CN117677221B - Display panel preparation method, display panel and display device - Google Patents
Display panel preparation method, display panel and display device Download PDFInfo
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- CN117677221B CN117677221B CN202311834142.3A CN202311834142A CN117677221B CN 117677221 B CN117677221 B CN 117677221B CN 202311834142 A CN202311834142 A CN 202311834142A CN 117677221 B CN117677221 B CN 117677221B
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- 238000002360 preparation method Methods 0.000 title abstract description 9
- 238000004806 packaging method and process Methods 0.000 claims abstract description 85
- 239000010410 layer Substances 0.000 claims description 381
- 238000005538 encapsulation Methods 0.000 claims description 94
- 238000005530 etching Methods 0.000 claims description 62
- 238000004519 manufacturing process Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 22
- 239000011241 protective layer Substances 0.000 claims description 21
- 230000003287 optical effect Effects 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 9
- 238000005336 cracking Methods 0.000 abstract description 6
- 239000007789 gas Substances 0.000 description 54
- 239000000463 material Substances 0.000 description 24
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 230000003628 erosive effect Effects 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- -1 silicon nitride compound Chemical class 0.000 description 3
- 229910018503 SF6 Inorganic materials 0.000 description 2
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- QKCGXXHCELUCKW-UHFFFAOYSA-N n-[4-[4-(dinaphthalen-2-ylamino)phenyl]phenyl]-n-naphthalen-2-ylnaphthalen-2-amine Chemical compound C1=CC=CC2=CC(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C=C4C=CC=CC4=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=C21 QKCGXXHCELUCKW-UHFFFAOYSA-N 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 2
- 229960000909 sulfur hexafluoride Drugs 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 230000007613 environmental effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The application provides a display panel preparation method, a display panel and a display device, wherein the display panel preparation method comprises providing a bearing layer, forming a plurality of sub-luminescent layers arranged at intervals and a plurality of sub-pixel definition layers arranged at intervals on the bearing layer, the sub-pixel definition layer encloses the sub-light emitting layer, and a plurality of sub-packaging layers are formed on the bearing layer at intervals, wherein one sub-packaging layer covers one sub-pixel definition layer and one sub-light emitting layer. The interval area is arranged between two adjacent sub-packaging layers, so that the probability of cracking of the sub-packaging layers can be effectively reduced, and the packaging effect of the sub-packaging layers on the sub-luminous layers is improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel preparation method, a display panel and display equipment.
Background
With the development of electro-optical display technology and semiconductor manufacturing technology, the development of an Organic Light-Emitting Diode (OLED) display panel has a wide prospect. However, since the light emitting layer in the organic light emitting diode in the OLED display panel is an organic light emitting material, the material is very sensitive to water and oxygen, and is easily denatured when contacting water and oxygen, so that the material emits light abnormally. A common way today is to use an encapsulation layer to protect the organic light emitting material in the OLED display panel.
The flexible display panel needs to be bent when being prepared, but in the related art, the extension performance of the packaging layer is poor, cracks or breaks are often generated due to stress when the packaging layer is bent, so that the packaging is invalid, and the OLED luminescent material is easy to damage.
Disclosure of Invention
The application aims to provide a display panel preparation method, a display panel and display equipment, which are used for solving the technical problem that a packaging layer of a flexible display panel is easy to crack in the related art.
In a first aspect, the present application provides a method for manufacturing a display panel, including:
Providing a bearing layer;
Forming a plurality of sub-light-emitting layers arranged at intervals and a plurality of sub-pixel definition layers arranged at intervals on the bearing layer, wherein the sub-light-emitting layers are surrounded by the sub-pixel definition layers;
and forming a plurality of sub-packaging layers arranged at intervals on the bearing layer, wherein one sub-packaging layer covers one sub-pixel definition layer and one sub-light-emitting layer.
In the method for manufacturing the display panel provided by the application, after a plurality of sub-luminous layers and a plurality of sub-pixel definition layers are formed on a bearing layer, a plurality of sub-packaging layers are formed on the bearing layer, wherein one sub-packaging layer covers one sub-pixel definition layer and one sub-luminous layer. The interval area is arranged between two adjacent sub-packaging layers, so that the probability of cracking of the sub-packaging layers can be effectively reduced, and the packaging effect of the sub-packaging layers on the sub-luminous layers is improved.
