CN110054865B - 树脂组合物 - Google Patents
树脂组合物 Download PDFInfo
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- CN110054865B CN110054865B CN201910048240.1A CN201910048240A CN110054865B CN 110054865 B CN110054865 B CN 110054865B CN 201910048240 A CN201910048240 A CN 201910048240A CN 110054865 B CN110054865 B CN 110054865B
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- epoxy
- carbodiimide
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- 239000011342 resin composition Substances 0.000 title claims abstract description 92
- 239000003822 epoxy resin Substances 0.000 claims abstract description 64
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 64
- 150000001875 compounds Chemical class 0.000 claims abstract description 43
- 150000002148 esters Chemical group 0.000 claims abstract description 33
- 150000001718 carbodiimides Chemical class 0.000 claims abstract description 26
- 229920006295 polythiol Polymers 0.000 claims abstract description 20
- -1 amine compound Chemical class 0.000 claims description 92
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 239000004593 Epoxy Substances 0.000 claims description 19
- 239000011256 inorganic filler Substances 0.000 claims description 19
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 19
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 16
- 125000003700 epoxy group Chemical group 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 12
- 239000012948 isocyanate Substances 0.000 claims description 12
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 229910052623 talc Inorganic materials 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 239000000454 talc Substances 0.000 claims description 7
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 6
- 239000004202 carbamide Substances 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 239000010445 mica Substances 0.000 claims description 6
- 229910052618 mica group Inorganic materials 0.000 claims description 6
- 238000007259 addition reaction Methods 0.000 claims description 5
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims description 4
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 2
- 229910002113 barium titanate Inorganic materials 0.000 claims description 2
- 229910021523 barium zirconate Inorganic materials 0.000 claims description 2
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 claims description 2
- 229910002115 bismuth titanate Inorganic materials 0.000 claims description 2
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004927 clay Substances 0.000 claims description 2
- 229910052570 clay Inorganic materials 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 235000012222 talc Nutrition 0.000 claims 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 11
- 150000003573 thiols Chemical class 0.000 abstract description 8
- 238000001723 curing Methods 0.000 description 39
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 21
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 18
- 238000012360 testing method Methods 0.000 description 15
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 13
- 125000003118 aryl group Chemical group 0.000 description 12
