CN118610135A - Silicon wafer guiding device of etching cleaning machine - Google Patents
Silicon wafer guiding device of etching cleaning machine Download PDFInfo
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- CN118610135A CN118610135A CN202410756751.XA CN202410756751A CN118610135A CN 118610135 A CN118610135 A CN 118610135A CN 202410756751 A CN202410756751 A CN 202410756751A CN 118610135 A CN118610135 A CN 118610135A
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- silicon wafer
- telescopic rod
- cleaning machine
- connecting plate
- guiding device
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 132
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 130
- 239000010703 silicon Substances 0.000 title claims abstract description 130
- 238000004140 cleaning Methods 0.000 title claims abstract description 23
- 238000005530 etching Methods 0.000 title claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 49
- 235000012431 wafers Nutrition 0.000 claims description 111
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000007723 transport mechanism Effects 0.000 claims description 2
- 230000005389 magnetism Effects 0.000 claims 6
- 230000002146 bilateral effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 16
- 230000008569 process Effects 0.000 abstract description 14
- 238000005299 abrasion Methods 0.000 abstract description 5
- 230000003014 reinforcing effect Effects 0.000 description 8
- 230000009471 action Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of photovoltaic automation equipment, and discloses a silicon wafer guiding device of an etching cleaning machine, which comprises a conveying mechanism and a support column, wherein a mounting frame is arranged at the top of the support column, and a guiding mechanism is arranged in the mounting frame; the guide mechanism comprises a first telescopic rod and a support column, the telescopic end of the first telescopic rod is fixedly connected with a connecting frame, the bottom of the connecting frame is fixedly provided with a first fixing plate, and the first fixing plate is slidably arranged on the outer surface of the support column. The device directly contacts the silicon chip through the guide ball, and rotates relative to the silicon chip in the process of rightward pressure application of the silicon chip, so that the silicon chip is pushed to the central line area of each group of alignment mechanisms, namely the guiding operation of the silicon chip is completed, and in the process, the silicon chip moves along the vertical direction of the transportation direction of the device without sliding friction with any other part, so that the abrasion degree of the silicon chip in the guiding process is reduced, and the safety of the silicon chip is effectively protected.
Description
Technical Field
The invention belongs to the technical field of photovoltaic automation equipment, and particularly relates to a silicon wafer guiding device of an etching cleaning machine.
Background
The silicon wafer must be strictly cleaned in the production of the semiconductor, because trace pollution can also cause device failure, and the cleaning aim is to remove the pollution impurities on the surface of the silicon wafer; at present, the cleaning of a silicon wafer is divided into physical cleaning and chemical cleaning, wherein the chemical cleaning depends on an etching cleaning machine, and the etching cleaning machine utilizes mixed liquid HF/HNO3/H2SO4 to corrode the lower surface and the edge of the diffused silicon wafer, remove N-type silicon at the edge, and insulate the upper surface and the lower surface of the silicon wafer from each other, SO that edge leakage is reduced; in the prior art, in order to prevent the silicon wafer from shifting, a sleeve structure for limiting and correcting is additionally arranged on the surface of the roller, and the silicon wafer is enabled to return to a normal moving path through limiting and abutting connection, but when the sleeve structure in a circumferential rotation mode contacts with the silicon wafer, the contact part of the sleeve structure and the silicon wafer relatively slides, so that the silicon wafer edge is easily worn, and the silicon wafer is damaged and disabled.
Disclosure of Invention
The invention aims to provide a silicon wafer guiding device of an etching cleaning machine, which aims to solve the problems in the background technology.
