CN117405212A - High-sensitivity low-noise digital hydrophone and application method thereof - Google Patents
High-sensitivity low-noise digital hydrophone and application method thereof Download PDFInfo
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 29
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- 239000000523 sample Substances 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 1
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- 238000000586 desensitisation Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
- G01H9/004—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means using fibre optic sensors
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Abstract
The invention relates to a high-sensitivity low-noise digital hydrophone and a use method thereof, wherein the digital hydrophone comprises: the front end of the shell is provided with an air bin, the tail end of the shell is provided with a cavity, and the air bin is separated from the cavity by a baffle; the integrated chip is positioned in the air bin and connected to one side of the partition board, and comprises an MEMS sound-sensitive film and an optical chip, wherein the MEMS sound-sensitive film is positioned at the front end of the optical chip; the optical chip comprises an optical waveguide chip, a laser and a photoelectric conversion module, wherein a reference light path and a detection light path are integrated in the optical waveguide chip, a gap is reserved between the front end of the detection light path and the MEMS acoustic sensitive film, and two ends of the reference light path are respectively connected with the laser and the photoelectric conversion module; and the processing chip is arranged in the cavity and connected to the other side of the partition board, and is connected with the photoelectric conversion module. The invention improves the signal-to-noise ratio, reduces noise and has high sensitivity.
Description
Technical Field
The invention relates to the technical field of underwater observation and detection equipment, in particular to a high-sensitivity low-noise digital hydrophone and a use method thereof.
Background
The sonar equipment is a downwind ear in the field of offshore military, and can sense sounds emitted by submarines, ships and the like in a long distance. However, with the development of the technology of underwater sound countermeasure and countercountermeasure, especially the appearance of a quiet submarine, the noise frequency is reduced to about hundred hertz, and the noise level is even lower than the ocean background noise, so that the traditional piezoelectric hydrophone is quite unprecedented.
In recent years, with the development of optical fiber sensing technology, an optical fiber hydrophone is used as a novel underwater sound detection device, the sensitivity of the novel underwater sound detection device can reach-140 dB rad/mu Pa, and the long-distance signal transmission of hundreds of kilometers can be realized. However, the optical fiber hydrophone has large noise due to polarization fading (6 pm/Hz1/2, polarized light output by the high-coherence laser is transmitted through a long-distance single-mode optical fiber, the polarization state is randomly changed due to the influences of microbending, twisting, environmental change and the like of the optical fiber in the optical fiber interferometer, so that the interference of light in the optical fiber hydrophone is unstable, and particularly when the polarization states of two beams of interference light are orthogonal, the visibility of an output signal is zero, and at the moment, a sensing signal completely disappears). Meanwhile, the sensitivity of the optical fiber hydrophone is difficult to further improve, various sensitization structures are arranged on the optical fiber hydrophone, but the final detected variation of the optical fiber is limited by the property of the optical fiber material, and the sensitivity is close to the limit (the smaller the Young modulus is, the more sensitive the vibration is). New technical means are needed to further improve the detection sensitivity, signal to noise ratio and noise.
Disclosure of Invention
Therefore, the invention aims to solve the technical problems of low sensitivity and high noise in the prior art.
In order to solve the technical problems, in one aspect, the invention provides a high-sensitivity low-noise digital hydrophone, which comprises:
the front end of the shell is provided with an air bin, the tail end of the shell is provided with a cavity, and the air bin is separated from the cavity by a baffle;
the integrated chip is positioned in the air bin and connected to one side of the partition board, and comprises an MEMS sound-sensitive film and an optical chip, wherein the MEMS sound-sensitive film is positioned at the front end of the optical chip; the optical chip comprises an optical waveguide chip, a laser and a photoelectric conversion module, wherein a reference light path and a detection light path are integrated in the optical waveguide chip, the reference light path and the detection light path adopt optical waveguides, a gap is reserved between the front end of the detection light path and the MEMS sound-sensitive film, and two ends of the reference light path are respectively connected with the laser and the photoelectric conversion module;
and the processing chip is arranged in the cavity and connected to the other side of the partition board, and is connected with the photoelectric conversion module.
In one embodiment of the invention, the optical waveguide chip has integrated therein a first optical waveguide, a second optical waveguide, a third optical waveguide, a first branch optical waveguide, a second branch optical waveguide, and a third branch optical waveguide;
one end of the first optical waveguide is connected with the laser, and the other end of the first optical waveguide is divided into a first branch optical waveguide and a second branch optical waveguide;
one end of the first branch optical waveguide is combined with one end of the third branch optical waveguide and is connected with one end of the second optical waveguide, and a gap is reserved between the free end of the second optical waveguide and the MEMS acoustic sensitive film;
one end of the third branch optical waveguide is combined with one end of the second branch optical waveguide and is connected with one end of the third optical waveguide, and the other end of the third optical waveguide is connected with the photoelectric conversion module.