Wherein, the forming a plurality of sub-packaging layers arranged at intervals on the bearing layer comprises:
Forming a package base layer on the bearing layer, wherein the package base layer covers the sub-light-emitting layer and the sub-pixel definition layer;
etching the package base layer and forming a plurality of sub-package layers arranged at intervals.
The package substrate comprises a first package layer, a second package layer and a third package layer which are sequentially stacked along the direction of the bearing layer, the package substrate is etched and a plurality of sub-package layers which are arranged at intervals are formed, and the package substrate comprises:
Etching the first packaging layer, wherein the orthographic projection of the etching area of the first packaging layer on the bearing layer is at least partially spaced from the orthographic projection of the sub-pixel defining layer and the sub-luminescent layer on the bearing layer;
Etching the second packaging layer, wherein the orthographic projection of the etching area of the second packaging layer on the bearing layer falls into the orthographic projection of the etching area of the first packaging layer on the bearing layer;
etching the third encapsulation layer.
Wherein said etching said first encapsulation layer comprises:
Etching the first packaging layer by introducing a first gas, wherein the etching time of the first gas is 30s-150s, and the flow rate of the first gas is 3000sccm-10000sccm;
the etching the second encapsulation layer includes:
Introducing a second gas to etch the second packaging layer, wherein the second gas etching time is 30s-150s, and the flow rate of the second gas is 3000sccm-10000sccm;
the etching the third encapsulation layer includes:
And introducing third gas to etch the third packaging layer, wherein the third gas etching time is 30s-150s, and the flow rate of the third gas is 3000sccm-10000sccm.
Before forming the plurality of sub-light-emitting layers and the plurality of sub-pixel definition layers, the method comprises the following steps:
and forming a protective layer on the bearing layer, wherein the sub-pixel definition layer covers at least part of the protective layer, and the protective layer and the sub-light-emitting layer are arranged at intervals.
Wherein after the etching the third encapsulation layer, the method includes:
and forming a fourth packaging layer, wherein the fourth packaging layer covers the side surfaces of the first packaging layer, the second packaging layer and the third packaging layer.
After forming a plurality of sub-packaging layers arranged at intervals on the bearing layer, the method comprises the following steps:
And forming a shading layer on one side of the protection layer, which is away from the bearing layer.
After forming a plurality of sub-packaging layers arranged at intervals on the bearing layer, the method comprises the following steps:
and covering optical glue and a glass cover plate, wherein the optical glue covers a plurality of sub-packaging layers and gaps among the sub-packaging layers.
In a second aspect, the present application provides a display panel prepared by the display panel preparation method, the display panel comprising:
A bearing layer;
a plurality of sub-luminous layers arranged at intervals and a plurality of sub-pixel definition layers arranged at intervals, wherein the sub-luminous layers are surrounded by the sub-pixel definition layers; and
And the plurality of sub-packaging layers are arranged at intervals, and one sub-packaging layer covers one sub-pixel definition layer and one sub-light-emitting layer.
In a third aspect, the present application provides a display device, which is characterized by comprising a housing and the display panel, wherein the housing is used for carrying the display panel.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application;
fig. 2 is a cross-sectional structural view of a display panel according to an embodiment of the present application;
Fig. 3 is a schematic top view of a display panel according to an embodiment of the present application;
fig. 4 is a flowchart of step S500 in a method for manufacturing a display panel according to an embodiment of the present application;
fig. 5 is a flowchart further included after step S501 in the method for manufacturing a display panel according to the embodiment of the present application;
fig. 6 is a cross-sectional structural view of a display panel including photoresist according to an embodiment of the present application;
Fig. 7 is a flowchart included in step S502 in a method for manufacturing a display panel according to an embodiment of the present application;
FIG. 8 is a schematic diagram of a first encapsulation layer of a display panel according to an embodiment of the present application;
FIG. 9 is a schematic diagram of an eroding second encapsulation layer of a display panel according to an embodiment of the present application;
FIG. 10 is a schematic diagram of a third encapsulation layer of a display panel according to an embodiment of the present application;
fig. 11 is a flowchart included in step S521 in a method for manufacturing a display panel according to an embodiment of the present application;
fig. 12 is a flowchart included in step S522 in a display panel manufacturing method according to an embodiment of the present application;
Fig. 13 is a flowchart included in step S523 in a display panel manufacturing method according to an embodiment of the present application;
Fig. 14 is a flowchart further included after step S523 in the display panel manufacturing method according to the embodiment of the present application;
Fig. 15 is a flowchart further included before step S300 in the method for manufacturing a display panel according to the embodiment of the present application;
fig. 16 is a flowchart one further included after step S500 in the method for manufacturing a display panel according to the embodiment of the present application;
Fig. 17 is a cross-sectional structural view of a display panel including a light shielding layer according to an embodiment of the present application;
fig. 18 is a second flowchart further included after step S500 in the method for manufacturing a display panel according to the embodiment of the present application;
Fig. 19 is a cross-sectional view of a display panel according to an embodiment of the present application, including an optical adhesive and a glass cover plate;
fig. 20 is a block diagram of a display device according to an embodiment of the present application.
