CN110099202A - The production method of camera module, terminal device and camera module - Google Patents
The production method of camera module, terminal device and camera module Download PDFInfo
- Publication number
- CN110099202A CN110099202A CN201910335855.2A CN201910335855A CN110099202A CN 110099202 A CN110099202 A CN 110099202A CN 201910335855 A CN201910335855 A CN 201910335855A CN 110099202 A CN110099202 A CN 110099202A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- encapsulation
- pin
- camera module
- subsidiary components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000005538 encapsulation Methods 0.000 claims abstract description 61
- 239000012790 adhesive layer Substances 0.000 claims abstract description 32
- 239000011195 cermet Substances 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims description 2
- 238000000227 grinding Methods 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 2
- 239000000306 component Substances 0.000 description 42
- 238000000034 method Methods 0.000 description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 230000005611 electricity Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- -1 resistance Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The present invention discloses a kind of camera module, it includes circuit board and encapsulation module, the encapsulation module includes image sensor chip, subsidiary components and encapsulation part, described image sensing chip and the subsidiary components are fixedly linked with the encapsulation part, the encapsulation module and the circuit board are in the direction stacking perpendicular to the circuit board, the encapsulation module is fixedly linked by conductive adhesive layer and the circuit board, the pin of the pin of described image sensing chip and the subsidiary components passes through the conductive adhesive layer and the circuit board electrical connection, the conducting direction of the conductive adhesive layer is perpendicular to the circuit board.Invention additionally discloses the production methods of a kind of terminal device and camera module.Above scheme, which can solve camera module, has that processing technology is cumbersome and second-rate.
Description
Technical field
The present invention relates to technical field of communication equipment more particularly to a kind of camera modules, terminal device and camera mould
The production method of group.
Background technique
Shooting function is the basic function of terminal device, and shooting function is completed by the camera module of terminal device.It takes the photograph
As head mould group generally includes circuit board, image sensor chip and some subsidiary components (such as resistance, capacitor etc.), circuit board
Be adhesively fixed on circuit boards by glue-line, subsidiary components usually pass through SMT (Surface Mount Technology,
Surface mounting technology) process Installation is on circuit boards.
Camera module is higher to the planarity requirements of circuit board, while circuit board also being required to install image sensing core
Higher flatness is still kept after piece and subsidiary components, is fixed on electricity in image sensor chip and subsidiary components
The interface of image sensor chip and the interface of circuit board are bonded by gold thread again after on the plate of road, to complete between the two
Electrical connection.
But the production method of above-mentioned camera module have the defects that it is more, firstly, SMT equipment is in the process of work
It is easier to deform, block, the problems such as breakage, vacuum pressure deficiency, gas leakage etc. cause suction and feeding, therefore SMT equipment
Need to inspect periodically and replace rapid wear accessory, SMT technique has that technique is cumbersome.Secondly, SMT process requirement flows back
The problem of welding, therefore being easier to circuit slab warping when carrying out reflow ovens process, the warpage of circuit board can generate solder hole, into
And stay in more residual stress on solder, cause camera module to be easier to generate quality problems.Again, in order to avoid even
The risk of tin needs to keep biggish distance (for example, at least in 0.2mm) between subsidiary components, and in order to guarantee SMT
The attachment demand of technique, the surface of circuit board need to be coated with ink and carry out protection circuit, and at the same time, ink is prevented as group weldering bridge
Even tin phenomenon only occurs between tin cream and needs the harmomegathus of strict control circuit board, the control of pad size, steel in such cases
The control etc. of net size, and then cause to manage cumbersome.
As it can be seen that current camera module has that technique is relatively complicated in process, while camera module
It is second-rate.
Summary of the invention
The present invention discloses a kind of camera module, and it is cumbersome and second-rate that there are processing technologys to solve camera module
Problem.
To solve the above-mentioned problems, the present invention adopts the following technical solutions:
A kind of camera module, comprising:
Circuit board；
Encapsulation module, the encapsulation module include image sensor chip, subsidiary components and encapsulation part, and described image passes
Sense chip and the subsidiary components are fixedly linked with the encapsulation part, the encapsulation module and the circuit board perpendicular to
The direction of the circuit board stacks, and the encapsulation module is fixedly linked by conductive adhesive layer and the circuit board, and described image passes
The pin of the pin of sense chip and the subsidiary components is described by the conductive adhesive layer and the circuit board electrical connection
The conducting direction of conductive adhesive layer is perpendicular to the circuit board.
