CN110129842A - A kind of compound cyanide-free gold electroplating plating solution preparation and gold process is electroplated using its - Google Patents
A kind of compound cyanide-free gold electroplating plating solution preparation and gold process is electroplated using its Download PDFInfo
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- CN110129842A CN110129842A CN201910431998.3A CN201910431998A CN110129842A CN 110129842 A CN110129842 A CN 110129842A CN 201910431998 A CN201910431998 A CN 201910431998A CN 110129842 A CN110129842 A CN 110129842A
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- gold
- electroplating
- cyanide
- plating solution
- plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Gold process is electroplated the invention discloses a kind of compound cyanide-free gold electroplating plating solution preparation and using it, compound cyanide-free gold electroplating plating solution is by main complexant, auxiliary complexing agent, sodium carbonate, gold potassium chloride, additive and pure water are formulated, cyanide is provided in the main complexant and auxiliary complexing agent provided, complexant and gold ion form stable complex, exist in plating solution without the gold ion that dissociates, suitable for decorative gold-plated, plated thickness can reach 0.075-0.2 μm, it is equally applicable to by control technological parameter functional gold-plated, cyanide-free gold electroplating bath stability provided by the invention, current efficiency is high, electrodeposition rate is fast, gold plate is in bright golden, it is strong with the binding force of prime coat simultaneously, the plating gold process may replace cyanide plating gold process, realize the cleanly production of craft of gilding.
Description
Technical field
The present invention relates to Gold-plating technique field, specifically a kind of compound cyanide-free gold electroplating plating solution prepares and using its electricity
Craft of gilding.
Background technique
Fitting has high chemical stability, does not dissolve in various bronsted lowry acids and bases bronsted lowries, will not be oxidized and change colour in air, simultaneously
It conducts electricity very well, contact resistance is low, these excellent performances are widely used in it in decorative electroplating and functional plating, separately
The metals such as copper, nickel, cobalt, antimony, indium are added in external gold plating solution, different tones or billon coating with high hardness can be obtained.
Electroplating gold is all made of cyaniding craft of gilding, CN at present-With hypertoxicity, not only there is serious pollution to environment, and
And also there is serious harm to production operation personnel health, while it is transported, there is also many hidden danger for storage link.For
The Green Sustainable for realizing environmental protection and electroplating industry need to develop a kind of cyanide-free gold electroplating plating solution and use its electroplating gold
Technique, replace existing cyaniding Gold-plating technique that there is great economic society to be worth.
Since the sixties in last century, the more mature cyanideless electro-plating technology for gold of theoretical basis mainly has citrate method plating
Gold, sulphite process is gold-plated, hydantoin derivative complexant is gold-plated, and the gold-plated plating solution of citrate method is substantially a kind of the molten of low cyanogen
Liquid, gold are added in the form of gold potassium cyanide, and no free cyanide exists.The gold-plated bath composition of sulphite process is complicated, not only
A variety of auxiliary complexing agents are added, retardance sulphite is also added and is oxidized to sulfate species, when the temperature is excessively high sulfurous acid
The sulphur that salinity parses is reacted with gold ion, generates the aurosulfo precipitating of black, while pH value range will be maintained between 8~10
Fine and close bright coating could be obtained, operating condition is harsh.The gold plate hair obtained using hydantoin derivative complexant Gold-plating technique
It is red, bright golden yellow coating can not be obtained.Citrate method is gold-plated and sulphite process it is gold-plated compared with cyanide electroplating gold
Need to be optimized in terms of bath stability and coating performance, hydantoin derivative complexant is gold-plated, and there has been no industrial application elder generations
Example, the above cyanideless electro-plating technology for gold are subject to certain restrictions in terms of popularization and application.
Therefore, for overcome the shortcomings of above-mentioned technology and design it is a kind of it is nontoxic, stable, environmentally friendly, production cost is low, can industry
A kind of compound cyanide-free gold electroplating plating solution for changing application prepares and gold process is electroplated using its, and exactly inventor is to be solved asks
Topic.
Summary of the invention
In view of the deficiencies of the prior art, the object of the present invention is to provide a kind of compound cyanide-free gold electroplating plating solution preparation and uses
It is electroplated gold process, safety and environmental protection is nontoxic, make it is reliable and stable, production cost is low, can industrialization production, improve productivity effect.
The technical solution adopted by the present invention to solve the technical problems is: a kind of compound cyanide-free gold electroplating plating solution, is matched by master
Position agent, auxiliary complexing agent, sodium carbonate, gold potassium chloride, additive and pure water are formulated, and main 30~90g/L of complexant, auxiliary is matched
Position 10~60g/L of agent, sodium carbonate 30g/L, 5~10g/L of additive, 1~5g/L of gold potassium chloride, first match master when preparing electroplate liquid
Position agent, auxiliary complexing agent, sodium carbonate, additive are dissolved in pure water, and the temperature of pure water is 40 ± 2 DEG C, then dissolve gold potassium chloride,
Compound cyanide-free gold electroplating plating solution is made.
