CN118684183A - Packaging structure and packaging method of MEMS chip - Google Patents
Packaging structure and packaging method of MEMS chip Download PDFInfo
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- CN118684183A CN118684183A CN202411178473.0A CN202411178473A CN118684183A CN 118684183 A CN118684183 A CN 118684183A CN 202411178473 A CN202411178473 A CN 202411178473A CN 118684183 A CN118684183 A CN 118684183A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 105
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000003825 pressing Methods 0.000 claims abstract description 46
- 238000007789 sealing Methods 0.000 claims abstract description 15
- 238000009434 installation Methods 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 33
- 229910052802 copper Inorganic materials 0.000 claims description 33
- 239000010949 copper Substances 0.000 claims description 33
- 239000011248 coating agent Substances 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 21
- 238000012360 testing method Methods 0.000 claims description 21
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 20
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 238000003466 welding Methods 0.000 claims description 17
- 230000000712 assembly Effects 0.000 claims description 16
- 238000000429 assembly Methods 0.000 claims description 16
- 239000004519 grease Substances 0.000 claims description 16
- 229920001296 polysiloxane Polymers 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 11
- 238000007731 hot pressing Methods 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 21
- 238000005538 encapsulation Methods 0.000 description 14
- 229920005591 polysilicon Polymers 0.000 description 7
- 239000003522 acrylic cement Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The invention belongs to the technical field of semiconductor chip packaging, in particular to a packaging structure of an MEMS chip and a packaging method thereof, which comprises a packaging shell, wherein the middle part of the packaging shell is provided with a packaging cavity, the middle part of the inner wall of the packaging cavity is fixedly provided with a chip positioning structure for limiting the MEMS chip, guide chips are fixedly arranged on two sides of the inner wall of the packaging cavity, a top cover structure for sealing and packaging the MEMS chips is arranged at the top of the packaging cavity, and a plurality of reserved pin holes are formed on two sides of the packaging shell. According to the MEMS chip packaging structure, a detachable split type pin design is adopted, the pin assembly is directly contacted with the guide chip in a pressing mode, so that the conduction of the chip is completed, when the packaged MEMS chip is installed and used, once a certain pin is bent or damaged, the corresponding pin can be quickly and pointedly removed for replacement, and the replacement is simple and convenient, so that the fault rate of the chip during installation is reduced, and the service life is prolonged.
Description
Technical Field
The invention relates to the technical field of semiconductor chip packaging, in particular to a packaging structure and a packaging method of an MEMS chip.
Background
The MEMS chip, collectively referred to as Micro-Electro-MECHANICAL SYSTEM, is a microelectromechanical system. The MEMS system has small volume, small weight, low power consumption, small inertia, high resonant frequency, short response time, etc. compared with available mechanical system, the MEMS system has small volume, changed mechanical principle, kinematic principle, material characteristic, machining, measurement, control, etc. and has the advantages of microelectronics in some pressure sensor, acceleration sensor, micropump, micro valve, micro groove, micro reaction chamber, micro executor, micro machinery, etc.
The packaging structure of the traditional MEMS chip mainly comprises a packaging shell, an MEMS chip, a packaging cover plate and pins, wherein the pins are fixed at the edge of the packaging shell in an integrated forming mode, the MEMS chip is fixed inside the packaging shell in a welding mode, and the packaging cover plate is adhered and fixed on the packaging structure through an adhesive. The package structure for MEMS chip of application No. cn202323203435.X, comprising a substrate and a chip body fixed on top of the substrate, further comprising: the damping mechanism comprises a mounting plate; the packaging structure of the MEMS chip of the above-mentioned general type has the following disadvantages in practical applications: the pin after the chip encapsulation is fixed, integrated into one piece, in the installation, because of reasons such as alignment error, personnel misoperation, the pin of chip exists buckling or cracked phenomenon, in case the pin of chip appears damaging, just influences the normal use of chip, and then appears the chip damage, and the whole encapsulation of chip is unable quick conduction of inside heat at the during operation, and after long-time work, the stability of whole encapsulation just is relatively poor.
