CN118366932B - MOS chip packaging structure - Google Patents
MOS chip packaging structure Download PDFInfo
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- CN118366932B CN118366932B CN202410796109.4A CN202410796109A CN118366932B CN 118366932 B CN118366932 B CN 118366932B CN 202410796109 A CN202410796109 A CN 202410796109A CN 118366932 B CN118366932 B CN 118366932B
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- glue injection
- mos
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 36
- 239000003292 glue Substances 0.000 claims abstract description 96
- 238000002347 injection Methods 0.000 claims abstract description 68
- 239000007924 injection Substances 0.000 claims abstract description 68
- 238000000034 method Methods 0.000 claims abstract description 45
- 238000003466 welding Methods 0.000 claims abstract description 18
- 238000012858 packaging process Methods 0.000 claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims abstract description 4
- 230000009975 flexible effect Effects 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 39
- 230000009471 action Effects 0.000 abstract description 20
- 239000002893 slag Substances 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 8
- 238000005538 encapsulation Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/85138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a MOS chip packaging structure, which relates to the technical field of MOS chip packaging and comprises a MOS chip body, wherein a plurality of groups of circuit elements of a packaging bracket are arranged on the MOS chip body, a plurality of groups of welding pins are arranged on the periphery of the MOS chip body, and bonding wires are connected between the welding pins and the MOS chip body. According to the MOS chip packaging structure, in the MOS chip packaging operation process, the two groups of pushing plates are kept against the bonding wires while shrinking and moving through transmission, the two groups of pushing plates are pushed and aligned through the action of the two groups of pushing plates against the two sides of the bonding wires and the shrinking and moving of the pushing plates, so that the offset bonding wires are aligned to the proper positions, the using effect of the MOS chip after the MOS chip packaging operation is ensured, and in the packaging process, whether welding slag is not cleaned is judged through whether rebound occurs in the pushing process of the rectangular glue injection dish, and the packaging quality of the MOS chip body is further ensured.
Description
Technical Field
The invention relates to the technical field of MOS chip packaging, in particular to a MOS chip packaging structure.
Background
In the process of processing the MOS chip, after cutting and welding the MOS chip, the MOS chip is required to be packaged, a physical barrier is provided for the MOS chip through packaging, the chip can be protected from adverse factors such as humidity, dust and temperature change in the external environment, and meanwhile, the packaging can also prevent the chip from being damaged by mechanical stress and static electricity, so that the durability and the reliability of the chip are improved.
In the process of packaging operation on the MOS chip, the actual position of the bonding wire on the MOS chip is offset due to calibration errors and unreasonable operation in the equipment operation process, and after the chip in the state is directly packaged, the circuit connection inside the chip is possibly caused to be problematic, so that the normal function of the chip is affected, and the offset can possibly cause unsmooth or interruption of circuit signal transmission, so that the chip is abnormal in function and expected performance and effect after the MOS chip is packaged are not achieved.
Disclosure of Invention
The present invention is directed to a MOS chip package structure, which solves the above-mentioned problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a MOS chip packaging structure, includes the MOS chip body, be provided with encapsulation support multiunit circuit element on the MOS chip body, be provided with multiunit leg around the MOS chip body, be connected with the bonding wire between leg and the MOS chip body, the bonding wire is used for the leg to be connected with encapsulation support or other circuit element on the MOS chip body and forms the conductive path, still includes:
The setting is at the return shape baffle of MOS chip body top, return shape baffle is used for stopping injecting glue excessive in the encapsulation process, be provided with the locating component that is used for returning shape baffle location installation between shape baffle and the MOS chip body, rectangle injecting glue ware has been placed to the inboard of returning shape baffle, rectangle injecting glue ware is used for supplementary MOS chip body heat dissipation after the encapsulation, be provided with the injecting glue circulation subassembly that is used for the encapsulation on the rectangle injecting glue ware, the inboard of returning shape baffle is provided with the multiunit and is used for injecting glue encapsulation in-process to the alignment subassembly of bonding line alignment, and each alignment subassembly sets up with each bonding line one-to-one respectively, the top of returning shape baffle is provided with the guide frame that is used for assisting rectangle injecting glue ware to the inboard accurate promotion of returning shape baffle, be provided with multiunit installation component between guide frame and the returning shape baffle, and the guide frame can dismantle with returning shape baffle under the effect of installation component and be connected.