Description of the reference numerals:
The display panel-100, the bearing layer-10, the sub-luminous layer-20, the sub-pixel definition layer-30, the sub-packaging layer-40, the packaging base layer-50, the first packaging layer-51, the second packaging layer-52, the third packaging layer-53, the fourth packaging layer-54, the protective layer-60, the shading layer-70, the optical cement-80, the glass cover plate-90, the display device-1000, the interval area-200, the photoresist-300 and the shell-400.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without any inventive effort, are intended to be within the scope of the application.
Reference herein to "an embodiment" or "implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment or implementation may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and the above figures are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
In the present specification, for convenience, words such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, which indicate an azimuth or a positional relationship, are used to describe positional relationships of constituent elements with reference to the drawings, only for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or elements referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus are not to be construed as limiting the present disclosure. The positional relationship of the constituent elements is appropriately changed according to the direction of the described constituent elements. Therefore, the present invention is not limited to the words described in the specification, and may be appropriately replaced according to circumstances.
In this specification, the terms "mounted," "connected," and "connected" are to be construed broadly, unless explicitly stated or limited otherwise. For example, it may be a fixed connection, a removable connection, or an integral connection; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intermediate members, or may be in communication with the interior of two elements. The meaning of the above terms in the present disclosure can be understood by one of ordinary skill in the art as appropriate.
With the development of electro-optical display technology and semiconductor manufacturing technology, the development of an Organic Light-Emitting Diode (OLED) display panel has a wide prospect. However, since the light emitting layer in the organic light emitting diode in the OLED display panel is an organic light emitting material, the material is very sensitive to water and oxygen, and is easily denatured when contacting water and oxygen, so that the material emits light abnormally. A common way today is to use an encapsulation layer to protect the organic light emitting material in the OLED display panel.
The flexible display panel needs to be bent when being prepared, but in the related art, the extension performance of the packaging layer is poor, cracks or breaks are often generated due to stress when the packaging layer is bent, so that the packaging is invalid, and the OLED luminescent material is easy to damage.
Referring to fig. 1 to 3, the present application provides a method for manufacturing a display panel, so as to solve the technical problem that a package layer of a flexible display panel is prone to crack in the related art.
The display panel manufacturing method includes, but is not limited to, steps S100, S300 and S500, and detailed descriptions about steps S100, S300 and S500 are as follows.
S100: a carrier layer 10 is provided.
It should be noted that the carrier layer 10 is a layer structure for covering the driving substrate and carrying the light emitting units in the display panel 100. In this embodiment, the carrier layer 10 is a planarization layer, and the carrier layer 10 is used to make the surface of the driving substrate relatively flat and to carry devices such as the light emitting unit and the package structure.
Optionally, the carrier layer 10 includes, but is not limited to, a material with good insulation performance such as Polyimide (PI).
S300: a plurality of sub-light emitting layers 20 and a plurality of sub-pixel defining layers 30 are formed on the carrier layer 10, wherein the sub-light emitting layers 20 are surrounded by the sub-pixel defining layers 30.
The forming of the plurality of sub-pixel defining layers 30 disposed at intervals on the carrier layer 10 may be, specifically, directly forming the plurality of sub-pixel defining layers 30 on a mask, or forming a normal pixel defining base layer first, and etching to form the plurality of sub-pixel defining layers 30 disposed at intervals.
