CN117794324A - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN117794324A CN117794324A CN202311836779.6A CN202311836779A CN117794324A CN 117794324 A CN117794324 A CN 117794324A CN 202311836779 A CN202311836779 A CN 202311836779A CN 117794324 A CN117794324 A CN 117794324A
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- display panel
- substrate
- layer
- frame glue
- inorganic insulating
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- 239000000463 material Substances 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 239000003292 glue Substances 0.000 claims abstract description 50
- 238000004806 packaging method and process Methods 0.000 claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 238000001514 detection method Methods 0.000 claims description 16
- 239000000945 filler Substances 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- -1 polyethylene Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229910002059 quaternary alloy Inorganic materials 0.000 claims description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 21
- 239000000565 sealant Substances 0.000 description 19
- 239000007788 liquid Substances 0.000 description 11
- 230000008439 repair process Effects 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000007787 solid Substances 0.000 description 8
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 230000009545 invasion Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 208000037656 Respiratory Sounds Diseases 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000005483 Hooke's law Effects 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
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Abstract
The application discloses a display panel and a display device, wherein the display panel comprises a substrate, a light-emitting unit layer, a packaging cover plate and frame glue, wherein a containing groove and a conducting structure are arranged on one side, close to the substrate, of the packaging cover plate, the containing groove is arranged corresponding to the frame glue, the conducting structure is arranged on one side, close to the substrate, of the containing groove, a filling material is arranged in the containing groove, and the filling material is used for being in a flowing state under a heating state; the conducting structure enables the filling material to flow out of the accommodating groove under the conducting state so as to fill a gap generated on one side of the frame glue close to the packaging cover plate. The display panel is repaired when the packaging layer has cracks, so that the problem of display panel faults caused by the cracks is avoided, and the service life of the display panel can be prolonged to a certain extent.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel and a display device.
Background
The organic electroluminescent devices (organic light emitting diode, OLED) have the advantages of surface light source, luminescence, energy saving, quick response, flexibility, ultra-light weight, low cost and the like, so that mass production technology is mature. The encapsulation technology is particularly critical because of the poor stability of the OLED, which is extremely sensitive to both water and oxygen. The packaging purpose is mainly to prevent water vapor and oxygen from entering the OLED, and a cover plate packaging technology and a film packaging technology are mainly adopted in the current mainstream, wherein the cover plate packaging technology is mainly divided into a Frit (glass cement packaging), a Dam (isolation Dam packaging), a Face seal (surface packaging) and the like.
In the cover plate packaging technology, the edge position is the weakest position of the packaging, the position is easily influenced by water vapor under the high-temperature and high-humidity environment, the stress of the edge position is larger, the film layer at the position is easy to generate film layer cracks, and when the film layer generates cracks, the water vapor extremely easily passes through the film layer to reach the device, so that the device is invalid.
Disclosure of Invention
The purpose of this application is to provide a display panel and display device, through repairing it when the encapsulation layer exists the crackle to avoid the display panel trouble problem that the crackle leads to, can effectively prolong display panel's life to a certain extent.
The application discloses a display panel, which comprises a display area and a non-display area, wherein the display panel comprises a substrate, a light-emitting unit layer, a packaging cover plate and frame glue, and the light-emitting unit layer is arranged on the substrate and is positioned in the display area; the packaging layer is arranged on the light-emitting unit layer and extends from the display area to the non-display area; the packaging cover plate is arranged on the packaging layer; the frame glue is arranged on the outer side of the packaging layer, and two ends of the frame glue are respectively bonded with the substrate and the packaging cover plate; the packaging cover plate is provided with a containing groove and a conducting structure on one side close to the substrate, the containing groove is arranged corresponding to the frame glue, the conducting structure is arranged on one side close to the substrate, filling materials are arranged in the containing groove, and the filling materials are used for being in fluidity under a heating state; the conducting structure enables the filling material to flow out of the accommodating groove under the conducting state so as to fill a gap generated on one side of the frame glue close to the packaging cover plate.
Optionally, the filling material comprises one or more materials of polyethylene wax, bismuth base alloy, lead base alloy and lead-tin-antimony-copper quaternary alloy; the melting temperature of the filler material is between 100 ℃ and 200 ℃.
