CN118439791A

CN118439791A - Substrate and manufacturing method thereof, shell and manufacturing method thereof, and electronic equipment

Info

Publication number: CN118439791A
Application number: CN202311637563.7A
Authority: CN
Inventors: 江博凡; 许文彬
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2023-11-30
Filing date: 2023-11-30
Publication date: 2024-08-06

Abstract

The application discloses a substrate, a manufacturing method thereof, a shell, a manufacturing method thereof and electronic equipment, and belongs to the technical field of electronic equipment. The substrate comprises a glass substrate, the glass substrate comprises a first surface, a plurality of protruding structures are protruding from the first surface, the size of the protruding structures protruding from the first surface is smaller than or equal to 100 mu m, the protruding structures comprise at least one of first protrusions and second protrusions, the first protrusions are formed by microcrystalline glass particles, and the second protrusions are formed by ceramic particles. The substrate is applied to the shell, and the shell is applied to the electronic equipment. The substrate provided by the application has better scratch resistance.

Description

Substrate and manufacturing method thereof, shell and manufacturing method thereof, and electronic equipment

Technical Field

The present application relates to the field of electronic devices, and in particular, to a substrate, a method for manufacturing the substrate, a housing, a method for manufacturing the housing, and an electronic device.

Background

With the development of technology, electronic devices are increasingly used, and have become an important tool in daily life and work of people. Glass materials have advantages of good workability, applicability to various surface processing processes, and the like, and are therefore often used for manufacturing housings of electronic devices. However, the surface of the case made of glass material is easily scratched, that is, the scratch-proof performance of the glass case in the related art is poor.

Disclosure of Invention

The application provides a substrate, a manufacturing method thereof, a shell, a manufacturing method thereof and electronic equipment.

The technical scheme is as follows:

a first aspect of the present application provides a substrate comprising: the glass substrate, glass substrate includes the first surface, and the first surface protrusion is provided with a plurality of protruding structures, and a plurality of protruding structures protrude in the size of first surface and be less than or equal to 100 mu m, and protruding structures include at least one of first protruding and second protruding, and first protruding is formed by the microcrystalline particle, and the second protruding is formed by ceramic particle.

In the substrate provided by the application, the raised structure is formed on the first surface of the glass substrate and is formed by the microcrystalline particles or the ceramic particles, so that the raised structure has higher hardness and better scratch resistance, namely the first surface of the glass substrate has better scratch resistance.

In some implementations, at least a portion of the raised structures protrude above the first surface by a dimension of 5 μm or more.

In some implementations, at least a portion of the raised structures protrude from the first surface by a dimension of 20 μm to 50 μm.

In some implementations, the glass substrate includes a second surface disposed opposite the first surface, the second surface being convexly provided with a plurality of raised structures.

In some implementations, the protrusion structure of the second surface is the first protrusion.

In a second aspect, there is provided a method for manufacturing a substrate, which is suitable for manufacturing a substrate provided in any one of the above-mentioned aspects, the method comprising:

Preparing first powder, wherein the first powder is glass particles;

Preparing a second powder, wherein the second powder comprises at least one of microcrystalline glass particles and ceramic particles;

Preparing a blank body through the first powder and the second powder;

sintering the green body to form a base material, wherein part of the second powder protrudes out of the first surface of the base material to form a protruding structure.

In the manufacturing method of the substrate, the protruding structure is formed on the first surface of the substrate, the protruding structure is formed by the second powder, and the second powder is at least one of microcrystalline glass particles and ceramic particles, so that the protruding structure is microcrystalline particles or ceramic particles formed by crystallization of the microcrystalline glass particles, the hardness is high, the scratch resistance is better, and the scratch resistance of the first surface of the substrate is better.

In some implementations, the process of preparing the embryo body includes:

Preparing a mixed material body, wherein the mixed material body comprises a first powder and a second powder, the first powder accounts for 20-80 wt% of the mixed material body, the second powder comprises one of microcrystalline glass particles and ceramic particles, and the second powder accounts for 20-80 wt% of the mixed material body.

In some implementations, the process of preparing the embryo body includes:

Preparing a mixture body, wherein the mixture body comprises a first powder and a second powder, the first powder accounts for 20-80 wt% of the mixture body, the second powder comprises microcrystalline glass particles and ceramic particles, the microcrystalline glass particles account for less than 80wt% of the mixture body, and the ceramic particles account for less than 60wt% of the mixture body.

In some implementations, the mixture body further includes a binder, the binder comprising less than 30wt% of the mixture body.

In some implementations, the glass particles have a particle size less than or equal to 5 μm.

In some implementations, the glass particles include SiO ₂、Al₂O₃、B₂O₃, alkali metal oxide, and alkaline earth metal oxide, where 5 wt.% alkali metal oxide is 20 wt.% or less; 55wt% or more and ₂O₃+SiO₂+Al₂O₃ wt% or less and 75wt% or less of B and 5wt% or less and 15wt% or less of alkaline earth metal oxide.

In some implementations, the glass particles further include a first auxiliary raw material, the first auxiliary raw material being less than or equal to 5wt%; the first auxiliary raw material may include: at least one of a colorant, a clarifying agent, a fluxing agent, an oxidizing agent, and a reducing agent.

In some implementations, the glass transition temperature of the glass particles is between 450 ℃ and 700 ℃.

In some implementations, when the second powder includes glass-ceramic particles, the crystalline phase of the glass-ceramic particles is one or more of cordierite, spinel, olivine, diopside, petalite, spodumene, eucryptite, lithium silicate, and a solid solution of quartz.

In some implementations, when the second powder includes glass-ceramic particles, the glass-ceramic particles include SiO ₂、Al₂O₃、B₂O₃ and alkaline earth oxides, wherein 55 wt.% B ₂O₃+SiO₂+Al₂O₃ wt.% B80 wt.%; alkaline earth metal oxide is more than or equal to 10wt% and less than or equal to 20wt%.

In some implementations, the glass-ceramic particles further include ZnO, which is 15wt% or less.

In some implementations, the glass-ceramic particles further include an alkali oxide, the alkali oxide being present in the glass-ceramic particles at a ratio of less than or equal to 15wt%.

In some implementations, the glass-ceramic particles further include a nucleating agent and a first auxiliary raw material, the nucleating agent having a ratio of less than or equal to 10wt% in the glass-ceramic particles and the first auxiliary raw material having a ratio of less than or equal to 5wt% in the glass-ceramic particles, the first auxiliary raw material including at least one of a colorant, a clarifying agent, a fluxing agent, an oxidizing agent, and a reducing agent.

In some implementations, when the second frit comprises glass-ceramic particles, the glass-ceramic particles have a particle size of 5 μm to 100 μm.

In some implementations, when the second powder includes glass-ceramic particles, the preparing of the second powder includes a crystallization process in which the glass-ceramic particles precipitate glass-ceramic particles, the glass-ceramic particles including first grains and second grains, the first grains having an average grain size of 1nm to 80nm, and the second grains having an average grain size of 10 μm to 20 μm.

In some implementations, when the second powder includes ceramic particles, the ceramic particles have a particle size of 10 μm to 150 μm.

In some implementations, when the second frit comprises ceramic particles, the primary crystalline phase of the ceramic particles is at least one of alumina, zirconia, cordierite, spinel, silicon carbide, silicon nitride, and aluminum nitride.

In some implementations, when the second frit comprises ceramic particles, the melting temperature of the ceramic particles is at least 500 ℃ higher than the melting temperature of the glass particles.

In some implementations, when the second powder includes ceramic particles, the melting temperature of the ceramic particles is greater than or equal to 1400 ℃.

In some implementations, when the second powder includes ceramic particles, the ceramic particles have a mohs hardness greater than or equal to 7.5.

In some implementations, where the second powder comprises ceramic particles, preparing the second powder further comprises: the ceramic particles are subjected to a wettability treatment.

In a third aspect, a method for manufacturing a housing is provided, including the method for manufacturing a substrate provided in any one of the above aspects.