In order to achieve the above object, the present invention provides the following technical solutions: the silicon wafer guiding device of the etching cleaning machine comprises a conveying mechanism and a support column, wherein a mounting frame is mounted at the top of the support column, and a guiding mechanism is mounted in the mounting frame;
The guiding mechanism comprises a first telescopic rod and a supporting column, wherein the telescopic end of the first telescopic rod is fixedly connected with a connecting frame, the bottom of the connecting frame is fixedly provided with a first fixed plate, the first fixed plate is slidably arranged on the outer surface of the supporting column, the top of the first fixed plate is provided with a second telescopic rod, the telescopic end of the second telescopic rod is fixedly provided with a second fixed plate, the inner wall of the second fixed plate is fixedly provided with a guiding column, the outer surface of the guiding column is slidably provided with a plurality of groups of sliding blocks, the bottom of each sliding block is fixedly connected with a vacuum chuck, the bottom of each vacuum chuck is adsorbed with a silicon wafer, the outer surface of each supporting column is slidably provided with a connecting plate positioned on the right side of the second fixed plate, and the bottom of each connecting plate is fixedly provided with a plurality of groups of aligning mechanisms;
the alignment mechanism comprises four connecting columns fixedly connected to the bottom of the connecting plate, supporting blocks are fixedly connected to the bottom of the connecting columns, a rotary drum is rotatably arranged on the outer surface of the connecting columns, a mounting groove is formed in the outer surface of the rotary drum, guide balls are rotatably arranged in the mounting groove, and the four connecting columns are uniformly distributed in the front-back direction and symmetrically distributed.
As a preferable scheme of the invention, the first telescopic rod is fixedly arranged on the left side of the inner wall of the mounting frame, the two groups of support columns are symmetrically distributed on the front side and the rear side of the first telescopic rod, the two ends of the support column are respectively fixedly connected with the left side and the right side of the inner wall of the mounting frame, the outer surface of the support column is also movably sleeved with a spring positioned on the right side of the connecting plate, and the two ends of the spring are respectively and elastically connected with the connecting plate and the mounting frame.
As a preferable scheme of the invention, the cross section of the connecting plate is L-shaped, the inner wall of the connecting plate is fixedly provided with the reinforcing blocks, the shape of the reinforcing blocks is right triangle, and the reinforcing blocks are arranged in a plurality of groups and are distributed on the connecting plate at equal intervals.
As a preferable scheme of the invention, the conveying mechanism comprises two groups of bases, a supporting frame is fixedly arranged between the two groups of bases, conveying rollers which are distributed symmetrically left and right are arranged in a rotating manner, a conveying belt is arranged on the outer surface of each conveying roller in a transmission manner, a motor is arranged on the front surface of each conveying belt and used for driving the conveying rollers, and the support columns are fixedly arranged at the tops of the bases.
As a preferable scheme of the invention, a second permanent magnet is fixedly arranged on the right side of the connecting plate, a first permanent magnet is fixedly arranged on the right side of the inner wall of the mounting frame, opposite surfaces of the first permanent magnet and the second permanent magnet are opposite to each other, and the first permanent magnet and the second permanent magnet have the same area and keep the front surface opposite to each other.
As a preferable scheme of the invention, the group number of the alignment mechanism is opposite to that of the silicon wafer, and a gap is reserved between the silicon wafer and the alignment mechanism.
As a preferable scheme of the invention, the right side of the outer surface of the guide post is provided with a convex block which is matched and clamped with the inner wall of the sliding block, so that the sliding block can only slide along the axis of the guide post.
As a preferable mode of the invention, the longitudinal section shape of the second fixing plate is U-shaped, and the top of the second fixing plate is still higher than the left side plane of the connecting plate when the second fixing plate moves to the lowest point.
As a preferable scheme of the invention, when the silicon wafer is driven to the right by the telescopic rod, the surface of the silicon wafer is only in rotary abutting connection with the outer surface of the guide ball.
The beneficial effects of the invention are as follows:
1. The device realizes the zero sliding friction function in the silicon wafer guiding process by being provided with the guiding mechanism, drives the vacuum chuck to move downwards by the telescopic rod II, performs vacuum adsorption fixation on the silicon wafer by utilizing the vacuum chuck, then drives the silicon wafer upwards to move to the height of the guiding ball, drives the silicon wafer to move rightwards by the telescopic rod I, enables the silicon wafer to be abutted against the aligning mechanism, enables the four rotating drums in each group of aligning mechanisms to be abutted against the silicon wafer so as to enable the guiding ball to be in direct contact with the silicon wafer, and enables the silicon wafer to be relatively rotated with the silicon wafer in the process of pressing rightwards, so that the silicon wafer is pushed to the center line area of each group of aligning mechanisms, namely the guiding operation on the silicon wafer is completed.
