CN117177470A - Manufacturing method of slotted circuit board and circuit board - Google Patents
Manufacturing method of slotted circuit board and circuit board Download PDFInfo
- Publication number
- CN117177470A CN117177470A CN202210593343.8A CN202210593343A CN117177470A CN 117177470 A CN117177470 A CN 117177470A CN 202210593343 A CN202210593343 A CN 202210593343A CN 117177470 A CN117177470 A CN 117177470A
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- Prior art keywords
- circuit board
- circuit
- adhesive tape
- semi
- processed
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 41
- 239000002390 adhesive tape Substances 0.000 claims abstract description 135
- 238000000034 method Methods 0.000 claims abstract description 57
- 238000003825 pressing Methods 0.000 claims abstract description 32
- 238000004080 punching Methods 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 53
- 239000010949 copper Substances 0.000 claims description 52
- 229910052802 copper Inorganic materials 0.000 claims description 52
- 239000000084 colloidal system Substances 0.000 claims description 41
- 239000000126 substance Substances 0.000 claims description 13
- 239000003814 drug Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 8
- 238000003801 milling Methods 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 114
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The application discloses a manufacturing method of a slotted circuit board and the circuit board, wherein the manufacturing method of the slotted circuit board comprises the following steps: providing a semi-processed circuit board; the surface of the semi-processed circuit board is provided with a circuit bonding pad; sticking adhesive tapes on the surface of the circuit bonding pad of the semi-processed circuit board so as to protect the circuit bonding pad on the surface of the semi-processed circuit board; pressing the semi-processed circuit board to form a pressed circuit board, and covering the surface of the adhesive tape, which is far away from the semi-processed circuit board, with an outer layer; punching holes on the position of the pressing circuit board corresponding to the adhesive tape so as to expose the adhesive tape; and removing the adhesive tape of the pressed circuit board and the outer layer on the surface of the adhesive tape, and exposing the circuit pad to obtain the slotted circuit board. By the method, the circuit bonding pads are formed at the bottom of the grooved circuit board, so that the diversity of circuit board welding components is improved.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a manufacturing method of a slotted circuit board and the circuit board.
Background
The circuit board is also called a PCB, is a provider for electric connection of electronic devices, and can be divided into a single-layer board, a double-layer board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the layer number of the circuit board.
At present, when a PCB is attached, components are generally attached to the surface of the PCB, along with the development of the PCB, the components are attached to the PCB more and more complex and more in number, and the occupied space is required to be smaller after the PCB is attached. The integrated chip is required, and the requirements on the PCB are also higher and higher. Digging a step groove on a PCB for embedding components is one of the development directions.
The step bottom after the PCB board fluting is general only insulating layer or copper sheet layer, can't carry out complicated welding action at the step bottom and connect the copper wire network in the PCB board, has restricted the variety of bottom welding components and parts behind the PCB board fluting.
Disclosure of Invention
The application mainly solves the technical problem of providing a manufacturing method of a slotted circuit board and the circuit board, wherein a circuit bonding pad is formed at the bottom of the slotted circuit board, so that the diversity of welding components of the circuit board is improved.
The application provides a manufacturing method of a slotted circuit board, wherein the manufacturing method of the slotted circuit board comprises the following steps: providing a semi-processed circuit board; the surface of the semi-processed circuit board is provided with a circuit bonding pad; sticking adhesive tapes on the surface of the circuit bonding pad of the semi-processed circuit board so as to protect the circuit bonding pad on the surface of the semi-processed circuit board; pressing the semi-processed circuit board to form a pressed circuit board, and covering the surface of the adhesive tape, which is far away from the semi-processed circuit board, with an outer layer; punching holes on the position of the pressing circuit board corresponding to the adhesive tape so as to expose the adhesive tape; and removing the adhesive tape of the pressed circuit board and the outer layer on the surface of the adhesive tape, and exposing the circuit pad to obtain the slotted circuit board.
The step of sticking the adhesive tape on the surface of the semi-processed circuit board, on which the circuit pad is arranged, so as to protect the circuit pad on the surface of the semi-processed circuit board comprises the following steps: filling the circuit bonding pad with colloid, and enabling the colloid to cover the surface of the circuit bonding pad; and covering the surface of the colloid by using the adhesive tape to protect the colloid.
