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CN116836548A - Polyarylester fiber fabric prepreg, copper-clad plate and preparation method - Google Patents

Polyarylester fiber fabric prepreg, copper-clad plate and preparation method Download PDF

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Publication number
CN116836548A
CN116836548A CN202310880465.XA CN202310880465A CN116836548A CN 116836548 A CN116836548 A CN 116836548A CN 202310880465 A CN202310880465 A CN 202310880465A CN 116836548 A CN116836548 A CN 116836548A
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polyarylate
prepreg
copper
parts
fiber fabric
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CN202310880465.XA
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Chinese (zh)
Inventor
霍一丁
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Ningbo Siege New Material Technology Co ltd
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Ningbo Siege New Material Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B32B2260/023—Two or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0276—Polyester fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/72—Density
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

The invention relates to the technical field of electronic materials, in particular to a polyarylate fiber fabric prepreg, a copper-clad plate and a preparation method thereof, comprising a polyarylate fiber fabric impregnated with cyanate resin solution; the cyanate resin solution comprises the following components in parts by weight: 50-80 parts of bisphenol A type cyanate ester prepolymer, 5-30 parts of phosphorus-containing epoxy resin, 0.01-0.05 part of accelerator, 5-30 parts of phosphorus flame retardant and 30-80 parts of solvent. And (3) paving the prepreg between 2 copper foils, and carrying out hot pressing treatment to obtain the polyarylate fiber fabric cyanate resin copper-clad plate. The copper-clad plate provided by the invention has the characteristics of low density, heat resistance, good flame retardance, low dielectric constant and dielectric loss, good toughness, impact resistance, low water absorption and the like, and is suitable for materials for printed circuit boards.

Description

Polyarylester fiber fabric prepreg, copper-clad plate and preparation method
Technical Field
The invention relates to the technical field of electronic materials, in particular to a polyarylate fiber fabric prepreg, a copper-clad plate and a preparation method.
Background
The copper clad laminate (Copper Clad Laminate, abbreviated as CCL) is a plate-like material which is obtained by immersing a reinforcing material in resin glue solution, coating copper foil on one or both sides, and hot-pressing, and is a core material for manufacturing a printed circuit board. Almost all electronic products use printed circuit boards, and are therefore referred to as "electronic product parents". The copper-clad plate and the printed circuit board are indispensable important components in modern electronic information products, and are widely applied to the terminal fields of consumer electronics, computers, communication, automotive electronics, aerospace, industrial control and the like. The core requirement of the copper-clad plate is low dielectric constant and low dielectric loss, and the smaller the dielectric constant and the dielectric loss, the faster the signal transmission speed and the better the signal transmission quality. The main materials of the copper-clad plate comprise reinforcing materials, resin and copper foil, so that the dielectric constant of the whole copper-clad plate can be effectively reduced by selecting the reinforcing materials and the resin with low dielectric constants.
The cyanate ester resin (CE) has a low relative dielectric constant (2.5-3.5) and a low dielectric loss (3.0X10) -3 ～8.0×10 -3 ) Lower moisture absorption and high decomposition temperature. The composite material is widely applied to the aerospace field by virtue of the advantages of excellent heat resistance, mechanical property, dimensional stability, moist heat resistance, low dielectric property and the like, such as the manufacture of aircraft stealth structures, high-performance radome structures, printed circuit boards and the like.
The thermotropic liquid crystal polyarylate fiber is obtained by melt spinning polyarylate (LCP) engineering plastics, and has low density (1.4 g/cm) 3 ) The dielectric constant is low (3.6), the dielectric loss is low (0.002), the performances of high strength, high modulus, high temperature resistance, flame retardance (V0), chemical reagent resistance, low moisture absorption rate, strong dimensional stability and the like are achieved, and the dielectric ceramic has wide potential application value in the fields of aviation, military, electronics, sports and the like. As a prepreg reinforcing material for the copper-clad plate, the LCP can further improve the dielectric property of the copper-clad plate, lighten the weight and simultaneously improve the flame retardant property, the moisture absorption resistance and the shock resistance of the copper-clad plate.
