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CN117367311A - Object surface contour acquisition method and device - Google Patents

Object surface contour acquisition method and device Download PDF

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Publication number
CN117367311A
CN117367311A CN202210765497.0A CN202210765497A CN117367311A CN 117367311 A CN117367311 A CN 117367311A CN 202210765497 A CN202210765497 A CN 202210765497A CN 117367311 A CN117367311 A CN 117367311A
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China
Prior art keywords
probe
reading
coordinates
upper probe
alignment
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CN202210765497.0A
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Chinese (zh)
Inventor
陈鲁
钟骏汶
刘欢敏
贺金龙
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Shenzhen Zhongke Feice Technology Co Ltd
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Shenzhen Zhongke Feice Technology Co Ltd
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Priority to CN202210765497.0A priority Critical patent/CN117367311A/en
Publication of CN117367311A publication Critical patent/CN117367311A/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The invention provides an object surface contour acquisition method, which comprises the following steps: placing a standard part with a preset first thickness into a detection area between an upper probe and a lower probe, and determining the distance between the upper probe and the lower probe; the optical axes of the upper probe and the lower probe are coincident and the light emitting directions are opposite; placing an object to be detected in the detection area, and respectively sampling the upper surface and the lower surface of the object to be detected by the upper probe and the lower probe to obtain a group of upper sampling points and lower sampling points; and determining coordinates of the up-sampling point and the down-sampling point according to the coordinates of the up-probe or the down-probe, the second up-probe reading and the second down-probe reading and the distances between the up-probe and the down-probe for a group of up-sampling point and down-sampling point. The object surface contour acquisition method has the advantages of higher detection speed and higher precision.

Description

Object surface contour acquisition method and device
Technical Field
The invention relates to the field of detection, in particular to a method and a device for acquiring the surface profile of an object.
Background
The white light confocal sensor (or called a white light confocal probe) has wide application in the manufacturing detection field of various intelligent terminals such as mobile phones, watches, flat panel and other products, and the white light confocal sensor can be used for obtaining the information of the three-dimensional shape of the panel surface, the panel thickness and the like. The relevant dimensions of the panel are inspected during the panel manufacturing process to measure whether the subsequent assembly requirements are met. The manufacturers require the detection equipment to have the characteristics of high detection speed, accurate detection result, easy observation and comparison of detection data and the like.
In the conventional technology, a single white light confocal sensor is generally adopted to scan the surface height fluctuation of the detected object, so that the coordinates of a plurality of sampling points on the surface of the detected object are sampled and acquired, on one hand, the detection speed is slower, and on the other hand, the correlation between the obtained detection data is weaker.
Disclosure of Invention
In order to solve the above problems, the present invention provides a method for collecting a surface profile of an object, including:
placing a standard part with a preset first thickness in a detection area between an upper probe and a lower probe, acquiring a first upper probe reading of the upper probe and a first lower probe reading of the lower probe, and determining the distance between the upper probe and the lower probe according to the first thickness, the first upper probe reading and the first lower probe reading; the optical axes of the upper probe and the lower probe are coincident and the light emitting directions are opposite;
placing an object to be detected in the detection area, and respectively sampling the upper surface and the lower surface of the object to be detected by the upper probe and the lower probe to obtain a group of upper sampling points and lower sampling points;
for a group of up-sampling points and down-sampling points, acquiring coordinates of the upper probe and a second upper probe reading and coordinates of the lower probe and a second lower probe reading;
and determining coordinates of the up-sampling point and the down-sampling point according to the coordinates of the upper probe or the lower probe, the second upper probe reading and the second lower probe reading and the distance between the upper probe and the lower probe.
In one embodiment, the determining the coordinates of the up-sampling point and the down-sampling point based on the coordinates of the up-probe or the down-probe, the second up-probe reading and the second down-probe reading, and the distance of the up-probe and the down-probe comprises:
determining coordinates of the up-sampling point according to the coordinates of the upper probe and the second upper probe reading;
and determining the point cloud coordinates of the down-sampling point according to the coordinates of the upper probe, the second down-probe reading and the distance between the upper probe and the lower probe.