Optionally, the conducting structure comprises a through hole and an electrically deformable layer, the electrically deformable layer is filled in the through hole, one end of the through hole is led to the filling material, and the other end is led to the frame glue; the electrically-induced deformation layer is formed by shrinkage under the drive of voltage, the through hole is communicated with the accommodating groove, the conducting structure is in a conducting state, and the filling material flows from the through hole to the frame glue under the heating state.
Optionally, a plurality of conducting structures are arranged on one side, close to the substrate, of the accommodating groove, and the conducting structures are arranged at intervals; the plurality of conductive structures are independently controlled.
Optionally, the electro-deformation layer includes a first electrode, a second electrode, and a piezoelectric layer, where the piezoelectric layer is disposed between the first electrode and the second electrode, and the piezoelectric layer is elastically deformed under control of the first electrode and the second electrode.
Optionally, a heating plate is further disposed in the accommodating groove, and is configured to generate heat under voltage control to melt the solid filling material, so that the filling material flows out of the conducting structure in a liquid state.
Optionally, the heating plate is provided with a plurality of pieces, and a plurality of heating plates are arranged at intervals.
Optionally, the accommodating groove is located in the non-display area, and extends from the frame glue to the display area; the packaging layer comprises a first inorganic insulating layer and a second inorganic insulating layer, wherein the first inorganic insulating layer wraps the light-emitting unit layer on one side of the substrate, and the second inorganic insulating layer wraps the first inorganic insulating layer on one side of the substrate; the second inorganic insulating layer comprises a main body part and an extension part, wherein the main body part is arranged on the first inorganic insulating layer, and the main body part and the first inorganic insulating layer are completely overlapped on the orthographic projection of the substrate; the extending part is arranged on the outer side of the main body part, is connected with the main body part and extends towards the substrate, and is arranged between the frame glue and the first inorganic insulating layer; the receiving groove overlaps the extension on an orthographic projection of the substrate.
Optionally, the display panel further includes a detection structure, the detection structure is disposed on a side of the packaging cover plate, which is close to the substrate, and the detection structure is used for detecting water vapor in the sealant.
The application discloses a display device, including drive circuit and foretell display panel, wherein, drive circuit is used for driving display panel shows.
The application sets up the holding tank on being close to the encapsulation apron of encapsulation edge position, has the filling material at the holding tank intussuseption, is provided with on-structure at one side that the holding tank is close to the frame and glues, and this on-structure is as ooff valve. When the gap appears between the frame glue and the packaging cover plate, the filling material in the accommodating groove is heated, and when the conducting structure is conducted, the solid state of the filling material is changed into the liquid state and flows out of the accommodating groove under the action of gravity, so that the filling material is filled into the corresponding gap, the gap between the frame glue and the packaging cover plate is repaired, and the sealing effect of the display panel is improved. Therefore, the problem of display panel faults caused by aging is avoided, and the service life of the display panel can be prolonged to a certain extent.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive faculty for a person skilled in the art. In the drawings:
fig. 1 is a schematic view of a display panel according to a first embodiment of the present application;
FIG. 2 is an enlarged schematic view of a portion of a display panel of the present application;
FIG. 3 is a schematic diagram of a conducting structure according to a first embodiment of the present application;
FIG. 4 is a schematic top view of a display panel of the present application;
FIG. 5 is a schematic diagram of a conducting structure according to a second embodiment of the present application;
fig. 6 is a schematic view of a display panel according to a third embodiment of the present application;
fig. 7 is a schematic view of a display device of the present application.
100 parts of a display panel; 101. a display area; 102. a non-display area; 103. a substrate; 104. a light emitting unit layer; 110. an encapsulation layer; 111. a first inorganic insulating layer; 112. a second inorganic insulating layer; 113. a main body portion; 114. an extension; 120. packaging the cover plate; 121. a receiving groove; 127. a filler material; 130. frame glue; 140. a conducting structure; 141. a through hole; 142. an electrically deformable layer; 143. a first electrode; 144. a second electrode; 145. a piezoelectric layer; 150. a heating sheet; 160. a detection structure; 200. a display device; 210. and a driving circuit.
