CN118068618B - Display panel and display device - Google Patents

Abstract

The application provides a display panel, which comprises an array substrate, a liquid crystal layer and a color film substrate, wherein the array substrate comprises a driving circuit layer and a plurality of pixel electrodes, the color film substrate comprises a public electrode, the driving circuit layer is further electrically connected with a driving circuit unit, and the driving circuit layer controls the electric potential of the plurality of pixel electrodes according to a driving electric signal output by the driving circuit unit. The color film substrate further comprises a thermosensitive assembly, and the thermosensitive assembly is electrically connected with the common electrode and the driving circuit unit respectively. When the temperature of the heat sensitive component is greater than or equal to the preset temperature, the potential of the power supply control signal output by the common electrode is greater than or equal to the preset potential, so that the driving circuit unit stops providing the driving electric signal for the driving circuit layer according to the power supply control signal with the potential greater than or equal to the preset potential, the display panel is automatically powered off, the display panel does not display pictures, the temperature in the display panel is reduced, and further the polaroid of the display panel is prevented from being burnt. The application also provides a display device.

Description

Display panel and display device

Technical Field

The present application relates to the field of display technologies, and in particular, to a display panel and a display device having the same.

Background

With the development of display technology, display devices are widely used in various fields and industries. The display device comprises a display panel for displaying pictures, and the display panel can emit heat when displaying the pictures, so that the local temperature in the display panel is higher, and the polaroid of the display panel is burnt out when the local temperature in the display panel exceeds the preset temperature.

Currently, display panels often use an overcurrent protector (Over Current Protect, OCP) to shut off the circuit to prevent local excessive temperatures within the display panel caused by excessive current. However, the overcurrent protector can only detect the magnitude of the current and cannot detect the temperature in the display panel. This causes frequent occurrence of the case where the overcurrent protector does not cut off the circuit when the temperature in the display panel exceeds a preset temperature or the case where the overcurrent protector cuts off the circuit when the temperature in the display panel does not exceed a preset temperature, so that the display panel is erroneously powered off or powered on.

Therefore, how to solve the problem that the automatic power-off cannot be realized when the temperature in the display panel is high in the prior art is a urgent need for those skilled in the art.

Disclosure of Invention

In view of the foregoing drawbacks of the prior art, an object of the present application is to provide a display panel and a display device having the same, which are intended to solve the problem that automatic power-off cannot be achieved when the temperature in the display panel is high in the prior art.

In order to solve the above technical problems, an embodiment of the present application provides a display panel, where the display panel includes an array substrate, a liquid crystal layer, and a color film substrate that are stacked, the array substrate includes a driving circuit layer and a plurality of pixel electrodes, the color film substrate includes a common electrode, the driving circuit layer and the common electrode are respectively disposed on opposite sides of the liquid crystal layer, the plurality of pixel electrodes are disposed on a side of the driving circuit layer facing the liquid crystal layer and are electrically connected to the driving circuit layer, the driving circuit layer is further electrically connected to a driving circuit unit, the driving circuit layer controls potentials of the plurality of pixel electrodes according to a driving electric signal output by the driving circuit unit, and the pixel electrodes and the common electrode are used for forming a preset electric field for driving liquid crystal molecules of the liquid crystal layer to deflect. The color film substrate further comprises a thermosensitive assembly, at least part of the thermosensitive assembly is arranged on one side of the public electrode, the thermosensitive assembly is respectively and electrically connected with the public electrode and the driving circuit unit, the public electrode is used for outputting a power control signal to the driving circuit unit through the thermosensitive assembly, when the temperature of the thermosensitive assembly is greater than or equal to the preset temperature, the potential of the power control signal output by the public electrode is greater than or equal to the preset potential, and the driving circuit unit stops providing driving electric signals to the driving circuit layer according to the power control signal with the potential greater than or equal to the preset potential.

In summary, the display panel provided by the embodiment of the application includes the common electrode, the thermosensitive element and the driving circuit layer. When the temperature of the heat sensitive component is greater than or equal to the preset temperature, the potential of the power supply control signal output by the common electrode is greater than or equal to the preset potential, and the driving circuit unit stops providing driving electric signals for the driving circuit layer according to the power supply control signal with the potential greater than or equal to the preset potential, so that the display panel is automatically powered off, at the moment, the display panel does not display pictures any more, so that the temperature in the display panel is gradually reduced, and further the polaroid of the display panel is prevented from being burnt.

In an exemplary embodiment, the thermosensitive assembly includes a thermosensitive layer and a first conductive layer stacked on one side of the common electrode, the thermosensitive layer being connected with the common electrode and the first conductive layer, respectively, such that the thermosensitive layer is electrically connected with the common electrode and the first conductive layer, respectively, and the first conductive layer is also electrically connected with the driving circuit unit. The temperature-sensitive layer is used for reducing the resistance value after the temperature of the temperature-sensitive layer is increased, so that the potential of the power supply control signal is increased, and when the temperature of the temperature-sensitive layer is greater than or equal to the preset temperature, the potential of the power supply control signal output to the driving circuit unit by the common electrode is greater than or equal to the preset potential.

In an exemplary embodiment, the heat-sensitive component includes a heat-sensitive layer, a first conductive layer and a protective layer, the protective layer is disposed on one side of the common electrode, a plurality of accommodating holes penetrating through the protective layer are formed in the protective layer, the heat-sensitive layer includes a plurality of heat-sensitive elements, one heat-sensitive element is disposed in one accommodating hole, the first conductive layer is disposed on one side of the protective layer opposite to the common electrode, opposite ends of each heat-sensitive element are respectively connected with the common electrode and the first conductive layer, so that each heat-sensitive element is respectively electrically connected with the common electrode and the first conductive layer, and the first conductive layer is also electrically connected with the driving circuit unit. The temperature-sensitive layer is used for reducing the resistance value after the temperature of the temperature-sensitive layer is increased, so that the potential of the power supply control signal is increased, and when the temperature of the temperature-sensitive layer is greater than or equal to the preset temperature, the potential of the power supply control signal output to the driving circuit unit by the common electrode is greater than or equal to the preset potential.

In an exemplary embodiment, the thermal assembly includes a thermal layer, a first conductive layer and a protective layer, the thermal layer includes a plurality of thermal elements and a first thermal sub-layer, the first thermal sub-layer is disposed on one side of the common electrode and is connected with the common electrode, so that the first thermal sub-layer is electrically connected with the common electrode, the protective layer is disposed on one side of the first thermal sub-layer opposite to the common electrode, a plurality of accommodating holes penetrating through the protective layer are formed in the protective layer, one thermal element is disposed in one of the accommodating holes, the first conductive layer is disposed on one side of the protective layer opposite to the first thermal sub-layer, opposite ends of each thermal element are respectively connected with the first thermal sub-layer and the first conductive layer, so that each thermal element is respectively electrically connected with the first thermal sub-layer and the first conductive layer, and the first conductive layer is also electrically connected with the driving circuit unit. The temperature-sensitive layer is used for reducing the resistance value after the temperature of the temperature-sensitive layer is increased, so that the potential of the power supply control signal is increased, and when the temperature of the temperature-sensitive layer is greater than or equal to the preset temperature, the potential of the power supply control signal output to the driving circuit unit by the common electrode is greater than or equal to the preset potential.