Preferably, the aligning assembly comprises two groups of pushing plates, the two groups of the aligning baffle are positioned and placed on the MOS chip body, the lower ends of the pushing plates are propped against the upper end of the MOS chip body, the initial distance between the two groups of pushing plates is smaller than the thickness of the bonding wire, the bonding wire is positioned and placed on the MOS chip body and between the two pushing plates, the two groups of the aligning baffle lean against the rear side of the inner wall of the aligning baffle to form a first inclined plane inclined towards the opposite side of the two groups of pushing plates, the connecting assembly for connecting the two groups of pushing plates is arranged in the aligning baffle, the two front ends of the pushing plates are provided with a second inclined plane which is used for propping against the pushing plates and is propped against the bottom of the rectangular glue injection vessel in the process of covering the rectangular glue injection vessel, and the bottom of the rear side of the pushing plate is provided with an arc chamfer which is used for propping against and moving with welding slag foreign matters in the MOS chip body.
Preferably, the connecting assembly comprises a fixed block fixed on one side of the push plate, a sliding rod is connected to the fixed block in a sliding mode, a limiting plate for limiting the sliding of the fixed block is fixed at the front end of the sliding rod, and a clamping assembly for assisting the installation and connection of the sliding rod is arranged between the rear end of the sliding rod and the inner wall of the square baffle.
Preferably, the clamping assembly comprises a T-shaped chute arranged on the inner wall of the rectangular baffle, a T-shaped block is connected to the T-shaped chute in a sliding manner, and the T-shaped block is connected with one end of the sliding rod in a mounting manner through a flexible piece.
Preferably, the flexible piece is a rubber block, and one ends of the T-shaped block and the sliding rod are respectively fixed with two sides of the rubber block.
Preferably, the injecting glue circulation subassembly is including seting up a plurality of circulation holes on the rectangle injecting glue dish, the outside of rectangle injecting glue dish is fixed with fixed frame, set up a plurality of injecting glue encapsulation in-process auxiliary exhaust holes on the fixed frame, the rectangle injecting glue dish adopts the heat conduction silica gel material.
Preferably, the locating component is including seting up the locating hole in MOS chip body upper end, the locating hole is provided with the multiunit, and multiunit locating hole equipartition is around the MOS chip body, the lower extreme of returning the shape baffle is fixed with the locating pin that sets up with the locating hole mutual match.
Preferably, the installation component is including seting up the spacing groove that is used for the card to establish the limit on the shape baffle that returns, the outside of guide frame is provided with and is used for establishing spacing L type cardboard with the spacing groove card, be provided with between L type cardboard and the guide frame and be used for assisting the flexible subassembly of L type cardboard.
Preferably, the telescopic assembly comprises a plurality of T-shaped rods which are connected to the L-shaped clamping plate in a sliding manner, one end of each T-shaped rod is fixed to the outer side of the guide frame, a spring is sleeved on the outer side of each T-shaped rod, and two ends of the spring are connected with one end of the L-shaped clamping plate and one end of each T-shaped rod respectively.
Compared with the prior art, the invention has the beneficial effects that:
According to the MOS chip packaging structure, the packaging operation of the MOS chip is assisted through the glue injection circulation assembly, the packaged MOS chip body is propped against the upper end of the MOS chip body due to the lower end of the internal rectangular glue injection dish, the rectangular glue injection dish is made of heat-conducting silica gel materials, and the heat dissipation of the MOS chip body in the working process is assisted through the heat conduction and insulation effects of the rectangular glue injection dish, so that the subsequent MOS chip can be conveniently used.
