CN110036396B

CN110036396B - Fingerprint identification device and electronic equipment

Info

Publication number: CN110036396B
Application number: CN201980000286.4A
Authority: CN
Inventors: 郭益平
Original assignee: Shenzhen Goodix Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2019-03-01
Filing date: 2019-03-01
Publication date: 2021-04-02
Anticipated expiration: 2039-03-01
Also published as: WO2020177032A1; CN110036396A

Abstract

A fingerprint identification device and an electronic device are provided, the fingerprint identification device is applied to the electronic device with a display screen, the fingerprint identification device comprises: a circuit board; at least one fingerprint sensor chip disposed above the circuit board; the at least one fingerprint sensor chip is connected with the circuit board; the circuit board is used for being installed below the display screen, so that the at least one fingerprint sensor chip is located below the display screen. In the embodiment of the application, the installation cost and the complexity of the at least one fingerprint sensor chip can be reduced through the circuit board, and the maintainability of the fingerprint sensor chip is improved. Especially, under the scene of aiming at a plurality of fingerprint sensor chips, the installation complexity can be effectively reduced, and the installation efficiency of the fingerprint sensor chips is improved.

Description

Fingerprint identification device and electronic equipment

Technical Field

The present invention relates to the field of electronics, and more particularly, to a fingerprint identification device and an electronic apparatus.

Background

At present, the scheme of fingerprint identification under a screen is to attach an optical or ultrasonic fingerprint identification module to the bottom of an Organic Light-Emitting Diode (OLED) screen, that is, the optical fingerprint identification module and the ultrasonic fingerprint identification module need to be tightly bonded to a Light-Emitting layer at the bottom of the screen.

However, since the OLED screen is very expensive and fragile, the OLED screen is easily damaged when the fingerprint recognition module is directly attached to the OLED screen. In addition, because fingerprint identification module and OLED screen glue together completely, if the fingerprint identification module damage appears, damage the OLED screen very easily when dismantling the fingerprint identification module. Moreover, the attaching process of directly attaching the fingerprint identification module to the OLED screen is also complex.

Due to the above problems, the cost and complexity of the electronic device are greatly increased, and the maintainability is low.

Disclosure of Invention

Provided are a fingerprint identification device and an electronic apparatus, which can reduce the cost and complexity of the electronic apparatus and improve the maintainability. Especially aiming at the scenes of a plurality of fingerprint sensor chips, the cost and the complexity of the electronic equipment can be effectively reduced, and the maintainability is greatly improved.

In a first aspect, a fingerprint identification apparatus is provided, which is applied to an electronic device having a display screen, and includes:

a circuit board;

at least one fingerprint sensor chip disposed above the circuit board;

the at least one fingerprint sensor chip is connected with the circuit board;

the circuit board is used for being installed below the display screen, so that the at least one fingerprint sensor chip is located below the display screen, the at least one fingerprint sensor chip is used for receiving fingerprint detection signals returned by reflection or scattering of a human finger above the display screen, and the fingerprint detection signals are used for detecting fingerprint information of the finger.

In the embodiment of the application, at least one fingerprint sensor chip fixed mounting in behind the circuit board, can pass through the circuit board will at least one fingerprint sensor chip fixed mounting has been avoided will at least one fingerprint sensor chip directly laminates on electronic equipment's the display screen, can reduce at least one fingerprint sensor chip's the installation degree of difficulty and complexity to improve maintainability. In addition, aiming at the scene that the at least one fingerprint sensor chip comprises a plurality of chips, the chips can be fixedly installed below the display screen at one time, the installation complexity can be reduced, and the installation efficiency can be improved.

In some possible implementations, the circuit board is provided with at least one mounting member at a peripheral position of the at least one fingerprint sensor chip, and the mounting member is used for fixedly mounting the circuit board below the display screen.

In some possible implementations, the thickness of the mount is such that a distance between the at least one fingerprint sensor chip and a lower surface of a light emitting layer of the display screen is less than or equal to 600 um.

In some possible implementations, the mounting member is an adhesive tape.

In some possible implementations, the fingerprint identification device further includes:

a support plate;

at least a portion of the circuit board is disposed between the at least one fingerprint sensor chip and the support plate.

In some possible implementations, the at least one fingerprint sensor chip is fixedly connected with the support plate.

In some possible implementations, the support plate is a metal stiffener, and/or the surface roughness of the support plate is greater than 0.25um, and/or the thickness of the support plate ranges from 0.15mm to 0.3 mm.

a bending part;

the two ends of the bending part are respectively used for connecting the display screen and the circuit board, so that the circuit board is arranged below the display screen in parallel.

In some possible implementations, the bending portion includes:

a Chip On Film (COF) layer;

the display screen comprises a driving Integrated Circuit (IC) chip of the display screen, and the COF layer is used for fixing the IC chip to the circuit board.

In some possible implementations, the bending portion further includes:

a shielding layer of the COF layer;

the shielding layer is arranged on the outer side of the COF layer, and the IC chip is arranged between the COF layer and the shielding layer and close to the circuit board.

In some possible implementations, the bent portion further includes:

a fixing member;

the fixing part is arranged at a position of the COF layer close to the IC chip, and the fixing part is used for fixing one end of the COF layer, which is used for connecting the circuit board, below the display screen.

In some possible implementations, a space exists between the fixing member and the driving IC chip.

In some possible implementations, the at least one fingerprint sensor chip includes a plurality of optical fingerprint sensor chips, and the plurality of optical fingerprint sensor chips are arranged on the upper surface of the supporting plate side by side to be spliced into one optical fingerprint sensor chip assembly.

In some possible implementations, a microlens array is disposed over the at least one fingerprint sensor chip.

and the optical filter is arranged above the at least one fingerprint sensor chip.

In some possible implementations, the light entering surface of the optical filter is provided with an optical inorganic coating or an organic blackened coating.

In some possible implementations, the optical filter and the at least one fingerprint sensor chip are fixed by dispensing in a non-photosensitive area of the at least one fingerprint sensor chip, and a gap exists between the optical filter and the photosensitive area of the at least one fingerprint sensor chip; or the lower surface of the optical filter is fixed on the upper surface of the at least one fingerprint sensor chip through glue with the refractive index lower than the preset refractive index.