In one embodiment, before the standard component with the preset first thickness is placed in the detection area between the upper probe and the lower probe, the method further comprises:
the upper and lower probes are aligned.
In one embodiment, the aligning the upper and lower probes comprises:
and when the signal spectrums acquired by the upper probe and the lower probe are extreme values, determining that the upper probe and the lower probe are aligned.
In one embodiment, the aligning the upper and lower probes comprises:
an alignment standard part is arranged in the detection interval of the upper probe and the lower probe, and alignment marks for alignment are arranged on the upper surface and the lower surface of the alignment standard part;
the upper probe and the lower probe are each moved to the alignment mark to determine alignment of the upper probe and the lower probe.
In one embodiment, the aligning the upper and lower probes further comprises, prior to:
the upper probe and the lower probe are adjusted so that their optical axes are perpendicular to the detection plane.
In one embodiment, said adjusting the upper and lower probes such that their optical axes are perpendicular to the detection plane comprises:
placing a vertical calibration member in a detection area between the upper probe and the lower probe, wherein the upper surface and the lower surface of the vertical calibration member are parallel to a detection plane;
and adjusting the inclination angles of the upper probe and the lower probe, and confirming that the upper probe and the lower probe are in a vertical state when signal spectrums of the upper probe and the lower probe are extreme values.
In order to solve the above problems, the present invention further provides an object surface profile acquisition device, which is characterized by comprising:
the probe distance detection module is used for placing a standard component with a preset first thickness into a detection area between an upper probe and a lower probe, acquiring a first upper probe reading of the upper probe and a first lower probe reading of the lower probe, and determining the distance between the upper probe and the lower probe according to the first thickness, the first upper probe reading and the first lower probe reading; the optical axes of the upper probe and the lower probe are coincident and the light emitting directions are opposite;
the scanning module is used for placing an object to be detected in the detection area, and the upper probe and the lower probe are used for respectively sampling the upper surface and the lower surface of the object to be detected to obtain a group of upper sampling points and lower sampling points;
the reading acquisition module is used for acquiring the coordinates of the upper probe and the second upper probe reading and the coordinates of the lower probe and the second lower probe reading for a group of upper sampling points and lower sampling points;
and the coordinate conversion module is used for determining the coordinates of the up-sampling point and the down-sampling point according to the coordinates of the upper probe or the lower probe, the second upper probe reading and the second lower probe reading and the distance between the upper probe and the lower probe.
In one embodiment, the coordinate scaling module is configured to determine coordinates of the upsampling point based on coordinates of the upsampling point and the second upsampling point reading; and determining the point cloud coordinates of the down-sampling point according to the coordinates of the upper probe, the second down-probe reading and the distance between the upper probe and the lower probe.
In one embodiment, a probe alignment module is also included for aligning the upper and lower probes.
In one embodiment, the probe alignment module is further configured to determine that the upper probe and the lower probe are aligned when the upper probe and/or the lower probe are moved circumferentially or spirally in a detection plane, and when signal spectra acquired by the upper probe and the lower probe are both extreme values.
In one embodiment, the probe alignment module is further used for embedding an alignment standard part in the detection intervals of the upper probe and the lower probe, and alignment marks for alignment are arranged on the upper surface and the lower surface of the alignment standard part; the upper probe and the lower probe are each moved to the alignment mark to determine alignment of the upper probe and the lower probe.
In one embodiment, the probe adjusting device further comprises a probe adjusting vertical module for adjusting the upper probe and the lower probe so that the optical axes of the upper probe and the lower probe are vertical to the detection plane.
In one embodiment, the probe adjustment vertical module is further configured to place a vertical alignment member in the detection area between the upper probe and the lower probe, the upper and lower surfaces of the vertical alignment member being parallel to the detection plane; and adjusting the inclination angles of the upper probe and the lower probe, and confirming that the upper probe and the lower probe are in a vertical state when signal spectrums of the upper probe and the lower probe are extreme values.
Compared with the prior art, the object surface profile acquisition method and device have the following beneficial effects.
The object surface contour acquisition method and device adopt two white light confocal sensors with coincident light emitting optical axes and up-down alignment opposite to each other to scan the upper surface and the lower surface of the detected object at the same time, and the detection speed is faster than that of a single white light confocal sensor.
