CN110246885A - A kind of display panel - Google Patents
A kind of display panel Download PDFInfo
- Publication number
- CN110246885A CN110246885A CN201910579188.2A CN201910579188A CN110246885A CN 110246885 A CN110246885 A CN 110246885A CN 201910579188 A CN201910579188 A CN 201910579188A CN 110246885 A CN110246885 A CN 110246885A
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- 239000002184 metal Substances 0.000 claims abstract description 239
- 229910052751 metal Inorganic materials 0.000 claims abstract description 239
- 230000007704 transition Effects 0.000 claims abstract description 171
- 238000004806 packaging method and process Methods 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 150000002739 metals Chemical class 0.000 claims description 17
- 238000005538 encapsulation Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 230000002035 prolonged effect Effects 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000004744 fabric Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000009413 insulation Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910003978 SiClx Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the present invention provides a kind of display panel, including being set on first substrate display area and around the packaging area of display area, is additionally provided with power supply signal binding terminal area far from the side of display area in packaging area；Terminal area direction is bound from display area to power supply signal, packaging area includes the first wiring region, the second wiring region and wiring transition region, and wiring transition region is set between the first wiring region and the second wiring region；It is set to the first metal wiring layer of the first wiring region；It is set on the first metal wiring layer and covers the first insulating layer of the first metal wiring layer, the first insulating layer extends to wiring transition region and the second wiring region from the first wiring region；The second metal wiring layer being set on the first insulating layer of the first wiring region, wiring transition region, the second wiring region；In wiring transition region, the second metal wiring layer is arranged with transition bed course, and thickness of the transition bed course close to the first wiring region side is greater than the thickness close to the second wiring region side.
Description
[technical field]
The present invention relates to field of display technology more particularly to a kind of display panels.
[background technique]
Organic light emission (Organic Light-Emitting Diode, hereinafter referred to as OLED) display panel has master because of it
It is dynamic to shine, high contrast, no angle limit, many advantages, such as Flexible Displays can be achieved and be widely used in display technology neck
Domain.
Currently, in order to improve the water resistant oxygen characteristic of each OLED device in OLED display panel, it will usually use packaging plastic
(frit) display panel is packaged.In specific production, need that packaging plastic is arranged in packaging plastic setting area.In packaging plastic
The film layer setting of setting area is complicated, and there are overlapping regions between multi-layer metal wiring layer, and there is also non-overlapping regions, is located at upper
Layer metal wiring layer from be located at lower layer metal wiring layer overlapping region extend to and positioned at lower layer metal wiring layer not
When overlapping region, because difference in height exists, it is be easy to cause the fracture of the metal wiring layer on upper layer, it is bad so as to cause showing.
[summary of the invention]
In view of this, the embodiment of the present invention provides a kind of display panel, including first substrate, the first substrate includes aobvious
Show region and the packaging area around the display area, is also set up in the packaging area far from the side of the display area
There is a power supply signal to bind terminal area；Terminal area direction, the envelope are bound from the display area to the power supply signal
Filling region includes the first wiring region, the second wiring region and wiring transition region, and the wiring transition region is set to first wiring
Between area and second wiring region；It is set to the first metal wiring layer of first wiring region；It is set to first gold medal
Belong on wiring layer and cover the first insulating layer of first metal wiring layer, first insulating layer is from first wiring region
Extend to the wiring transition region and second wiring region；It is set to first wiring region, wiring transition region, the second wiring
The second metal wiring layer on first insulating layer in area；In the wiring transition region, second metal wiring layer is arranged with
Transition bed course, thickness of the transition bed course close to first wiring region side are greater than close to second wiring region side
Thickness.
Optionally, the transition bed course from close to first wiring region side to close to second wiring region side,
Its thickness is gradually reduced.
Optionally, in the wiring transition region close to second wiring region side, the side and bottom of the transition bed course
The angle in face is less than or equal to 70 degree.
Optionally, the transition bed course is set between second metal wiring layer and first insulating layer.
Optionally, third metal wiring layer is additionally provided between first insulating layer and second metal wiring layer
And second insulating layer；The third metal wiring layer is set on the first insulating layer of first wiring region, and described second absolutely
Edge layer is set on the third metal wiring layer and covers the third metal wiring layer, and the second insulating layer is from described
One wiring region extends to the wiring transition region and second wiring region.
Optionally, the transition bed course is set between second metal wiring layer and the second insulating layer；Alternatively,
The transition bed course is set between the third metal wiring layer and first insulating layer.
Optionally, the transition bed course includes First Transition bed course and the second transition bed course；The First Transition bed course is set
It is placed between second metal wiring layer and the second insulating layer；Alternatively, the First Transition bed course is set to described
Between three metal wiring layers and the second insulating layer；The second transition bed course is set to the third metal wiring layer and institute
It states between second insulating layer；Alternatively, the second transition bed course is set to first metal wiring layer and first insulation
Between layer.
