CN116520649A

CN116520649A - Substrate carrying and exposing device and method, flat panel display and device manufacturing method

Info

Publication number: CN116520649A
Application number: CN202310550171.0A
Authority: CN
Inventors: 青木保夫
Original assignee: Nikon Corp
Current assignee: Nikon Corp
Priority date: 2017-09-29
Filing date: 2017-09-29
Publication date: 2023-08-01
Also published as: JPWO2019064583A1; TWI693663B; KR20220150401A; KR20200040861A; TW202046435A; WO2019064583A1; TW201921572A; KR102458992B1; CN111133383A; JP6813098B2; KR102614210B1; KR20230169480A

Abstract

The present invention provides a substrate conveying device for conveying a substrate to a holding device, and comprising: a first holding portion that holds the substrate above the holding device; a second holding portion that holds a part of the substrate held by the first holding portion; and a driving unit that moves one of the holding device and the second holding unit relative to the other so that the first holding unit is retracted from above the holding device; and the holding device, the first holding portion, and the second holding portion hold the substrate during the relative movement by the driving portion.

Description

Substrate carrying and exposing device and method, flat panel display and device manufacturing method

Related divisional application

The present application is a divisional application of patent application No. 201780095223.2, entitled substrate transfer apparatus, exposure apparatus, method for manufacturing flat panel display, device manufacturing method, substrate transfer method, and exposure method, filed on 2017, 09, and 29.

Technical Field

The invention relates to a substrate conveying device, an exposure device, a manufacturing method of a flat panel display (flat panel display), a device manufacturing method, a substrate conveying method and an exposure method.

Background

In a photolithography step for manufacturing electronic components such as a liquid crystal display device and a semiconductor device, an exposure apparatus for transferring a pattern formed on a mask (or photomask) onto a substrate (a substrate made of glass, plastic, or the like, a semiconductor wafer (wafer), or the like) by using an energy beam has been used.

In such an exposure apparatus, the removal of an exposed substrate from a stage device holding the substrate and the loading of a new substrate onto the stage device are performed. As a method for transporting a substrate, for example, a method described in patent document 1 is known.

Prior art literature

Patent literature

Patent document 1: international publication No. 2013/150787

Disclosure of Invention

According to a first embodiment, there is provided a substrate carrying device that carries a substrate to a holding device, and includes: a first holding portion that holds the substrate above the holding device; a second holding portion that holds a part of the substrate held by the first holding portion; and a driving unit that moves one of the holding device and the second holding unit relative to the other so that the first holding unit is retracted from above the holding device; and the holding device, the first holding portion, and the second holding portion hold the substrate during the relative movement by the driving portion.

According to a second embodiment, there is provided an exposure apparatus including: the substrate carrying device; and an optical system for irradiating the substrate conveyed to the holding device with an energy beam and exposing the substrate.

According to a third embodiment, there is provided a flat panel display manufacturing method including: exposing the substrate by using the exposure device; and developing the exposed substrate.

According to a fourth embodiment, there is provided a device manufacturing method including: exposing the substrate by using the exposure device; and developing the exposed substrate.

According to a fifth embodiment, there is provided a substrate carrying method of carrying a substrate to a holding device, including: holding the substrate by a first holding portion and a second holding portion above the holding device; and moving one of the holding device and the second holding portion and the first holding portion relative to the other so that the first holding portion is retracted from above the holding device; and the holding device, the first holding portion, and the second holding portion hold the substrate during the relative movement.

According to a sixth embodiment, there is provided an exposure method including: transporting the substrate to the holding device by the substrate transporting method; and irradiating the substrate with an energy beam, and exposing the substrate.

According to a seventh embodiment, there is provided a flat panel display manufacturing method including: exposing the substrate by using the exposure method; and developing the exposed substrate.

According to an eighth embodiment, there is provided an element manufacturing method including: exposing the substrate by using the exposure method; and developing the exposed substrate.

The structure of the following embodiment may be modified as appropriate, and at least a part of the structure may be replaced with another structure. Further, the arrangement is not particularly limited, and the constituent elements are not limited to the arrangement disclosed in the embodiments, and may be arranged at positions where the functions thereof can be achieved.

Drawings

Fig. 1 is a diagram schematically showing the configuration of an exposure apparatus according to a first embodiment.

Fig. 2 is a plan view of a stage device and a substrate carrying device included in the exposure apparatus (partially omitted) of fig. 1.

Fig. 3 (a) is a plan view of the platform device according to the first embodiment, fig. 3 (b) is a side view, and fig. 3 (c) is a cross-sectional view of fig. 3 (a) from A-A.

Fig. 4 (a) to 4 (c) are side views (one of them) of an exposure apparatus for explaining a substrate replacement operation according to the first embodiment.

Fig. 5 (a) to 5 (c) are side views (second) of the exposure apparatus for explaining the substrate replacement operation according to the first embodiment.

Fig. 6 (a) to 6 (c) are side views (iii) of an exposure apparatus for explaining a substrate replacement operation according to the first embodiment.

Fig. 7 (a) to 7 (c) are side views (fourth) of an exposure apparatus for explaining a substrate replacement operation according to the first embodiment.

Fig. 8 (a) to 8 (c) are side views (fifth) of an exposure apparatus for explaining a substrate replacement operation according to the first embodiment.

Fig. 9 (a) to 9 (c) are side views of an exposure apparatus for explaining a substrate replacement operation according to a first modification of the first embodiment.

Fig. 10 (a) is a perspective view of a substrate carrier according to a second modification of the first embodiment, and fig. 10 (b) is a side view.

Fig. 11 (a) and 11 (b) are side views of an exposure apparatus for explaining a substrate replacement operation according to a third modification of the first embodiment.

Fig. 12 (a) is a plan view of a substrate carrying-in hand according to a fourth modification of the first embodiment, and fig. 12 (b) is a sectional view A-A of fig. 12 (a).

Fig. 13 (a) and 13 (b) are diagrams for explaining a substrate loading operation performed by a substrate loader according to a fourth modification of the first embodiment.

Fig. 14 (a) and 14 (b) are cross-sectional views schematically showing a substrate carrier according to a fifth modification of the first embodiment.

Fig. 15 (a) and 15 (b) are a top view and a side view, respectively, of an exposure apparatus according to the second embodiment.

Fig. 16 (a) and 16 (b) are perspective views of a substrate carrier according to the second embodiment.

Fig. 17 (a) and 17 (b) are a plan view and a side view, respectively, of an exposure apparatus for explaining a substrate replacement operation according to the second embodiment.

Fig. 18 (a) and 18 (b) are a plan view and a side view, respectively, of an exposure apparatus for explaining a substrate replacement operation according to the second embodiment.

Fig. 19 (a) and 19 (b) are a plan view and a side view, respectively, of an exposure apparatus for explaining a substrate replacement operation according to the second embodiment.

Fig. 20 (a) and 20 (b) are a top view and a side view (fourth) of an exposure apparatus for explaining a substrate replacement operation according to the second embodiment.

Fig. 21 (a) and 21 (b) are a plan view and a side view, respectively, of an exposure apparatus for explaining a substrate replacement operation according to the second embodiment.

Fig. 22 (a) and 22 (b) are a plan view and a side view (sixth) of an exposure apparatus for explaining a substrate replacement operation according to the second embodiment.

Fig. 23 (a) and 23 (b) are a plan view and a side view (seventh) of an exposure apparatus for explaining a substrate replacement operation according to the second embodiment.

Fig. 24 (a) and 24 (b) are a plan view and a side view (eighth) of an exposure apparatus for explaining a substrate replacement operation according to the second embodiment.

Fig. 25 (a) and 25 (b) are diagrams for explaining the advantages of the substrate carrier of the second embodiment.

Fig. 26 (a) and 26 (b) are a top view and a side view, respectively, of an exposure apparatus for explaining a substrate replacement operation according to a first modification of the second embodiment.

Fig. 27 (a) and 27 (b) are a plan view and a side view, respectively, of an exposure apparatus for explaining a substrate replacement operation according to a second modification of the second embodiment.

Fig. 28 (a) and 28 (b) are a plan view and a side view (two) of an exposure apparatus for explaining a substrate replacement operation according to a second modification of the second embodiment.

Fig. 29 (a) and 29 (b) are a top view and a side view, respectively, of an exposure apparatus for explaining a substrate replacement operation according to a second modification of the second embodiment.

Fig. 30 (a) and 30 (b) are a top view and a side view, respectively, of an exposure apparatus for explaining a substrate replacement operation according to a second modification of the second embodiment.

Fig. 31 (a) and 31 (b) are side views of a substrate conveying device for explaining a substrate transfer from a beam unit to a substrate carrier in a third modification of the second embodiment.

Fig. 32 (a) and 32 (b) are a top view and a side view, respectively, of an exposure apparatus for explaining a substrate transfer from a beam unit to a substrate carrier in a fourth modification of the second embodiment.

Fig. 33 (a) and 33 (b) are a top view and a side view, respectively, of an exposure apparatus for explaining a substrate transfer from a beam unit to a substrate carrier in a fourth modification of the second embodiment.

Fig. 34 (a) and 34 (b) are a top view and a side view, respectively, of an exposure apparatus for explaining a substrate transfer from an external conveyance device to a substrate conveyance device according to a fifth modification of the second embodiment.

Fig. 35 (a) and 35 (b) are a plan view and a side view (two) respectively of an exposure apparatus for explaining a substrate transfer from an external conveyance device to a substrate conveyance device according to a fifth modification of the second embodiment.

Fig. 36 is a perspective view showing a substrate carrier according to a sixth modification of the second embodiment.

Fig. 37 (a) and 37 (b) are diagrams illustrating a configuration example of a substrate carrier.

Fig. 38 is a diagram for explaining a configuration example of the substrate conveying section.

Fig. 39 is a diagram for explaining a configuration example of the fixed disk.

Fig. 40 (a) and 40 (b) are a plan view and a side view showing the configuration of the platform device according to the first embodiment, the second embodiment, and modifications thereof, respectively.

Fig. 41 (a) is a plan view showing another example of the platform device, and fig. 41 (b) and 41 (c) are sectional views A-A of fig. 41 (a).

Fig. 42 (a) is a plan view showing another example of the stage device, and fig. 42 (b) is a sectional view A-A of fig. 42 (a).

Fig. 43 (a) to 43 (c) are side views for explaining the placement of a substrate on the stage device shown in fig. 42 (a) and 42 (b).

Description of symbols

10A-10L: exposure apparatus

20A, 20G, 20M, 20N: platform device

28A, 28G, 28M, 28N: substrate holder

100A-100L: substrate carrying device

160A-160L: substrate carrying section

161A to 161L: substrate carrying-in hand

164: x-axis driving device

182A, 182G, 182M: substrate carrying-in and supporting device

184a: holding pad

P, P1, P2, P3: substrate board

Detailed Description

First embodiment

First, a first embodiment of the present invention will be described with reference to fig. 1 to 8 (c).

