance of the conductive medium can be changed by changing at least one of the material, shape, size, and position in the spaced area of the conductive medium.
It is worth mentioning that while the impedance of the conductive medium is changed by the material, shape, size and position in the arranged spaced area, the mutual impedance between the conductive medium and the adjacent wireless module may also be changed, so that, in the process of adjustment by the above method, the change of the isolation caused by the impedance of the conductive medium and the change of the mutual impedance between the conductive medium and the adjacent wireless module are comprehensively considered.
In practical applications, in order to ensure the data transmission effect of the wireless module, the impedance of the conductive medium and/or the mutual impedance between the conductive medium and the adjacent wireless module are/is generally adjusted with the aim of reducing the isolation. Therefore, after the isolation is reduced, the throughput of the wireless module is correspondingly improved.
In one embodiment, the simulation is performed before the conductive medium is disposed in the isolation region. In the simulation, aiming at increasing the isolation between the two wireless modules, based on the preset material, shape, size and position in the spaced area of the conductive medium, the adjustment of at least one parameter (namely the material, the shape, the size and the position in the spaced area) is carried out, so that the aim of increasing the isolation between the two wireless modules is fulfilled. Then, according to the structural parameters (namely, shape, size and material) determined for the conductive medium, the conductive medium is manufactured, and the manufactured conductive medium is arranged in the spacing area between the conductive medium and the two wireless modules according to the determined position.
The conductive medium arranged between the two wireless modules forms a band elimination filter for inhibiting the surface wave, and the conductive medium can attenuate signals of certain frequency components to an extremely low level through signals of certain frequency components, so that the isolation effect between the two wireless modules is improved.
For a conductive medium, the frequency of the signal attenuated by the conductive medium is:
Figure BDA0002157462920000061
wherein c is the speed of light, lambda wavelength, epsilon is the dielectric constant of the conductive medium. Experiments prove that the radiation effect is best when lambda is 4(a + b), wherein a is the length of the conductive medium and b is the width of the conductive medium. Therefore, the shape and the dielectric constant of the conductive medium can be determined according to the frequency formula and the empirical value formula.
In one embodiment, the conductive medium is made of a conductive material having a dielectric constant of 3.5, i.e., e ═ 3.5 and c ═ 3 × 108m/s, for the wireless module, it is generally a WIFI module or a bluetooth module, and the working frequency band of the WIFI module and the bluetooth module is 2.4GHz, so the frequency of the signal to be attenuated by the conductive medium is the frequency of the working frequency band of the wireless module, and if f is taken1=2.4×109Hz, which can be derived from equation (5):
Figure BDA0002157462920000071
since λ is 4(a + b), equation (6) can be modified as:
Figure BDA0002157462920000072
substituting ∈ 3.5 into equation (7) can yield: a + b is 16.7 mm. Experiments verify that in practice, when the sum of the length and the width of the conductive medium is close to 16.7mm, the lower the isolation between the conductive medium and two adjacent wireless modules is, the better the corresponding isolation effect is.
In another embodiment, when the shape and size of the conductive medium are fixed, the smaller the dielectric constant of the conductive medium is, the better the radio frequency effect is, and thus, the smaller the isolation between two adjacent wireless modules of the conductive medium is, the better the isolation effect is.
In one embodiment, in order to ensure that the isolation between the two wireless modules is reduced after the conductive medium is arranged, the distance between the conductive medium and the wireless module is greater than 1 mm.
In one embodiment, the width of the conductive medium is greater than 1mm in order to ensure that the isolation between the two wireless modules is reduced after the conductive medium is disposed.
The conductive medium serves as a conductive element for blocking a channel between two adjacent wireless modules, and the conductive medium may be a sheet, and the material of the conductive medium may be a conductive material such as copper, silver, aluminum, and the like, which is not particularly limited herein. In one embodiment, the conductive medium is copper sheet.
