CN118382219A - Manufacturing method of PCB with outline border circuit pattern - Google Patents
Manufacturing method of PCB with outline border circuit pattern Download PDFInfo
- Publication number
- CN118382219A CN118382219A CN202410547100.XA CN202410547100A CN118382219A CN 118382219 A CN118382219 A CN 118382219A CN 202410547100 A CN202410547100 A CN 202410547100A CN 118382219 A CN118382219 A CN 118382219A
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- CN
- China
- Prior art keywords
- copper
- layer
- clad plate
- groove
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000010410 layer Substances 0.000 claims abstract description 139
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229910052802 copper Inorganic materials 0.000 claims abstract description 50
- 239000010949 copper Substances 0.000 claims abstract description 50
- 238000007747 plating Methods 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000005530 etching Methods 0.000 claims abstract description 12
- 239000011241 protective layer Substances 0.000 claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000000151 deposition Methods 0.000 claims abstract description 4
- 238000004381 surface treatment Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 51
- 238000003698 laser cutting Methods 0.000 claims description 4
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical group [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 3
- 238000013461 design Methods 0.000 description 6
- 238000003801 milling Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention provides a method for manufacturing a PCB board with a contour edge circuit pattern, which comprises the following steps: s1, forming a groove on the outline edge of a copper-clad plate; s2, copper plating is carried out on the outer edge of the copper-clad plate and the inner wall of the groove to form a first copper plating layer; s3, etching outer circuit patterns on the top surface and the bottom surface of the outer surface of the copper-clad plate, preparing a first outer circuit layer on the top surface of the copper-clad plate, preparing a second outer circuit layer on the bottom surface of the copper-clad plate, and coating solder resist ink layers on the corresponding positions of the first outer circuit layer and the second outer circuit layer; s4, synchronously depositing a metal protective layer on the surface of the outline edge of the copper-clad plate and the surface of the inner wall of the groove; s5, performing surface treatment on the metal protective layer to form a hollowed-out pattern, so that the copper surface pattern of the first copper plating layer is exposed at the hollowed-out pattern; and S6, etching the outline edge of the copper-clad plate, and removing the copper surface on the first copper-clad layer exposed at the hollowed-out pattern to obtain the circuit board with the outline edge circuit pattern.
Description
Technical Field
The invention relates to the field of manufacturing methods of PCB boards, in particular to a manufacturing method of a PCB board with an outline side circuit pattern.
Background
Along with the coming of the 5G age, the electronic products gradually develop towards light, thin and small trend, and the PCB which is one of important essential components of the electronic products also becomes light, thin and small along with the size reduction of the electronic products, and the wiring space on the corresponding light, thin and small PCB also becomes smaller and smaller.
The bonding pads on the existing PCB are basically designed on the upper surface and the lower surface of the PCB, and for products with more layers and denser device distribution, the existing wiring design cannot meet the requirements of the products, so that part of products with higher wiring density are designed on the side wall of the PCB for saving space.
However, for the graph manufacture on the side wall of the appearance of the PCB, no related technical scheme reference is available in the industry at present, and the manufacture of the product cannot be realized. Therefore, a new manufacturing method is needed to realize the manufacturing of the side wall graph of the PCB, so as to meet the design requirement of high-density wiring.
Because the existing PCB is light and thin, the thickness of the PCB is thinner, and if the requirement of high-density wiring is met under the condition that the volume of the PCB is not increased, only the side wall space can be utilized for expansion;
However, the dry film is in a half-hardening form, the fluidity of the dry film is poor, the dry film has poor coverage on defects such as pits, protrusions and the like, manual operation is needed, and the requirements on the experience and the technical skill of workers are high; therefore, it is difficult to wire the inner wall of the groove provided on the side wall where the outer edge of the circuit board is located by using the conventional dry film method.
Disclosure of Invention
Based on this, it is necessary to provide a method for manufacturing a PCB board having a contour border line pattern.