Meanwhile, as the detected object is arranged between the two white light confocal sensors through the clamp, the influence on the surface detection of the detected object is not influenced by the fluctuation of the traditional object bearing table.
In addition, because the two white light confocal sensors are overlapped in light-emitting optical axis and vertically aligned in opposite directions, when the coordinates of the sampling positions of the upper surface and the lower surface of the detected object are converted, only the coordinates of one white light confocal sensor and the readings of the two white light confocal sensors at the sampling positions are needed to be determined, the coordinate conversion is more convenient, errors are less prone to occur, and the accuracy is higher.
Drawings
FIG. 1 is a schematic diagram of a detection device of a correlation-based white light confocal sensor according to an embodiment of the present application;
FIG. 2 is a schematic diagram of the operation of a white light confocal sensor;
FIG. 3 is a flow chart of a method of object surface profile acquisition in one embodiment of the present application;
FIG. 4 is a schematic view of measuring the distance between an upper probe and a lower probe in one embodiment of the present application;
FIG. 5 is a schematic view of upper and lower probes scanning upper and lower surfaces of an object in one embodiment of the present application;
FIG. 6 is a schematic illustration of the upper and lower surfaces of an object at detection sampling locations (x 1, y 1) in one embodiment of the present application;
FIG. 7 is a schematic diagram of moving the upper and lower probes circumferentially in the XY plane to adjust alignment thereof in one embodiment of the present application;
FIG. 8 is a schematic diagram of an alignment standard using dimples as alignment marks in one embodiment of the present application;
FIG. 9 is a schematic diagram of an alignment standard using protrusions as alignment marks in one embodiment of the present application;
FIG. 10 is a schematic diagram of an alignment standard using vias as alignment marks in one embodiment of the present application;
FIG. 11 is a schematic diagram of a vertical process for adjusting the probe head-to-probe head using vertical standards in one embodiment of the application;
FIG. 12 is a schematic view of an object surface contour acquisition device according to one embodiment of the present application;
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
It should be noted that, in the embodiment of the present application, directional indications (such as up, down, left, right, front, and rear … …) are referred to, and the directional indications are merely used to explain the relative positional relationship, movement conditions, and the like between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present application, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be regarded as not exist and not within the protection scope of the present application.
The invention provides an object surface contour acquisition method, which is based on a detection device adopting a oppositely arranged white light confocal probe (or called a white light confocal sensor), and is shown by referring to fig. 1, a horizontal plane is taken as an XY plane, a direction vertical to the XY plane is taken as a Z axis, the contour detection device comprises a bracket, an upper white light confocal probe Lu and a lower white light confocal probe Ld with a certain height difference on the Z axis are arranged on the bracket, the upper white light confocal probe Lu emits detection white light with an optical axis vertical to the XY plane downwards, and the lower white light confocal probe Ld emits detection white light with an optical axis vertical to the XY plane upwards.
The bracket is also provided with a probe transmission part of an upper white light confocal probe (hereinafter referred to as an upper probe) and a lower white light confocal probe (hereinafter referred to as a lower probe), and the probe transmission part can control the upper white light confocal probe and the lower white light confocal probe to move in X, Y and Z directions. The bracket is also provided with a clamp and a clamp transmission part, the clamp can clamp the detected object, such as a glass panel, a wafer and the like, and the clamp transmission part can control the clamp to carry the detected object to translate in an XY plane.
A white light confocal probe can be used to detect the distance of the probe from the surface of the object to be detected, the principle of which can be seen with reference to fig. 2, using a polychromatic light source (e.g. white light) to illuminate the surface of the object to be detected. Because of the different wavelengths of the spectral light waves in the polychromatic light source, the light will be focused at different distances, only light of a very narrow wavelength range will be focused on the surface to be measured, and the remaining light will be concentrated in a larger area around this focus. By determining the wavelength of the focused light and reflecting it back to the optical system, accurate distance-to-surface measurement can be performed at nanometer resolution.
