CN118715600A - Electronic component transfer method, electronic device manufacturing method, and electronic device manufacturing apparatus - Google Patents
Electronic component transfer method, electronic device manufacturing method, and electronic device manufacturing apparatus Download PDFInfo
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- CN118715600A CN118715600A CN202380022702.7A CN202380022702A CN118715600A CN 118715600 A CN118715600 A CN 118715600A CN 202380022702 A CN202380022702 A CN 202380022702A CN 118715600 A CN118715600 A CN 118715600A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7515—Means for applying permanent coating, e.g. in-situ coating
- H01L2224/75161—Means for screen printing, e.g. roller, squeegee, screen stencil
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Die Bonding (AREA)
- Credit Cards Or The Like (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The electronic component transfer method uses at least one of a step of receiving a plurality of electronic components (15) held on a first substrate (20) by a first transfer roller (4) and a step of supplying the plurality of electronic components (15) held on the first transfer roller (4) to a second substrate (30), and makes the interval of the electronic components (15) on the second substrate (30) in the direction along a second axis (X3) different from the interval of the electronic components (15) on the first substrate (20) in the direction along the first axis (X1), and makes the interval of the electronic components (15) on the third substrate (40) in the direction along a third axis (X6) different from the interval of the electronic components (15) on the second substrate (30) in the direction along another axis (4) by at least one of a step of receiving the plurality of electronic components (15) held on the second substrate (30) by a second transfer roller (11) and a step of supplying the plurality of electronic components (15) held on the second transfer roller (11) to the third substrate (40).
Description
Technical Field
The present disclosure relates to an electronic component transfer method for transferring electronic components, a method for manufacturing electronic devices, and an apparatus for manufacturing electronic devices.
Background
In the case where a plurality of electronic components are manufactured on a growth substrate, it is necessary to transfer the plurality of electronic components to another substrate. For example, in a manufacturing process of a display device using an LED chip (an example of an electronic component) as a light emitting element, for example, the following operations are performed: a plurality of LED chips are manufactured on a growth substrate, and the LED chips are transferred to predetermined positions on a circuit substrate different from the growth substrate. As a conventional technique related to the transfer of electronic components, there is a device chip transfer method described in patent document 1 (international publication No. 2017/163775).
Patent document 1 describes a device chip transfer method for transferring a device chip using a receiving step of receiving a device chip held on a surface of a plate-like member by a surface of a rotatable columnar rotating member, and a providing step of providing a device chip held on a surface of the rotating member to a surface of another plate-like member.
In addition, patent document 1 describes a method of changing the pitch of the device chips on the plate-like member and the pitch of the device chips on the rotary member when the device chips on the plate-like member are received by the rotary member.
Prior art literature
Patent literature
Patent document 1: international publication No. 2017/163775
Disclosure of Invention
Problems to be solved by the invention
When the method described in patent document 1 is used, the intervals of the plurality of electronic components can be changed in one-dimensional direction, that is, the intervals of the plurality of electronic components can be changed in a direction along one axis while the plurality of electronic components are transferred from the plate-like member to the other plate-like member.
However, patent document 1 does not describe a method of changing the interval between a plurality of electronic components arranged in two dimensions.
The present disclosure has been made in view of the above-described problems, and an object thereof is to provide an electronic component transfer method, an electronic device manufacturing method, and an electronic device manufacturing apparatus that can change the intervals of electronic components in two dimensions.
Solution for solving the problem
In one embodiment of the present disclosure, an electronic component transfer method includes:
A first receiving step of disposing the first substrate and the first transfer roller so that a first axis parallel to a first surface of a first substrate holding a plurality of electronic components in a two-dimensional arrangement is orthogonal to a first rotation axis of a columnar first transfer roller capable of rotating, and receiving the plurality of electronic components held on the first surface of the first substrate by a surface of the first transfer roller;
A first supply step of, after the first receiving step, disposing the first transfer roller and the second base material so that the first rotation axis of the first transfer roller holding the plurality of electronic components on the surface is orthogonal to a second axis parallel to the second surface of the second base material, and supplying the plurality of electronic components held on the surface of the first transfer roller to the second surface of the second base material;
A second receiving step of, after the first supplying step, disposing the second base material and the second transfer roller so that a second rotation axis of a columnar second transfer roller rotatable with the other axis intersecting the second axis is orthogonal to the second surface of the second base material holding the plurality of electronic components, and receiving the plurality of electronic components held on the second surface of the second base material by a surface of the second transfer roller; and
A second supply step of, after the second receiving step, disposing the second transfer roller and the third base material so that the second rotation axis of the second transfer roller holding the plurality of electronic components on the surface is orthogonal to a third axis parallel to a third surface of the third base material, and supplying the plurality of electronic components held on the surface of the second transfer roller to the third surface of the third base material,
The first receiving step and the first supplying step are performed such that the intervals between the plurality of electronic components on the second base material in the direction along the second axis are different from the intervals between the plurality of electronic components on the first base material in the direction along the first axis,
Through at least one of the second receiving step and the second providing step, the intervals between the plurality of electronic parts on the third base material in the direction along the third axis are made different from the intervals between the plurality of electronic parts on the second base material in the direction along the other axis.
According to the above configuration, the intervals between the plurality of electronic components in the direction along the second axis on the second substrate on which the electronic components are transferred can be made different from the intervals between the plurality of electronic components in the direction along the first axis on the first substrate by at least one of the first receiving step and the first supplying step. In addition, at least one of the second receiving step and the second supplying step can make the intervals between the plurality of electronic components in the direction along the third axis on the third substrate on which the electronic components are transferred different from the intervals between the plurality of electronic components in the direction along the other axis on the second substrate. That is, the first receiving step, the first supplying step, the second receiving step, and the second supplying step change the intervals of the plurality of electronic components initially mounted on the first base material in the directions along the two intersecting axes, and are mounted on the third surface of the third base material.
Accordingly, it is possible to provide an electronic component transfer method capable of changing the interval of electronic components in two dimensions.
In another configuration of the electronic component transfer method of the present disclosure, at least one of the following operations is performed: setting a difference between a relative speed of the first surface of the first substrate with respect to the first transfer roller in a direction along the first axis and a surface speed based on rotation of the first transfer roller in the first receiving step; and setting a difference between a relative speed of the second surface of the second substrate with respect to the first transfer roller in a direction along the second axis and a surface speed based on rotation of the first transfer roller in the first supply step.
According to the above configuration, in the case where the difference is set between the relative speed of the first surface of the first substrate with respect to the first transfer roller in the direction along the first axis and the surface speed based on the rotation of the first transfer roller in the first receiving step, the intervals in the circumferential direction between the plurality of electronic components attached to the surface of the first transfer roller can be made different from the intervals between the plurality of electronic components in the direction along the first axis in the first substrate placed on the first surface of the first substrate. In the case where the difference is set between the relative speed of the second surface of the second substrate in the direction along the second axis and the surface speed based on the rotation of the first transfer roller in the first supply step, the interval in the direction along the second axis between the plurality of electronic components attached to the second surface of the second substrate and the interval in the circumferential direction between the plurality of electronic components attached to the surface of the first transfer roller can be made different.
In another configuration of the electronic component transfer method of the present disclosure, at least one of the following operations is performed: setting a difference between a relative speed of the second surface of the second substrate with respect to the second transfer roller in the direction along the other axis and a surface speed based on rotation of the second transfer roller in the second receiving step; and setting a difference between a relative speed of the third surface of the third substrate with respect to the second transfer roller and a surface speed based on rotation of the second transfer roller in the direction along the third axis in the second supply step.
According to the above configuration, in the case where the difference is set between the relative speed of the second surface of the second substrate with respect to the second transfer roller in the direction along the other axis and the surface speed based on the rotation of the second transfer roller in the second receiving step, the intervals in the circumferential direction between the plurality of electronic components attached to the surface of the second transfer roller can be made different from the intervals between the plurality of electronic components in the direction along the other axis in the second substrate placed on the second surface of the second substrate. In the second supply step, when a difference is set between the relative speed of the third surface of the third base material with respect to the second transfer roller in the direction along the third axis and the surface speed based on the rotation of the second transfer roller, the intervals in the circumferential direction between the plurality of electronic components attached to the third surface of the third base material and the intervals in the circumferential direction between the plurality of electronic components attached to the surface of the second transfer roller can be made different.
In another configuration of the electronic component transfer method of the present disclosure, at least one of the following operations is performed:
In the first receiving step, the following steps are repeated in this order: a step of bringing the first substrate and the first transfer roller into close contact with each other in a vertical direction while stopping movement of the first substrate and the first transfer roller in a direction along the first axis and stopping rotation of the first transfer roller, a step of holding the electronic component in contact with both the first surface of the first substrate and the surface of the first transfer roller by bringing the first substrate and the first transfer roller away from each other in the vertical direction, and a step of changing a positional relationship between the first substrate and the first transfer roller in the direction along the first axis and rotating the first transfer roller; and
In the first supply step, the following steps are repeated in this order: the method includes a step of bringing the second substrate and the first transfer roller into close contact with each other in a vertical direction while stopping movement of the second substrate and the first transfer roller in a direction along the second axis and stopping rotation of the first transfer roller, a step of holding the electronic component in contact with both the second surface of the second substrate and the surface of the first transfer roller by bringing the second substrate and the first transfer roller away from each other in a vertical direction, and a step of changing a positional relationship between the second substrate and the first transfer roller in a direction along the second axis and rotating the first transfer roller.
According to the above configuration, when the plurality of steps are repeated in this order in the first receiving step, a part of the electronic components, that is, a group of the electronic components held on the first substrate and arranged in a direction parallel to the first rotation axis of the first transfer roller are collectively transferred from the first substrate to the first transfer roller each time the movement of the first substrate and the rotation of the first transfer roller are stopped. Then, after a part of the electronic components are transferred from the first base material to the first transfer roller and the first base material and the first transfer roller are separated from each other in the vertical direction, the first transfer roller is rotated. That is, the circumferential intervals of the plurality of electronic components transferred to the surface of the first transfer roller can be adjusted by adjusting the rotation angle when the first transfer roller is rotated in a state where the first substrate and the first transfer roller are separated from each other in the vertical direction.
In the case where the plurality of steps are repeated in this order in the first supply step, a part of the electronic components, that is, a group of the electronic components held by the first transfer roller, among the plurality of electronic components held by the first transfer roller are collectively transferred from the first transfer roller to the second substrate each time the movement of the second substrate and the rotation of the first transfer roller are stopped. Then, a part of the electronic components are transferred from the first transfer roller to the second substrate, and the first transfer roller and the second substrate are separated from each other in the vertical direction, and then the first transfer roller is rotated. That is, the adjustment of the interval in the direction along the second axis between the plurality of electronic components transferred to the second surface of the second substrate can be performed by adjusting the rotation angle when the first transfer roller is rotated in a state where the first transfer roller and the second substrate are separated from each other in the vertical direction.
In another configuration of the electronic component transfer method of the present disclosure, at least one of the following operations is performed:
In the second receiving step, the following steps are repeated in this order: a step of bringing the second substrate and the second transfer roller into close contact with each other in a vertical direction while stopping movement of the second substrate and the second transfer roller in a direction along the other axis and stopping rotation of the second transfer roller, a step of holding the electronic component in contact with both the second surface of the second substrate and the surface of the second transfer roller by bringing the second substrate and the second transfer roller away from each other in a vertical direction, and a step of changing a positional relationship between the second substrate and the second transfer roller in a direction along the other axis and rotating the second transfer roller; and
In the second supply step, the following steps are repeated in this order: the method may further include a step of bringing the third substrate and the second transfer roller into close contact with each other in a vertical direction while stopping movement of the third substrate and the second transfer roller in a direction along the third axis and stopping rotation of the second transfer roller, a step of holding the electronic component in contact with both the third surface of the third substrate and the surface of the second transfer roller by bringing the third substrate and the second transfer roller away from each other in a vertical direction, and a step of changing a positional relationship between the third substrate and the second transfer roller in a direction along the third axis and rotating the second transfer roller.