A kind of compound cyanideless electro-plating gold process, its step are as follows:
1. substrate pretreatment: the static soak oil removing in degreasing powder, 5% is sulfuric acid activated, then clean with pure water rinsing；
2. intermediate electroplating bright nickel layer: matrix being placed in plating nickel plating bath and carries out Bright Nickel Electroplating processing；
3. electroplating gold: plating piece is charged into Hull cell, is placed in the compound cyanide-free gold electroplating plating solution of above-mentioned preparation, current density
0.3~0.7A/dm2, anode material is using titanium white gold net, and annode area: 30~50 DEG C of temperature, hydrogen is added in cathode area 3:1
Potassium oxide solution adjusts pH value 10.5~11.5, controls 30~70s of electroplating time, movable cathode stirring.
Preferably, the main complexant be one of pyrophosphorous acid sodium, 5,5- dimethyl hydantoin, EDETATE SODIUM or
Several mixtures.
Preferably, the auxiliary complexing agent is the mixing of one or more of sodium citrate, sodium potassium tartrate tetrahydrate, sodium sulfite
Object.
Preferably, the additive is one of brightener, compounding agent, stabilizer, antioxidant or multiple combinations structure
At.
The beneficial effects of the present invention are:
1, compound main complexant of the invention is free of cyanide, has stronger coordination ability with gold ion, with invention
Compound main complexant is suitable for present invention plating gold process, and optimizes adjustment to technological parameter, for current mainstream cyaniding
Object craft of gilding is toxic, pollutes the problems such as environment, solves the problems, such as bath stability, coating brightness and thickens, reaches substitution cyanogen
The purpose of compound craft of gilding realizes the cleanly production of craft of gilding.
2, the present invention is suitable for decorative gold-plated, and plated thickness can reach 0.075~0.2 μm, passes through control technique ginseng
Number is equally applicable to functional gold-plated, golden bath stability, and current efficiency is high, and electrodeposition rate is fast, and gold plate is golden in light, together
When and prime coat binding force it is strong.
Specific embodiment
Present invention will be further explained below with reference to specific examples, it should be appreciated that these embodiments are merely to illustrate the present invention
Rather than it limits the scope of the invention.In addition, it should also be understood that, after reading the content taught by the present invention, those skilled in the art
Member can make various changes or modifications the present invention, and such equivalent forms are also fallen within defined by application the appended claims
Range.
A kind of compound cyanide-free gold electroplating plating solution, by main complexant, auxiliary complexing agent, sodium carbonate, gold potassium chloride, additive and
Pure water is formulated, main 30~90g/L of complexant, 10~60g/L of auxiliary complexing agent, sodium carbonate 30g/L, 5~10g/ of additive
Main complexant, auxiliary complexing agent, sodium carbonate, additive are first dissolved in pure water when preparing electroplate liquid by L, 1~5g/L of gold potassium chloride
In, the temperature of pure water is 40 ± 2 DEG C, then dissolves gold potassium chloride, compound cyanide-free gold electroplating plating solution is made.Wherein main complexant can
Think one or more of pyrophosphorous acid sodium, 5,5- dimethyl hydantoin, EDETATE SODIUM mixture, auxiliary complexing agent is lemon
One or more of lemon acid sodium, sodium potassium tartrate tetrahydrate, sodium sulfite mixture, additive be brightener, compounding agent, stabilizer,
One of antioxidant or multiple combinations are constituted.
A kind of compound cyanideless electro-plating gold process, its step are as follows:
1. substrate pretreatment: the static soak oil removing in degreasing powder, 5% is sulfuric acid activated, then clean with pure water rinsing；
2. intermediate electroplating bright nickel layer: matrix being placed in plating nickel plating bath and carries out Bright Nickel Electroplating processing；
3. electroplating gold: plating piece is charged into Hull cell, is placed in the compound cyanide-free gold electroplating plating solution of above-mentioned preparation, current density
0.3~0.7A/dm2, anode material is using titanium white gold net, and annode area: 30~50 DEG C of temperature, hydrogen is added in cathode area 3:1
Potassium oxide solution adjusts pH value 10.5~11.5, controls 30~70s of electroplating time, movable cathode stirring.
Cyanideless electro-plating gold process provided by the invention wants regular replenishment gold potassium chloride, complexant when carrying out continuous electroplating
And additive, and pH value is controlled in 10.5~11.5 ranges.It is free of in main complexant and auxiliary complexing agent provided by the invention
Cyanide and bath composition is simple, using the available golden entire bright gold plate of cyanideless electro-plating gold process provided by the invention,
Plated thickness can reach 0.075-0.2 μm.
