CN110249177A - LED illumination module with fixing optical element and variable transmission mode - Google Patents
LED illumination module with fixing optical element and variable transmission mode Download PDFInfo
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- CN110249177A CN110249177A CN201780084737.8A CN201780084737A CN110249177A CN 110249177 A CN110249177 A CN 110249177A CN 201780084737 A CN201780084737 A CN 201780084737A CN 110249177 A CN110249177 A CN 110249177A
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
- F21Y2105/18—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array annular; polygonal other than square or rectangular, e.g. for spotlights or for generating an axially symmetrical light beam
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
A kind of LED illumination module, including LED light, the LED light is with multiple luminescent wafers on substrate and with the optical element combination of single focus.The luminescent wafer includes the single center luminescent wafer centered on optical axis and the peripheral wafer around Center Wafer setting.Lighting module includes pack optical element, which has the single focus being arranged in above LED light, and focus is on the optical axis of Center Wafer." hot spot " the emission mode collimation that the light emitted from Center Wafer is focused basically by optical element.The light guide emitted from peripheral wafer causes more dispersed or diverging " floodlight beam " emission mode.Center Wafer and peripheral wafer are independent controls, and the power for being transported to chip can be independently varied, to generate different optical transmission modes by using identical optical element.
Description
Background technique
Light emitting diode (LED) is now in the standard sources of various lighting devices, warning device and signal device.Hair
Optical diode includes semiconductor wafer (or chip), which emits predetermined wavelength when being motivated by electric power
The light of (color).Luminescent wafer is generally positioned in heat-conductive bracket, is provided with conductive contact with for chip to be connected to circuit,
It and may include main optical element.Including luminescent wafer, heat-conductive bracket, electrical connector and main optical element (if present)
Component is properly termed as LED light.It is commonly found the LED light of multiple color and luminous power.In some cases, multiple to shine
Chip is placed in common heat-conductive bracket.These luminescent wafers can be identical color or different colors.Public
On bracket, primary colors needed for some LED light provide color monitor is mixed, these LED light have the luminescent wafer of every kind of primary colors.
Light is radiated from the chip of LED far from heat-conductive bracket, passes around the optical axis at the center of luminescent wafer with divergent mode
Transmitting.The light emitted from the chip of LED also can be described as the separate light emitted from plane and pass through chip, optical axis perpendicular to
The plane.LED light may include main optical element, which can change the light emitted from one or more chips
Mode, but all LED light are all " orientation " light sources, because light emits on the direction far from heat-conductive bracket.Using LED light
Lighting device is designed to generate the different optical transmission modes for the purposes for being suitable for the lighting device.Light molded component (lens and/
Or reflecting mirror) configuration section determined by the optical transmission mode of lamp, and part the emission mode as required for lighting device determine
It is fixed.Common lighting device optical transmission mode includes collimated light beam (hot spot) mode and is uniformly distributed (floodlight) mode.Part is quasi-
Collimated optical beam emission mode and special-purpose is also used at the optical transmission mode of certain shape.Lighting device includes lens and/or anti-
The optical module of mirror is penetrated, to change the optical transmission mode of one or more LED light, to generate required optical transmission mode.Optics
Component usually surrounds focus and/or focal axis construction, and is accurately handled from the light that focus or focal axis emit by optical module.?
Deviate the light emitted at the focus or focal axis position of component, is sent out with the emission mode different from the emission mode of design from component
Out.Optical module generates the ability of accurate emission mode from LED, is slightly influenced by following facts: each luminescent wafer
All there is a region, and the light of the field emission from the chip of the spaced on center of chip deviates from the optics coke of optical module
Point or focal axis.Large-sized luminous chip and large substrate with multiple chips may exaggerate this influence, this would generally generate and lead
Cause fuzzy emission mode.
Some lighting devices are configured to generate more than one optical transmission mode.For example, flashlight can be designed to send out
Penetrate focus on light beam (hot spot) and diffusion (floodlight) two kinds of optical transmission modes.This is usually by relative to the mobile optics group of single source
Part realizes that this changes the mode of transmitting light.Other lighting devices may include multiple light sources, and each light source has oneself
Special optical component and different light sources is operated to generate photoemissive AD HOC.The manufacturing cost of multiple optical modules can
Can be very high, and it is impossible being suitable for may is that in the restriction range that specific illumination device configures.
This field is required to generate different light transmitting moulds using the identical fixed optical module with single focus
The lighting device of formula.
This field is required to generate the solid-state lighting device of the variable divergence light emission mode of movement-less part.
Summary of the invention
According to one embodiment of disclosed LED illumination module, LED illumination module includes having multiple hairs on substrate
The LED light of light chip, the LED light are combined with optical module, which is configured to reduce from one of chip
The diverging of the light of radiation.Luminescent wafer may include single center luminescent wafer or the center luminescent wafer centered on optical axis
Group.The optical axis can be overlapped with the axis of optical module.Luminescent wafer on substrate further includes around Center Wafer or chipset
One or more peripheral wafers of arrangement.Peripheral wafer can be around Center Wafer or chipset symmetrically or asymmetrically cloth
It sets.Disclosed lighting module may include the pack optical element with single focus.The optical element support is in LED light
The position of the fixation of side.The focus of optical element can be on Center Wafer or the optical axis of Center Wafer group, and focus can be with
With in the plane of Center Wafer or Center Wafer group.The light emitted from Center Wafer or chipset can be substantially by optics
Element collimation, and the emission mode transmitting of " hot spot " focused with one.It can choose other emission modes, optical module quilt
It is configured to be reduced to the diverging of the light emitted from LED light from wide-angle " floodlight " to the emission mode for focusing " hot spot " and in light
Change the light beam of diverging between spot and floodlight.The light of one or more peripheral wafer transmittings is opened from the focal point interval with optical element
Field emission, and with it is more dispersed and diverging " floodlight " emission mode transmitting.Center Wafer or chipset and one or more
A peripheral wafer is independent control, therefore by switching between Center Wafer and peripheral wafer, can be from same optics member
Part generates hot spot or floodlight emission mode.Selectively, the power for being transported to Center Wafer and peripheral wafer can independently change
Become, no moving parts and using have single focus same optical element in the case where, can produce from hot spot (only
Center Wafer is opened) arrive the light-emitting mode that hot spot/floodlight (all wafers opening) arrives floodlight (only peripheral wafer opening) again.
Peripheral wafer can be the single epitaxial wafer for being centered around Center Wafer with symmetric or asymmetric configuration.It may be selected
Ground, disclosed LED illumination module, which can be used, to be formed centrally one group of multiple chips in a substrate and arranges around the central set
Multiple chips configure.The subset of peripheral wafer can be configured to receive energy or all peripheral wafers together and can connect simultaneously
Receive energy.Light from peripheral wafer emits from optical module, has the track towards optical transmission mode diametrically side, therefore
It is successively powered to peripheral wafer or peripheral wafer group, can produce the mobile light emitting centered on the axis of symmetrical optical component
Mode.By the way that a chip of each color to be placed in the focus of optical element, and guarantee in each peripheral position
The quantity of colored chip is equal, to balance the colored light emission from row's LED illumination module.