According to the above configuration, when the plurality of steps are repeated in this order in the second receiving step, a part of the electronic components, that is, a group of the electronic components held on the second substrate and arranged in a direction parallel to the second rotation axis of the second transfer roller, is collectively transferred from the second substrate to the second transfer roller each time the movement of the second substrate and the rotation of the second transfer roller are stopped. Then, after a part of the electronic components are transferred from the second base material to the second transfer roller and the second base material and the second transfer roller are separated from each other in the vertical direction, the second transfer roller is rotated. That is, the circumferential intervals of the plurality of electronic components transferred to the surface of the second transfer roller can be adjusted by adjusting the rotation angle when the second transfer roller is rotated in a state where the second substrate and the second transfer roller are separated from each other in the vertical direction.
In the case where the plurality of steps are repeated in this order in the second supply step, a part of the electronic components, that is, a group of the electronic components held by the second transfer roller, among the plurality of electronic components held by the second transfer roller are collectively transferred from the second transfer roller to the third substrate each time the movement of the third substrate and the rotation of the second transfer roller are stopped. Then, a part of the electronic components are transferred from the second transfer roller to the third substrate, and the second transfer roller and the third substrate are separated from each other in the vertical direction, and then the second transfer roller is rotated. That is, the interval between the plurality of electronic components transferred to the third surface of the third substrate in the direction along the third axis can be adjusted by adjusting the rotation angle when the third transfer roller is rotated in a state where the second transfer roller and the third substrate are separated from each other in the vertical direction.
In another configuration of the electronic component transferring method of the present disclosure, the second axis in the second base material forms an angle of 90 degrees with the other axis,
A substrate rotation step of rotating the second substrate by 90 degrees is performed between the first supply step and the second receiving step so that the second axis of the second substrate when the second substrate is disposed in the first supply step is parallel to the other axis of the second substrate when the second substrate is disposed in the second receiving step.
According to the above configuration, since the angle between the second axis and the other axis in the second base material is 90 degrees, the plurality of electronic components held by the first base material are finally transferred to the third base material in a state where the intervals in the direction along the first axis of the first base material are changed and the intervals in the direction along the axis orthogonal to the first axis of the first base material are changed.
In addition, the first axis of the first base material when disposed in the first receiving step and the second axis of the second base material when disposed in the first supplying step are parallel to each other, and the other axis of the second base material when disposed in the second receiving step and the third axis of the third base material when disposed in the second supplying step are parallel to each other. Further, since the substrate rotating step of rotating the second substrate by 90 degrees is performed between the first supplying step and the second receiving step, the first substrate, the first transfer roller, and the second substrate are arranged in parallel to each other in the first receiving step and the first supplying step, that is, in parallel to the first axis of the first substrate and the second axis of the second substrate, and in parallel to each other in the second receiving step and the second supplying step, that is, in parallel to the other axis of the second substrate and the third axis of the third substrate.
In another configuration of the electronic component transferring method of the present disclosure, the second axis in the second base material forms an angle of 90 degrees with the other axis,
The second axis of the second base material in the case of being arranged in the first supply step is orthogonal to the other axis of the second base material in the case of being arranged in the second receiving step.
According to the above configuration, since the angle between the second axis and the other axis in the second base material is 90 degrees, the plurality of electronic components held by the first base material are finally transferred to the third base material in a state where the intervals in the direction along the first axis of the first base material are changed and the intervals in the direction along the axis orthogonal to the first axis of the first base material are changed.
In addition, since the second axis of the second base material when arranged in the first supply step may be orthogonal to the other axis of the second base material when arranged in the second receiving step in advance, the step of rotating the second base material as described above is not required.
In another configuration of the electronic component transferring method of the present disclosure, the electronic component transferring method further includes a coating step of coating the electrode portions of the plurality of electronic components held on the surface of the second transferring roller with a conductive paste by a coating roller.
According to the above configuration, the conductive paste applied to the electronic component can attach the electronic component to the third base material when the electronic component is transferred from the second transfer roller to the third base material. In addition, the electrode of the transferred electronic component can be electrically connected to the electrode of the electric circuit formed on the third base material through the conductive paste.
In one embodiment of the present disclosure, an electronic device includes a circuit board, and the method includes:
A first receiving step of disposing the first substrate and the first transfer roller so that a first axis parallel to a first surface of a first substrate holding a plurality of electronic components in a two-dimensional arrangement is orthogonal to a first rotation axis of a columnar first transfer roller capable of rotating, and receiving the plurality of electronic components held on the first surface of the first substrate by a surface of the first transfer roller;
A first supply step of, after the first receiving step, disposing the first transfer roller and the second base material so that the first rotation axis of the first transfer roller holding the plurality of electronic components on the surface is orthogonal to a second axis parallel to the second surface of the second base material, and supplying the plurality of electronic components held on the surface of the first transfer roller to the second surface of the second base material;
A second receiving step of, after the first supplying step, disposing the second base material and the second transfer roller so that a second rotation axis of a columnar second transfer roller rotatable with the other axis intersecting the second axis is orthogonal to the second surface of the second base material holding the plurality of electronic components, and receiving the plurality of electronic components held on the second surface of the second base material by a surface of the second transfer roller; and
A second supply step of, after the second receiving step, disposing the second transfer roller and the circuit board so that the second rotation axis of the second transfer roller holding the plurality of electronic components on the surface is orthogonal to a third axis parallel to a third surface of the circuit board, and supplying the plurality of electronic components held on the surface of the second transfer roller to the third surface of the circuit board,
The first receiving step and the first supplying step are performed such that the intervals between the plurality of electronic components on the second base material in the direction along the second axis are different from the intervals between the plurality of electronic components on the first base material in the direction along the first axis,
At least one of the second receiving step and the second supplying step is performed such that the intervals between the plurality of electronic components on the circuit board in the direction along the third axis are different from the intervals between the plurality of electronic components on the second base material in the direction along the other axis.
According to the above configuration, the intervals between the plurality of electronic components in the direction along the second axis on the second substrate on which the electronic components are transferred can be made different from the intervals between the plurality of electronic components in the direction along the first axis on the first substrate by at least one of the first receiving step and the first supplying step. In addition, at least one of the second receiving step and the second supplying step can make the intervals between the plurality of electronic components in the direction along the third axis on the circuit board on which the electronic components are transferred different from the intervals between the plurality of electronic components in the direction along the other axis on the second base material. That is, the first receiving step, the first supplying step, the second receiving step, and the second supplying step change the intervals of the plurality of electronic components initially mounted on the first base material in the directions along the two intersecting axes, and are mounted on the third surface of the circuit board.
Accordingly, a method for manufacturing an electronic device in which the intervals between electronic components are changed in two dimensions can be provided.
In one embodiment of the present disclosure, an apparatus for manufacturing an electronic device includes a circuit board, the apparatus including:
a first table, a second table, a third table, and a fourth table;
A first conveying device, a second conveying device and a third conveying device;
a cylindrical first transfer roller rotatable about a first rotation axis;
A cylindrical second transfer roller rotatable about a second rotation axis; and
A control unit configured to control the first conveying device, the second conveying device, the third conveying device, the first transfer roller, and the second transfer roller,
The control section performs the following operations:
Causing the first conveying device to convey a first base material holding a plurality of electronic parts in a two-dimensional arrangement on a first surface to the first table;
Moving the first transfer roller to a position where a first axis parallel to the first surface of the first substrate is orthogonal to the first rotation axis of the first transfer roller, and receiving the plurality of electronic components held on the first surface of the first substrate through the surface of the first transfer roller;
causing the second conveying device to convey a second substrate to the second stage;
moving the first transfer roller holding the plurality of electronic components on the surface to a position where the first rotation axis is orthogonal to a second axis parallel to the second surface of the second base material, and supplying the plurality of electronic components held on the surface of the first transfer roller to the second surface of the second base material;
Causing the second conveying means to convey the second base material holding the plurality of electronic parts on the surface to the third stage;
Moving the second transfer roller to a position where another axis intersecting the second axis of the second surface of the second substrate is orthogonal to the second rotation axis of the second transfer roller, and receiving the plurality of electronic components held on the second surface of the second substrate through the surface of the second transfer roller;
Causing the third conveying device to convey the circuit substrate to the fourth stage;
Moving the second transfer roller holding the plurality of electronic components on the surface to a position where the second rotation axis of the second transfer roller is orthogonal to a third axis parallel to the third surface of the circuit board, supplying the plurality of electronic components held on the surface of the second transfer roller to the third surface of the circuit board,
By making the intervals of the plurality of electronic parts in the direction along the second axis on the second base material different from the intervals of the plurality of electronic parts in the direction along the first axis on the first base material based on at least one of the receiving and the providing of the first transfer roller,
By making the intervals of the plurality of electronic parts on the circuit substrate in the direction along the third axis different from the intervals of the plurality of electronic parts on the second base material in the direction along the other axis based on at least one of the receiving and the supplying of the second transfer roller.
According to the above configuration, by at least one of receiving and supplying the electronic components by the first transfer roller, the intervals between the plurality of electronic components in the direction along the second axis on the second substrate on which the electronic components are transferred can be made different from the intervals between the plurality of electronic components in the direction along the first axis on the first substrate. Further, by at least one of receiving and supplying the electronic parts by the second transfer roller, the intervals between the plurality of electronic parts in the direction along the third axis on the circuit board on which the electronic parts are transferred can be made different from the intervals between the plurality of electronic parts in the direction along the other axis on the second base material. That is, by receiving and supplying the electronic components by the first transfer roller and receiving and supplying the electronic components by the second transfer roller, the intervals of the plurality of electronic components initially mounted on the first base material are changed in the directions along the two axes intersecting each other, and are mounted on the third surface of the circuit board.
Accordingly, it is possible to provide an apparatus for manufacturing an electronic device in which the intervals between electronic components are changed in two dimensions.
Drawings
Fig. 1 is a diagram showing a configuration of an electronic component transfer apparatus.
Fig. 2 is a diagram for explaining a case of transferring electronic components.
Fig. 3 is a cross-sectional view showing a state in which the first substrate is placed on the first stage.
Fig. 4 is a perspective view illustrating the structure of the first base material.
Fig. 5 is a diagram illustrating a first receiving step of receiving a plurality of electronic components held on a first surface of a first base material by a surface of a first transfer roller.
Fig. 6 is a diagram illustrating a first supply step of supplying electronic components held on the surface of the first transfer roller to the surface of the second base material.
Fig. 7 is a diagram illustrating the first receiving step.
Fig. 8 is a diagram illustrating the first receiving step.
Fig. 9 is a diagram illustrating the first receiving step.
Fig. 10 is a diagram illustrating the first receiving step.
Fig. 11 is a diagram illustrating the first receiving step.
Fig. 12 is a diagram illustrating the first supply step.
Fig. 13 is a diagram illustrating the first supply step.
Fig. 14 is a diagram illustrating the first supply step.
Fig. 15 is a diagram for explaining a case of transferring electronic components.
Fig. 16 is a diagram for explaining a case of transferring electronic components.
Fig. 17 is a diagram showing a configuration of another electronic component transfer apparatus.
Detailed Description
< First embodiment >, first embodiment
Fig. 1 is a diagram showing a configuration of an electronic component transfer apparatus. Fig. 2 is a diagram for explaining a case of transferring the electronic component 15. The electronic component 15 is, for example, a device chip. The electronic component transfer apparatus includes a control unit 50. The control unit 50 controls the operations of the respective units of the electronic component transfer apparatus according to the present embodiment and the other embodiments, and causes the electronic component transfer method according to the present embodiment and the other embodiments to be executed. The control unit 50 is a control circuit such as a processor. The control unit 50 includes, for example, a recording medium in which a program and data are recorded, and a computer circuit. In the electronic component transfer method, the electronic component 15 held on the surface of the first substrate 20 is transferred to the surface of the third substrate 40 via the first transfer roller 4, the second substrate 30, and the second transfer roller 11.
The configuration of the electronic component transfer apparatus will be described below with reference to fig. 1, and a method of transferring electronic components will be described below.
In the electronic component transfer apparatus, the first substrate 20 is stored in the first substrate storage unit 1, the second substrate 30 is stored in the second substrate storage unit 7, and the third substrate 40 is stored in the third substrate storage unit 14.
The first substrate storage unit 1 is disposed adjacent to the first conveyor 2. The first substrate 20 is transported between the first substrate storage unit 1 and the first table 3 by the first transport device 2. The first conveyor 2 includes a travel mechanism 2a that travels on a travel guide 16, an arm 2b, and a telescopic mechanism 2c that can extend the arm 2b in the direction of the first substrate storage unit 1 and in the direction of the first table 3. The first conveyor 2 can transfer the first substrate 20 between the first substrate storage unit 1 and the first table 3. For example, the first conveyor 2 can receive the first substrate 20 stored in the first substrate storage unit 1 using the arm 2b, and place the received first substrate 20 on the first table 3.