In some possible implementations, the periphery of the optical filter and the circuit board are fixed by dispensing.

In some possible implementation manners, the circuit board is connected to the at least one fingerprint sensor chip through a gold wire, and the height of the gold wire and the height of the sealing adhesive of the gold wire are respectively lower than the height of the optical filter.

a connector of the display screen;

the connector is connected with the circuit board, and the connector comprises at least one pin, and the at least one pin comprises a pin of the fingerprint identification device.

In a second aspect, an electronic device is provided, comprising:

the fingerprint identification device and the display screen of the first aspect or a possible implementation manner of the first aspect;

the fingerprint identification device is arranged below the display screen to realize fingerprint detection under the screen.

In some possible implementations, the display screen includes:

a display component;

the light shielding layer is arranged below the display component and provided with a window, the fingerprint identification device receives an optical signal which is sent by the display component and is formed after being reflected by a human finger through the window, and the optical signal is used for fingerprint identification;

at least one fingerprint sensor chip in the fingerprint identification device is in contact with the lower surface of the display component, or a gap exists between the at least one fingerprint sensor chip and the lower surface of the display component.

The electronic equipment of the embodiment of the application not only can reduce the installation difficulty and complexity of at least one fingerprint sensor chip in the fingerprint identification device, but also can improve the maintainability. In addition, aiming at the scene that the at least one fingerprint sensor chip comprises a plurality of chips, the chips can be fixedly installed below the display screen at one time, the installation complexity can be reduced, and the installation efficiency can be improved.

Drawings

Fig. 1 is a schematic plan view of an electronic device to which the present application may be applied.

Fig. 2 is a schematic side cross-sectional view of the electronic device shown in fig. 1.

Fig. 3 is a schematic structural diagram of a display screen of an electronic device according to an embodiment of the present application before being assembled with a fingerprint identification device.

Fig. 4 is a schematic configuration diagram of a bent portion of the electronic apparatus shown in fig. 3.

Fig. 5 is a schematic structural diagram of a fingerprint recognition device of the electronic apparatus shown in fig. 3.

Fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present application after a display screen and a fingerprint identification device are assembled.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

The technical scheme of the embodiment of the application can be applied to various electronic devices.

Such as portable or mobile computing devices, e.g., smart phones, laptops, tablets, gaming devices, etc., and other electronic devices, e.g., electronic databases, automobiles, Automated Teller Machines (ATMs), etc. However, the present embodiment is not limited thereto.

The technical scheme of the embodiment of the application can be used for the biological feature recognition technology. The biometric technology includes, but is not limited to, fingerprint recognition, palm print recognition, iris recognition, face recognition, and living body recognition. For convenience of explanation, the fingerprint identification technology is described as an example below.

The technical scheme of the embodiment of the application can be used for the under-screen fingerprint identification technology and the in-screen fingerprint identification technology.

Fingerprint identification technique is installed in the display screen below with fingerprint identification module under the screen to realize carrying out the fingerprint identification operation in the display area of display screen, need not set up the fingerprint collection region in the positive region except that the display area of electronic equipment. Specifically, the fingerprint identification module uses the light that returns from the top surface of electronic equipment's display module to carry out fingerprint response and other response operations. This returned light carries information about an object (e.g., a finger) in contact with the top surface of the display assembly, and the fingerprint recognition module located below the display assembly collects and detects this returned light to perform underscreen fingerprint recognition. Among other things, the design of the fingerprint recognition module may be such that the desired optical imaging is achieved by appropriately configuring the optical elements used to collect and detect the returned light.

Correspondingly, (In-display) fingerprint identification technique means installs inside the display screen fingerprint identification module or partial fingerprint identification module In the screen to realize carrying out the fingerprint identification operation In the display area of display screen, need not set up the fingerprint collection region In the positive region except that the display area of electronic equipment.

Fig. 1 and fig. 2 are schematic diagrams illustrating an electronic device 100 to which an off-screen fingerprint identification technology may be applied, where fig. 1 is a schematic diagram of a front side of the electronic device 100, and fig. 2 is a schematic diagram of a partial cross-sectional structure of the electronic device 100 shown in fig. 1.

As shown in fig. 1 and 2, the electronic device 100 may include a display 120 and a fingerprint identification module 140.

The display 120 may be a self-luminous display employing display units having self-luminous properties as display pixels. For example, the display screen 120 may be an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen. In other alternative embodiments, the Display 120 may also be a Liquid Crystal Display (LCD) or other passive light emitting Display, which is not limited in this embodiment of the present application.

In addition, the display screen 120 may also be specifically a touch display screen, which not only can perform image display, but also can detect a touch or pressing operation of a user, thereby providing a human-computer interaction interface for the user. For example, in one embodiment, the electronic device 100 may include a Touch sensor, which may be embodied as a Touch Panel (TP), which may be disposed on a surface of the display screen 120, or may be partially or wholly integrated within the display screen 120, so as to form the Touch display screen.

Fingerprint identification module 140 can be optical fingerprint identification module, for example optical fingerprint sensor.

In particular, the fingerprint identification module 140 may include a fingerprint sensor chip having an optically sensitive array (hereinafter also referred to as an optical fingerprint sensor). The optical sensing array includes a plurality of optical sensing units, and each optical sensing unit may specifically include a photodetector or a photosensor. Alternatively, the fingerprint identification module 140 may include a Photo detector array (or referred to as a Photo detector array or a Photo sensor array), which includes a plurality of Photo detectors distributed in an array.

As shown in fig. 1, the fingerprint identification module 140 may be disposed in a local area below the display screen 120, so that the fingerprint collection area (or detection area) 130 of the fingerprint identification module 140 is at least partially located in the display area 102 of the display screen 120.

Of course, in other alternative embodiments, the fingerprint identification module 140 may be disposed at other positions, such as the side of the display screen 120 or the edge non-transparent area of the electronic device 100. In this case, the optical signal of at least a part of the display area of the display screen 120 can be guided to the fingerprint identification module 140 through the optical path design, so that the fingerprint collection area 130 is actually located in the display area of the display screen 120.

In some embodiments of the present application, the fingerprint identification module 140 may only include one fingerprint sensor chip, and the area of the fingerprint collection area 130 of the fingerprint identification module 140 is small and the position is fixed at this time, so the user needs to press the finger to a specific position of the fingerprint collection area 130 when performing fingerprint input, otherwise the fingerprint identification module 140 may not collect a fingerprint image and cause poor user experience.