Detailed Description
It should be understood that the terminology, specific structural and functional details disclosed herein are merely representative for purposes of describing particular embodiments, but that the application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or implicitly indicating the number of technical features indicated. Thus, unless otherwise indicated, features defining "first", "second" may include one or more such features either explicitly or implicitly; the meaning of "plurality" is two or more. In addition, terms of the azimuth or positional relationship indicated by "upper", "lower", "left", "right", "vertical", "horizontal", etc., are described based on the azimuth or relative positional relationship shown in the drawings, and are merely for convenience of description of the present application, and do not indicate that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present application. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
The present application is described in detail below with reference to the attached drawings and alternative embodiments.
Fig. 1 is a schematic view of a display panel according to a first embodiment of the present application, fig. 2 is a schematic enlarged view of a portion of the display panel of the present application, and referring to fig. 1-2, the present application discloses a display panel 100, wherein the display panel 100 includes a display area 101 and a non-display area 102, the display panel 100 includes a substrate 103, a light emitting unit layer 104, an encapsulation layer 110, an encapsulation cover plate 120, and a frame glue 130, and the light emitting unit layer 104 is disposed on the substrate 103 and is located in the display area 101; the encapsulation layer 110 is disposed on the light emitting unit layer 104 and extends from the display region 101 to the non-display region 102; the package cover 120 is disposed on the package layer 110; the frame glue 130 is disposed at the outer side of the encapsulation layer 110, and two ends of the frame glue are respectively adhered to the substrate 103 and the encapsulation cover plate 120; wherein, a receiving groove 121 and a conducting structure 140 are disposed on a side of the packaging cover plate 120 close to the substrate 103, the receiving groove 121 is disposed corresponding to the frame glue 130, the conducting structure 140 is disposed on a side of the receiving groove 121 close to the substrate 103, a filling material 127 is disposed in the receiving groove 121, and the filling material 127 is used for having fluidity in a heating state; the conducting structure 140 enables the filling material 127 to flow out of the accommodating groove 121 in a conducting state so as to fill a gap generated on one side of the frame glue 130 close to the package cover 120.
The packaging cover plate 120 close to the packaging edge is provided with the accommodating groove 121, the accommodating groove 121 is filled with the filling material 127, one side, close to the frame glue 130, of the accommodating groove 121 is provided with the conducting structure 140, and the conducting structure 140 serves as a switch valve. When a gap is found between the sealant 130 and the package cover 120, the filling material 127 in the accommodating groove 121 is heated, and when the conducting structure 140 is conducted, the solid state is changed into the liquid state and flows out of the accommodating groove 121 under the action of gravity, so that the gap is filled into the corresponding gap, the gap between the sealant 130 and the package cover 120 is repaired, and the sealing effect of the display panel 100 is improved. Thereby avoiding the problem of failure of the display panel 100 caused by aging and effectively prolonging the service life of the display panel 100 to a certain extent.
Specifically, since the sealant 130 is the sealing line at the outermost side of the display panel 100, the sealant 130 is easily aged by invasion of high temperature, high humidity and the like under severe environments such as high temperature, high humidity and the like, when the sealant 130 is seriously aged, a gap can appear at a contact interface between the sealant 130 and the packaging cover plate 120, and water vapor easily enters the interior from the gap position, particularly when cracks are generated on an inner film layer, the failure of a device is more easily caused. In addition, in the rigid package, at the junction between the sealant 130 and the packaging layer 110, the packaging layer 110 is easily subjected to the stress action between the external force and the film layer, so that the packaging layer 110 near the sealant 130 is easily damaged, cracks appear, and the cracks gradually develop and extend inwards, so that water vapor enters the display area 101 through the cracks.
In another embodiment, the accommodating groove 121 and the conducting structure 140 mentioned in the present application may also be applied to repair of cracks of the encapsulation layer 110, specifically, in the orthographic projection of the substrate 103, the accommodating groove 121 overlaps the encapsulation layer 110, and at least one conducting structure 140 is disposed corresponding to the encapsulation layer 110. In this solution, after the frame glue 130 is aged, the conductive structure 140 is used to control the filling material 127 to flow out from the accommodating groove 121, so that on one hand, the gap between the frame glue 130 and the package cover plate 120 can be filled, and on the other hand, the package layer 110 can be filled to generate cracks. Thereby avoiding the problem of failure of the display panel 100 caused by cracks and effectively prolonging the service life of the display panel 100 to a certain extent.