- 239000002253 acid Substances 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 239000002245 particle Substances 0.000 description 11
- 239000007962 solid dispersion Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 229920003986 novolac Polymers 0.000 description 10
- 239000007787 solid Substances 0.000 description 10
- 238000003860 storage Methods 0.000 description 10
- 125000001931 aliphatic group Chemical group 0.000 description 9
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 8
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 8
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 8
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 239000004793 Polystyrene Substances 0.000 description 6
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 6
- 229920002223 polystyrene Polymers 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- CWERGRDVMFNCDR-UHFFFAOYSA-M thioglycolate(1-) Chemical compound [O-]C(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-M 0.000 description 6
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 5
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 5
- 150000007513 acids Chemical class 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 150000003077 polyols Chemical class 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 150000005846 sugar alcohols Polymers 0.000 description 5
- RQPNXPWEGVCPCX-UHFFFAOYSA-N 3-sulfanylbutanoic acid Chemical compound CC(S)CC(O)=O RQPNXPWEGVCPCX-UHFFFAOYSA-N 0.000 description 4
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 4
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 150000004645 aluminates Chemical class 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 150000002763 monocarboxylic acids Chemical class 0.000 description 4
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 4
- 150000007519 polyprotic acids Polymers 0.000 description 4
- 125000001302 tertiary amino group Chemical group 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- AJSTXXYNEIHPMD-UHFFFAOYSA-N triethyl borate Chemical compound CCOB(OCC)OCC AJSTXXYNEIHPMD-UHFFFAOYSA-N 0.000 description 4
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 3
- YAAUVJUJVBJRSQ-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2-[[3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propoxy]methyl]-2-(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS YAAUVJUJVBJRSQ-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 229940024606 amino acid Drugs 0.000 description 3
- 235000001014 amino acid Nutrition 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000001879 gelation Methods 0.000 description 3
- 239000002608 ionic liquid Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920005862 polyol Polymers 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- ACTRVOBWPAIOHC-UHFFFAOYSA-N succimer Chemical compound OC(=O)C(S)C(S)C(O)=O ACTRVOBWPAIOHC-UHFFFAOYSA-N 0.000 description 3
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 2
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 2
- GSLTVFIVJMCNBH-UHFFFAOYSA-N 2-isocyanatopropane Chemical compound CC(C)N=C=O GSLTVFIVJMCNBH-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 2
- CFPHMAVQAJGVPV-UHFFFAOYSA-N 2-sulfanylbutanoic acid Chemical compound CCC(S)C(O)=O CFPHMAVQAJGVPV-UHFFFAOYSA-N 0.000 description 2