In one embodiment of the invention, the free end of the second optical waveguide is connected to a coupling optical fiber, and a gap is formed between the coupling optical fiber and the MEMS acoustic sensitive film.
In one embodiment of the invention, the axis of the coupling fiber coincides with the central axis of the MEMS acoustic sensitive membrane.
In one embodiment of the invention, in the housing, a part surrounding the outer side of the air bin is of a spherical curved surface structure, and a part surrounding the outer side of the cavity is of a quadrangular prism structure.
In one embodiment of the invention, the processing chip comprises an acquisition unit, a processing unit and an audio output unit; the acquisition unit is electrically connected with the photoelectric conversion module, and the acquisition unit, the processing unit and the audio output unit are sequentially and electrically connected.
In one embodiment of the invention, the housing is made of metal, and an organic anti-corrosion material layer is attached to the outer surface of the housing.
In one embodiment of the invention, the microchip is coated with a sound insulating layer.
In another aspect, the invention provides a method of using a high sensitivity, low noise digital hydrophone, comprising the steps of:
after the optical waveguide chip in the integrated chip receives the laser emitted by the laser, the laser is split into a reference light path and a detection light path, and the reference light path emits a reference light beam; the detection light path emits a detection light beam; the detection light beam of the detection light path is emitted to the MEMS sound-sensitive film through the optical waveguide chip, and the detection light beam is back scattered by the MEMS sound-sensitive film and returns to the optical waveguide chip; when external sound waves are conducted to the MEMS sound sensitive film, vibration information of the external sound waves is carried by scattered detection light beams; the detection light beam carrying the external acoustic vibration information and the reference light beam interfere after being combined, the interfered light beam is incident into the photoelectric conversion module, the photoelectric conversion module converts the light beam into an electric signal and outputs the electric signal to the processing chip, and the processing chip acquires, processes, analyzes and analyzes the electric signal and then outputs a digital signal.
Compared with the prior art, the technical scheme of the invention has the following advantages:
the high-sensitivity low-noise digital hydrophone integrates the MEMS sound-sensitive film, the optical waveguide chip, the laser and the photoelectric conversion module into an integrated chip, integrates a reference light path and a detection light path on the optical waveguide chip by adopting an optical technology, realizes integration and miniaturization of the sensing signal processing transmitting and receiving process, has good polarization-maintaining effect (more than 60 dB), has system noise as low as 0.3pm/Hz1/2, and has low noise and high sensitivity; the MEMS sound-sensitive film and the optical chip are packaged on the same chip, and the high-integration design can effectively reduce connection loss and transmission loss, improve signal-to-noise ratio, reduce noise, and has high stability, low power consumption and miniaturization. In addition, the MEMS sound-sensitive film is adopted to directly detect external vibration, the Young modulus of the vibrating diaphragm is small, the vibration amplitude of the same sound intensity is large, and the sensitivity of the system can reach-80 dB rad/mu Pa, so that the sensitivity of the system is further improved.
Drawings
In order that the invention may be more readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings, in which
FIG. 1 is a schematic diagram of a high sensitivity, low noise digital hydrophone in accordance with a preferred embodiment of the invention;
FIG. 2 is a schematic diagram of the structure of an integrated chip in the high sensitivity, low noise digital hydrophone of FIG. 1;
FIG. 3 is a flow chart of the use and method of a high sensitivity, low noise digital hydrophone of the type shown in FIG. 1.
Description of the specification reference numerals: 100. a housing; 110. an air bin; 120. a chamber; 130. a partition plate;
200. an integrated chip; 210. a MEMS sound sensitive membrane; 220. an optical chip; 221. an optical waveguide chip; 222. a laser; 223. a photoelectric conversion module; 2211. coupling an optical fiber; 2212. a first optical waveguide; 2213. a second optical waveguide; 2214. a third optical waveguide; 2215. a first branched optical waveguide; 2216. a second branched optical waveguide; 2217. a third branched optical waveguide; 224. a sound insulation layer;
300. and processing the chip.
Detailed Description
The invention will be further described in connection with the accompanying drawings and specific examples which are set forth so that those skilled in the art will better understand the invention and will be able to practice it, but the examples are not intended to be limiting of the invention.