The step of removing the adhesive tape of the laminated circuit board and the outer layer on the surface of the adhesive tape to expose the circuit pad to obtain the slotted circuit board comprises the following steps: removing the adhesive tape of the pressed circuit board and the outer layer on the surface of the adhesive tape to expose the colloid; and removing the colloid by using chemical liquid medicine to expose the circuit bonding pad.
Wherein, the step of laminating the half-processed circuit board to form a laminated circuit board, and covering the surface of the adhesive tape far away from the half-processed circuit board with an outer layer comprises the following steps: laminating a dielectric layer on the surface of the semi-processed circuit board; manufacturing a circuit copper layer on the surface of the dielectric layer to form the laminated circuit board; wherein, the pressfitting circuit board surface is provided with circuit copper layer.
The laminated circuit board comprises a plurality of dielectric layers and a circuit copper layer which are overlapped.
The step of removing the adhesive tape of the laminated circuit board and the outer layer on the surface of the adhesive tape to expose the circuit pad to obtain the slotted circuit board further comprises the following steps: cutting along the edge of the adhesive tape by using a slot milling process to expose the edge of the adhesive tape; and uncovering the hole along the edge of the adhesive tape to remove the adhesive tape of the pressed circuit board and the outer layer on the surface of the adhesive tape, so as to expose the circuit bonding pad.
Wherein, the step of punching holes at the position of the pressing circuit board corresponding to the adhesive tape to expose the adhesive tape comprises the following steps: and drilling holes on the position of the pressing circuit board corresponding to the adhesive tape by using a depth control process until the adhesive tape is exposed.
The depth control process comprises mechanical depth control and laser depth control.
Wherein, the step of punching holes at the position of the pressing circuit board corresponding to the adhesive tape to expose the adhesive tape, further comprises: and manufacturing a gap at the position of the pressing circuit board corresponding to the adhesive tape so as to expose the adhesive tape.
The application further provides a circuit board, wherein the circuit board is provided with a groove, and the bottom of the groove is provided with a circuit bonding pad.
The beneficial effects of the application are as follows: the circuit board is formed by laminating the semi-processed circuit board, wherein the surface of the semi-processed circuit board is covered with an outer layer, and finally the outer layer on the surface of the adhesive tape and the adhesive tape is removed by the adhesive tape, so that a grooved circuit board is formed, the circuit pad is arranged at the bottom of the grooved circuit board, and the diversity of welding components at the bottom of the groove of the circuit board is increased.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic flow chart of a first embodiment of a method for manufacturing a slotted circuit board of the present application;
FIG. 2 is a schematic flow chart of a second embodiment of a method for manufacturing a slotted circuit board according to the present application;
FIG. 3 is a schematic flow chart of a third embodiment of a method for manufacturing a slotted circuit board according to the present application;
fig. 4a is a schematic cross-sectional structure of a first embodiment of the circuit board of the present application;
fig. 4b is a schematic top view of a first embodiment of the circuit board of the present application.
Detailed Description
The following describes embodiments of the present application in detail with reference to the drawings.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, interfaces, techniques, etc., in order to provide a thorough understanding of the present application.
The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" generally includes at least two, but does not exclude the case of at least one.
It should be understood that the term "and/or" as used herein is merely one relationship describing the association of the associated objects, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
It should be understood that the terms "comprises," "comprising," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present application, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
Referring to fig. 1, fig. 1 is a schematic flow chart of a first embodiment of a method for manufacturing a slotted circuit board according to the present application, as shown in fig. 1, the method for manufacturing a slotted circuit board includes:
step S11: a semi-finished circuit board is provided.
The half-processed circuit board is half-processed and unprocessed intermediate circuit board. A circuit pad is arranged on one side surface of the semi-processed circuit board. In other embodiments, wire pads may also be provided on opposite side surfaces of the semi-finished circuit board. The semi-processed circuit board comprises a plurality of circuit copper layers.
The method specifically comprises the following steps: providing a circuit board; and manufacturing a circuit copper layer on the surface of the circuit board so that the circuit copper layer forms a circuit bonding pad to obtain the semi-processed circuit board. The circuit copper layer is prepared through the processes of film pasting, developing, exposing and copper plating.