Fig. 1 schematically shows the structure of an exposure apparatus 10A according to the first embodiment. Fig. 2 is a plan view of the stage device 20A and the substrate transfer device 100A included in the exposure device 10A (partially omitted) of fig. 1. Fig. 3 (a) is a plan view of the stage device 20A, fig. 3 (b) is a side view of the stage device 20A, and fig. 3 (c) is a sectional view A-A of fig. 3 (a).

The exposure apparatus 10A is, for example, a projection exposure apparatus of a step and scan (so-called scanner) system using a rectangular (square) glass substrate P (hereinafter simply referred to as substrate P) as an exposure target for a liquid crystal display (flat panel display) or the like.

As shown in fig. 1, the exposure apparatus 10A includes an illumination system 12, a mask stage 14 for holding a mask M having a pattern such as a circuit pattern formed thereon, a projection optical system 16, a stage device 20A for holding a substrate P having a resist (sensor) applied on a surface (surface facing the +z side in fig. 1), a substrate conveying device 100A, and a control system for these. As shown in fig. 1, the exposure apparatus 10A is set with the X-axis, the Y-axis, and the Z-axis (the optical axes AX of the illumination system 12 and the projection optical system 16) orthogonal to each other, and a description will be given of a manner in which the mask M and the substrate P are scanned relative to the projection optical system 16 in the X-axis direction and the Y-axis is set in the horizontal plane during exposure. The directions of rotation (tilt) about the X-axis, Y-axis, and Z-axis will be described as θx, θy, and θz directions, respectively. The X-axis, Y-axis, and Z-axis positions will be described as X-position, Y-position, and Z-position, respectively.

The illumination system 12 is configured in the same manner as the illumination system disclosed in, for example, us patent No. 5,729,331, and irradiates the mask M with exposure illumination light (illumination light) IL. For example, light including at least one wavelength of i-rays (365 nm), g-rays (436 nm), and h-rays (405 nm) can be used as the illumination light IL. The wavelength of the light source used in the illumination system 12 and the illumination light IL irradiated from the light source is not particularly limited, and may be, for example, ultraviolet light such as ArF excimer laser (wavelength 193 nm) or KrF excimer laser (wavelength 248 nm) or vacuum ultraviolet light such as F2 laser (wavelength 157 nm).

The mask stage 14 holds a light-transmitting mask M. The mask stage 14 is driven by a mask stage driving system (not shown) including a linear motor, for example, at least in the scanning direction (X-axis direction) by a predetermined stroke (stroke). In order to adjust the relative position to at least one of the illumination system 12, the stage device 20A, and the projection optical system 16, the mask stage 14 is driven by a micro-motion driving system that moves the X position or the Y position by a stroke. The position information of the mask stage 14 is obtained by a mask stage position measurement system (not shown) including a linear encoder system or an interferometer system, for example.

The projection optical system 16 is disposed below the mask stage 14. The projection optical system 16 is, for example, a so-called multi-lens type projection optical system having the same configuration as that of the projection optical system disclosed in U.S. Pat. No. 6,552,775 or the like, and includes, for example, a plurality of optical systems telecentric on both sides for forming an erect positive image. Furthermore, the projection optical system 16 may not be a multi-lens system. The projection optical system may be one of those used in a semiconductor exposure apparatus.

In the exposure apparatus 10A, when the mask M located in a predetermined illumination region of the illumination light IL from the illumination system 12 is illuminated, a projection image (partial pattern image) of the pattern of the mask M in the illumination region is formed in the exposure region by the projection optical system 16. Then, the mask M is moved relative to the illumination region (illumination light IL) in the scanning direction, and the substrate P is moved relative to the exposure region in the scanning direction, whereby scanning exposure is performed on the substrate P, and the pattern (the entire pattern corresponding to the scanning range of the mask M) formed on the mask M is transferred.

(platform device 20A)

The stage assembly 20A includes a platen 22, a substrate table 24, a support assembly 26, and a substrate holder 28A.

The fixed platen 22 is formed of a rectangular plate-like member in plan view (viewed from the +z side) arranged such that the upper surface (+z plane) is parallel to the XY plane, and is provided on the floor surface F via a vibration isolator, not shown. The support device 26 is placed on the surface plate 22 in a noncontact state, and supports the substrate table 24 from below in a noncontact manner. The substrate holder 28A is disposed on the substrate stage 24, and the substrate stage 24 and the substrate holder 28A are integrally driven by a stage driving system, not shown, included in the stage device 20A. The platform driving system includes: the coarse movement system includes, for example, a linear motor, etc., and can drive the substrate stage 24 in the X-axis and Y-axis directions (along the upper surface of the fixed platen 22) with a predetermined stroke; and a micro-motion system including, for example, a voice coil motor, for micro-driving the substrate stage 24 in the 6 degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz) direction. The stage device 20A includes a stage measurement system including, for example, an optical interferometer system, an encoder system, and the like, for obtaining positional information of the 6 degrees of freedom directions of the substrate stage 24.

As shown in fig. 3 (a), the substrate P is mounted on the upper surface TS (+z-side surface) of the substrate holder 28A having a rectangular shape in plan view. The aspect ratio of the upper surface TS is substantially the same as the substrate P. As an example, the lengths of the long side and the short side of the upper surface TS are set to be slightly shorter than the lengths of the long side and the short side of the substrate P, respectively.

The upper surface TS of the substrate holder 28A is processed flat over the entire surface. A plurality of minute holes (not shown) for blowing air and minute holes (not shown) for vacuum suction are formed in the upper surface of the substrate holder 28A. The air blowing micro holes and the vacuum sucking micro holes may be used together. The substrate holder 28A may suck air between the upper surface and the substrate P through the plurality of holes by using a vacuum suction force supplied from a vacuum device (not shown), and may suck the substrate P onto the upper surface TS (perform plane correction). The substrate holder 28A is a so-called pin-holding type holder, and a plurality of pins (very small pins having a diameter of, for example, about 1 mm) are arranged at substantially uniform intervals. By having the plurality of pins, the substrate holder 28A can reduce the possibility of holding the substrate P by sandwiching refuse or foreign matter on the back surface thereof, and can reduce the possibility of deformation of the substrate P due to the sandwiching of the foreign matter. The substrate P is held (supported) on the upper surfaces of the plurality of pins. An XY plane formed by the upper surfaces of the plurality of pins is set as the upper surface of the substrate holder 28A. The substrate holder 28A may supply (supply) a pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) between the upper surface TS and the substrate P through the hole portion, thereby keeping the back surface of the substrate P adsorbed to the substrate holder 28A away from the upper surface TS (floating the substrate P). In addition, by using each of the plurality of holes formed in the substrate holder 28A to generate a time difference in timing of supplying the pressurized gas, by appropriately replacing the portions of the hole for vacuum suction and the hole for supplying the pressurized gas, or by appropriately changing the air pressure during suction and air supply, the grounded state of the substrate P can be controlled (for example, air accumulation is not generated between the back surface of the substrate P and the upper surface of the substrate holder 28A).

Further, the substrate holder 28A may perform the plane correction of the substrate in a state supported by the floating without adsorbing the substrate to the upper surface TS. In this case, the substrate holder 28A supplies a pressurized gas (e.g., air) supplied from a pressurized gas supply device (not shown) to the back surface of the substrate P (gas supply) through the hole portion, so that the gas is interposed between the lower surface of the substrate P and the upper surface of the substrate holder 28A (i.e., a gas film is formed). Further, the substrate holder 28A sucks the gas between the substrate holder 28A and the substrate P through the hole for vacuum suction by using a vacuum suction device, and applies a downward force (preload) in the gravity direction to the substrate P, thereby imparting rigidity to the gas film in the gravity direction. The substrate holder 28A may hold (support) the substrate P in a noncontact manner with a slight gap therebetween by balancing the pressure and flow rate of the pressurized gas and the vacuum suction force, and may apply a force (for example, a force for correcting or correcting the flatness) for controlling the flatness of the substrate P. The holes may be formed by machining the substrate holder 28A, or by forming the substrate holder 28A from a porous material, air may be supplied or sucked. The upper surface TS of the substrate holder 28A for floating the substrate P is not a surface on which the hole is formed, and a virtual surface located above the surface by the gap, that is, a lower surface of the substrate subjected to planar correction is set as the upper surface TS.

As shown in fig. 3 (a), for example, two notches 28b are formed on the +x side end of the upper surface TS of the substrate holder 28A, apart from each other in the Y axis direction. As shown in fig. 3 (c), the notch 28b is opened on the upper surface TS of the substrate holder 28A and the side surface on the +x side.

(substrate transfer apparatus 100A)

As shown in fig. 1, the substrate transfer apparatus 100A includes a port (port) unit 150A, a substrate transfer unit 160A, and a transfer apparatus 180A. The port 150A and the substrate transport section 160A are provided on the +x side with respect to the stage device 20A. For example, the substrate P is transferred between an external apparatus (not shown) such as a coater/developer and the exposure apparatus by the substrate transfer apparatus 100A. The substrate carrying section 160A is configured to carry the exposed substrate P (P1) from the substrate holder 28A to the port section 150A, and carry a new substrate P (P2) to be exposed from the port section 150A to the substrate holder 28A. The substrate P2 may be an unexposed (one or more times of unexposed) substrate or a substrate to be subjected to a second or subsequent exposure.

The transfer of the substrate P between the external apparatus and the exposure apparatus 10A is performed by the external transfer apparatus 300, and the external transfer apparatus 300 is disposed outside a chamber (chamber) not shown, for example, in which the illumination system 12, the mask stage 14, the projection optical system 16, the stage apparatus 20A, and the substrate transfer apparatus 100A are housed. The external transfer device 300 has a fork-shaped robot, and can transfer the substrate P placed on the port 150A in the exposure device 10A from the external device. Further, as described above, the substrate conveying portion 160A conveys the substrate P from the port portion 150A to the substrate holder 28A. The external transfer device 300 can transfer the exposed substrate P transferred from the substrate transfer device 100A to the port 150A from the chamber to an external device.