2. Simultaneously, utilize guide post slidable mounting to utilize the slider to connect vacuum chuck, vacuum chuck utilizes vacuum adsorption's silicon chip to drive by the telescopic link upwards and leave the surface of conveyer belt, the silicon chip can drive vacuum chuck and slider along the surface free slip of guide post through the reaction force that contacts and produce with aligning mechanism, thereby change the displacement of silicon chip in perpendicular to its direction of transportation, realize synchronous direction rectifying function, through the surface that is provided with the rotary drum seted up the mounting groove, and make the direction ball rotate and install wherein, when silicon chip and direction ball butt, can rotate simultaneously and adapt, avoided silicon chip and direction ball to produce sliding friction when the silicon chip is guided, the silicon chip can roll relatively with the direction ball when being put down by vacuum chuck and do free fall motion, avoid producing sliding wear.
3. The rotary drum and the connecting plate are pushed rightward by the telescopic rod driving the connecting frame, the vacuum chuck and the silicon wafer, the springs are continuously compressed, the alignment mechanism generates a reaction force when being abutted against the silicon wafer, the silicon wafer is assisted to move and guide, the distance between the permanent magnet block I and the permanent magnet block II is smaller along with the fact that the telescopic rod drives the silicon wafer to the right, the generated magnetic attraction force is larger, the resilience force from the springs is gradually counteracted, when the vacuum chuck lowers the silicon wafer, the magnetic attraction force can counteract the resilience force from the springs, the silicon wafer is guaranteed to be only acted by gravity when falling, and the guiding function of the device is better.
Drawings
FIG. 1 is a schematic front view of the structure of the present invention;
FIG. 2 is a schematic top view of the structure of the present invention;
FIG. 3 is a schematic view in elevation of a structure of the present invention;
FIG. 4 is an enlarged schematic view of the structure of FIG. 3A according to the present invention;
FIG. 5 is an enlarged schematic view of the structure of FIG. 3B according to the present invention;
FIG. 6 is a schematic diagram showing the overall cooperation of the guide mechanism of the present invention;
FIG. 7 is a schematic top cut-away view of the vacuum chuck, connecting column, support block and drum of the present invention;
FIG. 8 is a second overall mating schematic of the guide mechanism of the present invention;
fig. 9 is a partially exploded view of the guide mechanism of the present invention.
In the figure: 1. a transport mechanism; 10. a base; 11. a conveyor belt; 12. a motor; 13. a conveying roller; 14. a support frame; 2. a support post; 3. a mounting frame; 4. a guide mechanism; 40. a first telescopic rod; 41. a connection frame; 42. a first fixing plate; 43. a second telescopic rod; 44. a support column; 45. a spring; 46. a connecting plate; 47. a reinforcing block; 48. a permanent magnet block I; 49. a permanent magnet block II; 410. a second fixing plate; 411. a guide post; 412. a slide block; 413. a vacuum chuck; 414. a connecting column; 415. a support block; 416. a rotating drum; 417. a mounting groove; 418. a guide ball; 419. a bump; 5. and (3) a silicon wafer.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1 to 9, the embodiment of the invention provides a silicon wafer guiding device of an etching cleaning machine, which comprises a conveying mechanism 1 and a support column 2, wherein a mounting frame 3 is arranged at the top of the support column 2, and a guiding mechanism 4 is arranged in the mounting frame 3;
The guiding mechanism 4 comprises a first telescopic rod 40 and a supporting column 44, the telescopic end of the first telescopic rod 40 is fixedly connected with a connecting frame 41, a first fixed plate 42 is fixedly arranged at the bottom of the connecting frame 41, the first fixed plate 42 is slidably arranged on the outer surface of the supporting column 44, a second telescopic rod 43 is arranged at the top of the first fixed plate 42, a second fixed plate 410 is fixedly arranged at the telescopic end of the second telescopic rod 43, a guiding column 411 is fixedly arranged on the inner wall of the second fixed plate 410, a plurality of groups of sliding blocks 412 are slidably arranged on the outer surface of the guiding column 411, a vacuum chuck 413 is fixedly connected at the bottom of the sliding blocks 412, a silicon wafer 5 is adsorbed at the bottom of the vacuum chuck 413, a connecting plate 46 positioned on the right side of the second fixed plate 410 is slidably arranged on the outer surface of the supporting column 44, and a plurality of groups of aligning mechanisms are fixedly arranged at the bottom of the connecting plate 46;