In an exemplary embodiment, the thermal assembly includes a thermal layer, a first conductive layer and a protective layer, the thermal layer includes a plurality of thermal elements and a second thermal sub-layer, the protective layer is disposed on one side of the common electrode, the protective layer is provided with a plurality of accommodating holes penetrating through the protective layer, the thermal layer includes a plurality of thermal elements, one thermal element is disposed in one of the accommodating holes, the second thermal sub-layer is disposed on one side of the protective layer opposite to the common electrode, opposite ends of each thermal element are respectively connected with the second thermal sub-layer and the common electrode, so that each thermal element is respectively electrically connected with the second thermal sub-layer and the common electrode, and the first conductive layer is disposed on one side of the second thermal sub-layer opposite to the protective layer and is electrically connected with the second thermal sub-layer, so that the first conductive layer is electrically connected with the second thermal sub-layer, and the first conductive layer is also electrically connected with the driving circuit. The temperature-sensitive layer is used for reducing the resistance value after the temperature of the temperature-sensitive layer is increased, so that the potential of the power supply control signal is increased, and when the temperature of the temperature-sensitive layer is greater than or equal to the preset temperature, the potential of the power supply control signal output to the driving circuit unit by the common electrode is greater than or equal to the preset potential.

In an exemplary embodiment, the thermal assembly includes a thermal layer, a first conductive layer and a protective layer, where the thermal layer includes a plurality of thermal elements, a first thermal sub-layer and a second thermal sub-layer, where the first thermal sub-layer is disposed on one side of the common electrode and connected to the common electrode, so that the first thermal sub-layer is electrically connected to the common electrode, the protective layer is disposed on a side of the first thermal sub-layer opposite to the common electrode, a plurality of accommodating holes penetrating the protective layer are formed in the protective layer, the thermal layer includes a plurality of thermal elements, one thermal element is disposed in one of the accommodating holes, the second thermal sub-layer is disposed on a side of the protective layer opposite to the first thermal sub-layer, and opposite ends of each thermal element are respectively connected to the first thermal sub-layer and the second thermal sub-layer, so that each thermal element is respectively electrically connected to the first thermal sub-layer and the second thermal sub-layer, the first conductive sub-layer is electrically connected to the first conductive sub-layer and the second conductive layer, and the first conductive sub-layer is electrically connected to the first conductive layer. The temperature-sensitive layer is used for reducing the resistance value after the temperature of the temperature-sensitive layer is increased, so that the potential of the power supply control signal is increased, and when the temperature of the temperature-sensitive layer is greater than or equal to the preset temperature, the potential of the power supply control signal output to the driving circuit unit by the common electrode is greater than or equal to the preset potential.

In an exemplary embodiment, the heat-sensitive component includes a heat-sensitive layer, a first conductive layer, a second conductive layer and a protective layer, where the protective layer is disposed on one side of the common electrode, at least one accommodating hole penetrating the protective layer is provided on the protective layer, a part of the first conductive layer is disposed on one side of the protective layer opposite to the common electrode, a part of the first conductive layer is disposed in the accommodating hole and connected to the common electrode, so that the first conductive layer is electrically connected to the common electrode, the heat-sensitive layer is disposed on one side of the first conductive layer opposite to the protective layer and is electrically connected to the first conductive layer, and the second conductive layer is disposed on one side of the heat-sensitive layer opposite to the first conductive layer and is electrically connected to the heat-sensitive layer, so that the second conductive layer is electrically connected to the heat-sensitive layer and is electrically connected to the driving circuit unit. The temperature-sensitive layer is used for reducing the resistance value after the temperature of the temperature-sensitive layer is increased, so that the potential of the power supply control signal is increased, and when the temperature of the temperature-sensitive layer is greater than or equal to the preset temperature, the potential of the power supply control signal output to the driving circuit unit by the common electrode is greater than or equal to the preset potential.

In an exemplary embodiment, the heat-sensitive component includes a heat-sensitive layer, a first conductive layer, a second conductive layer and a protective layer, the protective layer is disposed on one side of the common electrode, a recess is formed on the periphery of the protective layer, at least one accommodating hole penetrating through the protective layer is formed at the bottom of the recess, a part of the first conductive layer is disposed on the recess and is located on one side of a part of the protective layer opposite to the common electrode, a part of the first conductive layer is disposed in the accommodating hole and is connected with the common electrode, so that the first conductive layer is electrically connected with the common electrode, the heat-sensitive layer is disposed on the recess and is located on one side of a part of the first conductive layer opposite to the protective layer, and the second conductive layer is disposed on the recess and is located on one side of the heat-sensitive layer opposite to the first conductive layer, so that the second conductive layer is electrically connected with the heat-sensitive layer, and the second conductive layer is electrically connected with the driving unit. The temperature-sensitive layer is used for reducing the resistance value after the temperature of the temperature-sensitive layer is increased, so that the potential of the power supply control signal is increased, and when the temperature of the temperature-sensitive layer is greater than or equal to the preset temperature, the potential of the power supply control signal output to the driving circuit unit by the common electrode is greater than or equal to the preset potential.

Based on the same inventive concept, the embodiment of the application also provides a display device, which comprises a driving circuit unit and the display panel, wherein the driving circuit unit is electrically connected with the color film substrate of the display panel and the array substrate of the display panel respectively.

In summary, the display device provided by the embodiment of the application includes a display panel, wherein the display panel includes a common electrode, a heat-sensitive component and a driving circuit layer. When the temperature of the heat sensitive component is greater than or equal to the preset temperature, the potential of the power supply control signal output by the common electrode is greater than or equal to the preset potential, and the driving circuit unit stops providing driving electric signals for the driving circuit layer according to the power supply control signal with the potential greater than or equal to the preset potential, so that the display panel is automatically powered off, at the moment, the display panel does not display pictures any more, so that the temperature in the display panel is gradually reduced, and further the polaroid of the display panel is prevented from being burnt.

In an exemplary embodiment, the driving circuit unit includes a scan driving circuit, a signal output end, a connection end, a ground end and a control transistor, the color film substrate includes a heat sensitive component, the array substrate includes a driving circuit layer, the heat sensitive component is electrically connected with a gate of the control transistor, the signal output end is electrically connected with the scan driving circuit and a source of the control transistor, the connection end is electrically connected with the source of the control transistor and the driving circuit layer, and a drain of the control transistor is electrically connected with the ground end. When the temperature of the thermosensitive assembly is greater than or equal to the preset temperature, the power control signal of which the potential is greater than or equal to the preset potential and is output by the common electrode is transmitted to the grid electrode, so that the source electrode and the drain electrode are conducted, and the connecting end is electrically connected with the grounding end.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic layer structure of a display device according to a first embodiment of the present application;

fig. 2 is a schematic circuit diagram of a display device according to a first embodiment of the present application;

fig. 3 is a schematic front view of a display panel according to a second embodiment of the present application;

FIG. 4 is a schematic cross-sectional view of the display panel of FIG. 3 along the direction IIII-IIII;

FIG. 5 is a schematic view of a first partial layer structure of a display panel according to a second embodiment of the present application;

FIG. 6 is a schematic diagram showing an electrical connection between a heat-sensitive component and a driving circuit unit of a display panel according to a second embodiment of the present application;

FIG. 7 is a schematic view of a second partial layer structure of a display panel according to a second embodiment of the present application;

fig. 8 is a schematic view of a third partial layer structure of a display panel according to a second embodiment of the present application;

fig. 9 is a schematic view of a fourth partial layer structure of a display panel according to a second embodiment of the present application;

fig. 10 is a schematic view of a fifth partial layer structure of a display panel according to a second embodiment of the present application;

FIG. 11 is a schematic view of a sixth partial layer structure of a display panel according to a second embodiment of the present application;

fig. 12 is a schematic view of a seventh partial layer structure of a display panel according to a second embodiment of the present application;

Fig. 13 is a schematic view of an eighth partial layer structure of a display panel according to a second embodiment of the present application.