As shown in fig. 2, the port portion 150A includes a beam unit 152, and the beam unit 152 is configured by a plurality (for example, 8 in the first embodiment) of beams 153 arranged at predetermined intervals in the Y-axis direction. A plurality of minute holes (not shown) for blowing out air are formed in the upper surface of each cross member 153. The beam unit 152 may supply (supply) pressurized gas (e.g., air) supplied from a pressurized gas supply device (not shown) between the rear surface of the substrate P and the upper surface of the beam unit 152 via the hole portion, thereby moving the rear surface of the substrate P away from the upper surface of the beam unit 152 (floating the substrate P). The Y-axis direction intervals of the plurality of cross members 153 are set as follows: the substrate P can be supported from below by the beam unit 152, and when the robot arm of the external transfer device 300 and the beam unit 152 are disposed at the same height, the plurality of fingers 310 of the robot arm can be disposed (inserted and removed) between the plurality of beams 153.

The length of each beam 153 in the longitudinal direction (X-axis direction) is slightly longer than the length of the substrate P in the longitudinal direction, and the length in the width direction (Y-axis direction) is set to, for example, about 1/50 of the length of the substrate P in the width direction or about 10 to 50 times the thickness of the substrate P.

As shown in fig. 1, a plurality of cross members 153 (overlapped in the paper depth direction in fig. 1) are supported from below by a plurality of (e.g., 2) bar-shaped legs 154 at positions further inward than both ends in the X-axis direction. The lower end portions of the plurality of legs 154 supporting the cross members 153 are connected to the base 157 via joint portions 155a, and the upper end portions are connected to the cross members 153 via joint portions 155 b. In the substrate conveying apparatus 100A, the positions of the beam unit 152 in the X-axis direction and the Z-axis direction can be integrally changed by a link mechanism including the beam 153, the leg 154, the joint 155a, the joint 155b, and the base 157. The link mechanism is formed in the following way: when the beam unit 152 is stopped at the substrate transfer position with the substrate holder 28A, the upper surface TS of the substrate holder 28A, the upper surface of the offset beam 185a described later, and the upper surface of the beam unit 152 are substantially contained in the same plane.

Referring back to fig. 2, the substrate carrying section 160A has a fork-shaped hand 161A (hereinafter referred to as a substrate carrying-in hand 161A) similar to the external carrying device 300 (see fig. 1 and 2). The substrate carrier 161A has a plurality of (for example, 7 in the first embodiment) fingers 162A, and the plurality of fingers 162A form a holding surface (hereinafter referred to as a substrate holding surface) for holding the substrate P.

The vicinities of the +x side ends of the plurality of fingers 162A are connected to each other by a connecting member 163A. In contrast, the end of the plurality of fingers 162A on the-X side (substrate holder 28A (see fig. 2, etc.) is free, and adjacent fingers 162A are spaced apart on the substrate holder 28A side.

As shown in fig. 1, the substrate holding surface formed by the plurality of fingers 162A is inclined with respect to a holding surface of the substrate holder 28A (hereinafter referred to as a holder substrate holding surface). That is, the substrate carrying-in hand 161A has a substrate holding surface inclined with respect to the holder substrate holding surface of the substrate holder 28A and holding the substrate P (P2). Therefore, the substrate carrying-in hand 161A holds the +x side end of the substrate P2 at a position higher than the-X side end of the substrate P2 (+z side). Regarding the Z position of the substrate carrier 161A, the-X side end of the substrate carrier 161A is closer to the substrate holder 28A than the +x side end. Further, in the vicinity of the tip end portion (-X side) of the plurality of finger portions 162A, the thickness of the finger portions 162A becomes thinner as the tip end portion is closer. In other words, the finger 162A has a conical shape at the tip end portion. Since the plurality of fingers 162A have a conical shape, the-X side end of the substrate P2 can be made closer to the upper surface TS of the substrate holder 28A than in the case where the thickness of the fingers 162A is uniform. In addition, the area of the substrate carrier 161A where the Z position approaches the substrate holder 28A can be reduced, so that the substrate carrier 161A can be less likely to come into contact with the substrate holder 28A.

Like the robot hand (see fig. 2) of the external conveyance device 300, the finger portions 162A of the substrate loading hand 161A are arranged so as not to overlap the cross beam 153 of the cross beam unit 152 in the top view position in the Y-axis direction. A plurality of support pads 164A for supporting the back surface of the substrate P are attached to each finger 162A, and the support pads 164A form a substrate holding surface of the substrate carrying hand 161A. The substrate P may not be supported by the support pad 164A over the entire back surface thereof. The substrate holding surface is formed by a surface virtually connecting the support surfaces of the support pads 164A.

As shown in fig. 2, the connecting member 163A is formed of a hollow member having a rectangular shape in a plan view and a thin thickness, and extends in the Y-axis direction, which is the direction in which the plurality of cross members 153 are arranged. Both ends of the connecting member 163A in the Y axis direction are connected to a pair of X axis driving devices 164 for moving the substrate carrying-in hand 161A in the X axis direction. Further, the pair of X-axis driving devices 164 may be driven independently, or may be mechanically coupled by gears or belts (belts) and driven simultaneously by one driving motor. Alternatively, the connecting member 163A may be configured as follows: the movement in the Y-axis direction is not limited to a pair but is performed by the X-axis driving device 164 on one side. The pair of X-axis driving devices 164 are movable up and down by a Z-axis driving device, not shown. Thus, the substrate carrying-in hand 161A can move between a position (+z side) higher than the upper surface of the beam unit 152 and a position (-Z side) lower than the beam unit 152.

The substrate transport section 160A includes one or more (for example, two in the first embodiment) substrate transport hands 170A. In the first embodiment, the two substrate carrying-out hands 170A are disposed apart from each other in the Y-axis direction.

Each substrate carrying-out hand 170A includes a holding pad 171A. The holding pad 171A may suction and hold the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device not shown.

The substrate carrying-out hand 170A is configured, for example, as an articulated robot or a parallel link robot (parallel link robot), and can change the X position, the Y position, and the Z position of the holding pad 171A.

(carrying device 180A)

The conveying device 180A is a device that cooperates with the substrate conveying section 160A at the time of substrate replacement. In other words, in the exposure apparatus 10A, the substrate P is carried in and carried out of the substrate holder 28A by using the substrate carrying section 160A and the carrying device 180A. In addition, when the substrate P is placed on the substrate holder 28A, the transfer device 180A is also used for positioning the substrate P. The conveying device 180A will be described in detail with reference to fig. 3 (a) to 3 (c).

As shown in fig. 3 (a) to 3 (c), the transfer device 180A includes a pair of substrate carry-in/out holders 182A, a pair of substrate carry-out holders 183A, and an offset beam portion 185.

As shown in fig. 3 (b), the substrate loading and holding device 182A includes a holding pad 184a, an X actuator 186X, and a Z actuator 186Z.

The holding pad 184a is formed of a plate-like member having a rectangular shape in plan view, and is capable of holding the lower surface of the substrate P by suction by vacuum suction supplied from a vacuum apparatus not shown. In addition, as shown in fig. 3 (b), the holding pad 184a may be driven in the Z-axis direction by a Z actuator 186Z. The holding pad 184a and the Z actuator 186Z can be integrally driven in the X axis direction by an X actuator 186X attached to the substrate stage 24.

As shown in fig. 3 (c), the substrate removal holding device 183A includes a holding pad 184b, an X actuator 186X, and a Z actuator 186Z. As shown in fig. 3 (c), a part of the holding pad 184b of one (+y side) substrate carry-out holding device 183A is inserted into one (+y side) notch 28b, for example, of the two notches 28b formed in the substrate holder 28A. In addition, a part of the holding pad 184b of the other (-Y side) substrate carrying-out holder 183A is inserted into the other (-Y side) notch 28 b.

The holding pad 184b is formed of a plate-like member having a rectangular shape in plan view, and is capable of holding the lower surface of the substrate P by suction by vacuum suction supplied from a vacuum apparatus not shown.

As shown in fig. 3 (c), the holding pad 184b may be driven in the Z-axis direction by a Z actuator 186Z. The holding pad 184b and the Z actuator 186Z may be integrally driven in the X axis direction by an X actuator 186X attached to the substrate stage 24. The Z actuator 186Z includes a support column supporting the holding pad 184b, and the support column is disposed outside the substrate holder 28A. The holding pad 184b is driven by the Z actuator 186Z in the notch 28b, and is movable between a position where it contacts the lower surface of the substrate P and can be held, and a position where it is away from the lower surface of the substrate P. The holding pad 184b is movable between a position where a part is accommodated in the notch 28b and a position higher than the upper surface of the substrate holder 28A by the Z actuator 186Z. The holding pad 184b is integrally driven by the X actuator 186X with the Z actuator 186Z, and is movable in the X axis direction.

The offset beam portion 185 includes a plurality (for example, 8 in the first embodiment) of offset beams 185a arranged at predetermined intervals in the Y-axis direction. The offset beam 185a is supported by a support member 185b attached to the substrate stage 24, and is disposed so that its upper surface is substantially flush with the upper surface TS of the substrate holder 28A. A plurality of minute holes (not shown) for blowing out air are formed in the upper surface of the offset beam 185a. The offset beam 185a supplies (supplies) pressurized gas (air) supplied from a pressurized gas supply device (not shown) between the upper surface of the offset beam 185a and the back surface of the substrate P through the hole. Thus, the back surface of the substrate P can be separated from the upper surface of the offset beam 185a (the substrate P can be lifted).

The operation of the handling device 180A will be described in detail below.

The configurations of the substrate carrying-in/holding device 182A and the substrate carrying-out/holding device 183A may be changed as appropriate. For example, in the present embodiment, the respective holding devices 182A and 183A are attached to the substrate stage 24, but not limited thereto, and may be attached to, for example, the substrate holder 28A or an XY stage device (not shown) for driving the substrate stage 24 in the XY plane. The positions and the number of the holders 182A and 183A are not limited to this, and may be attached to, for example, the +y side and the-Y side of the substrate stage 24.

In the exposure apparatus 10A (see fig. 1) configured as described above, the mask M on the mask stage 14 is loaded by a mask loader, not shown, under the management of the main control device, not shown, and the substrate P on the substrate holder 28A is carried in by the substrate carrying device 100A. Then, the main control device performs alignment measurement using an alignment detection system (not shown), and after the alignment measurement is completed, the main control device sequentially performs a step-and-scan exposure operation on a plurality of shot areas set on the substrate P. Since the exposure operation is the same as the exposure operation of the step-and-scan system performed previously, the X direction is set as the scanning direction. Further, detailed description about the exposure operation of the step-and-scan system will be omitted. Then, the substrate P (P1) after the exposure process is completed is carried out from the substrate holder 28A by the substrate carrying device 100A, and another substrate P (P2) to be exposed is carried into the substrate holder 28A, whereby replacement of the substrate P on the substrate holder 28A is performed, and a series of exposure operations for the plurality of substrates P is performed.