In other embodiments of the present application, the fingerprint identification module 140 may specifically include a plurality of fingerprint sensor chips; the plurality of fingerprint sensor chips can be arranged side by side in a splicing mode below the display screen 120, and sensing areas of the plurality of fingerprint sensor chips jointly form the fingerprint collecting area 130 of the fingerprint identification module 140. That is to say, the fingerprint collection area 130 of the fingerprint identification module 140 may include a plurality of sub-areas, and each sub-area corresponds to the sensing area of one of the fingerprint sensor chips, respectively, so as to extend the fingerprint collection area 130 of the optical fingerprint module 130 to the main area of the lower half of the display screen, that is, to the area that the finger presses conventionally, thereby realizing the blind-touch type fingerprint input operation. Alternatively, when the number of fingerprint sensor chips is sufficient, the fingerprint detection area 130 may also be extended to half or even the entire display area, thereby enabling half-screen or full-screen fingerprint detection.

It should be understood that the specific form of the fingerprint sensor chips is not limited in the embodiments of the present application.

For example, the plurality of fingerprint sensor chips may be individually packaged fingerprint sensor chips, or may be a plurality of chips (Die) packaged in the same chip package.

Also for example, the plurality of fingerprint sensor chips may be fabricated on different regions of the same chip (Die) by a semiconductor process.

As shown in fig. 2, the optical sensing array of the fingerprint identification module 140 is located in an area or an optical sensing range corresponding to the fingerprint collection area 130 of the fingerprint identification module 140. The fingerprint collection area 130 of the fingerprint identification module 140 may be equal to or different from an area or a light sensing range of an area where the optical sensing array of the fingerprint identification module 140 is located, which is not specifically limited in the embodiment of the present application.

For example, through the light path design of light collimation, fingerprint identification module 140's fingerprint collection area 130 can be designed into with fingerprint identification module 140's the area of the sensing array is unanimous basically.

For another example, the area of the fingerprint collection area 130 of the fingerprint identification module 140 may be larger than the area of the sensing array of the fingerprint identification module 140 by the light path design of the converging light or the light path design of the reflecting light.

The following is an exemplary description of the optical path design of the fingerprint identification module 140.

Use fingerprint identification module 140's light path design to adopt the optical Collimator of the through-hole array that has high aspect ratio as an example, optical Collimator can specifically be at the Collimator (collimater) layer that semiconductor silicon chip made formed, and it has a plurality of collimation units or micropore, the collimation unit can specifically be the aperture, in the reverberation of following the finger reflection back, perpendicular incidence the light of collimation unit can pass and be received by the fingerprint sensor chip of its below, and the too big light of incident angle is in the inside multiple reflection of collimation unit is attenuated, therefore every fingerprint sensor chip can only receive the reverberation of its fingerprint line reflection directly over basically, can effectively improve image resolution, and then improve the fingerprint identification effect.

Further, when fingerprint identification module 140 includes a plurality of fingerprint sensor chips, can configure a collimation unit for an optical sensing unit in the optical sensing array of every fingerprint sensor chip to the laminating sets up the top at its optical sensing unit that corresponds. Of course, the plurality of optical sensing units may also share one collimating unit, i.e. the one collimating unit has a sufficiently large aperture to cover the plurality of optical sensing units. Because a collimation unit can correspond a plurality of optical sensing units, the spatial period of display screen 120 and the spatial period's of fingerprint sensor chip correspondence has been destroyed, therefore, even the spatial structure of the luminous display array of display screen 120 and the spatial structure of the optical sensing array of fingerprint sensor chip are similar, also can effectively avoid fingerprint identification module 140 to utilize the optical signal through display screen 120 to carry out fingerprint imaging and generate moire fringe, effectively improved fingerprint identification module 140's fingerprint identification effect.

Taking the optical path design of the fingerprint identification module 140 as an example, the optical path design of the optical Lens is adopted, the optical Lens may include an optical Lens (Lens) layer, which has one or more Lens units, such as a Lens group composed of one or more aspheric lenses, and is used for converging the reflected light reflected from the finger to an induction array of a fingerprint sensor chip below the Lens unit, so that the induction array may perform imaging based on the reflected light, thereby obtaining a fingerprint image of the finger. The optical lens layer may further have a pinhole formed in an optical path of the lens unit, and the pinhole may cooperate with the optical lens layer to enlarge a field of view of the fingerprint identification module 140, so as to improve a fingerprint imaging effect of the fingerprint identification module 140.

Further, when fingerprint identification module 140 includes a plurality of fingerprint sensor chips, can carry out fingerprint formation of image for an optical lens of each fingerprint sensor chip configuration, or for an optical lens of a plurality of fingerprint sensor chip configurations to realize that light assembles and fingerprint formation of image. Even when one fingerprint sensor chip has two sensing arrays (Dual Array) or multiple sensing arrays (Multi-Array), two or more optical lenses can be configured for the fingerprint sensor chip to cooperate with the two sensing arrays or the multiple sensing arrays to perform optical imaging, so as to reduce the imaging distance and enhance the imaging effect.

Taking the optical path design of the fingerprint identification module 140 as an example, the optical path design employs a Micro-Lens (Micro-Lens) layer, the Micro-Lens layer may have a Micro-Lens array formed by a plurality of Micro-lenses, which may be formed above the sensing array of the fingerprint sensor chip through a semiconductor growth process or other processes, and each Micro-Lens may correspond to one of the sensing units of the sensing array. Other optical film layers such as a dielectric layer or a passivation layer may be further formed between the microlens layer and the sensing units, and more particularly, a light blocking layer having micro holes may be further included between the microlens layer and the sensing units, wherein the micro holes are formed between the corresponding microlenses and the sensing units, and the light blocking layer may block optical interference between adjacent microlenses and the sensing units, and allow light to be converged into the micro holes through the microlenses and transmitted to the sensing units corresponding to the microlenses through the micro holes, so as to perform optical fingerprint imaging.

It should be understood that several implementations of the above-mentioned optical path guiding structure may be used alone or in combination, for example, a microlens layer may be further disposed below the collimator layer or the optical lens layer. Of course, when the collimator layer or the optical lens layer is used in combination with the microlens layer, the specific lamination structure or optical path thereof may need to be adjusted according to actual needs.