In order to solve the technical problems, the invention provides a method for manufacturing a PCB with an outline border circuit pattern, which comprises the following steps:
s1, forming a groove on an outline edge of a copper-clad plate, wherein the outline edge is positioned between the top surface and the bottom surface of the copper-clad plate;
S2, copper plating is carried out on the outer edge of the copper-clad plate and the inner wall of the groove to form a first copper plating layer;
S3, etching outer circuit patterns on the top surface and the bottom surface of the outer surface of the copper-clad plate, preparing a first outer circuit layer on the top surface of the copper-clad plate, preparing a second outer circuit layer on the bottom surface of the copper-clad plate, and coating solder resist ink layers on the corresponding positions of the first outer circuit layer and the second outer circuit layer to obtain a first circuit board;
S4, synchronously depositing a metal protection layer on the surface of the outline edge of the copper-clad plate and the surface of the inner wall of the groove, wherein the metal protection layer is used for protecting the first copper plating layer;
s5, placing the copper-clad plate on a fixed jig so that the appearance side of the copper-clad plate faces upwards, and then performing surface treatment on the metal protective layer to form a hollowed-out pattern so that the copper surface pattern of the first copper-clad layer is exposed at the hollowed-out pattern;
And S6, etching the outline edge of the copper-clad plate, and removing the copper surface on the first copper plating layer exposed at the hollowed-out pattern to obtain the circuit board with the outline edge circuit pattern.
Preferably, in step S1, the copper-clad plate is a double-sided printed circuit board, the copper-clad plate includes a substrate, and the top surface and the bottom surface of the substrate are respectively covered with a second copper-plated layer.
Preferably, in step S1, the copper-clad plate is a multilayer printed circuit board, the copper-clad plate includes a plurality of substrates stacked together layer by layer, a pre-etched inner circuit layer is disposed between two adjacent stacked substrates, the inner circuit layer is located between the first outer circuit layer and the second outer circuit layer, and the bottom surface and the top surface of the outer layer of the copper-clad plate are covered with a second copper plating layer.
Preferably, in step S5, the metal protection layer is surface-treated by means of laser cutting.
Preferably, in step S6, the copper surface exposed at the hollowed pattern is removed by alkaline etching.
Preferably, the range of the face width L of the cross section of the notch of the groove is (0.4-1) mm, and the range of the thickness D of the copper-clad plate is (1-1.8) mm.
Preferably, the plurality of grooves are provided, the plurality of grooves comprise a first groove, a second groove and a third groove, the first groove extends to the top surface and penetrates through the top surface, and the corresponding first outer layer circuit layer extends to the first groove on the top surface to be connected with the outline circuit pattern in the first groove; the second grooves extend to the bottom surface and penetrate through the bottom surface, and the corresponding first outer layer circuit layers extend to the second grooves on the bottom surface to be connected with the outline border circuit patterns in the second grooves; the third groove penetrates to the inner circuit layer, and the inner circuit layer extends to the third groove to be connected with the outline border circuit pattern in the third groove.
Preferably, the ink is solder resist ink, and the metal protective layer is a nickel-gold protective layer.
Preferably, the face width L of the cross section of the notch of the groove is more than or equal to 0.4mm.
Preferably, the thickness D of the copper-clad plate is more than or equal to 1mm.
The application has the beneficial effects that: the application realizes the manufacture of the circuit pattern on the side wall of the appearance of the PCB by combining laser cutting and alkaline etching, thereby wiring on the side wall of the appearance where the thin thickness direction of the thinner PCB is positioned, and simultaneously meeting the design requirements of light, thin and high-density wiring on the circuit board.
Drawings
The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intentionally drawn to scale on actual size or the like, with emphasis on illustrating the principles of the invention.
FIG. 1 is a schematic flow chart of a method according to a preferred embodiment of the invention;
Fig. 2 is a schematic perspective view of a copper-clad plate without contour machining according to a preferred embodiment of the present invention;
FIG. 3 is a schematic perspective view of a circuit board product with a circuit pattern on the outline edge after processing the outline edge according to the preferred embodiment of the invention;
fig. 4 is a schematic cross-sectional view of a copper-clad plate without contour machining according to a preferred embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view of the copper-clad laminate of FIG. 4 with grooves formed in the outer edges thereof;
FIG. 6 is a schematic cross-sectional view of the copper-clad laminate of FIG. 5 with a first copper-clad layer on the exterior edge thereof;
FIG. 7 is a schematic view of a solder resist ink layer provided on the copper-clad plate of FIG. 6;
FIG. 8 is a schematic cross-sectional view of a circuit board product having a contoured edge circuit pattern in accordance with a preferred embodiment of the present invention;
In the figure: a copper-clad plate 5; a contour edge 3; a recess 300; a metal protective layer 7; hollowed-out patterns; a first groove 31; a second groove 32; a third groove 33; a contour line pattern 30; a top surface 1; a first outer wiring layer 10; a bottom surface 2; a second outer wiring layer 20; a solder resist ink layer 6; a fixing jig 8; an inner wiring layer 40; a first substrate 11; a second substrate 12.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to and integrated with the other element or intervening elements may also be present. The terms "mounted," "one end," "the other end," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-8, the present invention provides a method of manufacturing a PCB board having a contour edge line pattern,
S1, forming a groove 300 on the outline edge of a copper-clad plate 5; the outer surface of the copper-clad plate 5 comprises a top surface 1, a bottom surface 2 and an outline edge 3 positioned between the top surface 1 and the bottom surface 2. The copper-clad plate 5 is a double-sided printed wiring board or a multilayer printed wiring board. If the copper-clad plate 5 is a multilayer printed circuit board, the inner layer circuit layer 40 manufactured in advance is arranged in the copper-clad plate 5, and a groove or a specific outline edge is manufactured at a position on the outline edge 3 of the copper-clad plate 5, which is required to be manufactured with a side wall circuit, in a drilling or plate milling mode.