One embodiment of disclosed LED light, LED light include the Center Wafer surrounded by multiple peripheral wafer rings, this
The optical axis of a little rings and the transmitter at the center for passing through Center Wafer is concentric.Peripheral wafer in each ring can connect together with
As one group of energization.It is logical to each ring of peripheral wafer when the embodiment of LED light is located at behind pack optical module
Electricity, and to increase light around the mode of the light beam formed by Center Wafer.When ring is advanced far from optical axis, each ring is come from
Light by light emitting give the radially outer transmitting pattern of light from Center Wafer and radially inward adjacent ring.It is applied by changing
It is added in the power of Center Wafer and LED wafer ring, emission mode can be adjusted to floodlight beam from hot spot.
Term " ring " used herein includes the shape for being located around the chip of Center Wafer positioning, can be to center
Power is applied independently in other of chip and chip periphery " ring ".Each ring can be ring-shaped or circular, and and component
Optical axis it is concentric.Ring is also possible to non-circular, such as the square arrangement of chip.Each ring can be by about substantially symmetrical about its central axis
Uniform pattern arrangement a series of chips composition.It can also include the cloth of chip heterogeneous according to disclosed wafer ring
Set, and the arrangement of chip can be relative to the focal axis of component it is asymmetric.For example, chip can be gathered in the certain of the ring
Position, and the number of wafers at other positions is reduced.Although disclosing round pack optical element, other shapes are gathered
Beam optics element is compatible with disclosed lighting module.In the case where non-circular pack optical element, the ring of peripheral wafer can
To be configured to provide relatively uniform light intensity in the reflection of pack optical element and refractive surface, this be may cause relative to group
The non-uniform wafer arrangement mode of the optical axis of part.
Disclosed LED illumination module can be used in need that there are different beam emissions modes luminaire anyly
Side.Purposes include indoor and outdoors automobile lighting, emergency lighting, automobile and ship spotlight, indoor and outdoors architectural lighting,
Portable lamp, indoor and outdoors aviation lighting, motorcycle and bicycle lighting, camera illumination, stage/drama illumination, flashlight, spy
Illuminator, weapon aiming lighting system, remote controlled search light and the robot lighting device for searching for, rescuing, check etc., including
Unmanned plane installation illumination.Variable light hair is generated in the optical structure element of disclosed LED illumination module never moving parts
Emission mode.
Detailed description of the invention
Fig. 1 is the cross-sectional view according to one embodiment of the LED illumination module of all aspects of this disclosure；
Figure 1A is the graphical representation of the optical transmission mode as caused by the luminescent wafer of the LED illumination module in Fig. 1；
Fig. 2 is one embodiment according to the LED light compatible with the LED illumination module of Fig. 1 of all aspects of this disclosure
Top view；
Fig. 3 is the LED light of the substitution compatible with the LED illumination module according to the disclosure；
Fig. 4 A is the figure table according to the front view of an alternate embodiment of the LED illumination module of all aspects of this disclosure
Show；
Fig. 4 B is the figure table according to the front view of another alternate embodiment of the LED illumination module of all aspects of this disclosure
Show；
Fig. 5 is the schematic diagram according to the front view of row's LED illumination module of all aspects of this disclosure；
Fig. 6 is the vertical view according to the LED light of the substitution compatible with disclosed LED illumination module of all aspects of this disclosure
Figure；
Fig. 7 is the photo according to the exemplary L ED transmitter of all aspects of this disclosure；
Fig. 8 is the electrical schematic diagram of the LED emitter in Fig. 7；
Fig. 9 is the cross-sectional view of one embodiment of the lighting module comprising the LED emitter in Fig. 7 and Fig. 8；
Figure 10 is that the photoemissive mode of the lighting module in Fig. 9 indicates, is shown by the crystalline substance on transmitter
Piece group applies emission mode caused by different capacity mode；
Table 1 shows " unlatching " time of every group of LED wafer in the LED emitter in the lighting module of Fig. 9, generates
Optical transmission mode shown in Figure 10；
Figure 11 is the graphical representation of PWM percentage shown in table 1, generally corresponds to be transmitted in the lighting module of Fig. 9
LED emitter on LED wafer group changed power；
Figure 12 illustrates the lighting module with range capability, wherein according to from the lighting module to representative mesh
Target distance adjustment beam shape；And
Figure 13 is the cross-sectional view according to the alternate embodiment of the LED illumination module for the various aspects originally opened.
Specific embodiment
Fig. 1 is the cross-sectional view of the first embodiment of the LED illumination module 10 in conjunction with various aspects of the present disclosure.LED light 11 includes
Thermally conductive ceramic substrate 12, the thermal conductive ceramic substrate 12 are configured to support multiple luminescent wafers 14,16.The conduction of 12 bottom of substrate
Luminescent wafer 12,14 is connected to the circuit on printed circuit board (not shown) by pad 13.In the embodiment in figure 1, single opposite
Biggish Center Wafer 14 is located at the center of ceramic substrate 12.Center Wafer 14 in the embodiment is that side length is the rectangular of 1mm
Chip.Center Wafer 14 is about that the small rectangular peripheral wafer 16 of .2mm surrounds by many side lengths.The shape of each chip 14,16 can
It is disclosed rectangular to be different from, and the relative size difference between Center Wafer 14 and peripheral wafer 16 can be different from institute
Disclosed relationship.Chip 14,16 can be any closed rule or irregular polygon.It can will be from using YAG phosphor
The light of short (blue, purple) wavelength light conversion yellowly, red and white that luminescent wafer 14,16 radiates.YAG phosphor can be with
It is dispersed in epoxy resin 18 or other carriers, and fills the region of the side of sum between luminescent wafer 14,16, as shown in Figure 1.It is brilliant
Piece 14,16 and phosphor/epoxy resin 18 can be covered by optically transparent Silicone Sealants 20 to be protected.
The optical element 22 of exemplary internal reflection is supported on the position of 11 top of LED light, is sent out with substantially collecting by center
All light that light chip 14 and peripheral luminescent wafer 16 generate.Optical element 22 has single focus about axis A rotational symmetry
24, and be configured as the light generated at focus 24 being collimated to the side parallel with the axis A at the center of optical element 22
To.In Fig. 1, axis A is overlapped with the optical axis Ao of LED light 11, across Center Wafer 14 center and perpendicular to support LED light 11
Plane.Optical element 22 is an example and other non-circular packs of " pack (beam-forming) " optical texture
Optical element is compatible with disclosed lighting module.The peripheral inner reflection surface of TIR light element can coat reflecting material, to subtract
Pass through the leakage of the light on the surface less.