(substrate replacement action)

Next, the replacement operation of the substrate P on the substrate holder 28A of the exposure apparatus 10A will be described with reference to fig. 4 to 8. The following substrate replacement operation is controlled by a main control device, not shown. In the side views of fig. 4 to 8 for explaining the substrate replacement operation, the X-axis driving device 164 and the like are omitted as appropriate in order to facilitate understanding of the operation of the substrate conveying section 160A.

In the following description, the substrate holder 28A of the stage device 20A is provided with the exposed substrate P1 in advance, the exposed substrate P1 is carried out, and the carrying-in operation of the substrate P2 different from the substrate P1 on the substrate holder 28A is described. In the drawings of fig. 4 to 8, the direction of operation of the constituent elements is schematically indicated by blank arrows for easy understanding. In addition, the state of sucking gas or supplying gas (supplying gas) is schematically represented by a group of black arrows.

As shown in fig. 4 (a) and 4 (b), before the substrate P2 is transferred to the port 150A by the external transfer device 300, the substrate transfer hand 161A moves so that the upper surface of the substrate transfer hand 161A is positioned below the beam unit 152. At this time, the port 150A rotationally drives the foot 154 in the θy direction. Thus, the substrate carrying-in hand 161A is disposed below the beam unit 152 in the Z direction, so that the robot of the external transfer device 300 can be disposed between the beam unit 152 and the substrate carrying-in hand 161A.

The position of the port 150A is a substrate transfer position with the external transfer device 300.

The robot of the external transport device 300 holding the substrate P2 moves in the-X direction so that the substrate P2 is positioned above the beam unit 152 (+z side). At this time, the Y positions of the robot hand and the beam units 152 of the external conveying device 300 are positioned so that the finger portions of the fork-shaped robot hand included in the external conveying device 300 are positioned in the gaps between the beam units 152 adjacent to each other in the Y-axis direction in a plan view.

Then, as shown in fig. 4 (c), the robot of the external conveyance device 300 is driven to descend, and the fingers of the robot pass through the gaps of the plurality of beams of the beam unit 152, whereby the external conveyance device 300 hands over the substrate P2 onto the beam unit 152. The Z position of the robot hand of the external conveyance device 300 is controlled so as not to contact the substrate conveyance unit 160A standing by below the beam unit 152. Then, the robot arm of the external conveyance device 300 is driven in the +x direction, and is withdrawn from the exposure device 10A.

The substrate transport section 160A moves upward (in the +z direction), and the holding pad 171A of the substrate carry-out hand 170A suctions and holds the lower surface of the substrate P2 on the beam unit 152. Then, as shown in fig. 5 (a), pressurized gas is supplied to each of the plurality of beams 153 included in the beam unit 152 of the port portion 150A, and the pressurized gas is supplied (discharged) from the upper surface of each of the plurality of beams 153 to the lower surface of the substrate P2. Thereby, the substrate P2 is suctioned and supported by the substrate conveying portion 160A, and the substrate P2 floats up with a slight gap (for example, several tens micrometers to several hundreds micrometers) with respect to the beam unit 152. Further, by rotationally driving the leg 154 of the port 150A in the θy direction, the beam unit 152 is moved in the-X direction and the-Z direction.

The holding pad 171A of the substrate carry-out hand 170A that suctions the lower surface of the substrate P2 is suitably driven in the X-axis, Y-axis, and θz directions (3 degrees of freedom directions in the horizontal plane), whereby the position of the substrate P2 with respect to the substrate carry-in hand 161A is adjusted (aligned). The substrate P2 is supported by the beam unit 152 in a noncontact manner, and therefore, the position adjustment (minute amount of movement) in the 3-degree-of-freedom direction in the horizontal plane of the substrate P2 can be performed in a low-friction state. The positional adjustment (alignment) of the substrate P2 described herein may be omitted, and may be controlled in a manner that is optionally performed.

Then, the substrate conveying unit 160A is driven to rise in the +z direction to the position shown in fig. 5 (b). Thereby, the substrate P2 on the beam unit 152 is transferred to the substrate carry-in hand 161A. In other words, the substrate P2 on the beam unit 152 is scooped up from below by the substrate carrying-in hand 161A.

By further rotationally driving the pins 154 in the θy direction, the beam unit 152 is further driven in the-X direction, and is moved to a substrate transfer position with the substrate holder 28A for carrying out the substrate P1 from the substrate holder 28A (the position illustrated in fig. 5 (c)).

In addition, in the stage device 20A, the substrate stage 24 is moved in the +x direction so that the substrate holder 28A on which the exposed substrate P1 is placed at a predetermined substrate replacement position (substrate transfer position with the port 150A) in addition to the transfer operation (including the alignment operation as appropriate) of the substrate P2 from the external conveyance device 300 to the substrate carry-in hand 161A via the port 150A. In the first embodiment, the substrate replacement position of the substrate holder 28A is a position on the-X side with respect to the port portion 150A. In fig. 4 (a) to 5 (b), the substrate holder 28A is shown in the same position for easy understanding, but in the normal operation of the exposure apparatus 10A, the exposure operation for the substrate P1 is performed simultaneously with the transfer operation of the substrate P2 from the external carrier device 300 to the substrate carrier hand 161A, and at this time, the substrate holder 28A is appropriately moved in the X direction and the Y direction.

In addition, the holding pads 184b of the pair of substrate carry-out and holding devices 183A are driven to rise simultaneously with the movement of the substrate holder 28A to the substrate replacement position. The holding pad 184b holds a portion of the substrate P1 held on the upper surface of the substrate holder 28A by vacuum suction from the back surface (a portion disposed on the notch 28b (see fig. 3a and 3 c)).

Then, as shown in fig. 5 (c), the substrate carrier 161A supporting the substrate P2 is moved in the-X direction. Thereby, the substrate carrying-in hand 161A moves to the upper air of the substrate holder 28A positioned at the substrate replacement position. On the other hand, the Z position of the upper surface of the beam unit 152 and the Z position of the upper surface of the substrate holder 28A are set to substantially the same height. When these are set to substantially the same height, the substrate holder 28A may be driven in the Z-axis direction to adjust the height.

In the offset beam portion 185, pressurized gas is ejected from the upper surface of the offset beam 185 a.

In the stage device 20A, pressurized gas is supplied (discharged) from the upper surface of the substrate holder 28A to the lower surface of the substrate P1. Thereby, the substrate P1 floats from the upper surface TS of the substrate holder 28A, and friction between the lower surface of the substrate P1 and the upper surface TS of the substrate holder 28A becomes a low friction state.

Further, in the stage device 20A, the holding pad 184b of the substrate carrying-out and holding device 183A is slightly driven to rise in the +z direction so as to follow the floating operation of the substrate P1, and moves in the +x direction (the port portion 150A side) by a predetermined stroke while sucking and holding a part of the substrate P1. The movement amount of the holding pad 184b (i.e., the substrate P1) is set to, for example, about 50mm to 100 mm. Thus, the +x side end of the substrate P1 is supported by the offset beam 185a in a noncontact manner, and the position of the substrate P1 is offset from the substrate holder 28A in the X direction by a predetermined amount toward the +x direction.

Further, in the stage device 20A, the holding pads 184a of the pair of substrate carrying-in and holding devices 182A are moved in the +x direction by a predetermined stroke.

As shown in fig. 6 (a), the substrate loading hand 161A supporting the substrate P2 is disposed at a predetermined position above the substrate holder 28A. Thus, the substrate P2 is located substantially directly above the substrate holder 28A positioned at the substrate replacement position. At this time, the substrate carrying-in hand 161A and the substrate holder 28A are positioned so that the Y position of the substrate P1 and the Y position of the substrate P2 substantially coincide. In contrast, the substrate P1 and the substrate P2 are disposed at different positions in the X direction. Specifically, since the substrate P1 is offset from the substrate holder 28A toward the +x side as described above, the X positions of the substrates P1 and P2 are relatively different, and the end portion on the-X side of the substrate P2 is disposed (protrudes) further toward the-X side than the end portion on the-X side of the substrate P1. At this time, the substrate P2 on the substrate carrying-in hand 161A may be sucked and held on the lower surface by the substrate carrying-out hand 170A, or may be sucked and held by the finger 162A or held by friction. Furthermore, the notch 28b may not be formed in the substrate holder 28A. As described above, in the case where the lengths of the long side and the short side of the upper surface of the substrate holder 28A are set to be slightly shorter than the lengths of the long side and the short side of the substrate P, the notch 28b may not be formed in the substrate holder 28A as long as the substrate P can be moved in the +x axis direction while the holding pad 184b holds the substrate P protruding from the substrate holder 28A, and the substrate P is offset to the +x side from the upper surface TS of the substrate holder 28A. In this case, plane correction on the substrate holder 28A may also be performed at the end of the substrate P.

Thereafter, as shown in fig. 6 (b), the substrate carrying-in hand 161A is driven in the-Z direction to a position not in contact with the substrate holder 28A. The substrate loading hand 161A brings the-X side end portion of the substrate P2 (a part of the substrate P2) into contact with the holding pad 184a of the substrate loading and holding device 182A. Then, the holding pad 184a suctions and holds a part of the substrate P2 on the substrate carry-in hand 161A from below. The position of the holding pad 184a in the Z-axis direction is a position between the upper surface of the substrate holder 28A and the substrate holding surface of the substrate carrier 161A, and a part of the substrate P2 is sucked and held. When the holding pad 184a adsorbs and holds the substrate P2, the X position and the Y position of the substrate P2 are restrained. This prevents the substrate P2 from moving out of the substrate carrying-in hand 161A. The substrate loading and holding device 182A holds a narrow area of the-X side end of the substrate P2. More specifically, the area is an area where the entire substrate P2 cannot be supported only when the substrate is carried into the supporting device 182A. The X-direction dimension of the finger portion of the substrate carrier 161A is described as being shorter than the X-direction dimension of the substrate P2, but may be the same or longer. In this case, the holding pad 184a may hold the finger portion of the substrate carrying-in hand 161A and the region between the finger portions.

In addition, the substrate carrying-out hand 170A, which releases the suction gripping of the substrate P2, is driven simultaneously with the suction holding operation of the holding pad 184a on the substrate P2, and the lower surface of the portion of the substrate P1, which is offset to the +x side from the substrate holder 28A, is sucked and gripped. In addition, the beam unit 152 ejects pressurized gas.

Then, as shown in fig. 6 (c), the substrate conveying portion 160A is moved in the conveying-out direction (+x direction) in a state where the holding pad 184a of the substrate conveying-in and holding device 182A holds a part (-X side end) of the substrate P2 by suction. In this case, the finger 162A of the substrate carrier 161A may supply (discharge) pressurized gas to the lower surface of the substrate P2 to reduce the contact friction.