Optionally, the material of the transition bed course is silicon nitride or silica.
Optionally, the transition bedding plane to the side of second metal wiring layer be smooth plane；Alternatively, described
Transition bedding plane is provided with protrusion and sunk structure to the side of second metal wiring layer；Alternatively, the transition bedding plane
It is set as step-like to the side of second metal wiring layer.
Optionally, the packaging area further includes reflective metals setting area, and area and described second is arranged in the reflective metals
Wiring region is disposed adjacent, and reflective metals setting area is provided with the first reflective metal layer.
Optionally, the film layer difference in height of the reflective metals setting area and second wiring region is less than or equal to 7000 angstroms.
Optionally, second metal wiring layer includes power supply signal cabling, is provided with and answers in the power supply signal cabling
Power evacuation aperture；Filled layer is provided in the stress evacuation aperture；The filled layer belongs to the first metal layer；Alternatively, institute
It states filled layer and belongs to the third metal layer；Or the filled layer belongs to the transition bed course.
Optionally, the second reflective metals are additionally provided between first reflective metal layer and second metal wiring layer
Layer, second reflective metal layer and first reflective metal layer, the second metal wiring layer no overlap.
Optionally, the display panel is organic light emitting display panel, and the organic light emitting display panel further includes second
Substrate；The second substrate and the first substrate are bonded by being set to the encapsulated layer of the packaging area.
In the embodiment of the present invention, transition pad layer is set under the second metal wiring layer for being located at upper layer, and transition is arranged
The structure of bed course is the thickness that the thickness close to the first wiring region side is greater than close second wiring region side, so absolutely by first
Edge layer the first wiring region and wiring transition region between step-like segment difference at formed a gentle slope surface, the slope surface at
Second metal wiring layer of film can form continuous film surface, and the second metal line fault rupture will not occur or wiring is unequal
Situation avoids the second metal wiring layer and occurs to be routed undesirable defect in packaging area, improves the quality of display panel.
[Detailed description of the invention]
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for this field
For those of ordinary skill, without creative efforts, it can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is the schematic diagram for the display panel that the embodiment of the present invention one provides；
Fig. 2 is the enlarged diagram of a-quadrant in Fig. 1；
Fig. 3 is the schematic diagram in Fig. 2 along the section BB '；
Fig. 4 to Fig. 8 is the structural schematic diagram of transition bed course in several different embodiments；
Fig. 9 provides the schematic diagram of display panel for embodiment a kind of in embodiment one；
Figure 10 is the schematic diagram of display panel provided by Embodiment 2 of the present invention；
Figure 12 is the schematic diagram for the display panel that another embodiment provides in embodiment two；
Figure 13 is the schematic diagram for the display panel that the embodiment of the present invention three provides；
Figure 14 is the schematic diagram for the display panel that a kind of specific embodiment of embodiment three provides；
Figure 15 is the schematic diagram for the display panel that another specific embodiment of embodiment three provides；
Figure 16 is the schematic diagram for the display panel that another specific embodiment of embodiment three provides；
Figure 17 is the schematic diagram in the section CC ' along Figure 16.
[specific embodiment]
For a better understanding of the technical solution of the present invention, being retouched in detail to the embodiment of the present invention with reference to the accompanying drawing
It states.
It will be appreciated that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
Its embodiment, shall fall within the protection scope of the present invention.
The term used in embodiments of the present invention is only to be not intended to be limiting merely for for the purpose of describing particular embodiments
The present invention.In the embodiment of the present invention and the "an" of singular used in the attached claims, " described " and "the"
It is also intended to including most forms, unless the context clearly indicates other meaning.
Embodiment one
Fig. 1 is the schematic diagram for the display panel that the embodiment of the present invention one provides, as shown, display panel 10 includes first
Substrate 11, first substrate 11 include display area 12 and the packaging area 13 around display area 12.It is separate in packaging area 13
The side of display area 12 is additionally provided with power supply signal binding terminal area 14.
Fig. 2 is the enlarged diagram of a-quadrant in Fig. 1, and Fig. 3 is the schematic diagram in Fig. 2 along the section BB ', as shown, from aobvious
Show on region 12 to power supply signal binding 14 direction of terminal area, packaging area 13 includes the first wiring region 15, the second wiring region
17 are set between the first wiring region 15 and the second wiring region 17 with wiring transition region 16, wiring transition region 16.
First wiring region 15 is provided with the first metal wiring layer 18.Optionally, which can be
Grid routing layer, including a plurality of grid cabling；Alternatively, first metal wiring layer 18 can be source electrode routing layer, including a plurality of
Source electrode cabling.In wiring transition region 16 and not set first metal wiring layer 18 in the second wiring region 17.