- ALKYHXVLJMQRLQ-UHFFFAOYSA-N 3-Hydroxy-2-naphthoate Chemical compound C1=CC=C2C=C(O)C(C(=O)O)=CC2=C1 ALKYHXVLJMQRLQ-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 2
- DTRIDVOOPAQEEL-UHFFFAOYSA-M 4-sulfanylbutanoate Chemical compound [O-]C(=O)CCCS DTRIDVOOPAQEEL-UHFFFAOYSA-M 0.000 description 2
- DTRIDVOOPAQEEL-UHFFFAOYSA-N 4-sulfanylbutanoic acid Chemical compound OC(=O)CCCS DTRIDVOOPAQEEL-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical compound NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1483—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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Abstract
本发明的课题是提供耐湿性优异的含有含酯结构的硫醇的环氧树脂组合物。本发明的解决方案是一种树脂组合物,其包含:环氧树脂、含酯结构的多硫醇化合物、以及分子量为150~13000的碳二亚胺。
Description
技术领域
本发明涉及树脂组合物。
背景技术
使用多硫醇化合物作为固化剂的环氧树脂组合物由于低温固化性、快速固化性良好,因此被用于粘接剂、密封剂、涂层剂等各种用途。多硫醇化合物中,含酯结构的多硫醇化合物因为合成容易,可低成本地制造,所以时常被采用(专利文献1)。
现有技术文献
专利文献
专利文献1:日本专利特开平11-256013。
发明内容
发明所要解决的技术问题
然而,含酯结构的多硫醇化合物由于酯结构容易发生水解,含有含酯结构的多硫醇化合物的环氧树脂组合物也在耐湿性(防潮性)方面有改善的余地。于是,本发明的课题在于提供耐湿性优异的含有含酯结构的多硫醇化合物的环氧树脂组合物。
解决技术问题所采用的技术方案
为了解决上述课题,本发明包含以下的事项,
[1] 一种树脂组合物,其特征在于,包含:
(A)环氧树脂、
(B)含酯结构的多硫醇化合物、以及
(C)分子量为150~13000的碳二亚胺(碳化二亚胺);
[2] 根据上述[1]所述的树脂组合物,其特征在于,将所述树脂组合物的不挥发成分设为100质量%时,所述树脂组合物中的所述碳二亚胺的含量为0.01~50质量%;
[3] 根据上述[1]或[2]所述的树脂组合物,其特征在于,还包含(E)无机填充材料;
[4] 根据上述[3]所述的树脂组合物,其特征在于,将树脂组合物中的不挥发成分设为100质量份时,所述无机填充材料的含量为1~70质量份;
[5] 根据上述[3]或[4]所述的树脂组合物,其特征在于,所述无机填充材料包含选自二氧化硅、碳酸钙、滑石和云母中的至少1种;
[6] 根据上述[1]~[5]中任一项所述的树脂组合物,其特征在于,所述树脂组合物中的环氧基与硫醇基的当量比(环氧基/硫醇基)为0.50~10.0;
[7] 根据上述[1]~[6]中任一项所述的树脂组合物,其特征在于,还包含(D)固化促进剂;
[8] 根据上述[7]所述的树脂组合物,其特征在于,所述固化促进剂为潜伏性固化促进剂;
[9] 根据上述[8]所述的树脂组合物,其特征在于,所述潜伏性固化促进剂包含选自胺化合物的环氧加合物、胺化合物的脲加合物、以及使异氰酸酯化合物与环氧加合物的羟基发生加成反应而得的化合物中的至少1种;
[10] 根据上述[1]~[9]中任一项所述的树脂组合物,其特征在于,该树脂组合物为单组分(one-component)树脂组合物;
[11] 一种粘接剂,其特征在于,包含上述[1]~[10]中任一项所述的树脂组合物;
[12] 根据上述[11]所述的粘接剂,其特征在于,该粘接剂用于相机模块(cameramodule)的构件(结构构件)间的粘接;
[13] 一种密封剂,其特征在于,包含上述[1]~[10]中任一项所述的树脂组合物;
[14] 一种涂层剂,其特征在于,包含上述[1]~[10]中任一项所述的树脂组合物;
[15] 一种固化物,其特征在于,使上述[1]~[10]中任一项所述的树脂组合物热固化而成;
[16] 一种电子部件,其特征在于,包含上述[15]所述的固化物。
发明的效果
如果采用本发明,则可提供保存稳定性、低温固化性、耐湿性优异的含有含酯结构的硫醇的环氧树脂组合物。
具体实施方式
本发明的实施方式涉及的树脂组合物包含(A)环氧树脂、(B)含酯结构的多硫醇化合物、及(C)分子量为150~13000的碳二亚胺。
根据本实施方式,通过使用分子量为150~13000的碳二亚胺,即使在使用低成本的含酯结构的多硫醇化合物作为固化剂的情况下,也可获得具有优异的耐湿性的树脂组合物。即,尽管使用含酯结构的硫醇,也可获得具有优异的耐湿性的树脂组合物。
本实施方式涉及的树脂组合物较好是“单组分”的树脂组合物。所谓“单组分”的树脂组合物是指将固化剂和环氧树脂预先混合的组合物,是具有通过加热而固化的性质的组合物。
以下,对(A)~(C)的各成分进行详细说明。
[(A):环氧树脂]
作为环氧树脂,只要是在分子内具有至少1个环氧基的树脂,则无特别限定。作为环氧树脂,较好是使用平均每一分子中具有2个以上的环氧基的树脂。
作为环氧树脂,可列举例如:使双酚A、双酚F、双酚AD、邻苯二酚、间苯二酚等多元酚或者甘油、聚乙二醇等多元醇与环氧氯丙烷反应而得的多缩水甘油醚;使对羟基苯甲酸、β-羟基萘甲酸之类的羟基羧酸与环氧氯丙烷反应而得的缩水甘油醚酯;使邻苯二甲酸、对苯二甲酸之类的多元羧酸与环氧氯丙烷反应而得的多缩水甘油酯;以及环氧化苯酚酚醛树脂(phenol novolac resin)、环氧化甲酚酚醛树脂(cresol novolac resin)、环氧化聚烯烃、环式脂肪族环氧树脂、及氨基甲酸酯改性环氧树脂;等等,但并不仅限于这些例子。
其中,作为环氧树脂,从保持高耐热性及低透湿性等观点来看,较好是选自双酚A型环氧树脂、双酚F型环氧树脂、苯酚酚醛型环氧树脂、联苯芳烷基型环氧树脂、苯酚芳烷基型环氧树脂、芳族缩水甘油胺型环氧树脂、及具有二环戊二烯结构的环氧树脂中的至少一种;更好是选自双酚A型环氧树脂、双酚F型环氧树脂、苯酚酚醛型环氧树脂、及具有二环戊二烯结构的环氧树脂中的至少一种。
环氧树脂可以是液态,也可以是固态,可使用液态树脂和固态树脂这两者。在此,“液态”及“固态”是指25℃下的环氧树脂的状态。从涂布性、加工性、粘接性的观点来看,较好是使用的所有环氧树脂的至少10质量%以上为液态。
环氧树脂的环氧当量例如为50~1000g/eq,较好是100~500g/eq,更好是150~300g/eq。在此,环氧当量是指平均一当量的环氧基对应的环氧树脂的质量,可按照JIS K7236(2009)进行测定。