S2, copper plating is carried out on the outline 3 of the copper-clad plate 5 and the inner wall of the groove 300 to form a first copper plating layer;
S3, arranging a baffle plate at the groove 300 in advance, then etching an outer layer circuit pattern at the second copper plating layers of the top surface 1 and the bottom surface 2 of the copper-clad plate 5 by using a dry film method, preparing a first outer layer circuit layer 10 on the second copper plating layer at the top surface 1 of the copper-clad plate 5, preparing a second outer layer circuit layer 20 on the second copper plating layer at the bottom surface 2 of the copper-clad plate 5, and coating a solder resist ink layer 6 at the corresponding positions of the first outer layer circuit layer 10 and the second outer layer circuit layer 20; the barrier sheet prevents interference with the recess 300 when the top and bottom surfaces are treated, for example, the barrier sheet prevents solder ink from flowing into the recess 300 when the solder ink layer 6 is coated.
S4, synchronously depositing a metal protection layer 7 on the surface of the outline edge of the copper-clad plate 5 and the surface of the inner wall of the groove, wherein the metal protection layer is used for protecting the first copper plating layer; the metallization of the outer edge and the groove side wall of the copper-clad plate 5 is completed by combining a copper-tin plating process, namely, a copper layer and a metal protection layer 7 are sequentially overlapped on the surface of the outer edge and the inner wall of the groove, and the copper-clad thickness of the copper layer is more than or equal to 25 mu m in view of reliability;
S5, placing the copper-clad plate 5 on a fixing jig 8 for azimuth fixing before treatment, enabling the appearance edge 3 of the copper-clad plate 5 to face upwards, and then carrying out surface treatment on the metal protection layer 7 to form a hollowed-out pattern, so that the copper surface pattern of the first copper plating layer is exposed at the hollowed-out pattern;
And S6, etching the first copper plating layer exposed on the outer edge of the copper-clad plate 5, removing the copper surface on the first copper plating layer exposed at the hollowed-out pattern, and performing functional test on the position of the outer edge pattern according to design requirements, so that the circuit board with the first outer layer circuit layer 10, the second outer layer circuit layer 20, the outer edge circuit pattern 30 and the inner layer circuit layer 40 is manufactured.
The copper-clad plate 5 comprises a substrate and a copper layer covered on the outer surface of the substrate, wherein the copper layer covered on the top surface of the substrate is a first copper layer, and the copper layer covered on the bottom surface of the substrate is a second copper layer; the first copper layer and the second copper layer form a second copper plating layer; specifically, in step S3, the first outer circuit layer 10 is etched on the first copper layer, the second outer circuit layer 20 is etched on the second copper layer, and the substrate is made of an insulating material.
In a preferred embodiment, in step S1, when the copper-clad plate 5 is a double-sided printed wiring board, the copper-clad plate 5 includes a substrate having no inner wiring layer, and the top and bottom surfaces of the substrate are covered with second copper plating layers.
In a preferred embodiment, in step S1, when the copper-clad plate is a multilayer printed circuit board, the copper-clad plate includes a plurality of substrates stacked together layer by layer, an inner circuit layer etched in advance is disposed between two adjacent stacked substrates, the inner circuit layer is located between the first outer circuit layer and the second outer circuit layer, and the bottom surface and the top surface of the outer layer of the copper-clad plate are covered with a second copper plating layer.