A kind of terminal device, including camera module described above.
A kind of production method of camera module, comprising:
Image sensor chip and subsidiary components are encapsulated by encapsulation part to prepare encapsulation module；
The encapsulation module is adhesively fixed on circuit boards by conductive adhesive layer, the pin of described image sensing chip and
The pin of the subsidiary components passes through the conductive adhesive layer and the circuit board electrical connection.
The technical solution adopted by the present invention can reach it is following the utility model has the advantages that
Image sensor chip and subsidiary components are packaged portion and encapsulate to form envelope by camera module disclosed by the invention
Die-filling group, encapsulation module realizes the assembling between circuit board, the pin and auxiliary electricity of image sensor chip by conductive adhesive layer
The pin of sub- device passes through conductive adhesive layer and circuit board electrical connection.Realize subsidiary components in electricity compared to using SMT technique
For installation on the plate of road, camera module disclosed by the embodiments of the present invention, which is not present, inspects periodically and more the implementation of SMT equipment
The case where changing rapid wear accessory, and can be avoided when carrying out Reflow Soldering process, the buckling deformation problem of circuit board, and then can keep away
Exempt from residual stress.It is electrically connected due to being realized using conductive adhesive layer, is not present and connects tin phenomenon using existing for soldering electrical connection,
Simplify the control in process.As it can be seen that camera module disclosed by the invention is not only able to simplify technique, and can also improve
The quality of camera module.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes a part of the invention, this hair
Bright illustrative embodiments and their description are used to explain the present invention, and are not constituted improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the perspective view of the explosion of camera module disclosed by the embodiments of the present invention；
Fig. 2 is the structural schematic diagram of encapsulation module disclosed by the embodiments of the present invention；
Fig. 3 is the assembling schematic diagram of encapsulation module disclosed by the embodiments of the present invention and circuit board；
Fig. 4 is the flow diagram of the production method of camera module disclosed by the embodiments of the present invention.
Description of symbols:
100- circuit board,
200- encapsulation module, 210- image sensor chip, 211- pin, 220- subsidiary components, 221- pin, 230-
Encapsulation part, 231- cermet outer part, 232- filling glue,
300- conductive adhesive layer,
400- camera lens, 500- protective film, 600- bracket, 700- flexible circuit board, 800- electric connector.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the specific embodiment of the invention and
Technical solution of the present invention is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the present invention one
Section Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
Below in conjunction with attached drawing, technical solution disclosed in each embodiment that the present invention will be described in detail.
Fig. 1-Fig. 4 is please referred to, the embodiment of the present invention discloses a kind of camera module, and disclosed camera module includes electricity
Road plate 100 and encapsulation module 200.
Circuit board 100 is the basic component of camera module, and circuit board 100 is that the other components of camera module mention
For installation foundation, at the same time, circuit board 100 is camera module with electric components (such as image sensing core described hereinafter
Piece 210) power supply is provided.
In the embodiment of the present invention, encapsulation module 200 and circuit board 100 are in the direction stacking perpendicular to circuit board 100.Encapsulation
Mould group 200 includes image sensor chip 210, subsidiary components 220 and encapsulation part 230, and image sensor chip 210 is camera
The core component of mould group, image sensor chip 210 can incude optical signal and convert optical signals to electric signal, and then being capable of shape
At image information.Subsidiary components 220 are the additional device of camera module, and subsidiary components 220 can be resistance, electricity
The electronic devices such as appearance, storage chip are also possible to other types SMD (Surface Mounted Devices, surface mount device
Part) electronic device.
Image sensor chip 210 and subsidiary components 220 are fixedly linked with encapsulation part 230,210 He of image sensor chip
Subsidiary components 220 are packaged the encapsulation of portion 230.Specifically, image sensor chip 210 can choose wafer-level package technology
Image sensor chip.