The first insulating layer 19 is provided on the first metal wiring layer 18, which covers the first wiring region 15
The first metal wiring layer 18, and the first insulating layer 19 also extends to wiring transition region 16 and the second cloth from the first wiring region 15
Line area 17.Since in wiring transition region 16 and not set first metal wiring layer 18 in the second wiring region 17, the first insulation
Layer 19 is not a smooth film surface, but has difference in height in the first wiring region 15 and wiring transition region 16.
The first wiring region 15, wiring transition region 16, the second wiring region 17 the first insulating layer 19 on be provided with the second gold medal
Belong to wiring layer 20.Because the first insulating layer 19 for being set to 20 lower section of the second metal wiring layer is not a smooth film surface,
Therefore the second metal wiring layer 20 for being set to 19 top of the first insulating layer is also not a smooth film surface, in the first wiring region
15 also have difference in height with wiring transition region 16.
In wiring transition region 16, the second metal wiring layer 20 is arranged with transition bed course 21, and the transition bed course 21 is close to the
The thickness of one wiring region, 15 side is greater than the thickness close to 17 side of the second wiring region.
In the prior art, the metal wiring layer positioned at upper layer is extended to from the metal wiring layer overlapping region for being located at lower layer
When the region not overlapped with the metal wiring layer for being located at lower layer, because difference in height exists, and the difference in height is one step-like
Segment difference, be easy to cause the fracture of the metal wiring layer on upper layer, so as to cause show it is bad.In the embodiment of the present invention, it is being located at
The structure that transition pad layer is arranged under second metal wiring layer on upper layer, and transition bed course is arranged is close to the first wiring region side
Thickness be greater than close to the second wiring region side thickness, in this way the first insulating layer the first wiring region and wiring transition region it
Between step-like segment difference at formed a gentle slope surface, the second metal wiring layer to form a film in the slope surface can the company of being formed
Continuous film surface, avoids the second metal line at situations such as the second metal line fault rupture or uneven thicknesses of layers will not occur
Layer occurs to be routed undesirable defect in packaging area, improves the quality of display panel.
Optionally, in wiring transition region 16 close to 17 side of the second wiring region, the side of transition bed course 21 and the folder of bottom surface
Angle is less than or equal to 70 degree.The angle of the side of transition bed course 21 and bottom surface, which is less than or equal to 70 degree, can guarantee formed thereon the
Two metal wiring layers 20 are also to be less than or equal to 70 degree in the angle of wiring transition region 16 and 11 place plane of first substrate, be less than etc.
The risk of the fracture of the second metal wiring layer 20 or thicknesses of layers unevenness can be further decreased in 70 degree of angular ranges, and
Angular range less than or equal to 70 degree is also easy to control the formation process of transition bed course 21.
Optionally, as shown in figure 3, transition bed course 21 is from close to 15 side of the first wiring region to close second wiring region 17 1
Side, thickness are gradually reduced.The above-mentioned shape of transition bed course 21 formed slope surface it is gentle and continuous, can step down thereon second
The wiring Quality advance of metal wiring layer 20.But the present invention is not limited thereto, and in other embodiments, the transition bed course is also
It can be other structures.As shown in figure 4, in one embodiment, first part of the transition bed course 21 close to the first wiring region
211 and there are a segment differences close to the second part 212 of the second wiring region, but the segment difference is small compared to the segment difference of the first insulating layer
Very much, the cloth line mass of the second metal wiring layer is not influenced.The structure of transition bed course can be for different from Fig. 3 and shown in Fig. 4
Other structures, as long as thickness of the setting transition bed course close to the first wiring region side is greater than the thickness close to the second wiring region side
Degree, so that it may reduce the segment difference of the first insulating layer by transition bed course, and then improve the cloth line mass of the second metal wiring layer.
Optionally, as shown in figure 3, side of the transition bed course 21 towards the second metal wiring layer 20 is smooth plane.But
The present invention is not limited thereto, and in other embodiments, which can also be other structures.Such as Fig. 5 to Fig. 8 institute
Show, in other embodiments, transition bed course 21 is provided with raised sunk structure towards the side of the second metal wiring layer, this is convex
Rise and sunk structure can be it is jagged, as shown in Figure 5；It can also be wavy, as shown in Figure 6；Or wedge, such as Fig. 7
It is shown；Or transition bed course 21 is set as step-like towards the side of the second metal wiring layer, as shown in Figure 8.Above-mentioned protrusion
Sunk structure can increase transition bedding plane to the roughness of the second metal wiring layer side, increase transition bed course 21 and the second gold medal
The contact surface for belonging to wiring layer increases film forming contact strength of second metal wiring layer on transition bed course, is not easy to strip off, into one
Step improves the cloth line mass of the second metal wiring layer.