Referring to fig. 1-2, in one aspect, the invention provides a high sensitivity, low noise digital hydrophone comprising:
the shell 100, the front end is provided with an air bin 110, the tail end is provided with a cavity 120, and the air bin 110 and the cavity 120 are separated by a baffle 130;
the integrated chip 200 is positioned in the air bin 110 and connected to one side of the partition 130, the integrated chip 200 comprises a MEMS sound sensitive film 210 and an optical chip 220, and the MEMS sound sensitive film 210 is positioned at the front end of the optical chip 220; the optical chip 220 comprises an optical waveguide chip 221, a laser 222 and a photoelectric conversion module 223, wherein a reference light path and a detection light path are integrated in the optical waveguide chip 221, the reference light path and the detection light path adopt optical waveguides, a gap is reserved between the front end of the detection light path and the MEMS acoustic sensitive film 210, and two ends of the reference light path are respectively connected with the laser 222 and the photoelectric conversion module 223;
the processing chip 300 is disposed in the chamber 120 and connected to the other side of the partition 130, and the processing chip 300 and the photoelectric conversion module 223 are connected by signal lines.
Specifically, the MEMS acoustic-sensitive film 210, the optical waveguide chip 221, the laser 222 and the photoelectric conversion module 223 are highly integrated into the integrated chip 200, so that the reference light path and the detection light path are integrated on the optical waveguide chip 221 by adopting an optical technology, the integration and miniaturization of the sensing signal processing transmitting and receiving process are realized, the polarization-maintaining effect is good (more than 60 dB), the system noise is as low as 0.3pm/Hz1/2, the noise is low, and the sensitivity is high; the MEMS acoustic sensitive film 210 and the optical chip 220 are packaged on a chip, and the highly integrated design can effectively reduce connection loss and transmission loss, improve signal to noise ratio, reduce noise, have high stability, low power consumption and be miniaturized. In addition, the MEMS sound sensitive film 210 is adopted to directly detect external vibration, the Young modulus of the vibrating diaphragm is small, the vibration amplitude of the same sound intensity is large, and the sensitivity of the system can reach-80 dB rad/mu Pa, so that the sensitivity of the application is further improved.
In some possible embodiments, the laser 222 may be a normal linewidth laser 222 (linewidth < 1 nm), with wavelengths in the infrared band, 1310nm/1550nm.
In some possible embodiments, the laser 222 may be a communication common laser 222, and a narrow line width light source is not required, thereby greatly reducing the cost.
It should be noted that, in the present application, by measuring the vibration of the MEMS acoustic sensitive film 210 to detect the sound wave, the MEMS acoustic sensitive film 210 can be made thin (several micrometers), so that integration is facilitated, and it has a very low young's modulus, and can generate a larger amplitude under the same vibration.
The present application uses an FMCW interferometer for coherent detection based on laser doppler vibration measurement, and uses an IQ demodulation technique to analyze the phase change of vibration, thereby back-calculating the acoustic wave vibration. The FMCW interferometer (i.e., the structure composed of the optical waveguide chip 221, the laser 222 and the photoelectric conversion module 223) has extremely high sensitivity for coherent demodulation of the fm continuous wave.
Further, the optical waveguide chip 221 has integrated therein a first optical waveguide 2212, a second optical waveguide 2213, a third optical waveguide 2214, a first branch optical waveguide 2215, a second branch optical waveguide 2216, and a third branch optical waveguide 2217;
one end of the first optical waveguide 2212 is connected to the laser 222, and the other end is divided into a first branch optical waveguide 2215 and a second branch optical waveguide 2216;
one end of the first branch optical waveguide 2215 is combined with one end of the third branch optical waveguide 2217 and is connected with one end of the second optical waveguide 2213, and a gap is reserved between the free end of the second optical waveguide 2213 and the MEMS acoustic sensitive film 210;
one end of the third branch optical waveguide 2217 and one end of the second branch optical waveguide 2216 are combined and connected to one end of the third optical waveguide 2214, and the other end of the third optical waveguide 2214 is connected to the photoelectric conversion module 223.
The first optical waveguide 2212, the first branch optical waveguide 2215, the second optical waveguide 2213 and the third branch optical waveguide 2217 form a detection optical path, and the first optical waveguide 2212 and the second branch optical waveguide 2216 form a reference optical path. The reference light path emits a reference light beam; the detection light path emits a detection light beam.