With continued reference to fig. 1, the encapsulation layer 110 includes a first inorganic insulating layer 111 and a second inorganic insulating layer 112, the first inorganic insulating layer 111 is disposed on one side of the substrate 103 by wrapping the light emitting unit layer 104, and the second inorganic insulating layer 112 is disposed on one side of the substrate 103 by wrapping the first inorganic insulating layer 111; the second inorganic insulating layer 112 is disposed outside the first inorganic insulating layer 111. On the front projection of the substrate 103, the first inorganic insulating layer 111 is completely located within the projection range of the second inorganic insulating layer 112; the portion of the second inorganic insulating layer 112 not located above the first inorganic insulating layer 111 is also in direct contact with the substrate 103.
The first inorganic insulating layer 111 is formed of a silicon oxynitride material, the second inorganic insulating layer 112 is formed of a silicon nitride material, the thickness of the first inorganic insulating layer 111 may be about 1.5um, and the thickness of the second inorganic insulating layer 112 may be between 2um and 5um (inclusive). The first inorganic insulating layer 111 and the second inorganic insulating layer 112 extend from the display area 101 to the non-display area 102, respectively, and the accommodating groove 121 is mainly located in the non-display area 102 and is disposed corresponding to the second inorganic insulating layer 112, so as to repair a crack generated by the second inorganic insulating layer 112.
The second inorganic insulating layer 112 includes a main body portion 113 and an extension portion 114, the main body portion 113 being disposed on the first inorganic insulating layer 111, and the main body portion 113 and the first inorganic insulating layer 111 being entirely overlapped on the orthographic projection of the substrate 103; the extension 114 is disposed outside the main body 113, the extension 114 is connected to the main body 113 and extends toward the substrate 103, and the extension 114 is disposed between the frame glue 130 and the first inorganic insulating layer 111. On the orthographic projection of the substrate 103, the extension 114 is annular, and the inner side of the annular shape is in contact with the first inorganic insulating layer 111, the outer side is in contact with the frame glue 130, the lower side is in contact with the substrate 103, and the upper side is in contact with the package cover 120. The receiving groove 121 is located within a projection range of the extension 114 on an orthographic projection of the substrate 103.
Specifically, the filling material 127 in the accommodating groove 121 is a solid material, and may include one or more materials of polyethylene wax, bismuth-based alloy, lead-tin-antimony-copper quaternary alloy. The filler 127 has the characteristics of melting point low, high strength, good fluidity, small expansion and shrinkage, no toxicity, and the like, and the filler 127 has the characteristics of being melted into a liquid state by heating and being solid after cooling, and has no gas generation in the process of changing into the liquid state by heating, and has good fluidity, and physical change occurs.
Specifically, the melting temperature of the filler 127 is between 100 ℃ and 200 ℃, and it is generally difficult for the display panel 100 to reach about 100 ℃ even if the display panel generates heat or is used in a relatively hot environment. To prevent the filling material 127 from becoming liquid under normal use of the display panel 100, the melting temperature of the filling material 127 may be set to be above 100 ℃. In addition, since the OLED display panel 100 is not easily subjected to a high temperature, the filling material 127 may have a melting temperature of 200 ℃ or less. The filler material 127 of a desired melting point can be achieved relatively speaking by adjusting the proportions of the materials of different melting points.
In an embodiment, the filling material 127 may be heated and melted by laser, so that the filling material 127 is transformed from a solid state to a liquid state, and the laser heating mode may perform fixed-point heating to achieve directional repair. Of course, other heating methods may be used to transform the filler material 127 into a liquid state and then flow into the crack for repair.
Fig. 3 is a schematic view of a conducting structure according to a first embodiment of the present application, referring to fig. 3, the conducting structure 140 includes a through hole 141 and an electro-deformation layer 142, the electro-deformation layer 142 is filled in the through hole 141, one end of the through hole 141 is led to the filling material 127, and the other end is led to the frame glue 130; the electrically deformable layer 142 is formed by shrinking under the voltage driving, the through hole 141 is communicated with the accommodating groove 121, the conducting structure 140 is in a conducting state, and the filling material 127 flows from the through hole 141 to the frame glue 130 in a heating state.
The accommodating groove 121 may be a closed cavity, a through hole 141 is disposed on a side close to the frame glue 130, and an electro-deformation layer 142 is filled in the through hole 141 to seal the cavity.