The sub-pixel defining layer 30 encloses an opening, and the sub-light emitting layer 20 is disposed in the opening of the sub-pixel defining layer 30. Likewise, the present application is not limited to how the sub-luminescent layer 20 is formed.
The sub-pixel defining layer 30 may be used for absorbing light of the external environment, and optionally, in this embodiment, the material of the sub-pixel defining layer 30 is black Polyimide (PI), and the black Polyimide material has a plurality of advantages of good light-shielding property, good thermal conductivity, good antistatic property, good electrical conductivity, etc., and in other embodiments, the material of the sub-pixel defining layer 30 may be other types of materials, for example, black polymethyl methacrylate material (Polymethyl methacrylate, PMMA), black Polycarbonate material (PC), etc., as long as the material can absorb light of the external environment to avoid the reflection phenomenon, which is not particularly limited in the application.
S500: a plurality of sub-encapsulation layers 40 are formed on the carrier layer 10 at intervals, wherein one sub-encapsulation layer 40 covers one sub-pixel defining layer 30 and one sub-light emitting layer 20.
The sub-packaging layer 40 covers and packages the sub-luminescent layer 20, and can be used for preventing the sub-luminescent layer 20 from being affected by corrosion of external environmental moisture, oxygen and the like, improving the use effect of the sub-luminescent layer 20 and prolonging the service life of the sub-luminescent layer 20.
A plurality of sub-package layers 40 are formed on the carrier layer 10 at intervals, and the sub-package layers 40 are spaced apart, in other words, a spacing region 200 is provided between two adjacent sub-package layers 40. Compared with the scheme of arranging the package structure in the whole layer in the related art, the interval area 200 is provided between two adjacent sub-package layers 40 in the present application, which can effectively reduce the cracking probability of the sub-package layers 40 and improve the package effect of the sub-package layers 40 on the sub-luminescent layer 20.
In the method for manufacturing a display panel provided by the application, after forming a plurality of sub-light-emitting layers 20 and a plurality of sub-pixel defining layers 30 arranged at intervals on the carrier layer 10, a plurality of sub-encapsulation layers 40 are formed on the carrier layer 10 at intervals, wherein one sub-encapsulation layer 40 covers one sub-pixel defining layer 30 and one sub-light-emitting layer 20. The interval region 200 is provided between two adjacent sub-packaging layers 40, so that the probability of cracking of the sub-packaging layers 40 can be effectively reduced, and the packaging effect of the sub-packaging layers 40 on the sub-luminescent layer 20 can be improved.
Referring to fig. 2 and 4, step S500 includes steps S501 and S502, and the detailed description of steps S501 and S502 is as follows.
S501: an encapsulation base layer 50 is formed on the carrier layer 10, wherein the encapsulation base layer 50 covers the sub-light emitting layer 20 and the sub-pixel defining layer 30.
The package base layer 50 includes a first package layer 51, a second package layer 52, and a third package layer 53 sequentially stacked along the direction of the carrier layer 10. In this embodiment, the first encapsulation layer 51 is an inorganic layer, the first encapsulation layer 51 is a silicon nitride compound, the second encapsulation layer 52 is an organic layer, the third encapsulation layer 53 is an inorganic layer, and the third encapsulation layer 53 is a silicon nitride compound, and in other embodiments, the encapsulation base layer 50 may have other layer structures, and the materials of the first encapsulation layer 51 and the third encapsulation layer 53 may be other materials, which is not limited in the present application.
S502: the package base layer 50 is etched and a plurality of sub-package layers 40 are formed at intervals.
Referring to fig. 2,5 and 6, step S501 further includes step S511 after the package base layer 50 is formed on the carrier layer 10, and the detailed description of step S511 is as follows.
S511: a photoresist 300 is provided and the photoresist 300 is lithographically etched.
The photoresist 300 is etched and the photoresist 300 is patterned to form etched regions. The etched regions correspond to the spaced-apart regions 200 between the sub-package layers 40, in other words, in a subsequent preparation, the package base layer 50 in the etched regions is etched to form a plurality of the sub-package layers 40 disposed at intervals.
Referring to fig. 7 to 10, further, step S502 of "etching the package base layer 50 and forming a plurality of sub-package layers 40 disposed at intervals" includes steps S521, S522 and S523, and the detailed descriptions of steps S521, S522 and S523 are as follows.