In the present embodiment, encapsulation module 200 is fixedly linked by conductive adhesive layer 300 with circuit board 100, conductive adhesive layer 300
It can play the role of fixed bonding.At the same time, the pin 211 of image sensor chip 210 and drawing for subsidiary components 220
Foot 221 is electrically connected by conductive adhesive layer 300 with circuit board 100.In the embodiment of the present invention, the conducting direction of conductive adhesive layer 300
Perpendicular to circuit board 100, such as the direction arrow A in Fig. 3.It is non-conductive in the direction for being parallel to circuit board 100.
It should be noted that conductive adhesive layer 300 can only be now perpendicular in fact on the direction of circuit board 100 in the present embodiment
Electrical connection, during setting, circuit board 100 has be respectively used to be electrically connected with pin 211 and pin 221 first electric
Interconnecting piece and the second electrical connection section, conductive adhesive layer 300 can be realized being electrically connected for the first electrical connection section and pin 211, while energy
Being electrically connected between the second electrical connection section and pin 221 is enough realized, without will lead to being electrically connected for pin 211 and the second electrical connection section
It connects, while being electrically connected for pin 221 and the first electrical connection section will not be caused.
The conductive conducting particles of orientation is provided in conductive adhesive layer 300, by the contact between conducting particles, to reach
Said effect.Certainly, other orientation conductive structures, such as conductive bar can also be set in conductive adhesive layer 300, can equally be reached
To above-mentioned electrical connection effect.
Image sensor chip 210 and subsidiary components 220 are packaged by camera module disclosed by the embodiments of the present invention
The encapsulation of portion 230 forms encapsulation module 200, and encapsulation module 200 realizes the assembling between circuit board 100 by conductive adhesive layer 300,
The pin 211 of image sensor chip 210 and the pin 221 of subsidiary components 220 pass through conductive adhesive layer 300 and circuit board 100
Electrical connection.For realizing the installation of subsidiary components 220 on circuit boards using SMT technique, the embodiment of the present invention
The case where inspecting periodically and replace rapid wear accessory to the implementation of SMT equipment is not present in disclosed camera module, and can be avoided
When carrying out Reflow Soldering process, the buckling deformation problem of circuit board, and then can be avoided residual stress.Due to using conductive adhesive layer
300 realize electrical connection, therefore there is no tin phenomenon is connected using existing for soldering electrical connection, simplify the control in process.It can
See, camera module disclosed by the embodiments of the present invention is not only able to simplify technique, and can also improve the quality of camera module.
In addition, encapsulation module 200 itself intensity with higher, is not only able to provide well image sensor chip 210
Support, and can also prevent to occur in by exogenic processes the risk of the fracture of image sensor chip 210.It is of the invention based on this
Camera module disclosed in embodiment is lower to the supporting role requirement of circuit board 100, and circuit board 100 only needs to meet route
Conducting effect is more advantageous in such cases and selects thinner circuit board 100, and then can further decrease camera
The height of mould group ultimately facilitates the lightening design of terminal device.
Due to the higher-strength of encapsulation module 200, can ensure preferable flatness, be affected by temperature it is smaller, because
This can preferably ensure the depth of parallelism of circuit board 100 Yu image sensor chip 210, finally enable to the figure of camera module
More preferably as acquisition capability.
Attachment of traditional camera module due to carrying out subsidiary components 220 using SMT technique, in order to avoid occurring
Even tin risk, adjacent subsidiary components 220 need to retain biggish distance, and camera mould disclosed by the embodiments of the present invention
In group, being electrically connected between circuit board 100 is realized by conductive adhesive layer 300 after subsidiary components 220 are packed, therefore not
The distance between in the presence of even tin risk, therefore subsidiary components 220 can be reduced, reach the effect for increasing electronic device integrated level
Fruit.
In order to further increase the flatness after assembling, the pin 211 and subsidiary components of image sensor chip 210
220 pin 221 is in the same plane, that is to say, that be electrically connected junction and the auxiliary of the pin 211 of image sensor chip 210
The junction that is electrically connected of the pin 221 of electronic device 220 is coplanar.In such cases, during assembly, encapsulation module 200 passes through
After conductive adhesive layer 300 is bonded on circuit board 100, it is capable of the flat of preferably holding circuit plate 100 and image sensor chip 210
Face degree.