Patent CN109535653a discloses a phosphorus-containing epoxy resin composition and application thereof, and prepregs and laminates prepared therefrom, comprising: (A) phosphorus compound modified epoxy resin: 100 parts; (B) a curing accelerator: 0-5 parts; (C) cyanate resin: 5-80 parts; (D) polyphenylene ether resin: 5-70 parts; (E) a filler: 0-100 parts. The prepreg and the laminated board prepared by the resin composition have the characteristics of halogen-free flame retardance, high damp and heat resistance, low water absorption, high flame retardance, high peel strength and good dielectric property. However, the proposal uses phosphorus compound modified epoxy resin as a main resin matrix and glass fiber cloth as a reinforcing material, and polyphenylene oxide resin is also added, so that the components are complex, and the performances such as dielectric constant and the like still need to be improved.
Accordingly, there is a need for an improved polyarylate fiber fabric prepreg, copper-clad laminate, and method of making the same to solve the above-mentioned problems.
Disclosure of Invention
The invention aims to provide a polyarylate fiber fabric prepreg, a copper-clad plate and a preparation method thereof, wherein a bisphenol A type cyanate ester prepolymer is used as a main resin matrix, a small amount of phosphorus-containing epoxy resin is added, and the prepreg and the copper-clad plate are compounded with the polyarylate fiber fabric to obtain the copper-clad plate which has the advantages of low density, heat resistance, flame retardance, low dielectric constant and dielectric loss, good toughness, impact resistance and low water absorption rate, so as to meet the performance requirements of a high-frequency high-speed copper-clad plate.
In order to achieve the above object, in a first aspect, the present invention provides a polyarylate fiber fabric prepreg comprising a polyarylate fiber fabric impregnated with a cyanate ester resin solution;
the cyanate resin solution comprises the following components in parts by weight: 50-80 parts of bisphenol A type cyanate ester prepolymer, 5-30 parts of phosphorus-containing epoxy resin, 0.01-0.05 part of accelerator, 5-30 parts of phosphorus flame retardant and 30-80 parts of solvent.
After the bisphenol A type cyanate ester prepolymer is cured and polymerized, the network structure thermosetting resin with a triazine ring structure as a main part is generated, and has low relative dielectric constant, low dielectric loss, good thermal stability and wet heat resistance. The flame retardance can be remarkably improved by adding a small amount of phosphorus-containing epoxy resin and phosphorus flame retardant. Meanwhile, the polyarylate fiber fabric is used as a reinforcing material, and has good adhesion with cyanate resin solution, and the obtained prepreg has the advantages of low density, heat resistance, flame retardance, low dielectric constant and dielectric loss, good toughness, impact resistance, low water absorption and the like.
Preferably, the cyanate resin solution comprises, by weight: 60-80 parts of bisphenol A type cyanate ester prepolymer, 5-20 parts of phosphorus-containing epoxy resin, 0.01-0.05 part of accelerator, 5-20 parts of phosphorus flame retardant and 30-80 parts of solvent.
More preferably, the cyanate ester resin solution comprises, in parts by weight: 60-80 parts of bisphenol A type cyanate ester prepolymer, 10-15 parts of phosphorus-containing epoxy resin, 0.01-0.03 part of accelerator, 10-15 parts of phosphorus flame retardant and 40-80 parts of solvent.
Further, the content of phosphorus in the phosphorus-containing epoxy resin is 6-8%. At this content, it has better flame retardant property.
Further, the polyarylate fiber fabric has an areal density of 40-120g/m 2 The method comprises the steps of carrying out a first treatment on the surface of the The fabric form of the polyarylate fiber fabric is plain weave, twill weave or satin weave.