Specifically, the present embodiment provides a first optical waveguide 2212, a second optical waveguide 2213, a third optical waveguide 2214, a first branch optical waveguide 2215, a second branch optical waveguide 2216, and a third branch optical waveguide 2217, wherein the first optical waveguide 2212, the first branch optical waveguide 2215, and the third branch optical waveguide 2217 form a detection optical path, and the first optical waveguide 2212 and the second branch optical waveguide 2216 form a reference optical path. Therefore, the detection light path and the reference light path can be conducted rapidly and efficiently. The optical chip 220 is integrated with a reference optical path and a detection optical path, so that the functions of multiplexing/demultiplexing, multiplexing/multiplexing, phase control and the like are realized in the optical chip 220 with the centimeter-level size, and the integration is realized.
Further, a coupling optical fiber 2211 is connected to the free end of the second optical waveguide 2213, and a gap is formed between the coupling optical fiber 2211 and the MEMS acoustic sensitive film 210. In some possible implementations, the coupling fiber 2211 is a polarization maintaining fiber.
Specifically, this embodiment sets up the coupling optic fibre 2211, through coupling optic fibre 2211 with the concentrated outgoing of light beam after leading out from the inside of optical waveguide chip to on the MEMS sound sensitive film to avoid leading to the facula grow, return light reduction with the scattered outgoing of light beam on the MEMS sound sensitive film, can cause the signal to reduce, multipath effect influence also can increase, weakens interference effect (increase noise). As can be seen from this, the present embodiment provides the coupling optical fiber 2211 capable of enhancing the interference effect (reducing noise). Further, the axis of the coupling fiber 2211 coincides with the central axis of the MEMS acoustic sensitive film 210.
Specifically, in this embodiment, the axis of the coupling optical fiber 2211 coincides with the central axis of the MEMS acoustic sensitive film 210, so that the effective efficiency of the probe beam incident on the MEMS acoustic sensitive film 210 is ensured.
Further, in the housing 100, a portion surrounding the outside of the air chamber 110 has a spherical curved surface structure, and a portion surrounding the outside of the chamber 120 has a quadrangular prism structure.
Specifically, in the outer shell 100 of this embodiment, the part surrounding the outside of the air bin 110 is in a spherical curved surface structure, and the part surrounding the outside of the cavity 120 is in a quadrangular prism structure, so that the digital hydrophone cylindrical capsule structure has strong water pressure resistance.
Further, the processing chip 300 includes an acquisition unit, a processing unit, and an audio output unit; the acquisition unit is electrically connected with the photoelectric conversion module 223, and the acquisition unit, the processing unit and the audio output unit are electrically connected in sequence. In some embodiments, the processing chip 300 may integrate acquisition, processing, analysis, control, and communication functions, and the processing chip 300 may be a dedicated chip with low power consumption.
Specifically, the processing chip 300 of the present embodiment includes an acquisition unit, a processing unit, and an audio output unit, so as to acquire, process, analyze, and analyze the electrical signal and output a digital signal. Simple structure and low cost.
Further, the casing 100 is made of metal, and an organic anti-corrosion material layer is attached to the outer surface of the casing 100. For example, rubber, PVC, etc. are used for the organic anti-corrosive material layer.
Specifically, in this embodiment, an organic anti-corrosion material layer is attached to the outer surface of the casing 100, so that the casing 100 made of metal material is protected, and the service life of the application is further improved.
Further, the optical chip 220 is covered with a sound insulation layer 224.
Specifically, the sound insulation layer 224 can insulate external sound conduction, can shield the influence of sound waves on a reference light path, ensures the stability of a reference light beam, and further improves the detection sensitivity and the signal-to-noise ratio of the device. While the acoustic barrier 224 may avoid vibration cancellation desensitization caused by the reverse conduction of sound waves to the MEMS acoustic sensitive film 210.
Referring to FIG. 3, in another aspect, the invention provides a method of using a high sensitivity, low noise digital hydrophone, comprising the steps of:
after receiving the laser emitted by the laser 222, the optical waveguide chip 221 in the integrated chip 200 splits the laser into a reference light path and a detection light path, wherein the reference light path emits a reference light beam; the detection light path emits a detection light beam; the detection light beam of the detection light path is emitted to the MEMS acoustic sensitive film 210 through the optical waveguide chip 221, and the detection light beam is back scattered by the MEMS acoustic sensitive film 210 and returns to the optical waveguide chip 221; when the external sound wave is conducted to the MEMS sound sensitive film 210, the vibration information of the external sound wave is carried by the scattered detection light beam; the probe beam carrying the external acoustic vibration information and the reference beam are interfered after being combined, and the interfered beam is incident into the photoelectric conversion module 223 through the third optical waveguide 2214 (the photoelectric conversion module 223 converts the optical signal after interference into an electric signal for subsequent acquisition, processing and analysis), the photoelectric conversion module 223 converts the electric signal into an electric signal and outputs the electric signal to the processing chip 300, and the processing chip 300 acquires, processes and analyzes the electric signal and outputs a digital signal (namely, outputs an audio signal).