The conductive structure 140 in this embodiment mainly uses the capability of the electro-deformation layer 142 to recover deformation, and the electro-deformation layer 142 contracts under the voltage driving, so that the through hole 141 is no longer filled with the electro-deformation layer 142, and the filling material 127 can flow out of the through hole 141 to fill the gap of the sealant 130. Electrodes for driving the deformation of the electro-deformation layer 142 may be disposed at both sides of the through hole 141, and the electro-deformation layer 142 is driven to deform by the electrodes. In addition, in the present embodiment, by controlling the opening time of the conducting structure 140, the amount of the filling material 127 flowing out can be precisely controlled, so that the insufficient amount of the filling material 127 flowing out can be avoided to fill the gap, and also the excessive amount of the filling material 127 flowing out can be avoided, especially when other spaces exist in the sealant 130, the overflow of the filling material 127 cannot be controlled.
Specifically, the electro-deformation layer 142 includes a first electrode 143, a second electrode 144, and a piezoelectric layer 145, the piezoelectric layer 145 is disposed between the first electrode 143 and the second electrode 144, and the piezoelectric layer 145 is elastically deformed under the control of the first electrode 143 and the second electrode 144.
The piezoelectric layer 145 is typically formed of a piezoelectric material, specifically, a piezoelectric ceramic material, which is a ceramic material capable of mutually converting mechanical energy and electrical energy, and has unique properties such as dielectric properties and elasticity, in addition to piezoelectric properties. The elastic coefficient of a piezoelectric ceramic material is a parameter reflecting the relationship between deformation and acting force of the ceramic, and follows hooke's law as other elastomers: f= -K x, where F is stress, K is the elastic hardness constant of the elastomer, and x is strain. The driving voltage of the piezoelectric ceramic material is in linear relation with displacement, namely, the larger the voltage is, the larger the displacement is, within the maximum voltage born by the piezoelectric ceramic. At different voltages, the deformation of the piezoelectric ceramic material occurs in a gradual deformation amount, and the deformation is reversible.
In an embodiment, a heating plate 150 is further disposed in the accommodating groove 121, and is configured to generate heat to melt the solid filling material 127 under voltage control, so that the filling material 127 flows out of the conducting structure 140 in a liquid state.
The heating sheet 150 may be controlled by the first electrode 143 or the second electrode 144, and when the conducting structure 140 needs to be in a conducting state, a voltage is applied to the first electrode 143 and the second electrode 144, so that the piezoelectric layer 145 contracts, and in this process, the conducting structure 140 is conducted. When the conducting structure 140 is conducted, the heating plate 150 generates heat by utilizing the voltage of the first electrode 143 or the second electrode 144, and the heat is transferred to the filling material 127, so that the filling material 127 is melted and flows out of the through hole 141.
Fig. 4 is a schematic top view of the display panel of the present application, as shown in fig. 4, the sealant 130 is shaped like a Chinese character 'hui', the sealant 130 is disposed around the display area 101, and the accommodating groove 121 of the present application is also in a ring-shaped structure under the orthographic projection of the substrate 103. In this embodiment, on the projection of the substrate 103, the outermost side of the accommodating groove 121 does not exceed the outer side of the frame glue 130, the inner side of the accommodating groove 121 does not exceed the non-display area 102, i.e. does not enter the position of the display area 101, a communicating filling material 127 is disposed in the groove, and at least one conducting structure 140 is disposed at each position of the frame glue 130, so that when gaps appear at different positions of the frame glue 130, the filling material 127 is present for repairing.
In this solution, the amount of the filling material 127 can be controlled by controlling the depth of the accommodating groove 121, so that the filling material 127 can cover a larger area as much as possible to fill the crack on the premise of using a small amount of filling material 127 as much as possible, and the repair of the crack does not need a large amount of filling material 127 relatively.
Specifically, a plurality of conducting structures 140 are disposed on a side of the accommodating groove 121 near the substrate 103, and the conducting structures 140 are arranged at intervals; the plurality of conductive structures 140 are independently controlled. The plurality of conductive structures 140 are arranged along the receiving groove 121 disposed in a ring shape.
Each position on the ring is provided with a conducting structure 140 and is independently controlled, and in the actual detection of the tightness of the display panel 100, the corresponding position finds a gap, so that the conducting structure 140 at the corresponding position is controlled to conduct.
