CN110197625A - A kind of COB display screen module separating recombinant formula - Google Patents
A kind of COB display screen module separating recombinant formula Download PDFInfo
- Publication number
- CN110197625A CN110197625A CN201810189887.1A CN201810189887A CN110197625A CN 110197625 A CN110197625 A CN 110197625A CN 201810189887 A CN201810189887 A CN 201810189887A CN 110197625 A CN110197625 A CN 110197625A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- double
- cob
- display screen
- screen module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005538 encapsulation Methods 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 230000002950 deficient Effects 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 9
- 238000000926 separation method Methods 0.000 claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims description 13
- 241000446313 Lamella Species 0.000 claims description 2
- 238000013461 design Methods 0.000 claims description 2
- 238000001914 filtration Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005194 fractionation Methods 0.000 description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a kind of COB display screen modules for separating recombinant formula, specifically, COB circuit board is first designed to four layers or four layers or more of wiring board, then the wiring board for being designed to a double-layer circuit board and a bilayer or bilayer or more is split again, LED chip is encapsulated in the front of a double-layered circuit board by COB, the back side of this double-layered circuit board is equipped with scolding tin solder joint, it is cut into parts the identical encapsulation unit of multiple sizes, filtering out non-defective unit weldering, to return to another double-deck or double-deck above be welded on the wiring board of control element, the COB display screen module of separation recombinant formula is made, compared with high density LED COB display screen module on the market, the present invention is big by difficulty, the low high density LED COB encapsulation module of yield, which splits out, point to be fabricated separately, yields is high instead, Production efficiency is high instead, cost is low instead.
Description
Technical field
The present invention relates to LED application fields, and in particular to a kind of COB display screen module for separating recombinant formula.
Background technique
Common highdensity LED COB display screen module is all the wiring board with four layers or more, front encapsulation LED core
Control element is welded at piece, the back side, and thousands of a chips are all up in the cell module of a usual very little area, and encapsulation yield only has hundred
99 or so of ten thousand cause cell module absolutely unqualified, all to repair, and are limited, are led by LED encapsulation yield
Cause efficiency very low, and less reliable after maintenance.
For the defect and deficiency more than overcoming, the present invention takes the COB circuit board fractionation four layers or four layers or more to set
The wiring board of a double-layer circuit board and a bilayer or bilayer or more is counted into, difficulty is big, the low high density LED COB of yield
The wiring board of back side weldering control element more than encapsulation and another double-deck or bilayer, which splits out, to be fabricated separately, after the completion of encapsulation
Multiple encapsulation units are cut into, non-defective unit is then filtered out, are scrapped underproof, then weld another for returning to and having welded control element
On wiring board more than double-deck or bilayer, yields is high instead, and production efficiency is high instead, cost is low instead.
Summary of the invention
The present invention relates to a kind of COB display screen modules for separating recombinant formula, specifically, COB circuit board is first designed
At four layers or four layers or more of wiring board, then splits again and be designed to a double-layer circuit board and a bilayer or bilayer or more
Wiring board, LED chip are encapsulated in the front of a double-layered circuit board by COB, and the back side of this double-layered circuit board is equipped with scolding tin
Solder joint is cut into parts the identical encapsulation unit of multiple sizes, filter out non-defective unit weldering return to another it is double-deck or it is double-deck with
On be welded on the wiring board of control element, be made separation recombinant formula COB display screen module, with high density on the market
LED COB display screen module is compared, and the present invention is big by difficulty, and the low high density LED COB encapsulation module of yield splits out point
It is fabricated separately, yields is high instead, and production efficiency is high instead, cost is low instead.
A kind of production method of COB display screen module for separating recombinant formula is provided according to the present invention, specifically, handle
COB circuit board is first designed to four layers or four layers or more of wiring board, then splits again and is designed to a double-layer circuit board and one
Wiring board more than double-deck or bilayer, LED chip are encapsulated in the front of a double-layered circuit board by COB, double-layered circuit board
The back side is equipped with scolding tin solder joint, is cut into parts the identical encapsulation unit of multiple sizes, filters out non-defective unit；By another bilayer
Or control element is welded in route back more than bilayer, then the non-defective unit weldering of encapsulation unit is returned to the line for having welded control element
On the plate of road, the COB display screen module of separation recombinant formula is made.