Referring again to Fig. 1, it is generally the case that camera module further includes bracket 600 and camera lens 400, and camera lens 400 is installed
On bracket 600, bracket 600 is fixed on circuit board 100, and image sensor chip 210 is found a view through camera lens 400.Preferred side
In case, protecting film 500 has been can be set away from one end of image sensor chip 210 in camera lens 400, and protecting film 500 can play anti-
The effect of goggle head 400.Optical filter has can be set in the other end of camera lens 400 towards image sensor chip 210, and optical filter can
Play the role of optical filtering.Circuit board 100 can connect flexible circuit board 700, specifically, one end of flexible circuit board 700 with
Circuit board 100 is electrically connected, and the other end can be electrically connected by electric connector 800 with the mainboard of terminal device.Specifically, electrical connection
Device 800 can be Board-to-Board Electrical Connector.
In the present embodiment, image sensor chip 210 and subsidiary components 220 are packaged the encapsulation of portion 230.Encapsulation part 230
It can be packaging plastic.Certainly, encapsulation part 230 or other structures, in preferred scheme, encapsulation part 230 may include gold
Belong to the filling glue 232 that ceramics outer parts 231 and are filled in cermet outer part 231, image sensor chip 210 and auxiliary electricity
Sub- device 220 is fixedly linked with filling glue 232.In such cases, encapsulation part 230 includes cermet material, cermet material
The advantages of material has Metal Packaging and ceramic package concurrently, can be improved preferable surface planarity.At the same time, cermet periphery
Portion 231 can have good heat dissipation performance, can efficiently work image sensor chip 210 and subsidiary components 220
The heat generated in the process removes.Moreover, the intensity of the encapsulation part 230 of such structure is higher, camera mould can be preferably supported
The deformation that group generates in falling process, and then image sensor chip 210 and subsidiary components 220 can be provided better protection against,
Avoid the damage because of camera module caused by the falling of terminal device.
In camera module disclosed by the embodiments of the present invention, circuit board 100 can be rigid-flexible circuit board, or
Hard circuit board, is also possible to flexible circuit board, and the embodiment of the present invention does not limit the specific type of circuit board 100.
Based on camera module disclosed by the embodiments of the present invention, the embodiment of the present invention discloses a kind of terminal device, disclosed
Terminal device may include camera module described in foregoing embodiments.
Terminal device disclosed by the embodiments of the present invention can be mobile phone, tablet computer, E-book reader, game machine, can
The terminal devices such as wearable device (such as smartwatch), the embodiment of the present invention do not limit the specific type of terminal device.
Based on camera module disclosed by the embodiments of the present invention, the embodiment of the present invention discloses a kind of production of camera module
Method, please also refer to Fig. 1-Fig. 4, disclosed production method includes:
S101, image sensor chip 210 and subsidiary components 220 are encapsulated by encapsulation part 230 to prepare Encapsulation Moulds
Group 200.
The purpose of this step is to encapsulate, i.e., by 220 tubular of image sensor chip 210 and subsidiary components.Specifically,
Step S101 can be realized by following steps:
Step a, image sensor chip 210 and subsidiary components 220 are laid according to predeterminated position.In this step
Selected image sensor chip 210 and subsidiary components 220 are placed on preset position, preset position
It can be designed according to the electrically connecting position in circuit board 100.
Step b, on image sensor chip 210 and subsidiary components 220, encapsulating is to form encapsulation module 200.
Step c, the encapsulation module 200 after solidification is processed, so that 211 He of pin of image sensor chip 210
The pin 221 of subsidiary components 220 is exposed and is in the same plane.
In the encapsulation module 200 that such method is formed, the pin 211 and subsidiary components 220 of image sensor chip 210
Pin 221 it is exposed and be in the same plane, during step S102 is connected by conductive adhesive layer 300 later, nothing
Doubt the flatness that can guarantee circuit board 100 in assembling process.
Specifically, step c can process encapsulation module 200 by the way of radium-shine or plain grinding, so that image
The pin 211 of sensing chip 210 and the pin 221 of subsidiary components 220 are exposed and be in the same plane.Certainly, also
Other modes can be used, the present embodiment is without limitation.
S102,200 conductive adhesive layer 300 of encapsulation module is adhesively fixed on circuit board 100, image sensor chip 210
The pin 221 of pin 211 and subsidiary components 220 is electrically connected by conductive adhesive layer 300 with circuit board 100.