The method and the device adopt a detection interferometer based on laser Doppler vibration measurement for coherent detection, and adopt an IQ demodulation technology to analyze the phase change of vibration so as to reversely calculate the acoustic wave vibration.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present invention will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. And obvious changes and modifications which are extended therefrom are still within the scope of the invention.
Claims (9)
1. A high-sensitivity low-noise digital hydrophone is characterized in that: comprising the following steps:
the front end of the shell is provided with an air bin, the tail end of the shell is provided with a cavity, and the air bin and the cavity are separated by a baffle;
the integrated chip is positioned in the air bin and connected to one side of the partition board, and comprises an MEMS sound-sensitive film and an optical chip, wherein the MEMS sound-sensitive film is positioned at the front end of the optical chip; the optical chip comprises an optical waveguide chip, a laser and a photoelectric conversion module, wherein a reference light path and a detection light path are integrated in the optical waveguide chip, the reference light path and the detection light path adopt optical waveguides, a gap is reserved between the front end of the detection light path and the MEMS sound-sensitive film, and two ends of the reference light path are respectively connected with the laser and the photoelectric conversion module;
and the processing chip is arranged in the cavity and connected with the other side of the partition board, and the processing chip is connected with the photoelectric conversion module.
2. The high sensitivity, low noise digital hydrophone of claim 1, wherein: the optical waveguide chip is integrated with a first optical waveguide, a second optical waveguide, a third optical waveguide, a first branch optical waveguide, a second branch optical waveguide and a third branch optical waveguide;
one end of the first optical waveguide is connected with the laser, and the other end of the first optical waveguide is divided into the first branch optical waveguide and the second branch optical waveguide;
one end of the first branch optical waveguide is combined with one end of the third branch optical waveguide and is connected with one end of the second optical waveguide, and a gap is reserved between the free end of the second optical waveguide and the MEMS acoustic sensitive film;
one end of the third branch optical waveguide is combined with one end of the second branch optical waveguide and is connected with one end of the third optical waveguide, and the other end of the third optical waveguide is connected with the photoelectric conversion module.
3. The high sensitivity, low noise digital hydrophone of claim 2, wherein: and the free end of the second optical waveguide is connected with a coupling optical fiber, and a gap is reserved between the coupling optical fiber and the MEMS sound-sensitive film.
4. A high sensitivity, low noise digital hydrophone as recited in claim 3, wherein: the axis of the coupling optical fiber is coincident with the central axis of the MEMS sound-sensitive film.
5. The high sensitivity, low noise digital hydrophone of claim 1, wherein: in the shell, the part surrounding the outer side of the air bin is of a spherical curved surface structure, and the part surrounding the outer side of the cavity is of a quadrangular prism structure.
6. A high sensitivity, low noise digital hydrophone as recited in claim 1, wherein: the processing chip comprises an acquisition unit, a processing unit and an audio output unit; the acquisition unit is electrically connected with the photoelectric conversion module, and the acquisition unit, the processing unit and the audio output unit are electrically connected in sequence.
7. The high sensitivity, low noise digital hydrophone of claim 1, wherein: the shell is made of metal, and an organic anti-corrosion material layer is attached to the outer surface of the shell.
8. The high sensitivity, low noise digital hydrophone of claim 1, wherein: and the optical chip is coated with a sound insulation layer.
9. A method for using a high-sensitivity low-noise digital hydrophone is characterized by comprising the following steps of: the method comprises the following steps:
the optical waveguide chip in the integrated chip receives the laser emitted by the laser and splits the laser into a reference light path and a detection light path, wherein the reference light path emits a reference light beam; the detection light path emits a detection light beam; the detection light beam of the detection light path is emitted to the MEMS sound-sensitive film through the optical waveguide chip, and the detection light beam is back-scattered by the MEMS sound-sensitive film and returns to the optical waveguide chip; when external sound waves are conducted to the MEMS sound-sensitive film, vibration information of the external sound waves is carried by the scattered detection light beams; the detection light beam carrying external acoustic vibration information and the reference light beam interfere after being combined, the interfered light beam is incident into the photoelectric conversion module, the photoelectric conversion module converts the light beam into an electric signal and outputs the electric signal to the processing chip, and the processing chip acquires, processes, analyzes and analyzes the electric signal and outputs a digital signal.
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