Optionally, as shown in figure 3, transition bed course 21 is set between the second metal wiring layer 20 and the first insulating layer 19.
But the present invention is not limited thereto, and in other embodiments, which can also be arranged in other positions.Such as Fig. 9 institute
Show, in one embodiment, transition bed course 21 is set between the first metal wiring layer 18 and the first insulating layer 19.Transition pad
First metal wiring layer 18 of the layer 21 close to the first wiring region 15 is arranged, and the transition bed course 21 is close to positioned at the first wiring region
The thickness of 15 18 side of the first metal wiring layer is greater than the thickness close to 17 side of the second wiring region.Because in packaging area,
First wiring region 15 is provided with the first metal wiring layer 18, in wiring transition region 16 and not set first metal in the second wiring region 17
Wiring layer 18, wiring transition region 16, the second wiring region 17 and the difference in height of the first wiring region 15 are that the first metal wiring layer 18 is made
At, it is arranged in first metal wiring layer 18 of the wiring transition region 16 by transition bed course 21 close to the first wiring region 15, by first
Step-like segment difference caused by metal wiring layer 18 becomes a gentle slope surface, and the first insulating layer 19 is on the slope of transition bed course 21
Gentle slope surface can also be formed when forming a film on face, and then the second metal wiring layer 20 is also when forming a film on the first insulating layer 19
Situations such as forming continuous gentle film surface, the fracture of the second metal wiring layer 20 or uneven thicknesses of layers will not occur, avoids
Second metal wiring layer 20 occurs to be routed undesirable defect in packaging area, improves the quality of display panel.
Optionally, in structure shown in Fig. 9, side of the transition bed course 21 towards the second metal wiring layer 20 can be smooth
Plane, raised sunk structure also can be set.Transition bed course 21 is set as protrusion towards the side of the second metal wiring layer 20
Sunk structure, can with its increase and the first insulating layer 19 contact surface so that the first insulating layer 19 on transition bed course 21 at
Film contact strength increases, and is not easy to strip off.
The insulated with material material of transition bed course 21, optionally, the material of transition bed course 21 are silicon nitride or silica, nitrogen
The compactness and filming performance of SiClx or silica are good, are the good materials for the transition bed course to be formed.
Optionally, as shown in Figure 3 and Figure 9, bottom is additionally provided between first substrate 11 and the first metal wiring layer 18
Insulating layer 22, the metal layer and the first metal wiring layer 18 that bottom insulating layer 22 is used to that 22 lower layer of bottom insulating layer will to be located at completely cut off
Insulation or bottom insulating layer 22 are used for the wiring contact intensity of the first metal wiring layer of raising 18 disposed thereon.
Optionally, as shown in Figure 1, display panel can round display panel, but the present invention and be confined to this, the present invention mentions
The display panel of confession can also be rectangular display panel, or special-shaped display panel.
Optionally, display panel provided in an embodiment of the present invention is organic light emitting display panel, organic light emitting display panel
It further include the second substrate, the second substrate is set to the top of first substrate, the second substrate and first substrate by being set to encapsulation
The encapsulated layer in region is bonded.
In the embodiment of the present invention one, transition pad layer is set under the second metal wiring layer for being located at upper layer, and is arranged
The structure for crossing bed course is the thickness close to the first wiring region side greater than the thickness close to the second wiring region side, in this way first
Insulating layer forms a gentle slope surface at the step-like segment difference between the first wiring region and wiring transition region, in the slope surface
Second metal wiring layer of film forming can form continuous film surface, and the second metal line fault rupture or thicknesses of layers will not occur
Situations such as uneven, avoids the second metal wiring layer and occurs to be routed undesirable defect in packaging area, improves display panel
Quality.
Embodiment two
Figure 10 is the schematic diagram of display panel provided by Embodiment 2 of the present invention, as shown, display panel 40 includes the
One substrate 31, first substrate 31 includes display area and the packaging area around the display area, in packaging area far from aobvious
Show that the side in region is additionally provided with power supply signal binding terminal area.Terminal area side is bound from display area to power supply signal
To packaging area includes the first wiring region 35, the second wiring region 37 and wiring transition region 36, and wiring transition region 36 is set to first
Between wiring region 35 and the second wiring region 37.
First wiring region 35 is provided with the first metal wiring layer 38, is not set in wiring transition region 36 and the second wiring region 37
Set first metal wiring layer 38.The first insulating layer 39 is provided on the first metal wiring layer 38, which covers
First metal wiring layer 38 of the first wiring region of lid 35, and the first insulating layer 39 is also extended to from the first wiring region 35 and was routed
Cross area 36 and the second wiring region 37.Because in wiring transition region 36 and not set first metal wiring layer in the second wiring region 37
38, so the first insulating layer 39 is not a smooth film surface, but in the first wiring region 35 and the wiring formation of transition region 36
One step-like segment difference.