Emphasis describes the difference between each embodiment, difference between each embodiment in foregoing embodiments of the present invention
As long as optimization feature non-contradiction, can combine to form more preferably embodiment, it is contemplated that style of writing is succinct, then no longer superfluous at this
It states.
The above description is only an embodiment of the present invention, is not intended to restrict the invention.For those skilled in the art
For, the invention may be variously modified and varied.All any modifications made within the spirit and principles of the present invention are equal
Replacement, improvement etc., should be included within scope of the presently claimed invention.
Claims (10)
1. a kind of camera module characterized by comprising
Circuit board；
Encapsulation module, the encapsulation module include image sensor chip, subsidiary components and encapsulation part, and described image senses core
Piece and the subsidiary components are fixedly linked with the encapsulation part, and the encapsulation module is with the circuit board perpendicular to described
The direction of circuit board stacks, and the encapsulation module is fixedly linked by conductive adhesive layer and the circuit board, and described image senses core
The pin of the pin of piece and the subsidiary components passes through the conductive adhesive layer and the circuit board electrical connection, the conduction
The conducting direction of glue-line is perpendicular to the circuit board.
2. camera module according to claim 1, which is characterized in that the pin of described image sensing chip with it is described auxiliary
The pin of electronic device is helped to be in the same plane.
3. camera module according to claim 1, which is characterized in that the subsidiary components include SMD electronics device
Part.
4. camera module according to claim 3, which is characterized in that the SMD electronic device include resistance, capacitor,
At least one of storage chip.
5. camera module according to claim 1, which is characterized in that the circuit board is rigid-flexible circuit board.
6. camera module according to claim 1, which is characterized in that the encapsulation part include cermet outer part and
The filling glue being filled in the cermet outer part, described image sensing chip are filled out with the subsidiary components with described
Glue is filled to be fixedly linked.
7. a kind of terminal device, which is characterized in that including camera module of any of claims 1-6.
8. a kind of production method of camera module characterized by comprising
Image sensor chip and subsidiary components are encapsulated by encapsulation part to prepare encapsulation module；
The encapsulation module is adhesively fixed on circuit boards by conductive adhesive layer, the pin of described image sensing chip and described
The pin of subsidiary components passes through the conductive adhesive layer and the circuit board electrical connection.
9. production method according to claim 8, which is characterized in that the preparation encapsulation module, comprising:
Described image sensing chip and the subsidiary components are laid according to predeterminated position；
Encapsulating is on described image sensing chip and the subsidiary components to form encapsulation module；
The encapsulation module after solidification is processed, so that the pin of described image sensing chip and the auxiliary electron
The pin of device is exposed and is in the same plane.
10. manufacturing method according to claim 9, which is characterized in that the encapsulation module after solidification is processed,
It include: to be processed by the way of radium-shine or plain grinding to the encapsulation module, so that the pin of described image sensing chip
It is exposed with the pin of the subsidiary components and be in the same plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910335855.2A CN110099202A (en) | 2019-04-24 | 2019-04-24 | The production method of camera module, terminal device and camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910335855.2A CN110099202A (en) | 2019-04-24 | 2019-04-24 | The production method of camera module, terminal device and camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110099202A true CN110099202A (en) | 2019-08-06 |
Family
ID=67445751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910335855.2A Pending CN110099202A (en) | 2019-04-24 | 2019-04-24 | The production method of camera module, terminal device and camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110099202A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150021730A1 (en) * | 2013-07-19 | 2015-01-22 | Hon Hai Precision Industry Co., Ltd. | Camera module |