Reference numerals illustrate:

001-a first direction; 002-a second direction; 1-a display device; 10-a backlight module; 30-a display panel; 30 a-a display area; 30 b-a non-display area; 31-an array substrate; a 32-liquid crystal layer; 33-a color film substrate; 34, frame sealing glue; 35-spacer columns; a 50-driving circuit unit; 50 a-a signal output; 50 b-a connection end; ground-GND; 51-a scan driving circuit; 52-a data driving circuit; 53-a timing control circuit; 55-a control transistor; 55 a-gate; 55 b-source; 55 c-drain; 311-a driving circuit layer; 312-pixel electrodes; 313-a first substrate; 314-a first polarizer; 321-liquid crystal molecules; 331-alignment layer; 332-a common electrode; 333-a heat sensitive component; 333 a-a heat sensitive layer; 333 b-a first conductive layer; 333 c-protective layer; 333 d-a second conductive layer; 336-a light shielding layer; 336 a-light holes; 337-a first color resistance element; 338-a second color blocking element; 339-third color resistance element; 341-a second substrate; 342-a second polarizer; a1-a heat-sensitive element; a2-a first thermosensitive sublayer; a3-a second thermosensitive sublayer; c1-an accommodating hole; c2-depressions.

Detailed Description

In order that the application may be readily understood, a more complete description of the application will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the application. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the application may be practiced. The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The term "coupled" as used herein includes both direct and indirect coupling (coupling), unless otherwise indicated. Directional terms, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., in the present application are merely referring to the directions of the attached drawings, and thus, directional terms are used for better, more clear explanation and understanding of the present application, rather than indicating or implying that the apparatus or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art. It should be noted that the terms "first," "second," and the like in the description and claims of the present application and in the drawings are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprises," "comprising," "includes," "including," or "having," when used in this specification, are intended to specify the presence of stated features, operations, elements, etc., but do not limit the presence of one or more other features, operations, elements, etc., but are not limited to other features, operations, elements, etc. Furthermore, the terms "comprises" or "comprising" mean that there is a corresponding feature, number, step, operation, element, component, or combination thereof disclosed in the specification, and that there is no intention to exclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof. It will also be understood that the meaning of "at least one" as described herein is one and more, such as one, two or three, etc., and the meaning of "a plurality" is at least two, such as two or three, etc., unless specifically defined otherwise.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Referring to fig. 1, fig. 1 is a schematic layer structure of a display device according to a first embodiment of the application. In the embodiment of the application, the display device 1 may include a backlight module 10 and a display panel 30, the display panel 30 is disposed on a light emitting side of the backlight module 10, the backlight module 10 is configured to emit light to the display panel 30, and the display panel 30 is configured to display an image under the light provided by the backlight module 10.

Referring to fig. 2, fig. 2 is a schematic circuit diagram of a display device according to a first embodiment of the application. In the embodiment of the present application, the display device 1 further includes a driving circuit unit 50, the driving circuit unit 50 is electrically connected to the display panel 30, and the driving circuit unit 50 is configured to provide driving electrical signals required for displaying images to the display panel 30. The driving circuit unit 50 may include a scan driving circuit 51, a data driving circuit 52, and a timing control circuit 53, wherein the display panel 30 is electrically connected to the scan driving circuit 51 and the data driving circuit 52, respectively, and the timing control circuit 53 is electrically connected to the scan driving circuit 51 and the data driving circuit 52, respectively.

Specifically, the scan driving circuit 51 is configured to output a scan signal to the display panel 30, and the data driving circuit 52 is configured to output a data signal to the display panel 30. The timing control circuit 53 is configured to output a timing control signal to the scan driving circuit 51 to control when the scan driving circuit 51 outputs the scan signal to the display panel 30, and the timing control circuit 53 is also configured to output a timing control signal to the data driving circuit 52 to control when the data driving circuit 52 outputs the data signal to the display panel 30. The timing control signal comprises a CLK signal and an STV signal.

In other embodiments of the present application, the driving circuit unit 50 may further include a circuit for driving the backlight module 10 to emit light.

In an exemplary embodiment, the backlight module 10 may be an edge type backlight module or a direct type backlight module, which is not particularly limited in the present application. The display panel 30 may be a display panel of a twisted nematic mode (TWISTED NEMATIC, TN), a display panel of a vertical alignment mode (VERTICAL ALIGNMENT, VA), a display panel of an In-plane switching mode (In-PLANE SWITCHING, IPS), or a display panel of a fringe field switching mode (FRINGE FIELD SWITCHING, FFS), which is not particularly limited In the present application.

It will be appreciated that the display device 1 may be used in electronic devices including, but not limited to, televisions, tablet computers, notebook computers, desktop computers, mobile phones, car monitors, smart watches, smart bracelets, smart glasses, road signs, etc. According to the embodiment of the present application, the specific type of the display device 1 is not particularly limited, and a person skilled in the art can correspondingly design according to the specific use requirement of the display device 1, which is not described herein.

In other embodiments of the present application, the display device 1 may further include a processor and a memory, where the processor is electrically connected to the display panel 30, and is configured to control the display panel 30 to display. The memory is electrically connected to the processor, and is used for storing program codes required by the processor to operate, control the display content of the display panel 30, and the like.

In an exemplary embodiment, the Memory may include Volatile Memory (Volatile Memory), such as random access Memory (Random Access Memory, RAM); the Memory may also include Non-Volatile Memory (NVM), such as Read-Only Memory (ROM), flash Memory (FM), hard disk (HARD DISK DRIVE, HDD), or Solid state disk (Solid-state disk) (STATE DRIVE, SSD). The memory may also comprise a combination of the above types of memories.

In an exemplary embodiment, the processor includes one or more general-purpose processors, where a general-purpose processor may be any type of device capable of processing electronic instructions, including a central processing unit (Central Processing Unit, CPU), microprocessor, microcontroller, main processor, controller, and the like. The processor is configured to execute various types of digitally stored instructions, such as software or firmware programs stored in the memory, that enable the computing device to provide a wide variety of services.

In an exemplary embodiment, the display device 1 may further include other necessary components and constituent parts such as a driving board, a power board, a high-voltage board, and a key control board, which may be correspondingly supplemented by those skilled in the art according to the specific type and actual function of the display device 1, and will not be described herein.

Referring to fig. 3, fig. 3 is a schematic front view of a display panel according to a second embodiment of the application. In the embodiment of the present application, the display panel 30 includes a display area 30a and a non-display area 30b surrounding the display area 30 a. The display area 30a is used for performing image display, and the non-display area 30b is used for setting other auxiliary display components or modules and signal lines.

Referring to fig. 4, fig. 4 is a schematic cross-sectional view of the display panel shown in fig. 3 along the direction IIII-IIII. In the embodiment of the application, the display panel 30 includes an array substrate 31, a liquid crystal layer 32 and a color film substrate 33 sequentially stacked on the light emitting side of the backlight module 10, that is, the array substrate 31 is disposed on the light emitting side of the backlight module 10, the liquid crystal layer 32 is disposed on the side of the array substrate 31 opposite to the backlight module 10, and the color film substrate 33 is disposed on the side of the liquid crystal layer 32 opposite to the array substrate 31. Part of the array substrate 31 is located in the display area 30a, part of the array substrate 31 is located in the non-display area 30b, the liquid crystal layer 32 is located in the display area 30a, part of the color film substrate 33 is located in the display area 30a, and part of the color film substrate 33 is located in the non-display area 30b. The liquid crystal layer 32 includes a plurality of liquid crystal molecules 321, the array substrate 31 and the color film substrate 33 are used for forming a preset electric field, and the preset electric field is used for driving a plurality of the liquid crystal molecules 321 to deflect so as to control the transmittance of the liquid crystal layer 32, so that the display panel 30 displays different gray scales.