作为液态环氧树脂的具体例子,包括:双酚A型环氧树脂(三菱化学公司制“jER828EL”、“jER827”)、双酚F型环氧树脂(三菱化学公司制“jER807”)、苯酚酚醛型环氧树脂(三菱化学公司制“jER152”)、萘型二官能环氧树脂(DIC公司制“HP4032”、“HP4032D”)、双酚A型环氧树脂/双酚F型环氧树脂(新日铁住金化学公司制“ZX1059”)、氢化结构的环氧树脂(三菱化学公司制“YX-8000”)、具有丁二烯结构的环氧树脂(大赛璐化学工业公司制“PB-3600”)。其中,较好是高耐热且低粘度的三菱化学公司制的“jER828EL”、“jER827”、“jER807”及“ZX1059”,更好是“jER828EL”。此外,作为固态环氧树脂的具体例子,可列举:萘型四官能环氧树脂(DIC公司制“HP-4700”)、二环戊二烯型多官能环氧树脂(DIC公司制“HP-7200”)、萘酚型环氧树脂(新日铁住金化学公司制“ESN-475V”)、具有联苯结构的环氧树脂(日本化药公司制“NC-3000H”、“NC-3000L”,三菱化学公司制“YX-4000”)等。
作为优选的环氧树脂,可列举:双酚A型环氧树脂/双酚F型环氧树脂混合物(新日铁住金化学公司制“ZX1059”)、苯酚酚醛型环氧树脂(三菱化学公司制“jER152”)、及二环戊二烯型多官能环氧树脂(DIC公司制“HP-7200”)等。
将树脂组合物中的不挥发成分设为100质量%时,树脂组合物中的作为(A)成分的环氧树脂的含量例如为5质量%以上,较好是10质量%以上,更好是20质量%以上,例如为95质量%以下,较好是90质量%以下,更好是85质量%以下,进一步更好是80质量%以下,特别好是75质量%以下,最好是70质量%以下。
[(B):含酯结构的多硫醇化合物]
作为含酯结构的多硫醇化合物,只要是在分子内包含酯结构及2个以上的硫醇基的化合物,则无特别限定。
含酯结构的多硫醇化合物较好是三官能~六官能化合物(一分子中的硫醇基个数为3~6的化合物)。
含酯结构的多硫醇化合物较好是以树脂组合物中的环氧基与硫醇基的当量比(环氧基/硫醇基)为0.50~10.0的量被包含。当量比(环氧基/硫醇基)更好是0.75~5.0,进一步更好是0.80~2.0。
应予说明,硫醇基的当量是指平均一当量的硫醇基对应的含酯结构的多硫醇化合物的质量。
将作为(A)成分的环氧树脂的含量设为100质量份时,作为(B)成分的含酯结构的多硫醇化合物的含量例如为1~200质量份,较好是5~150质量份,更好是50~100质量份。
作为含酯结构的多硫醇化合物,可列举例如多元醇与巯基有机酸的偏酯、全酯。在此,所谓偏酯是指多元醇与羧酸的酯并且是多元醇的羟基的一部分形成了酯键的酯,所谓全酯是指多元醇的羟基全部形成了酯键的酯。作为所述多元醇,可列举例如:乙二醇、三羟甲基丙烷、季戊四醇及二季戊四醇等。作为所述巯基有机酸,可列举例如:巯基乙酸、巯基丙酸(例:3-巯基丙酸)、巯基丁酸(例:3-巯基丁酸、4-巯基丁酸)等巯基脂肪族单羧酸;通过羟基酸与巯基有机酸的酯化反应得到的含有硫醇基和羧基的酯;巯基琥珀酸、二巯基琥珀酸(例:2,3-二巯基琥珀酸)等巯基脂肪族二羧酸;巯基苯甲酸(例:4-巯基苯甲酸)等巯基芳族单羧酸;等等。所述巯基脂肪族单羧酸的碳数较好是2~8,更好是2~6,进一步更好是2~4,特别好是3。所述巯基有机酸中,较好是碳数为2~8的巯基脂肪族单羧酸,更好是巯基乙酸、3-巯基丙酸、3-巯基丁酸及4-巯基丁酸,进一步更好是3-巯基丙酸。
作为多元醇与巯基有机酸的偏酯的具体例子,可列举:三羟甲基丙烷二(巯基乙酸酯)、三羟甲基丙烷二(3-巯基丙酸酯)、三羟甲基丙烷二(3-巯基丁酸酯)、三羟甲基丙烷二(4-巯基丁酸酯)、季戊四醇三(巯基乙酸酯)、季戊四醇三(3-巯基丙酸酯)、季戊四醇三(3-巯基丁酸酯)、季戊四醇三(4-巯基丁酸酯)、二季戊四醇四(巯基乙酸酯)、二季戊四醇四(3-巯基丙酸酯)、二季戊四醇四(3-巯基丁酸酯)、二季戊四醇四(4-巯基丁酸酯)等。
作为多元醇与巯基有机酸的全酯的具体例子,可列举:乙二醇二(巯基乙酸酯)、乙二醇二(3-巯基丙酸酯)、乙二醇二(3-巯基丁酸酯)、乙二醇二(4-巯基丁酸酯)、三羟甲基丙烷三(巯基乙酸酯)、三羟甲基丙烷三(3-巯基丙酸酯)、三羟甲基丙烷三(3-巯基丁酸酯)、三羟甲基丙烷三(4-巯基丁酸酯)、季戊四醇四(巯基乙酸酯)、季戊四醇四(3-巯基丙酸酯)、季戊四醇四(3-巯基丁酸酯)、季戊四醇四(4-巯基丁酸酯)、二季戊四醇六(巯基乙酸酯)、二季戊四醇六(3-巯基丙酸酯)、二季戊四醇六(3-巯基丁酸酯)、二季戊四醇六(4-巯基丁酸酯)等。较好是选自季戊四醇四(3-巯基丙酸酯)、季戊四醇四(3-巯基丁酸酯)、二季戊四醇六(3-巯基丙酸酯)及三羟甲基丙烷三(3-巯基丙酸酯)中的至少一种。
此外,作为含酯结构的多硫醇化合物,还可使用例如三[(3-巯基丙酰氧基)乙基]异氰脲酸酯、1,3,5-三(3-巯基丁氧基乙基)-1,3,5-三嗪-2,4,6(1H,3H,5H)-三酮等。
[(C)碳二亚胺]
作为(C成分)的碳二亚胺只要是分子量为150~13000且在分子内具有“-N=C=N-”结构的化合物,则无特别限定。
碳二亚胺的分子量较好是170以上,更好是185以上,进一步更好是200以上。如果在这样的范围内,不仅耐湿性提高,还可获得良好的保存稳定性。
此外,碳二亚胺的分子量较好是8000以下,较好是6000以下,更好是5000以下,进一步更好是4000以下。如果在这样的范围内,可获得更优异的耐湿性。
应予说明,本说明书中,碳二亚胺为聚合物的情况下,碳二亚胺的分子量是指“质均分子量”。
在此,碳二亚胺的质均分子量是通过凝胶渗透色谱法(GPC)测定的聚苯乙烯换算的质均分子量,具体来说,对于碳二亚胺的聚苯乙烯换算的质均分子量而言,可使用株式会社岛津制作所制LC-9A/RID-6A作为测定装置,使用昭和电工公司制Shodex K-800P/K-804L/K-804L作为柱,使用氯仿等作为流动相,在40℃的柱温下进行测定,使用标准聚苯乙烯的校正曲线算出。
作为碳二亚胺,可使用单碳二亚胺、聚碳二亚胺及环状碳二亚胺中的任一种,更好是聚碳二亚胺。碳二亚胺的质均分子量是通过凝胶渗透色谱法(GPC)测定的聚苯乙烯换算的质均分子量,具体来说,对于碳二亚胺的聚苯乙烯换算的质均分子量而言,可使用株式会社岛津制作所制LC-9A/RID-6A作为测定装置,使用昭和电工公司制Shodex K-800P/K-804L/K-804L作为柱,使用氯仿等作为流动相,在40℃的柱温下进行测定,使用标准聚苯乙烯的校正曲线算出。
作为单碳二亚胺,例如可使用如下述式(I)表示的化合物,
(式I) RA-N=C=N-RB
式中,RA和RB独立地表示C1~C18烷基、C5~C18环烷基、或芳基。芳基可被选自C1~C18烷基、硝基、氨基及羟基中的至少一种取代基取代。
作为具体的单碳二亚胺,可列举:N,N'-二邻甲苯基碳二亚胺、N,N'-二苯基碳二亚胺、N,N'-二-2,6-二甲基苯基碳二亚胺、N,N'-双(2,6-二异丙基苯基)碳二亚胺、N,N'-双(丙基苯基)碳二亚胺、N,N'-二(十八烷基)碳二亚胺、N-甲苯基-N'-环己基碳二亚胺、N,N'-二-2,2-二叔丁基苯基碳二亚胺、N-甲苯基-N'-苯基碳二亚胺、N,N'-二对硝基苯基碳二亚胺、N,N'-二对氨基苯基碳二亚胺、N,N'-二对羟基苯基碳二亚胺、N,N'-二环己基碳二亚胺、及N,N'-二对甲苯基碳二亚胺等。应予说明,其中较好是N,N'-二环己基碳二亚胺、N,N'-双(丙基苯基)碳二亚胺及双(二丙基苯基)碳二亚胺。
作为聚碳二亚胺,例如可使用日本专利5693799号中所记载的化合物。具体来说,该文献中所记载的化合物是指以下述式表示的碳二亚胺化合物,
(式):R2-(-N=C=N-R1-)m-R3