The substrate transport section 160A is driven in the transport direction (+x direction), and the substrate transport hand 170A holding the substrate P1 is driven in the +x direction. Thereby, the substrate P1 moves from the substrate holder 28A onto the port portion 150A (beam unit 152). At this time, since the pressurized gas is discharged from the upper surfaces of the beams 153 of the beam unit 152, the substrate P1 is carried out from the substrate holder 28A in a state (a state of floating up) in which it is not in contact with the substrate holder 28A and the port portion 150A. The holding pads 184b of the pair of substrate carrying-out holders 183A are driven in the-Z direction and the-X direction so that a part thereof is accommodated in the notch 28b (see fig. 3A and 3 c) of the substrate holder 28A.

As shown in fig. 6 (c) and fig. 7 (a) to 7 (c), the substrate carrying-in hand 161A is moved in the +x direction, whereby the substrate carrying-in hand 161A is moved in the X direction relative to the substrate P2 held by the holding pad 184 a. Then, as shown in fig. 7 (c), the substrate carrying-in hand 161A is moved to the +x side with respect to the substrate holder 28A in the X direction, whereby the substrate carrying-in hand 161A is retracted from the upper space (+space on the Z side) of the substrate holder 28A and the lower space (-space on the Z side) of the substrate P2. In other words, the substrate carrying-in hand 161A is moved to the +x side with respect to the substrate holder 28A, and thereby is retracted from the space between the substrate P2 held by the holding pad 184a and the substrate holder 28A. When the substrate carrying-in hand 161A moves to the +x side with respect to the substrate holder 28A, it moves to a position above the substrate holder 28A, i.e., a position higher than the upper surface of the substrate holder 28A in the Z position. In this way, by retracting the substrate carrier 161A from the space between the substrate P2 and the substrate holder 28A, the substrate P2 is transferred from the substrate carrier 161A to the substrate holder 28A. That is, the substrate P2 is carried into the substrate holder 28A from the substrate carrying-in hand 161A. In the substrate P2, the region between the substrate carry-in hand 161A and the holding pad 184a is held by the substrate holder 28A.

Here, the holding pads 184a absorb and hold a part of the substrate P2, thereby fixing the relative position of the substrate P2 with respect to the substrate holder 28A in the X direction and the Y direction, or restricting the relative position to a predetermined minute movable range. The predetermined movable range is set by the driving range of the holding pad 184a with respect to the substrate holder 28A (or the substrate stage 24). The holding pad 184a may not necessarily be provided on the substrate table 24 (or the substrate holder 28A) as long as it has a function of setting the relative position (relative movable range) of the substrate P2 with respect to the substrate holder 28A in at least one of the X-direction and the Y-direction, and may be configured to be suspended from the upper space of the substrate holder 28A by a structure such as a column (not shown) provided in the exposure apparatus 10A. Further, in this case, the holding pad 184a may hold the upper surface of the substrate P2.

As described above, the substrate carrying-in hand 161A moves relative to the substrate holder 28A in the +x direction, that is, in the direction parallel to the substrate holding surface of the substrate holder 28A along the substrate holding surface of the substrate holder 28A, thereby retreating from below the substrate P2, and as a result, a part of the substrate P2 is gradually placed on the substrate holder 28A in order from the-X side. At this time, the area of the substrate P2 held by the substrate carry-in hand 161A decreases, and the area of the substrate P2 supported by the holder substrate holding surface of the substrate holder 28A increases. Thus, in at least a part of the period from the movement of the front end portion on the-X side of the substrate carrying-in hand 161A to the +x side of the substrate holder 28A (i.e., the period from the time when the substrate carrying-in hand 161A is completely retracted from the space between the substrate holder 28A and the substrate P2), the substrate carrying-in hand 161A, the substrate holder 28A, and the holding pad 184a simultaneously support (or hold) mutually different portions of the substrate P2, respectively. In other words, during the at least a part of the period, substantially the entire surface of the substrate P2 is supported by the substrate carrying-in hand 161A, the substrate holder 28A, and the holding pad 184a (any portion of the substrate P2 is supported by any one of the substrate carrying-in hand 161A, the substrate holder 28A, and the holding pad 184 a). The support (or holding) of the substrate P2 by the substrate carrier 161A and the substrate holder 28A is not limited to the contact state, and may be a support (or holding) in a non-contact state with a gas (air gap) interposed therebetween.

In the period from the movement of the front end portion on the-X side of the substrate carrying-in hand 161A to the +x side of the substrate holder 28A as described above, the position (Z position) in the Z-axis direction of the portion of the substrate P2 supported by the substrate carrying-in hand 161A (the direction perpendicular to the holder substrate holding surface of the substrate holder 28A) is higher than the Z position of the portion of the substrate P2 held by the holding pad 184 a. As described above, the substrate carrying-in hand 161A is retracted in the +x direction from the space between the substrate P2 and the substrate holder 28A, and the position (Z position) in the Z axis direction of the supported portion of the substrate P2 supported by the substrate holder 28A gradually decreases. When the flexibility of the substrate P2 is low (the substrate P2 is rigid and hard to flex), the Z position of the portion of the substrate P2 supported by the substrate carrier 161A gradually decreases as the substrate carrier 161A is retracted so that the portion of the substrate P2 held by the holding pad 184a is landed on the substrate holder 28A as an axis to make a circular motion in the θy direction. Further, the position (X position) in the X-axis direction of the supported portion of the substrate P2 supported by the substrate holder 28A gradually moves in the +x direction.

As described above, when the substrate P2 is gradually placed on the substrate holder 28A in order from the-X side with the substrate carrying-in hand 161A retreating from below the substrate P2, the position of the substrate P2 with respect to the substrate holder 28A is measured by a position measuring device not shown. Based on the measurement results, the holding pads 184a of the pair of substrate carry-in and holding devices 182A are driven in at least one of the X-axis direction and the Y-axis direction. Thereby, the X-axis direction position, Y-axis direction position, and θz direction angles of the substrate P2 with respect to the substrate holder 28A are adjusted. In the case of performing the rotation adjustment in the θz direction, the holding pads 184a may be driven by different amounts. The position measuring device (not shown) may be disposed in at least one of a stage device 20A (for example, a substrate holder 28A, a substrate stage 24) and a structure such as a cylinder (not shown) provided in the exposure device 10A.

As shown in fig. 8 (a), the substrate P2 transferred from the substrate loading hand 161A to the substrate holder 28A is placed on the substrate holder 28A except for the portion sucked and held by the holding pad 184 a. Further, the holding pad 184a may be driven in the Z-axis direction to assist the transfer of the substrate P2 to the substrate holder 28A. At this time, the supply (ejection) of the pressurized gas from the substrate holder 28A becomes air resistance, and the substrate P2 can be prevented from directly colliding against the substrate holder 28A, and breakage of the substrate P2 can be prevented. In addition, even if the supply (ejection) of the pressurized gas from the substrate holder 28A is not performed, the air between the upper surface of the substrate holder 28A and the substrate P2 becomes air resistance, and the above-described effects can be obtained. Then, the supply (ejection) of the pressurized gas from the substrate holder 28A is stopped, whereby the substrate P2 lands on the upper surface TS of the substrate holder 28A, and comes into contact with the upper surface TS. Thus, the X-axis direction position, Y-axis direction position, and θz direction angle of the substrate P2 with respect to the substrate holder 28A do not change.

In addition, the beam unit 152 stops the ejection of the pressurized gas to the substrate P1. The substrate carrying-out hand 170A releases the grip of the substrate P1.

After the substrate carrying-out hand 170A releases the grip of the substrate P1, the substrate carrying section 160A is driven to rise. The beam unit 152 on which the substrate P1 is mounted is moved to a substrate transfer position with the external transfer device 300.

As shown in fig. 8 (b), when the substrate P2 is placed on the substrate holder 28A, the holding pad 184a releases the suction grip of the substrate P2 and moves in the-X direction so as to retract from below the substrate P2. Thereby, the portion of the substrate P2 held by the holding pad 184a is placed on the upper surface of the substrate holder 28A.

The robot arm of the external conveyance device 300 is driven in the-X direction at a Z position lower than the beam unit 152, and is disposed below the beam unit 152.

Then, as shown in fig. 8 (c), the stage device 20A moves to a predetermined exposure start position in a state where the substrate P2 is suctioned and held by the substrate holder 28A. The operation of the stage device 20A during the exposure operation of the substrate P2 will not be described.

On the other hand, the robot of the external conveyance device 300 moves upward, and scoops the substrate P1 on the beam unit 152 from below. The robot of the external transport device 300 holding the exposed substrate P1 moves in the +x direction and withdraws from the exposure device 10A.

Then, in the port 150A, the beam unit 152 is moved in the-X direction to avoid contact with the substrate carrier 161A, and the substrate carrier 161A is moved in the +x direction.

After the exposed substrate P1 is transferred to an external device (not shown) such as a coater/developer, the robot of the external transport device 300 holds a predetermined substrate P3 to be exposed after the substrate P2 and moves the substrate P3 to the port 150A.

Then, as described in fig. 4 (a), before the new substrate P3 is transferred to the port 150A by the external transfer device 300, the substrate transfer unit 160A is moved downward (moved in the-Z direction) so that the upper surface of the substrate transfer hand 161A is positioned below the lower surface of the beam unit 152. By repeating the operations shown in fig. 4 (a) to 8 (c), exposure operations and the like can be continuously performed on a plurality of substrates P.

As described in detail above, the substrate P2 is held by the substrate carrier 161A and the holding pad 184a from the state held only by the substrate carrier 161A. Then, as the substrate carrier 161A moves relative to the substrate holder 28A, the substrate P2 is held by the substrate carrier 161A, the substrate carrier 182A, and the substrate holder 28A. Then, as shown in fig. 7 (c), when the substrate carrying-in hand 161A is moved to a position where the X-axis direction position of the substrate carrying-in hand 161A does not overlap the substrate holder 28A, the substrate P2 is held by the substrate carrying-in holding device 182A and the substrate holder 28A, and finally is held only by the substrate holder 28A. The substrate P2 is carried into the substrate holder 28A in a state held by any one of the substrate carrying-in hand 161A, the substrate holder 28A, and the holding pads 184 a.

As described in detail above, at least a part of the operations of carrying out the substrate P1 from the substrate holder 28A and carrying in the substrate P2 to the substrate holder 28A can be performed simultaneously, so that the substrate replacement time for the substrate holder 28A can be shortened. In addition, when the substrate P2 is carried into the substrate holder 28A, the substrate carrying-in hand 161A moves above the substrate holder 28A (+space on the Z side), so that the substrate carrying-in hand 161A can be driven quickly without causing interference in the moving path. This makes it possible to quickly carry the substrate P2 into the substrate holder 28A, and thus to shorten the substrate replacement time. Further, by the operation of moving the substrate carrying-in hand 161A to the +x side above the substrate holder 28A, the substrate P2 can be carried in to the substrate holder 28A while the substrate P1 is carried out from the substrate holder 28A. That is, since a common drive system is used for both the substrate carrying-in and the substrate carrying-out, it is not necessary to provide different drive systems for both the substrate carrying-in and the substrate carrying-out, and the number of drive systems can be reduced.