In the embodiment of the present application, referring to fig. 4, the display panel 30 further includes a sealant 34 disposed in the non-display area 30b, the sealant 34 is disposed between the array substrate 31 and the color film substrate 33 and is disposed at a peripheral side of the liquid crystal layer 32, and the sealant 34 is used for sealing the liquid crystal layer 32 between the array substrate 31 and the color film substrate 33. The display panel 30 further includes a plurality of spacer columns 35 located in the display area 30a, where the plurality of spacer columns 35 are disposed between the array substrate 31 and the color film substrate 33 at intervals and located in the liquid crystal layer 32, and the spacer columns 35 are used for supporting between the array substrate 31 and the color film substrate 33 so as to maintain a distance between the array substrate 31 and the color film substrate 33.

Referring to fig. 4 and fig. 5 together, fig. 5 is a schematic view of a first partial layer structure of a display panel according to a second embodiment of the application. In the embodiment of the application, the array substrate 31 includes a driving circuit layer 311 and a plurality of pixel electrodes 312, a part of the driving circuit layer 311 is located in the display area 30a, a part of the driving circuit layer 311 is located in the non-display area 30b, and a plurality of the pixel electrodes 312 are located in the display area 30a. The driving circuit layer 311 is disposed on a side of the liquid crystal layer 32 facing away from the color film substrate 33, the plurality of pixel electrodes 312 are disposed on a side of the driving circuit layer 311 facing the liquid crystal layer 32, and the plurality of pixel electrodes 312 are connected to the driving circuit layer 311 such that the plurality of pixel electrodes 312 are electrically connected to the driving circuit layer 311, and the driving circuit layer 311 is configured to provide data signals to the plurality of pixel electrodes 312 such that potentials of the data signals are applied to the pixel electrodes 312.

In an exemplary embodiment, the driving circuit layer 311 is electrically connected to the driving circuit unit 50, the driving circuit unit 50 supplies driving electric signals required for displaying images to the driving circuit layer 311, and the driving circuit layer 311 controls the electric potentials of the plurality of pixel electrodes 312 according to the driving electric signals. Specifically, the driving circuit layer 311 is electrically connected to the scan driving circuit 51 and the data driving circuit 52, respectively, the scan driving circuit 51 outputs the scan signal to the driving circuit layer 311, the data driving circuit 52 outputs the data signal to the driving circuit layer 311, and the driving circuit layer 311 controls the electric potentials of the plurality of pixel electrodes 312 according to the scan signal and the data signal.

In the embodiment of the application, referring to fig. 4 and 5, the color filter substrate 33 includes an alignment layer 331 and a common electrode 332, wherein a part of the alignment layer 331 is located in the display area 30a, a part of the alignment layer 331 is located in the non-display area 30b, a part of the common electrode 332 is located in the display area 30a, and a part of the common electrode 332 is located in the non-display area 30b. The alignment layer 331 is disposed on a side of the liquid crystal layer 32 opposite to the driving circuit layer 311, and the common electrode 332 is disposed on a side of the alignment layer 331 opposite to the liquid crystal layer 32. The alignment layer 331 is configured to maintain the liquid crystal molecules 321 at a predetermined tilt angle. The common electrode 332 and the pixel electrode 312 are used for forming the preset electric field for driving the liquid crystal molecules 321 in the liquid crystal layer 32 to deflect.

In an embodiment of the present application, referring to fig. 4 and 5, the color film substrate 33 further includes a thermal module 333, the thermal module 333 is disposed on a side of the common electrode 332 opposite to the alignment layer 331 and is connected to the common electrode 332, and the thermal module 333 is electrically connected to the common electrode 332 and the driving circuit unit 50, respectively, so that the common electrode 332 outputs a power control signal to the driving circuit unit 50 through the thermal module 333. The thermal sensitive component 333 is configured to decrease the resistance value after the temperature of the thermal sensitive component 333 increases, so that the potential of the power control signal increases, that is, the resistance value of the thermal sensitive component 333 decreases correspondingly with the temperature of the thermal sensitive component 333 increases, and the potential of the power control signal output to the driving circuit unit 50 increases correspondingly. Wherein, when the temperature of the heat sensitive component 333 is greater than or equal to a preset temperature, the potential of the power control signal outputted from the common electrode 332 is made greater than or equal to a preset potential. The driving circuit unit 50 stops supplying the driving electric signal to the driving circuit layer 311 according to the power control signal having the potential greater than or equal to the preset potential.

It is understood that the common electrode 332 has a potential of a predetermined value, for example, 5V, when the display panel 30 normally displays, and the common electrode 332 transmits the power control signal to the driving circuit unit 50. When the temperature of the heat-sensitive component 333 itself does not reach the preset temperature, the resistance of the heat-sensitive component 333 is larger, and the potential of the power control signal output from the common electrode 332 to the driving circuit unit 50 is smaller. As the temperature in the display panel 30 increases gradually, the temperature of the heat-sensitive component 333 increases gradually, the resistance of the heat-sensitive component 333 decreases, and the potential of the power control signal increases. When the temperature of the heat sensitive component 333 is greater than or equal to the preset temperature, the potential of the power control signal is greater than or equal to the preset potential, and the driving circuit unit 50 stops providing the driving electric signal to the driving circuit layer 311 according to the power control signal having the potential greater than or equal to the preset potential, the potential of the common electrode 332 remains unchanged, so that the common electrode 332 may continuously output the power control signal. Therefore, when the temperature of the thermal sensitive component 333 provided by the present application is greater than or equal to the preset temperature, the driving circuit unit 50 receives the power control signal with the potential greater than or equal to the preset potential output by the common electrode 332, and then stops providing the driving electric signal to the driving circuit layer 311, so as to realize automatic power off of the display panel 30, and the display panel 30 does not display a picture any more, so that the temperature in the display panel 30 is gradually reduced, and further the polarizer of the display panel 30 is prevented from being burned.

In the embodiment of the application, referring to fig. 6, fig. 6 is a schematic diagram showing an electrical connection between a heat-sensitive component and a driving circuit unit of a display panel according to a second embodiment of the application. The driving circuit unit 50 further includes a signal output terminal 50a, a connection terminal 50b, a ground terminal GND, and a control transistor 55, the thermosensitive element 333 is electrically connected to the gate 55a of the control transistor 55, the source 55b of the control transistor 55 is electrically connected to the signal output terminal 50a and the connection terminal 50b, and the drain 55c of the control transistor 55 is electrically connected to the ground terminal GND. The signal output terminal 50a is electrically connected to the scan driving circuit 51, and the connection terminal 50b is electrically connected to the driving circuit layer 311 is described as an example. The scan signal output by the scan driving circuit 51 is transmitted to the driving circuit layer 311 through the signal output end 50a and the connection end 50b, when the temperature of the thermal sensitive component 333 is greater than or equal to the preset temperature, the power control signal with the potential greater than or equal to the preset potential output by the common electrode 332 is transmitted to the gate 55a through the thermal sensitive component 333, the power control signal with the potential greater than or equal to the preset potential enables the source 55b and the drain 55c to be conducted, the connection end 50b is electrically connected with the ground end GND, and then the potential of the connection end 50b is the potential of the ground end GND, that is, the driving circuit layer 311 electrically connected with the connection end 50b does not receive the scan signal, and the display panel 30 does not display a picture.

In the embodiment of the present application, the control transistor 55 may be an N-type MOS transistor.

In other embodiments of the present application, if the signal output end 50a is electrically connected to the data driving circuit 52, the connection end 50b is electrically connected to the driving circuit layer 311, and the data signal output from the data driving circuit 52 passes through the signal output end 50a and the connection end 50b to the driving circuit layer 311. The power control signal having the potential greater than or equal to the preset potential output by the common electrode 332 causes the potential of the connection terminal 50b to be the potential of the ground terminal GND, that is, the driving circuit layer 311 electrically connected to the connection terminal 50b does not receive the data signal, and the display panel 30 does not display a picture.