It is provided with third metal wiring layer 42 on the first insulating layer 39, is being routed transition region 36 and the second wiring region 37 not
The third metal wiring layer 42 is set.Second insulating layer 43 is provided on third metal wiring layer 42, the second insulating layer 43
The third metal wiring layer 42 of the first wiring region 35 is covered, and second insulating layer 43 also extends to wiring from the first wiring region 35
Transition region 36 and the second wiring region 37.Equally, because in wiring transition region 36 and the not set third hardware cloth in the second wiring region 37
Line layer 42, the second insulating layer 43 being formed on third metal wiring layer 42 are not smooth film surfaces, in 35 He of the first wiring region
Being routed transition region 36 has step-like segment difference.
Second metal is set in the first wiring region 35, wiring transition region 36, the second insulating layer 43 of the second wiring region 37
Wiring layer 30.Second metal wiring layer 30 also has height in the first wiring region 35 and wiring transition region 36, the second wiring region 37
Difference.
In wiring transition region 36, the second metal wiring layer 30 is arranged with transition bed course 41, and the transition bed course 41 is close to the
The thickness of one wiring region, 35 side is greater than the thickness close to 37 side of the second wiring region.Specifically, which is formed in
Between second metal wiring layer 30 and second insulating layer 43, as shown in Figure 10, by the way that transition bed course 41 is arranged, in the first wiring region
A gentle slope surface is formd in 35 segment differences step-like with the second insulating layer 43 of wiring transition region 36, is located at the second insulation
When the second metal wiring layer 30 on layer 43 forms a film, gentle film surface can be also formed according to the shape of the gentle slope surface, it will not
Situations such as fracture of the second metal wiring layer 30 or uneven thicknesses of layers occurs, avoids the second metal wiring layer 30 in encapsulation region
Domain occurs to be routed undesirable defect, improves the quality of display panel.
In addition, as shown in Figure 10, because the first metal wiring layer 38 is positioned only at the first wiring region 35, being formed thereon
First insulating layer 39 has segment difference between the first wiring region 35, wiring transition region 36.Third on the first insulating layer 39
Metal wiring layer 42 is also positioned only at the first wiring region 35, and the second insulating layer 43 being formed thereon is in the first wiring region 35, cloth
Segment difference between line transition region 36 is further increased, and film forming spreadability deteriorates, it is most likely that cannot cover third hardware cloth
The fringe region of line layer 42.The fringe region of third metal wiring layer 42 can be covered by the way that transition bed course 41 is arranged,
Avoid the short circuit between third metal wiring layer 42 and the second metal wiring layer 30.Transition bed course 41 is insulating materials, optional
Ground, the material of transition bed course 41 are that the compactness and filming performance of silicon nitride perhaps silica silicon nitride or silica are good, are
The good material of the transition bed course of formation.
Figure 11 is please referred to, for the schematic diagram for the display panel that another embodiment in embodiment two provides.With Figure 10 institute
Show structure the difference is that, transition bed course 41 is set between third metal wiring layer 42 and second insulating layer 43.
First metal wiring layer 38 is positioned only at the first wiring region 35, and the first insulating layer 39 being formed thereon is in the first cloth
There is segment difference between line area 35, wiring transition region 36.After forming 42 layers of third metal wiring layer, in third metal wiring layer 42
The wiring transition region 36 on upper layer forms the transition bed course 41 close to third metal wiring layer 42, and transition bed course 41 is in the first wiring region
35, it is routed between the film layer segment difference of transition region 36 and forms a gentle slope surface, second insulating layer 43, second disposed thereon
Metal wiring layer 30 is formed with this according to the gentle slope surface of underlying film layer in film forming, is also capable of forming gentle continuous film
Face, it is ensured that second insulating layer 43 is good to the spreadability of third metal wiring layer 42, moreover it is possible to guarantee the second metal wiring layer 30
Fracture will not occur or thicknesses of layers is unequal bad.Optionally, transition bed course can also be set to the first metal wiring layer
And first between insulating layer, can equally play that the insulating film layer spreadability for guaranteeing to be located at upper layer is good and the second metal line
Fracture or the unequal undesirable effect of thicknesses of layers will not occur for layer.
Figure 12 is please referred to, is the schematic diagram for the display panel that yet another embodiment provides in embodiment two, as shown,
Transition bed course includes First Transition bed course 411 and the second transition bed course 412.First Transition bed course 411 is set to the second hardware cloth
Between line layer 30 and second insulating layer 43, the second transition bed course 412 is set to third metal wiring layer 42 and the first insulating layer 39
Between.In structure shown in embodiment two, the film layer difference in height between the first wiring region 35 and wiring transition region 36 is because of two
Metal wiring layer, that is, caused by being positioned only at the first metal wiring layer 38 and third metal wiring layer 42 of the first wiring region 35,
It is formed at the segment difference caused by the first metal wiring layer 38 and third metal wiring layer 42 gently by the way that two transition bed courses are arranged
Slope surface, can play and optimize the film forming spreadability of insulating film layer disposed thereon, reduce segment difference between film layer, optimize second
The advantages that metal wiring layer quality of forming film.Optionally, the second transition bed course can also be set and be located at the first metal wiring layer and
Between one insulating layer, First Transition bed course is set between third metal wiring layer and second insulating layer, effect is identical.