The circuit bonding pad refers to a circuit copper layer at the bottom of the groove and is a part of circuit copper layer arranged on the surface of the semi-processed circuit board. The circuit pads are in circuit connection with other circuit copper layers on the surface of the semi-processed circuit board so that the subsequently exposed circuit pads are connected with inner circuit pads of the circuit board. The wire bond pads may be arranged in a particular pattern of bond pads according to bonding requirements.
Step S12: and sticking an adhesive tape on the surface of the circuit pad of the semi-processed circuit board to protect the circuit pad on the surface of the semi-processed circuit board.
The adhesive tape has the characteristics of high temperature resistance and high pressure resistance, has chemical stability, and is not combined with the prepreg in the pressing process.
In another embodiment, if the circuit pads are provided on two opposite side surfaces of the semi-processed circuit board, the circuit pads of the two grooves are formed later by attaching adhesive tapes on the circuit pads on two sides, which is not limited herein.
Step S13: and pressing the semi-processed circuit board to form a pressed circuit board, and covering the surface of the adhesive tape far away from the semi-processed circuit board with an outer layer.
The method specifically comprises the following steps: and pressing the prepreg on the surface of the semi-processed circuit board to form a dielectric layer, manufacturing a circuit copper layer on the surface of the dielectric layer, pressing the dielectric layer on the surface of the circuit copper layer, and manufacturing the circuit copper layer on the surface of the dielectric layer to obtain a pressed circuit board with a preset number of circuit copper layers or a pressed circuit board with a preset thickness.
The thickness of the laminated circuit board is larger than that of the semi-processed circuit board, so that a step is formed after the laminated circuit board is grooved.
The thickness of the laminated circuit board can be designed according to actual requirements, and the number of circuit copper layers in the laminated circuit board can also be designed according to requirements.
The outer layer covered on the surface of the semi-processed circuit board comprises an outer layer formed by overlapping a plurality of dielectric layers and a circuit copper layer.
In this embodiment, the lamination circuit board includes electrically connected through holes, and the through holes are connected with circuit copper layers of different layers, wherein the through holes are arranged at positions avoiding the adhesive tape.
Step S14: and punching holes on the position of the pressing circuit board corresponding to the adhesive tape to expose the adhesive tape.
In one embodiment, holes are drilled vertically in the position of the press-fit circuit board corresponding to the adhesive tape until the adhesive tape is exposed. In another embodiment, a slit is formed at a position of the pressing circuit board corresponding to the adhesive tape to expose the adhesive tape. The holes are circular holes or square holes, and the slits are irregularly shaped, and the like, and are not limited herein.
Specifically, a depth control process is used to make holes at the positions of the pressing circuit board corresponding to the adhesive tapes so as to expose the adhesive tapes. The depth control process comprises mechanical depth control and UV laser depth control.
In another embodiment, the method further includes, after punching the hole at a position of the circuit board corresponding to the adhesive tape to expose the adhesive tape,: cutting along the edge position of the adhesive tape corresponding to the pressed circuit board by using a slot milling process to obtain a cutting profile; the tape is then torn along the cut profile with the hole as a base point to expose the wire bond pad.
Step S15: and removing the adhesive tape of the pressed circuit board and the outer layer on the surface of the adhesive tape to expose the circuit bonding pad, thereby obtaining the slotted circuit board.
The step includes milling a groove at the edge of the tape corresponding to the lamination circuit board by using a depth-control milling process so as to expose the edge of the tape. The method specifically comprises the steps of tearing off the adhesive tape for pressing the circuit board and the outer layer on the surface of the adhesive tape along the edge of the adhesive tape by utilizing holes to expose the circuit bonding pads, so as to obtain the slotted circuit board.
Wherein, the tank bottom of fluting circuit board is provided with the circuit pad.
The beneficial effects of this embodiment are: the circuit board is formed by laminating the semi-processed circuit board, wherein the surface of the semi-processed circuit board is covered with an outer layer, and finally the outer layer on the surface of the adhesive tape and the adhesive tape is removed by the adhesive tape, so that a grooved circuit board is formed, the circuit pad is arranged at the bottom of the grooved circuit board, and the diversity of welding components at the bottom of the groove of the circuit board is increased.