If the signal output terminal 50a is electrically connected to the timing control circuit 53, the connection terminal 50b is electrically connected to the scan driving circuit 51, and the timing control signal outputted from the timing control circuit 53 is sent to the scan driving circuit 51. The power control signal having the potential greater than or equal to the preset potential output by the common electrode 332 causes the potential of the connection terminal 50b to be the potential of the ground terminal GND, that is, the scan driving circuit 51 electrically connected to the connection terminal 50b does not receive the timing control signal, and further the scan driving circuit 51 does not output the scan signal, so that the display panel 30 does not display a picture. Wherein, the timing control signal can be a CLK signal or an STV signal.

In an exemplary embodiment, referring to fig. 4 and 5, a portion of the alignment layer 331 located in the display area 30a protrudes toward a side where the array substrate 31 is located, and a portion of the common electrode 332 located in the display area 30a protrudes toward a side where the array substrate 31 is located. The liquid crystal layer 32 is located between the alignment layer 331 and the driving circuit layer 311, the plurality of spacer columns 35 are connected between the alignment layer 331 and the driving circuit layer 311, and the frame sealing adhesive 34 is connected between the alignment layer 331 and the driving circuit layer 311.

In the embodiment of the application, referring to fig. 4 and 5, the thermal sensitive element 333 is disposed on a side of the common electrode 332 opposite to the alignment layer 331. The thermal assembly 333 includes a thermal layer 333a, a first conductive layer 333b, and a protective layer 333c sequentially stacked on a side of the common electrode 332 opposite to the alignment layer 331, wherein the thermal layer 333a is located in the display area 30a, the first conductive layer 333b is located in the display area 30a, and the protective layer 333c is located in the display area 30a and the non-display area 30b. That is, the heat-sensitive layer 333a is disposed on a side of a portion of the common electrode 332 facing away from the alignment layer 331 and is connected to a portion of the common electrode 332, the first conductive layer 333b is disposed on a side of the heat-sensitive layer 333a facing away from a portion of the common electrode 332 and is connected to the heat-sensitive layer 333a, and the protective layer 333c is disposed on a side of the first conductive layer 333b facing away from the heat-sensitive layer 333a and a side of a portion of the common electrode 332 facing away from a portion of the alignment layer 331 and is connected to the first conductive layer 333b and a portion of the common electrode 332. The heat sensitive layer 333a is electrically connected to the common electrode 332 and the first conductive layer 333b, the first conductive layer 333b is further electrically connected to the driving circuit unit 50, and the power control signal output from the common electrode 332 sequentially passes through the heat sensitive layer 333a and the first conductive layer 333b to the driving circuit unit 50. Wherein the thermosensitive layer 333a is configured to decrease a resistance value after the temperature thereof increases, so that the potential of the power control signal increases. When the temperature of the thermosensitive layer 333a itself is greater than or equal to the preset temperature, the potential of the power supply control signal output from the common electrode 332 to the driving circuit unit 50 is greater than or equal to the preset potential. The protective layer 333c is used for isolating moisture, oxygen or dust and other impurities, and preventing moisture, oxygen or dust and other impurities from entering the thermosensitive assembly 333, the common electrode 332, the alignment layer 331, the liquid crystal layer 32 and the array substrate 31 through the protective layer 333 c.

In an exemplary embodiment, the heat-sensitive layer 333a includes a heat-sensitive material of a negative temperature coefficient such that a resistance value of the heat-sensitive layer 333a decreases with an increase in temperature. The first conductive layer 333b has better conductive performance and light transmittance, and the material may be Indium Tin Oxide (ITO). The first conductive layer 333b may be formed by magnetron sputtering. The position of the heat sensitive layer 333a, the position of the first conductive layer 333b, the portion of the alignment layer 331 protruding toward the array substrate 31, and the portion of the common electrode 332 protruding toward the array substrate 31 correspond to each other, that is, the front projection of the heat sensitive layer 333a on the array substrate 31, the front projection of the first conductive layer 333b on the array substrate 31, the front projection of the portion of the alignment layer 331 protruding toward the array substrate 31, and the front projection of the portion of the common electrode 332 protruding toward the array substrate 31, on the array substrate 31 are located.

In the embodiment of the application, referring to fig. 4 and 5, the array substrate 31 further includes a first substrate 313 and a first polarizer 314, the first substrate 313 is disposed on a side of the driving circuit layer 311 opposite to the plurality of pixel electrodes 312, and the first polarizer 314 is disposed on a side of the first substrate 313 opposite to the driving circuit layer 311. A portion of the first substrate 313 is located in the display area 30a, a portion of the first substrate 313 is located in the non-display area 30b, a portion of the first polarizer 314 is located in the display area 30a, and a portion of the first polarizer 314 is located in the non-display area 30b. The first substrate 313 is configured to provide a surface formed by the driving circuit layer 311, and the first polarizer 314 is configured to convert light of the natural light emitted by the backlight module 10 into light of polarized light.

In the embodiment of the application, referring to fig. 4, the color film substrate 33 further includes a light shielding layer 336, a plurality of first color resist elements 337, a plurality of second color resist elements 338 and a plurality of third color resist elements 339, wherein the light shielding layer 336 is disposed on a side of the protective layer 333c opposite to the common electrode 332, and a portion of the light shielding layer 336 is disposed in the display area 30a and a portion of the light shielding layer 336 is disposed in the non-display area 30b. The light shielding layer 336 is provided with a plurality of light holes 336a penetrating through the light shielding layer 336, and the plurality of light holes 336a are distributed in an array and are all located in the display area 30a. A portion of the first color resist element 337 is disposed in one of the light holes 336a, and another portion of the first color resist element 337 extends toward the protective layer 333c and is embedded in the protective layer 333 c. A portion of the second color blocking element 338 is disposed in one of the light holes 336a, and another portion of the second color blocking element 338 extends toward the protective layer 333c and is embedded in the protective layer 333 c. A portion of the third color blocking element 339 is disposed in one of the light holes 336a, and another portion of the third color blocking element 339 extends toward the protective layer 333c and is embedded in the protective layer 333 c. The light emitted from the backlight module 10 is directed to the first color resist elements 337, the second color resist elements 338 and the third color resist elements 339. The first color blocking element 337 is configured to convert the light into a first color light, the second color blocking element 338 is configured to convert the light into a second color light, and the third color blocking element 339 is configured to convert the light into a third color light. The first color resistor element 337 may be red, the second color resistor element 338 may be green, the third color resistor element 339 may be blue, the light may be white, the first color light may be red, the second color light may be green, the third color light may be blue, that is, the first color may be red, the second color may be green, and the third color may be blue. The light shielding layer 336 is used for shielding the first color light, the second color light and the third color light to avoid color crosstalk between different color lights.

In an exemplary embodiment, the position of the first conductive layer 333b corresponds to the position of a plurality of color resistance elements, that is, the orthographic projection of a plurality of color resistance elements on the array substrate 31 is located within the orthographic projection of the first conductive layer 333b on the array substrate 31. The first conductive layer 333b has better transmittance, and can also refract or reflect the part of the light emitted to the first conductive layer 333b to the liquid crystal layer 32, thereby improving the light utilization rate. The plurality of color-resistant elements includes a plurality of first color-resistant elements 337, a plurality of second color-resistant elements 338, and a plurality of third color-resistant elements 339.

In an exemplary embodiment, referring to fig. 4, the color film substrate 33 further includes a second substrate 341 and a second polarizer 342, where the second substrate 341 is disposed on a side of the light shielding layer 336 opposite to the protective layer 333c, and covers the plurality of first color resistance elements 337, the plurality of second color resistance elements 338 and the plurality of third color resistance elements 339. The second polarizer 342 is disposed on a side of the second substrate 341 opposite to the light shielding layer 336. Part of the second substrate 341 is located in the display area 30a, part of the second substrate 341 is located in the non-display area 30b, part of the second polarizer 342 is located in the display area 30a, and part of the second substrate 341 is located in the non-display area 30b. The second substrate 341 is configured to provide a surface formed by the light shielding layer 336, the plurality of first color resist elements 337, the plurality of second color resist elements 338, and the plurality of third color resist elements 339. The second polarizer 342 is used for converting the first color light of the natural light into polarized light of a first color, converting the second color light of the natural light into polarized light of a second color, and converting the third color light of the natural light into polarized light of a third color.