The second substrate 30 is transported between the second substrate storage unit 7 and the rotating mechanism 6, and the second substrate 30 is transported between the second substrate storage unit 7 and the third table 10 by the second transport device 9. The second conveyor 9 includes a travel mechanism 9a, an arm 9b, and a telescopic mechanism 9c that can extend the arm 9b in the direction of the second substrate storage unit 7, the rotating mechanism 6, and the third table 10, which travel on the travel guide 17. The second conveyor 9 is capable of delivering the second substrate 30 between the rotating mechanism 6, the second substrate storage unit 7, and the third table 10. For example, the second conveyor 9 can receive the second substrate 30 stored in the second substrate storage unit 7 by using the arm 9b, and place the received second substrate 30 on the rotating mechanism 6. The second conveyor 9 can receive the second substrate 30 placed on the rotating mechanism 6 by using the arm 9b, and place the received second substrate 30 on the second substrate storage unit 7. The second conveyor 9 may also receive the second substrate 30 stored in the second substrate storage unit 7 by using the arm 9b, and place the received second substrate 30 on the third table 10.
The second conveyor 9 conveys the second substrate 30, on which the electronic component 15 is not mounted, received from the second substrate storage unit 7 to the rotating mechanism 6. For example, the second base material 30 on which the electronic component 15 is not mounted is stored in the second base material storage portion 7a (7), and the second base material 30 on which the electronic component 15 is mounted is stored in the second base material storage portion 7b (7). The second conveyor 9 conveys the second substrate 30 on which the electronic components 15 are mounted, received from the rotating mechanism 6, to the second substrate storage 7b or the third table 10. The second base material 30 on which the electronic component 15 is not mounted may be stored in the second base material storage unit 7b, or the second base material 30 on which the electronic component 15 is mounted may be stored in the second base material storage unit 7a.
The third substrate 40 is transported between the third substrate storage unit 14 and the fourth table 12 by the third transport device 13. The third conveying device 13 includes a travel mechanism 13a that travels on the travel guide 16, an arm 13b, and a telescopic mechanism 13c that can extend the arm 13b in the direction of the third substrate storage unit 14 and in the direction of the fourth table 12. The third conveyor 13 can transfer the third substrate 40 between the third substrate storage unit 14 and the fourth table 12. For example, the third conveying device 13 can receive the third substrate 40 placed on the fourth table 12 using the arm 13b, and convey the received third substrate 40 to the third substrate storage unit 14.
The electronic component 15 is a light emitting element such as a Mini-LED or a mu-LED, for example. Electronic components 15 such as Mini-LEDs and mu-LEDs are fabricated on a growth substrate (not shown). The plurality of electronic components 15 formed on the growth substrate are transferred onto the first surface 24 of the first base material 20 by a method such as laser lift-off, and the first base material 20 is stored in the first base material storage unit 1. In this case, the plurality of electronic components 15 are held on the first surface 24 of the first base material 20 in a two-dimensional arrangement. Then, by the electronic component transfer method by the electronic component transfer apparatus, the plurality of electronic components 15 held on the first surface 24 of the first base material 20 are finally transferred to the third surface 42 of the third base material 40. The third base material 40 is, for example, a circuit board provided with an electric circuit, and electrodes of the electronic component 15 transferred to the circuit board are connected to electrodes of the electric circuit of the circuit board. Thus, an electronic device such as a display device is manufactured in which the electronic component 15 is connected to an electric circuit. For example, the electronic component 15 is an LED element, and the display device is an LED display. The electronic component transfer apparatus may be an apparatus for manufacturing electronic devices.
The first table 3 is provided side by side with the first transfer roller 4 and the second table 5. The first stage 3 can hold the first substrate 20 by vacuum suction or the like on the first substrate 20 placed thereon. The second table 5 can hold the second substrate 30 by vacuum suction or the like on the second substrate 30 placed thereon. The electronic component 15 held by the first substrate 20 placed on the first stage 3 is transferred to the second substrate 30 placed on the second stage 5 via the first transfer roller 4.
The first table 3 is movable in a direction parallel to the first axis X1 of the first substrate 20 shown in fig. 2 by means of an electric motor or the like, for example. The second table 5 is movable in a direction parallel to the second axis X3 of the second substrate 30 shown in fig. 2 by, for example, an electric motor or the like. The first transfer roller 4 is rotatable about a first rotation axis X2 shown in fig. 2 and vertically liftable and lowerable by an electric motor or the like, for example.
The third table 10 is provided in parallel with the second transfer roller 11 and the fourth table 12. The third table 10 can hold the second substrate 30 by vacuum suction or the like on the second substrate 30 placed thereon. The fourth stage 12 can hold the third substrate 40 by vacuum suction or the like on the third substrate 40 placed thereon. The electronic components 15 held by the second substrate 30 placed on the third stage 10 are transferred to the third substrate 40 placed on the fourth stage 12 via the second transfer roller 11. The third substrate 40 on which the electronic component 15 is mounted is transported to the third substrate storage section 14 by the third transport device 13.
The third table 10 is movable in a direction parallel to and perpendicular to the other axis X4 of the second substrate 30 shown in fig. 2 by, for example, an electric motor or the like. The fourth table 12 is movable in a direction parallel to the third axis X6 of the third base material 40 shown in fig. 2 by means of an electric motor or the like, for example. The second transfer roller 11 is rotatable about a second rotation axis X5 shown in fig. 2 and vertically liftable and lowerable by an electric motor or the like, for example.
In order to adjust the positions of the first substrate 20, the first transfer roller 4, the second substrate 30, the second transfer roller 11, and the third substrate 40, the first stage 3, the first transfer roller 4, the second stage 5, the third stage 10, the second transfer roller 11, and the fourth stage 12 may be configured to be movable in directions different from the above-described directions.
Fig. 3 is a cross-sectional view showing a state in which the first substrate 20 is placed on the first table 3. Fig. 4 is a perspective view illustrating the structure of the first base material 20. As shown in the figure, the first base material 20 has an annular outer frame 21 and a first sheet 23 placed on the upper surface of the outer frame 21. The first sheet 23 is detachable from the outer frame 21. A spacer 22, which is a member different from the outer frame 21, is provided in a hole provided in the center of the outer frame 21. The lower surface of the first sheet 23 is supported by the outer frame 21 and the spacers 22. The plurality of electronic components 15 are mounted on the upper surface of the first sheet 23. In the present embodiment, the upper surface of the first sheet 23 provided on the first base material 20 is referred to as the first surface 24 of the first base material 20.
The first sheet 23 of the first base material 20 is, for example, a soft material, a hard material, or the like, and the first surface 24 thereof has adhesiveness to such an extent that the electronic component 15 can be held. For example, the first sheet 23 includes a substrate made of a resin such as polyethylene terephthalate, polyethylene naphthalate, polyether ether ketone, polyimide, or the like, and a resin film having tackiness. The resin film having adhesiveness may be an ultraviolet-modified material, a heat-modified material, or the like, or may be a resin having adhesiveness weaker than that of the sheet 25 of the first transfer roller 4, which will be described later.
The second substrate 30 has the same structure as the first substrate 20. That is, as shown in fig. 6, the second base material 30 includes an annular outer frame 31 and a second sheet 33 placed on the upper surface of the outer frame 31. The second sheet 33 is detachable from the outer frame 31. A spacer 32, which is a member different from the outer frame 31, is provided in a hole provided in the center of the outer frame 31. The lower surface of the second sheet 33 is supported by the outer frame 31 and the spacer 32. The plurality of electronic components 15 are mounted on the upper surface of the second sheet 33. In the present embodiment, the upper surface of the second sheet 33 provided on the second substrate 30 is referred to as a second surface 34 of the second substrate 30.
The second sheet 33 includes, for example, a base made of a soft material or a hard material, and an adhesive resin film including the second surface 34. The adhesive resin film has adhesiveness to the extent that the electronic component 15 is attached to the second surface 34. The adhesive resin film has a property of being an ultraviolet-modified material whose adhesive force is reduced by ultraviolet irradiation to the second sheet 33, for example. The adhesive resin film is made of, for example, a silicon-based, acrylic-based, or epoxy-based material. The substrate of the second sheet 33 is made of, for example, a resin such as polyethylene terephthalate, polyethylene naphthalate, polyether ether ketone, polyimide, or the like.
The third base material 40 is, for example, a circuit board provided with an electric circuit to which the electronic component 15 is electrically connected. A third sheet 41 having adhesiveness to the extent that the electronic component 15 is attached is provided on the upper surface of the electric circuit. After the electronic component 15 is mounted, a process of establishing conduction between the electrode of the circuit board and the electrode of the electronic component 15 is performed. For example, by pressing the electronic component 15 against the circuit board, electrical conduction between the electrode of the circuit board and the electrode of the electronic component 15 is established by the conductive material contained in the third sheet 41. In the present embodiment, the upper surface of the third base material 40 is referred to as a third surface 42.
The first transfer roller 4 has a sheet 25 having adhesiveness to the extent that the electronic component 15 is attached on the surface of the cylindrical portion thereof. The sheet 25 is detachable from the cylindrical portion of the first transfer roller 4. The sheet 25 includes, for example, a base and an adhesive resin film as an ultraviolet-modified material whose adhesive force is reduced by ultraviolet irradiation. The substrate is composed of, for example, a resin such as polyethylene terephthalate, polyethylene naphthalate, polyether ether ketone, polyimide, or the like. The adhesive resin film of the sheet 25 is made of, for example, a silicon-based, acrylic-based, or epoxy-based material. In the present embodiment, the surface of the sheet 25 provided on the first transfer roller 4 is referred to as a surface 26 of the first transfer roller 4.
The second transfer roller 11 has a sheet 35 having adhesiveness to the extent that the electronic component 15 is attached on its cylindrical surface. The sheet 35 is detachable from the cylindrical portion of the second transfer roller 11. The sheet 35 includes, for example, a base and an adhesive resin film as an ultraviolet-modified material whose adhesive force is reduced by ultraviolet irradiation. The substrate is made of, for example, a resin such as polyethylene terephthalate, polyethylene naphthalate, polyether ether ketone, polyimide, or the like. The adhesive resin film of the sheet 35 is made of, for example, a silicon-based, acrylic-based, or epoxy-based material. In the present embodiment, the surface of the sheet 35 provided on the second transfer roller 11 is referred to as a surface 36 of the second transfer roller 11.
As described above, the manufacturing apparatus of the electronic device including the circuit board includes: a first table 3, a second table 5, a third table 10, and a fourth table 12; a first conveyor 2, a second conveyor 9 and a third conveyor 13; a cylindrical first transfer roller 4 rotatable about a first rotation axis X2; a cylindrical second transfer roller 11 rotatable about a second rotation axis X5; and a control unit 50 that controls the first conveying device 2, the second conveying device 9, the third conveying device 13, the first transfer roller 4, and the second transfer roller 11.
When the plurality of electronic components 15 held on the first surface 24 of the first base material 20 are transferred to the second surface 34 of the second base material 30, an electronic component transfer method including a first receiving step, a first supplying step, a second receiving step, and a second supplying step described below is performed.
The first receiving step is a step of disposing the first substrate 20 and the first transfer roller 4 so that the first axis X1 parallel to the first surface 24 of the first substrate 20 holding the plurality of electronic components 15 in a two-dimensional arrangement is orthogonal to the first rotation axis X2 of the rotatable columnar first transfer roller 4, and receiving the plurality of electronic components 15 held on the first surface 24 of the first substrate 20 through the surface 26 of the first transfer roller 4. The first supply step is a step of disposing the first transfer roller 4 and the second base material 30 so that the first rotation axis X2 of the first transfer roller 4 holding the plurality of electronic components 15 on the surface 26 is orthogonal to the second axis X3 parallel to the second surface 34 of the second base material 30 after the first receiving step is performed, and supplying the plurality of electronic components 15 held on the surface 26 of the first transfer roller 4 to the second surface 34 of the second base material 30. The intervals between the plurality of electronic components 15 in the second base material 30 along the second axis X3 are made different from the intervals between the plurality of electronic components 15 in the first base material 20 along the first axis X1 by at least one of the first receiving step and the first supplying step.