By the above technical solution, since the manufacturing method of the housing includes the manufacturing method of the substrate, at least all the advantages of the manufacturing method of the substrate are provided, and will not be described herein.

In some implementations, the method further includes post-processing the substrate, the post-processing including at least one of CNC cold engraving, hot bending processing, polishing, chemical strengthening, laser engraving, surface etching, and surface coating.

In a fourth aspect, a housing is provided, including a substrate provided in any one of the above aspects.

By the technical scheme, the shell comprises the substrate, so that the shell at least has all beneficial effects of the substrate, and the description is omitted.

In a fifth aspect, an electronic device is provided, including the housing provided in the foregoing technical solution.

By means of the technical scheme, the electronic equipment comprises the shell, so that the electronic equipment at least has all beneficial effects of the shell, and the description is omitted.

Drawings

FIG. 1 is a schematic view of a substrate according to an embodiment of the present application;

FIG. 2 is an enlarged view at B in FIG. 1;

FIG. 3 is a cross-sectional view at A-A in FIG. 1;

FIG. 4 is an enlarged view of a substrate at C in FIG. 3 provided in accordance with an embodiment of the present application;

FIG. 5 is an enlarged view of another substrate provided in an embodiment of the present application at C in FIG. 3;

FIG. 6 is a flow chart of a method for manufacturing a substrate according to an embodiment of the present application;

FIG. 7 is a schematic diagram showing the morphology change of glass particles and glass-ceramic particles in the manufacturing process of the substrate according to the embodiment of the present application;

FIG. 8 is a schematic diagram showing the morphology change of glass particles and ceramic particles in the manufacturing process of the substrate according to the embodiment of the present application;

FIG. 9 is a partial view of a cross-section of a substrate under a microscope provided in an embodiment of the present application;

FIG. 10 is a flow chart of a method for manufacturing a housing according to an embodiment of the present application;

Fig. 11 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Wherein, the meanings represented by the reference numerals are respectively as follows:

100. a glass substrate; 110. a first surface; 120. a second surface;

200. A bump structure;

310. Glass particles; 320. microcrystalline glass particles; 330. ceramic particles;

400. An electronic device; 411. a battery cover; 412. a middle frame; 420. a battery; 430. and a display screen.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

It should be understood that references to "a plurality" in this disclosure refer to two or more. In the description of the present application, "/" means or, unless otherwise indicated, for example, A/B may represent A or B; "and/or" herein is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In addition, in order to facilitate the clear description of the technical solution of the present application, the words "first", "second", etc. are used to distinguish the same item or similar items having substantially the same function and function. It will be appreciated by those of skill in the art that the words "first," "second," and the like do not limit the amount and order of execution, and that the words "first," "second," and the like do not necessarily differ.

It should be understood that the "glass-ceramic particles" and "glass-ceramic particles" referred to in the present application are not of the same structure, and that the "glass-ceramic particles" are powdered raw materials for producing glass-ceramic, which are a combination of glass phases and glass-ceramic particles. Unlike "glass-ceramic particles," glass-ceramic particles "refer to grains that precipitate after crystallization of the" glass-ceramic particles.

The substrate, the method for manufacturing the substrate, the housing and the electronic device provided by the embodiment of the application are explained in detail below. In embodiments of the present application, the electrical connection refers to connection between two electrical devices through conductors, so that electrical signals can be transmitted between the two electrical devices. In the various figures of the present application, the arrowed leads are all directed to the surface of the device and the dotted leads are all directed to the device itself.

In the conventional art, a case of an electronic device is made of a glass material, and a part of the surface of the case is processed with a sand layer, for example, a bump structure is etched on the surface of the glass material by etching. But the salient points on the surface of the shell are made of glass materials, and when the shell is scratched by an external object, the salient point structures formed by the glass materials are extremely easy to be ground flat, so that scratches are left on the surface of the shell. In some shell preparation processes, the surface of the shell is subjected to hardening treatment, the hardening treatment has high cost, and the shell with frosted feel cannot be prepared.

As described above, the electronic device of the related art has poor scratch resistance of the case having a frosted feel.

In view of the above, the embodiments of the present application provide a substrate, a housing, and an electronic device, and a method for manufacturing the substrate, which are used to solve the problems that plague the skilled person to a certain extent. The substrate, the housing, the electronic device, and the method for manufacturing the substrate provided by the embodiments of the present application are explained in detail below.

Fig. 1 is a top view of a substrate according to an embodiment of the present application, fig. 2 is an enlarged view of the substrate at a in fig. 1, and fig. 3 is a cross-sectional view of the substrate at A-A in fig. 1; fig. 4 is an enlarged view of the substrate at C in fig. 3. The substrate comprises a glass substrate 100, the glass substrate 100 comprises a first surface 110, the first surface 110 is convexly provided with a plurality of protruding structures 200, the size of the protruding structures 200 protruding from the first surface 110 is smaller than or equal to 100 μm, the protruding structures 200 comprise at least one of first protrusions and second protrusions, the first protrusions are formed by microcrystalline particles, the microcrystalline particles can be formed by crystallization of microcrystalline glass particles, and the second protrusions are formed by ceramic particles. Since the protruding structures 200 protrude from the first surface 110 by a size of less than or equal to 100 μm, it is not possible to make a clear foreign body sensation when the first surface 110 is touched by hand, and it is generally difficult to clearly distinguish each protruding structure 200 by the naked eye, so that the aesthetic degree of the first surface 110 is not significantly affected.

In one possible embodiment, the bump structure 200 comprises first bumps, i.e. only first bumps formed of microcrystalline particles may be provided at the first surface 110 of the glass substrate 100. In another possible embodiment, the bump structure 200 comprises second bumps, i.e. only second bumps formed of ceramic particles may be provided on the first surface 110 of the glass substrate 100. In yet another possible embodiment, the bump structure 200 comprises a first bump and a second bump, i.e. both the first bump formed of microcrystalline particles and the second bump formed of ceramic particles are provided protruding at the first surface 110 of the glass substrate 100.

Since the first surface 110 of the substrate provided in the present embodiment is provided with the protruding structures 200 with the micro-scale dimensions, the protruding structures 200 with the micro-scale make the first surface 110 of the housing present a frosted feel. The bump structure 200 is formed of microcrystalline particles and/or ceramic particles, and the hardness of the microcrystalline particles and the hardness of the ceramic particles are both greater than that of the glass substrate 100, so that in the use process, if the first surface 110 of the substrate encounters scratch by an external object, the bump structure 200 is first contacted with the external object, and the bump structure 200 is scratched or worn to a lower extent due to the higher hardness of the bump structure 200, and the bump structure 200 can block the external object from directly scratching the glass substrate 100 to a certain extent, so that the scratch resistance of the first surface 110 of the substrate is improved.

In the substrate provided in this embodiment, since the bump structure 200 is formed on the first surface 110 of the glass substrate 100, the bump structure 200 is formed by microcrystalline particles or ceramic particles, so that the bump structure 200 has a relatively high hardness and a relatively good scratch resistance, i.e., the first surface 110 of the glass substrate 100 has a relatively good scratch resistance.

The substrate provided in this embodiment may be used for a housing of an electronic device, that is, the substrate may be processed to form a housing of the electronic device, or the substrate may be processed to form a part of the housing of the electronic device, for example, as a battery cover in the housing of the electronic device, and the battery cover is also referred to as a rear cover. The substrate may also be used as a decorative layer (or surface layer) for the housing of the electronic device. In addition, the substrate can be applied to other structures, such as biomedical appliances, tableware and kitchen ware, daily ornaments and the like.

In some implementations, at least a portion of the raised structures 200 protrude above the first surface 110 by a dimension of 5 μm or more. That is, among the plurality of bump structures 200, all or at least a part of the bump structures 200 protrude from the first surface 110 by a size of 5 μm or more, and in this size range, the protective performance against the first surface 110 is better. That is, when the substrate is applied to the housing, and the housing is applied to an article for daily use (e.g., a furniture home appliance, an electronic device), the protruding structure 200 protruding from the first surface 110 with a size of 20 μm or more can protect against most abrasion, such as unintentional scraping of the hands of a user, and the first surface 110 is scraped by the table top, the bracket, etc. when placed at the table top, the bracket, etc.