The object surface contour acquisition method of the present application is shown in fig. 3, and includes:
step S102: placing a standard component S1 with a preset first thickness in a detection area between an upper probe and a lower probe, acquiring a first upper probe reading of the upper probe and a first lower probe reading of the lower probe, and determining the distance between the upper probe and the lower probe according to the first thickness, the first upper probe reading and the first lower probe reading; the optical axes of the upper probe and the lower probe are coincident and the light emitting directions are opposite.
Referring to fig. 4, in the XYZ coordinate system, the optical axes of the upper probe Lu and the lower probe Ld are overlapped and the light emission directions are opposite. As can be seen from the above description of the working principle of the white light confocal probe, the distance detection accuracy of the white light confocal probe has a range requirement of a certain measurement distance, that is, the accuracy of the white light confocal probe is between specific spectrums, and in order to adapt to the detected objects with different thicknesses, the upper probe Lu or the lower probe Ld needs to be moved on the Z axis by the probe transmission member, so that the distances from the upper probe Lu and the lower probe Ld to the upper surface and the lower surface of the detected object are within the respective accuracy ranges.
Therefore, the distance Ds between the upper probe Lu and the lower probe Ld needs to be determined before the surface profile of the object to be detected is acquired. After the standard S1 of the first thickness t is predicted by the jig, and is horizontally moved by the jig in the XY plane between the upper probe Lu and the lower probe Ld, the upper probe Lu will take its reading d1 to the upper surface of the standard S1, and the lower probe Ld will take its reading d2 to the upper surface of the standard d, d1 and d2 all within a preset accuracy range.
Referring to fig. 4, the distance Ds between the upper probe Lu and the lower probe Ld is:
Ds=d1+t+d2
after confirming the distance Ds between the upper probe Lu and the lower probe Ld using the standard of the first thickness, the relative distance Ds between the upper probe Lu and the lower probe Ld can be locked on the Z axis, and then the object to be detected is moved to the detection area between the upper probe Lu and the lower probe Ld by the jig. And a coordinate system including the upper probe, the lower probe and the object to be detected is established.
Step S104: and placing an object to be detected in the detection area, and respectively sampling the upper surface and the lower surface of the object to be detected by the upper probe and the lower probe to obtain a group of upper sampling points and lower sampling points.
Referring to fig. 5, the object O is a flat plate-like object, which is held by a jig, and then horizontally moved in the XY plane into a detection area between the upper probe Lu and the lower probe Ld. During the movement of the object to be inspected O, the readings of the upper probe Lu and the lower probe Ld continuously vary with the change of the surface profile of the object to be inspected O. The readings of the upper probe Lu and the lower probe Ld can be periodically read for sampling, and each group of sampling points is the upper probe reading and the upper probe reading corresponding to one XY coordinate position on the XY plane. And (3) obtaining the upper probe reading and the upper probe reading corresponding to each of the plurality of XY coordinate positions by moving the detected object O. The specific XY coordinate position can be determined by the relative position of the moving jig and the upper probe Lu or the lower probe Ld on the XY plane.
In other embodiments, the object to be detected may be placed in the detection area, and then the probe driving member controls the upper probe Lu and the lower probe Ld to move relative to the object to be detected so as to sample and obtain the upper probe readings and the upper probe readings of a plurality of XY plane coordinate points. However, this method requires keeping the upper probe Lu and the lower probe Ld in alignment during the movement, and is relatively more preferable for the control accuracy, in which the upper probe Lu and the lower probe Ld are fixed and the object to be detected is moved by the jig to sample.
Step S106: and for a group of up-sampling points and down-sampling points, acquiring coordinates of the upper probe and a second upper probe reading and coordinates of the lower probe and a second lower probe reading.
Step S108: and determining coordinates of the up-sampling point and the down-sampling point according to the coordinates of the upper probe or the lower probe, the second upper probe reading and the second lower probe reading and the distance between the upper probe and the lower probe.
Specifically, determining the coordinates of the up-sampling point and the down-sampling point according to the coordinates of the up-probe or the down-probe, the second up-probe reading and the second down-probe reading, and the distance between the up-probe and the down-probe includes:
determining coordinates of the up-sampling point according to the coordinates of the upper probe and the second upper probe reading;
and determining the coordinates of the downsampling point according to the coordinates of the lower probe, the second lower probe reading and the distance between the upper probe and the lower probe.