Optionally, in side and Figure 12 of the transition bed course 41 in Figure 10 and Figure 11 towards the second metal wiring layer 20
The side of First Transition bed course 411, the second transition bed course 412 towards the second metal wiring layer 20 can be smooth plane,
Also raised sunk structure can be set.Specific structure can be with Fig. 5 to Fig. 8 of reference implementation example one and corresponding description, herein
It repeats no more.Transition bedding plane is set as raised sunk structure to the side of the second metal wiring layer, can be with its increasing and upper layer
The contact surface of film layer is not easy to strip off so that the film strength of upper layer film layer increases.
Optionally, as shown in Figure 10, Figure 11 and Figure 12, in wiring transition region 36 close to 37 side of the second wiring region, transition
The angle of bed course 41, the side of First Transition bed course 411 or the second transition bed course 412 and bottom surface is less than or equal to 70 degree.The angle
Range can guarantee the second metal wiring layer 30 formed thereon in wiring transition region 36 and first substrate 31 place plane
Angle is also to be less than or equal to 70 degree, and the angular range less than or equal to 70 degree can further decrease the fracture of the second metal wiring layer 30
Or the risk of thicknesses of layers unevenness, and the angular range less than or equal to 70 degree is also easy the formation process of transition bed course
Control.
Optionally, it as shown in Figure 10, Figure 11 and Figure 12, is also set up between first substrate 31 and the first metal wiring layer 38
There is bottom insulating layer 32, bottom insulating layer 32 will be for that will be located at the metal layer and the first metal wiring layer of 32 lower layer of bottom insulating layer
38 isolation insulation or bottom insulating layer 32 are used for the wiring contact intensity of the first metal wiring layer of raising 38 disposed thereon.
Optionally, display panel provided in an embodiment of the present invention is organic light emitting display panel, organic light emitting display panel
It further include the second substrate, the second substrate is set to the top of first substrate, the second substrate and first substrate by being set to encapsulation
The encapsulated layer in region is bonded.
Embodiment three
Figure 13 is please referred to, the schematic diagram of the display panel provided for the embodiment of the present invention three, embodiment three and embodiment one,
Two something in common of embodiment repeats no more, it is preferable that as shown in figure 13, in the third embodiment, display panel 50 includes the first base
Plate 51, first substrate 51 includes display area 52 and the packaging area 53 around display area 52, in packaging area 53 far from aobvious
Show that the side in region 52 is additionally provided with power supply signal binding terminal area 54.Terminal is bound from display area 52 to power supply signal
On the direction in region 54, packaging area 53 includes the first wiring region 55, the second wiring region 57 and wiring transition region 56, is routed transition
Area 56 is set between the first wiring region 55 and the second wiring region 57.Packaging area 53 be additionally provided with and be routed transition region 56,
Area 59 is arranged in the adjacent reflective metals in second wiring region 57, and reflective metals setting area 59 is provided with the first reflective metal layer 592.
When the effect of first reflective metal layer 592 is using laser heating melting packaging plastic (frit), the energy of reflection laser improves envelope
Fill the efficiency of glue melting.
In the structure shown in Figure 13, the first wiring region 55, wiring transition region 56, the second wiring region 57 be in longitudinal direction, i.e., from
Adjacent on display area 52 to the direction of power supply signal binding terminal area 54, area 59 and wiring transition region is arranged in reflective metals
56, the second wiring region 57 is to be disposed adjacent in a lateral direction, however, the present invention is not limited thereto.In the first wiring region 55, it was routed
It crosses area 56, be provided with the second metal wiring layer 591 on the second wiring region 57.