The alignment mechanism comprises four connecting columns 414 fixedly connected to the bottom of the connecting plate 46, supporting blocks 415 are fixedly connected to the bottom of the connecting columns 414, a rotary drum 416 is rotatably arranged on the outer surface of the connecting columns 414, a mounting groove 417 is formed in the outer surface of the rotary drum 416, guide balls 418 are rotatably arranged in the mounting groove 417, and the four connecting columns 414 are uniformly distributed in the front-back direction and symmetrically distributed;
The device realizes the zero sliding friction function in the silicon wafer guiding process by being provided with the guiding mechanism 4, drives the vacuum chuck 413 to move downwards by the telescopic rod II 43, performs vacuum adsorption fixation on the silicon wafer 5 by utilizing the vacuum chuck 413, then drives the silicon wafer 5 upwards to move to the height of the guiding ball 418, drives the silicon wafer 5 to move rightwards by the telescopic rod I40, enables the silicon wafer 5 to be abutted against the aligning mechanism, enables the four rotary drums 416 in each group of aligning mechanisms to be abutted against the silicon wafer 5 so as to enable the guiding ball 418 to be in direct contact with the silicon wafer 5, and enables the silicon wafer 5 to rotate relatively with the silicon wafer 5 in the rightward pressing process, so that the silicon wafer 5 is pushed to the central line area of each group of aligning mechanisms, namely the guiding operation on the silicon wafer 5 is completed, and the silicon wafer 5 moves in the vertical direction of the device conveying direction without sliding friction with any other parts in the process, so that the abrasion degree of the silicon wafer 5 in the guiding process is reduced, and the safety of the silicon wafer 5 is effectively protected.
Simultaneously, the guide column 411 is utilized to slidingly mount the slide block 412, the slide block 412 is utilized to connect the vacuum chuck 413, when the vacuum chuck 413 utilizes the silicon wafer 5 absorbed by vacuum to be driven upwards by the telescopic rod II 43 and leaves the surface of the conveyor belt 11, the silicon wafer 5 can drive the vacuum chuck 413 and the slide block 412 to freely slide along the outer surface of the guide column 411 through the reaction force generated by the contact with the alignment mechanism, thereby changing the displacement of the silicon wafer 5 in the vertical transport direction, realizing the synchronous guide deviation correcting function, and the installation groove 417 is formed on the outer surface of the rotary drum 416, so that the guide ball 418 is rotationally mounted in the installation groove, when the silicon wafer 5 is abutted with the guide ball 418, the rotation and the adaptation are simultaneously carried out, the sliding friction force between the silicon wafer 5 and the guide ball 418 is avoided when the silicon wafer 5 is guided, and when the silicon wafer 5 is placed by the vacuum chuck 413 to do free-fall motion, the silicon wafer can relatively roll with the guide ball 418, and the sliding abrasion is avoided.
The first telescopic rod 40 is fixedly arranged on the left side of the inner wall of the mounting frame 3, the two groups of support columns 44 are symmetrically distributed on the front side and the rear side of the first telescopic rod 40, two ends of the support columns 44 are fixedly connected with the left side and the right side of the inner wall of the mounting frame 3 respectively, the outer surface of the support columns 44 is movably sleeved with springs 45 positioned on the right side of a connecting plate 46, and two ends of each spring 45 are elastically connected with the connecting plate 46 and the mounting frame 3 respectively;
the connecting frame 41, the vacuum chuck 413 and the silicon wafer 5 are driven to push the rotary drum 416 and the connecting plate 46 rightwards through the telescopic rod I40, the spring 45 is continuously compressed, the alignment mechanism generates a reaction force when being abutted against the silicon wafer 5, the silicon wafer 5 is assisted to move and guide, the smaller the distance between the permanent magnet block I48 and the permanent magnet block II 49 is along with the movement of the telescopic rod I40 rightwards to the rightmost side, the larger the generated magnetic attraction force is, the rebound force from the spring 45 is gradually counteracted, and when the silicon wafer 5 is placed under the vacuum chuck 413, the magnetic attraction force can counteract the rebound force from the spring 45, so that the silicon wafer 5 is ensured to be only under the action of gravity when falling, and the guiding function of the device is better.