In some implementations, at least a portion of the raised structures 200 protrude from the first surface 110 by a dimension of 20 μm to 50 μm.

In some implementations, as shown in fig. 5, in the enlarged view of the other substrate at C provided in this embodiment, the glass substrate 100 includes a second surface 120, the second surface 120 is disposed opposite to the first surface 110, and the second surface 120 is convexly provided with a plurality of bump structures 200. In this arrangement, the surfaces of the opposite sides of the glass substrate 100 both exhibit a frosted feel and have better scratch resistance. The glass substrate 100 can be applied to a housing with both sides contacting an external object.

The bump structure 200 formed on the second surface 120 of the glass substrate 100 may be a first bump, a second bump, or both the first bump and the second bump may be included in the bump structure 200 formed on the second surface 120, which may be controlled by the selection of raw materials and the specific manufacturing process in the manufacturing process of the substrate.

In some implementations, the raised structures 200 of the second surface 120 are each first protrusions. The first bulge is formed by glass ceramic particles, in the manufacturing process, the glass particles and the glass ceramic particles are sintered, the glass particles are liquefied into a glass phase, the glass phase wraps the glass ceramic particles, the glass ceramic particles are further crystallized into the glass ceramic particles and grow up and protrude out of the first surface to form the first bulge, and the size of the first bulge protruding out of the surface can be adjusted in an etching mode. The manufacturing method is simpler in manufacturing and forming the substrate with the frosted feeling on two sides, namely, the first surface 110 and the second surface 120 of the substrate are provided with the first protrusions, the operation is easy to realize, and the production cost is relatively lower.

The substrate provided by the embodiment comprises at least one of microcrystalline particles and ceramic particles, and glass particles together form a glass substrate, and the substrate can be subjected to post-treatment processes such as chemical strengthening and hot bending processing, so that the substrate can be better adapted to various different use scene requirements of a shell of electronic equipment. The surface of the substrate provided in this embodiment forms the micro-scale protrusion structure 200, and the micro-scale protrusion structure 200 makes the surface of the substrate not easy to wear, and the surface of the substrate presents anti-glare frosted texture, so that the substrate is applicable to be used as a housing of electronic equipment.

The embodiment also provides a method for manufacturing a substrate, which is suitable for manufacturing the substrate provided by any one of the above technical schemes. The embodiment provides a manufacturing method of a substrate, including:

Preparing first powder, wherein the first powder is glass particles;

preparing a blank body from the first powder and the second powder;

sintering the green body to form a glass substrate, wherein part of the second powder protrudes out of the first surface of the substrate to form a protruding structure.

As described above, as shown in fig. 6, the method for manufacturing the substrate may be summarized as including at least: s10, preparing powder, S20, preparing a blank body and S30, sintering.

When the second powder comprises glass ceramic particles, the liquid glass phase formed after the glass particles are melted during sintering provides sintering driving force, optical performance and hot workability for the sintering process. The microcrystalline glass particles can be used to improve the mechanical reliability of the glass phase stress body or form larger grains to form the first protrusions according to the crystallization process and the sintering temperature. As shown in fig. 7 (1), glass particles 310 and glass-ceramic particles 320 mixed together are sintered together, and glass-ceramic particles 320 include glass-ceramic particles encased in glass, the volume of which is relatively small. During sintering, the glass phase droplets are connected under the drive of surface tension, and closed pores are formed inside. As the temperature increases further, the viscosity of the glass phase decreases and the gas gradually exits to clarify. At this time, as shown in (2) of fig. 7, the high-temperature crystal phase in the glass-ceramic particles 320 has not reached the crystallization temperature, and the glass phase in the glass-ceramic particles 320 is gradually liquefied and connected with the glass phase droplets formed by the glass particles 310, thereby forming a glass-ceramic matrix. During sintering, some of the glass-ceramic particles 320 grow up and the large size of the glass-ceramic particles form the first protrusions. Further, the glass phase may also be selectively etched by utilizing the difference in corrosion resistance between the microcrystalline phase and the glass phase, so that the effect of the first protrusions formed by the microcrystalline particles described above can be amplified by acid washing, etching, or the like, that is, as shown in (3) of fig. 7, the surface of the glass substrate may be subjected to acid washing, etching, or the like, to thin the glass phase in the glass substrate to some extent, so that the size of the microcrystalline particles exposed to the glass phase is larger, that is, the size of the first protrusions protruding from the first surface is larger. That is, the glass substrate can also enhance the abrasion resistance of the raised structures in combination with surface etching techniques.

When the second frit includes ceramic particles 330, the liquid glass phase formed after the glass particles 310 are melted during sintering provides sintering driving force, optical properties, and hot workability to the sintering process. The ceramic particles 330 have a density greater than that of the glass phase, so that the ceramic particles 330 are settled to the bottom side during sintering, and the ceramic particles 330 having a larger particle diameter protrude from the glass phase, thereby forming second protrusions, and thus improving the mechanical strength and scratch resistance of the surface of the glass substrate. As shown in fig. 8 (1), during sintering, droplets of the glass phase are connected by surface tension to form closed pores inside. As the temperature increases further, the viscosity of the glass phase decreases and the gas gradually exits to clarify. Ceramic particles 330 having a melting temperature higher than that of glass particles 310 are not soluble in the glass phase nor are they significantly grown, and the liquefied glass phase wraps around the surface of ceramic particles 330 under the action of surface tension. As shown in (2) of fig. 8, sintering under a high temperature environment reduces the viscosity of the glass phase, and ceramic particles 330 having a density greater than that of the glass phase settle, so that the ceramic particles 330 all settle to the underlying region to form a concentrated layer of ceramic particles 330, and the surface of the concentrated side of ceramic particles 330 is the first surface when forming the glass substrate. Among the ceramic particles 330, a portion of the ceramic particles 330 having a larger size forms a second protrusion.

When the second powder material comprises microcrystalline glass particles and ceramic particles, compared with the microcrystalline glass crystallized in situ in the related art, in the substrate provided by the embodiment, the thermal property difference between the ceramic particles and the glass particles is larger, so that the crystallinity and the grain size of the microcrystalline glass during hot processing can be better controlled, and the processing conditions of hot bending forming and chemical strengthening are met. By utilizing the corrosion resistance difference between the microcrystalline particles and the glass phase, the first protrusion effect formed by the microcrystalline particles can be amplified by acid washing, etching and the like, that is, the surface of the glass substrate can be subjected to acid washing, etching and the like, so that the glass phase in the glass substrate can be thinned to a certain extent, and the size of the microcrystalline particles exposed out of the glass phase is larger, that is, the size of the first protrusion protruding out of the first surface is larger. That is, the glass substrate can also enhance the abrasion resistance of the raised structures in combination with surface etching techniques.

After the glass substrate is formed, the glass substrate formed after sintering can be directly used as a glass substrate, and the glass substrate can be used for manufacturing a shell. Or the post-treatment process can be added according to the appearance requirement and the reliability requirement, namely, the post-treatment can be carried out on the glass substrate formed after sintering, the post-treated glass substrate is used as a glass substrate, and the glass substrate can be used for manufacturing the shell.

In the method for manufacturing the substrate provided by the embodiment, since the protruding structure is formed on the first surface of the base material, the protruding structure is formed by the second powder, and the second powder is at least one of microcrystalline glass particles and ceramic particles, the protruding structure is microcrystalline glass particles or ceramic particles, the hardness is high, the scratch resistance is better, and therefore the anti-skidding performance of the first surface of the substrate is better.

In some embodiments, the first powder is composed of glass particles that may be prepared by a melt quenching process and a ball milling process. Illustratively, the method of preparing the first powder may include:

preparing glass slag;

Glass particles are prepared from glass frit.