Disclosure of Invention
The invention aims to provide a packaging structure and a packaging method of an MEMS chip, which are used for solving the problems that pins of the packaging structure of the existing MEMS chip cannot be detached and replaced and the heat dissipation effect of the packaged chip is poor.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a packaging structure of MEMS chip, includes the encapsulation shell, the encapsulation chamber has been seted up at the middle part of encapsulation shell, the fixed chip location structure that is used for spacing to the MEMS chip that is provided with in middle part of encapsulation intracavity wall, the both sides of encapsulation intracavity wall are all fixed to be provided with and lead the chip, the top cap structure that is used for the sealed encapsulation of MEMS chip is installed at the top of encapsulation chamber, a plurality of reserved pin holes have all been seted up to the both sides of encapsulation shell, a plurality of the inside in reserved pin hole all is equipped with the pin subassembly, the clamp plate groove has all been seted up to the both sides at encapsulation shell top, two the inside in clamp plate groove is all fixed mounting has the clamp plate subassembly that is used for fixing the pin subassembly, two the nail hole has all been seted up to the one end in clamp plate groove, the inside threaded connection in nail hole has locking screw, the fixed ceramic substrate that is provided with in encapsulation shell's bottom.
Preferably, the chip positioning structure comprises a polysilicon connecting layer, a packaging frame is fixedly arranged at the top of the polysilicon connecting layer, a chip groove is formed in the top of the packaging frame, protection layers are fixedly arranged on two sides of the inner wall of the chip groove, MEMS chip pieces are placed between the protection layers, and a plurality of gold wire leads extending into the chip groove are fixedly arranged at the bottom of the polysilicon connecting layer.
Preferably, the top cover structure comprises a heat dissipation copper cover plate and heat conduction silicone grease coated at the bottom of the heat dissipation copper cover plate, the bottom of the heat conduction silicone grease is in contact with the surface of the MEMS chip part, and a polyimide protection coating is fixedly arranged on the upper surface of the heat dissipation copper cover plate.
Preferably, the gold wire and the guide chip are arranged in a one-to-one opposite mode, and a soldering tin layer is fixedly arranged between the corresponding gold wire and the guide chip.
Preferably, the pin assembly comprises a tinned pin and a folding pin part fixedly arranged at the bottom of the tinned pin, wherein a conductive part is fixedly arranged at the top of the tinned pin, and the conductive part is correspondingly arranged with the conductive chip.
Preferably, the pressing plate assembly comprises a pressing plate cover and an insulating pressing pad fixedly arranged on the inner side of the pressing plate cover, a rotating shaft is fixedly arranged at one end of the pressing plate cover, the rotating shaft is rotatably arranged in the pressing plate groove, a locking hole is formed in the other end of the pressing plate cover, and the locking hole is matched with the locking screw.
Preferably, a fool-proof notch is fixedly arranged on one side of the packaging shell.
A method of packaging a MEMS chip, comprising the steps of:
S1, positioning an MEMS chip: taking out the packaging shell, putting and clamping the solder balls at the bottom of the MEMS chip part opposite to the chip groove, then coating the edges of the MEMS chip part and the chip groove by using sealing resin, finishing preliminary positioning and fixing of the MEMS chip part, and enabling the solder ball points at the bottom of the MEMS chip part to be in one-to-one contact with the gold wire and finishing the conduction of a circuit;
s2, circuit welding: a spot welding gun is used for coating a proper amount of welding tin between the conducting chip and the corresponding gold wire, the spot welding gun is used for welding, and each conducting chip is connected with the corresponding gold wire to complete the extension of the circuit;
S3, sealing and packaging: firstly, coating a layer of heat-conducting silicone grease on the surface of an MEMS chip part, then coating an acrylic adhesive on the edge of the inner wall of a packaging cavity, finally coating a layer of heat-conducting silicone grease on the inner side of a heat-radiating copper cover plate, covering the whole heat-radiating copper cover plate on the packaging cavity, then hot-pressing and exhausting the heat-radiating copper cover plate by using hot-pressing equipment, exhausting air in the packaging cavity, and firmly adhering the heat-radiating copper cover plate on a packaging shell;
s4, coating film waterproof: coating a proper amount of epoxy resin sealant on the edge of the joint of the heat dissipation copper cover plate and the packaging shell, and finally covering a polyimide protection coating film on the surface of the heat dissipation copper cover plate, so that the primary sealing packaging of the chip is completed;
S5, pin installation: taking out a proper number of pin assemblies, leading the conductive members to be inserted in opposite directions to the reserved pin holes, turning over and pressing the pressing plate assemblies after the conductive members are inserted side by side, pressing the pressing plate assemblies in the pressing plate grooves, then taking out the locking screws, penetrating through the nail holes, realizing limit fixing of the pressing plate assemblies, enabling the insulating pressing pads to be contacted with the tops of the conductive members and pressed downwards after the pressing plate assemblies are pressed, leading the bottoms of the conductive members to be in close contact with the other ends of the conductive chips, and completing installation of the pin assemblies without loosening;
S6, testing electrical functions: and (3) using a chip testing tool to sequentially test the pin voltage, the pin current, the pin resistance and the pin function of the packaged chip pins, and packaging after the chip pins are qualified.