A kind of COB display screen module for separating recombinant formula is additionally provided according to the present invention, comprising: control element layer；One
Large scale pcb layer more than piece is two-sided or two-sided；The small ruler of bilayer arranged at equal interval of multi-disc same size same design
Very little pcb layer；LED core lamella；Encapsulate glue-line；It is characterized in that, chip package is on the small wiring board of multi-disc, every small line
Two groups or more RGB chip is packaged on the plate of road, every group of chip is made of three or three or more chips, chip
It is that bonding wire connection is conducting on wiring board or is to be communicated to wiring board by conducting resinl or is that direct welding is conducting to line
On the plate of road, small route back has solder joint, and the number of welds at the back side is greater than 4, and the small equidistant proper alignment of wiring board is welded in
In large-sized wiring board one side, large-sized another side is welded with control element.
According to a preferred embodiment of the invention, the COB display screen module of a kind of separation recombinant formula, feature
It is, contains interconnection circuit on the small wiring board, is encapsulated between each chip on small wiring board interconnection there are many being formed and closes
System.
According to a preferred embodiment of the invention, the COB display screen module of a kind of separation recombinant formula, feature
It is, the spacing between the small wiring board of the proper alignment is O.1mm~1.0mm, and small wiring board is square or is long
It is rectangular or be prismatic or be triangle or be greater than polygon equal to five.
In the description below to the drawings and specific embodiments, the thin of one or more embodiments of the invention will be illustrated
Section.
Detailed description of the invention
By reading this specification in conjunction with the following drawings, features, objects and advantages of the invention will become more to show and easy
See, it is as follows to the brief description of accompanying drawing.
Fig. 1 is the floor map of the COB double-sided wiring board of heavy nickel gold.
Fig. 2 is the floor map on COB double-sided wiring board after die bond bonding wire.
Fig. 3 is the floor map after glue dispensing and packaging.
Fig. 4 is the front plan schematic diagram for cutting into single package unit.
Fig. 5 is the back side plane schematic diagram for cutting into single package unit.
Fig. 6 is the schematic cross-section for cutting into single package unit.
Fig. 7 is the floor map of the double-sided wiring board of another welding control element.
Fig. 8 is to weld the schematic cross-section of upper control element at the back side of double-sided wiring board.
Fig. 9 is the floor map for separating the COB display screen module of recombinant formula.
Figure 10 is the schematic cross-section for separating the COB display screen module of recombinant formula.
Specific embodiment
The present invention will be described in detail by taking preferred embodiment as an example below.
It should be appreciated to those skilled in the art that as described below be merely illustrative and describe some preferred implementation sides
Formula to claim of the invention and does not have any restrictions.
First by tetra- sandwich circuit board of COB of conventional display screen module, the Double-side line for being designed to a COB is split into
Plate, for making COB encapsulation unit；With another double-sided wiring board, the back side is for welding control element, front welding COB envelope
Unit is filled, specific production process is as follows:
One, the production of COB encapsulation unit
Using traditional PCB manufacture craft, by sawing sheet, drilling, heavy copper, copper facing, cleaning, Double-face adhesive dry film, exposure, show
Shadow, etching move back film, double spread exposure solder mask, baking, exposure, the positive COB encapsulation welding tray 1.1 of development exposing and the back side
Welded connecting solder joint 1.2 (as shown in Figure 1, shown in Figure 5), baking-curing, again by the weldering of positive COB encapsulation welding tray 1.1 and the back side
The heavy nickel gold processing in surface for connecing connection welding 1.2, is fabricated to COB double-sided wiring board 1 as shown in Figure 1, the above are the tradition of PCB
Manufacture craft is not stated carefully herein.
It by COB double-sided wiring board 1 as shown in Figure 1, is placed on and helps in light DB382 bonder, by the LED core of multiple groups R, G, B
2 die bond of piece is on COB encapsulation welding tray 1.1, baking-curing, then by ASM-AB350 bonding equipment, with metal wire 3 by multiple groups
R, 2 bonding wire of LED chip of G, B are connected in corresponding COB encapsulation welding tray 1.1 (as shown in Figure 2), are then sealed by dispenser point
Glue 4 is filled, the LED chip 2 of every group of R, G, B and metal wire 3 are encapsulated in glue 4 (as shown in Figure 3), baking-curing, then
Single package unit (as shown in Fig. 4, Fig. 5, Fig. 6) is cut into cutting machine, then with dazzling large XSFG2013-15050 light splitting machine
It is screened, filters out non-defective unit, defective products is directly scrapped, then by the non-defective unit filtered out with dazzling large XSBD2013-15050 braid
Machine braid.