Further, the phosphorus-based flame retardant is a phosphorus-containing flame retardant which is soluble in the solvent, for example, a YK-30 phosphorus-containing flame retardant. The soluble phosphorus-containing flame retardant is selected, so that the dispersibility is good, and the composite strength of the cyanate resin solution and the polyarylate fiber fabric can be ensured.
Further, the accelerator comprises one or more of nonylphenol, triethylamine, 2-ethyl-4-methylimidazole, 1-dimethyl-3-phenylurea, diallyl bisphenol A, 2-allylphenol, aluminum acetylacetonate, iron acetylacetonate, nickel acetylacetonate, cobalt acetylacetonate, zinc octoate, tin octoate and manganese octoate.
Further, the solvent includes one or more of acetone, butanone, and propylene glycol methyl ether.
In a second aspect, the present invention provides a method for preparing the polyarylate fiber fabric prepreg according to any one of the above, comprising: and (3) immersing the polyarylate fiber fabric in the cyanate resin solution, and then drying to obtain the polyarylate fiber fabric prepreg.
Further, the gel content of the polyarylate fiber fabric prepreg is 50-80 wt%, preferably 50-60wt%. The strength, toughness, dielectric constant and other properties of the prepreg are regulated and controlled through the regulation and control of the gel content.
Further, the temperature of the drying is 90-130 ℃; the polyarylate fiber fabric is immersed in the cyanate resin solution in a gluing machine, and the speed of the polyarylate fiber fabric is 10-25m/min.
In a third aspect, the invention provides a copper-clad plate, comprising two copper foils and a prepreg arranged between the two copper foils; the prepreg is the polyarylate fiber fabric prepreg according to any one of the above.
Further, the number of layers of the semi-cured material is 1-6; and the multilayer prepregs can be laminated and compounded to obtain copper-clad plates with different specifications and performances.
Further, the copper-clad plate is obtained by laminating at least one prepreg with copper foil, vacuumizing and then performing hot pressing, wherein the hot pressing temperature is 160-300 ℃, the hot pressing time is 2-8h, and the hot pressing pressure is 1-50MPa.
The beneficial effects of the invention are as follows:
according to the polyarylate fiber fabric prepreg provided by the invention, the polyarylate (LCP) is used as a reinforcing material, and the cyanate is used as matrix resin, so that the obtained prepreg has the advantages of low density, heat resistance, flame retardance, low dielectric constant and dielectric loss, good toughness, impact resistance, low water absorption and the like, and the obtained copper-clad plate further has wide application potential in the field of high-frequency high-speed copper-clad plates.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the present invention will be clearly and completely described below, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Preparing a cyanate resin solution: 80 parts of bisphenol A type cyanate ester prepolymer, 10 parts of phosphorus-containing epoxy resin, 0.02 part of 2-ethyl-4-methylimidazole, 10 parts of YK-30 (viscosity at 25 ℃ C. Is 1200-1500 mPa.S, phosphorus content is 7.2%) phosphorus-containing flame retardant and 80 parts of acetone. The components are mixed and stirred, so that the solid resin is dissolved in the acetone solvent, and the resin solution with uniform color is obtained. The phosphorus content of the phosphorus-containing epoxy resin is 7.5 percent.
Preparing a prepreg: pouring the glue solution into a glue groove of a gluing machine, starting equipment, and impregnating the polyarylate fiber fabric, wherein the surface density of the polyarylate fiber fabric is 60g/m 2 Satin weave of (c). And the polyarylate fiber fabric containing the glue solution is subjected to drying channels of equipment to obtain the prepreg. The drying temperature is 90 ℃, the coating speed is 15m/min, and the glue content of the obtained prepreg is 60wt%.
