CN116967658B - Reinforced soldering lug and preparation method and application thereof - Google Patents
Reinforced soldering lug and preparation method and application thereof Download PDFInfo
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- CN116967658B CN116967658B CN202311071554.6A CN202311071554A CN116967658B CN 116967658 B CN116967658 B CN 116967658B CN 202311071554 A CN202311071554 A CN 202311071554A CN 116967658 B CN116967658 B CN 116967658B
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- solder
- soldering
- reinforced
- soft solder
- soldering lug
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- 238000005476 soldering Methods 0.000 title claims abstract description 75
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract description 79
- 239000002184 metal Substances 0.000 claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 43
- 230000015556 catabolic process Effects 0.000 abstract description 21
- 238000006731 degradation reaction Methods 0.000 abstract description 21
- 239000000463 material Substances 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000011800 void material Substances 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 230000001351 cycling effect Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a reinforced soldering lug, and a preparation method and application thereof, and belongs to the technical field of welding materials. According to the invention, the metal wire penetrates into the soft solder soldering lug through the through hole, during soldering, the molten soft solder is in wet soldering with the soldered piece, the strength of the metal wire is far greater than that of the soft solder, the metal wire and the soft solder are mutually staggered to form a framework in the soft solder, so that the expansion of cavities and even cracks in the soldering layer after the soldering layer passes through temperature circulation is prevented, the degradation degree of the soldering layer is reduced, and the capability of the soldering layer for resisting temperature cycle impact is improved; the reinforced soldering lug manufactured by the method has stable structure, and the metal wire is not easy to fall off and shift, thereby being convenient for processing.
Description
Technical Field
The invention belongs to the technical field of welding materials, and particularly relates to a reinforced welding lug, a preparation method and application thereof.
Background
The solder is a solder having a melting point of not more than 450 ℃, and is often used as a raw material for soldering, that is, the two electronic components are fixedly connected by heating the solder to a temperature lower than the melting point of the two electronic components to be connected and higher than the melting point of the solder. In the working process of electronic components, a welding layer between the electronic components is subjected to severe tests such as thermal stress, high-density current and power circulation, and the requirements on the temperature impact resistance of the welding layer are higher and higher along with the trend of precision and integration of the electronic components. However, conventional solder fillets have limited strength and the resulting solder layer has limited resistance to temperature shock.
Aiming at the defects in the soft solder soldering lug, the finding of a reinforced soldering lug capable of improving the temperature cycle impact resistance of a soldering layer is the key point of the research in the field of soldering materials at present.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a reinforced soldering lug, a preparation method and application thereof, wherein the reinforced soldering lug can improve the temperature cycle impact resistance of a soldering layer and has excellent soldering quality.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
in a first aspect, the present invention provides a method for preparing a reinforced tab, the method comprising the steps of:
s1, processing a plurality of through holes which are orderly arranged on a soft solder soldering lug, wherein the diameter of each through hole is 0.3-2mm, and the distance between each two through holes is 1-5mm;
S2, sequentially penetrating metal wires with diameters of 0.05-0.4mm through the two ends of all the through holes in a continuous S-shaped threading mode to form soft solder soldering lugs with the metal wires distributed on two surfaces;
And S3, rolling and cutting the soft solder soldering lug in the step S2 to obtain the reinforced soldering lug.
According to the invention, through holes are processed in the soft solder soldering lug, metal wires penetrate into the soft solder soldering lug through the through holes, during welding, the soft solder is melted and is subjected to wet welding with a welded part, the through holes are filled with the melted soft solder so as to disappear, the strength of the metal wires is far greater than that of the soft solder, the metal wires and the soft solder are mutually staggered, a framework is formed in the soft solder, the expansion of voids and even cracks in a welding layer after the welding layer is subjected to temperature circulation is prevented, the degradation degree of the welding layer is reduced, and the capability of the welding layer for resisting temperature cycle impact is improved; the reinforced soldering lug manufactured by the method has stable structure, and the metal wire is not easy to fall off and shift, thereby being convenient for processing.
The inventor finds that when the diameter of the through hole is 0.3-2mm, the final welding void ratio is the lowest; if the diameter of the through hole is too small, the through hole is inconvenient to process, the processing cost of the through hole is high, and the metal wire is inconvenient to pass through the through hole; if the diameter of the through hole is too large, the quality of the soft solder soldering lug is lost too much, the solder quantity is insufficient, the soldering layer is thinned, and the degradation degree of the soldering layer after temperature circulation is large.
