CN118280629B - Conductive paste for TOPCon battery and production process thereof - Google Patents
Conductive paste for TOPCon battery and production process thereof Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000002994 raw material Substances 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- 238000006243 chemical reaction Methods 0.000 claims abstract description 21
- 239000002482 conductive additive Substances 0.000 claims abstract description 17
- 239000011521 glass Substances 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 90
- 239000013384 organic framework Substances 0.000 claims description 54
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 45
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 42
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims description 36
- YQUVCSBJEUQKSH-UHFFFAOYSA-N 3,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(O)=C1 YQUVCSBJEUQKSH-UHFFFAOYSA-N 0.000 claims description 32
- 239000001913 cellulose Substances 0.000 claims description 30
- 229920002678 cellulose Polymers 0.000 claims description 30
- 229910021389 graphene Inorganic materials 0.000 claims description 29
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 28
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 20
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 claims description 20
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 18
- 239000000945 filler Substances 0.000 claims description 18
- ZYTWXMBGOUJDHJ-UHFFFAOYSA-N 2,6-dipyridin-2-ylpyridine-4-carboxylic acid Chemical compound C=1C(C(=O)O)=CC(C=2N=CC=CC=2)=NC=1C1=CC=CC=N1 ZYTWXMBGOUJDHJ-UHFFFAOYSA-N 0.000 claims description 16
- HXITXNWTGFUOAU-UHFFFAOYSA-N phenylboronic acid Chemical compound OB(O)C1=CC=CC=C1 HXITXNWTGFUOAU-UHFFFAOYSA-N 0.000 claims description 14
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 12
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 claims description 12
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 claims description 11
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 11
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 10
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 10
- 239000008367 deionised water Substances 0.000 claims description 10
- 229910021641 deionized water Inorganic materials 0.000 claims description 10
- 239000002808 molecular sieve Substances 0.000 claims description 10
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 9
- 229960003280 cupric chloride Drugs 0.000 claims description 9
- 238000010992 reflux Methods 0.000 claims description 8
- 239000002002 slurry Substances 0.000 claims description 7
- 239000004359 castor oil Substances 0.000 claims description 6
- 235000019438 castor oil Nutrition 0.000 claims description 6
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 6
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 6
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 6
- 229940037312 stearamide Drugs 0.000 claims description 6
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 3
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 claims description 2
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 claims description 2
- 238000004321 preservation Methods 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052710 silicon Inorganic materials 0.000 abstract description 9
- 239000010703 silicon Substances 0.000 abstract description 9
- 239000000377 silicon dioxide Substances 0.000 abstract description 5
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 5
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract description 3
- 239000010936 titanium Substances 0.000 abstract description 3
- 229910052719 titanium Inorganic materials 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 10
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 229910052810 boron oxide Inorganic materials 0.000 description 3
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 3
- 239000000292 calcium oxide Substances 0.000 description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 3
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 229910000464 lead oxide Inorganic materials 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- JFJNVIPVOCESGZ-UHFFFAOYSA-N 2,3-dipyridin-2-ylpyridine Chemical compound N1=CC=CC=C1C1=CC=CN=C1C1=CC=CC=N1 JFJNVIPVOCESGZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- -1 Silver aluminum Chemical compound 0.000 description 1
- 241001140644 Spodiopogon sibiricus Species 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000005619 boric acid group Chemical group 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229960001777 castor oil Drugs 0.000 description 1
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical group OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/18—Conductive material dispersed in non-conductive inorganic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
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- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Battery Electrode And Active Subsutance (AREA)
Abstract
本发明公开了一种TOPCon电池用导电浆料及其生产工艺,称取如下重量份原料:导电添加剂3‑5份、银粉85‑90份、玻璃粉1‑5份和改性载体9‑10份,将原料混合均匀并研磨细度至5μm,制得TOPCon电池用导电浆料,导电添加剂中含有铜、钛、二氧化硅和石墨烯结构,能够减少电子在传输过程中的损失,且铜也能够与硅或多晶硅形成低阻的欧姆接触,易形成数量多和深度浅的银铜尖钉,银铜尖钉成为电流传输的桥梁,实现更好的欧姆接触,同时能够防止形成银金属尖钉时穿透硅衬底,并提高对光的捕获,将原本不可以利用的光利用起来,拓宽了对太阳光的吸收范围,提升光电转化率。The invention discloses a conductive paste for a TOPCon battery and a production process thereof. The following raw materials are weighed in parts by weight: 3-5 parts of a conductive additive, 85-90 parts of silver powder, 1-5 parts of glass powder and 9-10 parts of a modified carrier. The raw materials are evenly mixed and ground to a fineness of 5 μm to obtain a conductive paste for a TOPCon battery. The conductive additive contains copper, titanium, silicon dioxide and a graphene structure, which can reduce the loss of electrons in a transmission process. Copper can also form a low-resistance ohmic contact with silicon or polycrystalline silicon, and is easy to form a large number of shallow silver-copper spikes. The silver-copper spikes become a bridge for current transmission, achieving better ohmic contact, and can prevent the silver metal spikes from penetrating a silicon substrate when formed, and improve the capture of light, so that light that could not be used originally is used, thereby broadening the absorption range of sunlight and improving the photoelectric conversion rate.
Description
技术领域Technical Field
本发明涉及TOPCon电池制备技术领域,具体涉及一种TOPCon电池用导电浆料及其生产工艺。The invention relates to the technical field of TOPCon battery preparation, and in particular to a conductive slurry for a TOPCon battery and a production process thereof.
背景技术Background Art
太阳能电池,也称光伏电池,是一种将太阳的光直接转化为电能的半导体器件。TOPCon是一种基于选择性载流子原理的隧穿氧化层钝化接触太阳能电池技术,其电池结构为n型硅衬底电池,在电池背面制备一层超薄氧化硅,然后再沉积一层掺杂硅薄层,二者共同形成了钝化接触结构,有效降低表面复合和金属接触复合,银铝浆是n型TOPCon太阳能电池正面电极导电材料,主要由导电功能相、无机粘结相、有机载体组成,现有的导电浆料在烧结过程中易形成过长的银尖钉,导致硅衬底穿透,使得电池转换率低。Solar cells, also known as photovoltaic cells, are semiconductor devices that convert sunlight directly into electrical energy. TOPCon is a tunneling oxide passivation contact solar cell technology based on the principle of selective carriers. Its cell structure is an n-type silicon substrate cell. An ultra-thin layer of silicon oxide is prepared on the back of the cell, and then a thin layer of doped silicon is deposited. The two together form a passivation contact structure, which effectively reduces surface recombination and metal contact recombination. Silver aluminum paste is the conductive material for the front electrode of n-type TOPCon solar cells. It is mainly composed of a conductive functional phase, an inorganic bonding phase, and an organic carrier. The existing conductive paste is prone to form excessively long silver spikes during the sintering process, resulting in penetration of the silicon substrate, resulting in low cell conversion rate.