Referring to fig. 7, fig. 7 is a schematic view of a second partial layer structure of a display panel according to a second embodiment of the application. The display panel of the second partial layer structure is different from the display panel of the first partial layer structure shown in fig. 5 in that: the common electrode 332 is positioned differently. For a description of the display panel of the second partial layer structure that is the same as the display panel of the first partial layer structure, please refer to the related description of the display panel of the first partial layer structure, and the description thereof will not be repeated here.

In the embodiment of the application, a portion of the common electrode 332 is disposed in the thermal sensitive component 333, that is, a portion of the thermal sensitive component 333 is located on a side of the common electrode 332 facing the alignment layer 331, and a portion of the thermal sensitive component 333 is located on a side of the common electrode 332 facing away from the alignment layer 331. Specifically, the first conductive layer 333b is disposed on a side of a portion of the alignment layer 331 facing away from the liquid crystal layer 32, the heat sensitive layer 333a is disposed on a side of the first conductive layer 333b facing away from a portion of the alignment layer 331 and is connected to the first conductive layer 333b, the common electrode 332 is disposed on a side of the heat sensitive layer 333a facing away from the first conductive layer 333b and a side of a portion of the alignment layer 331 facing away from the liquid crystal layer 32 and is connected to the heat sensitive layer 333a and a portion of the alignment layer 331, and the protective layer 333c is disposed on a side of the common electrode 332 facing away from the alignment layer 331 and a side facing away from the heat sensitive layer 333 a.

Referring to fig. 8, fig. 8 is a schematic view of a third partial layer structure of a display panel according to a second embodiment of the application. The display panel of the third partial layer structure is different from the display panel of the first partial layer structure shown in fig. 5 in that: the positions of the heat sensitive layer 333a, the first conductive layer 333b, and the protective layer 333c are different. For a description of the third type of partially layered display panel that is the same as the first type of partially layered display panel, please refer to the related description of the first type of partially layered display panel, and the description thereof will not be repeated here.

In the embodiment of the application, the common electrode 332 is disposed on a side of the alignment layer 331 opposite to the liquid crystal layer 32, and the protective layer 333c is disposed on a side of the common electrode 332 opposite to the alignment layer 331. The protective layer 333c has a plurality of accommodating holes c1 penetrating the protective layer 333c, and the accommodating holes c1 extend toward the protective layer 333c opposite to the common electrode 332. The heat-sensitive layer 333a includes a plurality of heat-sensitive elements a1, one heat-sensitive element a1 is disposed in one of the accommodating holes c1 and is connected to the common electrode 332, and each of the heat-sensitive elements a1 is exposed out of the protective layer 333c opposite to the surface of the common electrode 332, and the first conductive layer 333b is disposed on a side of the protective layer 333c opposite to the common electrode 332 and is connected to the plurality of heat-sensitive elements a1, that is, the heat-sensitive elements a1 penetrate through the protective layer 333c, and opposite ends of each of the heat-sensitive elements a1 are respectively connected to the common electrode 332 and the first conductive layer 333b, such that each of the heat-sensitive elements a1 is respectively electrically connected to the common electrode 332 and the first conductive layer 333 b. The light shielding layer 336 is disposed on a side of the first conductive layer 333b opposite to the protective layer 333 c. Each of the thermosensitive elements a1 is electrically connected to the common electrode 332 and the first conductive layer 333b, respectively.

It can be understood that the plurality of thermosensitive elements a1 are disposed in the protective layer 333c, so that the thickness of the thermosensitive layer 333a is larger, the time required for increasing the temperature of the thermosensitive layer 333a to the preset temperature is increased, the instant high temperature in the display panel 30 is avoided, the common electrode 332 outputs the power control signal with the potential greater than or equal to the preset potential, and the driving circuit unit 50 is further triggered by mistake to stop providing the driving electric signal to the driving circuit layer 311. Moreover, a plurality of the thermosensitive elements a1 are arranged in the protective layer 333c, so that the stability of the thermosensitive elements a1 is enhanced, and the risk of short-line falling of the thermosensitive elements a1 is avoided. Further, disposing a plurality of the thermosensitive elements a1 in the protective layer 333c is advantageous in reducing the overall thickness of the display panel 30. The surface of the first conductive layer 333b facing the protective layer 333c is flush, so that uniformity of thickness of the first conductive layer 333b is improved, and risk of disconnection and falling of the first conductive layer 333b is reduced.

In an exemplary embodiment, a plurality of the receiving holes c1 are located in the display region 30a and the non-display region 30b, and a plurality of the thermosensitive elements a1 are also located in the display region 30a and the non-display region 30b.

Referring to fig. 9, fig. 9 is a schematic diagram of a fourth partial layer structure of a display panel according to a second embodiment of the application. The display panel of the fourth partial layer structure is different from the display panel of the third partial layer structure shown in fig. 8 in that: the heat-sensitive layer 333a further includes a first heat-sensitive sub-layer a2. For a description of the display panel of the fourth partial layer structure that is the same as the display panel of the third partial layer structure, please refer to the related description of the display panel of the third partial layer structure, which is not repeated herein.

In the embodiment of the present application, the heat-sensitive layer 333a further includes a first heat-sensitive sub-layer a2, where the first heat-sensitive sub-layer a2 is disposed on a side of the common electrode 332 opposite to the alignment layer 331, and a portion of the first heat-sensitive sub-layer a2 is located in the display area 30a and a portion of the first heat-sensitive sub-layer a2 is located in the non-display area 30b. The first thermosensitive sublayer a2 is connected to the common electrode 332 such that the first thermosensitive sublayer a2 is electrically connected to the common electrode 332. The protective layer 333c is disposed on a side of the first thermosensitive sub-layer a2 opposite to the common electrode 332, the first conductive layer 333b is disposed on a side of the protective layer 333c opposite to the first thermosensitive sub-layer a2, and opposite ends of each thermosensitive element a1 are respectively connected to the first thermosensitive sub-layer a2 and the first conductive layer 333b, so that each thermosensitive element a1 is respectively electrically connected to the first thermosensitive sub-layer a2 and the first conductive layer 333 b.

It can be appreciated that the first thermosensitive sublayer a2 increases the contact area between the common electrode 332 and the thermosensitive layer 333a, and reduces the contact resistance between the common electrode 332 and the thermosensitive layer 333a, so that the change of the electric potential of the power control signal caused by the temperature change of the thermosensitive assembly 333 is more accurate.

Referring to fig. 10, fig. 10 is a schematic view of a fifth partial layer structure of a display panel according to a second embodiment of the application. The display panel of the fifth partial layer structure is different from the display panel of the third partial layer structure shown in fig. 8 in that: the heat-sensitive layer 333a further includes a second heat-sensitive sub-layer a3. For a description of the display panel of the fifth partial layer structure that is the same as the display panel of the third partial layer structure, please refer to the related description of the display panel of the third partial layer structure, which is not repeated herein.