The detection device may fix one of the upper probe Lu or the lower probe Ld to establish an XYZ coordinate system. Referring to fig. 6, the Z-axis coordinate of the upper probe Lu is fixed to Z0. For the sampling position (x 1, y 1) of the XY plane, if the reading of the upper probe Lu at this point is d1u and the reading of the lower probe Ld at this point is d1d, the coordinate P1u of the upper surface of the object to be detected at the sampling position (x 1, y 1) is:
P1u=(x1,y1,z0-d1u)
the coordinates P1d of the lower surface of the detected object at the sampling position (x 1, y 1) are:
P1d=(x1,y1,z0-Ds+d1d)=(x1,y1,z0-d1-t-d2+d1d)
similarly, when the sample is sampled to the sampling position (x 2, y 2) of the XY plane, the coordinate P2u of the upper surface of the detected object is:
P2u=(x2,y2,z0-d1u)
the coordinates P2d of the lower surface of the detected object at the sampling position (x 2, y 2) are:
P2d=(x2,y2,z0-Ds+d2d)=(x2,y2,z0-d1-t-d2+d2d)
in this way, by sampling the collected P1u, P1d, P2u, P2d … Pnu, pnd, the point cloud coordinates of the outer surface of the object to be detected can be sampled and obtained, so that the contour of the outer surface of the object to be detected is collected.
Further, in the present embodiment, before determining the distance between the upper probe Lu and the lower probe Ld by the standard, it further includes: the upper probe Lu and the lower probe Ld are aligned. Two ways can be used:
mode one:
the upper probe Lu and/or the lower probe Ld are/is moved circumferentially or spirally on the detection plane (i.e., XY plane), and when the signal spectra collected by the upper probe Lu and the lower probe Ld are both extreme, the alignment of the upper probe Lu and the lower probe Ld is determined.
Referring to fig. 7, the upper probe Lu can be moved in a clockwise circular motion with R1 as a radius on the XY plane, and the upper probe Lu is moved in a counterclockwise motion with R2 as a radius on the XY plane, when the moving tracks of the two are intersected, the upper probe Lu and the lower probe Ld means that the upper probe Lu and the lower probe Ld are aligned, and at this time, the signal spectrums collected by the upper probe Lu and the lower probe Ld are necessarily both extrema.
Further, in consideration of the inertial effects, after confirming that the signal spectra collected by the upper probe Lu and the lower probe Ld are extreme values, the upper probe Lu and the lower probe Ld can be controlled to be respectively reversed, the rotation speed is reduced, and the signal spectra collected by the upper probe Lu and the lower probe Ld are again brought to the extreme values again, that is, the trajectories of the upper probe Lu and the lower probe Ld are again intersected after being respectively reversed. This ensures that the upper probe Lu and the lower probe Ld are aligned up and down even if they are affected by inertia.
Similarly, the upper probe Lu and the lower probe Ld can be controlled to gradually slow down the rotation speed and reverse for a plurality of times, so that the final stopped position is the alignment position of the upper probe Lu and the lower probe Ld, thereby further improving the alignment precision.
Mode two:
an alignment standard component S2 is arranged in the detection interval of the upper probe Lu and the lower probe Ld, alignment marks for alignment are arranged on the upper surface and the lower surface of the alignment standard component S2, and the upper probe Lu and the lower probe Ld are respectively moved to the positions of the alignment marks, so that the alignment of the upper probe Lu and the lower probe Ld can be realized. The alignment marks may be pits, bumps, through holes, specular reflectors, etc.
For example, referring to FIG. 8, where the alignment mark is a dimple, moving the upper probe Lu to the dimple of the upper surface reads significantly more than the other locations, confirming that the upper probe Lu has reached the dimple location of the upper surface. In the same manner, it is also possible to confirm that the lower probe Ld has reached the pit position of the lower surface, and since the pit position of the upper surface and the pit position of the lower surface are pre-set aligned, it is possible to confirm that the upper probe Lu and the lower probe Ld are aligned.