发明内容Summary of the invention
本发明的目的在于提供一种TOPCon电池用导电浆料及其生产工艺,解决了现阶段导电浆料接触电阻大,且转化效率不高的问题。The purpose of the present invention is to provide a conductive paste for TOPCon batteries and a production process thereof, which solves the problems of large contact resistance and low conversion efficiency of the conductive paste at the current stage.
本发明的目的可以通过以下技术方案实现:The purpose of the present invention can be achieved through the following technical solutions:
一种TOPCon电池用导电浆料的生产工艺,具体包括如下步骤:A production process of conductive paste for TOPCon batteries, specifically comprising the following steps:
将改性填料放入管式炉中,在升温速率为5℃/min,氮气氛围条件下,升温至800-850℃,烧结2-3h,制得导电添加剂,称取如下重量份原料:导电添加剂3-5份、银粉85-90份、玻璃粉1-5份和改性载体9-10份,将原料混合均匀并研磨细度至5μm,制得TOPCon电池用导电浆料。The modified filler is placed in a tubular furnace, heated to 800-850°C at a heating rate of 5°C/min in a nitrogen atmosphere, and sintered for 2-3 hours to obtain a conductive additive. The following raw materials are weighed in parts by weight: 3-5 parts of conductive additive, 85-90 parts of silver powder, 1-5 parts of glass powder and 9-10 parts of modified carrier. The raw materials are mixed evenly and ground to a fineness of 5μm to obtain a conductive slurry for TOPCon batteries.
进一步,所述的改性填料由如下步骤制成:Further, the modified filler is prepared by the following steps:
步骤A1:将2,2':6',2''-三联吡啶-4'-羧酸、无水乙醇、对甲基苯磺酸和甲苯混合均匀,在转速为120-150r/min,温度为90-100℃的条件下,进行反应10-15h,制得中间体1,将二水氯化铜溶于无水乙醇中,加入中间体1,通入氮气保护,在转速为60-80r/min,温度为78-80℃的条件下,回流反应3-5h,制得铜有机框架;Step A1: 2,2':6',2''-terpyridine-4'-carboxylic acid, anhydrous ethanol, p-toluenesulfonic acid and toluene are uniformly mixed, and the mixture is reacted for 10-15 hours at a speed of 120-150 r/min and a temperature of 90-100° C. to obtain an intermediate 1, and cupric chloride dihydrate is dissolved in anhydrous ethanol, and the intermediate 1 is added, and nitrogen is introduced for protection, and the mixture is refluxed for 3-5 hours at a speed of 60-80 r/min and a temperature of 78-80° C. to obtain a copper organic framework;
步骤A2:将铜有机框架分散在乙醇中,加入氢氧化钠溶液,在温度为90-95℃的条件下,回流反应10-15h,制得功能化有机框架,将功能化有机框架、γ-氨丙基甲基二乙氧基硅烷、二环己基碳二亚胺和甲苯混合均匀,在转速为150-200r/min,温度为40-50℃的条件下,进行反应2-3h,制得改性有机框架;Step A2: Dispersing the copper organic framework in ethanol, adding sodium hydroxide solution, and reflux reacting for 10-15 hours at a temperature of 90-95° C. to obtain a functionalized organic framework, and uniformly mixing the functionalized organic framework, γ-aminopropylmethyldiethoxysilane, dicyclohexylcarbodiimide and toluene, and reacting for 2-3 hours at a speed of 150-200 r/min and a temperature of 40-50° C. to obtain a modified organic framework;
步骤A3:将氧化石墨烯分散在无水乙醇中,加入KH550和二环己基碳二亚胺,在转速为150-200r/min,温度为40-50℃的条件下,进行反应2-3h,制得预处理石墨烯,将预处理石墨烯、改性有机框架、二甲基二乙氧基硅烷和无水乙醇混合均匀,在转速为60-80r/min,温度为65-70℃的条件下,搅拌并加入去离子水和盐酸溶液,进行反应2-3h,加入钛酸正丁酯,继续反应2-3h,升温至120-130℃,保温处理1-1.5h,制得改性填料。Step A3: Disperse graphene oxide in anhydrous ethanol, add KH550 and dicyclohexylcarbodiimide, react for 2-3 hours at a speed of 150-200 r/min and a temperature of 40-50°C to obtain pretreated graphene, mix the pretreated graphene, modified organic framework, dimethyldiethoxysilane and anhydrous ethanol evenly, stir and add deionized water and hydrochloric acid solution at a speed of 60-80 r/min and a temperature of 65-70°C, react for 2-3 hours, add n-butyl titanate, continue to react for 2-3 hours, heat to 120-130°C, and keep warm for 1-1.5 hours to obtain a modified filler.
进一步,步骤A1所述的2,2':6',2''-三联吡啶-4'-羧酸和无水乙醇摩尔比为1:1,对甲基苯磺酸的用量为2,2':6',2''-三联吡啶-4'-羧酸,二水氯化铜和中间体1的摩尔比为1:1。Furthermore, the molar ratio of 2,2':6',2''-terpyridine-4'-carboxylic acid and anhydrous ethanol in step A1 is 1:1, the amount of p-toluenesulfonic acid used is 2,2':6',2''-terpyridine-4'-carboxylic acid, and the molar ratio of cupric chloride dihydrate and intermediate 1 is 1:1.
进一步,步骤A2所述的铜有机框架和氢氧化钠溶液的用量比为1g:6mL,氢氧化钠溶液的浓度为6mmol/L,功能化有机框架的羧基、γ-氨丙基甲基二乙氧基硅烷和二环己基碳二亚胺的摩尔比为1:1:1.1。Furthermore, the amount ratio of the copper organic framework and the sodium hydroxide solution described in step A2 is 1g:6mL, the concentration of the sodium hydroxide solution is 6mmol/L, and the molar ratio of the carboxyl group, γ-aminopropylmethyldiethoxysilane and dicyclohexylcarbodiimide of the functionalized organic framework is 1:1:1.1.
进一步,步骤A3所述的KH550的用量为氧化石墨烯质量的3%,KH550和二环己基碳二亚胺的摩尔比为1:1,预处理石墨烯、改性有机框架、二甲基二乙氧基硅烷、无水乙醇、去离子水、盐酸溶液和钛酸正丁酯的用量比为1g:3g:10mmol:30mL:40mL:10mL:5mmol,盐酸溶液的质量分数为5%。Furthermore, the amount of KH550 described in step A3 is 3% of the mass of graphene oxide, the molar ratio of KH550 and dicyclohexylcarbodiimide is 1:1, the amount ratio of pretreated graphene, modified organic framework, dimethyldiethoxysilane, anhydrous ethanol, deionized water, hydrochloric acid solution and n-butyl titanate is 1g:3g:10mmol:30mL:40mL:10mL:5mmol, and the mass fraction of hydrochloric acid solution is 5%.