The process for preparing the glass slag can be as follows: according to the difference of the volume of the components of the glass particles, melting the glass at 1000-1400 ℃ for 30-240 min, and then water quenching to form glass slag. Specifically, the temperature of the preparation process is selected to be specifically set according to the volume of the components of the glass particles. The glass particles may comprise SiO ₂、Al₂O₃、B₂O₃, alkali metal oxide and alkaline earth metal oxide in the respective proportions: alkali metal oxide is more than or equal to 5wt% and less than or equal to 20wt%;55wt% or more and ₂O₃+SiO₂+Al₂O₃ wt% or less and 75wt% or less of B and 5wt% or less and 15wt% or less of alkaline earth metal oxide. In addition, the composition of the glass particles may further include a first auxiliary raw material, the first auxiliary raw material having a ratio of not more than 5wt% in all the composition of the glass particles, and the first auxiliary raw material may include: at least one of a colorant, a clarifying agent, a fluxing agent, an oxidizing agent, and a reducing agent.

Both alkali metal oxides and alkaline earth metal oxides are metal oxides. The alkali metal oxide means an oxide formed of an alkali metal element such as sodium oxide, potassium oxide, or the like; the alkaline earth metal oxide refers to an oxide formed of an alkaline earth metal element, such as calcium oxide, magnesium oxide, and the like. Illustratively, the alkali metal oxides include Li ₂O、Na₂ O and K ₂ O, i.e., 5wt% Li ₂O+Na₂O+K₂ O20 wt%. Alkaline earth metal oxides include CaO, srO and BaO, that is, caO+SrO+BaO is 5 wt.% or less and 15 wt.% or less.

Among the components of the glass particles, siO ₂ and Al ₂O₃ are used as main components of the glass particles, so that the mechanical strength and the glass stability can be improved, and the glass has a wider processable temperature range. B ₂O₃ as a glass network former can enhance the chemical stability and scratch resistance of the glass and reduce the glass processing temperature; the alkali metal oxide can greatly reduce the melting temperature and the processing temperature of the glass and support the chemical strengthening capability of the glass; alkaline earth metal oxides can reduce glass processing temperatures and can also be used to adjust glass chemical stability, batch properties, optical basicity and refractive index.

In the first auxiliary raw material, one or more of a colorant, a clarifier, a fluxing agent, an oxidizing agent and a reducing agent can be selected according to the requirements for the glass substrate.

The process for preparing glass particles from glass slag comprises the following steps: ball milling is carried out on the glass slag to obtain glass particles with relatively smaller size, the glass particles are dried and sieved to obtain glass particles with the particle size not more than 5 mu m, and the glass particles obtained after sieving form the first powder.

In some embodiments, after sieving to obtain glass particles having a particle size no greater than 5 μm, the characteristic temperatures of the glass particles, including glass transition temperature, devitrification temperature, at which the first frit has a glass transition temperature of 450 ℃ to 700 ℃ and no significant devitrification peaks and devitrification phenomena in the range of 600 ℃ to 1000 ℃, can be tested by a calorimetric scanner (DSC, differential Scanning Calorimetry). The glass particles meeting the above characteristic temperature requirement are the first powder for standby.

When the second powder comprises glass ceramics particles, the glass ceramics particles can be prepared by a melting quenching method and a ball milling method. The preparation process of the microcrystalline glass particles can be as follows:

preparing microcrystalline glass slag;

And preparing microcrystalline glass particles by using microcrystalline glass residues.

Illustratively, the process for preparing the glass frit may be: according to the difference of the component mass of the microcrystalline glass particles, melting the glass at 1000-1400 ℃ for 30-120 min, and then water quenching to form glass slag. The devitrified glass slag is required to be subjected to devitrification treatment to obtain microcrystalline glass slag. The crystallization process can be a one-step crystallization method and a two-step crystallization method, and the crystallization temperature and time are controlled to control the crystal phase types of the precipitated microcrystalline particles, the number of the microcrystalline particles and the crystallinity. Since different crystals exist in the microcrystalline glass particles, the different crystals can grow to form microcrystalline particles at the corresponding temperature, the crystals which grow relatively faster at the temperature can grow to form microcrystalline particles by controlling the temperature, the corresponding crystal phase of the crystals is the main crystal phase, and the quantity and crystallinity of the microcrystalline particles are controlled by controlling the time of the growth of the crystals at the temperature. At the same temperature, a plurality of crystal phases are generated, and one of the largest crystal phases is the main crystal phase. After the temperature is adjusted, the types of the crystal phases and the number of the same crystal phases are changed, so that the main crystal phase is changed. I.e. the kind of main crystal phase is changed by changing the temperature. The difference in crystalline phases has a significant impact on the properties of the glass-ceramic particles. The microcrystalline glass particles are composite materials of crystals and glass bodies, and the performance of the microcrystalline glass particles is determined by the properties and the quantity proportion of the crystals and the glass bodies. The crystalline phase may affect the physical properties of hardness, strength, thermal stability, etc. of the first protrusions formed by the microcrystalline particles. Therefore, by controlling the kind and the number of the crystal phases by temperature and time, the performance of the first protrusions formed by the microcrystalline particles can be effectively controlled.

The microcrystalline glass particles can comprise SiO ₂、Al₂O₃、B₂O₃ and alkaline earth metal oxide, wherein the percentages of the components are as follows: b ₂O₃+SiO₂+Al₂O₃ -80 wt% and 55 wt%; alkaline earth metal oxide is more than or equal to 10wt% and less than or equal to 20wt%. Illustratively, the alkaline earth metal oxides include CaO, srO, and BaO, that is, 10 wt.% or less CaO+SrO+BaO or less 20 wt.%.

In some embodiments, the composition of the glass-ceramic particles may also include an alkali oxide, the alkali oxide being 15 wt.% or less, and illustratively, the alkali oxide including Li ₂O、Na₂ O and K ₂ O, i.e., li ₂O+Na₂O+K₂ O20 wt.% or less.

In some embodiments, the composition of the glass-ceramic particles may also include ZnO, which is 15 wt.% or less. ZnO can be used to adjust the density, refractive index, acid and alkali resistance and crystallization properties of the glass.

In some embodiments, the composition of the glass-ceramic particles may further include a nucleating agent and a first auxiliary raw material, the nucleating agent having a proportion of less than or equal to 10wt% in the glass-ceramic particles, the first auxiliary raw material having a proportion of no more than 5wt% in the composition of all the glass-ceramic particles, the first auxiliary raw material may include: at least one of a colorant, a clarifying agent, a fluxing agent, an oxidizing agent, and a reducing agent. The nucleating agent is a functional chemical auxiliary agent, can be used for adjusting the crystallization phase, the number of crystal nuclei, the crystal grain size and the crystallization mode of microcrystalline glass particles, and can be P ₂O₅、ZrO₂, tiO ₂ and the like.

In the components of the microcrystalline glass particles, siO ₂ and Al ₂O₃ are used as main components of the microcrystalline glass particles, so that the mechanical strength and the stability of the microcrystalline glass can be improved, and the microcrystalline glass has a wider processable temperature range. B ₂O₃ as a microcrystalline glass network forming body can enhance the chemical stability and scratch resistance of microcrystalline glass and reduce the processing temperature of the microcrystalline glass; the alkali metal oxide can greatly reduce the melting temperature and the processing temperature of the glass ceramics and support the chemical strengthening capability of the glass ceramics; the alkaline earth metal oxide can reduce the processing temperature of the glass ceramics, and can also be used for adjusting the chemical stability, the material property, the optical alkalinity and the refractive index of the glass ceramics.

In some implementations, the glass-ceramic particles further include a first auxiliary raw material, the first auxiliary raw material having a ratio of less than or equal to 5wt% in the glass-ceramic particles, the first auxiliary raw material including at least one of a colorant, a fining agent, a fluxing agent, an oxidizing agent, and a reducing agent. In the first auxiliary raw material, one or more of a colorant, a clarifying agent, a fluxing agent, an oxidizing agent and a reducing agent can be selected according to the requirements of the microcrystalline glass substrate.