| CN205123872U (en) * | 2015-12-08 | 2016-03-30 | 江西芯创光电有限公司 | Automatic camera module of focusing |
| CN106206485A (en) * | 2016-09-20 | 2016-12-07 | 苏州科阳光电科技有限公司 | Imageing sensor module and preparation method thereof |
| CN106229325A (en) * | 2016-09-21 | 2016-12-14 | 苏州科阳光电科技有限公司 | Sensor module and preparation method thereof |
| CN107071238A (en) * | 2016-12-23 | 2017-08-18 | 江苏正桥影像科技股份有限公司 | A kind of ultra-thin high-definition camera module and its manufacturing process |
| CN107301988A (en) * | 2017-05-27 | 2017-10-27 | 格科微电子（上海）有限公司 | Camera module and its assembly method |
| CN107888812A (en) * | 2017-11-27 | 2018-04-06 | 维沃移动通信有限公司 | The camera module of a kind of electronic equipment and electronic equipment |
| CN208489193U (en) * | 2018-08-20 | 2019-02-12 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN208509047U (en) * | 2018-05-17 | 2019-02-15 | 江西联益光学有限公司 | Camera module |
| CN109461746A (en) * | 2018-09-30 | 2019-03-12 | 华为技术有限公司 | A kind of CCD camera assembly, assemble method and terminal |
-
2019
- 2019-04-24 CN CN201910335855.2A patent/CN110099202A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150021730A1 (en) * | 2013-07-19 | 2015-01-22 | Hon Hai Precision Industry Co., Ltd. | Camera module |
| CN205123872U (en) * | 2015-12-08 | 2016-03-30 | 江西芯创光电有限公司 | Automatic camera module of focusing |
| CN106206485A (en) * | 2016-09-20 | 2016-12-07 | 苏州科阳光电科技有限公司 | Imageing sensor module and preparation method thereof |
| CN106229325A (en) * | 2016-09-21 | 2016-12-14 | 苏州科阳光电科技有限公司 | Sensor module and preparation method thereof |
| CN107071238A (en) * | 2016-12-23 | 2017-08-18 | 江苏正桥影像科技股份有限公司 | A kind of ultra-thin high-definition camera module and its manufacturing process |
| CN107301988A (en) * | 2017-05-27 | 2017-10-27 | 格科微电子（上海）有限公司 | Camera module and its assembly method |
| CN107888812A (en) * | 2017-11-27 | 2018-04-06 | 维沃移动通信有限公司 | The camera module of a kind of electronic equipment and electronic equipment |
| CN208509047U (en) * | 2018-05-17 | 2019-02-15 | 江西联益光学有限公司 | Camera module |
| CN208489193U (en) * | 2018-08-20 | 2019-02-12 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN109461746A (en) * | 2018-09-30 | 2019-03-12 | 华为技术有限公司 | A kind of CCD camera assembly, assemble method and terminal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105611135B (en) | System-level camera module and its electrical bracket and manufacturing method | |
| CN102646606B (en) | Packaging method of integrated circuit (IC) card module | |
| CN100527412C (en) | Electronic circuit module and method for fabrication thereof | |
| EP2733727B1 (en) | Packaging method of quad flat non-leaded package | |
| WO2021184190A1 (en) | Circuit board structure, electronic product, and manufacturing method and repair method for circuit board structure | |
| CN109244045A (en) | A kind of thick film substrate miniaturization Can encapsulating structure | |
| WO2023011666A1 (en) | Camera module, image acquisition module, and processing method for base of image acquisition module | |
| CN102270589B (en) | The manufacture method of semiconductor element and corresponding semiconductor element | |
| CN102984442B (en) | Stent-type image sensing module and preparation method thereof and multi-cam device | |
| JP2015188004A (en) | Package, semiconductor device, and semiconductor module | |
| CN109981958A (en) | The production method of camera module, terminal device and camera module | |
| CN103165794B (en) | Optical semiconductor device base station, its manufacture method and optical semiconductor device | |
| CN107155048A (en) | Dual camera module and terminal device | |
| CN207560141U (en) | Camera module | |
| CN100442466C (en) | Method for manufacturing wafer-level optoelectronic semiconductor assembly structure | |
| CN202075772U (en) | Contact-type integrated card (IC) module | |
| CN110099202A (en) | The production method of camera module, terminal device and camera module | |
| CN204792795U (en) | Terminal equipment | |
| CN219107753U (en) | Circuit board assembly and electronic equipment | |
| CN217882285U (en) | Laser semiconductor chip packaging structure and electronic equipment | |
| CN107808889B (en) | Stacked package structure and packaging method | |
| CN210467805U (en) | Chip packaging structure | |
| JP2010219180A (en) | Electronic component mounting structure, method for mounting electronic component, and substrate connecting component | |
| CN113747660A (en) | Image pickup apparatus and method for connecting the same | |
| CN222283350U (en) | A kind of inverted miniaturized camera module structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190806 |