进一步,所述的改性载体由如下步骤制成:Further, the modified carrier is prepared by the following steps:
步骤B1:将3,4-二羟基苯甲酸、环氧丙醇、对甲基苯磺酸和甲苯混合均匀,在转速为150-200r/min,温度为100-110℃的条件下,进行反应6-8h,制得中间体2,将苯硼酸、中间体2、氯仿和5A分子筛混合均匀,通入氮气保护,在转速为120-150r/min,温度为60-65℃的条件下,进行反应10-15h,制得中间体3;Step B1: 3,4-dihydroxybenzoic acid, glycidol, p-toluenesulfonic acid and toluene are mixed evenly, and reacted at a speed of 150-200 r/min and a temperature of 100-110° C. for 6-8 hours to obtain intermediate 2; phenylboric acid, intermediate 2, chloroform and 5A molecular sieve are mixed evenly, nitrogen is introduced for protection, and reacted at a speed of 120-150 r/min and a temperature of 60-65° C. for 10-15 hours to obtain intermediate 3;
步骤B2:将α-纤维素和氢氧化钠溶液混合,在转速为150-200r/min,温度为50-60℃的条件下,搅拌处理4-5h,制得碱化纤维素,将碱化纤维素、中间体3和二氧六环混合均匀,在转速为120-150r/min,温度为70-80℃,pH值为9-10的条件下,进行反应7-9h,制得改性纤维素,称取如下重量份原料:改性纤维素20-30份、二乙二醇单丁醚60-80份、蓖麻油5-10份和硬脂酰胺1-3份,将原料混合均匀,制得改性载体。Step B2: α-cellulose and sodium hydroxide solution are mixed, and stirred for 4-5 hours at a rotation speed of 150-200 r/min and a temperature of 50-60° C. to obtain alkalized cellulose. The alkalized cellulose, intermediate 3 and dioxane are mixed evenly, and reacted for 7-9 hours at a rotation speed of 120-150 r/min, a temperature of 70-80° C. and a pH value of 9-10 to obtain modified cellulose. The following raw materials are weighed in parts by weight: 20-30 parts of modified cellulose, 60-80 parts of diethylene glycol monobutyl ether, 5-10 parts of castor oil and 1-3 parts of stearamide, and the raw materials are mixed evenly to obtain a modified carrier.
进一步,步骤B1所述的3,4-二羟基苯甲酸和环氧丙醇的摩尔比为1:1,对甲苯磺酸的用量为3,4-二羟基苯甲酸质量的2%,苯硼酸、中间体2和5A分子筛的用量比为16mmol:15mmol:2g。Furthermore, the molar ratio of 3,4-dihydroxybenzoic acid and propylene oxide in step B1 is 1:1, the amount of p-toluenesulfonic acid used is 2% of the mass of 3,4-dihydroxybenzoic acid, and the amount ratio of phenylboric acid, intermediate 2 and 5A molecular sieve is 16mmol:15mmol:2g.
进一步,步骤B2所述的α-纤维素和氢氧化钠溶液的用量比为1g:25mL,氢氧化钠溶液的质量分数为15%,碱化纤维素和中间体3的质量比为1:1。Furthermore, the dosage ratio of the α-cellulose and the sodium hydroxide solution in step B2 is 1 g:25 mL, the mass fraction of the sodium hydroxide solution is 15%, and the mass ratio of the alkalized cellulose and the intermediate 3 is 1:1.
本发明的有益效果:本发明制备的一种TOPCon电池用导电浆料包括如下原料:导电添加剂、银粉、玻璃粉和改性载体,导电添加剂以2,2':6',2''-三联吡啶-4'-羧酸和无水乙醇反应,使得2,2':6',2''-三联吡啶-4'-羧酸上的羧基和无水乙醇上的羟基酯化,制得中间体1,将中间体1和二水氯化铜反应,使得中间体1上的三联吡啶和铜离子络合,形成铜有机框架,将铜有机框架用氢氧化钠溶液水解,使得铜有机框架上的酯基转变为羧基,制得功能化有机框架,将功能化有机框架和γ-氨丙基甲基二乙氧基硅烷反应,使得功能化有机框架上的羧基和γ-氨丙基甲基二乙氧基硅烷上的氨基脱水,制得改性有机框架,将氧化石墨烯和KH550反应,使得氧化石墨烯上的羧基和KH550上的氨基脱水反应,制得预处理石墨烯,将预处理石墨烯、改性有机框架、二甲基二乙氧基硅烷和钛酸正丁酯,水解缩合形成含钛的有机硅链段,制得改性填料,将改性填料高温烧结后,制得导电添加剂,导电添加剂中含有铜、钛、二氧化硅和石墨烯结构,能够减少电子在传输过程中的损失,且铜也能够与硅或多晶硅形成低阻的欧姆接触,易形成数量多和深度浅的银铜尖钉,银铜尖钉成为电流传输的桥梁,实现更好的欧姆接触,同时能够防止形成银金属尖钉时穿透硅衬底,并提高对光的捕获,将原本不可以利用的光利用起来,拓宽了对太阳光的吸收范围,提升光电转化率,改性载体以3,4-二羟基苯甲酸和环氧丙醇为原料,使得3,4-二羟基苯甲酸上的羧基和环氧丙醇上的羟基反应,制得中间体2,将苯硼酸和中间体2反应,使得苯硼酸上的硼酸基团和中间体2上的邻苯二酚基团反应,制得中间体3,将α-纤维素用氢氧化钠溶液处理,形成碱化纤维素,将碱化纤维素与中间体3反应,使得中间体3上的环氧基和碱化纤维素上的羟基反应,制得改性纤维,将改性纤维素、二乙二醇单丁醚、蓖麻油和硬脂酰胺混合,制得改性载体,在导电浆料烧结过程中改性载体能够提供硼掺杂,与导电添加剂配合,能够提升电荷载流子流动速率,进而提高导电性能。Beneficial effects of the present invention: A conductive paste for a TOPCon battery prepared by the present invention comprises the following raw materials: a conductive additive, silver powder, glass powder and a modified carrier, wherein the conductive additive reacts with 2,2':6',2''-terpyridine-4'-carboxylic acid and anhydrous ethanol, so that the carboxyl group on the 2,2':6',2''-terpyridine-4'-carboxylic acid and the hydroxyl group on the anhydrous ethanol are esterified to obtain an intermediate 1, the intermediate 1 is reacted with copper chloride dihydrate, so that the terpyridine on the intermediate 1 is complexed with copper ions to form a copper organic framework, and the copper organic framework is hydrolyzed with a sodium hydroxide solution, so that the ester group on the copper organic framework is converted into The functionalized organic framework is reacted with γ-aminopropylmethyldiethoxysilane to dehydrate the carboxyl groups on the functionalized organic framework and the amino groups on the γ-aminopropylmethyldiethoxysilane to obtain a modified organic framework; the graphene oxide is reacted with KH550 to dehydrate the carboxyl groups on the graphene oxide and the amino groups on the KH550 to obtain pretreated graphene; the pretreated graphene, the modified organic framework, dimethyldiethoxysilane and n-butyl titanate are hydrolyzed and condensed to form a titanium-containing organic silicon segment to obtain a modified filler; the modified filler is sintered at a high temperature to obtain a conductive additive, wherein the conductive additive