The second receiving step is a step of disposing the second substrate 30 and the second transfer roller 11 so that the other axis X4 of the second surface 34 of the second substrate 30 holding the plurality of electronic components 15 is orthogonal to the second rotation axis X5 of the rotatable cylindrical second transfer roller 11 after the first supplying step, and receiving the plurality of electronic components 15 held on the second surface 34 of the second substrate 30 through the surface 36 of the second transfer roller 11. The second supply step is a step of disposing the second transfer roller 11 and the third base material 40 so that the second rotation axis X5 of the second transfer roller 11 holding the plurality of electronic components 15 on the surface 36 is orthogonal to the third axis X6 parallel to the third surface 42 of the third base material 40 after the second receiving step is performed, and supplying the plurality of electronic components 15 held on the surface 36 of the second transfer roller 11 to the third surface 42 of the third base material 40. The intervals between the plurality of electronic components 15 in the direction along the third axis X6 in the third base material 40 and the intervals between the plurality of electronic components 15 in the direction along the other axis X4 in the second base material 30 are made different by at least one of the second receiving step and the second supplying step. In the present embodiment, the second axis X3 and the other axis X4 of the second substrate 30 form an angle of 90 degrees.
[ First receiving step and first providing step ]
The electronic component 15 held on the first substrate 20 is transferred to the second substrate 30 placed on the second stage 5 by using the first transfer roller 4. As shown in fig. 2, the first axis X1 of the first substrate 20 is orthogonal to the first rotation axis X2 of the first transfer roller 4, and the second axis X3 of the second substrate 30 is orthogonal to the first rotation axis X2 of the first transfer roller 4. Thus, the first axis X1 in the first substrate 20 is parallel to the second axis X3 in the second substrate 30.
Fig. 5 is a diagram illustrating a first receiving step of receiving the plurality of electronic components 15 held on the first surface 24 of the first base material 20 by the surface 26 of the first transfer roller 4. Fig. 6 is a diagram illustrating a first supply step of supplying the plurality of electronic components 15 held on the surface 26 of the first transfer roller 4 to the second surface 34 of the second base material 30. By the first receiving step and the first supplying step, the intervals between the electronic parts 15 in the second base material 30 in the direction along the second axis X3 are made different from the intervals between the electronic parts 15 in the first base material 20 in the direction along the first axis X1.
The control unit 50 included in the apparatus for manufacturing electronic devices causes the first conveying device 2 to convey the first base material 20, which holds the plurality of electronic components 15 in a two-dimensional arrangement on the first surface 24, to the first stage 3. Then, the control unit 50 moves the first transfer roller 4 to a position where the first axis X1 parallel to the first surface 24 of the first substrate 20 is orthogonal to the first rotation axis X2 of the first transfer roller 4, and receives the plurality of electronic components 15 held on the first surface 24 of the first substrate 20 through the surface 26 of the first transfer roller 4.
Specifically, in the first receiving step, as shown in fig. 2, the first substrate 20 and the first transfer roller 4 are arranged so that the first axis X1 parallel to the first surface 24 of the first substrate 20 holding the plurality of electronic components 15 in a two-dimensional arrangement is orthogonal to the first rotation axis X2 of the first transfer roller 4. The first sheet 23 of the first substrate 20 has an adhesive force of, for example, 0.5kg/25mm or less. The adhesion of the sheet 25 provided on the first transfer roller 4 is, for example, 2kg/25mm or more in a state where ultraviolet irradiation as the adhesion reduction treatment is not performed.
As shown in fig. 5, a first receiving step is performed between the first substrate 20 and the first transfer roller 4. Specifically, as described above, the adhesive force (0.5 kg/25mm or less) of the first sheet 23 of the first base material 20 is set to be smaller than the adhesive force (2 kg/25mm or more) of the sheet 25 provided on the first transfer roller 4. As a result, as will be described later, when the electronic component 15 is held between and in contact with the first transfer roller 4 and the first sheet 23, the electronic component 15 adheres more strongly to the first transfer roller 4.
The control unit 50 lowers the first transfer roller 4 so that the distance between the lowermost portion of the surface 26 of the first transfer roller 4 and the first surface 24 of the first base material 20 becomes equal to the extent to which the electronic component 15 mounted on the first surface 24 of the first base material 20 contacts the lowermost portion of the surface 26 of the first transfer roller 4. Then, the control unit 50 rotates the first transfer roller 4 counterclockwise while moving the first substrate 20 along the first axis X1 in a direction indicated by an arrow in fig. 5. That is, the first surface 24 of the first substrate 20 is relatively moved with respect to the first transfer roller 4 in the direction along the first axis X1, and the first transfer roller 4 is rotated in place. The electronic component 15 held between and in contact with the first surface 24 of the first substrate 20 and the first transfer roller 4 is strongly adhered to the first transfer roller 4. As a result, the electronic components 15 held on the first base material 20 are sequentially transferred to the surface 26 of the first transfer roller 4.
In this case, that is, in a case where the first transfer roller 4 is rotated counterclockwise while the first substrate 20 is moved in the direction indicated by the arrow in fig. 5 along the first axis X1, a difference can be set between the relative speed of the first surface 24 of the first substrate 20 with respect to the first transfer roller 4 in the direction along the first axis X1 and the surface speed of the first transfer roller 4 due to the rotation of the first transfer roller 4. In this way, the intervals in the circumferential direction between the plurality of electronic components 15 attached to the surface 26 of the first transfer roller 4 can be made different from the intervals between the plurality of electronic components 15 placed on the first surface 24 of the first base material 20 in the direction along the first axis X1 in the first base material 20. For example, in the vicinity where the first surface 24 of the first substrate 20 and the surface 26 of the first transfer roller 4 are closest, when the speed of the surface 26 of the first transfer roller 4 is made faster than the speed of the first surface 24 of the first substrate 20, as shown in fig. 5, the intervals in the circumferential direction of the plurality of electronic components 15 attached to the surface 26 of the first transfer roller 4 are wider than the intervals in the direction along the first axis X1 of the plurality of electronic components 15 mounted on the first surface 24 of the first substrate 20.
The control unit 50 stops the movement of the first substrate 20 and the rotation of the first transfer roller 4 after transferring the electronic component 15 mounted on the first surface 24 of the first substrate 20 to the surface 26 of the first transfer roller 4. Then, the control unit 50 raises the first transfer roller 4, and increases the distance between the first transfer roller 4 and the first substrate 20.
In this way, after the electronic component 15 is held on the surface 26 of the first transfer roller 4, the control unit 50 performs ultraviolet irradiation as the adhesion reduction treatment of the sheet 25 bonded to the surface of the first transfer roller 4. The ultraviolet irradiation is performed on the surface of the first transfer roller 4 in a state where the electronic component 15 is held on the surface 26 of the first transfer roller 4. The ultraviolet irradiation device and the like are not shown. For example, the adhesion of the sheet 25 of the first transfer roller 4 is set to, for example, 0.5kg/25mm or less by the adhesion reducing treatment.
Thereafter, the control unit 50 disposes the first transfer roller 4 and the second substrate 30 so that the first rotation axis X2 of the first transfer roller 4 holding the electronic component 15 on the surface 26 is orthogonal to the second axis X3 parallel to the second surface 34 of the second substrate 30. The adhesion of the second sheet 33 of the second substrate 30 is, for example, 2kg/25mm or more in a state where the adhesion reduction treatment is not performed. That is, at this time, the adhesive force (0.5 kg/25mm or less) of the sheet 25 provided on the first transfer roller 4 is smaller than the adhesive force (2 kg/25mm or more) of the second sheet 33 of the second base material 30. As a result, as will be described later, when the electronic component 15 is brought into contact with the first transfer roller 4 and the second surface 34 of the second base material 30, the electronic component 15 adheres more strongly to the second surface 34 of the second base material 30.
Next, a first supply step is performed between the first transfer roller 4 and the second substrate 30. Here, the control unit 50 included in the manufacturing apparatus of the electronic device causes the second conveying device 9 to convey the second substrate 30 to the second table 5. Then, the control unit 50 moves the first transfer roller 4 holding the plurality of electronic components 15 on the surface 26 to a position where the first rotation axis X2 is orthogonal to the second axis X3 parallel to the second surface 34 of the second base material 30, and supplies the plurality of electronic components 15 held on the surface 26 of the first transfer roller 4 to the second surface 34 of the second base material 30.
Specifically, the second conveyor 9 conveys the second substrate 30 stored in the second substrate storage unit 7a and on which the electronic component 15 is not mounted, to the upper side of the rotating mechanism 6, and conveys the second substrate 30 therefrom to the second stage 5.
Then, the control unit 50 lowers the first transfer roller 4 so that the distance between the lowermost portion of the surface 26 of the first transfer roller 4 and the second surface 34 of the second substrate 30 becomes equal to the distance between the second surface 34 of the second substrate 30 and the lowermost portion of the surface 26 of the first transfer roller 4, which is in contact with the electronic component 15. Then, the control unit 50 rotates the first transfer roller 4 counterclockwise while moving the second substrate 30 along the second axis X3 in the direction indicated by the arrow in fig. 6. That is, the control unit 50 moves the second surface 34 of the second substrate 30 relative to the first transfer roller 4 in the direction along the second axis X3, and rotates the first transfer roller 4 in place. In this case, the electronic component 15 held between and in contact with the second surface 34 of the second substrate 30 and the first transfer roller 4 is strongly adhered to the second substrate 30. As a result, the electronic components 15 held by the first transfer roller 4 are sequentially transferred to the second surface 34 of the second substrate 30.
In this case, that is, in the case where the first transfer roller 4 is rotated counterclockwise while the second substrate 30 is moved in the direction indicated by the arrow in fig. 6 along the second axis X3, a difference can be set between the relative speed of the second surface 34 of the second substrate 30 with respect to the first transfer roller 4 in the direction along the second axis X3 and the surface speed of the first transfer roller 4 due to the rotation of the first transfer roller 4. In this way, the intervals in the direction along the second axis X3 between the plurality of electronic components 15 attached to the second surface 34 of the second base material 30 can be made different from the intervals in the circumferential direction between the plurality of electronic components 15 attached to the surface 26 of the first transfer roller 4. In particular, in the vicinity where the second surface 34 of the second base material 30 is closest to the surface 26 of the first transfer roller 4, when the speed of the second surface 34 of the second base material 30 is made faster than the speed of the surface 26 of the first transfer roller 4, the intervals between the plurality of electronic components 15 attached to the second surface 34 of the second base material 30 are wider than the intervals between the plurality of electronic components 15 attached to the surface 26 of the first transfer roller 4 in the circumferential direction.
After the electronic component 15 attached to the surface 26 of the first transfer roller 4 is transferred to the second surface 34 of the second substrate 30 as described above, the control unit 50 stops the second substrate 30 and the first transfer roller 4. Then, the control unit 50 raises the first transfer roller 4, and increases the distance between the first transfer roller 4 and the second substrate 30.
By performing the first receiving process and the first supplying process as described above, as shown in fig. 2, the intervals dc between the electronic parts 15 in the second base material 30 in the direction along the second axis X3 can be made different from the intervals dc between the electronic parts 15 in the first base material 20 in the direction along the first axis X1.
The spacing between the electronic components 15 in the second base material 30 along the second axis X3 may be different from the spacing between the electronic components 15 in the first base material 20 along the first axis X1 by at least one of the first receiving step and the first supplying step. For example, at least one of the following operations may be performed: in the first receiving step, a difference is set between the relative speed of the first surface 24 of the first substrate 20 with respect to the first transfer roller 4 in the direction along the first axis X1 and the surface speed of the first transfer roller 4 based on the rotation of the first transfer roller 4; and setting a difference between a relative speed of the second surface 34 of the second substrate 30 with respect to the first transfer roller 4 in a direction along the second axis X3 and a surface speed of the first transfer roller 4 based on the rotation of the first transfer roller 4 in the first supply step.
Thereafter, the control unit 50 conveys the second substrate 30 from the second table 5 to the rotating mechanism 6. Then, the control unit 50 rotates the second substrate 30 on which the electronic component 15 is mounted by 90 degrees by using the rotating mechanism 6 operated by, for example, an electric motor or the like. That is, the substrate rotation step of rotating the second substrate 30 by 90 degrees is performed between the first supply step and the second receiving step so that the second axis X3 of the second substrate 30 when arranged in the first supply step is parallel to the other axis X4 of the second substrate 30 when arranged in the second receiving step, which will be described later.