Term " collimation " used herein indicates and reference line or plane " so that substantially parallel ".Those skilled in the art
Member it is understood that the fact that the tolerance and luminescent wafer of optical element are not real point light sources it is meant that passing through collimation
The light that optical element is issued from LED light source will be collimated substantially, inaccurately be put down with some launching tracks and reference line or plane
Capable light.Disclosed optical element 22 is the circular optical elements of total internal reflection (TIR) type, uses refracted light incident table
The combination in face 26 and light emission surface 28 cooperates with inner reflection surface 30, by (can also from the luminescent wafer 14,16 of LED light 11
To be known as (transmitter)) track of the light of radiation changes into the rail for generating predetermined optical transmission mode as will be detailed below
Mark.Reflecting surface and the lens combination of metallization can be used to reboot from the radiation of luminescent wafer 14,16 in substitution optical element
Light, to generate similar optical transmission mode.
In general, collimation optics reduce the light radiated from luminescent wafer relative to the center for passing through luminescent wafer
Axis or plane diverging.Optical element relative to line (commonly referred to as axis) collimated light forms a kind of " point " beam emissions shape
Formula has the diverging from the line less than 20 °, and preferably about 10 ° of diverging.From the side of light beam to the other side into
Row measures 20 ° or 10 ° of the angle of divergence, it means that any side of 10 ° of light beams from axis A off-axis A are about 5 °.Relatively
The diverging of the light relative to planar radiation is reduced in the optical element of plane collimated light, but is allowed in the direction parallel with plane
On diverging so that visible within the scope of vantage point of the light beam planar or near plane.This emission mode can be with
Referred to as " wide-angle " light beam can also be described as " part collimates ".
In the LED light 11 of Fig. 1 and Fig. 2, center luminescent wafer 14 is that side length is the rectangular of 1mm, and is had across crystalline substance
The optical axis A at the center of pieceO.The Center Wafer 14 is located so that the optical axis A of Center Wafer 14oAcross the focus of optical element 22
24.Light radiates on a series of radiation paths from Center Wafer 14, and radiation path forms the hemisphere of light, this can be referred to as " bright
Primary body (lambertian) " radiation mode.The physical size of Center Wafer 14 mean some light be from optical element 22
Optical axis AoThe position transmitting being spaced apart with focus 24.Substantially, optical element is all passed through from all light that Center Wafer 14 emits
Refractive surface 26, and received by the translucent material of optical element 22, this material can be by silicone, polycarbonate, propylene
The materials such as acid or glass are constituted.Once light will be mobile according to well-known principle, than Nie Er like that into optical element 22
Law.Light is incident in the interior reflective surface 30 of 22 periphery of optical element with being greater than the angle of critical angle, is reflected to basis
The direction of light and its in the track of the incidence angle in interior reflective surface 30.In the embodiment disclosed in fig. 1, refracted light incident face
26 and light reflective surface 28 be located at the bottom and top of optical element 22, with the internal reflection table for being located at 22 periphery of optical element
Face 30 cooperates, and the radiation path of the light from Center Wafer 14 is changed into the optical axis A substantially with Center Wafer 14oAlignment
Launching track (launching track is overlapped with the axis A in Fig. 1).Inner reflection surface 30 can metallize to reduce through the table
The leakage of the light in face.
Figure 1A shows the optical transmission mode from Center Wafer 14 and TIR light element 22.The figure shows relative to
Emission mode corresponding with about 10 ° of collimation " hot spot " light beams of 0 ° of center line that axis A is overlapped.Or it may also be said that from center
The emission mode that chip 14 passes through collimation optics 22 generates light beam, wherein essentially all of light appointing relative to axis A
Side anticipate all with 5 ° or the transmitting of smaller angle.It is located in emission mode by the largest beam intensity that Center Wafer 14 generates
The heart, when graphically present, similar to relatively sharp, the narrow spike centered on axis A.Figure 1A is also shown
Pass through the emission mode of collimation optics 22 from peripheral wafer 16.Peripheral wafer 16 generates the center relative to optical element 22
The light of axis A " off-axis ".The light generated by peripheral wafer 16 will not be collimated by optical element 22, and around by Center Wafer 14
The Mode Launch of the hot spot light beam of generation.It is understood that it is brilliant to change center relative to the power for being transmitted to peripheral wafer 16
The power of piece 14, the emission mode that the axis A divergence generated relative to optical element 22 is changed.When Center Wafer 14 and outside
When enclosing chip 16 and being all powered, it is filled with the center from 16 emission mode of peripheral wafer from the light emitting of Center Wafer 14, to mention
For the wide-angle floodlight emission mode from lighting module 10.
Pack optical element 22 extremely efficiently handles the light from Center Wafer 14, it means that the light of relatively small amount
Flux can generate clearly hot spot light beam.Because light caused by Center Wafer 14 is processed and focuses on zonule
It is interior, so hot spot light beam also has high luminous intensity.The efficiency of the processing of optical element 22 light as caused by peripheral wafer 16
It is relatively low, it means that some light are lost in optical element, and some light to expected floodlight emission mode without shadow
Emit on loud track.In addition, the light emitting amount to be filled of peripheral wafer 16 is much larger than the light filled by Center Wafer 14
Emission measure.Due to these factors, total luminous power of peripheral wafer 16 is greater than total luminous power of Center Wafer 14.Even if each
Peripheral wafer 16 is likely less than Center Wafer 14, but total lumen that peripheral wafer 16 generates is greater than total stream that Center Wafer 14 generates
It is bright.In addition, the consumed power when generating larger luminous flux of peripheral wafer 16 is greater than power consumed by Center Wafer 14.
Fig. 2 is the top view of the LED light 11 of Fig. 1, the ceramic substrate 12 for luminescent wafer is shown, according to the disclosure
Various aspects, LED light 11 include Center Wafer 14 and a large amount of lesser peripheral luminescent wafers 16.Although showing in relatively large
Heart chip 14 and lesser peripheral wafer, but the relative size of chip 14,16 is without being limited thereto.In disclosed LED light 11,
Center Wafer 14 and peripheral wafer 16 link together, so that Center Wafer 14 can separate energization with peripheral wafer 16.Outside
Enclosing chip 16 can connect together as one group of energization, or as the subset that can be individually powered.Peripheral wafer 16 is in
The optical axis A of heart chipoLateral separation, and also with 24 lateral separation of focus of optical element 22.This means that from peripheral wafer
The light of 16 radiation will emit not as collimated light beam from optical element 22, but as the light more dissipated as shown in Figure 1A
Beam transmitting.When graphically present, there is lower intensity along axis A by the light beam that peripheral wafer 16 is formed, wherein
The most of light emitted within the scope of certain angle is diffused to relative to axis A to about 45 °.From the transmitting mould of peripheral wafer 16
Formula can be described as a kind of " floodlight " optical transmission mode, but especially lack intensity along axis A.In the illumination mould of Fig. 1 and Fig. 2
In block 10, the peak strength of the emission mode from peripheral wafer 16 deviates about 20 ° from axis A, as shown in Figure 1A, it means that
The peak strength and axis A of light from peripheral wafer 16 dissipate about 20 degree.