contains The copper, titanium, silicon dioxide and graphene structure can reduce the loss of electrons during transmission, and copper can also form a low-resistance ohmic contact with silicon or polysilicon, and it is easy to form a large number of shallow silver-copper spikes. The silver-copper spikes become a bridge for current transmission, achieving better ohmic contact, and can prevent the formation of silver metal spikes from penetrating the silicon substrate, and improve the capture of light, making use of light that was originally unusable, broadening the absorption range of sunlight, and improving the photoelectric conversion rate. The modified carrier uses 3,4-dihydroxybenzoic acid and propylene oxide as raw materials, so that the carboxyl group on 3,4-dihydroxybenzoic acid and the hydroxyl group on propylene oxide react , intermediate 2 is obtained, phenylboronic acid is reacted with intermediate 2, so that the boric acid group on phenylboronic acid reacts with the catechol group on intermediate 2 to obtain intermediate 3, α-cellulose is treated with sodium hydroxide solution to form alkalized cellulose, alkalized cellulose is reacted with intermediate 3, so that the epoxy group on intermediate 3 reacts with the hydroxyl group on alkalized cellulose to obtain modified fiber, modified cellulose, diethylene glycol monobutyl ether, castor oil and stearamide are mixed to obtain a modified carrier, and the modified carrier can provide boron doping during the sintering process of the conductive slurry, and can be combined with the conductive additive to increase the charge carrier flow rate, thereby improving the conductive performance.
具体实施方式DETAILED DESCRIPTION
下面将对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
实施例1Example 1
一种TOPCon电池用导电浆料的生产工艺,具体包括如下步骤:A production process of conductive paste for TOPCon batteries, specifically comprising the following steps:
将改性填料放入管式炉中,在升温速率为5℃/min,氮气氛围条件下,升温至800℃,烧结2h,制得导电添加剂,称取如下重量份原料:导电添加剂3份、银粉85份、玻璃粉1份和改性载体9份,将原料混合均匀并研磨细度至5μm,制得TOPCon电池用导电浆料。The modified filler was placed in a tubular furnace, heated to 800°C at a heating rate of 5°C/min in a nitrogen atmosphere, and sintered for 2 hours to obtain a conductive additive. The following raw materials were weighed in parts by weight: 3 parts of conductive additive, 85 parts of silver powder, 1 part of glass powder and 9 parts of modified carrier. The raw materials were mixed evenly and ground to a fineness of 5μm to obtain a conductive slurry for TOPCon batteries.
所述的玻璃粉含有二氧化硅18wt%、三氧化二铝5wt%、三氧化二硼26wt%、氧化铅49%、氧化钙1wt%和氧化镁1wt%。The glass powder contains 18wt% silicon dioxide, 5wt% aluminum oxide, 26wt% boron oxide, 49% lead oxide, 1wt% calcium oxide and 1wt% magnesium oxide.
所述的改性填料由如下步骤制成:The modified filler is prepared by the following steps:
步骤A1:将2,2':6',2''-三联吡啶-4'-羧酸、无水乙醇、对甲基苯磺酸和甲苯混合均匀,在转速为120r/min,温度为90℃的条件下,进行反应10h,制得中间体1,将二水氯化铜溶于无水乙醇中,加入中间体1,通入氮气保护,在转速为60r/min,温度为78℃的条件下,回流反应3h,制得铜有机框架;Step A1: 2,2':6',2''-terpyridine-4'-carboxylic acid, anhydrous ethanol, p-toluenesulfonic acid and toluene are mixed evenly, and reacted at a speed of 120 r/min and a temperature of 90° C. for 10 hours to obtain an intermediate 1; cupric chloride dihydrate is dissolved in anhydrous ethanol, and the intermediate 1 is added, and nitrogen is introduced for protection, and refluxed at a speed of 60 r/min and a temperature of 78° C. for 3 hours to obtain a copper organic framework;
步骤A2:将铜有机框架分散在乙醇中,加入氢氧化钠溶液,在温度为90℃的条件下,回流反应10h,制得功能化有机框架,将功能化有机框架、γ-氨丙基甲基二乙氧基硅烷、二环己基碳二亚胺和甲苯混合均匀,在转速为150r/min,温度为40℃的条件下,进行反应2h,制得改性有机框架;Step A2: Disperse the copper organic framework in ethanol, add sodium hydroxide solution, and reflux for reaction at 90° C. for 10 h to obtain a functionalized organic framework; mix the functionalized organic framework, γ-aminopropylmethyldiethoxysilane, dicyclohexylcarbodiimide and toluene evenly, and react for 2 h at a speed of 150 r/min and a temperature of 40° C. to obtain a modified organic framework;
步骤A3:将氧化石墨烯分散在无水乙醇中,加入KH550和二环己基碳二亚胺,在转速为150r/min,温度为40℃的条件下,进行反应2h,制得预处理石墨烯,将预处理石墨烯、改性有机框架、二甲基二乙氧基硅烷和无水乙醇混合均匀,在转速为60r/min,温度为65℃的条件下,搅拌并加入去离子水和盐酸溶液,进行反应2h,加入钛酸正丁酯,继续反应2h,升温至120℃,保温处理1h,制得改性填料。Step A3: Disperse graphene oxide in anhydrous ethanol, add KH550 and dicyclohexylcarbodiimide, react for 2 hours at a speed of 150 r/min and a temperature of 40°C to obtain pretreated graphene, mix the pretreated graphene, modified organic framework, dimethyldiethoxysilane and anhydrous ethanol evenly, stir and add deionized water and hydrochloric acid solution at a speed of 60 r/min and a temperature of 65°C, react for 2 hours, add n-butyl titanate, continue to react for 2 hours, heat to 120°C, and keep warm for 1 hour to obtain a modified filler.