As described in detail above, according to the present first embodiment, the substrate conveying apparatus 100A for conveying the substrate P2 to the substrate holder 28A includes: a substrate carry-in hand 161A for holding the substrate P2 above the substrate holder 28A; a substrate loading and holding device 182A for holding a part of the substrate P2 held by the substrate loading hand 161A; and an X-axis driving device 164 for moving one of the substrate holder 28A, the substrate loading and holding device 182A, and the substrate loading hand 161A relative to the other so that the substrate loading hand 161A withdraws from above the substrate holder 28A; the substrate holder 28A, the substrate carrier 161A, and the substrate carrier 182A hold the substrate P2 during the relative movement by the X-axis driving device 164. Accordingly, since the substrate P2 is gradually placed on the substrate holder 28A in order from the end on the-X side (the side opposite to the port 150A), the substrate holder 28A or the substrate P2 is not easily damaged, and dust generated by contact is reduced. In addition, air accumulation is less likely to occur between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to wrinkle. In addition, the substrate P2 can be prevented from moving on the substrate holder 28A. Further, the placement of the substrate holder 28A of the substrate P2 may be controlled (for example, the placement is stopped in the middle) according to the retreat condition (speed and position) of the substrate carrying-in hand 161A. Therefore, the pressurized gas may not be injected from the substrate carrier 161A to the substrate P2 to reduce friction. In addition, a mechanism for driving the substrate loading and holding device 182A up and down may be omitted.

Further, according to the first embodiment, the substrate conveying apparatus 100A for conveying the substrate P2 to the holder substrate holding surface of the substrate holder 28A includes: a substrate carrying-in hand 161A provided above the holder substrate holding surface for holding the substrate P2 in a state in which a distance between a part of the substrate P2 and the holder substrate holding surface is shorter than a distance between the other part of the substrate P2 and the holder substrate holding surface; a substrate loading and holding device 182A for holding other parts of the substrate P2 held by the substrate loading hand 161A; and an X-axis driving device 164 for relatively moving the substrate holder 28A, the substrate loading and holding device 182A, and the substrate loading hand 161A in a direction along the substrate holding surface of the holder so that the substrate loading hand 161A withdraws from above the substrate holder 28A. Thus, the substrate P2 can be placed on the substrate holder 28A gradually from the end of the-X side (the side opposite to the port 150A), so that the substrate holder 28A or the substrate P2 is not easily damaged, and dust generated by contact is reduced. In addition, air accumulation is less likely to occur between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to wrinkle. In addition, the substrate P2 can be prevented from moving on the substrate holder 28A. Further, the placement of the substrate holder 28A of the substrate P2 may be controlled (for example, the placement is stopped in the middle) according to the retreat condition (speed and position) of the substrate carrying-in hand 161A. Therefore, the pressurized gas may not be injected from the substrate carrier 161A to the substrate P2 to reduce friction. In addition, a mechanism for moving the substrate loading and holding device 182A up and down may be omitted.

Further, according to the first embodiment, the substrate conveying device 100A for conveying the substrate P2 to the holder substrate holding surface of the substrate holder 28A capable of holding the substrate P2 includes: a substrate carry-in hand 161A having a substrate holding surface for holding the substrate P2 above the substrate holder 28A; a substrate loading and holding device 182A for holding a part of the substrate P2 held by the substrate loading hand 161A at a position between the holder substrate holding surface and the substrate holding surface in the up-down direction; and an X-axis driving device 164 for moving the substrate holder 28A and the substrate loading and holding device 182A relative to the substrate loading and holding device 161A in a state where the substrate loading and holding device 182A holds a part of the substrate P2 so that the substrate loading and holding device 161A is retracted from above the substrate holder 28A. Thus, the substrate P2 can be placed on the substrate holder 28A gradually from the end of the-X side (the side opposite to the port 150A), so that the substrate holder 28A or the substrate P2 is not easily damaged, and dust generated by contact is reduced. In addition, air accumulation is less likely to occur between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to wrinkle. In addition, the substrate P2 can be prevented from moving on the substrate holder 28A. Further, the placement of the substrate holder 28A of the substrate P2 may be controlled (for example, the placement is stopped in the middle) according to the retreat condition (speed and position) of the substrate carrying-in hand 161A. Therefore, the pressurized gas may not be ejected from the substrate carrier 161A to the substrate P2 to reduce friction. In addition, a mechanism for moving the substrate loading and holding device 182A up and down may be omitted.

Further, according to the present first embodiment, the substrate transfer apparatus 100A for transferring the substrate P2 to the holder substrate holding surface of the substrate holder 28A includes: a substrate carry-in hand 161A for holding the substrate P2 above the substrate holder 28A; a substrate loading and holding device 182A for holding a part of the substrate P2 held by the substrate loading hand 161A; and an X-axis driving device 164 for relatively moving the substrate holder 28A, the substrate loading and holding device 182A, and the substrate loading hand 161A in a predetermined direction along the substrate holding surface of the holder so that the substrate loading hand 161A withdraws from above the substrate holder 28A; the substrate carrying-in hand 161A holds the substrate P2 so that the position in the vertical direction of the region held by the substrate carrying-in hand 161A in the substrate P2 approaches the substrate holder 28A during the relative movement by the X-axis driving device 164. Thus, the substrate P2 can be placed on the substrate holder 28A gradually from the end of the-X side (the side opposite to the port 150A), so that the substrate holder 28A or the substrate P2 is not easily damaged, and dust generated by contact is reduced. In addition, air accumulation is less likely to occur between the substrate holder 28A and the substrate P2, and the substrate P2 is less likely to wrinkle. In addition, the substrate P2 can be prevented from moving on the substrate holder 28A. Further, the placement of the substrate holder 28A of the substrate P2 may be controlled (for example, the placement is stopped in the middle) according to the retreat condition (speed and position) of the substrate carrying-in hand 161A. Therefore, the pressurized gas may not be ejected from the substrate carrier 161A to the substrate P2 to reduce friction. In addition, a mechanism for moving the substrate loading and holding device 182A up and down may be omitted.

In the first embodiment, the substrate holding surface of the substrate carrying hand 161A is inclined with respect to the holder substrate holding surface. Accordingly, when the substrate carrier 161A is retracted from between the substrate P2 and the substrate holder 28A, the substrate carrier 161A is retracted in a direction away from the lower surface of the inclined substrate P2 (a direction different from the wiring direction of the lower surface of the substrate P2), so that contact wear can be reduced.

In the first embodiment, the X-axis driving device 164 moves one of the substrate holder 28A, the substrate loading and holding device 182A, and the substrate loading hand 161A relative to the other in a direction along the holding surface of the substrate holder 28A for holding the substrate P2. As a result, the substrate carrying-in hand 161A is retracted in a direction away from the lower surface of the inclined substrate P2 (a direction different from the wiring direction of the lower surface of the substrate P2), and contact wear can be reduced.

In the first embodiment, the X-axis driving device 164 moves the substrate carrying hand 161A in a direction parallel to the holder substrate holding surface of the substrate holder 28A. As a result, the substrate carrying-in hand 161A is retracted in a direction away from the lower surface of the inclined substrate P2 (a horizontal direction different from the wiring direction of the lower surface of the substrate P2), and contact wear can be reduced.

(first modification)

The first modification is an example in which the configuration of the substrate transport apparatus is changed. Specifically, the substrate transfer apparatus 100B of the exposure apparatus 10B according to the first modification includes a drive system that switches between a state in which the upper surface of the substrate transfer hand 161A is parallel to the holder substrate holding surface of the substrate holder 28A and a state in which the upper surface of the substrate transfer hand 161A is inclined with respect to the holder substrate holding surface of the substrate holder 28A.

The replacement operation of the substrate P on the substrate holder 28A of the substrate transfer apparatus 100B according to the first modification will be described with reference to fig. 9 (a) to 9 (c).

The state of fig. 9 (a) shows a state in which the stage device 20A is placed at the substrate transfer position with the port 150A after the state of fig. 5 (a) in the first embodiment.

As shown in fig. 9 (a), the substrate P2 is placed on the substrate carrier 161A. At this time, the upper surface of the substrate carry-in hand 161A is parallel to the holder substrate holding surface of the substrate holder 28A.

Then, as shown in fig. 9 (b), the substrate carrying-in hand 161A for supporting the substrate P2 from below is driven in the-X direction while the upper surface of the substrate carrying-in hand 161A is kept substantially parallel to the holder substrate holding surface of the substrate holder 28A. The operations of the stage device 20A, the substrate carrying-in/out support device 182A, the substrate carrying-out support device 183A, and the offset beam 185a are the same as those described in fig. 5 (c), and therefore, description thereof is omitted.

Then, the substrate carrying-in hand 161A supporting the substrate P2 from below is disposed at a predetermined position above the substrate holder 28A.

Then, as shown in fig. 9 (c), the substrate carrying-in hand 161A is driven to rise and the front end thereof is driven to incline downward. That is, the substrate carrier 161A is driven such that the upper surface of the substrate carrier 161A is inclined with respect to the holder substrate holding surface of the substrate holder 28A. Thus, the front end of the substrate P2 contacts the holding pad 184a of the substrate carry-in and holding device 182A. The holding pad 184a holds the vicinity of the-X side end of the substrate P2 by suction. The substrate carrying-in hand 161A may be set as follows: even if driven with the front end inclined downward, the substrate moves in the-X direction while being held parallel to the holder substrate holding surface of the substrate holder 28A at the Z position where the front end does not come into contact with the upper surface of the substrate holder 28A.

The following operations are basically the same as those of the first embodiment, and therefore, description thereof will be omitted.

According to the first modification, at the time of transferring the port 150A and the substrate P2 of the substrate carrying-in hand 161A, the substrate P2 can be transferred from one to the other in a state in which the substrate mounting surface of the port 150A is parallel to the upper surface of the substrate carrying-in hand 161A, so that the possibility of breakage of the substrate P2 at the time of substrate transfer can be reduced.

In addition, when the substrate carrying-in hand 161A for supporting the substrate P2 from below is moved in the-X direction, the distance between the port 150A and the substrate holder 28A and the substrate carrying-in hand 161A in the Z direction can be extended. As a result, when the substrate carrier 161A is moved in the-X direction, the port 150A and/or the substrate holder 28A may be less likely to come into contact with the substrate carrier 161A.