Specific embodiment 1:
Matrix uses latten(-tin), and anode material uses titanium white gold net, is electroplated in 250mL Hull cell.
(1) substrate pretreatment: latten(-tin) is placed in static soak oil removing in degreasing powder, 5% sulfuric acid activated, Zhi Houzai is added
It is clean with pure water rinsing.
(2) intermediate electroplating bright nickel layer: matrix is placed in plating nickel plating bath and carries out Bright Nickel Electroplating processing.
(3) electroplating gold: after electroplating bright Ni interlayer, matrix carries out second level pure water and washes, and is then placed in plating piece electrification multiple
It closes in cyanide-free gold electroplating plating solution, carries out electroplating gold.Wherein the configuration of compound cyanide-free gold electroplating plating solution includes that main complexant is burnt sub-
Sodium phosphate 50g/L, auxiliary complexing agent sodium sulfite 35g/L, sodium carbonate 30g/L, additive 7g/L, gold potassium chloride add 2g/L,
Using current density 0.4A/dm2, anode material is using titanium white gold net, annode area: cathode area 3:1, heating water bath control
For temperature at 40 DEG C, it is 11 that sodium hydroxide solution, which is added, and adjusts pH value, controls electroplating time 65s, and the constantly mobile stirring of cathode.
By experimental study, which can obtain bright golden yellow coating, be firmly combined with Ni substrate, corrosion resistance is good
Good, coating crystallizes careful flawless, and thickness of coating can reach 0.2 μm.
Specific embodiment 2:
(1) substrate pretreatment: latten(-tin) is placed in static soak oil removing in degreasing powder, 5% sulfuric acid activated, Zhi Houzai is added
It is clean with pure water rinsing.
(2) intermediate electroplating bright nickel layer: matrix is placed in plating nickel plating bath and carries out Bright Nickel Electroplating processing.
(3) electroplating gold: after electroplating bright Ni interlayer, matrix carries out second level pure water and washes, and is then placed in plating piece electrification multiple
It closes in cyanide-free gold electroplating plating solution, carries out electroplating gold.Wherein the configuration of compound cyanide-free gold electroplating plating solution includes that main complexant is burnt sub-
Sodium phosphate 35g/L, 5,5- dimethyl hydantoin 10g/L, auxiliary complexing agent sodium citrate 20g/L, sodium carbonate 30g/L, addition
Agent 5g/L, gold potassium chloride add 3.5g/L, using current density 0.3A/dm2, anode material use titanium white gold net, annode area:
Cathode area is 3:1, and heating water bath controls temperature at 32 DEG C, and it is 10.5 that potassium hydroxide solution, which is added, and adjusts pH value, control plating
Time 55s, and the constantly mobile stirring of cathode.
By experimental study, which can obtain bright golden yellow coating, be firmly combined with Ni substrate, corrosion resistance is good
Good, coating crystallizes careful flawless, and thickness of coating can reach 0.09 μm.
Specific embodiment 3:
(1) substrate pretreatment: latten(-tin) is placed in static soak oil removing in degreasing powder, 5% sulfuric acid activated, Zhi Houzai is added
It is clean with pure water rinsing.
(2) intermediate electroplating bright nickel layer: matrix is placed in plating nickel plating bath and carries out Bright Nickel Electroplating processing.
(3) electroplating gold: after electroplating bright Ni interlayer, matrix carries out second level pure water and washes, and is then placed in plating piece electrification multiple
It closes in cyanide-free gold electroplating plating solution, carries out electroplating gold.Wherein the configuration of compound cyanide-free gold electroplating plating solution includes that main complexant is burnt sub-
Sodium phosphate 50g/L, 5,5- dimethyl hydantoin 20g/L, EDETATE SODIUM 10g/L, 80g/L, auxiliary complexing agent sodium potassium tartrate tetrahydrate
40g/L, sodium carbonate 30g/L, additive 9g/L, gold potassium chloride add 3.5g/L respectively, using current density 0.6A/dm2, anode
Material uses titanium white gold net, annode area: cathode area 3:1, and heating water bath controls temperature at 48 DEG C, and it is molten that potassium hydroxide is added
It is 11.5 that liquid, which adjusts pH value, controls electroplating time 40s, and the constantly mobile stirring of cathode.
By experimental study, which can obtain bright golden yellow coating, be firmly combined with Ni substrate, corrosion resistance is good
Good, coating compact crystallization flawless, thickness of coating can reach 0.18 μm.