The control unit 50 may reduce the adhesion of the second substrate 30 by irradiating the rotating second substrate 30 with ultraviolet rays. In this case, even if there is an uneven distribution of the intensity of the ultraviolet light at the surface of the second substrate 30, the light energy received by the surface of the second substrate 30 is averaged by irradiating the ultraviolet light during the rotation of the second substrate 30. As a result, unevenness of the ultraviolet curing reaction in the second substrate 30 can be reduced. For example, the adhesion of the second sheet 33 of the second substrate 30 is set to, for example, 0.5kg/25mm or less by the adhesion-reducing treatment. The adhesion force of the sheet 35 provided on the second transfer roller 11 is, for example, 2kg/25mm or more in a state where ultraviolet irradiation is not performed. Thereafter, the control unit 50 conveys the rotated second substrate 30 to the third table 10 by the second conveying device 9. Instead of the aforementioned irradiation of the rotating second substrate 30 with ultraviolet light, the second substrate 30 may be irradiated with ultraviolet light after being transferred to the third stage 10 before being transferred by the second transfer roller 11.
[ Second receiving step and second providing step ]
The control unit 50 transfers the electronic component 15 mounted on the second substrate 30 to the third substrate 40 mounted on the fourth stage 12 using the second transfer roller 11. Here, the control unit 50 included in the electronic device manufacturing apparatus causes the second conveying device 9 to convey the second base material 30 holding the plurality of electronic components 15 on the surface to the third table 10. Then, the control unit 50 moves the second transfer roller 11 to a position where the other axis X4 intersecting the second axis X3 of the second surface 34 of the second substrate 30 is orthogonal to the second rotation axis X5 of the second transfer roller 11, and receives the plurality of electronic components 15 held on the second surface 34 of the second substrate 30 through the surface 36 of the second transfer roller 11.
Specifically, in the second receiving step and the second supplying step, as shown in fig. 2, the second substrate 30 and the second transfer roller 11 are disposed so that the other axis X4 of the second surface 34 of the second substrate 30 intersecting the second axis X3 is orthogonal to the second rotation axis X5 of the second transfer roller 11. The third substrate 40 and the second transfer roller 11 are disposed so that the third axis X6 of the third substrate 40 is orthogonal to the second rotation axis X5 of the second transfer roller 11. Thus, the other axis X4 in the second substrate 30 is parallel to the third axis X6 in the third substrate 40.
Next, a second receiving step and a second supplying step, which are similar to the first receiving step and the first supplying step described with reference to fig. 5 and 6, are performed between the second substrate 30 and the second transfer roller 11. By performing the second receiving step and the second supplying step, the intervals between the electronic parts 15 in the direction along the third axis X6 in the third base material 40 are made different from the intervals between the electronic parts 15 in the direction along the other axis X4 in the second base material 30.
Specifically, the control unit 50 vacuum-adsorbs the second substrate 30 to the third stage 10. A second receiving step is performed between the second substrate 30 and the second transfer roller 11. Specifically, the control unit 50 first disposes the second transfer roller 11 and the second substrate 30 so that the second rotation axis X5 of the second transfer roller 11 holding the electronic component 15 on the surface 36 is orthogonal to the other axis X4 parallel to the second surface 34 of the second substrate 30. That is, at this time, the adhesive force (0.5 kg/25mm or less) of the second sheet 33 of the second base material 30 is set to be smaller than the adhesive force (2 kg/25mm or more) of the sheet 35 provided on the second transfer roller 11. As a result, when the electronic component 15 is sandwiched between and in contact with the second sheet 33 of the second base material 30 and the sheet 35 of the second transfer roller 11, the electronic component 15 adheres more strongly to the sheet 35 of the second transfer roller 11.
Then, the control unit 50 lowers the second transfer roller 11 so that the distance between the lowermost portion of the surface 36 of the second transfer roller 11 and the second surface 34 of the second substrate 30 becomes equal to the extent to which the electronic component 15 mounted on the second surface 34 of the second substrate 30 contacts the lowermost portion of the surface 36 of the second transfer roller 11. Then, the control unit 50 rotates the second transfer roller 11 while moving the second substrate 30. In this case, the electronic component 15 held between and in contact with the second surface 34 of the second substrate 30 and the second transfer roller 11 is strongly adhered to the second transfer roller 11. As a result, the electronic components 15 held on the second substrate 30 are sequentially transferred to the surface 36 of the second transfer roller 11.
In this case, that is, in the case where the second transfer roller 11 is rotated while the second substrate 30 is moved, a difference can be set between the relative speed of the second surface 34 of the second substrate 30 with respect to the second transfer roller 11 in the direction along the other axis X4 and the surface speed of the second transfer roller 11 due to the rotation of the second transfer roller 11. In this way, the intervals in the circumferential direction between the plurality of electronic components 15 attached to the surface 36 of the second transfer roller 11 can be made different from the intervals between the plurality of electronic components 15 placed on the second surface 34 of the second base material 30 in the direction along the other axis X4 in the second base material 30. For example, in the vicinity where the second surface 34 of the second substrate 30 and the surface 36 of the second transfer roller 11 are closest, when the speed of the surface 36 of the second transfer roller 11 is made faster than the speed of the second surface 34 of the second substrate 30, the intervals in the circumferential direction of the plurality of electronic components 15 attached to the surface 36 of the second transfer roller 11 are wider than the intervals between the plurality of electronic components 15 placed on the second surface 34 of the second substrate 30 in the direction along the other axis X4.
The control unit 50 stops the second substrate 30 and the second transfer roller 11 after transferring the electronic component 15 mounted on the second surface 34 of the second substrate 30 to the surface 36 of the second transfer roller 11. Then, the control unit 50 raises the second transfer roller 11, and increases the distance between the second transfer roller 11 and the second substrate 30.
After the electronic component 15 is held on the surface 36 of the second transfer roller 11 in this manner, the control unit 50 irradiates the surface with ultraviolet light, which is the treatment for reducing the adhesion of the sheet 35 of the second transfer roller 11. As a result, the adhesion of the surface 36 of the second transfer roller 11 is, for example, 0.5kg/25mm or less. The third sheet 41 of the third base material 40 has an adhesive force of, for example, 2kg/25mm or more. That is, at this time, the adhesive force (0.5 kg/25mm or less) of the sheet 35 provided on the second transfer roller 11 is smaller than the adhesive force (2 kg/25mm or more) of the third sheet 41 of the third base material 40. As a result, as will be described later, when the electronic component 15 comes into contact with the second transfer roller 11 and the third surface 42 of the third base material 40, the electronic component 15 adheres more strongly to the third surface 42 of the third base material 40.
Next, the control unit 50 included in the manufacturing apparatus of the electronic device causes the third conveying device 13 to convey the circuit board to the fourth table 12. Then, the control unit 50 moves the second transfer roller 11 holding the plurality of electronic components 15 on the surface to a position where the second rotation axis X5 of the second transfer roller 11 is orthogonal to the third axis X6 parallel to the third surface 42 of the circuit board, and supplies the plurality of electronic components 15 held on the surface 36 of the second transfer roller 11 to the third surface 42 of the circuit board. Specifically, the control unit 50 uses the third conveying device 13 to convey the third substrate 40 stored in the third substrate storage unit 14 to the fourth table 12. Then, the control unit 50 disposes the second transfer roller 11 and the third substrate 40 so that the second rotation axis X5 of the second transfer roller 11 on which the electronic component 15 is provided on the surface 36 is orthogonal to the third axis X6 parallel to the third surface 42 of the third substrate 40 mounted on the fourth stage 12. The third table 10 holds the third substrate 40 by vacuum suction or the like on the third substrate 40 placed thereon.
Next, a second supply step is performed between the second transfer roller 11 and the third base material 40. Specifically, the control unit 50 lowers the second transfer roller 11 so that the distance between the lowermost portion of the surface 36 of the second transfer roller 11 and the third surface 42 of the third base material 40 is such that the third surface 42 of the third base material 40 contacts the electronic component 15 attached to the lowermost portion of the surface 36 of the second transfer roller 11. Then, the control unit 50 rotates the second transfer roller 11 while moving the third substrate 40. In this case, the electronic component 15 held between and in contact with the third surface 42 of the third base material 40 and the second transfer roller 11 is strongly adhered to the third base material 40. As a result, the electronic components 15 held by the second transfer roller 11 are sequentially transferred to the second surface 34 of the third substrate 40.
In this case, that is, in the case where the second transfer roller 11 is rotated while the third substrate 40 is moved, a difference can be set between the relative speed of the second surface 34 of the third substrate 40 with respect to the second transfer roller 11 in the direction along the third axis X6 and the surface speed of the second transfer roller 11 due to the rotation of the second transfer roller 11. In this way, the intervals in the direction along the third axis X6 between the plurality of electronic components 15 attached to the third surface 42 of the third base material 40 can be made different from the intervals in the circumferential direction between the plurality of electronic components 15 attached to the surface 36 of the second transfer roller 11. In particular, in the vicinity where the third surface 42 of the third base material 40 and the surface 36 of the second transfer roller 11 are closest, when the speed of the surface 36 of the second transfer roller 11 is made faster than the speed of the third surface 42 of the third base material 40, the intervals between the plurality of electronic components 15 attached to the third surface 42 of the third base material 40 are wider than the intervals between the plurality of electronic components 15 attached to the surface 36 of the second transfer roller 11 in the circumferential direction.
After the electronic component 15 attached to the surface 36 of the second transfer roller 11 is transferred to the third surface 42 of the third substrate 40 as described above, the control unit 50 stops the third substrate 40 and the second transfer roller 11. Then, the control unit 50 raises the second transfer roller 11, and increases the distance between the second transfer roller 11 and the third substrate 40.
By performing the second receiving step and the second supplying step as described above, as shown in fig. 2, the interval dr between the electronic parts 15 in the direction along the third axis X6 in the third base material 40 can be made different from the interval dr between the electronic parts 15 in the direction along the other axis X4 in the second base material 30.
The spacing between the electronic components 15 in the third base material 40 along the third axis X6 may be different from the spacing between the electronic components 15 in the second base material 30 along the other axis X4 by at least one of the second receiving step and the second supplying step. For example, at least one of the following operations may be performed: in the second receiving step, a difference is set between the relative speed of the second surface 34 of the second substrate 30 with respect to the second transfer roller 11 in the direction along the other axis X4 and the surface speed of the second transfer roller 11 based on the rotation of the second transfer roller 11; and setting a difference between a relative speed of the third surface 42 of the third substrate 40 with respect to the second transfer roller 11 in the direction along the third axis X6 and a surface speed of the second transfer roller 11 based on the rotation of the second transfer roller 11 in the second supply step.
As described above, by the first receiving step and the first supplying step, that is, by receiving and supplying the electronic parts 15 by the first transfer roller 4, the intervals between the plurality of electronic parts 15 in the direction along the second axis X3 in the second base 30 on which the electronic parts 15 are transferred can be made different from the intervals between the plurality of electronic parts 15 in the direction along the first axis X1 in the first base 20. Further, by the second receiving step and the second supplying step, that is, by receiving and supplying the electronic parts 15 by the second transfer roller 11, the intervals of the plurality of electronic parts 15 in the direction along the third axis X6 in the third base material 40 on which the electronic parts 15 are transferred can be made different from the intervals of the plurality of electronic parts 15 in the direction along the other axis X4 in the second base material 30. That is, the intervals between the plurality of electronic components 15 initially mounted on the first base material 20 are changed in the directions along the two intersecting axes by the first receiving step, the first supplying step, the second receiving step, and the second supplying step, and are mounted on the third surface 42 of the third base material 40.
Since the second axis X3 of the second substrate 30 forms an angle of 90 degrees with the other axis X4, the plurality of electronic components 15 held by the first substrate 20 are finally transferred to the third substrate 40 in a state where the intervals dc of the first substrate 20 in the direction along the first axis X1 are changed and the intervals dr of the first substrate 20 in the direction along the axis orthogonal to the first axis X1 are changed.