As described above, the shape, size, material, and placement position of the conductive medium in the spaced-apart area directly affect the isolation between the two wireless modules, and thus, in a specific embodiment, the shape, size, material, and placement position of the conductive medium in the spaced-apart area need to be determined according to the required isolation between the two wireless modules.
Fig. 1, 2 and 3 respectively show schematic diagrams of conductive media arranged to improve isolation between two wireless modules in an embodiment. In other embodiments, the positioning may be performed according to other shapes, sizes and positions in the spaced areas, which are not specifically limited herein.
Fig. 1 and 2 are schematic diagrams of conductive media actually disposed on a PCB, where the wireless module is fixed by a solder joint on the PCB, the conductive media is communicated with a ground terminal of the PCB, and the wireless module is communicated with the ground terminal of the PCB after the wireless module is fixed on the PCB, so that the conductive media is communicated with the ground terminal of the wireless module. Fig. 3 is a schematic view of a simulation structure of a conductive medium determined by simulation, in which the conductive medium disposed between the WIFI module I and the WIFI module II forms a trench-back type.
Fig. 4 is a schematic view of the shape of a conductive medium determined by simulation with the goal of reducing isolation. As shown in fig. 4, the conductive medium may be T-shaped in a, may be bent to the right in the vertical portion of T-shaped in b, or may be bent to the left in the vertical portion of T-shaped in c. It should be noted that fig. 4 is merely a simulation of the shape of the conductive medium for improving the isolation between two wireless modules in one embodiment, and is not to be considered as limiting the scope of the present disclosure. In other embodiments, the shape and size of the conductive medium may be determined according to actual requirements, such as required isolation.
It is worth mentioning that if more than two wireless modules, for example three or more wireless modules, are arranged at the same time, since the wireless modules which are closer to each other will affect each other, the parameters of the conductive medium, i.e. the above-mentioned parameters of shape, size, etc., need to be determined by comprehensively considering the effect of the conductive medium and the wireless modules located in the near field region of the conductive medium.
The description will now be made by way of example. In the television, the television integrates a WIFI module and a Bluetooth module, but two paths of WIFI are generally integrated in the television, one is a main one and the other is an auxiliary one, so that a 2T2R mode is formed, namely a two-transmission two-receiving mode. Thus, in the television set, three wireless modules are integrated. Assuming that the three wireless modules are respectively a WIFI module I, WIFI module II and a bluetooth module, if each parameter of a conductive medium (assumed to be a conductive medium a) to be laid between the WIFI module I and the WIFI module II is initially determined, in the process of determining the parameter of the conductive medium (assumed to be a conductive medium B) to be laid between the WIFI module II and the bluetooth module, the parameter of the conductive medium B needs to be determined by combining the isolation between the conductive medium B and the WIFI module I and the isolation between the conductive medium B and the WIFI module II, in the process of determining the parameter of the conductive medium B, the isolation between the conductive medium a and the WIFI module I needs to be verified reversely, and if the isolation between the conductive medium a and the WIFI module I does not meet the set requirement, the parameter of the conductive medium a needs to be adjusted again.
In summary, when two or more conductive media need to be laid, even when parameters of the conductive media to be laid between the two wireless modules are determined, in the process of determining the parameters for other conductive media, the parameters of the predetermined conductive media need to be verified in a reverse direction and adjusted correspondingly, so as to achieve a required isolation degree, for example, improve the isolation degree.
According to the technical scheme, the conductive medium is arranged between the two wireless modules and is communicated with the grounding ends of the wireless modules, so that on one hand, the isolation between the two wireless modules is realized through the conductive medium, and specifically, the isolation is adjusted through adjusting the impedance of the guide medium and the mutual impedance between the conductive medium and the adjacent wireless module; on the other hand, because the conducting medium is communicated with the grounding end of the wireless module, the conducting medium consumes less energy in the working process of the wireless module and occupies small space.