Wherein, the cross section of the connecting plate 46 is L-shaped, the inner wall of the connecting plate 46 is fixedly provided with reinforcing blocks 47, the shape of the reinforcing blocks 47 is a right triangle, and the reinforcing blocks 47 are arranged in a plurality of groups and are distributed on the connecting plate 46 at equal intervals;
The connection plate 46 is used for providing support for the alignment mechanism, and converting the thrust from the first telescopic rod 40 and the silicon wafer 5 into displacement of the connection plate 46 on the outer surface of the support column 44, and the connection tightness of two mutually perpendicular parts of the connection plate 46 can be enhanced by the reinforcing block 47.
The conveying mechanism 1 comprises two groups of bases 10, a supporting frame 14 is fixedly arranged between the two groups of bases 10, conveying rollers 13 which are symmetrically distributed left and right are rotatably arranged, a conveying belt 11 is arranged on the outer surface of the conveying rollers 13 in a transmission mode, a motor 12 is arranged on the front face of the conveying belt 11 and used for driving the conveying rollers 13, and a support column 2 is fixedly arranged at the top of the bases 10;
the conveying mechanism 1 continuously conveys the silicon wafers 5 through the continuously moving conveyor belt 11, wherein the supporting frame 14 is abutted against the inner surface of the conveyor belt 11 to provide stable support for the silicon wafers.
The right side of the connecting plate 46 is fixedly provided with a second permanent magnet block 49, the right side of the inner wall of the mounting frame 3 is fixedly provided with a first permanent magnet block 48, the opposite surfaces of the first permanent magnet block 48 and the second permanent magnet block 49 are different from each other, the areas of the first permanent magnet block 48 and the second permanent magnet block 49 are the same, and the front surfaces of the first permanent magnet block 48 and the second permanent magnet block 49 are opposite;
The side of the second permanent magnet block 49 facing the first permanent magnet block 48 is of the level N, the side of the first permanent magnet block 48 facing the second permanent magnet block 49 is of the level S, when the connecting plate 46 is driven to move rightwards continuously, the magnetic attraction force generated by the second permanent magnet block 48 is gradually increased and gradually counteracts the resilience force of the spring 45, when the silicon wafer 5 is placed down by the vacuum chuck 413, the connecting plate 46 can be kept to move leftwards temporarily, when the silicon wafer 5 is separated from contact with the guide ball 418, the outer edge of the silicon wafer 5 and the outer surface of the rotary drum 416 are at a certain distance when the silicon wafer 5 falls freely, the distance depends on the part of the guide ball 418 protruding from the outer surface of the rotary drum 416, the distance is enough for the silicon wafer 5 to move downwards to the lower part of the supporting block 415 completely, in the process, the resilience force generated by a part of the spring 45 is counteracted, the leftwards resetting process of the rotary drum 416 is slowed down, the silicon wafer 5 is prevented from contacting the outer surface of the rotary drum 416 in the falling process, and the accurate position of the silicon wafer 5 after being guided is maintained.
The group number of the alignment mechanisms is opposite to that of the silicon wafers 5, and a gap is reserved between the silicon wafers 5 and the alignment mechanisms;
The alignment mechanism is opposite to the number of the silicon wafers 5 and is used for guiding and adjusting the silicon wafers 5, when the second telescopic rod 43 and the vacuum chuck 413 are in the original positions, the silicon wafers 5 which are adsorbed and fixed are kept in a gap with the guide ball 418 and the rotary drum 416, and sliding abrasion between the silicon wafers 5 and the rotary drum 416 can be prevented when the silicon wafers 5 are brought up.
The right side of the outer surface of the guide post 411 is provided with a lug 419 which is matched and clamped with the inner wall of the sliding block 412, so that the sliding block 412 can only slide along the axis of the guide post 411;
The tab 419 is adapted to engage the middle of the slider 412, which prevents the slider 412 from being forced to rotate about the axis of the guide post 411.