步骤A1所述的2,2':6',2''-三联吡啶-4'-羧酸和无水乙醇摩尔比为1:1,对甲基苯磺酸的用量为2,2':6',2''-三联吡啶-4'-羧酸,二水氯化铜和中间体1的摩尔比为1:1。The molar ratio of 2,2':6',2''-terpyridine-4'-carboxylic acid and anhydrous ethanol in step A1 is 1:1, the amount of p-toluenesulfonic acid used is 2,2':6',2''-terpyridine-4'-carboxylic acid, and the molar ratio of cupric chloride dihydrate and intermediate 1 is 1:1.
步骤A2所述的铜有机框架和氢氧化钠溶液的用量比为1g:6mL,氢氧化钠溶液的浓度为6mmol/L,功能化有机框架的羧基、γ-氨丙基甲基二乙氧基硅烷和二环己基碳二亚胺的摩尔比为1:1:1.1。The amount ratio of the copper organic framework and the sodium hydroxide solution described in step A2 is 1g:6mL, the concentration of the sodium hydroxide solution is 6mmol/L, and the molar ratio of the carboxyl group, γ-aminopropylmethyldiethoxysilane and dicyclohexylcarbodiimide of the functionalized organic framework is 1:1:1.1.
步骤A3所述的KH550的用量为氧化石墨烯质量的3%,KH550和二环己基碳二亚胺的摩尔比为1:1,预处理石墨烯、改性有机框架、二甲基二乙氧基硅烷、无水乙醇、去离子水、盐酸溶液和钛酸正丁酯的用量比为1g:3g:10mmol:30mL:40mL:10mL:5mmol,盐酸溶液的质量分数为5%。The amount of KH550 described in step A3 is 3% of the mass of graphene oxide, the molar ratio of KH550 and dicyclohexylcarbodiimide is 1:1, the amount ratio of pretreated graphene, modified organic framework, dimethyldiethoxysilane, anhydrous ethanol, deionized water, hydrochloric acid solution and n-butyl titanate is 1g:3g:10mmol:30mL:40mL:10mL:5mmol, and the mass fraction of hydrochloric acid solution is 5%.
所述的改性载体由如下步骤制成:The modified carrier is prepared by the following steps:
步骤B1:将3,4-二羟基苯甲酸、环氧丙醇、对甲基苯磺酸和甲苯混合均匀,在转速为150r/min,温度为100℃的条件下,进行反应6h,制得中间体2,将苯硼酸、中间体2、氯仿和5A分子筛混合均匀,通入氮气保护,在转速为120r/min,温度为60℃的条件下,进行反应10h,制得中间体3;Step B1: 3,4-dihydroxybenzoic acid, propylene oxide, p-toluenesulfonic acid and toluene were mixed evenly, and the mixture was reacted at a speed of 150 r/min and a temperature of 100° C. for 6 h to obtain intermediate 2; phenylboric acid, intermediate 2, chloroform and 5A molecular sieve were mixed evenly, nitrogen was introduced for protection, and the mixture was reacted at a speed of 120 r/min and a temperature of 60° C. for 10 h to obtain intermediate 3;
步骤B2:将α-纤维素和氢氧化钠溶液混合,在转速为150r/min,温度为50℃的条件下,搅拌处理4h,制得碱化纤维素,将碱化纤维素、中间体3和二氧六环混合均匀,在转速为120r/min,温度为70℃,pH值为9的条件下,进行反应7h,制得改性纤维素,称取如下重量份原料:改性纤维素20份、二乙二醇单丁醚60份、蓖麻油5份和硬脂酰胺1份,将原料混合均匀,制得改性载体。Step B2: α-cellulose and sodium hydroxide solution are mixed, and stirred for 4 hours at a speed of 150 r/min and a temperature of 50° C. to obtain alkalized cellulose. The alkalized cellulose, intermediate 3 and dioxane are mixed evenly, and reacted for 7 hours at a speed of 120 r/min, a temperature of 70° C. and a pH value of 9 to obtain modified cellulose. The following raw materials are weighed in parts by weight: 20 parts of modified cellulose, 60 parts of diethylene glycol monobutyl ether, 5 parts of castor oil and 1 part of stearamide, and the raw materials are mixed evenly to obtain a modified carrier.
步骤B1所述的3,4-二羟基苯甲酸和环氧丙醇的摩尔比为1:1,对甲苯磺酸的用量为3,4-二羟基苯甲酸质量的2%,苯硼酸、中间体2和5A分子筛的用量比为16mmol:15mmol:2g。The molar ratio of 3,4-dihydroxybenzoic acid and propylene oxide in step B1 is 1:1, the amount of p-toluenesulfonic acid used is 2% of the mass of 3,4-dihydroxybenzoic acid, and the amount ratio of phenylboric acid, intermediate 2 and 5A molecular sieve is 16mmol:15mmol:2g.
步骤B2所述的α-纤维素和氢氧化钠溶液的用量比为1g:25mL,氢氧化钠溶液的质量分数为15%,碱化纤维素和中间体3的质量比为1:1。The dosage ratio of α-cellulose and sodium hydroxide solution in step B2 is 1 g:25 mL, the mass fraction of sodium hydroxide solution is 15%, and the mass ratio of alkalized cellulose and intermediate 3 is 1:1.
实施例2Example 2
一种TOPCon电池用导电浆料的生产工艺,具体包括如下步骤:A production process of conductive paste for TOPCon batteries, specifically comprising the following steps:
将改性填料放入管式炉中,在升温速率为5℃/min,氮气氛围条件下,升温至830℃,烧结2.5h,制得导电添加剂,称取如下重量份原料:导电添加剂4份、银粉88份、玻璃粉3份和改性载体9.5份,将原料混合均匀并研磨细度至5μm,制得TOPCon电池用导电浆料。The modified filler was placed in a tubular furnace, heated to 830°C at a heating rate of 5°C/min in a nitrogen atmosphere, and sintered for 2.5 hours to obtain a conductive additive. The following raw materials were weighed in parts by weight: 4 parts of conductive additive, 88 parts of silver powder, 3 parts of glass powder and 9.5 parts of modified carrier. The raw materials were mixed evenly and ground to a fineness of 5μm to obtain a conductive slurry for TOPCon batteries.
所述的玻璃粉含有二氧化硅18wt%、三氧化二铝5wt%、三氧化二硼26wt%、氧化铅49%、氧化钙1wt%和氧化镁1wt%。The glass powder contains 18wt% silicon dioxide, 5wt% aluminum oxide, 26wt% boron oxide, 49% lead oxide, 1wt% calcium oxide and 1wt% magnesium oxide.