For example, referring to fig. 9, if the alignment mark is a bump, when the upper probe Lu is moved to the bump on the upper surface, the reading is significantly lower than the other positions, and it is confirmed that the upper probe Lu has reached the bump position on the upper surface. In the same manner, it is also possible to confirm that the lower probe Ld has reached the convex position of the lower surface, and since the convex position of the upper surface and the convex position of the lower surface are preliminarily aligned, it is possible to confirm that the upper probe Lu and the lower probe Ld are aligned.
For another example, referring to fig. 10, if the alignment mark is a through hole, when the upper probe Lu is moved to the opening of the upper surface of the through hole, the signal and the reading are significantly abnormal to other positions, and it is confirmed that the upper probe Lu has reached the mark position of the upper surface. In the same manner, it is also possible to confirm that the lower probe Ld has reached the marking position of the lower surface, and that the upper probe Lu and the lower probe Ld are aligned because the through holes penetrate the upper surface and the lower surface to be aligned in advance.
For another example, the alignment mark may be a specular reflector, and when the upper probe Lu is moved to the specular reflector on the upper surface of the through hole, the signal and the reading are significantly abnormal to other positions, so that it is confirmed that the upper probe Lu has reached the specular reflector on the upper surface. In the same manner, it can also be confirmed that the lower probe Ld has reached the specular reflection member position of the lower surface, and since the specular reflection member position of the upper surface and the specular reflection member position of the lower surface are in the preset alignment, it can be confirmed that the upper probe Lu and the lower probe Ld are aligned.
Further, before adjusting the upper probe Lu and the lower probe Ld to be aligned, it is also necessary to adjust the upper probe Lu and the lower probe Ld vertically to ensure that the optical axes thereof are perpendicular to the detection plane, that is, the XY plane described above.
Specifically, a vertical calibration piece S3, the upper and lower surfaces of which are parallel to the detection plane, may be placed in the detection area between the upper probe Lu and the lower probe Ld, the inclination angles of the upper probe Lu and the lower probe Ld are adjusted, and when the signal spectrums of the upper probe Lu and the lower probe Ld are both extreme values, the upper probe Lu and the lower probe Ld are confirmed to be in a vertical state.
Referring to fig. 11, the outgoing direction of the upper probe Lu can be sequentially rotated in the X-axis direction and the Y-axis direction, and the more vertical the upper probe Lu is, the stronger the optical signal reflected by the vertical calibration piece S3 enters the upper probe Lu; the spectrum of the signal received by the upper probe Lu is monotonously increased as the vertical state of the upper probe Lu approaches. Preferably, in order to avoid inertia influence in the control process, the signal spectrum received by the upper probe Lu can slowly swing back after reaching an extreme value, or swing back for a plurality of times, so that the calibration precision is improved.
Preferably, the upper and lower surfaces of the vertical calibration member S3 may be set to be mirror surfaces, which have greater reflection intensity for the upper probe Lu and the lower probe Ld in the vertical state, and have more obvious extremum effect on the signal spectrum received by the upper probe Lu and the lower probe Ld, so that the vertical adjustment is more convenient.
The invention also provides an object surface profile acquisition device, as shown in fig. 12, which comprises:
the probe distance detection module 102 is configured to place a standard component with a preset first thickness in a detection area between an upper probe and a lower probe, obtain a first upper probe reading of the upper probe and a first lower probe reading of the lower probe, and determine a distance between the upper probe and the lower probe according to the first thickness, the first upper probe reading and the first lower probe reading; the optical axes of the upper probe and the lower probe are coincident and the light emitting directions are opposite.
And the scanning module 104 is configured to place an object to be detected in the detection area, and the upper probe and the lower probe sample the upper surface and the lower surface of the object to be detected respectively, so as to obtain a set of up-sampling points and down-sampling points.
And the reading acquisition module 106 is used for acquiring the coordinates of the upper probe and the second upper probe reading and the coordinates of the lower probe and the second lower probe reading for a group of upper sampling points and lower sampling points.
And the coordinate conversion module 108 is configured to determine coordinates of the up-sampling point and the down-sampling point according to the coordinates of the up-probe or the down-probe, the second up-probe reading and the second down-probe reading, and the distance between the up-probe and the down-probe.