In the embodiment of the application, the common electrode 332 is disposed on a side of the alignment layer 331 opposite to the liquid crystal layer 32, and the protective layer 333c is disposed on a side of the common electrode 332 opposite to the alignment layer 331. The heat-sensitive layer 333a further includes a second heat-sensitive sub-layer a3, where the second heat-sensitive sub-layer a3 is disposed on a side of the protective layer 333c opposite to the common electrode 332, and a portion of the second heat-sensitive sub-layer a3 is located in the display area 30a and a portion of the second heat-sensitive sub-layer a3 is located in the non-display area 30b. Opposite ends of each of the thermosensitive elements a1 are respectively connected with the second thermosensitive sub-layer a3 and the common electrode 332, so that each of the thermosensitive elements a1 is electrically connected with the second thermosensitive sub-layer a3 and the common electrode 332, respectively. The first conductive layer 333b is disposed on a side of the second thermosensitive sublayer a3 opposite to the protective layer 333c, and is connected to the second thermosensitive sublayer a3, so that the first conductive layer 333b is electrically connected to the second thermosensitive sublayer a 3.

It can be appreciated that the second thermosensitive sublayer a3 increases the contact area between the first conductive layer 333b and the thermosensitive layer 333a, and reduces the contact resistance between the first conductive layer 333b and the thermosensitive layer 333a, so that the change of the electric potential of the power control signal caused by the temperature change of the thermosensitive assembly 333 is more accurate.

Referring to fig. 11, fig. 11 is a schematic view of a sixth partial layer structure of a display panel according to a second embodiment of the application. The display panel of the sixth partial layer structure is different from the display panel of the third partial layer structure shown in fig. 8 in that: the heat-sensitive layer 333a further includes a first heat-sensitive sublayer a2 and a second heat-sensitive sublayer a3. For a description of the display panel of the sixth type of partial layer structure that is the same as the display panel of the third type of partial layer structure, please refer to the related description of the display panel of the third type of partial layer structure, the display panel of the fourth type of partial layer structure, and the display panel of the fifth type of partial layer structure, which will not be repeated herein.

In the embodiment of the present application, the common electrode 332 is disposed on a side of the alignment layer 331 opposite to the liquid crystal layer 32, and the first thermosensitive sublayer a2 is disposed on a side of the common electrode 332 opposite to the alignment layer 331 and is connected to the common electrode 332, so that the first thermosensitive sublayer a2 is electrically connected to the common electrode 332. The protective layer 333c is disposed on a side of the first heat-sensitive sub-layer a2 opposite to the common electrode 332, the second heat-sensitive sub-layer a3 is disposed on a side of the protective layer 333c opposite to the first heat-sensitive sub-layer a2, and the first conductive layer 333b is disposed on a side of the second heat-sensitive sub-layer a3 opposite to the protective layer 333c and is connected to the second heat-sensitive sub-layer a3, such that the first conductive layer 333b is electrically connected to the second heat-sensitive sub-layer a 3. Opposite ends of each thermosensitive element a1 are respectively connected with the first thermosensitive sub-layer a2 and the second thermosensitive sub-layer a3, so that each thermosensitive element a1 is respectively electrically connected with the first thermosensitive sub-layer a2 and the second thermosensitive sub-layer a 3.

Referring to fig. 12, fig. 12 is a schematic view of a seventh partial layer structure of a display panel according to a second embodiment of the application. The display panel of the seventh partial layer structure is different from the display panel of the first partial layer structure shown in fig. 5 in that: the thermal sensitive component 333 includes a first conductive layer 333b and a second conductive layer 333d. For a description of the seventh partial layer structure of the display panel that is the same as the first partial layer structure, please refer to the related description of the first partial layer structure of the display panel, and the description is omitted herein.

In the embodiment of the application, the thermal sensitive component 333 includes a first conductive layer 333b and a second conductive layer 333d, and the protective layer 333c is disposed on a side of the common electrode 332 opposite to the alignment layer 331. The protective layer 333c is provided with at least one receiving hole c1 penetrating the protective layer 333c such that a portion of the common electrode 332 is exposed to an opening of the receiving hole c1 facing the common electrode 332. A part of the first conductive layer 333b is disposed on a side of the protective layer 333c opposite to the common electrode 332, and a part of the first conductive layer 333b is disposed in the accommodating hole c1 and connected to the common electrode 332, so that the first conductive layer 333b is electrically connected to the common electrode 332. The heat sensitive layer 333a is disposed on a side of the first conductive layer 333b opposite to the protective layer 333c, and is connected to the first conductive layer 333b such that the heat sensitive layer 333a is electrically connected to the first conductive layer 333 b. The second conductive layer 333d is disposed on a side of the heat sensitive layer 333a opposite to the first conductive layer 333b, and is connected to the heat sensitive layer 333a such that the second conductive layer 333d is electrically connected to the heat sensitive layer 333a, and the second conductive layer 333d is also electrically connected to the driving circuit unit 50. The power control signal outputted from the common electrode 332 is transmitted to the driving circuit unit 50 through the first conductive layer 333b, the heat sensitive layer 333a, and the second conductive layer 333d in sequence.

In an exemplary embodiment, the first conductive layer 333b, the second conductive layer 333d, and the heat sensitive layer 333a are located in the display area 30a and the non-display area 30b, and the first conductive layer 333b corresponds to the positions of the plurality of color blocking elements, the second conductive layer 333d corresponds to the positions of the plurality of color blocking elements, and the heat sensitive layer 333a corresponds to the positions of the plurality of color blocking elements. That is, the orthographic projections of the plurality of color resistance elements on the array substrate 31 are located in the orthographic projections of the first conductive layer 333b on the array substrate 31, the orthographic projections of the plurality of color resistance elements on the array substrate 31 are located in the orthographic projections of the second conductive layer 333d on the array substrate 31, and the orthographic projections of the plurality of color resistance elements on the array substrate 31 are located in the orthographic projections of the heat sensitive layer 333a on the array substrate 31.

Referring to fig. 13, fig. 13 is a schematic view illustrating an eighth partial layer structure of a display panel according to a second embodiment of the application. The display panel of the eighth partial layer structure is different from the display panel of the seventh partial layer structure shown in fig. 12 in that: the positions of the first conductive layer 333b, the second conductive layer 333d, and the heat sensitive layer 333a are different. For a description of the display panel of the eighth partial layer structure that is the same as the display panel of the seventh partial layer structure, please refer to the related description of the display panel of the seventh partial layer structure, which is not repeated herein.

In the embodiment of the application, the protective layer 333c is disposed on a side of the common electrode 332 opposite to the alignment layer 331, a recess portion c2 is formed at a periphery of the protective layer 333c, at least one accommodating hole c1 is formed at a bottom of the recess portion c2, and the accommodating hole c1 penetrates the protective layer 333c. A part of the first conductive layer 333b is disposed in the recess c2 and is located at a side of a part of the protective layer 333c opposite to the common electrode 332, and a part of the first conductive layer 333b is disposed in the accommodating hole c1 and is connected to the common electrode 332, so that the first conductive layer 333b is electrically connected to the common electrode 332. The heat sensitive layer 333a is disposed in the recess c2 and located at a side of a portion of the first conductive layer 333b opposite to a portion of the protective layer 333c. The second conductive layer 333d is disposed on the recess c2 and is located on a side of the heat sensitive layer 333a opposite to the first conductive layer 333b, and the second conductive layer 333d is connected to the heat sensitive layer 333a such that the second conductive layer 333d is electrically connected to the heat sensitive layer 333a, and the second conductive layer 333d is also electrically connected to the driving circuit unit 50. That is, the first conductive layer 333b may have a hollow ring structure, the second conductive layer 333d may have a hollow ring structure, the heat sensitive layer 333a may have a hollow ring structure, the protective layer 333c may be filled in the hollow portion of the first conductive layer 333b, the hollow portion of the second conductive layer 333d, and the hollow portion of the heat sensitive layer 333a, and the hollow portion of the first conductive layer 333b, the hollow portion of the second conductive layer 333d, and the hollow portion of the heat sensitive layer 333a may be filled with a portion of the protective layer 333c.