The application also provides a second method for manufacturing a slotted circuit board, referring to fig. 2, fig. 2 is a schematic flow chart of a second embodiment of the method for manufacturing a slotted circuit board of the application. As shown in fig. 2, the method for manufacturing the slotted circuit board includes:
step S21: a semi-finished circuit board is provided.
The semi-processed circuit board comprises a multi-layer circuit board.
Step S22: and manufacturing a circuit bonding pad on the surface of the semi-processed circuit board.
The method comprises the following steps: a circuit pad is provided on one side surface of the semi-processed circuit board. The circuit pads may also be provided on opposite side surfaces of the semi-finished circuit board, as not limited herein.
The circuit bonding pad is prepared through the processes of film pasting, developing, exposing and copper plating.
In this embodiment, the surface of the semi-finished circuit board is provided with an inner layer of circuit copper layer in addition to the circuit pads. Wherein the wire bonding pads can be arranged into bonding pads with specific patterns according to the bonding requirements.
Step S23: the line pads are filled with a gel and the gel is allowed to cover the surfaces of the line pads.
The colloid has the characteristics of high temperature resistance and high pressure resistance, has good filling performance, can be used for filling gaps of circuit bonding pads to form a flat surface, and is easy to remove by chemical liquid medicine. Most of colloid with good filling performance is easy to remove by chemical liquid medicine, so that the colloid is easy to react with the manufacturing liquid medicine in the process of manufacturing the laminated circuit board, and is difficult to remove in the process of laminating and combined with the prepreg. Thus, the adhesive tape is used to further protect the surface of the colloid.
In this embodiment, the colloid is used to cover the surface of the circuit pad and fill the gap of the circuit pad, so that the surface of the circuit pad is flat, and the flatness of the subsequently manufactured laminated circuit board is ensured.
Step S24: the surface of the colloid is covered by the adhesive tape to protect the colloid.
The adhesive tape has the characteristics of high temperature resistance and high pressure resistance, has chemical stability, and is not combined with the prepreg in the pressing process.
In another embodiment, if the circuit pads are provided on two opposite side surfaces of the semi-processed circuit board, the circuit pads of the two grooves are formed later by attaching adhesive tapes on the circuit pads on two sides, which is not limited herein.
In this embodiment, the colloid and the colloid are used to perform dual protection on the circuit pad, which is suitable for the case that the circuit pad is thicker. If the copper layer of the circuit bonding pad is thinner, the adhesive tape can be directly used for protection; if the copper layer of the circuit pad is thicker, the glue is required to fill the gaps in the circuit pad to ensure the flatness of the circuit board.
Step S25: and pressing the semi-processed circuit board to form a pressed circuit board, and covering the surface of the adhesive tape far away from the semi-processed circuit board with an outer layer.
The method specifically comprises the following steps: and pressing the prepreg on the surface of the semi-processed circuit board to form a dielectric layer, manufacturing a circuit copper layer on the surface of the dielectric layer, pressing the dielectric layer on the surface of the circuit copper layer, and manufacturing the circuit copper layer on the surface of the dielectric layer to obtain a pressed circuit board with a preset number of circuit copper layers or a pressed circuit board with a preset thickness.
The thickness of the laminated circuit board is larger than that of the semi-processed circuit board, so that a step is formed after the laminated circuit board is grooved.
The thickness of the laminated circuit board can be designed according to actual requirements, and the number of circuit copper layers in the laminated circuit board can also be designed according to requirements.
The outer layer covered on the surface of the semi-processed circuit board comprises an outer layer formed by overlapping a plurality of dielectric layers and a circuit copper layer.
In this embodiment, the lamination circuit board includes electrically connected through holes, and the through holes are connected with circuit copper layers of different layers, wherein the through holes are arranged at positions avoiding the adhesive tape.
Step S26: and punching holes on the position of the pressing circuit board corresponding to the adhesive tape to expose the adhesive tape.
In one embodiment, holes are drilled vertically in the position of the press-fit circuit board corresponding to the adhesive tape until the adhesive tape is exposed. In another embodiment, a slit is formed at a position of the pressing circuit board corresponding to the adhesive tape to expose the adhesive tape.