所述的改性填料由如下步骤制成:The modified filler is prepared by the following steps:
步骤A1:将2,2':6',2''-三联吡啶-4'-羧酸、无水乙醇、对甲基苯磺酸和甲苯混合均匀,在转速为120r/min,温度为95℃的条件下,进行反应13h,制得中间体1,将二水氯化铜溶于无水乙醇中,加入中间体1,通入氮气保护,在转速为60r/min,温度为79℃的条件下,回流反应4h,制得铜有机框架;Step A1: 2,2':6',2''-terpyridine-4'-carboxylic acid, anhydrous ethanol, p-toluenesulfonic acid and toluene are mixed evenly, and reacted at a speed of 120 r/min and a temperature of 95° C. for 13 hours to obtain intermediate 1, and cupric chloride dihydrate is dissolved in anhydrous ethanol, and intermediate 1 is added, and nitrogen protection is introduced, and reflux reaction is carried out at a speed of 60 r/min and a temperature of 79° C. for 4 hours to obtain a copper organic framework;
步骤A2:将铜有机框架分散在乙醇中,加入氢氧化钠溶液,在温度为93℃的条件下,回流反应13h,制得功能化有机框架,将功能化有机框架、γ-氨丙基甲基二乙氧基硅烷、二环己基碳二亚胺和甲苯混合均匀,在转速为150r/min,温度为45℃的条件下,进行反应2.5h,制得改性有机框架;Step A2: Disperse the copper organic framework in ethanol, add sodium hydroxide solution, and reflux for reaction at 93° C. for 13 h to obtain a functionalized organic framework; uniformly mix the functionalized organic framework, γ-aminopropylmethyldiethoxysilane, dicyclohexylcarbodiimide and toluene, and react for 2.5 h at a speed of 150 r/min and a temperature of 45° C. to obtain a modified organic framework;
步骤A3:将氧化石墨烯分散在无水乙醇中,加入KH550和二环己基碳二亚胺,在转速为150r/min,温度为45℃的条件下,进行反应2.5h,制得预处理石墨烯,将预处理石墨烯、改性有机框架、二甲基二乙氧基硅烷和无水乙醇混合均匀,在转速为60r/min,温度为68℃的条件下,搅拌并加入去离子水和盐酸溶液,进行反应2h,加入钛酸正丁酯,继续反应3h,升温至125℃,保温处理1.3h,制得改性填料。Step A3: Disperse graphene oxide in anhydrous ethanol, add KH550 and dicyclohexylcarbodiimide, react for 2.5 hours at a speed of 150 r/min and a temperature of 45°C to obtain pretreated graphene, mix the pretreated graphene, modified organic framework, dimethyldiethoxysilane and anhydrous ethanol evenly, stir and add deionized water and hydrochloric acid solution at a speed of 60 r/min and a temperature of 68°C, react for 2 hours, add n-butyl titanate, continue to react for 3 hours, heat to 125°C, and keep warm for 1.3 hours to obtain a modified filler.
步骤A1所述的2,2':6',2''-三联吡啶-4'-羧酸和无水乙醇摩尔比为1:1,对甲基苯磺酸的用量为2,2':6',2''-三联吡啶-4'-羧酸,二水氯化铜和中间体1的摩尔比为1:1。The molar ratio of 2,2':6',2''-terpyridine-4'-carboxylic acid and anhydrous ethanol in step A1 is 1:1, the amount of p-toluenesulfonic acid used is 2,2':6',2''-terpyridine-4'-carboxylic acid, and the molar ratio of cupric chloride dihydrate and intermediate 1 is 1:1.
步骤A2所述的铜有机框架和氢氧化钠溶液的用量比为1g:6mL,氢氧化钠溶液的浓度为6mmol/L,功能化有机框架的羧基、γ-氨丙基甲基二乙氧基硅烷和二环己基碳二亚胺的摩尔比为1:1:1.1。The amount ratio of the copper organic framework and the sodium hydroxide solution described in step A2 is 1g:6mL, the concentration of the sodium hydroxide solution is 6mmol/L, and the molar ratio of the carboxyl group, γ-aminopropylmethyldiethoxysilane and dicyclohexylcarbodiimide of the functionalized organic framework is 1:1:1.1.
步骤A3所述的KH550的用量为氧化石墨烯质量的3%,KH550和二环己基碳二亚胺的摩尔比为1:1,预处理石墨烯、改性有机框架、二甲基二乙氧基硅烷、无水乙醇、去离子水、盐酸溶液和钛酸正丁酯的用量比为1g:3g:10mmol:30mL:40mL:10mL:5mmol,盐酸溶液的质量分数为5%。The amount of KH550 described in step A3 is 3% of the mass of graphene oxide, the molar ratio of KH550 and dicyclohexylcarbodiimide is 1:1, the amount ratio of pretreated graphene, modified organic framework, dimethyldiethoxysilane, anhydrous ethanol, deionized water, hydrochloric acid solution and n-butyl titanate is 1g:3g:10mmol:30mL:40mL:10mL:5mmol, and the mass fraction of hydrochloric acid solution is 5%.
所述的改性载体由如下步骤制成:The modified carrier is prepared by the following steps:
步骤B1:将3,4-二羟基苯甲酸、环氧丙醇、对甲基苯磺酸和甲苯混合均匀,在转速为150r/min,温度为105℃的条件下,进行反应7h,制得中间体2,将苯硼酸、中间体2、氯仿和5A分子筛混合均匀,通入氮气保护,在转速为120r/min,温度为65℃的条件下,进行反应13h,制得中间体3;Step B1: 3,4-dihydroxybenzoic acid, propylene oxide, p-toluenesulfonic acid and toluene were mixed evenly, and the mixture was reacted at a speed of 150 r/min and a temperature of 105° C. for 7 h to obtain intermediate 2; phenylboric acid, intermediate 2, chloroform and 5A molecular sieve were mixed evenly, nitrogen was introduced for protection, and the mixture was reacted at a speed of 120 r/min and a temperature of 65° C. for 13 h to obtain intermediate 3;
步骤B2:将α-纤维素和氢氧化钠溶液混合,在转速为150r/min,温度为55℃的条件下,搅拌处理4.5h,制得碱化纤维素,将碱化纤维素、中间体3和二氧六环混合均匀,在转速为120r/min,温度为75℃,pH值为10的条件下,进行反应8h,制得改性纤维素,称取如下重量份原料:改性纤维素25份、二乙二醇单丁醚70份、蓖麻油8份和硬脂酰胺2份,将原料混合均匀,制得改性载体。Step B2: α-cellulose and sodium hydroxide solution are mixed, and stirred for 4.5 hours at a speed of 150 r/min and a temperature of 55° C. to obtain alkalized cellulose. The alkalized cellulose, intermediate 3 and dioxane are mixed evenly, and reacted for 8 hours at a speed of 120 r/min, a temperature of 75° C. and a pH value of 10 to obtain modified cellulose. The following raw materials are weighed in parts by weight: 25 parts of modified cellulose, 70 parts of diethylene glycol monobutyl ether, 8 parts of castor oil and 2 parts of stearamide, and the raw materials are mixed evenly to obtain a modified carrier.