Preparing a copper-clad plate: 4 pieces with the size of 300mm multiplied by 200mm are cut from the prepreg, and are paved, and copper foils with the thickness of 15um are paved on the upper surface and the lower surface. Placing the well-paved laminate blank on a platform of a hot press, and closing the die, heating and pressurizing. The temperature is 200 ℃, the hot pressing time is 3 hours, and the hot pressing pressure is 10MPa. And cooling to obtain the copper-clad plate.
Example 2
Preparing a cyanate resin solution: 60 parts of bisphenol A type cyanate ester prepolymer, 20 parts of phosphorus-containing epoxy resin, 0.01 part of nonylphenol, 20 parts of YK-30 phosphorus-containing flame retardant and 70 parts of acetone. The components are mixed and stirred, so that the solid resin is dissolved in the acetone solvent, and the resin solution with uniform color is obtained. The phosphorus content of the phosphorus-containing epoxy resin is 8 percent.
Preparing a prepreg: pouring the glue solution into a glue groove of a gluing machine, starting equipment, and impregnating the polyarylate fiber fabric, wherein the surface density of the polyarylate fiber fabric is 80g/m 2 Satin weave of (c). And the polyarylate fiber fabric containing the glue solution is subjected to drying channels of equipment to obtain the prepreg. The drying temperature is 90 ℃, the coating speed is 15m/min, and the product is obtainedThe gel content of the prepreg was 60wt%.
Preparing a copper-clad plate: 2 pieces with the size of 300mm multiplied by 200mm are cut from the prepreg, and are paved, and copper foils with the thickness of 15um are paved on the upper surface and the lower surface. Placing the well-paved laminate blank on a platform of a hot press, and closing the die, heating and pressurizing. The temperature is 200 ℃, the hot pressing time is 3 hours, and the hot pressing pressure is 10MPa. And cooling to obtain the copper-clad plate.
Example 3
Preparing a cyanate resin solution: 70 parts of bisphenol A type cyanate ester prepolymer, 15 parts of phosphorus-containing epoxy resin, 0.02 part of 2-ethyl-4-methylimidazole, 15 parts of YK-30 phosphorus-containing flame retardant and 70 parts of acetone. The components are mixed and stirred, so that the solid resin is dissolved in the acetone solvent, and the resin solution with uniform color is obtained. The phosphorus content of the phosphorus-containing epoxy resin is 8 percent.
Preparing a prepreg: pouring the glue solution into a glue groove of a gluing machine, starting equipment, and impregnating the polyarylate fiber fabric, wherein the surface density of the polyarylate fiber fabric is 60g/m 2 Satin weave of (c). And the polyarylate fiber fabric containing the glue solution is subjected to drying channels of equipment to obtain the prepreg. The drying temperature is 90 ℃, the coating speed is 15m/min, and the glue content of the obtained prepreg is 60wt%.
Preparing a copper-clad plate: 2 pieces with the size of 300mm multiplied by 200mm are cut from the prepreg, and are paved, and copper foils with the thickness of 15um are paved on the upper surface and the lower surface. Placing the well-paved laminate blank on a platform of a hot press, and closing the die, heating and pressurizing. The temperature is 200 ℃, the hot pressing time is 3 hours, and the hot pressing pressure is 10MPa. And cooling to obtain the copper-clad plate.
Example 4
A polyarylate fiber fabric prepreg and a copper-clad plate are different from example 3 in 40 parts by weight of acetone. The resulting prepreg had a gel content of 80% by weight. The other components are the same as those in embodiment 3, and will not be described in detail here.
Example 5
A polyarylate fiber fabric prepreg and a copper-clad plate are different from example 3 in 80 parts by weight of acetone. The resulting prepreg had a gel content of 50% by weight. The other components are the same as those in embodiment 3, and will not be described in detail here.
Comparative example 1
A polyarylate fiber fabric prepreg and a copper-clad plate, which are different from example 3 in that the cyanate ester resin solution includes: 40 parts of bisphenol A type cyanate ester prepolymer, 45 parts of phosphorus-containing epoxy resin, 0.02 part of 2-ethyl-4-methylimidazole, 15 parts of YK-30 phosphorus-containing flame retardant and 80 parts of acetone. The other components are the same as those in embodiment 3, and will not be described in detail here.