Preferably, the packaging cavity can be filled with epoxy resin for sealing or is in a relatively vacuum environment by means of hot-pressing and exhausting.
Preferably, when the pin voltage test is performed, the test instrument can pass through the contact pin and apply certain voltage, then detect whether current passes through the pin, if so, the connection of the pin is normal, and if not, the connection problem of the pin is indicated;
The pin resistance test is used for detecting the resistance condition between the pins of the chip, the test instrument can contact the pins and apply certain current, then the voltage of the pins is measured, and the resistance between the pins can be calculated according to ohm's law by measuring the voltage drop and the current value.
Compared with the prior art, the invention has the beneficial effects that:
The MEMS chip packaging structure adopts a detachable split type pin design, the pin assembly directly contacts with the guide chip in a pressing mode to complete the conduction of the chip, when the packaged MEMS chip is installed and used, once a certain pin is bent or damaged, the corresponding pin can be quickly and pointedly removed for replacement, and the replacement is simple and convenient, so that the fault rate of the chip during installation is reduced, and the service life of the chip is prolonged;
Adopt copper apron to encapsulate the chip, the below is ceramic substrate, can increase the structural strength of chip after the encapsulation on the one hand, and on the other hand copper apron is through direct and the MEMS chip spare contact of heat conduction silicone grease, can conduct the heat of chip during operation to the external world with the mode of heat conduction, and then is favorable to improving the radiating efficiency of chip, and the work is more stable.
Drawings
FIG. 1 is a schematic diagram of a front view of a chip package structure according to the present invention;
FIG. 2 is a schematic diagram of a disassembled chip package structure according to the present invention;
FIG. 3 is a side cross-sectional view of a chip package structure of the present invention;
FIG. 4 is a disassembled cross-sectional view of a chip package structure of the present invention;
FIG. 5 is a schematic view of the platen assembly of the present invention;
Fig. 6 is a front cross-sectional view of a pin assembly of the present invention;
FIG. 7 is an enlarged view of part A of the present invention;
fig. 8 is a flow chart of the chip package of the present invention.
In the figure: 1. a package housing; 2. a polyimide protective coating; 3. a pin assembly; 31. tinning pins; 32. a conductive member; 33. a foot folding piece; 4. reserving pin holes; 5. a platen assembly; 51. a platen cover; 52. an insulating press pad; 53. a locking hole; 54. a rotating shaft; 6. a locking screw; 7. a platen groove; 8. a nail hole; 9. a ceramic substrate; 10. a polysilicon connection layer; 11. a gold wire; 12. a solder layer; 13. a chip; 14. a heat dissipating copper cover plate; 15. heat conductive silicone grease; 16. a MEMS chip member; 17. a package frame; 18. a protective layer; 19. a packaging cavity; 20. fool-proof notch.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1-8, the invention provides a packaging structure of a MEMS chip, which comprises a packaging shell 1, wherein a packaging cavity 19 is formed in the middle of the packaging shell 1, a chip positioning structure for limiting the MEMS chip is fixedly arranged in the middle of the inner wall of the packaging cavity 19, guide chips 13 are fixedly arranged at two sides of the inner wall of the packaging cavity 19, a top cover structure for sealing and packaging the MEMS chip is arranged at the top of the packaging cavity 19, a plurality of reserved pin holes 4 are formed at two sides of the packaging shell 1, pin assemblies 3 are arranged in the reserved pin holes 4, pressing plate grooves 7 are formed at two sides of the top of the packaging shell 1, pressing plate assemblies 5 for fixing the pin assemblies 3 are fixedly arranged in the two pressing plate grooves 7, nail holes 8 are formed at one ends of the two pressing plate grooves 7, locking screws 6 are connected in the internal threads of the nail holes 8, a ceramic substrate 9 is fixedly arranged at the bottom of the packaging shell 1, and fool-proof notches 20 are fixedly arranged at one side of the packaging shell 1.