In the prior art, the isolation between two wireless modules is reduced by an isolation circuit overlapped by microstrip lines. The method is characterized in that a band-stop filter is constructed by utilizing microstrip line simulated electronic components (such as simulated capacitors, resistors and inductors) to reduce the isolation. However, the isolation circuit needs to be connected with a resistor, consumes more energy, and occupies a large space due to the characteristics of the resistor, the capacitor and the inductor. The method can effectively solve the problems of high energy consumption and large occupied space in the prior art.
Fig. 5 is a schematic diagram illustrating a microstrip line added between two wireless modules to construct an isolation circuit in the prior art, where as shown in fig. 5, the microstrip line is connected to a radio frequency feeder end, and the microstrip line is disposed between the two wireless modules. When the wireless module works, the isolation circuit can improve the isolation between the two wireless modules, but when the wireless module works, the microstrip line and the grounding end form a voltage difference, so that current is generated on the microstrip line, and the effect of improving the isolation between the two wireless modules is realized based on the generated current. It can thus be seen that this approach, while increasing isolation between the wireless modules, increases power consumption.
As described above, the conductive medium arranged between the wireless modules corresponds to a band-stop filter, so that the conductive medium constitutes a band-stop filter that can pass signals of certain frequency components while attenuating signals of certain frequency components to an extremely low level. For example, for a WIFI module and a bluetooth module working in a 2.4GHz band, it can be ensured that the high conductive medium can ensure that signals near the 2.4GHz band are attenuated to be extremely low by setting parameters of the conductive medium, for example, for a wireless module working in the 2.4GHz band, setting the frequency band of the attenuated signals of the conductive medium as: f is more than 2.4GHz and less than or equal to 2.5 GHz.
The parameter affecting the frequency of the signal attenuated by the conductive medium may be the shape and dielectric constant of the conductive medium, so that the frequency band attenuated by the band-stop filter may be determined by the shape and/or dielectric constant of the conductive medium.
As can be seen from the above equation (5), in equation (5), f1When λ is 4(a + b), parameters such as the node constant of the conductive medium, the width and the length of the conductive medium can be selected according to the combination.
In one embodiment, the frequency band attenuated by the band-reject filter is set by using the operating frequency band of the wireless module as a reference, so as to reduce the signal interference received by the wireless module. For example, as the WIFI module and the bluetooth module operate in the 2.4GHz band, 2.4GHz < f ≦ 2.5GHz may be set as the band attenuated by the conductive medium as the band-stop filter.
In order to verify the effect of the technical scheme, isolation degree test is performed according to a circuit board integrated with two WIFI modules and one Bluetooth module in a television, in the circuit board, a conductive medium communicated with a grounding end of the WIFI module is arranged between the two WIFI modules (the WIFI module I, WIFI module II), a conductive medium communicated with the grounding end is arranged between the Bluetooth module and the WIFI module, before the conductive medium is arranged, the parameters of the conductive medium are determined by taking the isolation degree between the two WIFI modules and the isolation degree between the Bluetooth module and the WIFI module as targets, and the conductive medium corresponding to the parameters is arranged on the circuit board according to the determined parameters.
In the test data charts of fig. 6 to 9, the horizontal axis represents frequency, and the vertical axis represents isolation.
For the isolation between the WIFI module I and the Bluetooth module:
the degree of isolation between the two before the conductive medium is not applied is shown in fig. 6. In FIG. 6, three sample points 1, 2, 3 are identified, where sample point 1 has a frequency of 2.4GHz, at which the corresponding isolation is-15.792 dB; the frequency of sampling point 2 is 2.45GHz, and the corresponding isolation at the frequency is-14.815 dB; the frequency of sample point 3 is 2.5GHz, at which the corresponding isolation is-17.442 dB.
After the conductive medium having been parameterized to decrease the isolation is laid, the isolation between the two is shown in fig. 7. As shown in FIG. 7, sampling point 1 (frequency of 2.4GHz) corresponds to an isolation of-28.121 dB; the isolation corresponding to sampling point 2 (frequency of 2.45GHz) is-23.094 dB; sample point 3 (frequency 2.5GHz) corresponds to an isolation of-27.368 dB.