Fingerprint identification module 140 may be configured to collect fingerprint information (e.g., fingerprint image information) of a user.

Taking the example that the display screen 120 is an OLED display screen, the display screen 120 may be a display screen having a self-Light Emitting display unit, such as an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen. The fingerprint identification module 140 may utilize the display unit (i.e., the OLED light source) of the OLED display screen located in the fingerprint collection area 130 as an excitation light source for optical fingerprint detection.

When a finger touches, presses, or approaches (collectively referred to as pressing in this application for convenience of description) the fingerprint collection area 130, the display 120 emits a beam of light to the finger above the fingerprint collection area 130, and the beam of light is reflected on the surface of the finger to form reflected light or scattered light after being scattered by the inside of the finger, and the reflected light and the scattered light are collectively referred to as reflected light in the related patent application for convenience of description. Because ridges (ridges) and valleys (vally) of the fingerprint have different light reflection capabilities, reflected light from the ridges and the valleys of the fingerprint have different light intensities, and the reflected light is received by the fingerprint sensor chip in the fingerprint identification module 140 and converted into corresponding electric signals, namely fingerprint detection signals, after passing through the display screen 120; fingerprint image data can be obtained based on the fingerprint detection signal, and fingerprint matching verification can be further performed, so that an optical fingerprint identification function is realized in the electronic device 100.

Therefore, when the user needs to perform fingerprint unlocking or other fingerprint verification on the electronic device 100, the user only needs to press a finger on the fingerprint acquisition area 130 of the display screen 120, so that the input operation of the fingerprint feature can be realized. Since the collection of the fingerprint features can be implemented inside the display area 102 of the display screen 120, the electronic device 100 with the above structure does not need a special reserved space on the front surface thereof to set the fingerprint keys (such as Home keys), and thus a full-screen scheme can be adopted. Thus, the display area 102 of the display screen 120 may extend substantially across the entire front face of the electronic device 100.

Of course, in other alternatives, the fingerprint identification module 140 may also use an internal light source or an external light source to provide an optical signal for fingerprint detection and identification. In this case, the fingerprint identification module 140 may be suitable for not only self-luminous display screens such as OLED display screens, but also non-self-luminous display screens such as liquid crystal display screens or other passive luminous display screens.

Taking an application to a liquid crystal display screen with a backlight module and a liquid crystal panel as an example, to support the underscreen fingerprint detection of the liquid crystal display screen, the optical fingerprint system of the electronic device 100 may further include an excitation light source for optical fingerprint detection, where the excitation light source may specifically be an infrared light source or a light source of non-visible light with a specific wavelength, and may be disposed below the backlight module of the liquid crystal display screen or in an edge area below a protective cover plate of the electronic device 100, and the fingerprint identification module 140 may be disposed below the edge area of the liquid crystal panel or the protective cover plate and guided through a light path so that the fingerprint detection light may reach the fingerprint identification module 140; alternatively, the fingerprint recognition module 140 may be disposed under the backlight module, and the backlight module is configured to allow the fingerprint detection light to pass through the liquid crystal panel and the backlight module and reach the fingerprint recognition module 140 by perforating or performing other optical designs on the diffusion sheet, the brightness enhancement sheet, the reflection sheet, and other film layers. When adopting fingerprint identification module 140 adopts built-in light source or external light source to provide the light signal that is used for carrying out fingerprint detection, its detection principle can be the same.

As shown in fig. 1, the electronic device 100 may further include a protective cover 110.

The cover plate 110 may be a transparent cover plate, such as a glass cover plate or a sapphire cover plate, which is located above the display screen 120 and covers the front surface of the electronic device 100, and a protective layer may be further disposed on the surface of the cover plate 110. Therefore, in the embodiment of the present application, the pressing of the display screen 120 by the finger may actually mean that the finger presses the cover plate 110 above the display screen 120 or a surface of a protective layer covering the cover plate 110.

As shown in fig. 1, a Circuit board 150, such as a Flexible Printed Circuit (FPC), may be disposed below the fingerprint identification module 140.

The fingerprint identification module 140 may be soldered to the circuit board 150 via the solder pads, and may be electrically interconnected and signal-transmitted with other peripheral circuits or other components of the electronic device 100 via the circuit board 150. For example, the fingerprint identification module 140 may receive a control signal of a processing unit of the electronic device 100 through the circuit board 150, and may further output a fingerprint detection signal from the fingerprint identification module 140 to the processing unit or the control unit of the electronic device 100 through the circuit board 150.

In some embodiments, the fingerprint recognition device 140 may be fixedly attached directly to the lower surface of the display screen 120.

However, since the display screen 120 is expensive and fragile, the display screen 120 is easily damaged when the fingerprint recognition module 140 is directly attached to the display screen 120.

In addition, because fingerprint identification module 140 and display screen 120 stick together completely, if fingerprint identification module 140 damages, damage display screen 120 very easily when dismantling fingerprint identification module 140.

Moreover, the attaching process of directly attaching the fingerprint identification module 140 to the display screen 120 is also complicated.

Due to the above problems, the cost and complexity of the electronic apparatus 100 are greatly increased, and the maintainability is low.

The application provides a fingerprint identification device, which can reduce the cost and complexity of electronic equipment 100 and improve the maintainability.

The fingerprint identification device 200 and the electronic device 300 according to the embodiment of the present application will be described in detail with reference to fig. 3 to 6. It should be noted that, for convenience of description, the same reference numerals are used to designate the same components in the embodiments of the present application, and detailed description of the same components is omitted in different embodiments for the sake of brevity.

Fig. 3 is a schematic structural diagram of a display screen of an electronic device according to an embodiment of the present application before being assembled with a fingerprint identification device. The electronic device and the fingerprint identification device according to the embodiments of the present application will be described with reference to the accompanying drawings.

As shown in fig. 3, the electronic device 200 includes a display screen 210 and a fingerprint recognition device 220. The fingerprint recognition device 220 includes the circuit board 240 and a fingerprint sensor chip 221. The fingerprint sensor chip 221 is disposed above the circuit board 240; the fingerprint sensor chip 221 is connected to the circuit board 240.