Referring to fig. 3 and 4, further, the chip positioning structure includes a polysilicon connection layer 10, a packaging frame 17 is fixedly arranged at the top of the polysilicon connection layer 10, a chip slot is formed at the top of the packaging frame 17, protection layers 18 are fixedly arranged at both sides of the inner wall of the chip slot, a MEMS chip piece 16 is placed between the two protection layers 18, a plurality of gold wire leads 11 extending into the chip slot are fixedly arranged at the bottom of the polysilicon connection layer 10, the gold wire leads 11 are arranged opposite to the chip 13 one by one, and a soldering tin layer 12 is fixedly arranged between the corresponding gold wire leads 11 and the chip 13; when the MEMS chip 16 is used, one end of the gold wire 11 is welded with the chip 13 through the soldering tin layer 12, the other end of the gold wire extends to the inside of the chip groove along the polycrystalline silicon connecting layer 10, a conductive bump is formed, after the MEMS chip 16 is clamped in the chip groove, a welding ball at the bottom of the MEMS chip 16 is directly contacted with the conductive bump, and after the MEMS chip 16 is adhered and fixed, a pin passage is formed among the conductive bump, the gold wire 11 and the chip 13 by the welding ball, so that the welding flow during packaging is reduced, and the packaging efficiency is improved.
Referring to fig. 1,3 and 4, further, the top cover structure includes a heat dissipation copper cover plate 14 and a heat conduction silicone grease 15 coated on the bottom of the heat dissipation copper cover plate 14, the bottom of the heat conduction silicone grease 15 contacts with the surface of the MEMS chip 16, and a polyimide protection film 2 is fixedly arranged on the upper surface of the heat dissipation copper cover plate 14;
When the MEMS chip 16 is used, the heat dissipation copper cover plate 14 is directly contacted with the top of the MEMS chip 16 through the heat conduction silicone grease 15, heat generated during the operation of the MEMS chip 16 can be transferred to the heat dissipation copper cover plate 14 through the heat conduction silicone grease 15 in a heat transfer mode, and the heat dissipation copper cover plate 14 exchanges heat with external heat dissipation equipment, so that the temperature of the MEMS chip 16 during the operation is reduced.
Referring to fig. 1, 2,3, 4, 6 and 7, further, the pin assembly 3 includes a tin plated pin 31 and a pin folding member 33 fixedly disposed at the bottom of the tin plated pin 31, a conductive member 32 is fixedly disposed at the top of the tin plated pin 31, the conductive member 32 is disposed corresponding to the conductive chip 13, the platen assembly 5 includes a platen cover 51 and an insulating platen pad 52 fixedly disposed inside the platen cover 51, one end of the platen cover 51 is fixedly disposed with a rotating shaft 54, the rotating shaft 54 is rotatably disposed inside the platen groove 7, the other end of the platen cover 51 is provided with a locking hole 53, and the locking hole 53 is matched with the locking screw 6;
When the pin assembly 3 is damaged and needs to be replaced, a worker can unscrew and take down the locking screw 6 by using a screwdriver, then the pressing plate assembly 5 can be lifted from the pressing plate groove 7, the pin assembly 3 can loosen after the pressing of the pressing plate assembly 5 is not pressed, immediately the worker slightly lifts the corresponding pin assembly 3, the conductive piece 32 is separated from the reserved pin hole 4, then the new pin assembly 3 is taken out, the pin assembly 3 is inserted into the reserved pin hole 4, the pressing plate assembly 5 is covered, the pin assembly 3 is fixed by the locking screw 6, and after the pin assembly 3 is pressed, the conductive piece 32 is tightly attached to the conductive chip 13, so that a passage is formed between the conductive chip 13, the soldering tin layer 12 and the golden wire 11 and the MEMS chip piece 16 inside, and the replacement of the pin is facilitated.