Area 59 is arranged in reflective metals and wiring transition region 56, the difference in height of the second wiring region 591 are less than or equal to 7000 angstroms.Please
With reference to Figure 14, for the schematic diagram for the display panel that a kind of specific embodiment of embodiment three provides, in Figure 14, reflective metals are set
The first reflective metal layer 592 for setting the setting of area 59 belongs to the first metal wiring layer, is provided with covering reflection on the first metal layer
The first insulating layer 69 of area 59, wiring transition region 56, the second wiring region 57 is arranged in metal.It is arranged on the upper layer of the first insulating layer 69
There is the second metal wiring layer 591, area 59 is arranged in reflective metals and wiring transition region 56, the difference in height of the second wiring region 591 are the
The first metal wiring layer and the second metal line is arranged in film thickness difference between one metal wiring layer and the second metal wiring layer 591
591 film forming thickness difference of layer are within 7000 angstroms, it is ensured that belong to reflective metals setting area 59 and the wiring of packaging area 53
Transition region 56, the difference in height of the second wiring region 57 are smaller, when packaging plastic (frit) is arranged on packaging area 53, it is ensured that
Thickness of the packaging plastic in each region is more uniform, and it is bad the encapsulation that packaging plastic fails by uneven thickness will not to occur.Certainly,
First reflective metal layer 592 could also belong to the second metal wiring layer or belong to third metal wiring layer, as long as guaranteeing anti-
Radioglold belongs to setting area 59 and wiring transition region 56, the difference in height of each thicknesses of layers sum of the second wiring region 591 are less than or equal to 7000
Angstrom, so that it may guarantee the packaging effect of display panel.
Figure 15 is please referred to, for the schematic diagram for the display panel that another specific embodiment of embodiment three provides, first is anti-
It penetrates metal layer 592 and is also multiplexed with ground signal line, the second metal wiring layer includes power supply signal cabling 591.Display panel 50 to
The first reflective metal layer 592 for being multiplexed with ground signal line provides ground signalling, provides power supply letter to power supply signal cabling 591
Number, because the signal on two signal wires is different, in order to avoid signal interference, the first reflective metal layer 592 and power supply signal cabling 591
Between to be spaced a distance, the second reflective metal layer 593 is provided in the spacing distance.
Around display area 52, the first reflective metal layer 592 and power supply signal cabling 591 are provided in packaging area 53,
First reflective metal layer 592 and power supply signal cabling 591 can play the role of the reflection laser when melting packaging plastic.But because
It to be spaced a distance between the first reflective metal layer 592 and power supply signal cabling 591, in the distance, be not provided with
First reflective metal layer 592 or power supply signal cabling 591, without metal layer reflection laser, to the rate of packaging plastic melting
Can be different with the rate in 591 region of the first reflective metal layer 592 or power supply signal cabling, to influence final encapsulation effect
Fruit.In above-mentioned specific embodiment, is arranged in the interval between the first reflective metal layer 592 and power supply signal cabling 591
Two reflective metal layers 593, the second reflective metal layer 593 can play the role of reflection laser, to guarantee entire packaging area
Packaging effect it is consistent, stablize.Second reflective metal layer 593 can be with the first reflective metal layer 592, power supply signal cabling
591 no overlaps, to guarantee that crosstalk will not occur for signal.Second reflective metal layer 593 can be by being different from the first reflection
Metal layer 592, power supply signal cabling 591 metallic diaphragm formed.
Figure 16 and Figure 17 are please referred to, Figure 16 is the signal for the display panel that another specific embodiment of embodiment three provides
Figure, Figure 17 are the schematic diagram in the section CC ' along Figure 16.As shown, the second metal wiring layer 591 includes setting answering in the inner
Power evacuation aperture 70.When second metal wiring layer 591 is as power supply signal cabling, power supply signal is provided for entire display panel, electricity
The line width of source signal cabling is larger, in order to avoid its film layer is broken, needs that exclusion is arranged in the second metal wiring layer 591 and answers
The stress evacuation aperture 70 of power, stress evacuation aperture 70 are exactly etch away sections metal layer, in this way meeting in the second metal wiring layer 591
Cause the thickness in 591 other regions of region and the second metal wiring layer of the second metal wiring layer 591 setting stress evacuation aperture 70
Difference, and stress evacuation aperture 70 reflects the laser of melting packaging plastic without the second metal wiring layer 591.Embodiment three it is another
In kind specific embodiment, filled layer 71 is provided in stress evacuation aperture 70, stress evacuation aperture 70 can be improved in filled layer 71
The caliper uniformity in 591 other regions of region and the second metal wiring layer.Filled layer 71 may belong to the first metal wiring layer, or
Person belongs to third metal wiring layer, or belongs to transition bed course described in embodiment one or embodiment two.When filled layer 71 belongs to
First metal wiring layer, or when belonging to third metal wiring layer, filled layer 71 is also used as reflective metals, reflection melting encapsulation
The laser of glue improves packaging effect.
Optionally, shown in Figure 14 and Figure 17, bottom is additionally provided between first substrate 51 and the first reflective metal layer 592
Insulating layer 62, bottom insulating layer 62 for will be located at 62 lower layer of bottom insulating layer metal layer and the first reflective metal layer 592 every
Insulation or bottom insulating layer 62 are used for the wiring contact intensity of the first reflective metal layer of raising 592 disposed thereon.