In some embodiments, the crystalline phase of the glass-ceramic particles is one or more of cordierite, spinel, olivine, diopside, petalite, spodumene, eucryptite, lithium silicate, and a solid solution of quartz.

The microcrystalline particles separated out from the microcrystalline glass slag can be divided into small-sized first grains and large-sized second grains, wherein the average grain size of the first grains is 1-80 nm, and the average grain size of the second grains is 10-20 mu m. In the glass substrate prepared by adopting the microcrystalline glass particles comprising the first crystal grains and the second crystal grains, the first crystal grains have smaller size, play a role in dispersion toughening, can remarkably improve the overall fracture toughness of the glass substrate, and can not remarkably influence the optical performance of the glass substrate. In addition, if desired, the first grains can grow to form second grains during subsequent hot working and sintering, thereby increasing the number of second grains, i.e., the ratio of the first grains to the second grains can be adjusted by hot working and sintering. The second crystal grains can provide micron-sized protrusions for the surface of the base material, and the effect of protecting the base material from abrasion and scratch is achieved.

The process for preparing the microcrystalline glass particles by the microcrystalline glass residues comprises the following steps: and ball milling the microcrystalline glass slag to obtain microcrystalline glass particles with relatively smaller size, drying the microcrystalline glass particles, sieving to obtain microcrystalline glass particles with the particle size of 5-100 mu m, and forming the second powder or forming part of the second powder by the microcrystalline glass particles obtained after sieving.

In some embodiments, after sieving to obtain glass-ceramic particles having a particle size of 5 μm to 100 μm, the characteristic temperature of the glass-ceramic particles, including glass-ceramic transition temperature and crystallization temperature, at a glass-ceramic transition temperature of 650 ℃ to 850 ℃ and crystallization temperature of 900 ℃ to 1400 ℃ of the second powder, can be measured by a calorimetric scanner. And the microcrystalline glass particles meeting the requirement of the characteristic temperature are the second powder for standby.

When the second powder includes ceramic particles, the ceramic particles may be prepared by:

Preparing a ceramic precursor;

ceramic particles are prepared from a ceramic precursor.

The preparation method of the ceramic precursor comprises the steps of uniformly mixing a plurality of raw materials according to the component proportion, and grinding and sintering the mixed raw materials at high temperature to form the ceramic precursor. In some embodiments, the ceramic precursor may also be formed by sol-gel and chemical deposition methods.

The method of preparing ceramic particles from a ceramic precursor may include: the ceramic precursor is ball-milled to obtain ceramic particles with relatively smaller size, the ceramic particles are dried and sieved to obtain ceramic particles with the particle size of 10-150 mu m, and the ceramic particles obtained after sieving form the second powder or form part of the second powder.

The characteristic temperature of the ceramic particles, including the melting temperature of the ceramic particles, i.e. the melting temperature of the ceramic particles, can be measured by a calorimetric scanner.

In some embodiments, the melting temperature of the ceramic particles is at least 500 ℃ greater than the melting temperature of the glass particles. So configured, when the melting temperature of the glass particles is reached, the melting temperature of the ceramic particles is not reached, thereby causing the ceramic particles to be embedded in the glass substrate formed of the glass particles and to remain in a particulate state, so that the ceramic particles are finally used to form the second protrusions.

Illustratively, the ceramic particles have a melting temperature of 1400 ℃ or greater, and within the temperature range of the melting temperature, the erosion effect of the ceramic phase formed by the ceramic particles by the glass droplets formed by the glass particles during the subsequent sintering process is conveniently controlled so that the ceramic particles remain more completely within the glass phase for final use in forming the second protrusions.

In some embodiments, the ceramic particles have a mohs hardness of greater than or equal to 7.5, which is relatively greater, and the second protrusions are made harder as the ceramic particles eventually form the second protrusions protruding from the first surface, which may further enhance the wear resistance of the first surface.

In some embodiments, the surface of the ceramic particles can infiltrate the glass droplets, which can reduce the porosity of the sintered glass substrate. The ceramic particles may be treated to increase the wettability of the ceramic particles with respect to the glass droplets by a wettability treatment process. Illustratively, when the primary crystal phase of the ceramic particles is silicon carbide, the wettability treatment process for the ceramic particles includes pre-oxidizing the ceramic particles at a high temperature to form a silicon oxide film layer on the surfaces of the silicon carbide particles. When the main crystal phase of the ceramic particles is silicon nitride, the wettability treatment process for the ceramic particles includes coating the surface of the ceramic particles with silane to coat the surface of the silicon nitride with silane. When the primary crystal phase of the ceramic particles is aluminum nitride, the wettability treatment process for the ceramic particles includes coating the surface of the ceramic particles with silane to coat the surface of the aluminum nitride with silane. As shown in fig. 9, fig. 9 is a cross-sectional view of the green body after sintering, and it can be seen that the ceramic particles exist in the glass phase in the circled region, and that the ceramic particles have good wettability with the glass phase and no voids exist.

When the second powder comprises ceramic particles and glass ceramics particles, the ceramic particles and the glass ceramics particles are respectively prepared, and then the ceramic particles and the glass ceramics particles are mixed according to a set proportion to form the second powder. The mixing setting ratio of the ceramic particles and the glass ceramics particles can be determined by referring to the ratio of the glass particles, the glass ceramics particles and the ceramic particles in the mixed powder formed by the first powder and the second powder.

After the preparation of the first powder and the second powder is completed, the preparation of the embryo is performed.

In some implementations, the process of preparing the embryo body includes:

Specifically, in one embodiment, the mixture body includes a first powder and a second powder, the first powder is glass particles, the second powder is glass ceramic particles, and the second powder does not contain ceramic particles. In the preparation process of the mixture, glass particles and microcrystalline glass particles are uniformly mixed together according to a set proportion, so that mixed powder is formed. The glass particles account for 20 to 80 weight percent of the mixture, and the glass-ceramic particles account for 20 to 80 weight percent of the mixture. Illustratively, if the glass particles are 20wt% and the glass-ceramic particles are 80wt%, the glass particles and the glass-ceramic particles are uniformly mixed in a ratio of 1:4 to obtain a mixed material. In another example, the glass particles are 50wt% and the glass-ceramic particles are 50wt%, and the glass particles and the glass-ceramic particles are uniformly mixed in a ratio of 1:1 to obtain a mixture. In yet another example, the glass particles are 80wt% and the glass-ceramic particles are 20wt%, and the glass particles and glass-ceramic particles are uniformly mixed in a ratio of 4:1 to obtain a mixed material body.

In another embodiment, the mixture comprises a first powder and a second powder, wherein the first powder is glass particles, the second powder is ceramic particles, and the second powder does not contain microcrystalline glass particles. In the preparation process of the mixture, glass particles and ceramic particles are uniformly mixed together according to a set proportion, so that mixed powder is formed. The glass particles account for 20 to 80 weight percent of the mixture body, and the ceramic particles account for 20 to 80 weight percent of the mixture body. Illustratively, if the glass particles are 20wt% and the ceramic particles are 80wt%, the glass particles and the ceramic particles are uniformly mixed in a ratio of 1:4 to obtain a mixture body. In another example, the glass particles are 50wt% and the ceramic particles are 50wt%, and the glass particles and the ceramic particles are uniformly mixed in a ratio of 1:1 to obtain a mixture body. In yet another example, where the glass particles are 60wt% and the ceramic particles are 40wt%, a mixture may be obtained by uniformly mixing the glass particles and the ceramic particles in a ratio of 3:2. In another example, the glass particles are 80wt% and the ceramic particles are 20wt%, and the glass particles and the ceramic particles are uniformly mixed in a ratio of 4:1 to obtain a mixture body.