Fig. 5 is a schematic view of a conducting structure according to a second embodiment of the present application, as shown in fig. 5, in a cross section along a radial width direction of the sealant 130, a plurality of conducting structures 140 are disposed on a side of the accommodating groove 121 near the substrate 103, and the conducting structures 140 are arranged at intervals and extend toward the display area 101, at least beyond a film interface between the sealant 130 and the encapsulation layer 110; the plurality of conductive structures 140 are independently controlled.
Since a certain external force is required to be applied during the box alignment process of the package cover plate 120, the frame glue 130 is easy to squeeze with the outermost film layer in the package layer 110, so that the package layer 110 is cracked, and the frame glue 130 is easy to form gaps and the like at the position close to the package layer 110. In contrast, the plurality of conductive structures 140 are arranged in order in the cross section along the radial width direction of the sealant 130. Repair of the frame glue 130 and the encapsulation layer 110 may be achieved with precise control of the plurality of conductive structures 140.
Specifically, a heating plate 150 is further disposed in the accommodating groove 121, and is configured to generate heat to melt the solid filling material 127 under voltage control, so that the filling material 127 flows out of the conducting structure 140 in a liquid state. The heating plate 150 is provided with a plurality of heating plates 150 at intervals. The heating plates 150 are disposed at two sides of the conducting structure 140, and are sequentially spaced from the conducting structure 140.
Specifically, in another embodiment, the accommodating groove 121 includes a first annular groove and a second annular groove, the first annular groove is disposed around the second annular groove, and the second annular groove is disposed around the display area 101, in other words, the accommodating groove 121 includes at least two annular grooves disposed in an aligned manner. The use of the filling material 127 can be further reduced, and in actual use, a plurality of annular grooves can be arranged at intervals, and the filling material 127 in two adjacent annular grooves is not communicated.
Further, in each annular groove, a plurality of square grooves may be provided in a discontinuous arrangement, and an annular arrangement of the accommodating grooves 121 may be formed by arranging the discontinuous square grooves. In this embodiment, each annular groove is further provided with a plurality of square grooves which are not communicated, so that when repairing a specific area, only the filling material 127 in the accommodating groove 121 corresponding to the specific area moves, and the filling material 127 in the accommodating groove 121 in other areas remains.
In another embodiment, the receiving groove 121 includes a plurality of receiving holes, a plurality of the receiving holes are spaced apart, and the filling material 127 is disposed in the receiving holes. Each of the conducting structures 140 may be disposed corresponding to one of the receiving holes, and in this embodiment, the receiving grooves 121 are further disposed as a plurality of receiving holes, and the plurality of receiving holes are disposed at a predetermined interval. According to the scheme, the containing holes are arranged in a plurality of ways, on one hand, fixed-point control can be realized, one containing hole or a plurality of containing holes are selected to repair in the corresponding areas with cracks, and the control mode is more accurate. Another option is that quantitative control can be achieved, and the amount of filler material 127 can be precisely controlled, for example by the number of heats of the receiving holes, enabling finer control.
Specifically, the hole depth of the accommodating hole is between 50um and 200um, the aperture is between 10um and 50um, and the distance between adjacent accommodating holes is about 100 um. The width of the conducting structure 140 is between 10um and 50um, and the thickness is smaller than the hole depth of the accommodating hole.
In this embodiment, the depth and aperture requirements of the accommodating hole can ensure that the accommodated filling material 127 can repair cracks, and the accommodating hole is located in the non-display area 102, so that the display effect is not affected basically. Specifically, the receiving hole may be extended from the extension portion 114 toward the main body portion 113, but the receiving hole is not beyond the area of the non-display area 102, specifically, is at least greater than 0.5um from the edge of the display area 101.
Fig. 6 is a schematic view of a display panel according to a third embodiment of the present application, and as shown in fig. 6, the present application further discloses a display panel 100, where the display panel 100 includes a display area 101 and a non-display area 102, the display panel 100 includes a substrate 103, a light emitting unit layer 104, an encapsulation layer 110, an encapsulation cover plate 120, and a frame glue 130, and the light emitting unit layer 104 is disposed on the substrate 103 and is located in the display area 101; the encapsulation layer 110 is disposed on the light emitting unit layer 104 and extends from the display region 101 to the non-display region 102; the package cover 120 is disposed on the package layer 110; the frame glue 130 is disposed at the outer side of the encapsulation layer 110, and two ends of the frame glue are respectively adhered to the substrate 103 and the encapsulation cover plate 120; wherein, a receiving groove 121 and a conducting structure 140 are disposed on a side of the packaging cover plate 120 close to the substrate 103, the receiving groove 121 is disposed corresponding to the frame glue 130, the conducting structure 140 is disposed on a side of the receiving groove 121 close to the substrate 103, a filling material 127 is disposed in the receiving groove 121, and the filling material 127 is used for having fluidity in a heating state; the conducting structure 140 enables the filling material 127 to flow out of the accommodating groove 121 in a conducting state so as to fill a gap generated on one side of the frame glue 130 close to the package cover.