In addition, the first axis X1 of the first base material 20 and the second axis X3 of the second base material 30 in the case of being arranged in the first receiving step and the first supplying step are parallel to each other, and the other axis X4 of the second base material 30 and the third axis X6 of the third base material 40 in the case of being arranged in the second receiving step and the second supplying step are parallel to each other. Further, since the substrate rotation step of rotating the second substrate 30 by 90 degrees is performed between the first supply step and the second receiving step, the first substrate 20, the first transfer roller 4, and the second substrate 30 are arranged in parallel to each other in the first receiving step and the first supply step, that is, in parallel to the first axis X1 of the first substrate 20 and the second axis X3 of the second substrate 30, and in parallel to the second substrate 30, the second transfer roller 11, and the third substrate 40 in the second receiving step and the second supply step, that is, in parallel to the other axis X4 of the second substrate 30 and the third axis X6 of the third substrate 40. As shown in fig. 1 and 2, the electronic component 15 can have a U-shaped path for transferring the first substrate 20 to the first transfer roller, the second substrate 30, the second transfer roller, and the third substrate 40 in this order. Therefore, the path can be compactly concentrated.
< Second embodiment >
The transfer process of the electronic component 15 of the second embodiment is different from the above embodiment. The second embodiment will be described below, but the same configuration as the above embodiment will be omitted.
Fig. 7 to 11 are diagrams for explaining the first receiving step.
In the first receiving step, that is, in the step of receiving the electronic component 15 from the first base material 20 by the first transfer roller 4, operations are performed in which the following steps are repeated in order: the method includes a step of bringing the first substrate 20 and the first transfer roller 4 into contact with each other in the vertical direction while stopping the movement of the first substrate 20 and the first transfer roller 4 in the direction along the first axis X1 and stopping the rotation of the first transfer roller 4 (a first step described later), a step of bringing the first substrate 20 and the first transfer roller 4 away from each other in the vertical direction to hold the electronic component 15 in contact with both the first surface 24 of the first substrate 20 and the surface 26 of the first transfer roller 4 on the first transfer roller 4 (a second step described later), and a step of changing the positional relationship between the first substrate 20 and the first transfer roller 4 in the direction along the first axis X1 and rotating the first transfer roller 4 (a third step described later).
To be specific, first, as in the case of the above-described embodiment, the control unit 50 irradiates the first sheet 23 of the first base material 20 with ultraviolet light as an adhesion reducing treatment to reduce the adhesion in advance.
Next, as shown in fig. 7, in the first step, the control unit 50 brings the first substrate 20 and the first transfer roller 4 into close proximity to each other in the vertical direction and brings the electronic component 15 into contact with both the first surface 24 of the first substrate 20 and the surface 26 of the first transfer roller 4 in a state in which the movement of the first substrate 20 and the first transfer roller 4 in the direction along the first axis X1 is stopped and the rotation of the first transfer roller 4 is stopped. In the illustrated example, the control unit 50 lowers the first transfer roller 4 in a state where the lowermost point 25a of the first transfer roller 4 is spaced apart from the electronic component 15a to be received among the plurality of electronic components 15 by a predetermined distance d1 in the direction along the first axis X1 of the first base material 20. As a result, first, the first transfer roller 4 is in line contact with the end of the electronic component 15a at a position separated from the lowermost point 25a by the distance d 1. Then, as the lowering of the first transfer roller 4 proceeds, the two are shifted from line contact to surface contact, and the lowering of the first transfer roller 4 is stopped in a state where the contact area is increased.
Next, as shown in fig. 8, in the second step, the control unit 50 keeps the electronic component 15 in contact with both the first surface 24 of the first base material 20 and the surface 26 of the first transfer roller 4 on the first transfer roller 4 by moving the first base material 20 and the first transfer roller 4 away from each other in the vertical direction. That is, only the electronic component 15a that is in contact with the surface 26 of the first transfer roller 4 in the first step is transferred from the first substrate 20 to the first transfer roller 4. In the illustrated example, the control unit 50 moves up the first transfer roller 4 to separate the first substrate 20 and the first transfer roller 4 from each other in the vertical direction.
Next, as shown in fig. 9, in the third step, the control unit 50 changes the positional relationship between the first substrate 20 and the first transfer roller 4 in the direction along the first axis X1, and rotates the first transfer roller 4. In the illustrated example, the first substrate 20 is moved in the right direction in fig. 9 along the first axis X1, whereby the positional relationship between the first substrate 20 and the first transfer roller 4 in the direction along the first axis X1 is changed and the first transfer roller 4 is rotated counterclockwise. For example, the control unit 50 moves the first substrate 20 by a predetermined distance through the first table 3, and rotates the first transfer roller 4 by a predetermined rotation angle. As a result, as described with reference to fig. 7, the lowermost point 25a of the first transfer roller 4 is spaced apart from the electronic component 15a to be received next by a predetermined distance d1 in the direction along the first axis X1 of the first base material 20.
Thereafter, as shown in fig. 10, the first step is performed again. That is, the control unit 50 lowers the first transfer roller 4 to bring the first substrate 20 and the first transfer roller 4 into close proximity to each other in the vertical direction, and brings the electronic component 15 into contact with both the first surface 24 of the first substrate 20 and the surface 26 of the first transfer roller 4. Then, as shown in fig. 11, the second step of vertically moving the first substrate 20 and the first transfer roller 4 away from each other is performed again, so that the electronic component 15 in contact with the surface 26 of the first transfer roller 4 in the first step is transferred from the first substrate 20 to the first transfer roller 4.
As described above, the first, second, and third steps are sequentially repeated in the first receiving step, whereby a part of the electronic components 15, that is, a group of the electronic components 15 held in the plurality of electronic components 15 of the first base material 20, are collectively transferred from the first base material 20 to the first transfer roller 4 in a direction parallel to the first rotation axis X2 of the first transfer roller 4 every time the movement of the first base material 20 and the rotation of the first transfer roller 4 are stopped. Then, the control unit 50 transfers a part of the electronic components 15 from the first base material 20 to the first transfer roller 4, and rotates the first transfer roller 4 after moving the first base material 20 and the first transfer roller 4 away from each other in the vertical direction. That is, the circumferential intervals of the plurality of electronic components 15 transferred to the surface 26 of the first transfer roller 4 can be adjusted by adjusting the rotation angle when the first transfer roller 4 is rotated in a state where the first substrate 20 and the first transfer roller 4 are separated from each other in the vertical direction.
Similarly, in the first supply step, that is, in the step of supplying the electronic component 15 to the second base material 30 by the first transfer roller 4, the operations of repeating the following steps in order are performed: a step of bringing the second substrate 30 and the first transfer roller 4 into contact with each other in the vertical direction while stopping the movement of the second substrate 30 and the first transfer roller 4 in the direction along the second axis X3 and stopping the rotation of the first transfer roller 4 ((fourth step described later)), a step of bringing the second substrate 30 and the first transfer roller 4 away from each other in the vertical direction to hold the electronic component 15 in contact with both the second surface 34 of the second substrate 30 and the surface 26 of the first transfer roller 4 on the second substrate 30 ((fifth step described later)), and a step of changing the positional relationship between the second substrate 30 and the first transfer roller 4 in the direction along the second axis X3 and rotating the first transfer roller 4 (sixth step described later).
Fig. 12 to 14 are diagrams for explaining the first supply step.
To be specific, first, as in the case of the above embodiment, the sheet 25 of the first transfer roller 4 is irradiated with ultraviolet light as the adhesion reducing treatment to reduce the adhesion in advance.
Next, as shown in fig. 12, in the fourth step, the control unit 50 brings the second substrate 30 and the first transfer roller 4 into close proximity to each other in the vertical direction in a state in which the movement of the second substrate 30 and the first transfer roller 4 in the direction along the second axis X3 is stopped and the rotation of the first transfer roller 4 is stopped, and brings the electronic component 15 into contact with both the second surface 34 of the second substrate 30 and the surface 26 of the first transfer roller 4. In this case, the control unit 50 lowers the first transfer roller 4 in a state where the lowermost point 25a of the first transfer roller 4 is spaced apart from the electronic component 15b to be supplied among the plurality of electronic components 15 by a predetermined distance d2 in a direction along the second axis X3 of the second base material 30. As a result, first, the electronic component 15b to be supplied held by the first transfer roller 4 is in line contact with the second surface 34 of the second base material 30 at a position separated from the lowermost point 25a by a distance d 2. Then, as the first transfer roller 4 is lowered, the two are shifted from line contact to surface contact, and the lowering of the first transfer roller 4 is stopped in a state where the contact area is increased.
Next, as shown in fig. 13, in the fifth step, the control unit 50 keeps the electronic component 15 in contact with both the second surface 34 of the second substrate 30 and the surface 26 of the first transfer roller 4 on the second substrate 30 by moving the second substrate 30 and the first transfer roller 4 away from each other in the vertical direction. That is, only the electronic component 15b that is in contact with the second surface 34 of the second substrate 30 in the fourth step is transferred from the first transfer roller 4 to the second substrate 30. In the illustrated example, the control unit 50 moves up the first transfer roller 4 to separate the second substrate 30 and the first transfer roller 4 from each other in the vertical direction.
Next, as shown in fig. 14, in the sixth step, the control unit 50 changes the positional relationship between the second substrate 30 and the first transfer roller 4 in the direction along the second axis X3, and rotates the first transfer roller 4. In the illustrated example, the second substrate 30 is moved in the right direction in fig. 14 along the second axis X3, whereby the positional relationship between the second substrate 30 and the first transfer roller 4 in the direction along the second axis X3 is changed and the first transfer roller 4 is rotated counterclockwise. For example, the control unit 50 moves the second substrate 30 by a predetermined distance through the second table 5, and rotates the first transfer roller 4 by a predetermined rotation angle. As a result, as described with reference to fig. 12, the lowermost point 25a of the first transfer roller 4 is spaced apart from the electronic component 15b to be supplied next by a predetermined distance d2 in the direction along the second axis X3 of the second substrate 30.
As described above, by sequentially repeating the fourth step, the fifth step, and the sixth step in the first supply step, a part of the electronic components 15, that is, a group of electronic components 15 held in the plurality of electronic components 15 of the first transfer roller 4, are collectively transferred from the first transfer roller 4 to the second substrate 30 in a direction parallel to the first rotation axis X2 of the first transfer roller 4 every time the movement of the second substrate 30 and the rotation of the first transfer roller 4 are stopped. Then, the control unit 50 transfers a part of the electronic components 15 from the first transfer roller 4 to the second substrate 30, and moves the second substrate 30 and rotates the first transfer roller 4 after the first transfer roller 4 and the second substrate 30 are separated from each other in the vertical direction. That is, the distance of movement of the second substrate 30 in a state where the first transfer roller 4 and the second substrate 30 are separated from each other in the vertical direction can be adjusted, so that the intervals in the direction along the second axis X3 between the plurality of electronic components 15 transferred to the second surface 34 of the second substrate 30 can be adjusted.
In order to make the intervals between the plurality of electronic components 15 in the second base material 30 along the second axis X3 different from the intervals between the plurality of electronic components 15 in the first base material 20 along the first axis X1, at least one of the following operations may be performed: the above-described plurality of steps (i.e., the first step, the second step, and the third step) are repeated in this order in the first receiving step; and repeating the above-described steps (i.e., the fourth step, the fifth step, and the sixth step) in this order in the first supply step.
As described above, the first receiving step and the first providing step are described, but the second receiving step and the second providing step are also the same, and a specific description thereof is omitted. That is, at least one of the following operations may be performed: in the second receiving step, the following steps are repeated in this order: a step of bringing the second substrate 30 and the second transfer roller 11 into contact with each other in the vertical direction while stopping the movement of the second substrate 30 and the second transfer roller 11 in the direction along the other axis X4 and stopping the rotation of the second transfer roller 11, a step of bringing the electronic component 15 into contact with both the second surface 34 of the second substrate 30 and the surface 36 of the second transfer roller 11 by bringing the second substrate 30 and the second transfer roller 11 away from each other in the vertical direction, a step of holding the electronic component 15 in contact with both the second surface 34 of the second substrate 30 and the surface 36 of the second transfer roller 11 on the second transfer roller 11 by bringing the second substrate 30 and the second transfer roller 11 into contact with each other, and a step of changing the positional relationship between the second substrate 30 and the second transfer roller 11 in the direction along the other axis X4 and rotating the second transfer roller 11; and in the second providing step, repeating the following steps in order: the method includes a step of bringing the third substrate 40 and the second transfer roller 11 into contact with each other in the vertical direction while stopping the movement of the third substrate 40 and the second transfer roller 11 in the direction along the third axis X6 and stopping the rotation of the second transfer roller 11, a step of bringing the electronic component 15 into contact with both the third surface 42 of the third substrate 40 and the surface 36 of the second transfer roller 11 by bringing the third substrate 40 and the second transfer roller 11 away from each other in the vertical direction, a step of holding the electronic component 15 in contact with both the third surface 42 of the third substrate 40 and the surface 36 of the second transfer roller 11 on the third substrate 40, and a step of changing the positional relationship between the third substrate 40 and the second transfer roller 11 in the direction along the third axis X6 and rotating the second transfer roller 11.