A method of packaging a MEMS chip, comprising the steps of:
s1, positioning an MEMS chip: taking out the packaging shell 1, leading the solder balls at the bottom of the MEMS chip 16 to face the chip groove, putting in and clamping, then using sealing resin to smear at the edges of the MEMS chip 16 and the chip groove, finishing the preliminary positioning and fixing of the MEMS chip 16, and leading the solder ball points at the bottom of the MEMS chip 16 to be in one-to-one contact with the gold wire leads 11 at the moment, and finishing the conduction of a circuit;
S2, circuit welding: a proper amount of welding tin is coated between the conducting chip 13 and the corresponding golden wire 11 by using a spot welding gun, and each conducting chip 13 is connected with the corresponding golden wire 11 by using the spot welding gun to complete the extension of a circuit;
S3, sealing and packaging: firstly, coating a layer of heat-conducting silicone grease 15 on the surface of an MEMS chip part 16, then coating an acrylic adhesive on the edge of the inner wall of a packaging cavity 19, finally coating a layer of heat-conducting silicone grease 15 on the inner side of a heat-radiating copper cover plate 14, covering the whole heat-radiating copper cover plate 14 on the packaging cavity 19, then hot-pressing and exhausting on the heat-radiating copper cover plate 14 by using hot-pressing equipment, exhausting air in the packaging cavity 19, and firmly adhering the heat-radiating copper cover plate 14 on a packaging shell 1;
S4, coating film waterproof: coating a proper amount of epoxy resin sealant on the edge of the joint of the heat dissipation copper cover plate 14 and the packaging shell 1, and finally covering the surface of the heat dissipation copper cover plate 14 with a polyimide protective coating film 2, thereby completing the primary sealing packaging of the chip;
S5, pin installation: taking out a proper number of pin assemblies 3, leading a conductive piece 32 to be inserted into a reserved pin hole 4, turning over and pressing a pressing plate assembly 5 after the conductive piece 32 is inserted side by side, pressing the pressing plate assembly 5 into a pressing plate groove 7, then taking out a locking screw 6, penetrating a nail hole 8, realizing limit fixation of the pressing plate assembly 5, leading an insulating pressing pad 52 to be contacted with the top of the conductive piece 32 and pressed downwards after the pressing plate assembly 5 is pressed, leading the bottom of the conductive piece 32 to be in close contact with the other end of a conductive chip 13, and completing installation of the pin assemblies 3 at the moment without loosening; the packaging cavity 19 can be filled with epoxy resin for sealing or the interior of the packaging cavity 19 is in a relatively vacuum environment by means of hot-pressing and exhausting;
s6, testing electrical functions: using a chip testing tool to sequentially test the pin voltage, the pin current, the pin resistance and the pin function of the packaged chip pins, and packaging after the chip pins are qualified; when the voltage test of the pin is carried out, the test instrument can pass through the contact pin and apply certain voltage, then detect whether current passes through the pin, if so, the connection of the pin is normal, and if not, the connection problem of the pin is indicated;
The pin resistance test is used for detecting the resistance condition between the pins of the chip, the test instrument can contact the pins and apply certain current, then the voltage of the pins is measured, and the resistance between the pins can be calculated according to ohm's law by measuring the voltage drop and the current value.
Although the present invention has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present invention.
Claims (10)
1. The packaging structure of the MEMS chip comprises a packaging shell (1), and is characterized in that: the packaging structure is characterized in that a packaging cavity (19) is formed in the middle of the packaging shell (1), a chip positioning structure used for limiting an MEMS chip is fixedly arranged in the middle of the inner wall of the packaging cavity (19), a guide chip (13) is fixedly arranged on two sides of the inner wall of the packaging cavity (19), a top cover structure used for sealing and packaging the MEMS chip is arranged at the top of the packaging cavity (19), a plurality of reserved pin holes (4) are formed in two sides of the packaging shell (1), pin assemblies (3) are respectively arranged in the reserved pin holes (4), a pressing plate groove (7) are respectively formed in two sides of the top of the packaging shell (1), pressing plate assemblies (5) used for fixing the pin assemblies (3) are fixedly arranged in the pressing plate grooves (7), nail holes (8) are respectively formed in one ends of the pressing plate grooves (7), locking screws (6) are connected to inner threads of the nail holes (8), and ceramic substrates (9) are fixedly arranged at the bottoms of the packaging shell (1).