The LED illumination module 10 of Fig. 1 is configured so that Center Wafer 14 and peripheral wafer 16 can together or individually
It is powered.Furthermore, it is possible to the light emitting intensity from Center Wafer 14 and peripheral wafer 16 be modulated, to generate from focus point to wide-angle
The optical transmission mode of floodlight.It is powered in reduced level for example, Center Wafer 14 can according to need, with filling by peripheral brilliant
The center for the floodlight emission mode that piece 16 generates.In general, hot spot optical transmission mode is the object for illuminating distant place, or it is used for
Generate the visible warning optical signal at a distance such as in beacon.Floodlight emission mode can be used for illuminating construction operation area, hand over
The scene etc. of interpreter's event.The LED illumination module 10 of Fig. 1 can provide hot spot, floodlight from single optical element 22 or mix this
The various emission modes of the two, the optical element 22 can have single focus 24 and without using moving parts.
The arrangement of peripheral wafer is not limited to shape identical with Center Wafer.For example, the peripheral wafer 16 in Fig. 2 is around side
Shape Center Wafer 14 arranges squarely.Three chips can be removed from the corner that peripheral wafer 16 is arranged, " x " table is used in Fig. 2
Show these chips.Removing three peripheral wafers 16 in the corner of bracket will lead to the more round light emitting from optical element 22
Mode.The arrangement of peripheral wafer 16 is the example according to " ring " of the peripheral wafer 16 of the disclosure in Fig. 2.
Fig. 3 is the top view of ceramics bracket 12, shows a kind of alternating pattern of luminescent wafer, wherein "center" shines
Chip 32 is made of 9 lesser chips 34.In this embodiment, it is configured to make close to 34 groups of 9 chips of the center of bracket
Centered on group 32 be powered together, wherein be configured to be powered together around the peripheral wafer 36 of the central set or lead in subset 38
Electricity.As shown in figure 3, the group of 9 peripheral wafers 36 is connected in subset 38 by cross spider, subset 38 connects into be powered together.Son
Collection may include the chip of equal amount as shown in Figure 3 or the chip of unequal quantity.Bracket 12 and luminescent wafer 34,36
It will work as described in the embodiment above for Fig. 1 and Fig. 2, and only with respect to centered in group 32
The grouping of the construction and peripheral wafer 36 of heart chip is different.
Fig. 4 A shows the selectable grouping of luminescent wafer, wherein 8 peripheral wafers 16 surround Center Wafer 14.TIR
Optical element 22 is shown schematically in front of chip 14,16.Center Wafer 14 and peripheral wafer 16 are configured to individually be powered.
In some embodiments, each chip 14,16 can be individually operated, and can change the energy for being applied to each chip to produce
Raw different optical transmission mode.The light radiated from each peripheral wafer 16 emits along track from optical element 22, which adds
The strong peripheral wafer 16 from energization radially across emission mode.For example, the periphery in 12 upper left corner of substrate from Fig. 4 A is brilliant
The light of piece 16 facilitates the lower right-most portion of floodlight emission mode.Light from top center peripheral wafer 16 helps to send out in floodlight
The floodlight of the bottom center of emission mode emits.It should be noted that with rotational order to each of 8 peripheral wafers 16
Chip is powered, and will generate vortex emission mode.It is powered with left and right or upper and lower mode to peripheral wafer 16, it will be from optical element 22
Generate the optical transmission mode moved backward accordingly.
Fig. 4 B shows three LED light 44,46,48 being closely grouped behind TIR light element 22.Art technology
Personnel can appreciate that luminescent wafer can be arranged on common substrate as shown in Figure 1, Figure 2 and Figure 3, or can be with
It is arranged on independent substrate as shown in Figure 4 B.When being quoted in the disclosure and additional scheme, " luminescent wafer " is drawn
With the chip on the chip or independent bracket that can refer in common holder.Each LED light 44,46,48 include its own substrate,
Electrical connection, luminescent wafer and primary optical element (as existed).The optical axis of center LED light 44 and the rotary shaft weight of optical element 22
It closes, and the LED wafer of center LED light 44 is located at the focal point of TIR light element 22, therefore radiated from center LED light 44
Light is focused into collimated light beam, as described above, this depends on the size of chip and the precision of optical element 22.One peripheral LED
Lamp 46 is located at the left side of center LED light 44, and a peripheral LED lamp 48 is on the right side for being located at center LED light 44.In this arrangement
In, the light radiated from left side peripheral LED lamp 46 facilitates the right side of floodlight emission mode, and radiates from right side peripheral LED light 48
Light facilitate the left side of floodlight emission mode.In this embodiment, so that all three LED light 44,46,48 are powered generation
The general photoemissive light beam of lateral left and right side passes through the phase of three LED light 44,46,48 side or lower section in the horizontal plane
To less transmitting.
Fig. 5 shows row's LED illumination module 50 according to all aspects of this disclosure, and each LED illumination module 50 has
Three LED light 52,54,56 in a row are arranged behind TIR light element 22, are similar to shown in Fig. 4 B.Multiple rows of LED light
52, it 54,56 is aligned along common axis B, is installed together by three groups of (or more group) LED illumination modules 50 to be formed and can be used as letter
The light-emitting section (not shown) of number device.In this embodiment, each LED light 52,54,56 emits the light of different colours (wavelength).
For example, in every group of three LED light, a lamp is amber light 52, and a lamp is blue lamp 54, and a lamp is red light 56.As above
Described, only center lamp will generate the focus on light beam being aligned with the axis of optical element 22, and other lamps are directly through transmitting mould
Formula supplements low focus emission.In the lighting system designed for generating three kinds of colors, any color is placed in all three
The center of kind TIR light element 22, then mean that other two kinds of colors can not always focus, and the light emitting mould of different colours
Formula will be unbalanced.In the 5 embodiment of figure 5, the focus of each TIR light element is arranged in a chip of each color
Place.In two TIR light elements, color is not in center, and color is once in leftward position, once in right positions.When
When each color is all powered, the mode of this three-colour light-emitting lamp (or chip on common substrate) will generate the transmitting mould of balance
Formula, one of chip are located at center, and a chip is located at right positions, and a chip is located at leftward position.
Fig. 6 shows the LED light 60 according to all aspects of this disclosure.Luminescent wafer 64 positioned at the center of bracket 62 is by list
The peripheral wafer 66 of the form of a extension luminescent wafer surrounds.In the configuration, Center Wafer 64 and peripheral wafer 66 are to separate
Control.The energy for being transmitted to Center Wafer 64 and peripheral wafer 66 can change, and be emitted from hot spot light beam to floodlight with generating
The optical transmission mode of mode, wherein the characteristic of respective emission mode depends on the optical element of processing light.The embodiment can be with
In the case where no moving parts, by can have single focus optical element generate hot spot, floodlight, combination hot spot/
Floodlight or the variation between them.Peripheral wafer 66 is around according to the another of " ring " of the Center Wafer 64 of various aspects of the present disclosure
A example.