The inventor also finds that the distance between the through holes also affects the quality of the reinforced soldering lug, if the distance between the through holes is too small, the distribution of metal wires passing through the through holes on the surface of the soldering lug is too dense, so that molten soft solder is not easy to pass through the metal wires to be wetted and welded with a welded piece, poor welding and even cold welding are caused, and the degradation degree of a welding layer after temperature circulation is larger; if the distance between the through holes is too large, the distribution of the penetrating metal wires on the surface of the soldering lug is too small, the strengthening effect is poor, namely the degradation degree of the soldering layer after temperature circulation is large.
The inventor also finds that when the diameter of the metal wire is 0.05-0.4mm, the welding void ratio of the reinforced welding lug is ensured to be smaller, and meanwhile, the cost of the metal wire is lower; if the diameter of the metal wire is too small, the processing cost of the metal wire is high, and the metal wire is easy to break when passing through the through hole; if the diameter of the metal wire is too large, the difficulty is high when the metal wire passes through the through hole, and in the subsequent welding process, the wetting and bonding capacity of the metal wire and the molten soft solder is poor, so that the degradation degree of the welding layer is also high after temperature circulation.
As a preferred embodiment of the method for manufacturing the reinforced soldering lug, in the step S1, the diameter of the through hole is 1.2-1.5mm; the inventor finds through a large number of experiments that when the diameter of the through hole is in a preferred range, the degradation degree of the welding layer of the reinforced welding lug after temperature circulation can be ensured to be minimum.
As a preferred embodiment of the method for manufacturing the reinforced soldering lug, in the step S1, the distance between the through holes is 2-4mm; the inventor finds through a large number of experiments that when the distance between the through holes is in the preferred range, the degradation degree of the welding layer of the reinforced welding lug after temperature circulation can be ensured to be minimum.
As a preferred embodiment of the method for producing a reinforced solder tab of the present invention, in the step S1, the melting point of the solder tab is 80 to 400 ℃.
As a preferred embodiment of the method for producing a reinforced solder tab of the present invention, in the step S1, the solder tab is selected from tin-based solder, lead-based solder, indium-based solder, bismuth-based solder, antimony-based solder, or zinc-based solder.
As a more preferred embodiment of the method for producing a reinforced solder tab of the present invention, the solder tab has a thickness of 0.08 to 2mm.
As a preferred embodiment of the method for manufacturing a reinforced soldering lug according to the present invention, in the step S2, the diameter of the metal wire is 0.1-0.2mm, and the inventors have found through a lot of experiments that the metal wire having the above preferred range of the diameter minimizes the degradation degree of the soldering layer after the reinforced soldering lug is subjected to the temperature cycle.
As a preferred embodiment of the method for producing a reinforced solder tab of the present invention, in the step S2, the melting point of the metal wire is at least 200 ℃ higher than the melting point of the solder tab; the reinforced soldering lug needs to be heated in the welding process, the loss of the metal wire with higher melting point caused by fusion diffusion is very small, the expansion of voids and even cracks in the welding layer after the welding layer passes through the temperature cycle can be prevented, the degradation degree of the welding layer is reduced, and the capability of the welding layer for resisting the temperature cycle impact is improved.
In a more preferred embodiment of the method for producing a reinforced tab of the present invention, the metal wire is made of Cu or an alloy thereof, ag or an alloy thereof, ni or an alloy thereof, or Au or an alloy thereof.
In a second aspect, the present invention also provides a reinforced soldering lug, which is manufactured by the manufacturing method according to the first aspect.
The reinforced soldering lug has a stable structure, is used for welding and interconnecting electronic components, greatly reduces the degradation degree of a welding layer after temperature circulation, and improves the welding quality.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the metal wire penetrates into the soft solder soldering lug, during soldering, the molten soft solder is in wet soldering with a piece to be soldered, the strength of the metal wire is far greater than that of the soft solder, the metal wire and the soft solder are mutually staggered to form a framework in the soft solder, so that the expansion of cavities and even cracks in the soldering layer after the soldering layer passes through temperature circulation is prevented, the degradation degree of the soldering layer is reduced, and the capability of the soldering layer for resisting temperature circulation impact is improved; the reinforced soldering lug manufactured by the method has stable structure, and the metal wire is not easy to fall off and shift, thereby being convenient for processing.
Drawings
FIG. 1 is a schematic view of a wire passing through a solder via according to the present invention;
FIG. 2 is a schematic diagram of a solder tab of the present invention with wires on both sides of the solder tab rolled;
in the figure, 1, a soft solder soldering lug; 2. a metal wire; 3. and a through hole.
Detailed Description
For a better description of the objects, technical solutions and advantages of the present invention, the present invention will be further described with reference to the following specific examples.
The materials, methods and apparatus employed in the present invention, unless otherwise specified, are all conventional in the art.