上式中,式中,R1相同或不同,表示2价芳族基团和/或脂肪族基团;
R1为芳族基团的情况下,R1可被具有至少1个碳原子的脂肪族取代基和/或脂环族取代基和/或芳族取代基取代。在此,这些取代基可具有杂原子,且这些取代基可在碳二亚胺基键合的芳族基团的至少1个邻位取代;
R2为C1~C18烷基、C5~C18环烷基、芳基、C7~C18芳烷基、-R4-NH-COS-R5、-R4COOR5、-R4-OR5、-R4-N(R5)2、-R4-SR5、-R4-OH、-R4-NH2、-R4-NHR5、-R4-环氧基、-R4-NCO、-R4-NHCONHR5、-R4-NHCONR5R6或-R4-NHCOOR7;
R3为-N=C=N-芳基、-N=C=N-烷基、-N=C=N-环烷基、-N=C=N-芳烷基、-NCO、-NHCONHR5、-NHCONHR5R6、-NHCOOR7、-NHCOS-R5、-COOR5、-OR5、环氧基、-N(R5)2、-SR5、-OH、-NH2、-NHR5;
R4表示2价芳族基团和/或脂肪族基团;
R5和R6相同或不同,为C1~C20烷基、C3~C20环烷基、C7~C18芳烷基、低聚/聚乙二醇类和/或低聚/聚丙二醇类;
R7具有R5的上述定义之一,或者是聚酯基或聚酰胺基;
m为2以上的整数。
作为聚碳二亚胺,可列举:聚(4,4'-二环己基甲烷碳二亚胺)、聚(N,N'-二-2,6-二异丙基苯基碳二亚胺)、聚(1,3,5-三异丙基亚苯基-2,4-碳二亚胺)等。其中,较好是聚(1,3,5-三异丙基亚苯基-2,4-碳二亚胺)。
作为聚碳二亚胺,可使用市售品,可列举例如:脂肪族聚碳二亚胺(日清纺化学公司制“Elastostab H01”)、碳二亚胺改性异氰酸酯(日清纺化学公司制“CARBODILITE V-05”)等。其中,较好是碳二亚胺改性异氰酸酯(日清纺化学公司制“CARBODILITE V-05”)。
作为环状碳二亚胺,例如可列举日本专利5856924号中所记载的环状碳二亚胺等。
此外,将树脂组合物的不挥发成分设为100质量%时,树脂组合物中的(C)碳二亚胺的含量较好是0.01~50质量%,更好是0.1~35质量%。
[D:固化促进剂]
本实施方式涉及的树脂组合物较好是包含固化促进剂。
作为固化促进剂,较好是使用潜伏性固化促进剂。潜伏性固化促进剂特别是在制成单组分的树脂组合物的情况下是重要的成分,是具有在常温(20℃±15℃(JISZ8703))下对于环氧树脂的固化没有帮助而在加热时促进环氧树脂的固化的功能的添加剂。
作为潜伏性固化促进剂,可使用液态潜伏性固化促进剂、固体分散型潜伏性固化促进剂中的任一种,更好是使用固体分散型潜伏性固化促进剂。
液态潜伏性固化促进剂是指在常温下为可溶于环氧树脂的液体,常温下不具活性,但通过加热起到环氧树脂的固化促进剂的作用的化合物。
作为液态潜伏性固化促进剂,可列举例如离子液体,但并不仅限于此。
作为构成离子液体的阳离子,可列举例如:咪唑鎓离子、哌啶鎓离子、吡咯烷鎓离子、吡唑鎓离子、胍鎓离子、吡啶鎓离子等铵类阳离子;四烷基鏻阳离子等鏻阳离子;三乙基锍离子等锍阳离子等。
此外,作为构成离子液体的阴离子,可列举:氟离子、氯离子、溴离子、碘离子等卤化物类阴离子;甲磺酸根离子等烷基硫酸类阴离子;三氟甲磺酸根离子、六氟膦酸根离子、三氟三(五氟乙基)膦酸根离子、双(三氟甲磺酰)亚胺离子、三氟乙酸根离子、四氟硼酸根离子等含氟化合物类阴离子;苯酚离子(phenolate anion)、2-甲氧基苯酚离子、2,6-二叔丁基苯酚离子等酚类阴离子;天冬氨酸根离子、谷氨酸根离子等酸性氨基酸根离子;甘氨酸根离子、丙氨酸根离子、苯丙氨酸根离子等中性氨基酸根离子;N-苯甲酰丙氨酸根离子、N-乙酰苯丙氨酸根离子、N-乙酰甘氨酸根离子等N-酰基氨基酸根离子;甲酸根离子、乳酸根离子、酒石酸根离子、马尿酸根离子、N-甲基马尿酸根离子、苯甲酸根离子等羧酸类阴离子。
固体分散型潜伏性固化促进剂是指在常温下为不溶于环氧树脂的固体,通过加热而变得可溶,起到环氧树脂的固化促进剂的作用的化合物。
作为固体分散型潜伏性固化促进剂,可列举例如常温下呈固体的咪唑化合物、及固体分散型胺加合物类潜伏性固化促进剂,但并不仅限于这些例子。
作为所述常温下呈固体的咪唑化合物,可列举例如:2-十七烷基咪唑、2-苯基-4,5-二羟甲基咪唑、2-十一烷基咪唑、2-苯基-4-甲基-5-羟甲基咪唑、2-苯基-4-苄基-5-羟甲基咪唑、2,4-二氨基-6-(2-甲基咪唑基-(1))-乙基-均三嗪、2,4-二氨基-6-(2'-甲基咪唑基-(1)')-乙基-均三嗪·异氰脲酸加合物、2-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、1-氰乙基-2-苯基咪唑、1-氰乙基-2-甲基咪唑偏苯三甲酸盐、1-氰乙基-2-苯基咪唑偏苯三甲酸盐、N-(2-甲基咪唑基-1-乙基)脲、N,N'-(2-甲基咪唑基-(1)-乙基)己二酰二胺(N,N'-(2-methylimidazolyl-(1)-ethyl)adipoyl diamide)等,但并不仅限于这些例子。
作为固体分散型胺加合物类潜伏性固化促进剂的优选例,可列举选自胺化合物的环氧加合物、胺化合物的脲加合物、及使异氰酸酯化合物与环氧加合物的羟基发生加成反应而得的化合物中的至少1种。
作为可用作所述胺化合物的环氧加合物的制造原料之一的环氧化合物,可列举例如:使双酚A、双酚F、邻苯二酚、间苯二酚等多元酚、或者甘油或聚乙二醇之类的多元醇与环氧氯丙烷反应而得的多缩水甘油醚;使对羟基苯甲酸、β-羟基萘甲酸之类的羟基羧酸与环氧氯丙烷反应而得的缩水甘油醚酯;使邻苯二甲酸、对苯二甲酸之类的多元羧酸与环氧氯丙烷反应而得的多缩水甘油酯;使4,4'-二氨基二苯基甲烷或间氨基苯酚等与环氧氯丙烷反应而得的缩水甘油胺化合物;以及环氧化苯酚酚醛树脂、环氧化甲酚酚醛树脂、环氧化聚烯烃等多官能性环氧化合物,或者丁基缩水甘油醚、苯基缩水甘油醚、甲基丙烯酸缩水甘油酯等单官能性环氧化合物;等等,但并不仅限于这些例子。
可用作所述固体分散型胺加合物类潜伏性固化促进剂的制造原料的胺化合物,只要是在分子内具有1个以上能与环氧基发生加成反应的活性氢且至少在分子内具有1个以上选自伯氨基、仲氨基及叔氨基中的官能团的化合物即可。作为此种胺化合物,可列举例如:二亚乙基三胺、三亚乙基四胺、正丙胺、2-羟乙氨基丙胺、环己胺、4,4'-二氨基-二环己基甲烷之类的脂肪族胺类;4,4'-二氨基二苯基甲烷、2-甲基苯胺等芳族胺化合物;2-乙基-4-甲基咪唑、2-乙基-4-甲基咪唑啉、2,4-二甲基咪唑啉、哌啶、哌嗪等含氮原子的杂环化合物;等等,但并不仅限于这些例子。
此外,其中特别是在分子内具有叔氨基的化合物是提供具有优异的固化促进能力的潜伏性固化促进剂的原料,作为此种化合物的例子,可列举例如:二甲氨基丙胺、二乙氨基丙胺、二正丙氨基丙胺、二丁氨基丙胺、二甲氨基乙胺、二乙氨基乙胺、N-甲基哌嗪等胺化合物、或者2-甲基咪唑、2-乙基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑等咪唑化合物之类的在分子内具有叔氨基的伯胺类或仲胺类;2-二甲氨基乙醇、1-甲基-2-二甲氨基乙醇、1-苯氧基甲基-2-二甲氨基乙醇、2-二乙氨基乙醇、1-丁氧基甲基-2-二甲氨基乙醇、1-(2-羟基-3-苯氧基丙基)-2-甲基咪唑、1-(2-羟基-3-苯氧基丙基)-2-乙基-4-甲基咪唑、1-(2-羟基-3-丁氧基丙基)-2-甲基咪唑、1-(2-羟基-3-丁氧基丙基)-2-乙基-4-甲基咪唑、1-(2-羟基-3-苯氧基丙基)-2-苯基咪唑啉、1-(2-羟基-3-丁氧基丙基)-2-甲基咪唑啉、2-(二甲氨基甲基)苯酚、2,4,6-三(二甲氨基甲基)苯酚、N-β-羟基乙基吗啉、2-二甲氨基乙硫醇、2-巯基吡啶、2-苯并咪唑、2-巯基苯并咪唑、2-巯基苯并噻唑、4-巯基吡啶、N,N-二甲氨基苯甲酸、N,N-二甲基甘氨酸、烟酸、异烟酸、吡啶甲酸、N,N-二甲基甘氨酰肼、N,N-二甲基丙酰肼、烟酰肼、异烟酰肼等那样的在分子内具有叔氨基的醇类、酚类、硫醇类、羧酸类及酰肼类;等等。