According to the MOS chip packaging structure, in the MOS chip packaging operation process, the two groups of pushing plates are kept against the bonding wires while shrinking and moving through transmission, the two groups of pushing plates are pushed and aligned through the action of the two groups of pushing plates against the two sides of the bonding wires and the shrinking and moving of the pushing plates, so that the offset bonding wires are aligned to the proper positions, the using effect of the MOS chip after the MOS chip packaging operation is ensured, and in the packaging process, whether welding slag is not cleaned is judged through whether rebound occurs in the pushing process of the rectangular glue injection dish, and the packaging quality of the MOS chip body is further ensured.
Drawings
FIG. 1 is a schematic diagram of the overall outline structure of the present invention;
Fig. 2 is a schematic diagram of a state of the MOS chip body, the rectangular baffle, the rectangular glue injection dish and the guide frame after being connected;
FIG. 3 is a schematic diagram showing the explosion state of the MOS chip body, the rectangular baffle, the rectangular glue injection dish and the guide frame according to the present invention;
fig. 4 is a schematic diagram of a MOS chip structure according to the present invention;
FIG. 5 is a schematic view of a baffle plate with a shape of a circle according to the present invention;
FIG. 6 is a schematic diagram of a rectangular glue injection dish and glue injection flow assembly according to the present invention;
FIG. 7 is a schematic view showing a state before the clip-shaped baffle plate and the guide frame are connected;
FIG. 8 is a schematic view of a mounting assembly and telescoping assembly according to the present invention;
FIG. 9 is a schematic diagram of a centering assembly and connecting assembly according to the present invention;
FIG. 10 is a schematic view of a fastening assembly according to the present invention;
Fig. 11 is a schematic diagram showing a state of being abutted against a pushing plate when soldering slag exists on a MOS chip body of the present invention.
In the figure: 101. a MOS chip body; 102. welding feet; 103. a bonding wire; 2. a return-shaped baffle; 3. rectangular glue injection dishes; 401. a flow hole; 402. a fixed frame; 403. an exhaust hole; 501. positioning holes; 502. a positioning pin; 6. a guide frame; 701. a limit groove; 702. an L-shaped clamping plate; 801. a T-shaped rod; 802. a spring; 901. a push plate; 902. a first inclined surface; 903. arc chamfering; 10. a second inclined surface; 1101. a fixed block; 1102. a slide bar; 1103. a limiting plate; 1201. a T-shaped chute; 1202. a T-shaped block; 13. rubber blocks.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1: referring to fig. 1-11, an MOS chip package structure in the drawings includes an MOS chip body 101, a plurality of groups of circuit elements of a package support are disposed on the MOS chip body 101, a plurality of groups of solder feet 102 are disposed around the MOS chip body 101, bonding wires 103 are connected between the solder feet 102 and the MOS chip body 101, and the bonding wires 103 are used for connecting the solder feet 102 with the package support or other circuit elements on the MOS chip body 101 to form a conductive path, and further includes:
The device comprises a rectangular baffle plate 2 arranged above a Metal Oxide Semiconductor (MOS) chip body 101, wherein the rectangular baffle plate 2 is used for blocking glue injection from overflowing in the packaging process, a positioning component used for positioning and mounting the rectangular baffle plate 2 is arranged between the rectangular baffle plate 2 and the MOS chip body 101, a rectangular glue injection vessel 3 is arranged on the inner side of the rectangular baffle plate 2, the rectangular glue injection vessel 3 is used for assisting in radiating the MOS chip body 101 after packaging, glue injection circulation components used for packaging are arranged on the rectangular glue injection vessel 3, a plurality of groups of alignment components used for aligning bonding wires 103 in the glue injection packaging process are arranged on the inner side of the rectangular baffle plate 2, each alignment component is respectively arranged in one-to-one correspondence with each bonding wire 103, a guide frame 6 used for assisting in accurately pushing the rectangular glue injection vessel 3 towards the inner side of the rectangular baffle plate 2 is arranged above the rectangular baffle plate 2, a plurality of groups of mounting components are arranged between the guide frame 6 and the rectangular baffle plate 2, and the guide frame 6 is detachably connected with the rectangular baffle plate 2 under the effect of the mounting components;
What needs to be explained here is: in the MOS chip packaging operation process, through transmission, two groups of pushing plates 901 keep propping against bonding wires 103 while shrinking, the propping action of two groups of pushing plates 901 and two sides of bonding wires 103 and the shrinking motion of the pushing plates 901 are used for pushing and straightening the propped bonding wires 103, so that the offset bonding wires 103 are straightened to a proper position, the use effect of the MOS chip after the MOS chip packaging operation is ensured, in the packaging process, whether the welding slag is not cleaned up or not is judged through the rebound action in the pushing process of a rectangular glue injection dish 3, and the packaging quality of the MOS chip body 101 is further ensured.