In another embodiment, the mixture comprises a first powder and a second powder, wherein the first powder is glass particles, and the second powder comprises ceramic particles and glass ceramic particles. The glass particles account for 20 to 80 weight percent of the mixture, the glass ceramic particles account for less than 80 weight percent of the mixture, and the ceramic particles account for less than 60 weight percent of the mixture. That is, 20wt% or less and 80wt% or less of glass particles, 0wt% or less and 80wt% or less of microcrystalline glass particles, and 0wt% or less and 60wt% or less of ceramic particles.

Illustratively, when the glass particles are 20wt%, the glass ceramic particles are 60wt% and the ceramic particles are 20wt%, the glass particles, the glass ceramic particles and the ceramic particles are uniformly mixed in a ratio of 1:3:1 to obtain a mixture body. In another example, the glass particles are 50wt%, the glass ceramics particles are 25wt% and the ceramic particles are 25wt%, and the glass particles, the glass ceramics particles and the ceramic particles are uniformly mixed in a ratio of 2:1:1 to obtain a mixture body. In yet another example, the glass particles are 80wt%, the glass-ceramic particles are 10wt%, and the glass particles, the glass-ceramic particles, and the ceramic particles are uniformly mixed in a ratio of 8:1:1 to obtain a mixture.

It should be noted that, in the preparation process of the mixture body, the first powder and the second powder may be uniformly mixed by using methods such as grinding and mixing, stirring and mixing, suspension dispersion and mixing, and the like.

Depending on the pelletization requirements of the shaping process, binders may also be added to the mixture. Illustratively, in some implementations, the mixture body further includes a binder, the binder comprising less than 30wt% of the mass of the mixture body. That is, 0wt% of the adhesive is less than or equal to 30wt%.

In the process of preparing the embryo body by the mixture, the embryo body can be specifically a powder embryo or a raw porcelain tape. Illustratively, the mixture may be placed in a mold such that the mixture is closely packed under a set pressure to reduce the inter-particle gaps in the mixture, and the compacted mixture forms a powder compact. When the mixture body comprises an adhesive, the raw porcelain tape with the thickness of 0.5-8 mm can be obtained through tape casting molding after granulation under the auxiliary adhesive action of the adhesive.

After the green body is prepared, the green body and a die in which the green body is positioned are sent into an appliance for sintering to carry out sintering treatment. That is, during sintering, the green body is located in the mold, the mold has at least one flat surface, and the side of the green body contacting the flat surface is the first surface.

In the sintering process, the glass particles are melted into a liquid glass phase with certain viscosity due to the lowest melting temperature of the glass particles, and the glass particles and the ceramic particles are still in solid particles when the glass particles are melted due to the fact that the melting temperature of the glass particles is higher than that of the glass particles, and the glass particles and the ceramic particles are wrapped in the glass phase. The microscopic processes of the sintering process can be classified into three modes of solid phase sintering, grain rearrangement and dissolution precipitation. Solid phase sintering is mainly present between crystal grains with high melting temperature, grain rearrangement is mainly driven by wetting effect and surface energy of the glass phase, and dissolution precipitation mainly occurs between the glass phase and the grains. The sintering process in the green body is mainly dominated by the viscous flow of the low viscosity glass phase and the sintering process is mainly dominated by the grain rearrangement process. The growth of crystal grains and interface reaction in the dissolution and precipitation process can be controlled by adjusting the components and the proportion of the components in the glass particles and adjusting the sintering temperature.

It should be noted that, when the second powder is glass ceramic particles, that is, when the mixture includes glass particles and glass ceramic particles, but does not include ceramic particles, the sintering may be performed at a low temperature or at a high temperature. The sintering temperature can be 600-1200 ℃. The temperature can be selected according to the ratio of the first powder to the second powder in the mixture. In some embodiments, sintering is specifically a low temperature sintering, such as 600 ℃, 650 ℃, 700 ℃, and the like. In the low-temperature sintering process, the energy consumption is relatively low, and the cost is relatively low. When the second powder comprises ceramic particles, i.e. the mixture comprises ceramic particles, sintering may be performed at a high temperature, e.g. 780 ℃, 1050 ℃, 1200 ℃, etc.

The sintering process can be maintained for 2-12 hours, so that the mixture forms a high-density glass substrate.

When the mixture body comprises an adhesive, the blank body is specifically a ceramic tape, and in this case, the blank body can be subjected to heat preservation, preheating and glue discharging, and specifically, the blank body is kept at the temperature of 400-600 ℃ for a set time. The preheated green body is subjected to formal sintering, for example, the green body can be kept at 600-1200 ℃ for 2-12 hours until the green body is completely densified. Illustratively, the densified glass substrate can have a thickness of 0.3mm to 5mm.

The manufacturing method of the substrate is used for manufacturing the substrate, in the manufacturing process of the substrate, the fluidity of a glass phase is fully utilized, the loss of the glass phase caused by interface reaction is avoided to a certain extent through the component design of a mixture body, the grain rearrangement efficiency in the sintering process is greatly improved, and finally the high-density substrate is obtained. Compared with a ceramic substrate manufactured by a low-temperature co-fired ceramic mode in the related art, the substrate manufactured by the manufacturing method of the substrate provided by the embodiment can be subjected to post-treatment processes such as chemical strengthening and hot bending processing, so that the substrate can better adapt to various different use scene requirements of a shell of electronic equipment. Compared with the processing mode of forming the strengthening layer by surface processing on the surface of the glass substrate in the related art, the manufacturing method of the substrate provided by the embodiment realizes the regulation and control of the size of the microcrystal particles through temperature control, so that the surface of the manufactured substrate forms a micron-sized protruding structure, and a substrate which is not easy to wear and has anti-glare frosted texture is formed, thereby being applicable to the decorating layer serving as a shell of electronic equipment.

In the following, ten specific cases are provided to further explain the specific procedure of the substrate manufacturing method provided in this embodiment.

Table 1 shows the detailed process parameters and performance parameters for cases 1-4, table 2 shows the detailed process parameters and performance parameters for cases 5-7, and table 3 shows the detailed process parameters and performance parameters for cases 8-10.

Table 1:

As can be seen from table 1 shown above, in cases 1 to 4, the first frit included glass particles, and the second frit included ceramic particles, and not microcrystalline glass particles. In case 1, the ratio of glass particles to ceramic particles was 4:1, in cases 2 to 4, the ratio of glass particles to ceramic particles was 1:1. glass particles and ceramic particles were prepared according to the respective component ratios in table 1, and illustratively, in the glass particles, the SiO ₂ component was 42wt%, the Al ₂O₃ component was 3wt%, the B ₂O₃ component was 25wt%, the Na ₂ O component was 19wt%, the K ₂ O component was 1wt%, the alkaline earth oxide component was 10wt%, and the alkaline earth oxides included CaO, srO, and BaO.

In the manufacturing process of cases 1 to 4, first, the first powder and the second powder were prepared by installing the component ratios in table 1, and the first powder and the second powder were uniformly mixed in accordance with the glass to ceramic ratios in table 1, thereby obtaining a mixed powder. Pouring the mixed powder into a mould for flattening, wherein the mould can be a graphite mould. The mixed powder is compacted under an auxiliary pressure of 10MPa, and then the die containing the mixed powder is placed into a muffle furnace to be sintered at a corresponding temperature (780 ℃). And (3) transferring the sintered glass substrate into an environment with the temperature of 450 ℃ for heat preservation for 2 hours for annealing so as to reduce microcracks in the glass substrate. The glass substrate obtained after annealing has a convex structure on one side, and the convex structure comprises a second convex structure formed by ceramic particles.

Taking case 1 as an example, the sintered glass substrate was subjected to a cross-section analysis, and the main crystal phase Al ₂O₃ of the ceramic particles well infiltrated with the glass matrix and still exist in the form of grains.