Fig. 7 is the top view according to the exemplary L ED transmitter 100 of all aspects of this disclosure.Aluminium oxide (Al2O3) base
Plate 112 can support multiple LED wafers, and one of LED wafer 114 is arranged in center.Substrate 112 can be by other materials
(including alternative ceramic material) is constituted.In this embodiment, peripheral LED chip 116 is arranged in around center LED wafer
In 114 annulus.As schematically illustrated in figure 8, each ring of peripheral LED chip 116a, 116b, 116c are connected to and center
Chip 114 is separately energized and is powered each other.LED wafer 116a, 116b, the 116c for constituting each ring are electrically connected to each other,
Therefore all wafers in ring are powered simultaneously.As shown in figure 8, Center Wafer 114 has the anode 120 and cathode 122 of own,
And 116 share common anode 120 of peripheral wafer, wherein each ring of peripheral wafer 116a, 116b, 116c is respectively provided with individually
Cathode 122a, 112b, 122c.Controller 128 is connected to cathode 122,122a, 112b, 122c of every string LED wafer 114,116
On, with control selections it is applied to the power of every string as described above.The illustrative transmitter 100 of Fig. 7 has in inner ring
There are 9 peripheral wafer 116a, and is respectively provided with 12 peripheral wafers 116b, 116c in each middle ring and outer ring.Peripheral wafer
116 quantity, shape and geometrical arrangements can be different from the present embodiment.
In addition, the width of each inner ring, middle ring and outer ring can be designed to be able to place more or less peripheral wafer
116a, 166b, 116c or each peripheral wafer 116 can generate luminous flux, which is selected as offer for peripheral wafer
The luminous flux of the expected combination maximum value of 116 each ring (or group).Substrate 112 is configured to dissipate and be produced by peripheral wafer 116
Raw heat.Fig. 7 shows transmitter 100, wherein the radial spacing of the chip 116 in each ring and radial dimension substantially phase
Deng.Chip 116 is shown as rectangle, the radius of the narrow side of the rectangle perpendicular to transmitter 100.However, each outer ring can be set
It counts into broader radial dimension, to allow greater number of peripheral wafer 116c or larger sized chip or chip to exist
Arrangement in the radial direction, rather than the circumferential direction illustrated.Selectively, the chip 116 in outer collarette can apply bigger
Power, lead to bigger luminous flux to fill the periphery of floodlight emission mode.
In the transmitter of Fig. 7, LED wafer 114,116 is configured as closed regular polygon, and uses the indigo plant in spectrum
The indium nitride of color part transmitting light sows (InGaN) semiconductor, combines with yttrium-aluminium-garnet (YAG) phosphor (doped with cerium).Greatly
The blue photons of most LED are absorbed by the phosphor, and are re-emitted in the yl moiety of spectrum.Remaining blue photons and yellow light
The eyes that are mixed into of illumination provide good approximate white light.Phosphor interspersion is in the ring for covering and protecting LED wafer 114,116
In oxygen resin layer 118.This configuration means that the light from each chip is combined to produce with from the light of other adjacent chips
" patch " of light.In disclosed transmitter 100, this configuration causes light emitting area to expand as each wafer ring is powered
Exhibition.Other wafer materials and/or other phosphor materials be can choose to generate color in addition to white, it is also an option that not
With wafer material and different phosphor materials, in the case where no moving parts, with generate can change simultaneously color and
The light of beam shape.
Each LED wafer 114,116 must be by applying voltage forward bias, which becomes according to the type of LED
Change.Multiple LED wafers, which are connected in series, allows the LED wafer being connected in series to be also turned on and disconnect, but also needs to concatenated
LED wafer applies the voltage for being sufficient to make each chip forward bias.Required voltage be connected in series all LED wafers just
To the sum of bias voltage.Voltage needed for opening single led chip can be 3.5V, therefore ten strings in these LED wafers
Connection will need over the voltage source of 35V.Electrical system in motor vehicles is usually 12VDC or 24VDC system.When a string of connection
When voltage needed for LED wafer is more than voltage available, it is necessary to using available 12VDC or 24VDC capable of being converted to required electricity
The Switching Power Supply of pressure.Selectively, LED wafer can by it is short it is concatenated in a manner of contact and connect, wherein the LED wafer in the string
The sum of forward voltage is no more than voltage available.Fig. 8 show arrangement there are three concatenated chip peripheral wafer 116a, 116b,
116c, and these concatenated chip strings connect in parallel.The case where LED wafer needs the forward voltage of 3.5V
Under, three LED wafers of series connection can be run in the vehicle electrical systems of the 12VDC of not Switching Power Supply.It can be excellent
Choosing is effectively to be matched to relatively low forward bias voltage in vehicle using the Switching Power Supply for Center Wafer
Available 12VDC or 24VDC.
Fig. 7 also shows insertion epoxy resin and is connected to the conductor 124 of anode and cathode electrical connection.Bonding wire 126 will be every
A peripheral wafer 116 is connected in series to another chip, wherein one end of every shish-kebab piece 116 is connected to anode and the other end connects
To cathode electrode, as shown in Figure 8.Conductor 124 and bonding wire 126 can be metallic conductor (such as conducting wire) or can be by
The conductive material (not shown) being deposited on substrate 112 is constituted.Conductive material can be by physical vapour deposition (PVD) or this field
The other technologies known are deposited on substrate.
Fig. 9 is the cross-sectional view comprising the alternate embodiment of the lighting module 200 of transmitter 100 in Fig. 7 and Fig. 8.From transmitting
The light that device 100 radiates is redirected by reflector 212 and lens 214.In embodiment of the disclosure, reflector 212 and thoroughly
Mirror 214 is about axis A rotational symmetry, the axis A and optical axis A centered on the Center Wafer 114 of transmitter 100OIt is overlapped.Reflection
Device 212 and lens 214 are configured to the light emitted from Center Wafer 214 being collimated into light beam substantially.Light is on a series of tracks
It is radiated from the Center Wafer 114 of transmitter 100, some of tracks are incident on reflector 212 (wide-angle light), and some rails
Mark is incident on lens 214 (narrow angle light).Lens 214, which have, diameter and to be located in reflector, therefore from Center Wafer 114
Most of light that transmitter 100 radiates is not through lens 214, is exactly redirected by reflector 212.The lighting module of Fig. 9
200 light for being configured to generate from the Center Wafer 114 of transmitter 100 just generate hot spot beam emissions mode.Hot spot light beam can
To have the diverging between 5 ° to 15 °, this depends on the desired use of module 200.The optics of reflector 212 and lens 214
System is configured as, and the light that will be radiated with wide-angle from Center Wafer 114 relative to the optical axis of Center Wafer is re-introduced into phase
For optical axis AOWith the reflection of much smaller angle or refraction track.In the disclosure, this emission mode is referred to as " collimated light
Beam ", but degree of collimation is selected according to the preference of engineer, to be suitable for specific purposes.In most cases, in
The radiation mode of heart chip 114 is the diverging " forming " by reducing the light from Center Wafer relative to axis A.