Preferably, the aligning assembly is composed of two groups of pushing plates 901, the lower ends of the two groups of pushing plates 901 are propped against the upper end of the MOS chip body 101 after the MOS chip body 101 is positioned and placed by the square baffle 2, the initial distance between the two groups of pushing plates 901 is smaller than the thickness of the bonding wire 103, the bonding wire 103 is positioned and placed between the two pushing plates 901 after the square baffle 2 is positioned and placed on the MOS chip body 101, a first inclined plane 902 inclining towards the opposite side of the two groups of pushing plates 901 is arranged on the rear side of the inner wall of the two groups of pushing plates 901, a connecting assembly for connecting the two groups of pushing plates 901 is arranged in the square baffle 2, a second inclined plane 10 for propping against the pushing plates 901 in the process of covering the rectangular glue injection dish 3 is arranged at the front ends of the two pushing plates 901, an arc chamfer 903 for propping against the pushing plates 901 in the process of covering the rectangular glue injection dish 3 is arranged at the bottom of the rear side of the pushing plates 901, and an arc chamfer 903 for propping against the welding slag foreign matters in the MOS chip body 101 is arranged at the bottom of the rear side;
What needs to be explained here is: in the process that the rectangular glue injection vessel 3 is pushed towards the inner side of the return baffle 2, along with the pushing of the rectangular glue injection vessel 3, the lower end of the rectangular glue injection vessel 3 is firstly propped against the second inclined surfaces 10 of the two groups of push plates 901 on each straightening component, as the lower ends of the two groups of push plates 901 are propped against the upper ends of the MOS chip body 101, in the process that the lower end of the rectangular glue injection vessel 3 is propped against the second inclined surfaces 10 on the push plates 901, the two groups of push plates 901 are pushed to bear against the inner side of the return baffle 2 to shrink and move, in the process that the two groups of push plates 901 shrink and move, the first inclined surfaces 902 on the two groups of push plates 901 are propped against the front ends of bonding wires 103 to push the two groups of push plates 901 to move away from each other transversely and keep against the inner sides of the return baffle 2, and the two groups of push plates 901 keep propping against the bonding wires 103 through the elastic reset action of the rubber blocks 13 on the bonding wires 103 after the two groups of push plates 901 move transversely, and the bonding wires 103 are pushed to the right by the pushing the bonding wires 103 after the two groups of push plates 901 move transversely.
Preferably, the connecting component comprises a fixed block 1101 fixed on one side of the push plate 901, a sliding rod 1102 is slidably connected on the fixed block 1101, a limiting plate 1103 for slidably limiting the fixed block 1101 is fixed at the front end of the sliding rod 1102, and a clamping component for assisting the installation and connection of the sliding rod 1102 is arranged between the rear end of the sliding rod 1102 and the inner wall of the square baffle 2;
What needs to be explained here is: the sliding connection of the fixed block 1101 and the sliding rod 1102 facilitates the shrinkage sliding of the push plate 901 after being stressed;
Noteworthy here is that: the front end of the slide bar 1102 in the initial state is arranged in a downward inclined mode, and the push plate 901 is positioned at the front end of the slide bar 1102 in the initial state after installation through the inclination action of the slide bar 1102 and the gravity action of the fixed block 1101 and the push plate 901, so that the push plate 901 can conveniently abut against the upper end of the MOS chip body 101 and can conveniently shrink after being stressed by the push plate 901.