使所述的环氧化合物与胺化合物发生加成反应制造潜伏性固化促进剂的时候,还可添加在分子内具有2个以上的活性氢的活性氢化合物。作为此种活性氢化合物,可列举例如:双酚A、双酚F、双酚S、氢醌、邻苯二酚、间苯二酚、邻苯三酚、苯酚酚醛树脂等多元酚类,三羟甲基丙烷等多元醇类,己二酸、邻苯二甲酸等多元羧酸类,1,2-二巯基乙烷、2-巯基乙醇、1-巯基-3-苯氧基-2-丙醇、巯基乙酸、邻氨基苯甲酸、乳酸等,但并不仅限于这些例子。
作为可用作所述固体分散型胺加合物类潜伏性固化促进剂的制造原料的异氰酸酯化合物,可使用例如:正丁基异氰酸酯、异丙基异氰酸酯、苯基异氰酸酯、苄基异氰酸酯等单官能异氰酸酯化合物;六亚甲基二异氰酸酯、甲苯二异氰酸酯、1,5-萘二异氰酸酯、二苯基甲烷-4,4'-二异氰酸酯、异佛尔酮二异氰酸酯、苯二亚甲基二异氰酸酯、对苯二异氰酸酯、1,3,6-六亚甲基三异氰酸酯、双环庚烷三异氰酸酯等多官能异氰酸酯化合物;以及这些多官能异氰酸酯化合物与活性氢化合物反应而得的含末端异氰酸酯基的化合物;等等。作为此种含末端异氰酸酯基的化合物的例子,可列举:通过甲苯二异氰酸酯与三羟甲基丙烷的反应得到的具有末端异氰酸酯基的加成化合物、通过甲苯二异氰酸酯与季戊四醇的反应得到的具有末端异氰酸酯基的加成化合物等,但并不仅限于这些例子。
此外,作为可用作所述固体分散型胺加合物类潜伏性固化促进剂的制造原料的脲化合物,可列举例如脲(尿素)、硫脲等,但并不仅限于这些例子。
固体分散型潜伏性固化促进剂例如可通过下述方法容易地获得:将上述的制造原料适当混合,在室温至200℃的温度下使其反应后,进行冷却固化,然后进行粉碎,或者在甲基乙基酮、二噁烷、四氢呋喃等溶剂中使其反应,脱溶剂后,粉碎固体成分。
关于作为固体分散型潜伏性固化促进剂市售的代表例子,例如,作为胺-环氧加合物类(胺加合物类)可列举“PN-23”(Ajinomoto Fine-Techno公司制)、“Ajicure PN-H”(Ajinomoto Fine-Techno公司制)、“Hardener X-3661S”(A.C.R.公司制)、“Hardener X-3670S”(A.C.R.公司制)等,而作为脲型加合物类可列举“FXR-1081”(T&K TOKA公司制)、“Fujicure FXR-1000”(T&K TOKA公司制)、“Fujicure FXR-1030”(T&K TOKA公司制)等。
此外,还可列举作为咪唑改性微胶囊体的“Novacure HX-3721”(旭化成公司制)、“HX-3722”(旭化成公司制)、“Novacure HX-3742”(旭化成公司制)。
将作为(A)成分的环氧树脂的含量设为100质量份时,作为(D)成分的固化促进剂的含量较好是0.1~100质量份,更好是0.5~50质量份,进一步更好是1.0~30质量份。
[(E):无机填充材料]
本实施方式涉及的树脂组合物较好是包含无机填充材料。通过使用无机填充材料,可使耐湿性进一步提高。
将树脂组合物中的不挥发成分设为100质量份时,无机填充材料(E)成分的含量例如为1~70质量份,较好是5~60质量份,更好是10~50质量份。
对于无机填充材料的平均粒径而言,例如平均粒径为0.1~100μm,较好是0.5~40μm,更好是1.0~30μm。
无机填充材料的平均粒径可通过基于米氏(Mie)散射理论的激光衍射散射法进行测定。具体来说,可通过激光衍射式粒度分布测定装置,以体积基准制成无机填充材料的粒度分布,将其中值粒径作为平均粒径来进行测定。测定样品可优选使用通过超声波使无机填充材料分散于水中而得的样品。作为激光衍射散射式粒度分布测定装置,可使用堀场制作所制LA-500等。
作为无机填充材料,无特别限定,可列举例如:选自二氧化硅、氧化铝、硫酸钡、滑石、粘土、云母、氢氧化铝、氢氧化镁、碳酸钙、碳酸镁、氧化镁、氮化硼、硼酸铝、钛酸钡、钛酸锶、钛酸钙、钛酸镁、钛酸铋、氧化钛、锆酸钡、及锆酸钙中的至少一种。
无机填充材料较好是包含选自二氧化硅、碳酸钙、滑石、云母中的至少1种,更好是包含二氧化硅。
[(F):其他]
另外,为了实现优异的保存稳定性,本实施方式涉及的树脂组合物较好是还包含选自硼酸酯化合物、钛酸酯化合物、铝酸酯化合物、锆酸酯化合物、异氰酸酯化合物、羧酸、酸酐及巯基有机酸中的1种以上。
作为所述硼酸酯化合物,可列举例如:硼酸三甲酯、硼酸三乙酯、硼酸三正丙酯、硼酸三异丙酯、硼酸三正丁酯、硼酸三戊酯、硼酸三烯丙酯、硼酸三己酯、硼酸三环己酯、硼酸三辛酯、硼酸三壬酯、硼酸三癸酯、硼酸三(十二烷基)酯、硼酸三(十六烷基)酯、硼酸三(十八烷基)酯、三(2-乙基己氧基)硼烷、双(1,4,7,10-四氧杂十一烷基)(1,4,7,10,13-五氧杂十四烷基)(1,4,7-三氧杂十一烷基)硼烷、硼酸三苄基酯、硼酸三苯基酯、硼酸三邻甲苯基酯、硼酸三间甲苯基酯、三乙醇胺硼酸酯等。
作为所述钛酸酯化合物,可列举例如:钛酸四乙酯、钛酸四丙酯、钛酸四异丙酯、钛酸四丁酯、钛酸四辛酯等。
作为所述铝酸酯化合物,可列举例如:铝酸三乙酯、铝酸三丙酯、铝酸三异丙酯、铝酸三丁酯、铝酸三辛酯等。
作为所述锆酸酯化合物,可列举例如:锆酸四乙酯、锆酸四丙酯、锆酸四异丙酯、锆酸四丁酯等。
作为所述异氰酸酯化合物,可列举例如:正丁基异氰酸酯、异丙基异氰酸酯、2-氯乙基异氰酸酯、苯基异氰酸酯、对氯苯基异氰酸酯、苄基异氰酸酯、六亚甲基二异氰酸酯、2-乙基苯基异氰酸酯、2,6-二甲基苯基异氰酸酯、2,4-甲苯二异氰酸酯、甲苯二异氰酸酯、2,6-甲苯二异氰酸酯、1,5-萘二异氰酸酯、二苯基甲烷-4,4'-二异氰酸酯、联甲苯胺二异氰酸酯、异佛尔酮二异氰酸酯、苯二亚甲基二异氰酸酯、对苯二异氰酸酯、双环庚烷三异氰酸酯等。
作为所述羧酸,可列举例如:甲酸、乙酸、丙酸、丁酸、己酸、辛酸等饱和脂肪族一元酸;丙烯酸、甲基丙烯酸、丁烯酸等不饱和脂肪族一元酸;一氯乙酸、二氯乙酸等卤代脂肪酸;乙醇酸、乳酸等一元含氧酸;乙醛酸、葡萄酸(外消旋酒石酸)等脂肪族醛酸及酮酸;草酸、丙二酸、琥珀酸、马来酸等脂肪族多元酸;苯甲酸、卤代苯甲酸、甲基苯甲酸、苯乙酸、肉桂酸、扁桃酸等芳族一元酸;邻苯二甲酸、均苯三酸等芳族多元酸等。
作为所述酸酐,可列举例如:琥珀酸酐、十二烷基琥珀酸酐、马来酸酐、甲基环戊二烯与马来酸酐的加合物、六氢邻苯二甲酸酐、甲基四氢邻苯二甲酸酐等脂肪族或脂肪族多元酸酐等;邻苯二甲酸酐、偏苯三酸酐、均苯四酸酐等芳族多元酸酐等。
作为所述巯基有机酸,可列举例如:巯基乙酸、巯基丙酸、巯基丁酸、巯基琥珀酸、二巯基琥珀酸等巯基脂肪族单羧酸,通过羟基有机酸与巯基有机酸的酯化反应得到的巯基脂肪族单羧酸,巯基苯甲酸等巯基芳族单羧酸等。
作为(F)成分,从通用性和安全性高、提高保存稳定性的观点来看,其中较好是硼酸酯化合物,更好是硼酸三乙酯、硼酸三正丙酯、硼酸三异丙酯、硼酸三正丁酯,更好是硼酸三乙酯。只要树脂的保存稳定性提高,则(F)成分的含量无特别限定,将(A)成分的环氧树脂的含量设为100质量份时,(F)成分的含量较好是0.001~50质量份,更好是0.05~30质量份,进一步更好是0.1~10质量份。