The fingerprint sensor chip 221 may include one or more optical fingerprint sensor chips. Each optical fingerprint sensor chip may include one or more optical fingerprint sensors or arrays of optical fingerprint sensors.

When the fingerprint sensor chip 221 includes a plurality of optical fingerprint sensor chips, the plurality of optical fingerprint sensor chips may be disposed side by side on the upper surface of the circuit board 240 to be spliced into an optical fingerprint sensor chip assembly.

The circuit board 240 is configured to be mounted below the display screen 210, so that the fingerprint sensor chip 221 is located below the display screen 210. The fingerprint sensor chip 221 is configured to receive a fingerprint detection signal returned by reflection or scattering of a human finger on the display screen 210, and the fingerprint detection signal is used to detect fingerprint information of the finger. The circuit board 240 may be a circuit board of any component, for example, a circuit board of the display screen 210 or a circuit board of the fingerprint sensor chip 221. For another example, the circuit board 240 is a circuit board shared by the display and the fingerprint sensor chip 221, so as to simplify the structure of the electronic device.

For example, the fingerprint sensor chip 221 may be disposed below a middle region of the display screen 210 of the electronic device 200 through the circuit board 240 to conform to a usage habit of a user and facilitate holding by the user.

For example, the circuit board 240 is disposed between the display screen 210 and the fingerprint sensor chip 221. For another example, the fingerprint sensor chip 221 is disposed between the circuit board 240 and the display screen 210.

Optionally, the fingerprint sensor 221 is disposed under the display screen 210 in a non-contact manner.

In the embodiment of the present application, fingerprint sensor chip 221 fixed mounting in behind circuit board 240, can pass through circuit board 240 will fingerprint sensor chip 221 fixed mounting has been avoided general in the below of electronic equipment's display screen 210 the direct laminating of fingerprint sensor chip 221 is in on the display screen 210, can reduce the installation degree of difficulty and the complexity of fingerprint sensor chip 221 to improve maintainability.

In addition, in a scenario where the fingerprint sensor chip 221 includes a plurality of chips, the plurality of chips may be fixedly mounted below the display screen 210 at one time, which can reduce the mounting complexity and improve the mounting efficiency.

Optionally, in some embodiments of the present application, a microlens array may be disposed above the fingerprint sensor chip 221. The fingerprint sensor chip 221 receives a fingerprint detection signal which is sent by the display screen 210 and is returned by reflection or scattering of a human finger above the display screen 210 through the micro-lens array, and can collect the wide-angle fingerprint detection signal, so that the fingerprint identification efficiency is improved.

It should be understood that the fingerprint sensor chip 211 shown in fig. 3 may be the fingerprint sensor chip 210 in the fingerprint identification device 140 shown in fig. 1 and 2, and the circuit board 240 may be the circuit board 150 shown in fig. 1 and 2, and the description of the related functions and structures thereof may refer to the foregoing description, and therefore, for brevity, will not be repeated herein.

It should also be understood that FIG. 3 is only one example of the present application and should not be taken as limiting the present application.

For example, in other alternative embodiments, the fingerprint sensor chip 211 and the circuit board may be disposed side-by-side on a support plate.

For another example, in other alternative embodiments, the fingerprint sensor chip 211 may also be fixed to other components of the electronic device, such as a middle frame, a back cover, or a battery, so that the fingerprint sensor chip 211 is disposed below the display screen of the electronic device.

Optionally, the fingerprint identification device 220 further includes a bending portion.

Two ends of the bending part are respectively used for connecting the display screen 210 and the circuit board 240, so that the circuit board 240 is arranged below the display screen 210 in parallel. The shape of the bent portion may be a U-shape or a deformation of the U-shape. Taking the shape of the bent portion as a U-shape as an example, two ends of the bent portion are parallel to each other, so that when the two ends of the bent portion are respectively used for connecting the display screen 210 and the circuit board 240, it can be ensured that the circuit board 240 is arranged below the display screen 210 in parallel.

As shown in fig. 4, the bending portion may include a Chip On FPC (COF) layer 231 and an Integrated Circuit (IC) Chip 234 of the display screen 210.

The COF layer 231 may be used to secure the IC chip 234 to the circuit board 240.

Alternatively, the bending portion can use the COF layer 231 as a carrier to directly package the IC chip 234 on the COF layer 231 to form a chip package product. I.e., the COF layer 231 may be used to carry the IC chip 234. The COF layer 231 may also be referred to as a COF flexible package substrate, which refers to a package type flexible substrate without a chip or a component, and is an important component of a Printed Circuit Board (PCB).

In addition, the COF layer 231 may also serve to electrically connect the IC chip 234 to the circuit board 240 during chip packaging. That is, the IC chip 234 may be bonded to the circuit board 240 through the COF layer 231 to enable the IC chip to communicate with the circuit board 240.

In the present application, the bending portion may be a part of the circuit board 240.

That is, after the fingerprint sensor chip 221 is fixedly disposed on the circuit board 240, the circuit board 240 is bent, so that the fingerprint sensor chip 221 can be fixedly disposed under the display screen 210. For example, the folded circuit board 240 may be attached below the display screen 210 by an adhesive tape. In the embodiment of the present application, the fingerprint sensor chip 221 is mounted below the display screen 210 through a circuit board, so that the mounting cost and complexity are low, and the maintainability is improved.

Optionally, as shown in fig. 4, the bending portion may further include a shielding layer 232 of the COF layer. The shielding layer 232 is used to support the IC chip 234 and insulate the IC chip 234 from other components of the electronic device 200.

At this time, the shielding layer 232 may be disposed at an outer side of the COF layer 231, and the IC chip 234 may be disposed between the COF layer 231 and the shielding layer 232 at a position close to the circuit board 240.

It should be understood that the shielding layer 232 may be disposed at a position of the COF layer 231 near the IC chip 234, that is, the shielding layer 232 may be disposed at a partial position of the outer side of the COF layer 231, or the shielding layer 232 may be disposed at the entire outer side of the COF layer. This is not particularly limited in the embodiments of the present application.

Optionally, as shown in fig. 4, the bent portion may further include a fixing member 233.

The fixing member 233 may be disposed at a position of the COF layer 231 near the IC chip 234, and the fixing member 233 is used to fix one end of the COF layer 231 for connecting the circuit board 240 below the display screen 210.