步骤B1所述的3,4-二羟基苯甲酸和环氧丙醇的摩尔比为1:1,对甲苯磺酸的用量为3,4-二羟基苯甲酸质量的2%,苯硼酸、中间体2和5A分子筛的用量比为16mmol:15mmol:2g。The molar ratio of 3,4-dihydroxybenzoic acid and propylene oxide in step B1 is 1:1, the amount of p-toluenesulfonic acid used is 2% of the mass of 3,4-dihydroxybenzoic acid, and the amount ratio of phenylboric acid, intermediate 2 and 5A molecular sieve is 16mmol:15mmol:2g.
步骤B2所述的α-纤维素和氢氧化钠溶液的用量比为1g:25mL,氢氧化钠溶液的质量分数为15%,碱化纤维素和中间体3的质量比为1:1。The dosage ratio of α-cellulose and sodium hydroxide solution in step B2 is 1 g:25 mL, the mass fraction of sodium hydroxide solution is 15%, and the mass ratio of alkalized cellulose and intermediate 3 is 1:1.
实施例3Example 3
一种TOPCon电池用导电浆料的生产工艺,具体包括如下步骤:A production process of conductive paste for TOPCon batteries, specifically comprising the following steps:
将改性填料放入管式炉中,在升温速率为5℃/min,氮气氛围条件下,升温至850℃,烧结3h,制得导电添加剂,称取如下重量份原料:导电添加剂5份、银粉90份、玻璃粉5份和改性载体10份,将原料混合均匀并研磨细度至5μm,制得TOPCon电池用导电浆料。The modified filler was placed in a tubular furnace, heated to 850°C at a heating rate of 5°C/min in a nitrogen atmosphere, and sintered for 3 hours to obtain a conductive additive. The following raw materials were weighed in parts by weight: 5 parts of conductive additive, 90 parts of silver powder, 5 parts of glass powder and 10 parts of modified carrier. The raw materials were mixed evenly and ground to a fineness of 5μm to obtain a conductive slurry for TOPCon batteries.
所述的玻璃粉含有二氧化硅18wt%、三氧化二铝5wt%、三氧化二硼26wt%、氧化铅49%、氧化钙1wt%和氧化镁1wt%。The glass powder contains 18wt% silicon dioxide, 5wt% aluminum oxide, 26wt% boron oxide, 49% lead oxide, 1wt% calcium oxide and 1wt% magnesium oxide.
所述的改性填料由如下步骤制成:The modified filler is prepared by the following steps:
步骤A1:将2,2':6',2''-三联吡啶-4'-羧酸、无水乙醇、对甲基苯磺酸和甲苯混合均匀,在转速为150r/min,温度为100℃的条件下,进行反应15h,制得中间体1,将二水氯化铜溶于无水乙醇中,加入中间体1,通入氮气保护,在转速为80r/min,温度为80℃的条件下,回流反应5h,制得铜有机框架;Step A1: 2,2':6',2''-terpyridine-4'-carboxylic acid, anhydrous ethanol, p-toluenesulfonic acid and toluene are mixed evenly, and reacted for 15 hours at a speed of 150 r/min and a temperature of 100° C. to obtain an intermediate 1, and cupric chloride dihydrate is dissolved in anhydrous ethanol, and the intermediate 1 is added, and nitrogen protection is introduced, and reflux reaction is carried out for 5 hours at a speed of 80 r/min and a temperature of 80° C. to obtain a copper organic framework;
步骤A2:将铜有机框架分散在乙醇中,加入氢氧化钠溶液,在温度为95℃的条件下,回流反应15h,制得功能化有机框架,将功能化有机框架、γ-氨丙基甲基二乙氧基硅烷、二环己基碳二亚胺和甲苯混合均匀,在转速为200r/min,温度为50℃的条件下,进行反应3h,制得改性有机框架;Step A2: Disperse the copper organic framework in ethanol, add sodium hydroxide solution, and reflux for reaction at 95° C. for 15 h to obtain a functionalized organic framework; uniformly mix the functionalized organic framework, γ-aminopropylmethyldiethoxysilane, dicyclohexylcarbodiimide and toluene, and react for 3 h at a speed of 200 r/min and a temperature of 50° C. to obtain a modified organic framework;
步骤A3:将氧化石墨烯分散在无水乙醇中,加入KH550和二环己基碳二亚胺,在转速为200r/min,温度为50℃的条件下,进行反应3h,制得预处理石墨烯,将预处理石墨烯、改性有机框架、二甲基二乙氧基硅烷和无水乙醇混合均匀,在转速为80r/min,温度为70℃的条件下,搅拌并加入去离子水和盐酸溶液,进行反应3h,加入钛酸正丁酯,继续反应3h,升温至130℃,保温处理1.5h,制得改性填料。Step A3: Disperse graphene oxide in anhydrous ethanol, add KH550 and dicyclohexylcarbodiimide, react for 3 hours at a speed of 200 r/min and a temperature of 50°C to obtain pretreated graphene, mix the pretreated graphene, modified organic framework, dimethyldiethoxysilane and anhydrous ethanol evenly, stir and add deionized water and hydrochloric acid solution at a speed of 80 r/min and a temperature of 70°C, react for 3 hours, add n-butyl titanate, continue to react for 3 hours, heat to 130°C, and keep warm for 1.5 hours to obtain a modified filler.
步骤A1所述的2,2':6',2''-三联吡啶-4'-羧酸和无水乙醇摩尔比为1:1,对甲基苯磺酸的用量为2,2':6',2''-三联吡啶-4'-羧酸,二水氯化铜和中间体1的摩尔比为1:1。The molar ratio of 2,2':6',2''-terpyridine-4'-carboxylic acid and anhydrous ethanol in step A1 is 1:1, the amount of p-toluenesulfonic acid used is 2,2':6',2''-terpyridine-4'-carboxylic acid, and the molar ratio of cupric chloride dihydrate and intermediate 1 is 1:1.
步骤A2所述的铜有机框架和氢氧化钠溶液的用量比为1g:6mL,氢氧化钠溶液的浓度为6mmol/L,功能化有机框架的羧基、γ-氨丙基甲基二乙氧基硅烷和二环己基碳二亚胺的摩尔比为1:1:1.1。The amount ratio of the copper organic framework and the sodium hydroxide solution described in step A2 is 1g:6mL, the concentration of the sodium hydroxide solution is 6mmol/L, and the molar ratio of the carboxyl group, γ-aminopropylmethyldiethoxysilane and dicyclohexylcarbodiimide of the functionalized organic framework is 1:1:1.1.