以上说明的本实施方式涉及的树脂组合物可按照目前公知的方法实施。即,例如可通过用各种混合机将各成分混合来制备本实施方式涉及的树脂组合物。
此外,本实施方式涉及的树脂组合物为单组分的树脂组合物的情况下,作为其固化方法,可使用目前公知的方法。例如,可通过加热树脂组合物来进行固化。加热适当的是在例如60~150℃、较好是70~120℃、更好是80~100℃的温度下进行例如1~120分钟、较好是3~60分钟、更好是5~40分钟的时间。
本实施方式涉及的树脂组合物中可根据需要加入本发明的领域中常用的填充材料、稀释剂、溶剂、颜料、柔性赋予剂、偶联剂、抗氧化剂、触变性赋予剂、分散剂等各种添加剂。
本实施方式涉及的树脂组合物可用于例如功能性制品。作为该功能性制品,可列举例如粘接剂、铸型剂、封闭剂、密封剂、纤维强化用树脂、涂层剂或涂料等。
合适的是,本实施方式涉及的树脂组合物可合适地用作CCM、HDD、半导体元件、集成电路等电子部件的制造时使用的粘接剂,更合适地用作相机模块的构件间的粘接用粘接剂。作为此种构件,可列举例如:铜和镍等金属构件;LCP(液晶聚合物)、聚酰胺和聚碳酸酯等塑料构件。本实施方式涉及的树脂组合物适合作为用于粘接选自这些金属构件和塑料构件的同种或异种构件的粘接剂。
如果采用本实施方式涉及的树脂组合物,可获得例如在121℃和100%RH的环境下放置24小时后为30%以上的剪切粘接强度维持率。
实施例
以下,基于实施例及比较例对本发明进行更具体的说明,但本发明并不限定于以下的实施例。应予说明,以下的记载中的“份”表示“质量份”。
1.原材料
[(A)成分]
(A1) ZX1059:新日铁住金化学公司制,双酚A型环氧树脂/双酚F型环氧树脂混合物,环氧当量(EPW)165g/eq
(A2) jER152:三菱化学公司制,苯酚酚醛型环氧树脂,环氧当量(EPW)177g/eq
(A3) HP-7200:DIC公司制,二环戊二烯型环氧树脂,环氧当量(EPW)258g/eq。
[(B)成分]
(B1) PE1:昭和电工公司制“Karenz MT”,季戊四醇四(3-巯基丁酸酯),硫醇基当量136g/eq
(B2) PEMP:SC有机化学公司制,季戊四醇四(3-巯基丙酸酯),硫醇基当量122g/eq
(B3) DPMP:二季戊四醇六(3-巯基丙酸酯),硫醇基当量131g/eq
(B4) TMTP:三羟甲基丙烷三(3-巯基丙酸酯),硫醇基当量140g/eq。
[(C)成分]
(C1) STABAXOL I粉末:朗盛(LANXESS)公司制,N,N'-双(2,6-二异丙基苯基)碳二亚胺,分子量360
(C2) STABAXOL P:朗盛公司制,聚(1,3,5-三异丙基亚苯基-2,4-碳二亚胺),质均分子量3000~4000
(C3) CARBODILITE V-05:日清纺化学公司制,碳二亚胺改性异氰酸酯,质均分子量800
(C4) N,N'-二环己基碳二亚胺:和光纯药工业公司制,分子量206
(C5) 二异丙基碳二亚胺:和光纯药工业公司制,分子量126
(C6) STABAXOL P100:朗盛公司制,芳族聚碳二亚胺,质均分子量15000以上。
[(D)成分]
(D1) PN-23:Ajinomoto Fine-Techno公司制,含咪唑基的改性多胺(固体)
(D2) FXR-1081:T&K TOKA公司制,含脲键的改性多胺,固体型
(D3) HX-3722:旭化成公司制,咪唑改性微胶囊体。
[(E)无机填充材料]
(E1) SO-C5:Admatechs公司制,二氧化硅,粒径1.3~1.7μm
(E2) WHITON B:白石钙公司制,碳酸钙,平均粒径3.6μm
(E3) TALC MS:日本滑石公司制,滑石,平均粒径14.0μm
(E4) MICA C-1000:Imerys Mica Kings Mountain 公司制,云母,平均粒径26.0μm。
[(F)其他]
(F1) TEB:纯正化学公司制,硼酸三乙酯。
2.评价试验
(1)保存稳定性
将测定对象的树脂组合物在塑料制密闭容器中于25℃保管7天。保管前后,通过E型粘度计RE-80U(东机产业公司制,转子:3°×R9.7)以25℃、20rpm的条件测定树脂组合物的粘度,通过“7天后的粘度/初始粘度”算出自初始粘度的增粘率;
<评价标准>
◎:不到2.0倍
〇:2.0倍以上且不到3.0倍
×:3.0倍以上。
(2)低温固化性
按照JIS C6521通过热板式凝胶化试验机GT-D(日新科学公司制),对测定对象的树脂组合物在90℃变得不再拉丝的时间进行测定。具体来说,将约0.5g的组合物置于预先加热至90℃的热板式凝胶化试验机上,启动秒表,使用前端宽5mm的刮刀反复进行密切圆运动,测定到凝胶化为止的时间;
<评价标准>
◎:不到10分钟
〇:10分钟以上且不到30分钟
×:30分钟以上。
(3)剪切粘接试验
按照JIS K-6850,在90℃的热循环式炉内用30分钟使测定对象的树脂组合物固化,制成通过树脂组合物粘接的试片。作为试片,使用将低碳钢板(软钢板)(SPCC,大佑机材公司制)进行丙酮脱脂、并用环形带#120研磨而得的试片。对于所得的试片的剪切粘接强度,通过万能试验机(T.S.E公司制,AC-50KN-CM)进行测定(测定环境:温度25℃/湿度60%,拉伸速度:5mm/min)。
(4)耐湿试验
通过与(3)同样的步骤制成试片,将试片在设定为121℃、100%RH的条件的高度加速寿命试验装置(ESPEC公司制)中放置24小时后,对于所得的试片通过万能试验机测定耐湿试验后的剪切粘接强度。
进而,为了评价高温高湿环境下对粘接强度造成的影响,算出粘接强度维持率。粘接强度保持率根据初始的剪切粘接强度和耐湿试验后的剪切粘接强度的值如下算出;
[粘接强度维持率(%)]=[耐湿试验后的剪切粘接强度]/[初始的剪切粘接强度]×100
<评价标准>
◎:30%以上
〇:15%以上且不到30%
×:不到15%。
3.实施例和比较例
按照表1~表4的上栏所示的配合方式将各成分混合,制备实施例1~22及比较例1~5涉及的树脂组合物。
应予说明,对于实施例1~22,将(A)成分、(C)成分、(E)成分用三辊磨混合,向其中添加(D)成分、(F)成分并进一步通过混合机混合,向其中添加(B)成分并通过混合机充分分散后,静置脱泡来进行制备。应予说明,制备操作在25℃进行,总计的混合时间为30分钟。
对于比较例1~5,也基于表1~表4的配合方式同样地进行制备。
实施例1~22及比较例1~5的树脂组合物供于上述的评价试验,结果示于表1~表4。
由表1~表4可知,如实施例1~22的结果所示,本发明的树脂组合物的低温固化性优异,保存稳定性也良好,而且显示优异的耐湿性。与之相对,可知比较例1~5的树脂组合物不具有如本发明的树脂组合物那样高水平的性能。
此外,如果将比较例1和比较例2与比较例5进行比较,可知比较例1和比较例2的低温固化性优异,但耐湿性(粘接强度维持率)差。即,使用(B)含酯结构的多硫醇化合物的情况下,可获得优异的低温固化性,但耐湿性变差。
与之相对,如果将实施例1~22与比较例1和比较例2进行比较,可知耐湿性得到改善。即,可以理解通过添加(C)碳二亚胺,从而耐湿性得到改善。
另外,如果将比较例3和4与实施例1~22进行比较,可以理解即使在添加了碳二亚胺的情况下,通过将其分子量设定为150~10000的范围内,从而保存稳定性提高。
应予说明,实施例1~22中,实施例17和实施例22的结果从保存稳定性、低温固化性和耐湿性的观点来看特别好。
[表1]