Specifically, a depth control process is used to make holes at the positions of the pressing circuit board corresponding to the adhesive tapes so as to expose the adhesive tapes. The depth control process comprises mechanical depth control and UV laser depth control.
In another embodiment, the method further includes, after punching the hole at a position of the circuit board corresponding to the adhesive tape to expose the adhesive tape,: and cutting along the edge position of the adhesive tape corresponding to the pressed circuit board by using a slot milling process to obtain a cutting profile.
Step S27: and removing the adhesive tape of the pressed circuit board and the outer layer on the surface of the adhesive tape to expose the colloid.
Specifically, the adhesive tape of the laminated circuit board and the outer layer of the surface of the adhesive tape are removed along the edge of the adhesive tape by using the holes to expose the colloid.
Step S28: and removing the colloid by using chemical liquid medicine to expose the circuit bonding pad, thereby obtaining the slotted circuit board.
The method specifically comprises the step of etching colloid in a gap of a circuit bonding pad by using chemical liquid medicine, wherein the bottom of the slot of the obtained slotted circuit board is provided with the circuit bonding pad.
The beneficial effects of this embodiment are: the circuit board is formed by laminating the semi-processed circuit board, wherein the surface of the semi-processed circuit board is covered with an outer layer, and finally the outer layer on the surface of the adhesive tape and the adhesive tape is removed by the adhesive tape, so that a grooved circuit board is formed, the circuit pad is arranged at the bottom of the grooved circuit board, and the diversity of welding components at the bottom of the groove of the circuit board is increased.
The application also provides a third method for manufacturing a slotted circuit board, referring to fig. 3, fig. 3 is a schematic flow chart of a third embodiment of the method for manufacturing a slotted circuit board of the application. As shown in fig. 3, the method for manufacturing the slotted circuit board includes:
step S31: a semi-finished circuit board is provided.
The semi-processed circuit board comprises a multi-layer circuit board.
Step S32: and manufacturing a circuit bonding pad on the surface of the semi-processed circuit board.
The method comprises the following steps: a circuit pad is provided on one side surface of the semi-processed circuit board. The circuit pads may also be provided on opposite side surfaces of the semi-finished circuit board, as not limited herein.
The circuit bonding pad is prepared through the processes of film pasting, developing, exposing and copper plating.
In this embodiment, the surface of the semi-finished circuit board is provided with an inner layer of circuit copper layer in addition to the circuit pads. Wherein the wire bonding pads can be arranged into bonding pads with specific patterns according to the bonding requirements.
Step S33: the line pads are filled with a gel and the gel is allowed to cover the surfaces of the line pads.
The colloid has the characteristics of high temperature resistance and high pressure resistance, has good filling performance, can be used for filling gaps of circuit bonding pads to form a flat surface, and is easy to remove by chemical liquid medicine. Most of colloid with good filling performance is easy to remove by chemical liquid medicine, so that the colloid is easy to react with the manufacturing liquid medicine in the process of manufacturing the laminated circuit board, and is difficult to remove in the process of laminating and combined with the prepreg. Thus, the adhesive tape is used to further protect the surface of the colloid.
In this embodiment, the colloid is used to cover the surface of the circuit pad and fill the gap of the circuit pad, so that the surface of the circuit pad is flat, and the flatness of the subsequently manufactured laminated circuit board is ensured.
Step S34: the surface of the colloid is covered by the adhesive tape to protect the colloid.
The adhesive tape has the characteristics of high temperature resistance and high pressure resistance, has chemical stability, and is not combined with the prepreg in the pressing process.
In another embodiment, if the circuit pads are provided on two opposite side surfaces of the semi-processed circuit board, the circuit pads of the two grooves are formed later by attaching adhesive tapes on the circuit pads on two sides, which is not limited herein.
In this embodiment, the colloid and the colloid are used to perform dual protection on the circuit pad, which is suitable for the case that the circuit pad is thicker. When the copper layer of the circuit bonding pad is thinner, the adhesive tape can be directly used for protection; if the copper layer of the circuit pad is thicker, the glue is required to fill the gaps in the circuit pad to ensure the flatness of the circuit board.
Step S35: and pressing a dielectric layer on the surface of the semi-processed circuit board.
The dielectric layer is made of prepreg. Specifically, a dielectric layer is pressed on the surface of the adhesive tape.