Two, the production of the double-sided wiring board of another back side welding control element
Using traditional PCB manufacture craft, by sawing sheet, drilling, heavy copper, copper facing, cleaning, Double-face adhesive dry film, exposure, show
Shadow, etching move back the pad 5.1 of film, double spread exposure solder mask, baking, exposure, development exposing face bonding COB encapsulation unit
With the welding pad (as shown in Figure 7) of control element at the back side, baking-curing, again by pad progress OSP surface treatment, be fabricated to
Double-sided wiring board 5 as shown in Figure 7, then control element 6 is welded to 5 back side of double-sided wiring board (as shown in Figure 8).
Three, the production of knockdown COB display screen module
It is overleaf welded on the front pad of the double-sided wiring board 5 of control element 6 and prints tin cream, it will be in braid with chip mounter
The attachment of single package unit crosses Reflow Soldering welding, is fabricated to separation as shown in Figure 9, Figure 10 group again to the pad for having printed tin cream
Box-like COB display screen module.
The present invention takes the COB circuit board fractionation four layers or four layers or more to be designed to a double-layer circuit board and one pair
Wiring board more than layer or bilayer, difficulty is big, it is more than the low high density LED COB encapsulation of yield and another double-deck or bilayer
The wiring board of back side weldering control element split out and be fabricated separately, cut into multiple encapsulation units after the completion of encapsulation, then sieve
Non-defective unit is selected, is scrapped underproof, then is welded on the wiring board for returning to and having welded another double-deck or bilayer of control element or more,
Yields is high instead, and production efficiency is high instead, cost is low instead.
A kind of specific embodiment of COB display screen module for separating recombinant formula carries out the present invention in conjunction with attached drawing above
Detailed description.It will be understood by those skilled in the art, however, that the above be merely illustrative and describe it is some specific
Embodiment to this with novel range, especially the scope of the claims, and does not have any restrictions.
Claims (4)
1. a kind of production method for the COB display screen module for separating recombinant formula, specifically, COB circuit board is first designed to
Then four layers or four layers or more of wiring board splits the line for being designed to a double-layer circuit board and a bilayer or bilayer or more again
Road plate, LED chip are encapsulated in the front of a double-layered circuit board by COB, and the back side of double-layered circuit board is equipped with scolding tin solder joint, will
It is cut into the identical encapsulation unit of multiple sizes in parts, filters out non-defective unit；By wiring board more than another double-deck or bilayer
Control element is welded in the back side, then the non-defective unit weldering of encapsulation unit is returned on the wiring board for having welded control element, and separation is made again
Knockdown COB display screen module.
2. a kind of COB display screen module for separating recombinant formula, comprising:
Control element layer；
The large scale pcb layer of a piece of odt circuit or the double-deck above circuit；
The pcb layer of the double-deck small size arranged at equal interval of multi-disc same size same design；
LED core lamella；
Encapsulate glue-line；
It is characterized in that, chip package on the small wiring board of multi-disc, is packaged with two groups or more on every small wiring board
RGB chip, every group of chip are made of three or three or more chips, chip be bonding wire connection be conducting on wiring board or
Person is to be communicated to wiring board by conducting resinl or is that direct welding is conducting on wiring board, and small route back has solder joint,
The number of welds at the back side is greater than 4, and the small equidistant proper alignment of wiring board is welded in large-sized wiring board one side, large-sized
Another side is welded with control element.
3. a kind of COB display screen module for separating recombinant formula according to claim 2, which is characterized in that the small line
Contain interconnection circuit on the plate of road, is encapsulated between each chip on small wiring board interconnected relationship there are many being formed.