Optionally, display panel provided in an embodiment of the present invention is organic light emitting display panel, organic light emitting display panel
It further include the second substrate, the second substrate is set to the top of first substrate, the second substrate and first substrate by being set to encapsulation
The encapsulated layer in region is bonded.
The display panel that the embodiment of the present invention three provides advanced optimizes envelope on the basis of embodiment one or implementation two
The wires design for filling region, improves packaging effect.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent substitution, improvement and etc. done be should be included within the scope of the present invention.
Claims (14)
1. a kind of display panel, which is characterized in that including first substrate, the first substrate includes display area and surrounds described
The packaging area of display area is additionally provided with power supply signal binding far from the side of the display area in the packaging area
Terminal area；
From the display area to the power supply signal bind terminal area direction, the packaging area include the first wiring region,
Second wiring region and wiring transition region, the wiring transition region be set to first wiring region and second wiring region it
Between；
It is set to the first metal wiring layer of first wiring region；
It is set on first metal wiring layer and covers the first insulating layer of first metal wiring layer, described first absolutely
Edge layer extends to the wiring transition region and second wiring region from first wiring region；
The second metal wiring layer being set on the first insulating layer of first wiring region, wiring transition region, the second wiring region；
In the wiring transition region, second metal wiring layer is arranged with transition bed course, and the transition bed course is close to described
The thickness of first wiring region side is greater than the thickness close to second wiring region side.
2. display panel as described in claim 1, which is characterized in that the transition bed course is from close to first wiring region one
To close to second wiring region side, thickness is gradually reduced for side.
3. display panel as described in claim 1, which is characterized in that in the wiring transition region close to second wiring region
Side, the side of the transition bed course and the angle of bottom surface are less than or equal to 70 degree.
4. display panel as described in claim 1, which is characterized in that the transition bed course is set to second metal line
Between layer and first insulating layer.
5. display panel as described in claim 1, which is characterized in that in first insulating layer and second metal line
Third metal wiring layer and second insulating layer are additionally provided between layer；
The third metal wiring layer is set on the first insulating layer of first wiring region, and the second insulating layer is set to
On the third metal wiring layer and the third metal wiring layer is covered, the second insulating layer is prolonged from first wiring region
Extend to the wiring transition region and second wiring region.
6. display panel as claimed in claim 5, which is characterized in that the transition bed course is set to second metal line
Between layer and the second insulating layer；Alternatively, the transition bed course is set to the third metal wiring layer and described first absolutely
Between edge layer.
7. display panel as claimed in claim 5, which is characterized in that the transition bed course includes First Transition bed course and second
Transition bed course；
The First Transition bed course is set between second metal wiring layer and the second insulating layer；Alternatively, described
One transition bed course is set between the third metal wiring layer and the second insulating layer；
The second transition bed course is set between the third metal wiring layer and the second insulating layer；Alternatively, described
Two transition bed courses are set between first metal wiring layer and first insulating layer.
8. display panel as described in claim 1, which is characterized in that the material of the transition bed course is silicon nitride or oxidation
Silicon.
9. display panel as described in claim 1, which is characterized in that the transition bedding plane is to second metal wiring layer
Side be smooth plane；Alternatively, the transition bedding plane to the side of second metal wiring layer be provided with protrusion and
Sunk structure；Alternatively, the transition bedding plane is set as step-like to the side of second metal wiring layer.
10. display panel as described in claim 1, which is characterized in that the packaging area further includes reflective metals setting area,
The reflective metals setting area and second wiring region are disposed adjacent, and reflective metals setting area is provided with the first reflection
Metal layer.
11. display panel as claimed in claim 10, which is characterized in that the reflective metals setting area and second wiring
The film layer difference in height in area is less than or equal to 7000 angstroms.
12. display panel as claimed in claim 5, which is characterized in that second metal wiring layer includes that power supply signal is walked
Line is provided with stress evacuation aperture in the power supply signal cabling；Filled layer is provided in the stress evacuation aperture；
The filled layer belongs to the first metal layer；Alternatively, the filled layer belongs to the third metal layer；Or it described fills out
It fills layer and belongs to the transition bed course.
13. display panel as claimed in claim 10, which is characterized in that first reflective metal layer and second metal
It is additionally provided with the second reflective metal layer between wiring layer, it is second reflective metal layer and first reflective metal layer, described
Second metal wiring layer no overlap.
14. display panel as described in claim 1, which is characterized in that the display panel is organic light emitting display panel, institute
Stating organic light emitting display panel further includes the second substrate；The second substrate and the first substrate are by being set to the encapsulation
The encapsulated layer in region is bonded.
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| CN201910579188.2A CN110246885B (en) | 2019-06-28 | 2019-06-28 | Display panel |
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| CN201910579188.2A CN110246885B (en) | 2019-06-28 | 2019-06-28 | Display panel |
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| CN110246885B (en) | 2021-10-01 |
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