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[表2]
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[表3]
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[表4]
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Claims (20)
1.一种树脂组合物,其特征在于,包含:
(A)环氧树脂、
(B)含酯结构的多硫醇化合物、
(C)分子量为150~13000的碳二亚胺、以及
(E)无机填充材料,
所述环氧树脂整体的至少10质量%以上为液态,
将树脂组合物的不挥发成分设为100质量%时,树脂组合物中的所述环氧树脂的含量为10质量%以上且95质量%以下,
将树脂组合物的不挥发成分设为100质量%时,树脂组合物中的所述碳二亚胺的含量为4.94~50质量%,
所述无机填充材料为选自二氧化硅、氧化铝、硫酸钡、滑石、粘土、云母、氢氧化铝、氢氧化镁、碳酸钙、碳酸镁、氧化镁、氮化硼、硼酸铝、钛酸钡、钛酸锶、钛酸钙、钛酸镁、钛酸铋、氧化钛、锆酸钡、及锆酸钙中的至少一种,
树脂组合物中的环氧基与硫醇基的当量比、即环氧基/硫醇基为0.50~10.0,
树脂组合物为单组分树脂组合物。
2.根据权利要求1所述的树脂组合物,其特征在于,将所述树脂组合物的不挥发成分设为100质量%时,所述树脂组合物中的所述碳二亚胺的含量为4.94~35质量%。
3.根据权利要求1所述的树脂组合物,其特征在于,将树脂组合物中的不挥发成分设为100质量份时,所述无机填充材料的含量为1~70质量份。
4.根据权利要求1所述的树脂组合物,其特征在于,所述无机填充材料包含选自二氧化硅、碳酸钙、滑石和云母中的至少1种。
5.根据权利要求1所述的树脂组合物,其特征在于,还包含(D)固化促进剂。
6.根据权利要求5所述的树脂组合物,其特征在于,所述固化促进剂为潜伏性固化促进剂。
7.根据权利要求6所述的树脂组合物,其特征在于,所述潜伏性固化促进剂包含选自胺化合物的环氧加合物、胺化合物的脲加合物、以及使异氰酸酯化合物与环氧加合物的羟基发生加成反应而得的化合物中的至少1种。
8.根据权利要求1所述的树脂组合物,其特征在于,所述碳二亚胺的分子量为170~8000。
9.根据权利要求1所述的树脂组合物,其特征在于,所述碳二亚胺的分子量为185~6000。
10.根据权利要求1所述的树脂组合物,其特征在于,所述碳二亚胺的分子量为200~5000。
11.根据权利要求1所述的树脂组合物,其特征在于,将树脂组合物中的不挥发成分设为100质量份时,所述无机填充材料的含量为5~60质量份。
12.根据权利要求1所述的树脂组合物,其特征在于,将树脂组合物中的不挥发成分设为100质量份时,所述无机填充材料的含量为10~50质量份。
13.根据权利要求1所述的树脂组合物,其特征在于,所述树脂组合物中的环氧基与硫醇基的当量比、即环氧基/硫醇基为0.75~5.0。
14.根据权利要求1所述的树脂组合物,其特征在于,所述树脂组合物中的环氧基与硫醇基的当量比、即环氧基/硫醇基为0.80~2.0。
15.一种粘接剂,其特征在于,包含权利要求1所述的树脂组合物。
16.根据权利要求15所述的粘接剂,其特征在于,该粘接剂用于相机模块的构件间的粘接。
17.一种密封剂,其特征在于,包含权利要求1所述的树脂组合物。
18.一种涂层剂,其特征在于,包含权利要求1所述的树脂组合物。
19.一种固化物,其特征在于,使权利要求1所述的树脂组合物热固化而成。
20.一种电子部件,其特征在于,包含权利要求19所述的固化物。
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102449021A (zh) * | 2009-05-28 | 2012-05-09 | 昭和电工株式会社 | 环氧树脂涂料组合物 |
JP2014051621A (ja) * | 2012-09-07 | 2014-03-20 | Asahi Kasei E-Materials Corp | 液状樹脂組成物、及び加工品 |
JP2014152236A (ja) * | 2013-02-07 | 2014-08-25 | Asahi Kasei E-Materials Corp | エポキシ樹脂組成物、及び加工品 |
CN104797623A (zh) * | 2012-11-28 | 2015-07-22 | 味之素株式会社 | 树脂固化剂和单组分环氧树脂组合物 |
CN105199326A (zh) * | 2014-06-30 | 2015-12-30 | 味之素株式会社 | 树脂组合物 |
CN106062030A (zh) * | 2014-03-17 | 2016-10-26 | 纳美仕有限公司 | 树脂组合物 |
CN107251163A (zh) * | 2015-08-19 | 2017-10-13 | 积水化学工业株式会社 | 导电材料及连接结构体 |
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JP5653623B2 (ja) | 2007-12-13 | 2015-01-14 | 昭和電工株式会社 | エポキシ樹脂硬化剤およびその製造方法ならびにエポキシ樹脂組成物 |
JPWO2016021531A1 (ja) | 2014-08-04 | 2017-05-18 | 積水化学工業株式会社 | 表示素子用封止剤 |
US10865326B2 (en) | 2017-09-20 | 2020-12-15 | Ppg Industries Ohio, Inc. | Coating compositions, elastic barrier coatings formed therefrom, and methods of applying such coatings |
-
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102449021A (zh) * | 2009-05-28 | 2012-05-09 | 昭和电工株式会社 | 环氧树脂涂料组合物 |
JP2014051621A (ja) * | 2012-09-07 | 2014-03-20 | Asahi Kasei E-Materials Corp | 液状樹脂組成物、及び加工品 |
CN104797623A (zh) * | 2012-11-28 | 2015-07-22 | 味之素株式会社 | 树脂固化剂和单组分环氧树脂组合物 |
JP2014152236A (ja) * | 2013-02-07 | 2014-08-25 | Asahi Kasei E-Materials Corp | エポキシ樹脂組成物、及び加工品 |
CN106062030A (zh) * | 2014-03-17 | 2016-10-26 | 纳美仕有限公司 | 树脂组合物 |
CN105199326A (zh) * | 2014-06-30 | 2015-12-30 | 味之素株式会社 | 树脂组合物 |
CN107251163A (zh) * | 2015-08-19 | 2017-10-13 | 积水化学工业株式会社 | 导电材料及连接结构体 |
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