In the case where the above-described plural steps are repeated in sequence in the second receiving step, each time the movement of the second base material 30 and the rotation of the second transfer roller 11 are stopped, a part of the electronic components 15, that is, a group of electronic components 15 held in the plurality of electronic components 15 of the second base material 30 are collectively transferred from the second base material 30 to the second transfer roller 11 in a direction parallel to the second rotation axis X5 of the second transfer roller 11. Then, after transferring a part of the electronic components 15 from the second base material 30 to the second transfer roller 11 and moving the second base material 30 and the second transfer roller 11 away from each other in the vertical direction, the second transfer roller 11 is rotated. That is, the circumferential intervals of the plurality of electronic components 15 transferred to the surface 36 of the second transfer roller 11 can be adjusted by adjusting the rotation angle when the second transfer roller 11 is rotated in a state where the second substrate 30 and the second transfer roller 11 are separated from each other in the vertical direction.
In the case where the above-described plural steps are repeated sequentially in the second supply step, each time the movement of the third base material 40 and the rotation of the second transfer roller 11 are stopped, a part of the electronic components 15, that is, a group of the electronic components 15 held by the second transfer roller 11 among the plural electronic components 15 are collectively transferred from the second transfer roller 11 to the third base material 40 in a direction parallel to the second rotation axis X5 of the second transfer roller 11. Then, after transferring a part of the electronic components 15 from the second transfer roller 11 to the third substrate 40 and moving the second transfer roller 11 and the third substrate 40 away from each other in the vertical direction, the third substrate 40 is moved and the second transfer roller 11 is rotated. That is, the distance of movement of the third base material 40 in a state where the second transfer roller 11 and the third base material 40 are separated from each other in the vertical direction can be adjusted, so that the intervals in the direction along the third axis X6 between the plurality of electronic components 15 transferred to the third surface 42 of the third base material 40 can be adjusted.
< Third embodiment >
The third embodiment differs from the above embodiment in the positions where the second transfer rollers 11 and the third substrate 40 are provided. The third embodiment will be described below, but the same configuration as the above embodiment will be omitted.
Fig. 15 is a diagram illustrating a case of transferring the electronic component 15. In the above embodiment, the example in which the second base material 30 on which the electronic component 15 is mounted is rotated by 90 degrees by the rotation mechanism 6 has been described, but the rotation mechanism 6 is not provided in the present embodiment. In this case, the second axis X3 of the second base material 30 forms an angle of 90 degrees with the other axis X4, and the second axis X3 of the second base material 30 when arranged in the first supply step is orthogonal to the other axis X4 of the second base material 30 when arranged in the second receiving step. The step of rotating the second base material 30 as described in the above embodiment is not required. That is, as shown in fig. 15, the electronic component 15 can be transferred from the first substrate 20 to the first transfer roller 4, the second substrate 30, the second transfer roller 11, and the third substrate 40 in this order.
< Other embodiments >
＜1＞
In the above-described embodiment, the configuration of the electronic component transfer apparatus has been specifically described, but the configuration may be changed as appropriate. In the above embodiments, some numerical examples and material names are described, but these are described for the purpose of example and may be changed as appropriate.
For example, one transfer roller may be horizontally moved to the position of the first transfer roller 4 and the position of the second transfer roller 11, and the one transfer roller may serve as both the first transfer roller 4 and the second transfer roller 11.
In the above embodiment, the description has been given of the specific configurations of the first substrate 20, the second substrate 30, and the third substrate 40, but the configurations are not limited to the above examples, and may be appropriately modified.
In the above embodiment, the description has been made of an example in which a material whose adhesive force is reduced by ultraviolet irradiation is used, but other materials may be used. For example, a material whose adhesion is reduced by application of heat may be used.
＜2＞
In the above embodiment, the case where the electronic component 15 is a light emitting element has been described, but other kinds of electronic components 15 can be used. For example, the electronic component 15 may be various elements such as a piezoelectric element, an acceleration sensor, a micro device chip using NEMS, MEMS, or the like, a memory element based on a charge accumulation method or another method such as MRAM, feRaM, PCM, a switching element, and an arithmetic processing device chip such as a microcomputer.
＜3＞
In the above embodiment, the first transfer roller 4 used in the first receiving step and the first supplying step may be provided with a driver movable in a direction along the first rotation axis X2. In the case of adopting the above configuration, as shown in fig. 16, a plurality of electronic components 15 can be arranged alternately. That is, the electronic components 15 transferred to the second base material 30 can be shifted in the direction along the first rotation axis X2 for each adjacent row.
Specifically, when the electronic component transfer method described in the second embodiment is used, the first transfer rollers 4 are shifted by a predetermined distance in the direction along the first rotation axis X2 in the third step. In this way, the positions of the rows of the electronic components 15 attached to the first transfer roller 4 in the first and second steps to be performed next are shifted from the positions of the rows of the electronic components 15 attached to the first transfer roller 4 before that in the direction along the first rotation axis X2. In this way, when the electronic components 15 attached to the first transfer roller 4 are transferred to the second base material 30, the arrangement of the plurality of electronic components 15 as shown in fig. 16 is realized.
In particular, when the first transfer rollers 4 are fixed at a distance offset in the direction along the first rotation axis X2 and the offset direction is the opposite direction each time the third step is performed, the arrangement of the electronic components 15 is made as shown in fig. 16. The first transfer rollers 4 may be offset by different distances in the direction along the first rotation axis X2 each time the third step is performed.
Similarly, the first transfer rollers 4 may be shifted by a predetermined distance in the direction along the first rotation axis X2 in the sixth step, or the first transfer rollers 4 may be shifted by a predetermined distance in the direction along the first rotation axis X2 in both the third step and the sixth step.
Alternatively, instead of providing a driver for shifting the first transfer roller 4 in the direction along the first rotation axis X2, a driver for shifting the first table 3 and/or the second table 5 in the direction along the first rotation axis X2 may be provided. In this case, an alignment mechanism for ensuring positional accuracy of the electronic component 15 is provided on the first stage 3 and/or the second stage 5.
The second transfer rollers 11 used in the second receiving step and the second supplying step are the same as those used in the second receiving step, although the explanation thereof is omitted. That is, the second transfer roller 11 may be provided with a driver movable in a direction along the second rotation axis X5. Further, a driver may be provided to shift the third table 10 and/or the fourth table 12 in the direction along the second rotation axis X5. In this case, an alignment mechanism for ensuring positional accuracy of the electronic component 15 is provided on the third table 10 and/or the fourth table 12.
＜4＞
In the second embodiment, which of the electronic components 15a to be received and the electronic components 15b to be supplied is appropriately changed.
For example, in fig. 7, the first electronic component 15 held on the first base material 20 is transferred to the first transfer roller 4 with the first electronic component 15a to be received, but another electronic component 15 other than the first electronic component 15 may be the electronic component 15a to be received. That is, all the electronic components 15 held by the first base material 20 may not be the electronic components 15a to be received.
Similarly, in fig. 12, the forefront electronic component 15 held by the first transfer roller 4 is transferred to the second base material 30 as the electronic component 15b to be supplied, but another electronic component 15 other than this may be the electronic component 15b to be supplied. That is, all the electronic components 15 held by the first transfer roller 4 may not be set as the electronic components 15b to be supplied.
＜5＞
In the above embodiment, for example, when the number of electronic components 15 mounted on the first base material 20 is small, the first base material 20 may be exchanged in the middle, and the electronic components 15 may be transferred from the plurality of first base materials 20 to one first transfer roller 4.
Similarly, for example, when the number of electronic components 15 mounted on the second base material 30 is small, the second base material 30 may be exchanged during the transfer, and the electronic components 15 may be transferred from the plurality of second base materials 30 to one second transfer roller 11.
＜6＞
In the above embodiment, the example in which the first transfer roller 4 and the second transfer roller 11 are vertically lifted has been described, but the first table 3, the second table 5, the third table 10, and the fourth table 12 may be lifted. Alternatively, both the transfer rollers and the transfer tables may be lifted and lowered.
Similarly, the first transfer roller 4 and the second transfer roller 11 may be moved in the horizontal direction, instead of the first table 3, the second table 5, the third table 10, and the fourth table 12 being moved in the horizontal direction. Alternatively, both the transfer rollers and the transfer tables may be moved in the horizontal direction.
＜7＞
In the above embodiment, the example in which the third sheet 41 having adhesiveness is provided on the third base material 40 has been described, but another configuration may be adopted. For example, the electronic component 15 held by the second transfer roller 11 may be coated with an adhesive paste, and the electronic component 15 may be attached to the third base material 40 by the adhesive paste without providing the third sheet 41 on the third base material 40. The adhesive force of the adhesive paste needs to be larger than that of the sheet 35 provided on the second transfer roller 11 (for example, 0.5kg/25mm or less).
For example, in the electronic component transfer apparatus shown in fig. 17, an application roller 18 for applying paste material is provided in parallel with the second transfer roller 11. In this case, the application roller 18 can be brought close to the electronic component 15 held by the second transfer roller 11, and the conductive paste can be applied from the application roller 18 to each electronic component 15. That is, the electronic component transfer method further includes a coating step of coating the electrode portions of the plurality of electronic components 15 held on the surface 36 of the second transfer roller 11 with the conductive paste by the coating roller 18. The conductive paste is, for example, a conductive paste in which conductive metals such as silver, copper, nickel, and solder are mixed with an adhesive paste. The application step of applying the conductive paste may be performed sequentially during the reception of the electronic component 15 by the second transfer roller 11 in the second reception step, may be performed sequentially during the supply of the electronic component 15 from the second transfer roller 11 in the second supply step, or may be performed between the second reception step and the second supply step.
＜8＞
In the first receiving step and the first supplying step of the above-described embodiment, the first substrate 20 is moved along the first axis X1 relative to the first transfer roller 4, and the second substrate 30 is moved along the second axis X3 relative to the first transfer roller 4, whereby transfer is performed in which the intervals between the electronic components 15 are changed. Alternatively, the first transfer roller 4 may be moved along the first axis X1 with respect to the first base material 20, and the first transfer roller 4 may be moved along the second axis X3 with respect to the second base material 30, whereby the transfer may be performed with the interval between the electronic components 15 changed.
＜9＞
In the second receiving step and the second supplying step of the above-described embodiment, the second substrate 30 is moved along the other axis X4 relative to the second transfer roller 11, and the third substrate 40 is moved along the third axis X6 relative to the second transfer roller 11, whereby transfer is performed in which the interval between the electronic components 15 is changed. Alternatively, the second transfer roller 11 may be moved along the other axis X4 with respect to the second base material 30, and the second transfer roller 11 may be moved along the third axis X6 with respect to the third base material 40, whereby the transfer may be performed with the interval between the electronic components 15 changed.
＜10＞
The configurations disclosed in the above embodiments (including other embodiments, the same will be described below) may be applied in combination with the configurations disclosed in other embodiments, as long as they do not contradict each other, and the embodiments disclosed in the present specification are examples, and the embodiments of the present disclosure are not limited thereto and may be appropriately changed within a range not departing from the object of the present disclosure.
Industrial applicability
The present disclosure can be used for an electronic component transfer method, an electronic device manufacturing method, and an electronic device manufacturing apparatus, which can change the interval between electronic components in two dimensions.
Description of the reference numerals
3: A first work table;
4: a first transfer roller;
5: a second work table;
10: a third table;
11: a second transfer roller;
12: a fourth table;
15: an electronic component;
20: a first substrate;
24: a first surface;
26: a surface;
30: a second substrate;
34: a second surface;
36: a surface;
40: a third substrate;
42: a third surface;
50: a control unit;
X1: a first shaft;
x2: a first rotation shaft;
x3: a second shaft;
x4: another shaft;
X5: a second rotation shaft;
x6: and a third axis.