The information of part of raw materials adopted in the embodiment of the invention is as follows:
| Trade name | Elemental and mass ratio, etc | Melting point (. Degree. C.) |
| SAC305 tin-based soft solder | Sn:Ag:Cu＝96.5:3:0.5 | 217-220 |
| In97Ag3 indium base soft solder | In:Ag＝97:3 | 144 |
| Purple copper wire | Pure copper | 1083 |
| Tin-plated nickel wire | The thickness of the tin plating layer is 0.01mm | 1453 |
Example 1
The preparation method of the reinforced soldering lug comprises the following steps:
s1, processing a plurality of through holes which are orderly arranged on a SAC305 tin-based soft solder soldering lug with the thickness of 0.6mm, wherein the diameter of each through hole is 1.6mm, and the distance between each through hole is 3mm;
S2, sequentially penetrating red copper wires with the diameter of 0.15mm through the two ends of all through holes in a continuous S-shaped threading mode to form soft solder soldering lugs with metal wires distributed on two surfaces, wherein the threading mode of the red copper wires is shown in a schematic diagram in FIG. 1, and the melting point of the red copper wires is 1083 ℃;
s3, rolling the soft solder soldering lug in the step S2 into a thickness of 0.3mm by a roller, and cutting the soft solder soldering lug into a required size to obtain the reinforced soldering lug, wherein a schematic diagram of the rolled reinforced soldering lug is shown in FIG. 2.
Example 2
This embodiment differs from embodiment 1 only in that: in the step S1, the diameter of the through holes is 2mm, and the distance between the through holes is 5mm; in the step S2, the diameter of the red copper wire is 0.4mm; the remaining steps are identical to those of example 1.
Example 3
This embodiment differs from embodiment 1 only in that: in the step S1, the diameter of the through holes is 0.3mm, and the distance between the through holes is 2mm; in the step S2, the diameter of the purple copper wire is 0.1mm; the remaining steps are identical to those of example 1.
Example 4
This embodiment differs from embodiment 1 only in that: in the step S1, the diameter of the through holes is 1.2mm, and the distance between the through holes is 1mm; in the step S2, the diameter of the red copper wire is 0.05mm; the remaining steps are identical to those of example 1.
Example 5
This embodiment differs from embodiment 1 only in that: in the step S1, the diameter of the through holes is 1.5mm, and the distance between the through holes is 4mm; in the step S2, the diameter of the purple copper wire is 0.2mm; the remaining steps are identical to those of example 1.
Example 6
This embodiment differs from embodiment 1 only in that: in the step S1, the soft solder soldering lug is an In97Ag3 indium-based soft solder soldering lug; in the step S2, the metal wire is a tinned nickel wire; the remaining steps are identical to those of example 1.
Comparative example 1
This comparative example differs from example 1 only in that: in the step S1, the diameter of the through hole was 0.18mm, and the rest of the steps were the same as in example 1.
Comparative example 2
This comparative example differs from example 1 only in that: in the step S1, the diameter of the through hole was 5mm, and the rest steps were the same as in example 1.
Comparative example 3
This comparative example differs from example 1 only in that: in the step S1, the distance between the through holes is 0.1mm; the remaining steps are identical to those of example 1.
Comparative example 4
This comparative example differs from example 1 only in that: in the step S1, the distance between the through holes is 10mm; the remaining steps are identical to those of example 1.
Comparative example 5
This comparative example differs from example 1 only in that: in the step S2, the diameter of the purple copper wire is 0.01mm; the remaining steps are identical to those of example 1.
Comparative example 6
This comparative example differs from example 1 only in that: in the step S2, the diameter of the purple copper wire is 1mm; the remaining steps are identical to those of example 1.
Comparative example 7
The comparative example used commercially available SAC305 tin-based solder pads, i.e., which were not subjected to the steps S1-S3 of the present invention.
Comparative example 8
The comparative example used a commercially available In97Ag3 indium-based solder tab, i.e., was not subjected to the steps S1-S3 described In the present invention.
Experimental example
Welding the welding tabs of the embodiment and the comparative example between two copper-clad ceramic plates by adopting a vacuum formic acid reflow method, wherein the size of the copper-clad ceramic plates is 57 x 48.5 x 2mm; after welding, the welded part is subjected to 1000 times of temperature cycle impact at minus 40-125 ℃, and the void ratio of the welded layer before and after the temperature cycle impact is respectively detected by an ultrasonic scanner, so that the degradation degree of the welded layer is calculated, and the test result is shown in Table 1.
Detection standard: the smaller the void ratio change of the welding layer after the temperature cycle impact is compared with the void ratio change before the temperature cycle impact, the less serious the degradation degree is, namely the better the quality of the welding layer is, namely the stronger the capability of the welding layer for resisting the temperature cycle impact is; wherein degradation degree = void fraction after temperature cycling impact-void fraction before temperature cycling impact.