The second fixing plate 410 has a "U" shape in longitudinal section, and the top of the second fixing plate 410 is still higher than the left plane of the connecting plate 46 when the second fixing plate moves to the lowest point;
the guide post 411, the slide block 412 and the vacuum chuck 413 are connected to the lower surface of the second fixing plate 410, and can be abutted against the connecting plate 46, so that the connecting plate 46 is prevented from being directly contacted with the vacuum chuck 413 to cause damage.
When the silicon wafer 5 is driven to the right by the first telescopic rod 40, the surface of the silicon wafer is only in rotary abutting connection with the outer surface of the guide ball 418;
when the silicon wafer 5 moves upwards, the silicon wafer passes through the outer surface of the guide ball 418 and is in rolling contact with the outer surface of the guide ball 418, so that sliding abrasion is avoided.
Working principle:
when the device works, firstly, the first telescopic rod 40 is started, the connecting frame 41, the first fixed plate 42 and the vacuum chuck 413 are driven to the leftmost side, the second telescopic rod 43 is started, the vacuum chuck 413 is driven to the highest point, the conveying mechanism 1 is started, and the motor 12 drives the conveying roller 13 and the conveying belt 11, so that the conveying direction of the conveying belt 11 is rightward;
when the silicon chips are placed on the upper surface of the conveyor belt 11 and driven to move rightwards by the conveyor belt 11, the second telescopic rod 43 is started, the second fixing plate 410, the guide column 411, the sliding block 412 and the vacuum chuck 413 are driven to move downwards, the first batch of silicon chips are adsorbed and fixed through the vacuum chuck 413, and then the second telescopic rod 43 is started to drive the vacuum chuck 413 to reset upwards and quickly;
Then, the first telescopic rod 40 is quickly started, the connecting frame 41, the first fixed plate 42, the second telescopic rod 43, the second fixed plate 410, the vacuum chuck 413 and the silicon wafer 5 are driven to move rightward along the outer surface of the supporting column 44, and at the moment, the silicon wafer 5 starts to be abutted with the alignment mechanism and is firstly contacted with the guide ball 418;
on the one hand, the positions among the guide ball 418, the rotary drum 416 and the connecting column 414 are relatively fixed, the silicon wafer 5 starts to be in rolling contact with the guide ball 418 and drives the vacuum chuck 413 and the sliding block 412 to move along the axis of the guide column 411, so that the horizontal line of the silicon wafer 5 is collinear with the front and rear central lines of the alignment mechanism, and at the moment, the silicon wafer 5 is completely and vertically moved and adjusted along the transportation direction of the device and moves to the standard position;
Meanwhile, as the silicon wafer 5 continuously abuts against the guide ball 418 to the right and pushes the connecting plate 46 to the right, so that the spring 45 is compressed to generate resilience force, at the moment, the distance between the permanent magnet block two 49 and the permanent magnet block one 48 is more and more, and continuously increased magnetic attraction force is generated, after the silicon wafer 5 moves to the rightmost side, the thrust force of the permanent magnet block one 48, the permanent magnet block two 49 and the silicon wafer 5 to the right is larger than the resilience force generated by the spring 45, at the moment, the vacuum sucker 413 is closed, and the silicon wafer 5 is released downwards, so that the silicon wafer 5 falls on the conveyor belt 11;
Then, the spring 45 pushes the connection plate 46 rightward and slowly resets leftward against the magnetic attraction force of the first permanent magnet block 48 and the second permanent magnet block 49, at which time the first telescopic rod 40 rapidly resets leftward and repeatedly performs the above-described operations.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides an etching cleaning machine silicon chip guider, includes transport mechanism (1), pillar (2), installing frame (3), its characterized in that are installed at the top of pillar (2): a guide mechanism (4) is arranged in the mounting frame (3);
The guide mechanism (4) comprises a first telescopic rod (40) and a support column (44), the telescopic end of the first telescopic rod (40) is fixedly connected with a connecting frame (41), the bottom of the connecting frame (41) is fixedly provided with a first fixed plate (42), the first fixed plate (42) is slidably arranged on the outer surface of the support column (44), the top of the first fixed plate (42) is provided with a second telescopic rod (43), the telescopic end of the second telescopic rod (43) is fixedly provided with a second fixed plate (410), the inner wall of the second fixed plate (410) is fixedly provided with a guide column (411), the outer surface of the guide column (411) is slidably provided with a plurality of groups of sliding blocks (412), the bottom of the sliding blocks (412) is fixedly connected with a vacuum sucker (413), the bottom of the vacuum sucker (413) is adsorbed with a silicon wafer (5), the outer surface of the support column (44) is slidably provided with a connecting plate (46) positioned on the right side of the second fixed plate (410), and the bottom of the connecting plate (46) is fixedly provided with a plurality of groups of alignment mechanisms.