Preferably, the clamping assembly comprises a T-shaped chute 1201 arranged on the inner wall of the rectangular baffle 2, a T-shaped block 1202 is slidingly connected on the T-shaped chute 1201, and the T-shaped block 1202 is connected with one end of the slide bar 1102 through a flexible piece;
what needs to be explained here is: the T-shaped sliding groove 1201 and the T-shaped block 1202 facilitate the quick installation connection of the auxiliary sliding rod 1102 and the inside of the back-shaped baffle 2.
Preferably, the flexible piece is a rubber block 13, and one ends of the T-shaped block 1202 and the sliding rod 1102 are respectively fixed with two sides of the rubber block 13;
what needs to be explained here is: through the flexible action of the rubber block 13 and the connection action of the sliding rod 1102 and the fixed block 1101, the push plate 901 which is stressed in the movement process is convenient to move up and down and left and right, and the push plate 901 which moves up and down and left and right is convenient to reset through the elastic action of the rubber block 13.
Preferably, the glue injection circulation assembly comprises a plurality of circulation holes 401 formed in the rectangular glue injection vessel 3, a fixed frame 402 is fixed on the outer side of the rectangular glue injection vessel 3, a plurality of exhaust holes 403 for assisting in exhausting in the glue injection packaging process are formed in the fixed frame 402, and the rectangular glue injection vessel 3 is made of heat-conducting silica gel;
What needs to be explained here is: after the rectangular glue injection dish 3 is positioned and pushed, the glue needed in the packaging process is poured on the rectangular glue injection dish 3, part of the glue added in the rectangular glue injection dish 3 flows into the cavity between the rectangular glue injection dish 3 and the return-shaped baffle plate 2 through the plurality of flow holes 401 in the pouring process, the gas in the cavity between the rectangular glue injection dish 3 and the return-shaped baffle plate 2 is discharged outwards through the plurality of vent holes 403 in the glue inflow process, the probability of generating bubbles in the packaging process is reduced, and the glue is not injected continuously after reaching a certain height along with continuous pouring of the glue on the rectangular glue injection dish 3 and circulation of the glue to the cavity between the rectangular glue injection dish 3 and the return-shaped baffle plate 2, and the packaging operation of the MOS chip is completed after the glue is injected.
Preferably, the positioning assembly comprises positioning holes 501 formed in the upper end of the MOS chip body 101, a plurality of groups of positioning holes 501 are formed in the positioning holes 501, the plurality of groups of positioning holes 501 are uniformly distributed around the MOS chip body 101, and positioning pins 502 which are mutually matched with the positioning holes 501 are fixed at the lower end of the square baffle 2;
What needs to be explained here is: in the process of packaging the MOS chip, the square baffle plate 2 is positioned and placed above the MOS chip body 101 through the positioning and guiding functions of the positioning holes 501 and the positioning pins 502.
Preferably, the mounting assembly comprises a limiting groove 701 which is arranged on the square baffle 2 and used for clamping and limiting, an L-shaped clamping plate 702 which is used for clamping and limiting with the limiting groove 701 is arranged on the outer side of the guide frame 6, and a telescopic assembly which is used for assisting the L-shaped clamping plate 702 to stretch out and draw back is arranged between the L-shaped clamping plate 702 and the guide frame 6;
What needs to be explained here is: in the process of installing the guide frame 6, each L-shaped clamping plate 702 is pulled away from the guide frame 6, after the pulling is completed, the guide frame 6 is placed against the upper side of the square baffle 2, after the placing is completed, the pulling of each L-shaped clamping plate 702 is loosened, one end of each L-shaped clamping plate 702 is clamped into the limiting groove 701 under the action of the elastic force of the spring 802 on the telescopic component, the guide frame 6 is installed and fixed at the upper end of the square baffle 2 through the interaction of the L-shaped clamping plates 702 and the limiting grooves 701, the guide frame 6 is installed on the square baffle 2 after the encapsulation is completed, one end of each L-shaped clamping plate 702 is pulled out of the limiting groove 701, and then the guide frame 6 is separated and removed from the square baffle 2, so that the guide frame 6 is convenient for subsequent continuous encapsulation auxiliary use.