S521: the first encapsulation layer 51 is etched, wherein the front projection of the etched area of the first encapsulation layer 51 on the carrier layer 10 is at least partially spaced from the front projection of the sub-pixel defining layer 30 and the sub-luminescent layer 20 on the carrier layer 10.
In other words, the etching area of the package substrate needs to avoid the area where the pixel defining layer and the light emitting layer are located, so as to avoid the phenomena of etching to the pixel defining layer or the light emitting layer, and damaging the device.
S522: the second encapsulation layer 52 is etched, wherein the orthographic projection of the etched area of the second encapsulation layer 52 on the carrier layer 10 falls into the orthographic projection of the etched area of the first encapsulation layer 51 on the carrier layer 10.
S523: the third encapsulation layer 53 is etched.
The front projection of the etched area of the second encapsulation layer 52 on the carrier layer 10 falls into the front projection of the etched area of the first encapsulation layer 51 on the carrier layer 10, in other words, the etched area of the second encapsulation layer 52 is smaller than the etched area of the first encapsulation layer 51, in other words, the second encapsulation layer 52 is far away from the opening area of the pixel defining layer compared to the first encapsulation layer 51.
When etching the third encapsulation layer 53, the etching gas will also etch the second encapsulation layer 52, so that the etching area of the second encapsulation layer 52 is smaller than the etching area of the first encapsulation layer 51, and a portion of the second encapsulation layer 52 may be reserved for etching when etching the third encapsulation layer 53, so as to improve the cross-sectional flatness of the first encapsulation layer 51 and the second encapsulation layer 52 in the etching area, and avoid etching to the pixel definition layer when etching the third encapsulation layer 53.
Referring to fig. 7 to 13, in this embodiment, step S521 includes step S5211 in the step S521 of etching the first encapsulation layer 51, and the detailed description of step S5211 is as follows.
S5211: and introducing a first gas to etch the first packaging layer 51, wherein the etching time of the first gas is 30s-150s, and the flow rate of the first gas is 3000sccm-10000sccm.
Alternatively, in this embodiment, the first gas is sulfur hexafluoride (SF 6), and in other embodiments, the first gas may be nitrogen trifluoride (NF 3) or other gases capable of eroding the first encapsulation layer 51 (nitrogen silicon compound), which is not limited in the present application.
The flow rate of the first gas is 3000sccm-10000sccms, alternatively, the flow rate of the first gas may be 3000sccm, 4000sccm, 5000sccm, 5500sccm, 5600sccm, 5700sccm, 6000sccm, 7000sccm, 8000sccm, 9000sccm, 9900sccm, 10000sccm, or other values within 3000sccm-10000sccms, which is not limited by the present application.
The etching time of the first gas to the first encapsulation layer 51 is 30s-150s, alternatively, the etching time of the first gas to the first encapsulation layer 51 may be 30s, 40s, 50s, 60s, 75s, 80s, 90s, 100s, 110s, 120s, 128s, 130s, 140s, 147s, 150s, or other time within 30s-150s, which is not limited in the present application. The etching time of the first gas to the first encapsulation layer 51 may be adjusted according to the type of the first gas, the flow rate of the first gas, or the specification of the display panel 100, for example, the etching time of the first gas to the first encapsulation layer 51 may be 10s-60s, 30s-100s, or 150s-300s, which is not limited in the present application.
The step S522 of "etching the second encapsulation layer 52" includes a step S5212, and a detailed description of the step S5221 is as follows.
S5221: and introducing a second gas to etch the second encapsulation layer 52, wherein the second gas etching time is 30s-150s, and the flow rate of the second gas is 3000sccm-10000sccm.
Alternatively, in this embodiment, the second gas is oxygen (O2), and in other embodiments, the second gas may be silane (SiH 4) or other gas capable of eroding the second encapsulation layer 52 (organic layer), which is not limited in the present application.
The flow rate of the second gas is 3000sccm-10000sccms, alternatively, the flow rate of the second gas may be 3000sccm, 4000sccm, 5000sccm, 5500sccm, 5600sccm, 5700sccm, 6000sccm, 7000sccm, 8000sccm, 9000sccm, 9900sccm, 10000sccm, or other values within 3000sccm-10000sccms, which is not limited by the present application.