As previously mentioned, being radially offset from the optical axis A of Center Wafer from the light that peripheral wafer 116a, 116b, 116c emitO, and
And each ring has gradually bigger be radially offset from.Light from the position that transmitter 100 radiates determine by reflector 212 and/
Or the path of the light of lens 214.In general, the light radiated from transmitter 100 is away from optical axis AOIt is remoter, passing through reflector 212
And/or after lens 214, from optical axis AOThe angle of diverging is bigger.It is successively powered outward to the ring of LED wafer from center,
It generates from gradually wide " floodlight " optical transmission mode of module 200.
Figure 10 is the mode according to shown in table 1 and Figure 11, by be applied to Center Wafer 114 and peripheral wafer 116a,
The different capacity mode of the ring of 116b, 116c, the graphical representation of the light emitted from module 200.Each Center Wafer 114 and periphery
The ring of chip 116a, 116b, 116c can individually be powered, and can be modulated by pulse width known in the art
(PWM) technology controls the amount of the effective power for being applied to every group of LED wafer.Table 1 and Figure 11 show power transmission mode
One representative example, the power transmission mode generate variable divergence optical transmission mode from module 200.Figure 10 is according to 1 He of table
The mode of Figure 11, when electric energy is applied to such as LED wafer, the graphical representation of the light beam emitted from module 200.Optical transmission mode is bright
It is aobviously that floodlight emits light beam from the development of close collimated light beam, wherein close collimated light beam has to any side central axis A
The divergence less than 5 ° is dissipated, floodlight is emitted light beam and dissipated from central axis with about 7.5 ° of angle.Four groups are transmitted to by changing
The power of LED wafer generates the variation of the beam shape by less diverging (hot spot) to more divergings (floodlight).It should be noted that
It is that be applied to the changed power of LEDs group be not linear.The shape of chip 114,116 and position and by come from peripheral wafer
116 light filling large area emission mode it is meant that from peripheral wafer 116 emit light with from Center Wafer 114 emit
Light is compared to seeming less strong, and therefore, 114 power ratio of Center Wafer increases to the function of the ring of peripheral wafer 116a, 116b, 116c
Rate reduces faster, as shown in Figure 11 and table 1.
The luminous flux generated around each wafer ring of Center Wafer arrangement is proportional to the electric current for being transmitted to chip.Each
Ring has highlight flux, and the flux which generates when being driven under sustained ceiling current by each chip determines.
Sustained ceiling current removes the limit of the thermal capacity of the transmitter substrate of heat by the capacity of the conductor of connection chip and from chip
System.Transmitter may be configured so that the luminous power of each ring as ring is gradually distance from optical axis (across the center of Center Wafer)
And increase.The relationship of luminous power between ring can be nonlinear, such as exponential relationship or logarithmic relationship.Outer ring can compare
Inner ring is much brighter, luminous flux needed for the big peripheral region to generate filling floodlighting mode.When ring be configured with from inner ring to
Outer ring in a non-linear manner increased light emitting capacity when, the power for being applied to each ring can be in the power of the chip in each ring
Increase in process range.It is produced from hot spot light illumination mode to wafer ring balance power during floodlighting mode transition, is applied to
The raw optical axis along lighting module has the light illumination mode of the peak brightness clearly defined.As shown in Figure 10, from hot spot to floodlight
The illumination curve of each step in preceding 11 steps of transition has the peak value individually clearly defined along optical axis, and without secondary
Off-axis peak value.Elementary beam keeps this elementary beam profile to provide one kind for most of transition from hot spot to floodlight
There is no the light illumination modes for the bright spot that may interfere with scene visual processing.
In transmitter shown in Fig. 7, the inner ring and middle ring of Light-Emitting Diode (LEDs) in total power never to drive.This
Mean that these rings are configured with from original luminous power.In another exemplary embodiment, can more effectively match
Outer ring is set to provide with luminous flux required for the peripheral region of required intensity filling floodlight beam, then by Center Wafer and outer ring
Between each ring be configured to when each ring with its power handling capability or close to its power handling capability driving when, with provide fill out
Luminous flux needed for filling beam profile.
Hot spot light beam is generally more appropriate for long distance illumination or zonule bright illumination, closely to carry out detailed work
Make.Floodlight emission mode is generally more appropriate for illuminating large area or the observation of short-range wide-angle.Figure 12 is shown according to the disclosure
Various aspects include lighting module 200 a light source 300.The target 302 at first distance D1 apart from light source 300 can be used
Focus on light beam illuminates completely.Second target 303 at the distance D2 closer to light source 300 can only be by identical beam shape
Partly illuminate.Second target 303 can be illuminated completely by the light beam with the bigger angle of divergence.One example of this target
It may be the suspect of scene of a crime.For law enfrocement official, it can be seen that the arm and hand of this people, so that it is determined that this people
The threat types shown are very useful.Focus on light beam may not be able to illuminate entire people, it is thus possible to invisible arm and hand.
Change light beam shape will enable law enfrocement official accurately assess situation.The shape of light beam can be by being manually entered (example
Such as dial or sliding block) change.Control circuit, which can be configured as, to be applied to according to user in the operation of input terminal to adjust
The power of LED wafer.This headlamp can be used for police car and search and rescue to provide variable hot spot illumination on vehicle, and can be with
The lane lamp with variable beam shape is used to improve the visibility of target or scene away from vehicle different distance.
In an alternative embodiment, the light source 300 of Figure 12 can arrive mesh equipped with a rangefinder 320 to determine
Target distance, and beam shape is adjusted according to this distance.Rangefinder can be laser range finder or known in the art other non-
Contact distance measuring method, such as ultrasonic range finder.According to distance controlling beam shape can there are many applications, including flash lamp
Or other bases change the portable lighting lamp of width of light beam at a distance from object.One example is the photograph of construction area warning
Bright, the visible focus on light beam of medium and long distance can be used to warn the vehicle of distant place, but when vehicle close to when, light beam will gradually
Become less to focus, thus driver will not be made dizzy, to provide better illumination for scene.For weapon or photograph
The sighting system of machine is alternatively possible application, and wherein light beam is configured to according to illuminating target at a distance from lighting module.
When target is relative to weapon or mobile imaging system, ranging can be used for continuously changing the shape of light beam.