The substrate carrier 161A may be moved relative to the substrate holder 28A in the +x direction while gradually changing the inclination angle between the upper surface of the substrate carrier 161A and the holder substrate holding surface of the substrate holder 28A.

As in the first modification, the substrate holding surface of the substrate carrier 161A may be inclined with respect to the holder substrate holding surface of the substrate holder 28A by inclining the substrate carrier 161A.

(second modification)

The second modification is an example in which the shape of the finger portion of the substrate carrying-in finger is changed. Fig. 10 (a) is a perspective view of a substrate carrier 161C according to a second modification, and fig. 10 (b) is a side view of the substrate carrier 161C according to the second modification.

As shown in fig. 10 (a) and 10 (b), in the substrate carrying-in hand 161C of the second modification, the finger 162C has an XZ triangular cross-sectional shape in which the +x side end portion is thicker and the closer to the-X side end portion is, the thinner.

Note that, the replacement operation of the substrate on the substrate holder 28A is the same as that of the first embodiment, and therefore, the description thereof is omitted.

As in the second modification, the finger portion of the substrate carrying-in hand may have an XZ triangular cross-section shape in which the +x side end portion is thick and the thickness becomes thinner as the-X side end portion is closer. By this, the rigidity of the finger portions of the substrate carrying-in hand is increased, so that the shake of the substrate carrying-in hand 161C when the substrate carrying-in hand 161C is moved and the contact of the substrate carrying-in hand 161C with the substrate holder 28A due to the shake can be reduced. In addition, the driving mechanism for tilting the substrate carrying-in hand 161A with respect to the substrate holder 28A (see fig. 9 (c)) as in the first modification may be omitted.

(third modification)

In the first embodiment, the substrate carrier is moved to a predetermined position above the substrate holder 28A, and then moved downward, so that the tip of the substrate P2 is brought into contact with the holding pad 184a of the substrate carrier 182A. In the third modification, the front end of the substrate P2 is brought into contact with the holding pad 184a of the substrate carry-in and carry-out holder 182A by using the substrate carry-out hand 170A.

The replacement operation of the substrate P on the substrate holder 28A of the substrate transfer apparatus 100D according to the third modification will be described with reference to fig. 11 (a) and 11 (b). Fig. 11 (a) corresponds to the state of fig. 6 (a) of the first embodiment, and fig. 11 (b) corresponds to the state of fig. 6 (b) of the first embodiment.

As shown in fig. 11 (a) and 11 (b), in the substrate transport apparatus 100D according to the third modification, the substrate transport section 160D includes a substrate carry-in hand 161C and a substrate carry-out hand 170A according to the second modification.

As shown in fig. 11 (a), in the third modification, the substrate transfer position between the substrate carrying-in hand 161C and the stage device 20A is located on the +x side from the substrate transfer position of the substrate carrying-in hand 161A in fig. 6 (a).

When the substrate carrying-in hand 161C reaches the substrate transfer position, as shown in fig. 11 (b), the substrate carrying-out hand 170A holding the lower surface of the substrate P2 is driven to extend the arm. Thus, the substrate P2 slides down along the substrate carrier 161C, and the tip of the substrate P2 contacts the holding pad 184a of the substrate carrier 182A.

In this case, in order to smooth the movement of the substrate, the support pad 164D attached to the upper surface of the finger 162C of the substrate carrying-in hand 161C is preferably in a rod shape extending in the extending direction of the finger 162C. In addition, when the substrate P2 is slid, pressurized gas may be ejected from the support pad 164D.

The substrate transport section 160D may also include a plurality of substrate carrying-out hands 170A. The front end of the substrate P2 may be brought into contact with the holding pad 184a by a part of the plurality of substrate carry-out hands 170A, and the exposed substrate P1 on the substrate holder 28A may be held by the remaining substrate carry-out hands 170A. Thus, when the front end of the substrate P2 is held by the holding pad 184a and the exposed substrate P1 is held by the remaining substrate carry-out hand 170A, the substrate carry-in hand 161C can be moved in the +x direction, and the substrate carry-in operation and the substrate carry-out operation can be performed simultaneously.

According to the third modification, the substrate P2 alone is lowered by the substrate carrying-out hand 170A without moving the entire substrate carrying portion 160D, so that positioning can be performed more easily and accurately than moving the entire substrate carrying portion 160D. In addition, the stroke of the substrate conveying unit 160D in the X-axis direction can be shortened. Further, since the substrate P2 is deflected by the action of gravity, even if the moving distance in the X-axis direction of the substrate carrying-in hand 161C is made shorter than the horizontal moving distance of the substrate P2 due to the gradient of the substrate carrying-in hand 161C, the front end of the substrate P2 can be brought close to the holding pad 184a of the substrate carrying-in holding device 182A.

In the description of fig. 11 (a) and 11 (b), the substrate carrier 161C according to the second modification is used, but the substrate carrier 161A according to the first embodiment may be used.

(fourth modification)

The fourth modification is an example in which the structure of the substrate carrier is changed. Fig. 12 (a) is a plan view of a substrate carrying-in hand 161E according to a fourth modification, and fig. 12 (b) is a cross-sectional view of fig. 12 (a) through a.

As shown in fig. 12 (a), among the plurality of fingers 162E of the substrate carrying hand 161E, the fingers 162E1 at both ends in the Y axis direction include a belt portion 166. As shown in fig. 12 (b), the belt portion 166 includes a belt 166a and a pair of pulleys 166b. The belt 166a is disposed substantially parallel to the upper surface of the finger 162E1 so as to be in contact with the back surface of the substrate P2 and so that the upper surface thereof is substantially flush with the upper surface of the support pad 164E provided on the finger 162E 1. The belt 166a is made of a material having a high coefficient of friction, which is difficult to slide, and is made of, for example, a material obtained by coating stainless steel with urethane, silica, rubber, or soft polyvinyl chloride (Poly Vinyl Chloride, PVC), or the like.

Fig. 13 (a) and 13 (b) are diagrams showing operations of loading the substrate P2 into the substrate holder 28A by using the substrate loading hand 161E.

As shown in fig. 13 (a), after the front end of the substrate P2 is brought into contact with the holding pad 184a of the substrate carry-in and holding device 182A, the substrate carry-in hand 161E is moved relative to the substrate holder 28A in the +x direction in a state where the holding pad 184a holds the front end of the substrate P2. Then, since the belt 166a is made of a material having a large friction coefficient, as shown in fig. 13 (b), the belt 166a in contact with the substrate P2 is circulated by the pair of pulleys 166b as the substrate P2 moves relative to the substrate carry-in hand 161E. Thereby, the belt 166a is inclined downward on the substrate carrying hand 161E while maintaining the Y-axis direction position of the constraining substrate P2. Therefore, the substrate P2 is carried into the substrate holder 28A in a state of being restrained by the belt 166a immediately before the entire substrate P2 is separated from the substrate carrying-in hand 161E.

In the first embodiment and the first to third modifications, the substrate carrying-in hand is moved (retracted) in the +x direction while the holding pad 184a of the substrate carrying-in holder 182A holds the-X side end portion of the substrate P2 (for example, (c) of fig. 6, etc.). At this time, the portion other than the-X side end portion of the substrate P2 is in a state where the movement in the Y-axis direction is not restricted before being supported by the substrate holder 28A.

On the other hand, in the fourth modification, while the substrate carrying-in hand 161E is moved in the +x direction while the holding pad 184a holds the-X side end of the substrate P2, the substrate P2 is placed on the substrate holder 28A while the substrate carrying-in hand 161E holds the +x side end and restricts the movement in the Y axis direction. Therefore, according to the fourth modification, the substrate P2 can be restrained immediately before the entire substrate P2 leaves the substrate carry-in hand 161E, so that the placement deviation of the substrate P2 can be prevented.

The belt 166 may be fed by a motor or the like. In this case, the tape 166a may be fed out in synchronization with the timing of retracting the substrate carrying-in hand 161E. In addition, in this case, the belt 166a may not be an endless belt. Further, when the respective belts 166a provided in the finger portions 162E1 at the both ends are independently moved, the relative position of the substrate P2 with respect to the substrate holder 28A can be adjusted (aligned) on the substrate carrying-in hand 161E.

(fifth modification)

The fifth modification changes the configuration of the finger portion of the substrate carrying-in hand. Fig. 14 (a) and 14 (b) are cross-sectional views schematically showing a substrate carrier 161F according to a fifth modification.

As shown in fig. 14 (a), the finger 162F of the substrate carrying-in hand 161F has a first finger 162F1 and a second finger 162F2. The first finger 162F1 is hollow, and a wire rope 169A for moving the second finger 162F2 is disposed inside. The second finger 162F2 is coupled to the first finger 162F1 via a pin 169B or the like so as to be rotatable about the Y axis. Further, a wire rope 169A is connected to the second finger 162F2. By moving the wire rope 169A by a driving device not shown, the second finger 162F2 rotates about the Y axis with the pin 169B as a fulcrum. Thus, only a partial region of the substrate P2 held by the second finger 162F2 can be inclined with respect to the holder substrate holding surface of the substrate holder 28A.

Other structures are the same as those of the first embodiment, and therefore, description thereof is omitted.

The substrate carrying hand 161F may not have a driving mechanism using the wire rope 169A, and may be configured to tilt the second finger 162F2 with respect to the first finger 162F 1.

According to the fifth modification, the driving mechanism for tilting the substrate carrying-in hand 161A (see fig. 9 (c)) as in the first modification may be omitted. In addition, the tip end portion of the second finger 162F2 may be thinned.

Second embodiment

Next, an exposure apparatus according to a second embodiment will be described with reference to fig. 15 (a) to 25 (b). The configuration of the exposure apparatus 10G according to the second embodiment is the same as that of the first embodiment except that the configuration and operation of a part of the substrate transport apparatus are different, and therefore only the differences will be described below, and elements having the same configuration and functions as those of the first embodiment will be denoted by the same reference numerals as those of the first embodiment, and the description thereof will be omitted.

Fig. 15 (a) and 15 (b) are a top view and a side view, respectively, of an exposure apparatus 10G according to the second embodiment. Fig. 16 (a) and 16 (b) are perspective views of a substrate carrier 161G according to the second embodiment.

(platform device 20G)

In the first embodiment, the substrate holder 28A includes the notch 28b (see fig. 3 (a) and 3 (c)) for accommodating the holding pad 184b of the substrate carrying-out and holding device 183A. As shown in fig. 15 (a), the substrate holder 28G of the second embodiment includes a notch 28a for accommodating the holding pad 184a of the substrate carrying-in and holding device 182G in addition to the notch 28 b.