Step S36: and manufacturing a circuit copper layer on the surface of the dielectric layer.
And sticking colloid and adhesive tape on the surface of the circuit copper layer to obtain a second protective layer. And pressing the dielectric layer and the outer circuit copper layer on the surface of the second protective layer to obtain the pressed circuit board. The surface of the second protection layer is larger than the area of the circuit bonding pad, so that a two-step circuit board is formed after the second protection layer and the first protection layer on the surface of the circuit bonding pad are torn off. The application can form multi-step grooves on the circuit board through the protective layer formed by the colloid and the adhesive tape, and is not limited herein.
The thickness of the laminated circuit board is larger than that of the semi-processed circuit board, so that a step is formed after the laminated circuit board is grooved.
The thickness of the laminated circuit board can be designed according to actual requirements, and the number of circuit copper layers in the laminated circuit board can also be designed according to requirements.
The outer layer covered on the surface of the semi-processed circuit board comprises an outer layer formed by overlapping a plurality of dielectric layers and a circuit copper layer.
In this embodiment, the lamination circuit board includes electrically connected through holes, and the through holes are connected with circuit copper layers of different layers, wherein the through holes are arranged at positions avoiding the adhesive tape.
Step S37: and punching holes on the position of the pressing circuit board corresponding to the adhesive tape to expose the adhesive tape.
Specifically, a depth control process is used to make holes at the positions of the pressing circuit board corresponding to the adhesive tapes so as to expose the adhesive tapes. The depth control process comprises mechanical depth control and UV laser depth control.
In another embodiment, the method further includes, after punching the hole at a position of the circuit board corresponding to the adhesive tape to expose the adhesive tape,: and cutting along the edge position of the adhesive tape corresponding to the pressed circuit board by using a slot milling process to obtain a cutting profile.
Step S38: and removing the adhesive tape of the pressed circuit board and the outer layer on the surface of the adhesive tape to expose the colloid.
Specifically, the adhesive tape for laminating the circuit board, the dielectric layer and the circuit copper layer on the surface of the adhesive tape are removed along the edge of the adhesive tape by utilizing the holes so as to expose the colloid.
Step S39: and removing the colloid by using chemical liquid medicine to expose the circuit bonding pad, thereby obtaining the slotted circuit board.
The method specifically comprises the step of etching colloid in a gap of a circuit bonding pad by using chemical liquid medicine, wherein the bottom of the slot of the obtained slotted circuit board is provided with the circuit bonding pad.
The beneficial effects of this embodiment are: the circuit board is formed by laminating the semi-processed circuit board, wherein the surface of the semi-processed circuit board is covered with an outer layer, and finally the outer layer on the surface of the adhesive tape and the adhesive tape is removed by the adhesive tape, so that a grooved circuit board is formed, the circuit pad is arranged at the bottom of the grooved circuit board, and the diversity of welding components at the bottom of the groove of the circuit board is increased. In addition, the colloid and the adhesive tape can be reused in the process of manufacturing the laminated circuit board so as to manufacture the circuit board with multiple steps.
The present application further provides a circuit board, and in particular, referring to fig. 4a and fig. 4b, fig. 4a is a schematic cross-sectional structure of a first embodiment of the circuit board of the present application, and fig. 4b is a schematic top view of the first embodiment of the circuit board of the present application. As shown in fig. 4a and 4b, a groove 401 is provided on the circuit board, and a wire pad 41 is provided at the bottom of the groove.
In a specific embodiment, the surface of the circuit board is further provided with an outer circuit copper layer 42, and the outer circuit copper layer 42 may also be an outer circuit pad, so that other components are soldered on the surface of the circuit board through the outer circuit pad.
Wherein, the circuit pad 41 and the outer layer circuit copper layer 42 are arranged in different layers, namely, the height difference exists between the circuit pad 41 and the outer layer circuit copper layer 42.
The circuit pads 41 are distributed in a pattern and connected to the inner circuit copper layer of the same layer. The inner wiring copper layer is a copper layer provided opposite to the outer wiring copper layer 42.
Through the structure, the bottom of the groove of the circuit board can be welded with components and the surface of the circuit board can be welded with components, so that the diversity of the welded components of the circuit board is improved.