Comparative example 2
A polyarylate fiber fabric prepreg and a copper-clad plate are different from example 3 in that the polyarylate fiber fabric is replaced with a glass fiber cloth. The other components are the same as those in embodiment 3, and will not be described in detail here.
TABLE 1 Performance test results of prepregs obtained in examples 1-5 and comparative examples 1-2
As can be seen from Table 1, under the composition ratio defined by the invention, the content of phosphorus in the phosphorus-containing epoxy resin is controlled to be 6-8%, the glue content of the prepreg is controlled to be 50-60% by weight, and the obtained prepreg has a dielectric constant of less than 3.0, a high glass transition temperature and good flame retardance; when the gel content is increased, the dielectric constant is slightly increased, and the flame retardant property is reduced. And when the content of bisphenol A type cyanate ester prepolymer is reduced, the dielectric constant is obviously increased.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A polyarylate fibrous fabric prepreg comprising a polyarylate fibrous fabric impregnated with a cyanate ester resin solution.
The cyanate resin solution comprises the following components in parts by weight: 50-80 parts of bisphenol A type cyanate ester prepolymer, 5-30 parts of phosphorus-containing epoxy resin, 0.01-0.05 part of accelerator, 5-30 parts of phosphorus flame retardant and 30-80 parts of solvent.
2. The polyarylate fibrous fabric prepreg of claim 1, wherein the phosphorous epoxy resin has a phosphorous content of from 6 to 8 percent.
3. The polyarylate fibrous fabric prepreg of claim 1 or 2, wherein the polyarylate fibrous fabric has an areal density of 40 to 120g/m 2 . The fabric form of the polyarylate fiber fabric is plain weave, twill weave or satin weave.
4. A polyarylate fibrous fabric prepreg according to any of claims 1 to 3, wherein the phosphorus-based flame retardant is a phosphorus-containing flame retardant that is soluble in the solvent.
5. The polyarylate fibrous fabric prepreg of claim 1, wherein the accelerator comprises one or more of nonylphenol, triethylamine, 2-ethyl-4-methylimidazole, 1-dimethyl-3-phenylurea, diallylbisphenol a, 2-allylphenol, aluminum acetylacetonate, iron acetylacetonate, nickel acetylacetonate, cobalt acetylacetonate, zinc octoate, tin octoate, and manganese octoate.
6. The polyarylate fibrous fabric prepreg of claim 1, wherein the solvent comprises one or more of acetone, butanone, and propylene glycol methyl ether.
7. A method for preparing the polyarylate fibrous fabric prepreg of any of claims 1-6, comprising: and (3) immersing the polyarylate fiber fabric in the cyanate resin solution, and then drying to obtain the polyarylate fiber fabric prepreg.
8. The method for preparing the polyarylate fiber fabric prepreg according to claim 7, wherein the polyarylate fiber fabric prepreg has a gel content of 50wt% to 80wt%;
the temperature of the drying is 90-130 ℃; the polyarylate fiber fabric is immersed in the cyanate resin solution in a gluing machine, and the speed of the polyarylate fiber fabric is 10-25m/min.
9. The copper-clad plate is characterized by comprising two copper foils and a prepreg arranged between the two copper foils; the prepreg is the polyarylate fiber fabric prepreg according to any one of claims 1-6.
10. The copper-clad plate according to claim 9, wherein the number of semi-cured layers is 1 to 6; the copper-clad plate is obtained through hot pressing, the hot pressing temperature is 160-300 ℃, the hot pressing time is 2-8h, and the hot pressing pressure is 1-50MPa.
CN202310880465.XA 2023-07-18 2023-07-18 Polyarylester fiber fabric prepreg, copper-clad plate and preparation method Pending CN116836548A (en)

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