Preferably, the telescopic assembly comprises a plurality of T-shaped rods 801 which are slidably connected to the L-shaped clamping plate 702, one end of each T-shaped rod 801 is fixed with the outer side of the guide frame 6, a spring 802 is sleeved on the outer side of each T-shaped rod 801, and two ends of the spring 802 are respectively connected with one end of the L-shaped clamping plate 702 and one end of each T-shaped rod 801;
What needs to be explained here is: through a plurality of T type poles 801, carry out slip direction to the motion of L type cardboard 702 after the atress, through a plurality of springs 802, the reset motion of L type cardboard 702 after being convenient for pull, supplementary L type cardboard 702 carries out flexible slip.
In the scheme, the method comprises the following steps: a MOS chip package structure, comprising the steps of:
In the process of packaging the MOS chip, the square baffle 2 is positioned and placed above the MOS chip body 101 through the positioning guiding action of the plurality of groups of positioning holes 501 and the positioning pins 502, the lower ends of the push plates 901 are propped against the upper ends of the MOS chip body 101 in the positioning and placing process of the square baffle 2, after the square baffle 2 is positioned and placed, the guide frame 6 is installed and connected above the square baffle 2, in the installation process of the guide frame 6, each L-shaped clamping plate 702 is pulled away from the guide frame 6, after the pulling is completed, the guide frame 6 is propped against and placed above the square baffle 2, after the placing is completed, the pulling of each L-shaped clamping plate 702 is released, one end of each L-shaped clamping plate 702 is clamped into the limiting groove 701 under the action of the elasticity of the springs 802 on the telescopic component, and the guide frame 6 is installed and fixed at the upper end of the square baffle 2 through the interaction of the L-shaped clamping plates 702 and the limiting groove 701;
After the guide frame 6 is installed and fixed, pushing the rectangular glue injection dish 3 towards the inner side of the back-shaped baffle plate 2, enabling the lower end of the rectangular glue injection dish 3 to prop against the upper end of the MOS chip body 101, in the pushing process, enabling the fixing frame 402 on the outer side of the rectangular glue injection dish 3 to pass through the guide frame 6, accurately guaranteeing the propped position of the rectangular glue injection dish 3 and the MOS chip body 101 through the auxiliary positioning and guiding function of the guide frame 6, pouring the needed glue in the packaging process onto the rectangular glue injection dish 3 after the positioning pushing of the rectangular glue injection dish 3 is completed, enabling part of glue added into the rectangular glue injection dish 3 to flow into the cavity between the rectangular glue injection dish 3 and the back-shaped baffle plate 2 through the plurality of through holes 401 in the pouring process, discharging gas in the cavity between the rectangular glue injection dish 3 and the back-shaped baffle plate 2 outwards through the plurality of exhaust holes 403 in the glue inflow process, reducing the probability of generating bubbles in the packaging process, and enabling the glue to continuously pour into the cavity between the rectangular glue injection dish 3 and the rectangular MOS chip body 3 and the back-shaped MOS chip body 101 through the auxiliary positioning function of the back-shaped baffle plate 2, and continuing to fill the glue into the rectangular glue injection dish 3 after the packaging process, and continuously cooling the MOS chip body is not required to reach the heat conduction operation in the back-shaped chip body after the packaging process, and the back-shaped metal chip body is continuously filled with the MOS chip body is filled, and the heat conducting glue is continuously cooled, and the heat conducting operation is carried out, and the heat conducting glue is convenient, and the glue is continuously carried out, and the heat conducting is continuously has a certain conductive material is subjected to be subjected to the heat conductive to the bottom and has a good quality is subjected to the heat conduction performance and has a good quality and has a good heat insulation performance and a good quality;
In the process of MOS chip packaging operation, in the process of pushing the rectangular glue injection vessel 3 towards the inner side of the return baffle plate 2, along with pushing of the rectangular glue injection vessel 3, the lower end of the rectangular glue injection vessel 3 is firstly propped against the second inclined planes 10 of the two groups of push plates 901 on each straightening assembly, as the lower ends of the two groups of push plates 901 are propped against the upper ends of the MOS chip body 101, in the process of propping the lower end of the rectangular glue injection vessel 3 against the second inclined planes 10 on the push plates 901, the two groups of push plates 901 are pushed to bear force to move towards the inner part of the return baffle plate 2 in a shrinkage process, in the process of shrinking the two groups of push plates 901, the first inclined planes 902 on the two