By the above, after the conductive medium is arranged, the isolation degree corresponding to the three sampling points is reduced, so that the isolation effect between the WIFI module I and the Bluetooth module is improved after the parameters of the conductive medium are determined by taking the reduced isolation degree as a target and are arranged between the WIFI module I and the Bluetooth module.
For the isolation between the WIFI module II and the Bluetooth module:
the isolation between the two before the conductive medium is not arranged is shown in FIG. 8, wherein the isolation corresponding to sampling point 1 (frequency of 2.4GHz) is-13.626 dB; the isolation corresponding to sampling point 2 (frequency of 2.45GHz) is-13.524 dB; sample point 3 (frequency 2.5GHz) corresponds to an isolation of-15.292 dB.
After the conductive medium having the parameters determined with the aim of reducing the isolation is laid, the isolation between the two is as shown in fig. 9. Wherein, the isolation corresponding to the sampling point 1 (the frequency is 2.4GHz) is-23.345 dB; the isolation corresponding to sampling point 2 (frequency of 2.45GHz) is-24.358 dB; the isolation corresponding to sampling point 3 (frequency of 2.5GHz) is-25.136 dB
It can also be seen from the above that, after the conductive medium is laid, the isolation corresponding to the three sampling points is all reduced, so that the isolation effect between the WIFI module II and the Bluetooth module is improved after the parameters of the conductive medium are determined by taking the reduced isolation as a target and the conductive medium is laid between the WIFI module I and the Bluetooth module.
In order to further verify the technical effect of the scheme, the throughput test is carried out on the television which comprises the circuit board integrated with the two WIFI modules and the Bluetooth module.
And when the television plays 4K video, the television is connected with the Bluetooth sound box to play, and the throughput of the WIFI module is tested on the basis.
It should be noted that in the following tables 1 and 2, the conductive media are laid after the parameters of the conductive media are determined to reduce the isolation in the tests.
In this test, the television set includes two WIFI modules, forming a two-transmission and two-reception mode, where Rx represents reception data and Tx represents transmission data. For the WIFI module, the 2.4GHz band in which the WIFI module operates includes 11 channels, i.e., channels 1 to 11, where the commonly used channels are channel 1, channel 6, and channel 11, and therefore in this test, the test is performed on the commonly used channels, i.e., channels 1, 6, and channel 11.
Wherein, the measured throughput in the normal mode is shown in the following table 1:
Figure BDA0002157462920000121
TABLE 1 throughput of WIFI Module in Normal mode
As shown in table 1, in the normal mode, after the conductive medium is arranged, the throughput of the WIFI module is wholly improved regardless of whether the WIFI module transmits or receives data, thereby proving that the isolation effect between the WIFI module and the bluetooth module is improved by arranging the conductive medium.
In the fading mode, the measured throughput of the WIFI module is as shown in table 2 below:
Figure BDA0002157462920000131
table 2 throughput of WIFI module in attenuation mode
As shown in table 2, in the attenuation mode, after the conductive medium is arranged, the throughput of the WIFI module is wholly improved regardless of whether the WIFI module transmits or receives data, thereby proving that the isolation effect between the WIFI module and the bluetooth module is improved by arranging the conductive medium.
In an embodiment of the present disclosure, a circuit board is provided, where at least two wireless modules are mounted on the circuit board at intervals, a conductive medium is disposed in an interval area between two adjacent wireless modules on the circuit board, the conductive medium is separated from the wireless modules, and the conductive medium is communicated with a ground terminal of the wireless modules, and the isolation between two wireless modules adjacent to the conductive medium is adjusted by the method in any of the above embodiments.
In a further embodiment of the present disclosure, a television set is provided, which includes the circuit board as above.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the embodiments disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains.