Table 2:

As is clear from table 2 shown above, in case examples 5 to 7, the first frit included glass particles, and the second frit included glass-ceramic particles, but not ceramic particles. In cases 5 to 7, the ratio of glass particles to glass-ceramic particles was 1:1. Glass particles and ceramic particles were prepared according to the respective component ratios in table 2, and illustratively, in the glass particles, the SiO ₂ component was 42wt%, the Al ₂O₃ component was 3wt%, the B ₂O₃ component was 25wt%, the Na ₂ O component was 19wt%, the K ₂ O component was 1wt%, the alkaline earth oxide component was 10wt%, and the alkaline earth oxides included CaO, srO, and BaO.

In the manufacturing process of cases 5 to 7, first, the first powder and the second powder were prepared by installing the component ratios in table 2, and the first powder and the second powder were uniformly mixed in accordance with the glass to glass ceramics ratio in table 1, thereby obtaining a mixed powder. Pouring the mixed powder into a mould for flattening, wherein the mould can be a graphite mould. Compacting the mixed powder under the auxiliary pressure of 10MPa, and then placing a die containing the mixed powder into a muffle furnace to sinter at the corresponding temperature (760 ℃). And (3) transferring the sintered glass substrate into an environment with the temperature of 450 ℃ for heat preservation for 2 hours for annealing so as to reduce microcracks in the glass substrate. And soaking the glass substrate obtained after annealing in etching liquid for 4 hours to finally obtain the glass substrate with the first protrusions on the first surface and the second surface.

As can be seen from table 3 shown below, in cases 8 to 10, the first frit included glass particles, and the second frit included glass-ceramic particles. In cases 8 to 10, the ratio of glass particles, glass ceramics particles, and ceramic particles was 1:1:1. glass particles, glass ceramic particles and ceramic particles were prepared according to the respective component ratios in 3, and illustratively, in the glass particles, the component of SiO ₂ was 42wt%, the component of Al ₂O₃ was 3wt%, the component of B ₂O₃ was 25wt%, the component of Na ₂ O was 19wt%, the component of K ₂ O was 1wt%, the component of alkaline earth oxide was 10wt%, and the alkaline earth oxides included CaO, srO and BaO.

In the manufacturing process of cases 8 to 10, glass particles, glass ceramics particles and ceramic glass particles were first prepared by installing the component ratios in table 3, and glass particles, glass ceramics particles and ceramic glass particles were uniformly mixed in accordance with the ratios (1:1:1) of glass, glass ceramics and ceramic in table 1, thereby obtaining a mixed powder. Pouring the mixed powder into a mould for flattening, wherein the mould can be a graphite mould. Compacting the mixed powder under the auxiliary pressure of 10MPa, and then placing a die containing the mixed powder into a muffle furnace to sinter at the corresponding temperature (760 ℃). And (3) transferring the sintered glass substrate into an environment with the temperature of 450 ℃ for heat preservation for 2 hours for annealing so as to reduce microcracks in the glass substrate. And soaking the glass substrate obtained after annealing in etching solution for 4 hours to finally obtain the glass substrate with the convex structures on the first surface and the second surface, wherein the convex structures comprise the first bulges and the second bulges on the first surface, and the convex structures comprise the first bulges on the second surface.

Table 3:

as shown in fig. 10, this embodiment also provides a method for manufacturing a housing, where the housing includes the substrate provided in any one of the embodiments, so that the method for manufacturing a housing includes the method for manufacturing a substrate described above, and the method for manufacturing a substrate is not described herein again. The housing may be applied to electronic devices, and in addition, the housing may be applied to other structures, such as biomedical devices, tableware cookware, daily decorations, and the like.

In some implementations, the method of manufacturing a housing further includes performing an S40 post-processing step on the substrate. The post-processing includes at least one of CNC (Computer Numerical Control, computer numerical control machine) cold engraving, hot bending processing, polishing, chemical strengthening, laser engraving, surface etching, and surface coating.

CNC cold engraving is a precision machining mode, and is mainly performed by a computer numerical control automatic machine tool. The technology can directly use CNC to carry out fine engraving, dig the inside of the planar glass, and enable the outside to form radian.

The thermal bending process is to heat a flat plate-shaped substrate to soften the substrate, place the softened substrate on a mold of a curved form, deform the flat plate-shaped substrate by gravity deformation or pressurization to a curved shape corresponding to the mold shape, and after cooling, shape the substrate in the curved shape. The substrate may be processed into a 3D-shaped glass substrate by a hot bending process. In the related art, if a pure glass-ceramic plate is subjected to hot bending, a severe crystallization phenomenon occurs in the glass-ceramic plate during the hot bending, so that the glass phase in the glass-ceramic peeling force plate is rapidly consumed, and the glass-ceramic plate cannot be subjected to hot bending, that is, cannot be subjected to hot bending. In the substrate with the first bump provided in this embodiment, the main body of the substrate is a glass phase, and the microcrystalline glass phase is only a small portion for forming the first bump. Therefore, the substrate provided by the embodiment has relatively high thermal stability, and can effectively avoid severe crystallization phenomenon and complete loss of the glass phase, thereby supporting hot bending processing.

Polishing is by reducing the roughness of the surface of the workpiece to obtain a relatively smoother surface. After the substrate is formed by sintering, the plurality of raised structures formed on the first surface of the substrate are different in size and protruding from the first surface, and the largest size of the plurality of raised structures protruding from the first surface can be controlled within a threshold range by polishing, so that the touch feeling of the substrate is improved. In addition, other surfaces except the first surface of the outer surface of the substrate can be polished so that the other surfaces are smoother and flatter.

The chemical strengthening is to prevent the substrate from being in the strengthening solution, so that ions on the surface of the substrate are exchanged with ions in the solution, a strengthening layer is formed on the surface of the substrate, and in the process of ion exchange, compressive stress is generated due to volume change, so that tensile stress layers are formed on the two surfaces and the inside of the substrate, and the structural strength of the substrate is improved. The substrate has better chemically strengthened physical conditions after sodium ions and lithium ions are introduced into the glass phase of the substrate in a certain proportion. In the case that the first surface of the substrate has the second protrusions formed by the ceramic particles, a better chemical strengthening effect of controlling the shape and size can be achieved by coating a protective layer on the outer side of the first surface, distributing strengthening and controlling the thermal stress of the crystalline phase.

Laser engraving is a manufacturing process that uses numerical control techniques and lasers as the processing medium. The laser engraving can be used for engraving characters or patterns on the surface of the substrate, such as engraving characters or patterns of product numbers, trademarks and the like on the surface of the substrate, and engraving the characters or patterns on the surface of the substrate to improve the aesthetic degree of the substrate or meet the personalized customization demands of customers.

And the surface etching can utilize the difference of acid and alkali resistance of the glass phase and other different crystal phases (the crystal phase of the microcrystalline glass particles or the crystal phase of the ceramic particles), and expose more other crystal phases in a mode of etching the glass phase on the surface so that the size of the protruding structure exposed out of the first surface is larger, thereby enhancing the roughness and frosted texture of the first surface.

Surface coating is a process of coating one or more thin films on the surface of a substrate. The surface of the substrate is coated with a film, which has a certain protection effect on the surface of the substrate, or the function of the substrate is added, for example, the self-cleaning film is added on the surface of the substrate, so that the surface of the substrate is not easy to be stained with dirt. The self-cleaning film can be a self-cleaning super-hydrophilic glass film, a titanium dioxide film and the like.

The case may be manufactured only from a substrate, and in the manufacturing method of the case, cutting processing for the substrate may be included.

The housing may comprise other structural members in addition to the substrate, and the method of manufacturing the housing may further comprise the step of assembling the substrate with the other structural members. The housing may further comprise a frame, and the substrate is mounted in the frame, and the method of manufacturing the housing may further comprise a step of connecting the substrate to the frame. In another example, the case further includes a bottom plate, the substrate is disposed on one side of the bottom plate, and the substrate is used as a decorative layer of the case, and the method for manufacturing the case further includes a step of connecting the substrate to the bottom plate.

The embodiment also provides a shell, and the substrate provided by any one of the embodiments is applied. The housing may be applied to electronic devices, and in addition, the housing may be applied to other structures, such as biomedical devices, tableware cookware, daily decorations, and the like.