The circuit layers 40 are laminated in sequence, and then the multi-layer circuit board is pressed, and then holes are drilled at the corresponding positions of the copper-clad plate, so that the circuits on the circuit layers are provided with channels for conducting. And (2) laminating the bottom surface of the substrate which is overlapped at the lowest position and the top surface of the substrate which is overlapped at the uppermost position with a second copper plating layer, and laminating the substrates which are etched with the inner layer circuit after being laminated in sequence to obtain the copper-clad plate in the step (S1).
Referring to fig. 4 to 8, specifically, when the substrate includes a first substrate 11 and a second substrate 12, the second substrate 12 is stacked and connected to the top end of the first substrate 11, an inner circuit layer 40 is disposed between the first substrate 11 and the second substrate 12, the side of the first substrate 11 away from the second substrate 12 is the bottom surface 2 of the multilayer copper-clad plate, and the side of the second substrate 12 away from the first substrate 11 is the top surface 1 of the multilayer copper-clad plate.
Optionally, the copper-clad plate provided by the application comprises a first substrate, a second substrate and a third substrate, wherein the second substrate is connected to the top end of the first substrate in a superposition manner, the third substrate is connected to the top end of the second substrate in a superposition manner, inner circuit layers can be respectively arranged between the first substrate and the second substrate and between the second substrate and the third substrate, the side, far away from the second substrate, of the first substrate is the bottom surface of the multilayer copper-clad plate, and the side, far away from the second substrate, of the third substrate is the top surface of the multilayer copper-clad plate. Optionally, a fourth layer of substrate and a fifth layer of substrate may be sequentially stacked on the top surface of the third substrate, and the specific number of layers of the circuit board is not limited to the specific protection scope of the present application.
In a preferred embodiment, in step S5, the metal protection layer 7 is surface-treated by means of laser cutting.
In a preferred embodiment, in step S6, the copper surface of the first copper plating layer exposed at the hollowed-out pattern is removed by means of alkaline etching.
Referring to fig. 3, in a preferred embodiment, there are a plurality of grooves 300, and the plurality of grooves 300 may be spaced apart from each other or communicate with each other at random on the outer side according to the design requirements of a specific product.
Referring to fig. 1 and 2, in a preferred embodiment, the plurality of grooves includes a first groove 31, a second groove 32, and a third groove 33, where the first groove 31 extends to the top surface 1 and penetrates through the top surface 1 near one end of the first groove 31, and the corresponding first outer circuit layer 10 extends to the first groove 31 on the top surface 1 to connect with the outline border circuit pattern 30 in the first groove 31; the second groove 32 extends to the bottom surface 2 and penetrates through one end of the bottom surface 2, which is close to the second groove 32, and the corresponding second outer circuit layer 20 extends to the second groove 32 on the bottom surface 2 to be connected with the outline border circuit pattern 30 in the second groove 32; the third groove 33 penetrates to one end of the inner circuit layer 40 near the third groove 33, and the inner circuit layer 40 extends to the third groove 33 to be connected with the outline border circuit pattern 30 in the third groove 33. The grooves are arranged on the outline 3 at intervals or are communicated with each other, the outline border line patterns 30 in the first groove 31 are first outline border line patterns, the outline border line patterns 30 in the second groove 32 are second outline border line patterns, and the outline border line patterns 30 in the third groove 33 are third outline border line patterns; the first, second and third contour line patterns are respectively distributed on the groove inner walls of the first, second and third grooves 31, 32 and 33. The depth direction of the groove is perpendicular to the plane of the appearance edge, and the extending direction of the groove is parallel to the plane of the appearance edge.
Referring to fig. 7, in a preferred embodiment, the ink is a solder resist ink and the metal protective layer is a nickel gold protective layer.
Referring to fig. 3, in a preferred embodiment, the range of the face width L of the notch cross section of the groove is (0.4-1) mm, and the range of the thickness D of the copper-clad plate is (1-1.8) mm; the face width L of the notch cross section of the groove 300 is more than or equal to 0.4mm.
In the preferred embodiment, the thickness D of the copper-clad plate 5 is not less than 1mm, and the thickness D of the copper-clad plate 5 is the width of the outline 3.
Another embodiment
In this embodiment, the processing manner of the outline border line patterns in steps S5 and S6 is as follows: after a PCB board is fixed on a special fixing jig, the outline 3 of the PCB needing to be manufactured with a pattern is placed upwards, then a milling machine or a CNC machine is used, and a depth-control milling mode is adopted to remove a metal layer at a designated position of the outline 3, so that the pattern meeting the design requirement is formed; considering metal wires or burrs generated in the machining process, microetching treatment can be carried out according to actual conditions after depth control milling so as to ensure the uniformity of the edges of the circuit and the bonding pad.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description of the terms "preferred embodiment," "further embodiment," "other embodiments," or "specific examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.