The display panel 100 further includes a detection structure 160, where the detection structure 160 is disposed on a side of the package cover 120 near the substrate 103, and the detection structure 160 is used for detecting water vapor in the sealant 130.
Specifically, the detecting structure 160 is a metal detecting structure, i.e. a metal material of a metal or organic light emitting layer is used for failure detection, and whether the metal is failed or the degree of the failure can be determined by detecting the characteristics of resistance or electric heat of the metal. Characteristic change data of the metal detection structure under different water vapor invasion can be collected in advance, comparison analysis is carried out according to the prediction data, whether water vapor invasion exists in the frame glue 130 is judged, and corresponding filling materials 127 are selected for repairing.
In another embodiment, the detecting structure 160 may be a light detecting structure, where the detecting structure 160 is disposed on the substrate 103 and located in the non-display area 102, and the detecting structure 160 overlaps the accommodating groove 121 on the front projection of the substrate 103; the detecting structure 160 is configured to emit light toward the accommodating groove 121 and receive light reflected by the accommodating groove 121; when the package layer 110 has a crack at the position of the receiving groove 121, the detecting structure 160 cannot receive the light reflected by the receiving groove 121.
In this solution, by disposing the detecting structure 160 on the substrate 103 of the display panel 100, the detecting structure 160 mainly has a light emitting end and a light receiving end; the cold light source is emitted by the light emitting end, and the light receiving end receives the reflected light of the first intensity without a crack on the extension 114, and receives the reflected light of the second intensity when a crack exists on the extension 114. And judging whether a crack occurs at the corresponding position according to the reflected light intensity information collected by the light receiving end, and if the crack exists, adopting a heating operation to repair the crack by using the filling material 127.
Still further, an infrared emitter is disposed within the detecting structure 160 for emitting an infrared laser to the filler material 127 to melt the filler material 127.
The present solution provides a solution capable of performing detection and repair in real time, specifically, the detection structure 160 is controlled to detect the package of the display panel 100 by switching on/off the display panel 100 or other preset time, when a crack is detected, the infrared emitter in the detection structure 160 that detects the crack is controlled to emit laser, and the laser irradiates the filling material 127, so that the filling material 127 is melted by heating and flows to the crack, thereby filling the crack.
Of course, the same applies to the case of using an external detection device to heat the filler 127 by an external heating source. In contrast, the external inspection device needs to be inspected before the display panel 100 leaves the factory, but cannot be inspected after the factory, but the inspection structure 160 is not required to be integrated inside the display panel 100, so that the cost of the display panel 100 is reduced.
Fig. 7 is a schematic diagram of a display device of the present application, and referring to fig. 7, the present application discloses a display device, and a display device 200 includes the display panel 100 and a driving circuit 210, where the driving circuit 210 is used to drive the display panel 100 to display. The display panel 100 in the present embodiment is an organic light emitting display panel 100.
The packaging cover plate 120 close to the packaging edge is provided with the accommodating groove 121, the accommodating groove 121 is filled with the filling material 127, one side, close to the frame glue 130, of the accommodating groove 121 is provided with the conducting structure 140, and the conducting structure 140 serves as a switch valve. When a gap is found between the sealant 130 and the package cover 120, the filling material 127 in the accommodating groove 121 is heated, and when the conducting structure 140 is conducted, the solid state is changed into the liquid state and flows out of the accommodating groove 121 under the action of gravity, so that the gap is filled into the corresponding gap, the gap between the sealant 130 and the package cover 120 is repaired, and the sealing effect of the display panel 100 is improved. Thereby avoiding the problem of failure of the display panel 100 caused by aging and effectively prolonging the service life of the display panel 100 to a certain extent.