In one embodiment, the coordinate scaling module 108 is configured to determine the coordinates of the upsampled point based on the coordinates of the upsampled probe and the second upsampled probe reading; and determining the point cloud coordinates of the down-sampling point according to the coordinates of the upper probe, the second down-probe reading and the distance between the upper probe and the lower probe.
In one embodiment, the object surface profile acquisition device further comprises a probe alignment module 110 for aligning the upper and lower probes.
In one embodiment, the probe alignment module 110 is further configured to determine the alignment of the upper probe and the lower probe when the upper probe and/or the lower probe are moved circumferentially or spirally in the detection plane and when the signal spectra acquired by the upper probe and the lower probe are both extreme values.
In one embodiment, the probe alignment module 110 is further configured to embed an alignment standard in the detection intervals of the upper probe and the lower probe, and alignment marks of alignment are disposed on the upper surface and the lower surface of the alignment standard; the upper probe and the lower probe are each moved to the alignment mark to determine alignment of the upper probe and the lower probe.
In one embodiment, the probe adjustment vertical module 112 is further included for adjusting the upper probe and the lower probe so that the optical axes thereof are vertical to the detection plane.
In one embodiment, the probe adjustment vertical module 112 is further configured to place a vertical alignment member in the detection area between the upper probe and the lower probe, the upper and lower surfaces of the vertical alignment member being parallel to the detection plane; and adjusting the inclination angles of the upper probe and the lower probe, and confirming that the upper probe and the lower probe are in a vertical state when signal spectrums of the upper probe and the lower probe are extreme values.
Compared with the prior art, the object surface profile acquisition method and device have the following beneficial effects.
The object surface contour acquisition method and device adopt two white light confocal sensors with coincident light emitting optical axes and up-down alignment opposite to each other to scan the upper surface and the lower surface of the detected object at the same time, and the detection speed is faster than that of a single white light confocal sensor.
Meanwhile, as the detected object is arranged between the two white light confocal sensors through the clamp, the influence on the surface detection of the detected object is not influenced by the fluctuation of the traditional object bearing table.
In addition, because the two white light confocal sensors are overlapped in light-emitting optical axis and vertically aligned in opposite directions, when the coordinates of the sampling positions of the upper surface and the lower surface of the detected object are converted, only the coordinates of one white light confocal sensor and the readings of the two white light confocal sensors at the sampling positions are needed to be determined, the coordinate conversion is more convenient, errors are less prone to occur, and the accuracy is higher.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The foregoing description is only of embodiments of the present invention, and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.

Claims (14)

1. An object surface contour acquisition method, comprising:
placing a standard part with a preset first thickness in a detection area between an upper probe and a lower probe, acquiring a first upper probe reading of the upper probe and a first lower probe reading of the lower probe, and determining the distance between the upper probe and the lower probe according to the first thickness, the first upper probe reading and the first lower probe reading; the optical axes of the upper probe and the lower probe are coincident and the light emitting directions are opposite;
placing an object to be detected in the detection area, and respectively sampling the upper surface and the lower surface of the object to be detected by the upper probe and the lower probe to obtain a group of upper sampling points and lower sampling points;
for a group of up-sampling points and down-sampling points, acquiring coordinates of the upper probe and a second upper probe reading and coordinates of the lower probe and a second lower probe reading;
and determining coordinates of the up-sampling point and the down-sampling point according to the coordinates of the upper probe or the lower probe, the second upper probe reading and the second lower probe reading and the distance between the upper probe and the lower probe.
2. The object surface contour collection method as defined in claim 1, wherein said determining coordinates of said up-sampling point and down-sampling point based on coordinates of said up-probe or down-probe, said second up-probe reading and said second down-probe reading, and distances of said up-probe and down-probe comprises:
determining coordinates of the up-sampling point according to the coordinates of the upper probe and the second upper probe reading;
and determining the coordinates of the down-sampling point according to the coordinates of the upper probe, the second down-probe reading and the distance between the upper probe and the lower probe.
3. The method of claim 1, wherein before placing the standard piece of the preset first thickness in the detection area between the upper probe and the lower probe, further comprises:
the upper and lower probes are aligned.