Figure 13 be include transmitter 402 lighting module 400 another embodiment cross-sectional view.What transmitter 402 radiated
Light is redirected by reflector 412 and lens 414.In embodiment of the disclosure, reflector 412 and lens 414 are about axis A
Symmetrically, axis A is surrounded and the optical axis A centered on the Center Wafer 414 of transmitter 402OIt is overlapped.412 He of reflector
Lens 414 are configured to that the light emitted from Center Wafer 414 is made to be collimated into light beam substantially.Light is on a series of tracks from transmitter
402 Center Wafer 414 radiates, and some of tracks are incident on reflector 412 (wide-angle light), and some of tracks enter
(narrow angle light) is penetrated on lens 414.Lens 414 have diameter and are located in reflector, therefore emit from Center Wafer 414
Most of light that device 402 radiates is not through lens 414, is exactly redirected by reflector 412.Lighting module in Figure 13
400 light for being configured to generate from the Center Wafer 414 of transmitter 402 just generate hot spot beam emissions mode.Hot spot light beam can
To have the reflection between 5 ° to 15 °, this depends on the desired use of module 400.The optics of reflector 412 and lens 414
System is configured as, and the light that will be radiated with wide-angle from Center Wafer 414 relative to the optical axis of Center Wafer is re-introduced into phase
For optical axis AOWith much smaller angle reflection or refraction track.In most cases, the radiation mode of Center Wafer 414 is
By reducing diverging " forming " of the light from Center Wafer relative to axis A.
As previously mentioned, being radially offset from the optical axis A of Center Wafer from the light that peripheral wafer 416a, 416b, 416c emitO, and
And each ring has raised position relative to Center Wafer 414 and respective inner ring.It determines from the position of 402 radiant light of transmitter
Determine light and passes through the path of reflector 412 and/or lens 414.In general, the light radiated from transmitter 402 is away from optical axis AOMore
Far, after reflector 412 and/or lens 414, from optical axis AOThe angle of diverging is bigger.In addition, the raised position of each ring makes
Corresponding peripheral wafer 416a, 416b, 416c closer to reflector 412, this allow these chips can project light onto from
Optical axis AOFarther position.The respective raised position peripheral wafer 416a, 416b, 416c further allows broader floodlight to emit
Mode, while diameter needed for advantageously not increasing transmitter 402.The raised position of peripheral wafer 416a, 416b, 416c it is another
One advantage is also to provide a bigger chance to enhance the heat dissipation of the substrate of transmitter 402.Positioned at peripheral wafer 416a,
The region of 416b, 416c and the transmitter 402 of 414 lower section of Center Wafer can be filled with highly heat-conductive material, or provide convolution
Surface region (not shown) is in the cloth for wherein having the coolant liquid (air or liquid) recycled at the convoluted surface of transmitter 402
Set middle heat dissipation.It is successively powered, can produce from gradually wide " floodlight " the light hair of module 400 to the ring of LED wafer outward from center
Emission mode.
Disclosed lighting module, which can be configured as, generates the sightless light of human eye, such as infrared (IR) light.With can
Infrared (IR) light of deformation shape can be used in night observation device, reason with as visible light for searchlight and for night and
It is identical as other type of lighting that night observation device is used in combination.
For vehicle headlamp system usually using at least two luminaires, one is used for remote visual distance light, another
For the dipped beam in opposing traffic when driving.The lighting module according to the disclosure can be used, so that luminaire can be with
Change beam shape to generate two kinds of emission modes of distance light and dipped beam.
Aircraft, which generallys use, can generate long range, the landing light of collimated light beam and with wide floodlight emission mode
Taxiing light.It can be used according to the lighting module of the disclosure and generate single aeronautical light, which can provide simultaneously
Land and wheel function, to eliminate the weight and expense of independent lamp.The combination of land lamp and taxiing light may include velocity pick-up
Device, only when the speed of aircraft shows aircraft at ground, sliding beam shape just be can be used.
LED based growth lamp also can benefit from the emission mode changed automatically.Focusing on light beam on seedling can be with
It is controlled to expand to the span comprising growing plant.The shape of light beam can according to crown measurement distance or according to
The a few hours of process or day/night circulation are to change.It can also be by providing the combination of peripheral wafer and/or chip phosphor
(it emits the light different from Center Wafer wavelength), to change the wavelength of the light emitted from growth lamp consistent with the shape of light beam.
The color of the wavelength or light that change growth light can be used to simulate the variation in season, or for adjusting the color of growth light, with full
Sufficient plant is in its growth or the needs of the different phase of processing maturation period.
According to all aspects of this disclosure, the shape of the light beam from disclosed luminaire can become according to various variables
Change, including but not limited to the angle orientation of speed, height, distance, GPS location, the input from Vehicular system or luminaire.One
A example is headlamp, and when angle position, instruction wearer overlooks downwards the ground in front of them, headlamp changes floodlight
Beam shape, and when wearer's new line needs to see distant place, beam shape is changed into a light beam by headlamp.It can be equipped with and be
System is for measuring the light reflected by disclosed lighting module institute illuminated target.Reflected light can be used to change light beam
Shape, until reflected light reaches maximization, this shows that the shape of light beam and the size of target and distance match.Accelerometer, GPS
The shape control input that sensor, altimeter and Other Instruments can be used to provide for changing light beam.
Disclosed luminaire be can control to generate the alternate variable hair accomplished continuously or intermittently between hot spot and floodlight
Emission mode.This changeable mode may be used as attracting the caution signal of attention, can also be used to make individual or group people or
Animal is got lost or Whiteout.Special variable beam mode can be used for aircraft to avoid bird collisions.
The control of beam shape can by be manually entered, automatically control or by network remote signal/wireless signal or
Native wireless signals (such as bluetooth or WiFi) Lai Shixian.It can be by being mounted on mobile phone, plate according to the lighting module of the disclosure
Application program (app) control on computer or other equipment, application program (app) are provided as communicating with the lighting module
's.For example, lighting module can be equipped with a bluetooth transceiver, and communicated by bluetooth with mobile phone or tablet computer.
Claims (20)
1. a kind of LED lamp component, comprising:
Multiple luminescent wafers, each luminescent wafer have the optical axis centered on light emitting area, and the multiple luminescent wafer is set
It sets on bracket；
Pack optical element has focus and the cloth together with the optical axis of the first luminescent wafer in the multiple luminescent wafer
It sets, which passes through the focus, so that being collimated into from the light that first luminescent wafer emits relative to described first
The light beam of the optical axis of luminescent wafer；
Wherein, the multiple luminescent wafer in addition to first luminescent wafer is arranged at least multiple rings, each ring packet
Include multiple luminescent wafers centered on the optical axis, and from the multiple hair in addition to first luminescent wafer
The light of light chip transmitting, emits in the spread angle range relative to the optical axis from the pack optical element, the diverging
Angular region is greater than first angle of divergence.
2. LED lamp component according to claim 1, wherein first luminescent wafer and remove first luminescent wafer
The multiple luminescent wafer in addition can independently be powered.