groups of push plates 901 are propped against the front ends of the bonding wires 103, the two push plates 901 are pushed to move away from each other transversely and keep leaning towards the inner part of the return baffle plate 2 in a shrinkage reference picture 9, in the process of mutual distance and shrinkage motion of the two push plates 901, the elastic force reset action of the rubber block 13 on the push plate 901 after transverse movement enables the two groups of push plates 901 to keep propping against the bonding wires 103 while shrinking, the propping action of the two groups of push plates 901 against the two sides of the bonding wires 103 and the shrinking action of the push plates 901 are utilized to push and align the propped bonding wires 103, so that the offset bonding wires 103 are aligned to a proper position, the use effect of the MOS chip after MOS chip packaging operation is ensured, and in the process of pushing the two groups of push plates 901 to lean against the shrinking movement of the return baffle 2, the lower ends of the two groups of push plates 901 prop against the upper ends of the MOS chip body 101, when welding slag exists at the position of the propped MOS chip body 101 in the welding process, the push plates 901 are pushed upwards through the propping action of the welding slag and arc-shaped chamfer 903 at the front side of the push plates 901, the push plates 901 are tilted upwards, the tilting action of the push plates 901 is realized, the rebound occurs in the pushing-in process, the rebound occurs in the pushing-in process of the rectangular glue injection vessel 3, the situation that welding slag is not cleaned is judged on the MOS chip body 101, the rectangular glue injection vessel 3 needs to be taken out for cleaning, the probability that welding slag exists on the packaged MOS chip body 101 is reduced, and the packaging quality of the MOS chip body 101 is further guaranteed.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A MOS chip package structure, comprising:
The MOS chip comprises a MOS chip body (101), wherein a plurality of groups of circuit elements of a packaging support are arranged on the MOS chip body (101), a plurality of groups of welding legs (102) are arranged around the MOS chip body (101), bonding wires (103) are connected between the welding legs (102) and the MOS chip body (101), and the bonding wires (103) are used for connecting the welding legs (102) with the packaging support or other circuit elements on the MOS chip body (101) to form a conductive path;
Characterized by further comprising:
The device comprises a rectangular baffle plate (2) arranged above a Metal Oxide Semiconductor (MOS) chip body (101), wherein the rectangular baffle plate (2) is used for blocking glue injection from overflowing in the packaging process, a positioning component used for positioning and mounting the rectangular baffle plate (2) is arranged between the rectangular baffle plate (2) and the MOS chip body (101), a rectangular glue injection vessel (3) is arranged on the inner side of the rectangular baffle plate (2), the rectangular glue injection vessel (3) is used for assisting the MOS chip body (101) to dissipate heat after packaging, glue injection circulation components used for packaging are arranged on the rectangular glue injection vessel (3), a plurality of groups of arranging components used for arranging bonding wires (103) in the glue injection packaging process are arranged on the inner side of the rectangular baffle plate (2), the arranging components are respectively arranged in one-to-one correspondence with the bonding wires (103), a guide frame (6) used for assisting the rectangular glue injection vessel (3) to accurately push towards the inner side of the rectangular baffle plate (2), and a plurality of groups of guide frame (6) are arranged between the guide frame (6) and the rectangular baffle plate (2), and the guide frame (6) can be mounted under the guide frame (2) in a detachable mode;
The utility model provides a welding device for a Metal Oxide Semiconductor (MOS) chip, including Metal Oxide Semiconductor (MOS) chip body (101) and is formed by two sets of push plates (901), returns shape baffle (2) and positions back two sets of push plates (901) the lower extreme of push plate (901) offsets with the upper end of MOS chip body (101), and the initial interval between two sets of push plates (901) is less than the thickness of bonding wire (103), returning shape baffle (2) position back bonding wire (103) and be in between two push plates (901) on MOS chip body (101), two sets of push plates (901) lean on the rear side of back shape baffle (2) inner wall to set up first inclined plane (902) to two sets of push plates (901) opposite one side slope, the inside of returning shape baffle (2) is provided with the coupling assembling that is used for being connected two sets of push plates (901), two the front end of push plate (901) is provided with in-process that is used for rectangle injecting glue ware (3) lid and offsets the second inclined plane (10) of transmission to push plate (901), the bottom of push plate (901) offset the bottom of push plate (901) of pushing plate (901), the bottom of push plate (901) is offered and is used for the inside arc-shaped foreign matter (101) removal that moves.