The foregoing is only the embodiments of the present application, and therefore, the patent scope of the application is not limited thereto, and all equivalent structures or equivalent processes using the descriptions of the present application and the accompanying drawings, or direct or indirect application in other related technical fields, are included in the scope of the application.
Claims (10)
1. The manufacturing method of the slotted circuit board is characterized by comprising the following steps of:
providing a semi-processed circuit board; the surface of the semi-processed circuit board is provided with a circuit bonding pad;
sticking adhesive tapes on the surface of the circuit bonding pad of the semi-processed circuit board so as to protect the circuit bonding pad on the surface of the semi-processed circuit board;
pressing the semi-processed circuit board to form a pressed circuit board, and covering the surface of the adhesive tape, which is far away from the semi-processed circuit board, with an outer layer;
punching holes on the position of the pressing circuit board corresponding to the adhesive tape so as to expose the adhesive tape;
and removing the adhesive tape of the pressed circuit board and the outer layer on the surface of the adhesive tape, and exposing the circuit pad to obtain the slotted circuit board.
2. The method of manufacturing a slotted circuit board as defined in claim 1, wherein said step of taping a surface of said semi-finished circuit board on which said circuit pads are disposed to protect said circuit pads on said semi-finished circuit board surface comprises:
filling the circuit bonding pad with colloid, and enabling the colloid to cover the surface of the circuit bonding pad;
and covering the surface of the colloid by using the adhesive tape to protect the colloid.
3. The method of manufacturing a slotted circuit board as defined in claim 2, wherein said step of removing said adhesive tape of said laminated circuit board and said outer layer of said surface thereof to expose said circuit pads, and obtaining said slotted circuit board comprises:
removing the adhesive tape of the pressed circuit board and the outer layer on the surface of the adhesive tape to expose the colloid;
and removing the colloid by using chemical liquid medicine to expose the circuit bonding pad.
4. The method of manufacturing a slotted circuit board of claim 1, wherein the step of laminating the half-finished circuit board to form a laminated circuit board with the tape having an outer layer on a surface thereof remote from the half-finished circuit board comprises:
laminating a dielectric layer on the surface of the semi-processed circuit board;
manufacturing a circuit copper layer on the surface of the dielectric layer to form the laminated circuit board; wherein, the pressfitting circuit board surface is provided with circuit copper layer.
5. The method of claim 4, wherein the laminated circuit board comprises a plurality of dielectric layers and a circuit copper layer which are overlapped.
6. The method of claim 1, wherein the step of removing the tape and the outer layer on the surface of the tape to expose the circuit pads to obtain the grooved circuit board further comprises:
cutting along the edge of the adhesive tape by using a slot milling process to expose the edge of the adhesive tape;
and uncovering the hole along the edge of the adhesive tape to remove the adhesive tape of the pressed circuit board and the outer layer on the surface of the adhesive tape, so as to expose the circuit bonding pad.
7. The method of claim 1, wherein the step of punching holes in the press-fit circuit board at positions corresponding to the adhesive tapes to expose the adhesive tapes comprises:
and drilling holes on the position of the pressing circuit board corresponding to the adhesive tape by using a depth control process until the adhesive tape is exposed.
8. The method of claim 7, wherein the depth control process comprises mechanical depth control and laser depth control.
9. The method of claim 1, wherein the step of punching holes in the pressed circuit board at positions corresponding to the adhesive tapes to expose the adhesive tapes, further comprises:
and manufacturing a gap at the position of the pressing circuit board corresponding to the adhesive tape so as to expose the adhesive tape.
10. The circuit board is characterized in that a groove is formed in the circuit board, and a circuit bonding pad is arranged at the bottom of the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210593343.8A CN117177470A (en) | 2022-05-27 | 2022-05-27 | Manufacturing method of slotted circuit board and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210593343.8A CN117177470A (en) | 2022-05-27 | 2022-05-27 | Manufacturing method of slotted circuit board and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117177470A true CN117177470A (en) | 2023-12-05 |
Family
ID=88938129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210593343.8A Pending CN117177470A (en) | 2022-05-27 | 2022-05-27 | Manufacturing method of slotted circuit board and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117177470A (en) |
-
2022
- 2022-05-27 CN CN202210593343.8A patent/CN117177470A/en active Pending
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