The etching time of the second gas to the second encapsulation layer 52 is 30s-150s, alternatively, the etching time of the second gas to the second encapsulation layer 52 may be 30s, 40s, 50s, 60s, 75s, 80s, 90s, 100s, 110s, 120s, 128s, 130s, 140s, 147s, 150s, or other time within 30s-150s, which is not limited in the present application. The etching time of the second gas to the second encapsulation layer 52 may be adjusted according to the type of the second gas, the flow rate of the second gas, or the specification of the display panel 100, for example, the etching time of the second gas to the second encapsulation layer 52 may be 10s-60s, 30s-100s, or 150s-300s, which is not limited in the present application.
The step S523 of etching the third encapsulation layer 53 includes a step S5231, and a detailed description of the step S5231 is as follows.
S5231: and introducing third gas to etch the third encapsulation layer 53, wherein the third gas etching time is 30s-150s, and the flow rate of the third gas is 3000sccm-10000sccm.
Alternatively, in this embodiment, the third gas is sulfur hexafluoride (SF 6), and in other embodiments, the third gas may be nitrogen trifluoride (NF 3) or other gases capable of eroding the third encapsulation layer 53 (nitrogen silicon compound), which is not limited in the present application.
The flow rate of the third gas is 3000sccm-10000sccms, alternatively, the flow rate of the third gas may be 3000sccm, 4000sccm, 5000sccm, 5500sccm, 5600sccm, 5700sccm, 6000sccm, 7000sccm, 8000sccm, 9000sccm, 9900sccm, 10000sccm, or other values within 3000sccm-10000sccms, which is not limited by the present application.
The etching time of the third gas to the third encapsulation layer 53 is 30s-150s, alternatively, the etching time of the third gas to the third encapsulation layer 53 may be 30s, 40s, 50s, 60s, 75s, 80s, 90s, 100s, 110s, 120s, 128s, 130s, 140s, 147s, 150s, or other time within 30s-150s, which is not limited in the present application. The etching time range of the third gas to the third encapsulation layer 53 may be adjusted according to the type of the third gas, the flow rate of the third gas, or the specification of the display panel 100, for example, the etching time of the third gas to the third encapsulation layer 53 may be 10s-60s, 30s-100s, or 150s-300s, which is not limited in the present application.
Referring to fig. 2 and 14, step S523 includes step S524 after the etching of the third encapsulation layer 53, and the detailed description of step S524 is as follows.
S524: a fourth encapsulation layer 54 is formed, wherein the fourth encapsulation layer 54 covers the sides of the first encapsulation layer 51, the second encapsulation layer 52 and the third encapsulation layer 53.
In the present embodiment, the fourth encapsulation layer 54 is an inorganic layer, and the fourth encapsulation layer 54 is a silicon nitride compound, and in other embodiments, the material of the fourth encapsulation layer 54 may be other materials, which is not limited in the present application.
It should be noted that, the second encapsulation layer 52 is an organic layer, and has a high water-oxygen transmittance, so as to prevent water vapor from entering from the second encapsulation layer 52 and further form the fourth encapsulation layer 54, and the fourth encapsulation layer 54 may be used to encapsulate the second encapsulation layer 52, so as to reduce the water-oxygen transmittance of the encapsulation structure in the display panel 100 and improve the service life of the sub-luminescent layer 20.
Referring to fig. 2, 10 and 15, step S300 includes step S200 before forming a plurality of sub-light emitting layers 20 and a plurality of sub-pixel defining layers 30 on the carrier layer 10, and the detailed description of step S200 is as follows.
S200: a protective layer 60 is formed on the carrier layer 10, wherein the sub-pixel defining layer 30 covers at least a portion of the protective layer 60, and the protective layer 60 is spaced apart from the sub-light emitting layer 20.
Specifically, the protective layer 60 corresponds to the space region 200 between the plurality of sub-package layers 40, in other words, the protective layer 60 is disposed corresponding to the eroded region of the package base layer 50. The protective layer 60 is disposed between the third encapsulation layer 53 and the carrier layer 10, so that the protective layer 60 can prevent the third gas from eroding the carrier layer 10 when eroding the third encapsulation layer 53.