Claims (10)
1. An electronic component transfer method, comprising:
A first receiving step of disposing the first substrate and the first transfer roller so that a first axis parallel to a first surface of a first substrate holding a plurality of electronic components in a two-dimensional arrangement is orthogonal to a first rotation axis of a columnar first transfer roller capable of rotating, and receiving the plurality of electronic components held on the first surface of the first substrate by a surface of the first transfer roller;
A first supply step of, after the first receiving step, disposing the first transfer roller and the second base material so that the first rotation axis of the first transfer roller holding the plurality of electronic components on the surface is orthogonal to a second axis parallel to the second surface of the second base material, and supplying the plurality of electronic components held on the surface of the first transfer roller to the second surface of the second base material;
A second receiving step of, after the first supplying step, disposing the second base material and the second transfer roller so that a second rotation axis of a columnar second transfer roller rotatable with the other axis intersecting the second axis is orthogonal to the second surface of the second base material holding the plurality of electronic components, and receiving the plurality of electronic components held on the second surface of the second base material by a surface of the second transfer roller; and
A second supply step of, after the second receiving step, disposing the second transfer roller and the third base material so that the second rotation axis of the second transfer roller holding the plurality of electronic components on the surface is orthogonal to a third axis parallel to a third surface of the third base material, and supplying the plurality of electronic components held on the surface of the second transfer roller to the third surface of the third base material,
The first receiving step and the first supplying step are performed such that the intervals between the plurality of electronic components on the second base material in the direction along the second axis are different from the intervals between the plurality of electronic components on the first base material in the direction along the first axis,
Through at least one of the second receiving step and the second providing step, the intervals between the plurality of electronic parts on the third base material in the direction along the third axis are made different from the intervals between the plurality of electronic parts on the second base material in the direction along the other axis.
2. The electronic component transferring method according to claim 1, wherein,
At least one of the following operations is performed: setting a difference between a relative speed of the first surface of the first substrate with respect to the first transfer roller in a direction along the first axis and a surface speed based on rotation of the first transfer roller in the first receiving step; and setting a difference between a relative speed of the second surface of the second substrate with respect to the first transfer roller in a direction along the second axis and a surface speed based on rotation of the first transfer roller in the first supply step.
3. The electronic part transferring method according to claim 1 or 2, wherein,
At least one of the following operations is performed: setting a difference between a relative speed of the second surface of the second substrate with respect to the second transfer roller in the direction along the other axis and a surface speed based on rotation of the second transfer roller in the second receiving step; and setting a difference between a relative speed of the third surface of the third substrate with respect to the second transfer roller and a surface speed based on rotation of the second transfer roller in the direction along the third axis in the second supply step.
4. The electronic component transferring method according to claim 1, wherein,
At least one of the following operations is performed:
In the first receiving step, the following steps are repeated in this order: a step of bringing the first substrate and the first transfer roller into close contact with each other in a vertical direction while stopping movement of the first substrate and the first transfer roller in a direction along the first axis and stopping rotation of the first transfer roller, a step of holding the electronic component in contact with both the first surface of the first substrate and the surface of the first transfer roller by bringing the first substrate and the first transfer roller away from each other in the vertical direction, and a step of changing a positional relationship between the first substrate and the first transfer roller in the direction along the first axis and rotating the first transfer roller; and
In the first supply step, the following steps are repeated in this order: the method includes a step of bringing the second substrate and the first transfer roller into close contact with each other in a vertical direction while stopping movement of the second substrate and the first transfer roller in a direction along the second axis and stopping rotation of the first transfer roller, a step of holding the electronic component in contact with both the second surface of the second substrate and the surface of the first transfer roller by bringing the second substrate and the first transfer roller away from each other in a vertical direction, and a step of changing a positional relationship between the second substrate and the first transfer roller in a direction along the second axis and rotating the first transfer roller.
5. The electronic part transferring method according to claim 1 or 4, wherein,
At least one of the following operations is performed:
In the second receiving step, the following steps are repeated in this order: a step of bringing the second substrate and the second transfer roller into close contact with each other in a vertical direction while stopping movement of the second substrate and the second transfer roller in a direction along the other axis and stopping rotation of the second transfer roller, a step of holding the electronic component in contact with both the second surface of the second substrate and the surface of the second transfer roller by bringing the second substrate and the second transfer roller away from each other in a vertical direction, and a step of changing a positional relationship between the second substrate and the second transfer roller in a direction along the other axis and rotating the second transfer roller; and
In the second supply step, the following steps are repeated in this order: the method may further include a step of bringing the third substrate and the second transfer roller into close contact with each other in a vertical direction while stopping movement of the third substrate and the second transfer roller in a direction along the third axis and stopping rotation of the second transfer roller, a step of holding the electronic component in contact with both the third surface of the third substrate and the surface of the second transfer roller by bringing the third substrate and the second transfer roller away from each other in a vertical direction, and a step of changing a positional relationship between the third substrate and the second transfer roller in a direction along the third axis and rotating the second transfer roller.
6. The method for transferring electronic parts according to any one of claims 1 to 5, wherein,
The second axis in the second substrate makes an angle of 90 degrees with the other axis,
A substrate rotation step of rotating the second substrate by 90 degrees is performed between the first supply step and the second receiving step so that the second axis of the second substrate when the second substrate is already arranged in the first supply step is parallel to the other axis of the second substrate when the second substrate is already arranged in the second receiving step.
7. The method for transferring electronic parts according to any one of claims 1 to 5, wherein,
The second axis in the second substrate makes an angle of 90 degrees with the other axis,
The second axis of the second base material in the case where the second base material has been arranged in the first supply step is orthogonal to the other axis of the second base material in the case where the second base material has been arranged in the second receiving step.
8. The electronic component transferring method according to any one of claims 1 to 7, wherein,
The electronic component transfer method further includes a coating step of coating the electrode portions of the plurality of electronic components held on the surface of the second transfer roller with a conductive paste by a coating roller.
9. A method for manufacturing an electronic device including a circuit board, the method comprising:
A first receiving step of disposing the first substrate and the first transfer roller so that a first axis parallel to a first surface of a first substrate holding a plurality of electronic components in a two-dimensional arrangement is orthogonal to a first rotation axis of a columnar first transfer roller capable of rotating, and receiving the plurality of electronic components held on the first surface of the first substrate by a surface of the first transfer roller;
A first supply step of, after the first receiving step, disposing the first transfer roller and the second base material so that the first rotation axis of the first transfer roller holding the plurality of electronic components on the surface is orthogonal to a second axis parallel to the second surface of the second base material, and supplying the plurality of electronic components held on the surface of the first transfer roller to the second surface of the second base material;
A second receiving step of, after the first supplying step, disposing the second base material and the second transfer roller so that a second rotation axis of a columnar second transfer roller rotatable with the other axis intersecting the second axis is orthogonal to the second surface of the second base material holding the plurality of electronic components, and receiving the plurality of electronic components held on the second surface of the second base material by a surface of the second transfer roller; and
A second supply step of, after the second receiving step, disposing the second transfer roller and the circuit board so that the second rotation axis of the second transfer roller holding the plurality of electronic components on the surface is orthogonal to a third axis parallel to a third surface of the circuit board, and supplying the plurality of electronic components held on the surface of the second transfer roller to the third surface of the circuit board,
The first receiving step and the first supplying step are performed such that the intervals between the plurality of electronic components on the second base material in the direction along the second axis are different from the intervals between the plurality of electronic components on the first base material in the direction along the first axis,
At least one of the second receiving step and the second supplying step is performed such that the intervals between the plurality of electronic components on the circuit board in the direction along the third axis are different from the intervals between the plurality of electronic components on the second base material in the direction along the other axis.
10. An apparatus for manufacturing an electronic device including a circuit board, the apparatus comprising:
a first table, a second table, a third table, and a fourth table;
A first conveying device, a second conveying device and a third conveying device;
a cylindrical first transfer roller rotatable about a first rotation axis;
A cylindrical second transfer roller rotatable about a second rotation axis; and
A control unit configured to control the first conveying device, the second conveying device, the third conveying device, the first transfer roller, and the second transfer roller,
The control section performs the following operations:
Causing the first conveying device to convey a first base material holding a plurality of electronic parts in a two-dimensional arrangement on a first surface to the first table;
Moving the first transfer roller to a position where a first axis parallel to the first surface of the first substrate is orthogonal to the first rotation axis of the first transfer roller, and receiving the plurality of electronic components held on the first surface of the first substrate through the surface of the first transfer roller;
causing the second conveying device to convey a second substrate to the second stage;
moving the first transfer roller holding the plurality of electronic components on the surface to a position where the first rotation axis is orthogonal to a second axis parallel to the second surface of the second base material, and supplying the plurality of electronic components held on the surface of the first transfer roller to the second surface of the second base material;
Causing the second conveying means to convey the second base material holding the plurality of electronic parts on the surface to the third stage;
Moving the second transfer roller to a position where another axis intersecting the second axis of the second surface of the second substrate is orthogonal to the second rotation axis of the second transfer roller, and receiving the plurality of electronic components held on the second surface of the second substrate through the surface of the second transfer roller;
Causing the third conveying device to convey the circuit substrate to the fourth stage;
Moving the second transfer roller holding the plurality of electronic components on the surface to a position where the second rotation axis of the second transfer roller is orthogonal to a third axis parallel to the third surface of the circuit board, supplying the plurality of electronic components held on the surface of the second transfer roller to the third surface of the circuit board,
By making the intervals of the plurality of electronic parts in the direction along the second axis on the second base material different from the intervals of the plurality of electronic parts in the direction along the first axis on the first base material based on at least one of the receiving and the providing of the first transfer roller,
By making the intervals of the plurality of electronic parts on the circuit substrate in the direction along the third axis different from the intervals of the plurality of electronic parts on the second base material in the direction along the other axis based on at least one of the receiving and the supplying of the second transfer roller.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022035136A JP7097656B1 (en) | 2022-03-08 | 2022-03-08 | Electronic component transfer method, electronic device manufacturing method, and electronic device manufacturing equipment |
| JP2022-035136 | 2022-03-08 | ||
| PCT/JP2023/005458 WO2023171292A1 (en) | 2022-03-08 | 2023-02-16 | Electronic component transfer method, method for manufacturing electronic device, and device for manufacturing electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118715600A true CN118715600A (en) | 2024-09-27 |
Family
ID=82356962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380022702.7A Pending CN118715600A (en) | 2022-03-08 | 2023-02-16 | Electronic component transfer method, electronic device manufacturing method, and electronic device manufacturing apparatus |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7097656B1 (en) |
| KR (1) | KR20240134182A (en) |
| CN (1) | CN118715600A (en) |
| TW (1) | TW202410790A (en) |
| WO (1) | WO2023171292A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7254394B1 (en) | 2022-12-02 | 2023-04-10 | 株式会社写真化学 | Electronic component transfer roll and electronic component transfer method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6312270B2 (en) | 2016-03-25 | 2018-04-18 | 株式会社写真化学 | Electronic device manufacturing method and device using device chip |
| DE102017124582A1 (en) | 2017-10-20 | 2019-04-25 | Asm Assembly Systems Gmbh & Co. Kg | Complementary tool for chip transfer device with removal tool and turning tool |
| JP6978129B1 (en) | 2021-03-18 | 2021-12-08 | 株式会社写真化学 | Device chip transfer mechanism |
-
2022
- 2022-03-08 JP JP2022035136A patent/JP7097656B1/en active Active
-
2023
- 2023-02-16 WO PCT/JP2023/005458 patent/WO2023171292A1/en active Application Filing
- 2023-02-16 CN CN202380022702.7A patent/CN118715600A/en active Pending
- 2023-02-16 KR KR1020247026708A patent/KR20240134182A/en unknown
- 2023-03-07 TW TW112108306A patent/TW202410790A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023130693A (en) | 2023-09-21 |
| KR20240134182A (en) | 2024-09-06 |
| JP7097656B1 (en) | 2022-07-08 |
| WO2023171292A1 (en) | 2023-09-14 |
| TW202410790A (en) | 2024-03-01 |
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