2. The MOS chip package structure of claim 1, wherein: the connecting assembly comprises a fixed block (1101) fixed on one side of the push plate (901), a sliding rod (1102) is slidably connected to the fixed block (1101), a limiting plate (1103) for limiting sliding of the fixed block (1101) is fixed at the front end of the sliding rod (1102), and a clamping assembly for assisting the installation and connection of the sliding rod (1102) is arranged between the rear end of the sliding rod (1102) and the inner wall of the square baffle (2).
3. The MOS chip package structure of claim 2, wherein: the clamping assembly comprises a T-shaped chute (1201) formed in the inner wall of the square baffle (2), a T-shaped block (1202) is connected to the T-shaped chute (1201) in a sliding mode, and the T-shaped block (1202) is connected with one end of the sliding rod (1102) through a flexible piece in a mounting mode.
4. A MOS chip package structure as claimed in claim 3, wherein: the flexible piece is a rubber block (13), and one ends of the T-shaped block (1202) and the sliding rod (1102) are respectively fixed with two sides of the rubber block (13).
5. The MOS chip package structure of claim 1, wherein: the glue injection circulation assembly comprises a plurality of circulation holes (401) formed in a rectangular glue injection vessel (3), a fixing frame (402) is fixed on the outer side of the rectangular glue injection vessel (3), a plurality of auxiliary exhaust holes (403) in the glue injection packaging process are formed in the fixing frame (402), and the rectangular glue injection vessel (3) is made of heat-conducting silica gel.
6. The MOS chip package structure of claim 1, wherein: the locating component comprises locating holes (501) formed in the upper end of the MOS chip body (101), a plurality of groups of locating holes (501) are formed in the locating holes (501), the locating holes (501) are uniformly distributed around the MOS chip body (101), and locating pins (502) which are matched with the locating holes (501) are fixed at the lower end of the square baffle plate (2).
7. The MOS chip package structure of claim 1, wherein: the installation component is including seting up spacing groove (701) that are used for the card to establish the limit on return shape baffle (2), the outside of guide frame (6) is provided with and is used for establishing spacing L type cardboard (702) with spacing groove (701) card, be provided with between L type cardboard (702) and guide frame (6) and be used for assisting the flexible subassembly of L type cardboard (702).
8. The MOS chip package structure of claim 7, wherein: the telescopic assembly comprises a plurality of T-shaped rods (801) which are connected to an L-shaped clamping plate (702) in a sliding mode, one end of each T-shaped rod (801) is fixed to the outer side of a guide frame (6), springs (802) are sleeved on the outer sides of the T-shaped rods (801), and two ends of each spring (802) are connected with one ends of the L-shaped clamping plate (702) and one ends of the T-shaped rods (801) respectively.
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| CN116314050A (en) * | 2023-05-22 | 2023-06-23 | 东莞市华越半导体技术股份有限公司 | Multi-chip packaging module and method |
| CN117766471A (en) * | 2023-11-07 | 2024-03-26 | 北京致盈科技有限公司 | Semiconductor assembly package |
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| CN117766471A (en) * | 2023-11-07 | 2024-03-26 | 北京致盈科技有限公司 | Semiconductor assembly package |
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