The alignment mechanism comprises four connecting columns (414) fixedly connected to the bottom of the connecting plate (46), supporting blocks (415) are fixedly connected to the bottom of the connecting columns (414), rotating drums (416) are rotatably mounted on the outer surfaces of the connecting columns (414), mounting grooves (417) are formed in the outer surfaces of the rotating drums (416), guide balls (418) are rotatably mounted in the mounting grooves (417), and the four connecting columns (414) are uniformly distributed in a front-back mode and symmetrically distributed.
2. The etching cleaning machine silicon wafer guiding device according to claim 1, wherein: the telescopic rod I (40) is fixedly arranged on the left side of the inner wall of the mounting frame (3), the supporting columns (44) are arranged into two groups and symmetrically distributed on the front side and the rear side of the telescopic rod I (40), two ends of each supporting column (44) are fixedly connected with the left side and the right side of the inner wall of the mounting frame (3) respectively, the outer surface of each supporting column (44) is movably sleeved with a spring (45) positioned on the right side of the connecting plate (46), and two ends of each spring (45) are connected with the connecting plate (46) and the mounting frame (3) elastically.
3. The etching cleaning machine silicon wafer guiding device according to claim 2, wherein: the cross section shape of connecting plate (46) is "L" shape, the inner wall fixed mounting of connecting plate (46) has stiffening block (47), the shape of stiffening block (47) is right triangle, stiffening block (47) set up into the multiunit and equidistantly distribute on connecting plate (46).
4. A silicon wafer guiding device of an etching cleaning machine according to claim 3, wherein: the conveying mechanism (1) comprises two groups of bases (10), a supporting frame (14) is fixedly installed between the two groups of bases (10), a conveying roller (13) which is distributed in a bilateral symmetry manner is installed in a rotating mode, a conveying belt (11) is installed on the outer surface of the conveying roller (13) in a transmission mode, a motor (12) is installed on the front face of the conveying belt (11), the conveying roller (13) is driven, and the supporting column (2) is fixedly installed at the top of the base (10).
5. The etching and cleaning machine silicon wafer guiding device according to claim 4, wherein: the right side of connecting plate (46) is fixed mounting has permanent magnetism piece two (49), the right side of installing frame (3) inner wall is fixed mounting has permanent magnetism piece one (48), the opposite face of permanent magnetism piece one (48) and permanent magnetism piece two (49) is different each other, the area of permanent magnetism piece one (48) and permanent magnetism piece two (49) is the same to keep the front relative.
6. The etching cleaning machine silicon wafer guiding device according to claim 5, wherein: the number of the groups of the alignment mechanisms is opposite to that of the silicon wafers (5), and gaps are reserved between the silicon wafers (5) and the alignment mechanisms.
7. The etching and cleaning machine silicon wafer guiding device according to claim 6, wherein: the right side of the outer surface of the guide post (411) is provided with a lug (419) which is matched and clamped with the inner wall of the sliding block (412), so that the sliding block (412) can only slide along the axis of the guide post (411).
8. The etching and cleaning machine silicon wafer guiding device according to claim 7, wherein: the longitudinal section of the second fixing plate (410) is U-shaped, and the top of the second fixing plate (410) is still higher than the left side plane of the connecting plate (46) when the second fixing plate moves to the lowest point.
9. The etching and cleaning machine silicon wafer guiding device according to claim 8, wherein: when the silicon wafer (5) is driven to the right by the first telescopic rod (40), the surface of the silicon wafer is only in rotary abutting connection with the outer surface of the guide ball (418).
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