It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims (9)

1. The method for adjusting the isolation is characterized by being applied to at least two wireless modules, wherein the at least two wireless modules are installed at intervals, a conductive medium is arranged in an interval area between adjacent wireless modules in the at least two wireless modules, the conductive medium is separated from the wireless modules and is communicated with the grounding end of the wireless modules, and the isolation between the two wireless modules adjacent to the conductive medium is adjusted by adjusting the mutual impedance between the conductive medium and the adjacent wireless modules; the band elimination filter is formed by conductive media arranged among the wireless modules, and the frequency band attenuated by the band elimination filter is set by taking the working frequency band of the wireless modules as reference so as to reduce the signal interference borne by the wireless modules;
the adjusting of the isolation between two adjacent wireless modules by adjusting the mutual impedance between the conductive medium and the adjacent wireless modules includes:
reducing the isolation between two adjacent wireless modules of the conductive medium by increasing the mutual impedance between the conductive medium and the adjacent wireless modules; or
The isolation between two adjacent wireless modules of the conductive medium is improved by reducing the mutual impedance between the conductive medium and the adjacent wireless modules.
2. The method of claim 1, further comprising:
reducing the isolation between two adjacent wireless modules by reducing the impedance of the conductive medium, or simultaneously reducing the impedance of the conductive medium and increasing the mutual impedance of the conductive medium and the adjacent wireless modules; or
The isolation between two adjacent wireless modules of the conductive medium is improved by increasing the impedance of the conductive medium or simultaneously increasing the impedance of the conductive medium and reducing the mutual impedance of the conductive medium and the adjacent wireless modules.
3. The method of claim 1, wherein the impedance of the conductive medium is varied by varying at least one of a material, a shape, a size, and a position in the spaced-apart region of the conductive medium.
4. The method according to claim 1, characterized in that the frequency band attenuated by the band-stop filter is determined by the shape and/or the dielectric constant of the conductive medium.
5. The method of claim 1, wherein the wireless module is a bluetooth module or a WIFI module.
6. The method of claim 1, wherein the conductive medium is spaced apart from the wireless module by a distance greater than 1 mm.
7. The method of claim 1, wherein the width of the conductive medium is greater than 1 mm.
8. A circuit board, wherein at least two wireless modules are mounted on the circuit board at intervals, a conductive medium is arranged in an interval area between two adjacent wireless modules of the at least two wireless modules on the circuit board, the conductive medium is separated from the wireless modules, and the conductive medium is communicated with a ground terminal of the wireless modules, and the isolation between the two wireless modules adjacent to the conductive medium is adjusted by the method according to any one of claims 1 to 7.
9. A television set, characterized in that it comprises a circuit board according to claim 8.
CN201910721765.7A 2019-08-06 2019-08-06 Isolation degree adjusting method, circuit board and television Active CN110416729B (en)

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JP4571988B2 (en) * 2007-01-19 2010-10-27 パナソニック株式会社 Array antenna device and wireless communication device
JP2009246560A (en) * 2008-03-28 2009-10-22 Ngk Spark Plug Co Ltd Antenna device and radio communication apparatus with the same
CN102623793A (en) * 2011-02-01 2012-08-01 华硕电脑股份有限公司 Multi-input multi-output antenna system
GB2500209B (en) * 2012-03-13 2016-05-18 Microsoft Technology Licensing Llc Antenna isolation using a tuned ground plane notch
CN202839957U (en) * 2012-08-28 2013-03-27 深圳市信维通信股份有限公司 Antenna device used for mobile terminal and mobile terminal
CN103367893A (en) * 2013-07-04 2013-10-23 云南大学 High-isolation broadband two-antenna system
CN104241829A (en) * 2014-09-24 2014-12-24 上海大学 RFID (radiofrequency identification) tag applied to intensive distribution scenarios and mutual impedance design method thereof
CN107546489B (en) * 2017-08-16 2020-12-15 京信通信技术(广州)有限公司 Multi-frequency base station antenna for eliminating coupling resonance
CN107681261B (en) * 2017-09-07 2021-01-26 深圳市盛路物联通讯技术有限公司 Antenna device and wireless communication apparatus

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