In an exemplary embodiment, the first conductive layer 333b is located at a position offset from the positions of the plurality of color resist elements, the second conductive layer 333d is located at a position offset from the positions of the plurality of color resist elements, and the heat sensitive layer 333a is located at a position offset from the positions of the plurality of color resist elements. That is, the front projections of the plurality of color resist elements on the array substrate 31 do not overlap with the front projections of the first conductive layer 333b on the array substrate 31, the front projections of the plurality of color resist elements on the array substrate 31 do not overlap with the front projections of the second conductive layer 333d on the array substrate 31, and the front projections of the plurality of color resist elements on the array substrate 31 do not overlap with the front projections of the heat sensitive layer on the array substrate 31.

It is understood that, to improve the conductivity of the first conductive layer 333b and the second conductive layer 333d, the materials of the first conductive layer 333b and the second conductive layer 333d may be metals. In order to avoid that the first conductive layer 333b and the second conductive layer 333d affect the light transmittance of the display panel 30, the positions of the first conductive layer 333b and the positions of the plurality of color resistance elements are staggered, and the positions of the second conductive layer 333d and the positions of the plurality of color resistance elements are staggered. In addition, the metal has a better reflection effect, and the first conductive layer 333b can reflect the light emitted to the light shielding layer 336 into the liquid crystal layer 32, so as to prevent the light shielding layer 336 from absorbing the light, thereby improving the utilization rate of the light and further improving the display effect. Meanwhile, the position of the first conductive layer 333b is set to correspond to the position of the frame sealing glue 34, ultraviolet light curing treatment is required to be performed on the frame sealing glue after the frame sealing glue is coated, and the first conductive layer 333b can reflect the ultraviolet light, so that curing of the frame sealing glue 34 is facilitated to be enhanced, packaging reliability of the frame sealing glue 34 is ensured, and flowing frame sealing glue is prevented from polluting liquid crystal.

In summary, in the display panel 30 and the display device 1 provided in the embodiments of the application, the display panel 30 includes the array substrate 31, the liquid crystal layer 32 and the color film substrate 33 that are stacked, the array substrate includes the driving circuit layer 311 and the plurality of pixel electrodes 312, the color film substrate 33 includes the common electrode 332, the driving circuit layer 311 and the common electrode 332 are respectively disposed on opposite sides of the liquid crystal layer 32, the plurality of pixel electrodes 312 are disposed on a side of the driving circuit layer 311 facing the liquid crystal layer 32 and are electrically connected to the driving circuit layer 311, the driving circuit layer 311 is further electrically connected to the driving circuit unit 50, the driving circuit layer 311 controls the electric potentials of the plurality of pixel electrodes 312 according to the driving electric signals output by the driving circuit unit 50, and the pixel electrodes 312 and the common electrode 332 are used for forming the preset electric field for driving the liquid crystal molecules of the liquid crystal layer 32 to deflect. The color film substrate 33 further includes a heat-sensitive component 333, at least a portion of the heat-sensitive component 333 is disposed on one side of the common electrode 332 and is connected to the common electrode 332, the heat-sensitive component 333 is electrically connected to the common electrode 332 and the driving circuit unit 50, and the common electrode 332 outputs a power control signal to the driving circuit unit 50 through the heat-sensitive component 333. When the temperature of the heat sensitive component 333 is greater than or equal to the preset temperature, the electric potential of the power control signal output by the common electrode 332 is greater than or equal to the preset electric potential, and the driving circuit unit 50 stops providing the driving electric signal to the driving circuit layer 311 according to the power control signal with the electric potential greater than or equal to the preset electric potential, so that the display panel 30 is automatically powered off, and at this time, the display panel 30 does not display a picture any more, so that the temperature in the display panel 30 is gradually reduced, and further the polarizer of the display panel 30 is prevented from being burnt.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

It is to be understood that the application is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims. Those skilled in the art will recognize that the full or partial flow of the embodiments described above can be practiced and equivalent variations of the embodiments of the present application are within the scope of the appended claims.

Claims (4)

1. The display panel comprises an array substrate, a liquid crystal layer and a color film substrate which are arranged in a stacked manner, and is characterized in that the array substrate comprises a driving circuit layer and a plurality of pixel electrodes, the color film substrate comprises a public electrode, the driving circuit layer and the public electrode are respectively arranged on two opposite sides of the liquid crystal layer, the pixel electrodes are arranged on one side, facing the liquid crystal layer, of the driving circuit layer and are electrically connected with the driving circuit layer, the driving circuit layer is also electrically connected with a driving circuit unit, the driving circuit layer controls the electric potential of the pixel electrodes according to driving electric signals output by the driving circuit unit, and the pixel electrodes and the public electrode are used for forming a preset electric field for driving liquid crystal molecules of the liquid crystal layer to deflect;

The color film substrate further comprises a thermosensitive assembly, the thermosensitive assembly comprises a thermosensitive layer, a first conductive layer and a protective layer, the thermosensitive layer comprises a plurality of thermosensitive elements and a first thermosensitive sub-layer, the first thermosensitive sub-layer is arranged on one side of the public electrode and is connected with the public electrode, the first thermosensitive sub-layer is electrically connected with the public electrode, the protective layer is arranged on one side of the first thermosensitive sub-layer opposite to the public electrode, a plurality of containing holes penetrating through the protective layer are formed in the protective layer, one thermosensitive element is arranged in one containing hole, the first conductive layer is arranged on one side of the protective layer opposite to the first thermosensitive sub-layer, each thermosensitive element is electrically connected with the first thermosensitive sub-layer and the first conductive layer, and the first conductive layer is electrically connected with the driving circuit unit;

the common electrode is used for outputting a power supply control signal to the driving circuit unit through the thermosensitive layer and the first conductive layer, wherein the thermosensitive layer is used for reducing the resistance value after the temperature of the thermosensitive layer is increased so that the potential of the power supply control signal is increased, and when the temperature of the thermosensitive layer is greater than or equal to a preset temperature, the potential of the power supply control signal output to the driving circuit unit by the common electrode is greater than or equal to a preset potential so that the driving circuit unit stops providing a driving electric signal to the driving circuit layer according to the power supply control signal with the potential greater than or equal to the preset potential.

2. The display panel of claim 1, wherein the heat-sensitive layer further comprises a second heat-sensitive sub-layer disposed on a side of the protective layer opposite to the first heat-sensitive sub-layer, opposite ends of each of the heat-sensitive elements are respectively connected to the first heat-sensitive sub-layer and the second heat-sensitive sub-layer, such that each of the heat-sensitive elements is electrically connected to the first heat-sensitive sub-layer and the second heat-sensitive sub-layer, and the first conductive layer is disposed on a side of the second heat-sensitive sub-layer opposite to the protective layer and is connected to the second heat-sensitive sub-layer, such that the first conductive layer is electrically connected to the second heat-sensitive sub-layer.

3. A display device, comprising a driving circuit unit and the display panel according to claim 1 or 2, wherein the driving circuit unit is electrically connected to a color film substrate of the display panel and an array substrate of the display panel, respectively.

4. The display device according to claim 3, wherein the driving circuit unit includes a scan driving circuit, a signal output terminal, a connection terminal, a ground terminal, and a control transistor, the color film substrate includes a thermosensitive element, the array substrate includes a driving circuit layer, the thermosensitive element is electrically connected to a gate of the control transistor, the signal output terminal is electrically connected to the scan driving circuit and a source of the control transistor, the connection terminal is electrically connected to the source of the control transistor and the driving circuit layer, and a drain of the control transistor is electrically connected to the ground terminal;

when the temperature of the thermosensitive assembly is greater than or equal to the preset temperature, the power control signal of which the potential is greater than or equal to the preset potential and is output by the common electrode is transmitted to the grid electrode, so that the source electrode and the drain electrode are conducted, and the connecting end is electrically connected with the grounding end.