2. The MEMS chip package structure of claim 1, wherein: the chip positioning structure comprises a polycrystalline silicon connecting layer (10), a packaging frame (17) is fixedly arranged at the top of the polycrystalline silicon connecting layer (10), chip grooves are formed in the top of the packaging frame (17), protection layers (18) are fixedly arranged on two sides of the inner walls of the chip grooves, MEMS chip pieces (16) are placed between the protection layers (18), and a plurality of gold wire leads (11) extending into the chip grooves are fixedly arranged at the bottom of the polycrystalline silicon connecting layer (10).
3. The MEMS chip package structure of claim 2, wherein: the top cover structure comprises a heat dissipation copper cover plate (14) and heat conduction silicone grease (15) coated at the bottom of the heat dissipation copper cover plate (14), the bottom of the heat conduction silicone grease (15) is in contact with the surface of the MEMS chip part (16), and a polyimide protection coating film (2) is fixedly arranged on the upper surface of the heat dissipation copper cover plate (14).
4. The MEMS chip package structure of claim 2, wherein: the gold wire (11) and the guide chip (13) are arranged in a one-to-one opposite mode, and a soldering tin layer (12) is fixedly arranged between the corresponding gold wire (11) and the guide chip (13).
5. The MEMS chip package structure of claim 4, wherein: the pin assembly (3) comprises tinned pins (31) and a folded pin piece (33) fixedly arranged at the bottom of the tinned pins (31), a conductive piece (32) is fixedly arranged at the top of the tinned pins (31), and the conductive piece (32) and the conductive chip (13) are correspondingly arranged.
6. The MEMS chip package structure of claim 1, wherein: the clamp plate subassembly (5) include clamp plate lid (51) and fixed insulating pressure pad (52) that set up in clamp plate lid (51) inboard, the one end of clamp plate lid (51) is fixed to be provided with pivot (54), pivot (54) rotate the inside that sets up in clamp plate groove (7), locking hole (53) have been seted up to the other end of clamp plate lid (51), locking hole (53) and locking screw (6) assorted.
7. The MEMS chip package structure of claim 1, wherein: one side of the packaging shell (1) is fixedly provided with a fool-proof notch (20).
8. The packaging method of a packaging structure of a MEMS chip according to any one of claims 1 to 7, wherein: the method comprises the following steps:
S1, positioning an MEMS chip: taking out the packaging shell (1), leading the solder balls at the bottom of the MEMS chip (16) to be opposite to the chip groove, putting in and clamping, then using sealing resin to smear the edges of the MEMS chip (16) and the chip groove, finishing preliminary positioning and fixing of the MEMS chip (16), leading the solder ball points at the bottom of the MEMS chip (16) to be in one-to-one contact with the gold wire leads (11), and finishing the conduction of a circuit;
S2, circuit welding: a proper amount of welding tin is coated between the guide chip (13) and the corresponding golden wire (11) by using a spot welding gun, and each guide chip (13) is connected with the corresponding golden wire (11) by using the spot welding gun to complete the extension of a circuit;
S3, sealing and packaging: firstly, coating a layer of heat-conducting silicone grease (15) on the surface of an MEMS chip part (16), then coating a layer of acrylic acid binder on the edge of the inner wall of a packaging cavity (19), finally coating a layer of heat-conducting silicone grease (15) on the inner side of a heat-radiating copper cover plate (14), integrally covering the heat-radiating copper cover plate (14) on the packaging cavity (19), then hot-pressing and exhausting on the heat-radiating copper cover plate (14) by using hot-pressing equipment, exhausting air in the packaging cavity (19), and firmly adhering the heat-radiating copper cover plate (14) on a packaging shell (1);
S4, coating film waterproof: coating a proper amount of epoxy resin sealant on the edge of the joint of the heat dissipation copper cover plate (14) and the packaging shell (1), and finally covering a polyimide protection coating film (2) on the surface of the heat dissipation copper cover plate (14), thereby completing the primary sealing packaging of the chip;
S5, pin installation: taking out a proper number of pin assemblies (3), leading a conductive piece (32) to be inserted into a reserved pin hole (4), turning over and pressing a pressing plate assembly (5) after the conductive piece (32) is inserted side by side, pressing the pressing plate assembly (5) in a pressing plate groove (7), then taking out a locking screw (6), penetrating a nail hole (8) to limit and fix the pressing plate assembly (5), leading an insulating pressing pad (52) to be contacted with the top of the conductive piece (32) and pressed downwards after the pressing plate assembly (5) is pressed, leading the bottom of the conductive piece (32) to be in close contact with the other end of a conductive chip (13), and completing installation of the pin assemblies (3) at the moment without looseness;
s6, testing electrical functions: and (3) using a chip testing tool to sequentially test the pin voltage, the pin current, the pin resistance and the pin function of the packaged chip pins, and packaging after the chip pins are qualified.