Claims (5)
1. a kind of compound cyanide-free gold electroplating plating solution, it is characterised in that: by main complexant, auxiliary complexing agent, sodium carbonate, chlorauride
Potassium, additive and pure water are formulated, and main 30~90g/L of complexant, 10~60g/L of auxiliary complexing agent, sodium carbonate 30g/L add
Add 5~10g/L of agent, 1~5g/L of gold potassium chloride, first by main complexant, auxiliary complexing agent, sodium carbonate, addition when preparing electroplate liquid
Agent is dissolved in pure water, and the temperature of pure water is 40 ± 2 DEG C, then dissolves gold potassium chloride, compound cyanide-free gold electroplating plating solution is made.
2. a kind of compound cyanide-free gold electroplating plating solution according to claim 1, it is characterised in that: the main complexant is Jiao Ya
One or more of sodium phosphate, 5,5- dimethyl hydantoin, EDETATE SODIUM mixture.
3. a kind of compound cyanide-free gold electroplating plating solution according to claim 1, it is characterised in that: the auxiliary complexing agent is lemon
One or more of lemon acid sodium, sodium potassium tartrate tetrahydrate, sodium sulfite mixture.
4. a kind of compound cyanide-free gold electroplating plating solution according to claim 1, it is characterised in that: the additive is light
One of agent, compounding agent, stabilizer, antioxidant or multiple combinations are constituted.
5. a kind of compound cyanide-free gold electroplating plating solution according to claims 1 to 4 simultaneously carries out a kind of compound cyanideless electro-plating with it
Gold process, its step are as follows:
(1) substrate pretreatment: the static soak oil removing in degreasing powder, 5% is sulfuric acid activated, then clean with pure water rinsing；
(2) intermediate electroplating bright nickel layer: matrix is placed in plating nickel plating bath and carries out Bright Nickel Electroplating processing；
(3) electroplating gold: plating piece is charged into coating bath, is placed in the compound cyanide-free gold electroplating plating solution of above-mentioned preparation, and current density 0.3~
0.7A/dm2, anode material is using titanium white gold net, and annode area: 30~50 DEG C of temperature, hydroxide is added in cathode area 3:1
Potassium solution adjusts pH value 10.5~11.5, controls 30~70s of electroplating time, movable cathode stirring.
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| CN201910431998.3A CN110129842A (en) | 2019-05-23 | 2019-05-23 | A kind of compound cyanide-free gold electroplating plating solution preparation and gold process is electroplated using its |
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| CN201910431998.3A CN110129842A (en) | 2019-05-23 | 2019-05-23 | A kind of compound cyanide-free gold electroplating plating solution preparation and gold process is electroplated using its |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112501663A (en) * | 2020-11-14 | 2021-03-16 | 山东鲁蓝环保科技有限公司 | Cyanide-free gold plating electroplating liquid of compound phosphate system and electroplating process thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4168214A (en) * | 1978-06-14 | 1979-09-18 | American Chemical And Refining Company, Inc. | Gold electroplating bath and method of making the same |
| CN102212854A (en) * | 2011-05-20 | 2011-10-12 | 北京工业大学 | Cyanide-free gold electroplating liquid |
| CN103741181A (en) * | 2014-01-10 | 2014-04-23 | 哈尔滨工业大学 | Multi-coordination-agent cyanide-free electrogilding liquid and electrogilding process |
| CN104233384A (en) * | 2014-09-17 | 2014-12-24 | 朱忠良 | Cyanide-free gold electroplating solution and electroplating process using same |
-
2019
- 2019-05-23 CN CN201910431998.3A patent/CN110129842A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4168214A (en) * | 1978-06-14 | 1979-09-18 | American Chemical And Refining Company, Inc. | Gold electroplating bath and method of making the same |
| CN102212854A (en) * | 2011-05-20 | 2011-10-12 | 北京工业大学 | Cyanide-free gold electroplating liquid |
| CN103741181A (en) * | 2014-01-10 | 2014-04-23 | 哈尔滨工业大学 | Multi-coordination-agent cyanide-free electrogilding liquid and electrogilding process |
| CN104233384A (en) * | 2014-09-17 | 2014-12-24 | 朱忠良 | Cyanide-free gold electroplating solution and electroplating process using same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112501663A (en) * | 2020-11-14 | 2021-03-16 | 山东鲁蓝环保科技有限公司 | Cyanide-free gold plating electroplating liquid of compound phosphate system and electroplating process thereof |
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Address after: 276000 mengyubu community, Jiuqu sub district office, Hedong District, Linyi City, Shandong Province Applicant after: Shandong Lulan Environmental Protection Technology Co.,Ltd. Address before: 276000 mengyubu community, Jiuqu sub district office, Hedong District, Linyi City, Shandong Province Applicant before: SHANDONG XINHAI SURFACE TEC Co.,Ltd. |
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Application publication date: 20190816 |