步骤A3所述的KH550的用量为氧化石墨烯质量的3%,KH550和二环己基碳二亚胺的摩尔比为1:1,预处理石墨烯、改性有机框架、二甲基二乙氧基硅烷、无水乙醇、去离子水、盐酸溶液和钛酸正丁酯的用量比为1g:3g:10mmol:30mL:40mL:10mL:5mmol,盐酸溶液的质量分数为5%。The amount of KH550 described in step A3 is 3% of the mass of graphene oxide, the molar ratio of KH550 and dicyclohexylcarbodiimide is 1:1, the amount ratio of pretreated graphene, modified organic framework, dimethyldiethoxysilane, anhydrous ethanol, deionized water, hydrochloric acid solution and n-butyl titanate is 1g:3g:10mmol:30mL:40mL:10mL:5mmol, and the mass fraction of hydrochloric acid solution is 5%.
所述的改性载体由如下步骤制成:The modified carrier is prepared by the following steps:
步骤B1:将3,4-二羟基苯甲酸、环氧丙醇、对甲基苯磺酸和甲苯混合均匀,在转速为200r/min,温度为110℃的条件下,进行反应8h,制得中间体2,将苯硼酸、中间体2、氯仿和5A分子筛混合均匀,通入氮气保护,在转速为150r/min,温度为65℃的条件下,进行反应15h,制得中间体3;Step B1: 3,4-dihydroxybenzoic acid, propylene oxide, p-toluenesulfonic acid and toluene were mixed evenly, and the mixture was reacted at a speed of 200 r/min and a temperature of 110° C. for 8 h to obtain intermediate 2; phenylboric acid, intermediate 2, chloroform and 5A molecular sieve were mixed evenly, nitrogen was introduced for protection, and the mixture was reacted at a speed of 150 r/min and a temperature of 65° C. for 15 h to obtain intermediate 3;
步骤B2:将α-纤维素和氢氧化钠溶液混合,在转速为200r/min,温度为60℃的条件下,搅拌处理5h,制得碱化纤维素,将碱化纤维素、中间体3和二氧六环混合均匀,在转速为150r/min,温度为80℃,pH值为10的条件下,进行反应9h,制得改性纤维素,称取如下重量份原料:改性纤维素30份、二乙二醇单丁醚80份、蓖麻油10份和硬脂酰胺3份,将原料混合均匀,制得改性载体。Step B2: α-cellulose and sodium hydroxide solution are mixed, and stirred for 5 hours at a speed of 200 r/min and a temperature of 60° C. to obtain alkalized cellulose. The alkalized cellulose, intermediate 3 and dioxane are mixed evenly, and reacted for 9 hours at a speed of 150 r/min, a temperature of 80° C. and a pH value of 10 to obtain modified cellulose. The following raw materials are weighed in parts by weight: 30 parts of modified cellulose, 80 parts of diethylene glycol monobutyl ether, 10 parts of castor oil and 3 parts of stearamide, and the raw materials are mixed evenly to obtain a modified carrier.
步骤B1所述的3,4-二羟基苯甲酸和环氧丙醇的摩尔比为1:1,对甲苯磺酸的用量为3,4-二羟基苯甲酸质量的2%,苯硼酸、中间体2和5A分子筛的用量比为16mmol:15mmol:2g。The molar ratio of 3,4-dihydroxybenzoic acid and propylene oxide in step B1 is 1:1, the amount of p-toluenesulfonic acid used is 2% of the mass of 3,4-dihydroxybenzoic acid, and the amount ratio of phenylboric acid, intermediate 2 and 5A molecular sieve is 16mmol:15mmol:2g.
步骤B2所述的α-纤维素和氢氧化钠溶液的用量比为1g:25mL,氢氧化钠溶液的质量分数为15%,碱化纤维素和中间体3的质量比为1:1。The dosage ratio of α-cellulose and sodium hydroxide solution in step B2 is 1 g:25 mL, the mass fraction of sodium hydroxide solution is 15%, and the mass ratio of alkalized cellulose and intermediate 3 is 1:1.
对比例1Comparative Example 1
本对比例与实施例1相比用α-纤维素代替改性纤维素,其余步骤相同。Compared with Example 1, this comparative example uses α-cellulose instead of modified cellulose, and the other steps are the same.
对比例2Comparative Example 2
本对比例与实施例1相比未加入改性有机框架,其余步骤相同。Compared with Example 1, this comparative example did not add a modified organic framework, and the remaining steps were the same.
对比例3Comparative Example 3
本对比例与实施例1相比用铜有机框架代替改性填料,其余步骤相同。Compared with Example 1, this comparative example uses a copper organic framework instead of a modified filler, and the remaining steps are the same.
将实施例1-3和对比例1-3制得的导电浆料用Baccini丝网印刷机分别印刷在n型TOPCon电池硅片上,硅片尺寸182mm×182mm,然后在峰值温度为830℃氩气保护下烧结,制得电极片,用德国Berger测试仪PSS10-HE测试其接触电阻和转换效率,检测结果如下表1所示。The conductive pastes prepared in Examples 1-3 and Comparative Examples 1-3 were respectively printed on n-type TOPCon cell silicon wafers with a size of 182 mm×182 mm using a Baccini screen printer, and then sintered under argon protection at a peak temperature of 830° C. to obtain electrode sheets. The contact resistance and conversion efficiency thereof were tested using a German Berger tester PSS10-HE. The test results are shown in Table 1 below.
表1Table 1
由上表可知实施例1-3制得的导电浆料的接触电阻为1.33-1.42mΩ·cm2,转换效率为26.14-26.61%,对比例1制得的导电浆料的接触电阻为2.72mΩ·cm2,转换效率为24.14%,对比例2制得的导电浆料的接触电阻为5.68mΩ·cm2,转换效率为23.07%,对比例3制得的导电浆料的接触电阻为6.31Ω·cm2,转换效率为21.21%,表明本发明具有很好的转化效率。It can be seen from the above table that the contact resistance of the conductive paste prepared in Examples 1-3 is 1.33-1.42 mΩ·cm 2 , and the conversion efficiency is 26.14-26.61%. The contact resistance of the conductive paste prepared in Comparative Example 1 is 2.72 mΩ·cm 2 , and the conversion efficiency is 24.14%. The contact resistance of the conductive paste prepared in Comparative Example 2 is 5.68 mΩ·cm 2 , and the conversion efficiency is 23.07%. The contact resistance of the conductive paste prepared in Comparative Example 3 is 6.31 Ω·cm 2 , and the conversion efficiency is 21.21%, indicating that the present invention has good conversion efficiency.
以上内容仅仅是对本发明的构思所作的举例和说明,所属本技术领域的技术人员对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代,只要不偏离发明的构思或者超越本权利要求书所定义的范围,均应属于本发明的保护范围。The above contents are merely examples and explanations of the concept of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the concept of the invention or exceed the scope defined by the claims, they should all fall within the protection scope of the present invention.
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