Alternatively, in the embodiment of the present application, the protection layer 60 is made of metal, such as aluminum Al, silver Ag, etc., and in other embodiments, the protection layer 60 may be made of other materials with higher compactness and capable of blocking the third gas erosion, which is not limited in the present application.
Further, it should be noted that, when the protective layer 60 is made of metal, the protective layer 60 may be made of the same material as the anode layer of the light emitting unit in the display panel 100, in other words, the protective layer 60 may be made of one process together with the anode layer, which may simplify the manufacturing method of the display panel 100, reduce the manufacturing cost of the display panel 100, and improve the manufacturing efficiency of the display panel 100.
Referring to fig. 16 and 17, in one embodiment, step S500 includes step S510 after forming a plurality of sub-package layers 40 disposed at intervals on the carrier layer 10, and the detailed description of step S510 is as follows.
S510: a light shielding layer 70 is formed on the side of the protective layer 60 facing away from the carrier layer 10.
When the protective layer 60 is made of metal, the protective layer 60 easily reflects ambient light, which is unfavorable for the display effect of the display panel 100. The light shielding layer 70 is disposed at a side of the protective layer 60 away from the carrier layer 10, so that the protective layer 60 can be prevented from reflecting ambient light, thereby improving the display effect of the display panel 100.
Referring to fig. 18 and 19, in an embodiment, step S500 further includes step S520 after the forming of the plurality of sub-package layers 40 disposed at intervals on the carrier layer 10, and the detailed description of step S520 is as follows.
S520: and covering the optical adhesive 80 and the glass cover plate 90, wherein the optical adhesive 80 covers the plurality of sub-packaging layers 40 and gaps among the plurality of sub-packaging layers 40.
The optical adhesive 80 is in a liquid state in the process of preparing the display panel 100, and the optical adhesive 80 is filled into the gaps of the plurality of sub-packaging layers 40, so that stress caused when the display panel 100 needs to be bent to form a curved surface can be reduced.
It should be noted that, step S510 and step S520 are not sequentially divided, and are merely preparation steps of different embodiments, and should not be construed as limiting the present application.
Referring to fig. 2 again, the present application also provides a display panel 100, and the display panel 100 is manufactured by the display panel manufacturing method.
The display panel 100 includes a carrier layer 10, a plurality of sub-luminescent layers 20, a plurality of sub-pixel defining layers 30, and a plurality of sub-encapsulation layers 40.
Specifically, the plurality of sub-light emitting layers 20 are disposed at intervals, the plurality of sub-pixel defining layers 30 are disposed at intervals, and one sub-light emitting layer 20 is surrounded by one sub-pixel defining layer 30.
The sub-packaging layers 40 are disposed at intervals, and one sub-packaging layer 40 covers one sub-pixel defining layer 30 and one sub-light emitting layer 20.
The sub-packaging layers 40 are spaced apart, in other words, a spacing region 200 is provided between two adjacent sub-packaging layers 40. Compared with the scheme of arranging the package structure in the whole layer in the related art, the interval area 200 is provided between two adjacent sub-package layers 40 in the present application, which can effectively reduce the cracking probability of the sub-package layers 40 and improve the package effect of the sub-package layers 40 on the sub-luminescent layer 20.
In the display panel 100 provided by the present application, a plurality of sub-encapsulation layers 40 are formed on the carrier layer 10 at intervals, and one sub-encapsulation layer 40 covers one sub-pixel defining layer 30 and one sub-light emitting layer 20. The interval region 200 is provided between two adjacent sub-packaging layers 40, so that the probability of cracking of the sub-packaging layers 40 can be effectively reduced, and the packaging effect of the sub-packaging layers 40 on the sub-luminescent layer 20 can be improved.
Referring to fig. 20, the present application further provides a display device 1000, where the display device 1000 includes a housing 400 and the display panel 100, and the housing 400 is used for carrying the display panel 100.
Optionally, the display device 1000 includes, but is not limited to, an electronic device such as a display screen, a mobile phone, a computer, etc.
While the foregoing is directed to embodiments of the present application, it will be appreciated by those skilled in the art that changes and modifications may be made without departing from the principles of the application, and such changes and modifications are intended to be included within the scope of the application.