TABLE 1
The results in table 1 show that the reinforced soldering tabs according to examples 1 to 6 of the present invention have a degree of degradation of the soldering layer after temperature cycling of less than 2.5%, wherein the reinforced soldering tabs according to example 3 and example 4 have a minimum degree of degradation of the soldering layer after temperature cycling of less than 2%. In comparative example 1, the diameter of the through hole is too small, so that the difficulty in processing the through hole is high; in the comparative example 2, the quality of the soft solder soldering lug is lost too much due to the overlarge diameter of the through hole, the solder quantity is insufficient, the soldering layer is thinner, and the degradation degree of the soldering layer after temperature circulation is larger; in comparative example 3, the metal wires passing through the through holes are too densely distributed on the surface of the soldering lug due to the too small distance between the through holes, so that molten soft solder is not easy to be wetted and welded with a welded piece through the metal wires, poor welding and even cold welding are caused, and the degradation degree of a welding layer after temperature circulation is high; in comparative example 4, too large distance between the through holes can cause too little distribution of the penetrating metal wires on the surface of the soldering lug, and the strengthening effect is poor, namely the degradation degree of the soldering layer after temperature circulation is large; comparative example 5 the wire has a high processing cost due to the too small diameter of the wire, and is broken when passing through the through hole; in comparative example 6, the metal wire has a large diameter, so that the difficulty is high when the metal wire passes through the through hole, and the wettability and bonding capability of the metal wire and the molten soft solder are poor in the subsequent welding, so that the degradation degree of the welding layer after temperature cycling is also high; whereas the welding tabs of comparative examples 7 and 8, which were not prepared by the method of the present invention, were more degraded in the welded layer after the final temperature cycle.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present invention may be modified or substituted equally without departing from the spirit and scope of the technical solution of the present invention.
Claims (6)
1. A method of preparing a reinforced tab, the method comprising the steps of:
s1, processing a plurality of through holes which are orderly arranged on a soft solder soldering lug, wherein the diameter of each through hole is 0.3-1.5mm, and the distance between the through holes is 1-2mm;
S2, sequentially penetrating metal wires with diameters of 0.05-0.1mm through the two ends of all the through holes in a continuous S-shaped threading mode to form soft solder soldering lugs with the metal wires distributed on two surfaces;
s3, rolling and cutting the soft solder soldering lug obtained in the step S2 to obtain the reinforced soldering lug;
in the step S2, the melting point of the metal wire is 200 ℃ or higher than that of the soft solder soldering lug.
2. The method for manufacturing a reinforced solder tab according to claim 1, wherein in the step S1, the diameter of the through hole is 1.2-1.5mm.
3. The method of manufacturing reinforced solder tabs according to claim 1, wherein in step S1, the melting point of the solder tab is 80-400 ℃.
4. The method of manufacturing a reinforced solder tab according to claim 1, wherein in step S1, the solder tab is selected from tin-based solder, lead-based solder, indium-based solder, bismuth-based solder, antimony-based solder, and zinc-based solder.
5. The method of manufacturing a reinforced solder tab according to claim 1, wherein in the step S2, the metal wire is made of at least one of Cu or an alloy thereof, ag or an alloy thereof, ni or an alloy thereof, au or an alloy thereof.
6. A reinforced tab produced by the production method according to any one of claims 1 to 5.
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| CN202311071554.6A CN116967658B (en) | 2023-08-24 | 2023-08-24 | Reinforced soldering lug and preparation method and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311071554.6A CN116967658B (en) | 2023-08-24 | 2023-08-24 | Reinforced soldering lug and preparation method and application thereof |
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| CN116967658B true CN116967658B (en) | 2024-07-26 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105537793A (en) * | 2016-01-15 | 2016-05-04 | 东南大学 | Soldering lug for welding power module |
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| JP5207707B2 (en) * | 2007-10-31 | 2013-06-12 | ニホンハンダ株式会社 | Molded solder containing metal wire and method for producing the same |
| JP5743970B2 (en) * | 2012-07-18 | 2015-07-01 | ニホンハンダ株式会社 | Molded solder containing metal wire and manufacturing method thereof |
| CN107486651B (en) * | 2017-08-02 | 2020-10-23 | 中国电器科学研究院股份有限公司 | Preparation method of low-temperature solder sheet |
| CN111468861B (en) * | 2020-04-17 | 2022-02-15 | 中车青岛四方机车车辆股份有限公司 | Copper-phosphorus brazing filler metal soldering lug and preparation method thereof |
| CN115008060A (en) * | 2022-05-31 | 2022-09-06 | 深圳市兴鸿泰锡业有限公司 | A tin-based composite material preform solder sheet for power chip packaging and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105537793A (en) * | 2016-01-15 | 2016-05-04 | 东南大学 | Soldering lug for welding power module |
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