4. a kind of COB display screen module for separating recombinant formula according to claim 2, which is characterized in that described neat
Spacing between the small wiring board of arrangement is 0.1mm~1.0mm, and small wiring board is square or is rectangle or is rib
Shape or it is triangle or is greater than polygon equal to five.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810189887.1A CN110197625A (en) | 2018-02-27 | 2018-02-27 | A kind of COB display screen module separating recombinant formula |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810189887.1A CN110197625A (en) | 2018-02-27 | 2018-02-27 | A kind of COB display screen module separating recombinant formula |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110197625A true CN110197625A (en) | 2019-09-03 |
Family
ID=67751001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810189887.1A Withdrawn CN110197625A (en) | 2018-02-27 | 2018-02-27 | A kind of COB display screen module separating recombinant formula |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110197625A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214665A (en) * | 2010-04-06 | 2011-10-12 | 胜开科技股份有限公司 | Wafer level image sensor packaging structure and manufacturing method of the same |
| JP2011238802A (en) * | 2010-05-11 | 2011-11-24 | Panasonic Corp | Light-emitting module and illuminating device using the same |
| CN103222073A (en) * | 2010-08-03 | 2013-07-24 | 财团法人工业技术研究院 | Light emitting diode chip, light emitting diode package structure, and method for forming the same |
| CN105977363A (en) * | 2016-07-01 | 2016-09-28 | 安徽亮亮电子科技有限公司 | LED substandard lamp bead recycling and re-use method |
| CN106801791A (en) * | 2017-01-16 | 2017-06-06 | 深圳雷曼光电科技股份有限公司 | COB LED encapsulation modules, display device, lighting device and method for packing |
| CN207867833U (en) * | 2018-02-27 | 2018-09-14 | 王定锋 | A kind of COB display screen modules of separation recombinant formula |
-
2018
- 2018-02-27 CN CN201810189887.1A patent/CN110197625A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214665A (en) * | 2010-04-06 | 2011-10-12 | 胜开科技股份有限公司 | Wafer level image sensor packaging structure and manufacturing method of the same |
| JP2011238802A (en) * | 2010-05-11 | 2011-11-24 | Panasonic Corp | Light-emitting module and illuminating device using the same |
| CN103222073A (en) * | 2010-08-03 | 2013-07-24 | 财团法人工业技术研究院 | Light emitting diode chip, light emitting diode package structure, and method for forming the same |
| CN105977363A (en) * | 2016-07-01 | 2016-09-28 | 安徽亮亮电子科技有限公司 | LED substandard lamp bead recycling and re-use method |
| CN106801791A (en) * | 2017-01-16 | 2017-06-06 | 深圳雷曼光电科技股份有限公司 | COB LED encapsulation modules, display device, lighting device and method for packing |
| CN207867833U (en) * | 2018-02-27 | 2018-09-14 | 王定锋 | A kind of COB display screen modules of separation recombinant formula |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9391050B2 (en) | Semiconductor light emitting device and fabrication method for same | |
| KR20090128376A (en) | Stacked packages | |
| JP2008078626A (en) | Laminated semiconductor package comprising interposer chip capable of wire bonding monitoring, and manufacturing method thereof | |
| CN107204333B (en) | A kind of packaging method of flexible substrate package structure | |
| CN108538803A (en) | Assembling fan-out package structure and production method after a kind of chip | |
| CN107983665A (en) | A kind of exception LED core particle choosing except method and choosing except system | |
| CN103579171B (en) | Semiconductor package part and manufacture method thereof | |
| CN207867833U (en) | A kind of COB display screen modules of separation recombinant formula | |
| US9543279B2 (en) | Method of manufacturing a single light-emitting structure | |
| CN110197625A (en) | A kind of COB display screen module separating recombinant formula | |
| CN213583780U (en) | Lamp strip made of RGB light source and white light source | |
| CN102064264A (en) | Packaging method of LED (Light Emitting Diode) | |
| US9041892B2 (en) | Tape substrate for chip on film structure of liquid crystal panel | |
| CN210575900U (en) | Integrated photoelectric display unit and photoelectric display device thereof | |
| CN101165886B (en) | Semiconductor packaging member for semiconductor device stacking and its manufacture method | |
| CN210245495U (en) | Micro-assembled solid power device | |
| CN114373856A (en) | Lamp strip manufactured by RGB lamp beads with welding legs on multiple sides and manufacturing method thereof | |
| TWI393277B (en) | Method for packaging light-emitting diode | |
| US7371607B2 (en) | Method of manufacturing semiconductor device and method of manufacturing electronic device | |
| CN216010489U (en) | LED lamp strip with multiple lamp beads connected in series and parallel | |
| CN114373855A (en) | Lamp strip made of LED lamp beads and manufacturing method thereof | |
| CN114373857A (en) | Lamp strip made of RGB lamp beads and manufacturing method thereof | |
| CN110931371B (en) | Semiconductor device and method for manufacturing the same | |
| CN114361320A (en) | Lamp strip manufactured by LED lamp beads with welding legs on multiple sides and manufacturing method thereof | |
| CN101281875A (en) | Grain automatic positioning, and stack type encapsulation structure as well as manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190903 |
|
| WW01 | Invention patent application withdrawn after publication |