In the installation process or after the installation is completed, the bending degree of the bending part can be kept unchanged through the fixing part 233, and the position of the fingerprint sensor chip 221 relative to the display screen is further ensured to be fixed. Therefore, the position of the fingerprint sensor chip 221 is prevented from changing in the using process, and the fingerprint identification effect can be improved.

Alternatively, a space exists between the fixing member 233 and the driving IC chip 234. The fixing member 233 may include one or more members for fixing. The fixing member 233 may fix one end of the COF layer 231, which is used for connecting the circuit board 240, below the display screen 210 by means of a snap or an adhesive. For example, the fixing member 233 may be fixed to the protective layer 217 of the display screen 210, or may be fixed to other components such as a middle frame or a battery of the electronic device 200, which is not specifically limited in this embodiment of the present invention.

The specific structure of the display screen 210 according to the embodiment of the present application will be described in detail with reference to fig. 4.

As shown in fig. 4, the display screen 210 may include a display component 215 and a light blocking layer 216.

The light shield layer 216 set up in display component 215's below, light shield layer 216 is provided with the windowing, fingerprint identification device 220 passes through the windowing is received the light signal that forms after the reflection of human finger that display component 215 sent, light signal is used for fingerprint identification.

The fingerprint sensor 221 of the fingerprint identification device 220 is in contact with the lower surface of the display component 215, or a gap exists between the fingerprint sensor 221 and the lower surface of the display component 215. The gap may be an air gap (air gap) not filled with any auxiliary material, which may ensure that the fingerprint sensor 221 does not contact the lower surface of the display screen when the display screen is pressed or the electronic device falls or collides, and may not affect the stability and performance of fingerprint identification of the fingerprint sensor 221.

The display element 215 may be a light emitting layer of the display panel 210, for example, the display element 215 may be an OLED organic light emitting panel made by Low Temperature Poly-silicon (LTPS) technology, which has an ultra-thin thickness, a light weight, and Low power consumption, and can be used to provide a relatively clear image. When there is a gap between the fingerprint sensor chip 221 and the display assembly 215, the gap may be less than or equal to a preset threshold, including but not limited to 600 um.

The opacifying layer 216 may also be used as a screen print layer, which may carry graphics, which may be used as a logo, such as a trademark pattern, or an embossing layer. The light shielding layer 216 may be a black sheet-like layer or a printed layer for shielding light.

Optionally, as shown in fig. 5, the display screen 210 may further include a protection layer 217 for protecting the display screen 210. Similar to the light shielding layer 216, the protective layer 217 is also provided with a window, and the fingerprint identification device 220 receives an optical signal which is sent by the display component 215 and is formed after being reflected by a human finger through the window, wherein the optical signal is used for fingerprint identification. In other embodiments, the protective layer 217 may also be referred to as a buffer (cushion) layer or a rear panel, or the light shielding layer 216 and the protective layer 217 may be integrally formed.

The protective layer 217 may also include a heat sink layer. For example, the protection layer 217 may include the heat dissipation layer at least a portion of which is formed of a metal material.

Optionally, as shown in fig. 4, the display screen 210 may further include a wiring layer 214, which may include wiring for electrical connection of the fingerprint sensor chip 221 and/or the display screen 210.

Optionally, as shown in fig. 4, the display screen 210 may further include a Polarizer (POL) 213. Polarizers, which may also be referred to as polarizers, are used to produce polarized light. The polarized light is used for optical signal imaging.

Optionally, as shown in fig. 4, the display screen 210 may further include a cover glass 211, where the cover glass 211 is used to protect the display screen 210.

Alternatively, as shown in fig. 4, the cover glass 211 and the polarizer 213 may be bonded by an Optically Clear Adhesive (OCA) 212. The OCA 212 may be a double-sided adhesive tape without a base material formed by making an optical acrylic adhesive into a non-base material and then respectively attaching a release film to the upper and lower bottom layers, in short, the OCA 212 may be a layer of double-sided adhesive tape without a base material and having an optically transparent property.

Alternatively, the OCA 212 may be any adhesive for cementing transparent optical elements (such as lenses, etc.), which is colorless and transparent, has a light transmittance greater than a certain threshold (e.g., greater than 90%), has good cementing strength, can be cured at room temperature or at intermediate temperature, and has small curing shrinkage. For example, the OCA 212 may be replaced with an Optically Clear Resin (OCR).

The fingerprint recognition device shown in fig. 3 will be described in detail below.

Fig. 5 is a schematic structural diagram of the fingerprint recognition device 220 of the electronic apparatus shown in fig. 3.

As shown in fig. 5, the circuit board 240 is provided with at least one mounting member 227 at a peripheral position of the fingerprint sensor chip 221, and the mounting member 227 is used for fixedly mounting the circuit board 240 below the display screen 210.

For example, the mounting member 227 is an adhesive tape.

The thickness of the mounting member 227 is such that the distance between the fingerprint sensor chip 221 and the lower surface of the light emitting layer of the display screen 210 is less than or equal to 600 um.

Optionally, as shown in fig. 5, the fingerprint recognition device 220 may further include a support plate 229.

At least a portion of the circuit board 240 is disposed between the fingerprint sensor chip 221 and the support plate 229. That is, the fingerprint sensor chip 221 may be disposed on the upper surface of the circuit board 240.

Alternatively, as shown in fig. 5, the fingerprint sensor chip 221 may be attached to the upper surface of the circuit board 240 by a Die Attach Film (DAF) 222. The supporting plate 229 and the circuit board 240 are bonded together by an electrically conductive adhesive (228).

The DAF 222 may be any ultra-thin film adhesive used to connect a semiconductor chip to a package substrate and a chip to a chip in a semiconductor packaging process, and the fingerprint sensor chip 221 may be packaged in a stacked and thin manner. The conductive adhesive 228 may be an adhesive that has a certain conductivity after being cured or dried.

Optionally, in this embodiment, the fingerprint sensor chip 221 may also be fixedly connected to the support plate 229.

For example, the circuit board 240 may be provided with a through hole through which the fingerprint sensor chip 221 is fixedly connected with the support plate 229. For another example, the fingerprint sensor chip 221 may be fixedly connected to the support plate 229 by bypassing the circuit board 240.