9. The packaging method of claim 8, wherein: the packaging cavity (19) is filled with epoxy resin for sealing or is subjected to hot pressing and exhausting, so that the interior of the packaging cavity (19) is in a relatively vacuum environment.
10. The packaging method of claim 8, wherein: when the voltage test of the pin is carried out, the test instrument can pass through the contact pin and apply certain voltage, then detect whether current passes through the pin, if so, the connection of the pin is normal, and if not, the connection problem of the pin is indicated;
The pin resistance test is used for detecting the resistance condition between the pins of the chip, the test instrument can contact the pins and apply certain current, then the voltage of the pins is measured, and the resistance between the pins can be calculated according to ohm's law by measuring the voltage drop and the current value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411178473.0A CN118684183A (en) | 2024-08-27 | 2024-08-27 | Packaging structure and packaging method of MEMS chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411178473.0A CN118684183A (en) | 2024-08-27 | 2024-08-27 | Packaging structure and packaging method of MEMS chip |
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| Publication Number | Publication Date |
|---|---|
| CN118684183A true CN118684183A (en) | 2024-09-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411178473.0A Pending CN118684183A (en) | 2024-08-27 | 2024-08-27 | Packaging structure and packaging method of MEMS chip |
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| Country | Link |
|---|---|
| CN (1) | CN118684183A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4630172A (en) * | 1983-03-09 | 1986-12-16 | Printed Circuits International | Semiconductor chip carrier package with a heat sink |
| CN218385212U (en) * | 2022-08-29 | 2023-01-24 | 联测优特半导体(东莞)有限公司 | Pressing plate for packaging |
| CN218525581U (en) * | 2022-08-29 | 2023-02-24 | 广东明江芯片发展有限公司 | Pin structure for chip installation |
| CN220021089U (en) * | 2023-05-29 | 2023-11-14 | 深圳市美矽微半导体股份有限公司 | 5V single-channel DC motor driving chip |
| CN221427718U (en) * | 2023-11-30 | 2024-07-26 | 山东舜芯工研微电子有限公司 | Chip ceramic packaging structure |
-
2024
- 2024-08-27 CN CN202411178473.0A patent/CN118684183A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4630172A (en) * | 1983-03-09 | 1986-12-16 | Printed Circuits International | Semiconductor chip carrier package with a heat sink |
| CN218385212U (en) * | 2022-08-29 | 2023-01-24 | 联测优特半导体(东莞)有限公司 | Pressing plate for packaging |
| CN218525581U (en) * | 2022-08-29 | 2023-02-24 | 广东明江芯片发展有限公司 | Pin structure for chip installation |
| CN220021089U (en) * | 2023-05-29 | 2023-11-14 | 深圳市美矽微半导体股份有限公司 | 5V single-channel DC motor driving chip |
| CN221427718U (en) * | 2023-11-30 | 2024-07-26 | 山东舜芯工研微电子有限公司 | Chip ceramic packaging structure |
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