Claims (5)
1.A method for manufacturing a display panel, comprising:
Providing a bearing layer;
A protective layer is formed on the bearing layer,
Forming a plurality of sub-light-emitting layers and a plurality of sub-pixel definition layers which are arranged at intervals on the bearing layer, wherein the sub-light-emitting layers are surrounded by the sub-pixel definition layers, at least part of the protective layers are covered by the sub-pixel definition layers, and the protective layers and the sub-light-emitting layers are arranged at intervals;
Forming a plurality of sub-packaging layers arranged at intervals on the bearing layer, wherein one sub-packaging layer covers one sub-pixel definition layer and one sub-light-emitting layer; the forming a plurality of sub-packaging layers arranged at intervals on the bearing layer comprises the following steps: forming a package base layer on the bearing layer, wherein the package base layer covers the sub-light-emitting layer and the sub-pixel definition layer; etching the package base layer and forming a plurality of sub-package layers arranged at intervals; the package base layer includes first encapsulation layer, second encapsulation layer and third encapsulation layer that stacks gradually along the loading layer direction, the etching the encapsulation base layer and form a plurality of interval settings the sub-encapsulation layer includes: etching the first packaging layer, wherein the orthographic projection of the etching area of the first packaging layer on the bearing layer is at least partially spaced from the orthographic projection of the sub-pixel defining layer and the sub-luminescent layer on the bearing layer; etching the second packaging layer, wherein the orthographic projection of the etching area of the second packaging layer on the bearing layer falls into the orthographic projection of the etching area of the first packaging layer on the bearing layer; etching the third encapsulation layer; forming a fourth packaging layer, wherein the fourth packaging layer covers the side surfaces of the first packaging layer, the second packaging layer and the third packaging layer;
and forming a shading layer on one side of the protection layer, which is away from the bearing layer, wherein the shading layer can be used for preventing the protection layer from reflecting ambient light.
2. The method of claim 1, wherein the etching the first encapsulation layer comprises:
Etching the first packaging layer by introducing a first gas, wherein the etching time of the first gas is 30s-150s, and the flow rate of the first gas is 3000sccm-10000sccm;
the etching the second encapsulation layer includes:
Introducing a second gas to etch the second packaging layer, wherein the second gas etching time is 30s-150s, and the flow rate of the second gas is 3000sccm-10000sccm;
the etching the third encapsulation layer includes:
And introducing third gas to etch the third packaging layer, wherein the third gas etching time is 30s-150s, and the flow rate of the third gas is 3000sccm-10000sccm.
3. The method for manufacturing a display panel according to claim 1, wherein after forming a plurality of sub-packaging layers disposed at intervals on the carrier layer, the method comprises:
and covering optical glue and a glass cover plate, wherein the optical glue covers a plurality of sub-packaging layers and gaps among the sub-packaging layers.
4. A display panel produced by the display panel production method according to any one of claims 1 to 3, characterized in that the display panel comprises:
A bearing layer;
a plurality of sub-luminous layers arranged at intervals and a plurality of sub-pixel definition layers arranged at intervals, wherein the sub-luminous layers are surrounded by the sub-pixel definition layers; and
And the plurality of sub-packaging layers are arranged at intervals, and one sub-packaging layer covers one sub-pixel definition layer and one sub-light-emitting layer.
5. A display device comprising a housing and the display panel of claim 4, the housing being configured to carry the display panel.
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| CN112018131A (en) * | 2020-08-06 | 2020-12-01 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and preparation method thereof |
| CN113659098A (en) * | 2021-09-14 | 2021-11-16 | 京东方科技集团股份有限公司 | Display panel, display panel forming method and display device |
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| US9991326B2 (en) * | 2015-01-14 | 2018-06-05 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting device comprising flexible substrate and light-emitting element |
| CN109616492B (en) * | 2018-10-26 | 2020-11-06 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel, flexible display device and preparation method of flexible display panel |
| CN113838994B (en) * | 2019-11-29 | 2022-07-22 | 华为技术有限公司 | Display panel, flexible display screen, electronic equipment and preparation method of display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112018131A (en) * | 2020-08-06 | 2020-12-01 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and preparation method thereof |
| CN113659098A (en) * | 2021-09-14 | 2021-11-16 | 京东方科技集团股份有限公司 | Display panel, display panel forming method and display device |
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