3. LED lamp component according to claim 1, wherein the LED lamp component is connected to controller, the controller root
Change according to input be supplied to first luminescent wafer power and being supplied to be arranged in it is described more at least one described ring
The power of a luminescent wafer.
4. LED lamp component according to claim 3, wherein the input selected from by optical assembly Angle Position, to target away from
From, speed, height and GPS location composition group.
5. LED lamp component according to claim 1, wherein the multiple luminescent wafer is arranged on common support.
6. LED lamp component according to claim 1, wherein the combination output of the multiple luminescent wafer has substantially
Even brightness output.
7. LED lamp component according to claim 1, wherein first luminescent wafer emits the light of the first color, this
One color is different from the color of light emitted from the multiple luminescent wafer in addition to first luminescent wafer.
8. LED lamp component according to claim 1, wherein the luminous power that first luminescent wafer has, which is less than, to be removed
The luminous power of the multiple luminescent wafer other than first luminescent wafer.
9. LED lamp component according to claim 1, wherein the multiple luminescent wafer in addition to the first luminescent wafer
It can separately be powered with first luminescent wafer, and each of the multiple luminescent wafer chip can exist with setting
The other luminescent wafer is powered together in same ring.
10. LED lamp component according to claim 1, wherein each wafer ring has total luminous power, and each ring
Total luminous power be greater than radially inward ring total luminous power.
11. a kind of LED lamp component, comprising:
Multiple luminescent wafers, each luminescent wafer have the optical axis centered on light emitting area, and the multiple luminescent wafer is set
It sets on bracket；
Pack optical element has focus and arranges together with the optical axis of the first luminescent wafer of the multiple luminescent wafer,
The optical axis passes through the focus, shines so that being collimated into from the light that first luminescent wafer emits relative to described first
The light beam of the optical axis of chip；
Wherein, the multiple luminescent wafer in addition to first luminescent wafer be set as from first luminescent wafer along
First axle is positioned close to the position of the pack optical element, also, from described more in addition to first luminescent wafer
The light that a luminescent wafer issues emits in the spread angle range relative to the optical axis from the pack optical element, described
Spread angle range is greater than first angle of divergence.
12. LED lamp component according to claim 11, wherein first luminescent wafer and except described first shine crystalline substance
The multiple luminescent wafer other than piece can independently be powered.
13. LED lamp component according to claim 11, wherein the LED lamp component is connected to controller, the controller
Changed according to input be supplied to first luminescent wafer power and being supplied to be arranged at least one described ring described in
The power of multiple luminescent wafers.
14. LED lamp component according to claim 11, wherein the input selected from by optical assembly Angle Position, to target
Distance, speed, the group of height and GPS location composition.
15. LED lamp component according to claim 11, wherein the multiple luminescent wafer is arranged on common support.
16. LED lamp component according to claim 11, wherein at least multiple described in addition to first luminescent wafer
Luminescent wafer is arranged at least one ring centered on the optical axis.
17. LED lamp component according to claim 11, wherein first luminescent wafer emits the light of the first color, should
First color is different from the color of light emitted from the multiple luminescent wafer in addition to first luminescent wafer.
18. LED lamp component according to claim 11, wherein first luminescent wafer is greater than except described first shines
The multiple luminescent wafer other than chip.
19. LED lamp component according to claim 11, wherein the multiple luminous crystalline substance in addition to the first luminescent wafer
Piece can separately be powered with first luminescent wafer, and each of the multiple luminescent wafer chip can be with setting
The other luminescent wafer is powered together in same ring.
20. LED lamp component according to claim 11, wherein first luminescent wafer and except described first shine crystalline substance
Each of the multiple luminescent wafer except piece chip can independently be powered.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/383,469 | 2016-12-19 | ||
| US15/383,469 US10400994B2 (en) | 2016-12-19 | 2016-12-19 | LED illumination module with fixed optic and variable emission pattern |
| US201762547454P | 2017-08-18 | 2017-08-18 | |
| US62/547,454 | 2017-08-18 | ||
| PCT/US2017/067364 WO2018118955A1 (en) | 2016-12-19 | 2017-12-19 | Led illumination module with fixed optic and variable emission pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110249177A true CN110249177A (en) | 2019-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780084737.8A Pending CN110249177A (en) | 2016-12-19 | 2017-12-19 | LED illumination module with fixing optical element and variable transmission mode |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP3555525A1 (en) |
| JP (1) | JP2020502744A (en) |
| KR (1) | KR20190099026A (en) |
| CN (1) | CN110249177A (en) |
| AU (1) | AU2017379823A1 (en) |
| CA (1) | CA3047545A1 (en) |
| IL (1) | IL267272A (en) |
| MX (1) | MX2019007317A (en) |
| WO (1) | WO2018118955A1 (en) |
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| CN111237682A (en) * | 2020-03-09 | 2020-06-05 | 深圳市睿智龙电子科技有限公司 | Shadowless lighting device and lighting method thereof |
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| CN109143753A (en) * | 2018-09-08 | 2019-01-04 | 深圳阜时科技有限公司 | A kind of optical module, optical projection mould group, sensing device and equipment |
| CN110941131B (en) * | 2018-09-21 | 2023-03-14 | 深圳阜时科技有限公司 | Light source structure, optical projection module, sensing device and equipment |
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- 2017-12-19 MX MX2019007317A patent/MX2019007317A/en unknown
- 2017-12-19 WO PCT/US2017/067364 patent/WO2018118955A1/en active Application Filing
- 2017-12-19 EP EP17829824.6A patent/EP3555525A1/en not_active Withdrawn
- 2017-12-19 AU AU2017379823A patent/AU2017379823A1/en not_active Abandoned
- 2017-12-19 JP JP2019531420A patent/JP2020502744A/en active Pending
- 2017-12-19 CA CA3047545A patent/CA3047545A1/en active Pending
- 2017-12-19 KR KR1020197021036A patent/KR20190099026A/en unknown
- 2017-12-19 CN CN201780084737.8A patent/CN110249177A/en active Pending
-
2019
- 2019-06-12 IL IL267272A patent/IL267272A/en unknown
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| CN101878392A (en) * | 2007-11-08 | 2010-11-03 | 建兴电子科技股份有限公司 | Electro-optical based lamp/fixture forcontinuous control of led light beam position and focus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111237682A (en) * | 2020-03-09 | 2020-06-05 | 深圳市睿智龙电子科技有限公司 | Shadowless lighting device and lighting method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| MX2019007317A (en) | 2019-09-05 |
| EP3555525A1 (en) | 2019-10-23 |
| IL267272A (en) | 2019-08-29 |
| JP2020502744A (en) | 2020-01-23 |
| WO2018118955A1 (en) | 2018-06-28 |
| KR20190099026A (en) | 2019-08-23 |
| CA3047545A1 (en) | 2018-06-28 |
| AU2017379823A1 (en) | 2019-07-11 |
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Application publication date: 20190917 |