Claims (10)
1. A method for manufacturing a PCB board with a contour edge circuit pattern is characterized by comprising the following steps:
s1, forming a groove on an outline edge of a copper-clad plate, wherein the outline edge is positioned between the top surface and the bottom surface of the copper-clad plate;
S2, copper plating is carried out on the outer edge of the copper-clad plate and the inner wall of the groove to form a first copper plating layer;
s3, etching outer circuit patterns on the top surface and the bottom surface of the outer surface of the copper-clad plate, preparing a first outer circuit layer on the top surface of the copper-clad plate, preparing a second outer circuit layer on the bottom surface of the copper-clad plate, and coating solder resist ink layers on the corresponding positions of the first outer circuit layer and the second outer circuit layer;
S4, synchronously depositing a metal protection layer on the surface of the outline edge of the copper-clad plate and the surface of the inner wall of the groove, wherein the metal protection layer is used for protecting the first copper plating layer;
s5, placing the copper-clad plate on a fixed jig so that the appearance side of the copper-clad plate faces upwards, and then performing surface treatment on the metal protective layer to form a hollowed-out pattern so that the copper surface pattern of the first copper-clad layer is exposed at the hollowed-out pattern;
And S6, etching the outline edge of the copper-clad plate, and removing the copper surface on the first copper plating layer exposed at the hollowed-out pattern to obtain the circuit board with the outline edge circuit pattern.
2. The method of manufacturing a PCB of claim 1, wherein the copper-clad plate is a double-sided printed wiring board, the copper-clad plate includes a substrate, and the top and bottom surfaces of the substrate are respectively covered with a second copper plating layer.
3. The method for manufacturing a PCB according to claim 1, wherein the copper-clad plate is a multilayer printed wiring board, the copper-clad plate includes a plurality of substrates stacked one on top of the other, a pre-etched inner circuit layer is disposed between two adjacent substrates, the inner circuit layer is disposed between the first outer circuit layer and the second outer circuit layer, and the bottom surface and the top surface of the outer layer of the copper-clad plate are covered with a second copper plating layer.
4. A method of manufacturing a PCB board according to claim 2 or 3, wherein in step S5, the metal protection layer is surface-treated by means of laser cutting.
5. The method according to claim 4, wherein in step S6, the copper surface exposed at the hollowed pattern is removed by alkaline etching.
6. The method of claim 1, wherein the ink is solder resist ink and the metal protective layer is a nickel-gold protective layer.
7. The method of manufacturing a PCB board of claim 4, wherein the plurality of grooves includes a first groove, a second groove, and a third groove, the first groove extends to the top surface and penetrates through the top surface, and the corresponding first outer layer circuit layer extends to the first groove on the top surface and is connected with the outline border circuit pattern in the first groove; the second grooves extend to the bottom surface and penetrate through the bottom surface, and the corresponding first outer layer circuit layers extend to the second grooves on the bottom surface to be connected with the outline border circuit patterns in the second grooves; the third groove penetrates to the inner circuit layer, and the inner circuit layer extends to the third groove to be connected with the outline border circuit pattern in the third groove.
8. The method for manufacturing a PCB according to claim 1, wherein the range of the face width L of the cross section of the notch of the groove is (0.4-1) mm, and the range of the thickness D of the copper-clad plate is (1-1.8) mm.
9. The method of manufacturing a PCB according to claim 8, wherein the face width L of the notch cross section of the groove is 0.4mm or more.
10. The method for manufacturing a PCB according to claim 8, wherein the thickness D of the copper-clad plate is more than or equal to 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410547100.XA CN118382219A (en) | 2024-05-06 | 2024-05-06 | Manufacturing method of PCB with outline border circuit pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410547100.XA CN118382219A (en) | 2024-05-06 | 2024-05-06 | Manufacturing method of PCB with outline border circuit pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118382219A true CN118382219A (en) | 2024-07-23 |
Family
ID=91901376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410547100.XA Pending CN118382219A (en) | 2024-05-06 | 2024-05-06 | Manufacturing method of PCB with outline border circuit pattern |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118382219A (en) |
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2024
- 2024-05-06 CN CN202410547100.XA patent/CN118382219A/en active Pending
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