The support plate 229 includes, but is not limited to, a metal reinforcing plate, and the thickness of the support plate 229 may range from 0.075mm to 0.3 mm. For example, the metal reinforcing plate may be a rigid reinforcing plate, and the thickness of the supporting plate 229 ranges from 0.15mm to 0.3mm to control the thickness of the fingerprint recognition device 220.

The support plate 229 has a surface roughness (Ra) greater than a threshold, such as 0.25um, to enhance imaging; specifically, when the surface roughness of the supporting plate 229 is greater than a certain threshold, the surface thereof may scatter the optical signal, which may effectively reduce the optical signal emitted by the display screen 210 and reflected inside the fingerprint identification device 220, thereby avoiding the influence of the optical reflection on the imaging; in addition, when the surface roughness of the support plate 229 is greater than a certain threshold value, the reliability of the connection between the support plate 229 and other components may be increased. Such as the reliability of the connection between the support plate 229 and the fingerprint sensor chip 221 and the circuit board 240 and the reliability of the connection between the support plate 229 and the member for fixing the support plate 229.

The color of the supporting plate 229 may be dark to increase the light absorption effect of the supporting plate 229, so as to prevent the light reflected upward by the supporting plate 229 from interfering with the light received by the fingerprint sensor chip 221. Such as black or dark brown.

Optionally, as shown in fig. 5, the fingerprint identification device 220 further includes:

an optical filter 223, the optical filter 223 being disposed above the fingerprint sensor chip 221.

The optical filter 223 may include one or more optical filters, which may be configured, for example, as a band pass filter to allow transmission of light emitted by the OLED screen while blocking other light components such as infrared light in sunlight. Such optical filtering may effectively reduce background light caused by sunlight when the fingerprint recognition device 220 is used outdoors under a screen. The one or more optical filters may be implemented, for example, as optical filter coatings formed on one or more continuous interfaces, or may be implemented as one or more discrete interfaces. It should be understood that the filter 223 may be fabricated on the surface of any optical component or along the optical path to the fingerprint sensor chip 221 via reflected light formed by finger reflection.

In the present embodiment, the optical filter 223 is used to reduce the undesired ambient light in the fingerprint sensing to improve the optical sensing of the received light by the fingerprint sensor chip 221. The filter 223 may specifically be used to filter out light of a particular wavelength, e.g., near infrared light and a portion of red light, etc. For example, a human finger absorbs most of the energy of light with a wavelength below 580nm, and if one or more optical filters or optical filter layers are designed to filter light with a wavelength from 580nm to infrared, the effect of ambient light on the optical detection in fingerprint sensing can be greatly reduced.

In addition, the light inlet surface of the optical filter 223 may be provided with an optical inorganic coating or an organic blackened coating, so that the reflectivity of the light inlet surface of the optical filter 223 is lower than a first threshold value, for example, 1%, thereby ensuring that the fingerprint sensor chip 221 can receive sufficient optical signals, and further improving the fingerprint identification effect.

The optical filter 223 and the fingerprint sensor chip 221 are fixed by dispensing in a non-photosensitive area of the fingerprint sensor chip 221, and a gap exists between the optical filter 223 and the photosensitive area of the fingerprint sensor chip 221. Or the lower surface of the optical filter 223 is fixed on the upper surface of the fingerprint sensor chip 221 by glue with a refractive index lower than a preset refractive index, for example, the preset refractive index includes but is not limited to 1.3. Or the periphery of the optical filter 223 and the circuit board 240 are fixed by dispensing.

It should be noted that when the optical filter 223 is attached to the upper surface of the fingerprint sensor chip 221 by filling the optical adhesive, once the thickness of the adhesive covering the upper surface of the fingerprint sensor chip 221 is not uniform, a newton ring phenomenon may occur, thereby affecting the fingerprint identification effect. In the embodiment of the present application, the optical filter 223 can be attached to the upper surface of the fingerprint sensor chip 221 in an overhead manner, so that an air layer can be ensured between the optical filter 223 and the fingerprint sensor chip 221, thereby avoiding the occurrence of the newton ring problem and improving the fingerprint identification effect.

Optionally, as shown in fig. 5, the circuit board 240 is connected to the fingerprint sensor chip 221 through a gold wire 226, and a height of the gold wire 226 and a height of the sealant 225 of the gold wire 226 are respectively lower than a height of the optical filter 223.

Specifically, the gold wire 226 is used to implement communication between the fingerprint sensor chip 221 and the circuit board 240, and to implement electrical interconnection and signal transmission with other peripheral circuits or other elements in the electronic device shown in fig. 1 or fig. 2 through the circuit board 220. For example, the fingerprint sensor chip 221 may receive a control signal of a processing unit of the electronic device through the gold wire 226, and may further output a fingerprint detection signal (e.g., a fingerprint image) to an image processor of the fingerprint identification device 220 or a processor of the electronic device 300 through the gold wire 226.

In this embodiment, the gold wire 226 is encapsulated by the sealant 225, so that the connection reliability between the circuit board 240 and the fingerprint sensor chip 221 can be effectively ensured.

As shown in fig. 6, taking the display screen 210 as an OLED screen as an example, the display screen 210 may be a soft screen or a hard screen, and the display screen may include a screen printing (screen print) layer 216, a protective layer 217, and other stacked layers. After the above-mentioned lamination is perforated, the OLED panel may leak light downward. When a finger is placed above the OLED screen with the bright screen, the finger can reflect light emitted by the OLED screen, and the reflected light can penetrate through the OLED screen to the lower side of the OLED screen. The filter 223 positioned below the OLED screen can be used to filter out infrared signal components in the leaked light. Since a fingerprint is a diffuse reflector, light signals formed by reflection or diffusion of a finger exist in all directions. A Micro lens Array (Micro lens Array) disposed between the bottom of the OLED screen and the fingerprint sensor chip 221 can collect the light signal leaked from the top of the OLED screen. Thus, the fingerprint sensor chip 221 receives the light signal of the red light filtered, and images a fingerprint image.