It should be noted that, the inventive concept of the present application may form a very large number of embodiments, but the application documents have limited space and cannot be listed one by one, so that on the premise of no conflict, the above-described embodiments or technical features may be arbitrarily combined to form new embodiments, and after the embodiments or technical features are combined, the original technical effects will be enhanced.
The foregoing is a further detailed description of the present application in connection with specific alternative embodiments, and it is not intended that the practice of the present application be limited to such descriptions. It should be understood that those skilled in the art to which the present application pertains may make several simple deductions or substitutions without departing from the spirit of the present application, and all such deductions or substitutions should be considered to be within the scope of the present application.
Claims (10)
1. A display panel comprising a display area and a non-display area, the display panel comprising:
a substrate;
a light emitting unit layer disposed on the substrate and located in the display region;
the packaging layer is arranged on the light-emitting unit layer and extends from the display area to the non-display area;
the packaging cover plate is arranged on the packaging layer; and
the frame glue is arranged on the outer side of the packaging layer, and two ends of the frame glue are respectively bonded with the substrate and the packaging cover plate;
wherein, one side of the packaging cover plate, which is close to the substrate, is provided with an accommodating groove and a conducting structure, the accommodating groove is arranged corresponding to the frame glue, the conducting structure is arranged at one side of the accommodating groove, which is close to the substrate,
a filling material is arranged in the accommodating groove and is used for having fluidity in a heating state; the conducting structure enables the filling material to flow out of the accommodating groove under the conducting state so as to fill a gap generated on one side of the frame glue close to the packaging cover plate.
2. The display panel of claim 1, wherein the filler material comprises one or more of polyethylene wax, bismuth-based alloy, lead-tin-antimony-copper quaternary alloy;
the melting temperature of the filler material is between 100 ℃ and 200 ℃.
3. The display panel according to claim 1, wherein the conductive structure includes a through hole and an electro-deformation layer filled in the through hole, one end of the through hole opens to the filler material, and the other end opens to the frame glue;
the electrically-induced deformation layer contracts under the drive of voltage, the through hole is communicated with the accommodating groove, the conducting structure is in a conducting state, and the filling material flows from the through hole to the frame glue under the heating state.
4. A display panel according to claim 3, wherein a plurality of conducting structures are arranged on one side of the accommodating groove close to the substrate, and the conducting structures are arranged at intervals; the plurality of conductive structures are independently controlled.
5. A display panel according to claim 3, wherein the electro-deformation layer comprises a first electrode, a second electrode and a piezoelectric layer arranged between the first electrode and the second electrode, the piezoelectric layer being elastically deformed under control of the first electrode and the second electrode.
6. The display panel of claim 1, wherein a heating sheet is further disposed in the receiving groove for generating heat under voltage control to melt the filler material so that the filler material flows out of the conductive structure.
7. The display panel of claim 6, wherein the heating sheet is provided in a plurality of pieces, and a plurality of the heating sheets are disposed at intervals.
8. The display panel of claim 1, wherein the receiving groove is located in the non-display area, and the receiving groove extends from the frame glue to the display area;
the packaging layer comprises a first inorganic insulating layer and a second inorganic insulating layer, wherein the first inorganic insulating layer wraps the light-emitting unit layer on one side of the substrate, and the second inorganic insulating layer wraps the first inorganic insulating layer on one side of the substrate;
the second inorganic insulating layer comprises a main body part and an extension part, wherein the main body part is arranged on the first inorganic insulating layer, and the main body part and the first inorganic insulating layer are completely overlapped on the orthographic projection of the substrate;
the extending part is arranged on the outer side of the main body part, is connected with the main body part and extends towards the substrate, and is arranged between the frame glue and the first inorganic insulating layer;
the receiving groove overlaps the extension on an orthographic projection of the substrate.
9. The display panel of claim 1, further comprising a detection structure disposed on a side of the package cover adjacent to the substrate, the detection structure configured to detect moisture within the package layer.
10. A display device comprising a drive circuit and the display panel of any one of claims 1-9, wherein the drive circuit is configured to drive the display panel to display.
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| CN202311836779.6A CN117794324B (en) | 2023-12-27 | 2023-12-27 | Display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311836779.6A CN117794324B (en) | 2023-12-27 | 2023-12-27 | Display panel and display device |
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| CN117794324B CN117794324B (en) | 2024-10-11 |
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| CN117794324B (en) | 2024-10-11 |
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