Since the housing includes the substrate, at least the substrate has all the beneficial effects, and will not be described herein.

The embodiment provides electronic equipment, which comprises the shell provided by the technical scheme.

The electronic device may be an electronic product or a component with a housing, such as electronic paper, a mobile phone, a tablet computer, a television, a smart bracelet, a smart watch, a display, a notebook computer, and an electronic photo frame, which is not limited in this embodiment.

As shown in fig. 11, in an electronic device 400 according to an embodiment of the present application, the electronic device 400 may include a display 430, a battery 420, and a housing, where the housing may be provided as or part of the housing of the electronic device. For example, the housing includes a middle frame 412 and a battery cover 411, and the substrate is used for manufacturing the battery cover 411, that is, the battery cover 411 includes a substrate, and the first surface 110 of the substrate is a side surface of the battery cover back 411 away from the battery 420, or the first surface 110 of the substrate is a side surface of the battery cover 411 facing outwards. The middle frame 412 is connected with the battery cover 411, the display screen 430 is mounted on the middle frame 412, the display area of the display screen 430 faces away from the battery cover 411, and the battery 420 is located between the display screen 430 and the battery cover 411.

According to the electronic equipment provided by the embodiment of the application, the shell of the electronic equipment adopts the substrate, the surface of the substrate is provided with the micron-sized protruding structure 200, and the hardness of the protruding structure 200 is relatively high, so that the scratch resistance of the shell of the electronic equipment is better.

It should be noted that, since the housing provided in the above embodiment includes the substrate, the manufacturing method of the substrate is included in the manufacturing method of the housing. Since the electronic device provided in the above embodiment includes the housing, at least the manufacturing method of the substrate is included in the manufacturing method of the electronic device.

The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.

Claims

1. A substrate, comprising: the glass substrate comprises a first surface, a plurality of protruding structures are arranged on the first surface in a protruding mode, the size of the protruding structures protruding out of the first surface is smaller than or equal to 100 microns, the protruding structures comprise at least one of first protrusions and second protrusions, the first protrusions are formed by microcrystalline particles, and the second protrusions are formed by ceramic particles.

2. The substrate of claim 1, wherein at least a portion of the raised structures protrude above the first surface by a dimension of 5 μm or more.

3. The substrate of claim 2, wherein at least a portion of the raised structures protrude from the first surface by a dimension of 20 μm to 50 μm.

4. The substrate of claim 1, wherein the glass substrate comprises a second surface disposed opposite the first surface, the second surface being convexly provided with a plurality of the raised structures.

5. The substrate of claim 4, wherein the bump structure of the second surface is the first bump.

6. A method of manufacturing a substrate, suitable for manufacturing a substrate according to any one of claims 1-5, comprising:

preparing first powder, wherein the first powder is glass particles;

Preparing a blank body through the first powder and the second powder;

And sintering the blank to form a glass substrate, wherein part of the second powder protrudes out of the first surface of the substrate to form a protruding structure.

7. The method of claim 6, wherein the process of preparing the embryo body comprises:

Preparing a mixture body, wherein the mixture body comprises the first powder and the second powder, the first powder accounts for 20-80 wt% of the mixture body, the second powder comprises one of microcrystalline glass particles and ceramic particles, and the second powder accounts for 20-80 wt% of the mixture body.

8. The method of claim 6, wherein the process of preparing the embryo body comprises:

Preparing a mixture body, wherein the mixture body comprises the first powder and the second powder, the first powder accounts for 20wt% -80wt% of the mixture body, the second powder comprises microcrystalline glass particles and ceramic particles, the microcrystalline glass particles account for less than 80wt% of the mixture body, and the ceramic particles account for less than 60deg.C.

9. The method of claim 7 or 8, wherein the mixture further comprises a binder, the binder comprising less than 30wt% of the mixture.

10. The method of claim 6, wherein the glass particles have a particle size of less than or equal to 5 μm.

11. The method of claim 6, wherein the glass particles comprise SiO ₂、Al₂O₃、B₂O₃, alkali metal oxide, and alkaline earth metal oxide, wherein 5 wt.% or less alkali metal oxide or less than 20 wt.%; 55wt% or more and ₂O₃+SiO₂+Al₂O₃ wt% or less and 75wt% or less of B and 5wt% or less and 15wt% or less of alkaline earth metal oxide.

12. The method of claim 11, wherein the glass particles further comprise a first auxiliary raw material, the first auxiliary raw material being less than or equal to 5wt%; the first auxiliary raw material may include: at least one of a colorant, a clarifying agent, a fluxing agent, an oxidizing agent, and a reducing agent.

13. The method of claim 6, wherein the glass particles have a glass transition temperature of 450 ℃ to 700 ℃.

14. The method of claim 6, wherein when the second frit comprises glass-ceramic particles, the crystalline phase of the glass-ceramic particles is one or more of cordierite, spinel, olivine, diopside, petalite, spodumene, eucryptite, lithium silicate, and a solid solution of quartz.

15. The method of claim 6, wherein when the second powder comprises glass-ceramic particles, the glass-ceramic particles comprise SiO ₂、Al₂O₃、B₂O₃ and alkaline earth metal oxide, wherein 55 wt.% is less than or equal to

B ₂O₃+SiO₂+Al₂O₃ is less than or equal to 80wt%; alkaline earth metal oxide is more than or equal to 10wt% and less than or equal to 20wt%.

16. The method of claim 15, wherein the glass-ceramic particles further comprise ZnO at less than or equal to 15wt%.

17. The method of claim 15, wherein the glass-ceramic particles further comprise an alkali oxide, the alkali oxide comprising less than or equal to 15wt% of the glass-ceramic particles.

18. The method of claim 15, wherein the glass-ceramic particles further comprise a nucleating agent and a first auxiliary raw material, the nucleating agent comprising less than or equal to 10wt% of the glass-ceramic particles, the first auxiliary raw material comprising less than or equal to 5wt% of the glass-ceramic particles, the first auxiliary raw material comprising at least one of a colorant, a fining agent, a fluxing agent, an oxidizing agent, and a reducing agent.

19. The method of claim 6, wherein when the second powder comprises glass-ceramic particles, the glass-ceramic particles have a particle size of 5 μm to 100 μm.

20. The method of claim 6, wherein when the second frit comprises glass-ceramic particles, the preparing of the second frit comprises a crystallization process in which the glass-ceramic particles precipitate glass-ceramic particles, the glass-ceramic particles comprise one or both of first grains having an average grain size of 1nm to 80nm and second grains having an average grain size of 10 μm to 20 μm.

21. The method of claim 6, wherein when the second powder comprises ceramic particles, the ceramic particles have a particle size of 10 μm to 150 μm.

22. The method of claim 6, wherein when the second powder comprises ceramic particles, the ceramic particles have a predominant crystal phase of at least one of alumina, zirconia, cordierite, spinel, silicon carbide, silicon nitride, and aluminum nitride.

23. The method of claim 6, wherein when the second frit comprises ceramic particles, the ceramic particles have a melting temperature at least 500 ℃ higher than the melting temperature of the glass particles.

24. The method of claim 6, wherein when the second powder comprises ceramic particles, the ceramic particles have a melting temperature of 1400 ℃ or greater.

25. The method of claim 6, wherein when the second powder comprises ceramic particles, the ceramic particles have a mohs hardness of greater than or equal to 7.5.

26. The method of claim 6, wherein when the second frit comprises ceramic particles, preparing the second frit further comprises: and carrying out wettability treatment on the ceramic particles.

27. A method of manufacturing a housing comprising the method of manufacturing a substrate according to any one of claims 6 to 26.

28. The method of claim 27, wherein the method further comprises:

And carrying out post-treatment on the substrate, wherein the post-treatment comprises at least one of CNC cold engraving, hot bending processing, polishing, chemical strengthening, laser engraving, surface etching and surface coating.

29. A housing comprising a substrate according to any one of claims 1-5.

30. An electronic device comprising the housing of claim 29.