4. A method of object surface contour acquisition as defined in claim 3, wherein said aligning said upper and lower probes comprises:
and when the signal spectrums acquired by the upper probe and the lower probe are extreme values, determining that the upper probe and the lower probe are aligned.
5. A method of object surface contour acquisition as defined in claim 3, wherein said aligning said upper and lower probes comprises:
an alignment standard part is arranged in the detection interval of the upper probe and the lower probe, and alignment marks for alignment are arranged on the upper surface and the lower surface of the alignment standard part;
the upper probe and the lower probe are each moved to the alignment mark to determine alignment of the upper probe and the lower probe.
6. The object surface contour collection method as defined in claim 3, further comprising, prior to said aligning said upper and lower probes:
the upper probe and the lower probe are adjusted so that their optical axes are perpendicular to the detection plane.
7. The method of claim 6, wherein adjusting the upper probe and the lower probe such that their optical axes are perpendicular to the detection plane comprises:
placing a vertical calibration member in a detection area between the upper probe and the lower probe, wherein the upper surface and the lower surface of the vertical calibration member are parallel to a detection plane;
and adjusting the inclination angles of the upper probe and the lower probe, and confirming that the upper probe and the lower probe are in a vertical state when signal spectrums of the upper probe and the lower probe are extreme values.
8. An object surface contour acquisition device, comprising:
the probe distance detection module is used for placing a standard component with a preset first thickness into a detection area between an upper probe and a lower probe, acquiring a first upper probe reading of the upper probe and a first lower probe reading of the lower probe, and determining the distance between the upper probe and the lower probe according to the first thickness, the first upper probe reading and the first lower probe reading; the optical axes of the upper probe and the lower probe are coincident and the light emitting directions are opposite;
the scanning module is used for placing an object to be detected in the detection area, and the upper probe and the lower probe are used for respectively sampling the upper surface and the lower surface of the object to be detected to obtain a group of upper sampling points and lower sampling points;
the reading acquisition module is used for acquiring the coordinates of the upper probe and the second upper probe reading and the coordinates of the lower probe and the second lower probe reading for a group of upper sampling points and lower sampling points;
and the coordinate conversion module is used for determining the coordinates of the up-sampling point and the down-sampling point according to the coordinates of the upper probe or the lower probe, the second upper probe reading and the second lower probe reading and the distance between the upper probe and the lower probe.
9. The object surface contour collection device of claim 8, wherein the coordinate scaling module is configured to determine coordinates of the upsampling point based on coordinates of the upsampling point and the second upsampling point reading; and determining the point cloud coordinates of the down-sampling point according to the coordinates of the upper probe, the second down-probe reading and the distance between the upper probe and the lower probe.
10. The object surface contour collection apparatus of claim 8, further comprising a probe alignment module for aligning the upper probe and the lower probe.
11. The object surface contour collection device of claim 10, wherein said probe alignment module is further configured to determine alignment of said upper probe and said lower probe when signal spectra collected by said upper probe and said lower probe are both extrema when said upper probe and said lower probe are moved circumferentially or helically about a detection plane.
12. The object surface contour collection device according to claim 10, wherein the probe alignment module is further configured to embed an alignment standard in a detection zone of the upper probe and the lower probe, and alignment marks are disposed on upper and lower surfaces of the alignment standard; the upper probe and the lower probe are each moved to the alignment mark to determine alignment of the upper probe and the lower probe.
13. The object surface profile acquisition device of claim 10, further comprising a probe adjustment vertical module for adjusting the upper probe and the lower probe such that their optical axes are perpendicular to the detection plane.
14. The object surface profile acquisition device of claim 13, wherein the probe adjustment vertical module is further configured to place a vertical alignment member in the detection zone between the upper probe and the lower probe, the upper and lower surfaces of the vertical alignment member being parallel to the detection plane; and adjusting the inclination angles of the upper probe and the lower probe, and confirming that the upper probe and the lower probe are in a vertical state when signal spectrums of the upper probe and the lower probe are extreme values.
CN202210765497.0A 2022-07-01 2022-07-01 Object surface contour acquisition method and device Pending CN117367311A (en)

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CN202210765497.0A CN117367311A (en) 2022-07-01 2022-07-01 Object surface contour acquisition method and device

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