It should be noted that the light signals leaked from above the OLED screen include fingerprint signals and internal structure signals of the screen, and the internal structure signals of the screen may affect the imaging of the fingerprint image, for example, moire fringes may be generated when the fingerprint image is imaged. In this embodiment, by controlling the mounting member 227 (e.g., the adhesive used for adhering the fingerprint recognition device) and the sizes of the parts, the distance between the fingerprint sensor chip 221 and the OLED screen (e.g., the lower surface of the display module 215) is within 600um, so that the image of the screen structure is blurred, but the image of the structure of the fingerprint is not affected. Since the smaller the distance between the fingerprint sensor chip 221 and the OLED screen is, the better the fingerprint identification performance is, the distance between the fingerprint sensor chip 221 and the OLED screen can be minimized on the premise of the reliability and the process capability.

Optionally, as shown in fig. 6, the fingerprint recognition device 220 further includes a connector 250 of the display screen 210; the connector 250 is connected to the circuit board 240, and the connector 250 includes at least one pin, which includes the pin of the fingerprint recognition device 220. Therefore, the number of connectors in the electronic equipment can be effectively reduced, and the internal structure of the electronic equipment is further simplified.

It should be understood that fig. 3-6 are only examples of the present application and should not be construed as limiting the present application.

For example, in other alternative embodiments, the fingerprint recognition device 220 may further include an image processor, which may be disposed on the circuit board 240. The image processor may be embodied as a Micro Processing Unit (MCU) and is configured to receive a fingerprint detection signal (e.g., a fingerprint image) from the fingerprint sensor chip 221 via the circuit board 240 and perform fingerprint identification based on the fingerprint detection signal.

Specifically, the fingerprint sensor chip 221 first receives reflected light reflected from a user's finger and performs imaging based on the received light signal to generate a fingerprint image; then, the fingerprint image is sent to the image processor through the circuit board 240, so that the image processor performs image processing and obtains a fingerprint signal; and finally, carrying out fingerprint identification on the fingerprint signal through an algorithm.

For another example, the fingerprint identification device 220 may further include at least one capacitor, and the at least one capacitor may be disposed on the circuit board 220 for optimizing the fingerprint detection signal collected by the fingerprint sensor chip 221. For example, the at least one capacitor is used for filtering the fingerprint detection signal collected by the fingerprint sensor chip 221.

It should be understood that the specific examples in the embodiments of the present application are for the purpose of promoting a better understanding of the embodiments of the present application and are not intended to limit the scope of the embodiments of the present application.

It is to be understood that the terminology used in the embodiments of the present application and the appended claims is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the present application. For example, as used in the examples of this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

Those of ordinary skill in the art will appreciate that the elements of the examples described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the components and steps of the examples have been described above generally in terms of their functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

In the several embodiments provided in the present application, it should be understood that the disclosed system and apparatus may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may also be an electric, mechanical or other form of connection.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiments of the present application.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.

The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application may be substantially implemented or contributed to by the prior art, or all or part of the technical solutions may be implemented in a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.

While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A fingerprint identification device is applied to an electronic device with a display screen, and is characterized by comprising:

a circuit board;

at least one fingerprint sensor chip disposed above the circuit board;

the at least one fingerprint sensor chip is connected with the circuit board;

the circuit board is used for being installed below the display screen, so that the at least one fingerprint sensor chip is located below the display screen in a non-contact mode, the at least one fingerprint sensor chip is used for receiving fingerprint detection signals returned by reflection or scattering of a human finger above the display screen, and the fingerprint detection signals are used for detecting fingerprint information of the finger;

the circuit board is provided with at least one mounting part at the peripheral position of the at least one fingerprint sensor chip, and the mounting part is used for fixedly mounting the circuit board below the display screen;

the thickness of the mounting piece enables the distance between the at least one fingerprint sensor chip and the lower surface of the light emitting layer of the display screen to be smaller than or equal to 600 um;

the fingerprint identification device further comprises: the fingerprint sensor chip is fixedly connected with the supporting plate through the through hole, or the fingerprint sensor chip bypasses the circuit board and is fixedly connected with the supporting plate;

wherein, the backup pad is the metal reinforcement board, and/or the surface roughness of backup pad is greater than 0.25um, and/or the thickness range of backup pad is 0.15mm ~0.3 mm.

2. The fingerprint recognition device of claim 1, wherein the mounting member is an adhesive tape.

3. The fingerprint recognition device according to claim 1 or 2, further comprising:

a bending part;

4. The fingerprint recognition device according to claim 3, wherein the bent portion comprises:

a Chip On Film (COF) layer;

5. The fingerprint recognition device according to claim 4, wherein the bent portion further comprises:

a shielding layer of the COF layer;

6. The fingerprint recognition device according to claim 4, wherein the bent portion further comprises:

a fixing member;

7. The fingerprint recognition device of claim 6, wherein a space exists between the fixture and the IC chip.

8. The fingerprint recognition device according to claim 1 or 2, wherein the at least one fingerprint sensor chip comprises a plurality of optical fingerprint sensor chips, and the plurality of optical fingerprint sensor chips are arranged on the upper surface of the support plate side by side to be spliced into an optical fingerprint sensor chip assembly.

9. The fingerprint recognition device of claim 1 or 2, wherein a micro-lens array is disposed over the at least one fingerprint sensor chip.

10. The fingerprint recognition device according to claim 1 or 2, further comprising:

11. The fingerprint identification device of claim 10, wherein the light inlet surface of the optical filter is provided with an optical inorganic coating or an organic black coating.

12. The fingerprint identification device according to claim 10, wherein the optical filter and the at least one fingerprint sensor chip are fixed by dispensing in a non-photosensitive area of the at least one fingerprint sensor chip, and a gap exists between the optical filter and the photosensitive area of the at least one fingerprint sensor chip; or the lower surface of the optical filter is fixed on the upper surface of the at least one fingerprint sensor chip through glue with the refractive index lower than the preset refractive index.

13. The fingerprint identification device of claim 10, wherein the periphery of the filter and the circuit board are fixed by dispensing.

14. The fingerprint identification device of claim 10, wherein the circuit board is connected to the at least one fingerprint sensor chip by a gold wire, and a height of the gold wire and a height of a sealant of the gold wire are respectively lower than a height of the optical filter.

15. The fingerprint recognition device according to claim 1 or 2, further comprising:

a connector of the display screen;

16. An electronic device, comprising:

the fingerprint recognition device and display of any one of claims 1 to 15;

17. The electronic device of claim 16, wherein the display screen comprises:

a display component;