(substrate transfer device 100G)

In the substrate conveying device 100G according to the second embodiment, the plurality of beams 153 provided in the beam unit 152 are supported from below by a plurality of (e.g., 2) bar-shaped legs 154 extending in the Z-axis direction at positions further inward than both ends in the X-axis direction. The vicinity of the lower end portions of the plurality of legs 154 supporting the cross members 153 are connected by a base plate 156. In the substrate conveying device 100G, the substrate plate 156 is moved in the X-axis direction by a predetermined stroke by an X actuator, not shown, and the beam unit 152 is integrally moved in the X-axis direction by a predetermined stroke. Further, the base plate 156 is moved in the Z-axis direction by the Z actuator 158, whereby the beam unit 152 can be integrally moved up and down in the Z-axis direction. In the plan view of fig. 15 (a) and the following, the illustration of the base plate 156 is omitted.

In the substrate carrying section 160G of the second embodiment, as shown in fig. 15 (a), the substrate carrying hand 161G has a plurality of (for example, 8 in the present embodiment) finger sections 162G. The vicinities of the-X-side ends of the plurality of fingers 162G are connected to each other by a connecting member 163G. The connection member 163G is configured to be capable of floating and supporting the substrate P by supplying gas (gas supply) to the back surface of the substrate P held by the substrate carrying-in hand 161G. In contrast, the +x side end of the plurality of fingers 162G is a free end, and the adjacent fingers 162G are spaced apart from the port 150G. As shown in fig. 15 (a), each finger 162G is arranged so that its position in the Y-axis direction does not overlap with the plurality of beams of the beam unit 152 in a plan view.

As shown in fig. 16 (a) and 16 (b), among the plurality of finger portions 162G, the finger portions 162G1 at both ends in the Y-axis direction have a triangular shape in which the thickness on the X side (substrate holder 28G side) is thin and the +x side (port portion 150G side) is thick in a side view. On the other hand, the inner finger 162G2 has a smaller thickness on the port side than the finger 162G1 on both ends.

As shown in fig. 16 (a) and 16 (b), the arm 168 of the substrate carrying-in hand 161G is attached to the finger 162G1 at both ends. As shown in fig. 15 (a), both ends of the arm 168 are connected to the X-axis driving device 164.

As shown in fig. 15 (a) and 15 (b), the substrate carrying-in hand 161G has a pair of substrate pickup hands 167G provided with finger portions 162G1 at both ends in the Y-axis direction. The substrate pickup hand 167G is movable in the X-axis direction and the Z-axis direction by a drive device, not shown, by a predetermined stroke.

The substrate pickup hand 167G may suction and hold the lower surface of the substrate P by a vacuum suction force supplied from a vacuum apparatus, not shown.

(carrying device 180G)

The substrate loading and holding device 182G is different from the substrate loading and holding device 182A of the first embodiment in that the X actuator 186X is omitted. As shown in fig. 15 (b), the holding pad 184a of the substrate loading and holding device 182G is movable in the notch 28a by the Z actuator 186Z, and is thereby movable between a position in contact with the lower surface of the substrate P and a position away from the lower surface of the substrate P. The holding pad 184a is movable between a position where a part is accommodated in the notch 28a and a position higher than the upper surface of the substrate holder 28G by the Z actuator 186Z.

(substrate replacement action)

Next, the replacement operation of the substrate P on the substrate holder 28G of the exposure apparatus 10G according to the second embodiment will be described with reference to fig. 17 (a) to 24 (b).

As shown in fig. 17 (a) and 17 (b), during the exposure process of the stage device 20G, the external conveyance device 300 is moved in the-Z direction to place the substrate P2 on the beam unit 152. Then, the external conveyance device 300 moves in the +x direction and withdraws from the exposure device.

The substrate carrying-in hand 161G is driven in the +x direction, and enters from the-X side (substrate holder 28G side) to the lower side of the beam unit 152.

Then, as shown in fig. 18 (a) and 18 (b), the stage device 20G, which has completed the exposure process, moves to the substrate transfer position with the substrate carrying section 160G.

The beam unit 152 is driven downward (driven in the-Z direction) in a state of holding the substrate P2 by the Z actuator 158. At this time, a part of the substrate P2 on the beam unit 152 is in contact with the substrate pickup hand 167G of the substrate carry-in hand 161G. The substrate pickup hand 167G suctions and holds the lower surface of the substrate P2.

Thereafter, as shown in fig. 19 (a) and 19 (b), in the stage device 20G, the substrate P1 on the substrate holder 28G is shifted in the +x direction by the substrate carrying-out support device 183A. At this time, the substrate holder 28G and the offset beam 185a supply gas (supply gas) to the back surface of the substrate P1 to move the substrate P in a floating state.

Pressurized gas is ejected from each beam 153 of the beam unit 152. In addition, the beam unit 152 gradually and continuously descends.

The substrate carrying-in hand 161G gradually moves in the-X direction while holding the substrate P2 on the beam unit 152 by suction by the substrate pickup hand 167G. The substrate P2 moves in the-X direction along with the movement of the substrate carrier 161G in the-X direction.

Then, as shown in fig. 20 (a) and 20 (b), the substrate carrying-in hand 161G is moved in the-X direction to the X position where the root of the finger 162G and the beam unit 152 do not overlap in a plan view.

The beam unit 152 moves downward below the substrate carrier 161G, and transfers the new substrate P2 to the substrate carrier 161G. At this time, the relative position of the substrate P2 to the substrate carrier 161G may be adjusted by the pair of substrate pickup hands 167G on the substrate carrier 161G.

Thereafter, as shown in fig. 21 (a) and 21 (b), the substrate carrying-in hand 161G moves in the-X direction while holding the substrate P2, and is disposed at a predetermined position above the substrate holder 28G.

In the stage device 20G, the holding pad 184a of the substrate loading and holding device 182G is driven to rise by the Z actuator 186Z. The substrate carry-in hand 161G pushes out the substrate P2 obliquely downward by the substrate pickup hand 167G. Thereby, the-X side end of the substrate P2 contacts the holding pad 184 a. Thereby, the holding pad 184a contacts the substrate P2 on the substrate carrying-in hand 161G standing by above the substrate holder 28G from below, and holds the vicinity of the end of the substrate P2 on the-X side by suction. Further, at the timing, the substrate pickup hand 167G may also perform positional adjustment of the substrate P2 with respect to the substrate holder 28G.

In addition, the substrate carrying-out hand 170A is moved simultaneously with the suction and holding operation of the holding pad 184a on the substrate P2, and the lower surface of the portion of the substrate P1 shifted to the +x side from the substrate holder 28G is sucked and held.

The beam unit 152 moves in the-X direction and the-Z direction, and stops at a substrate transfer position with the substrate holder 28G. In addition, pressurized gas is ejected from each beam 153 of the beam unit 152. Thus, the beam unit 152 serves as a guide (guide) for supporting the substrate P1 carried out from the substrate holder 28G.

Then, the holding of the substrate P2 by the substrate pickup hand 167G of the substrate carry-in hand 161G is released, and as shown in fig. 22 (a) and 22 (b), the substrate carrying section 160G is driven in the carry-out direction (+x side) in a state in which the holding pad 184a of the substrate carry-in holder 182G adsorbs the-X side end portion of the substrate P2. When the substrate transport section 160G is driven in the transport direction (+x side), the substrate transport hand 170A holding the substrate P1 is also driven in the +x direction.

Thereby, the substrate P1 moves from the substrate holder 28G to the port portion 150G (beam unit 152). At this time, since the pressurized gas is discharged from the upper surface of the beam unit 152, the substrate P1 is carried in a non-contact state (except for the portion held by the substrate carrying-out hand 170A) on the substrate holder 28G and the port portion 150G.

Then, as shown in fig. 23 (a) and 23 (b), the substrate carrying-out hand 170A releases the grip of the substrate P1 and moves in the-X direction together with the substrate carrying-in hand 161G. The port 150G moves in the +x direction while the substrate P2 is held by the beam unit 152.

In the stage device 20G, the substrate loading and holding device 182G adjusts the position of the substrate P2 with respect to the substrate holder 28G, and then moves in the Z-Z direction by the Z actuator 186, and a part of the substrate P2 is accommodated in the notch 28 a. Thereby, the substrate P2 is adsorbed to the holder substrate holding surface of the substrate holder 28G. The positional adjustment (alignment) of the substrate P2 described herein may be omitted, and may be controlled in a manner that is performed as needed.

Thereafter, as shown in fig. 24 (a) and 24 (b), when the substrate carrying-in hand 161G moves to a position where interference with the substrate P1 does not occur, the beam unit 152 moves in the +z direction and moves to a substrate transfer position with the external carrier device 300.

The external transport device 300 recovers the substrate P1 on the beam unit 152 and then transports a new substrate P3 to the port 150A.

As described in detail above, according to the second embodiment, the port 150G is left open between the adjacent finger portions 162G of the substrate carrying hand 161G. Thus, the substrate carrying-in hand 161G can be driven from the substrate holder 28G side directly under the beam unit 152 to the upper side of the beam unit 152, thereby scooping up the substrate P2 on the beam unit 152 and moving to the substrate holder 28G side. Therefore, even in a state where the substrate P2 is mounted on the beam unit 152, the substrate carrying-in hand 161G can be moved in the X-axis direction by a short movement distance to the lower side of the substrate P2. That is, the substrate carrying-in hand 161G can receive the substrate P2 on the beam unit 152 without moving to the position on the +x side of the port portion 150G. The substrate carrying-in hand 161G can be transferred to the beam unit 152 without moving the exposed substrate P1 to the position on the +x side of the port portion 150G. That is, a series of operations of carrying in the substrate P2 and carrying out the substrate P1 can be performed without changing the positional relationship in the X direction of the external carrying device 300, the port 150G, the substrate carrying-in hand 161G, and the substrate holder 28G. Further, since the chamber does not need to be provided so as to provide a space for the substrate carrying-in hand 161G to move to the position on the +x side of the port portion 150G, the floor area (footprint) of the exposure apparatus, that is, the installation area of the exposure apparatus 10G can be reduced. In addition, when a defect occurs in the exposure apparatus, when an operation such as initial setting is performed, the substrate P that has been carried out to the port 150G (beam unit 152) can be transferred again to the substrate carrying-in hand 161G and carried in to the substrate holder 28G, even if the external carrying apparatus 300 is not present.

In addition, according to the present second embodiment, the vicinities of the end portions of the plurality of fingers 162G of the substrate carrying-in hand 161G on the-X side (substrate holder 28G side) are connected to each other by the connecting member 163G. As a result, the substrate carrier 161G of the second embodiment can set the substrate P2 on the substrate holder 28G without deformation, as compared with the substrate carrier 161A.

Specifically, as shown in fig. 25 (a), in the substrate carrying-in hand 161A of the first embodiment, the space is left between the-X side fingers 162A. Therefore, as shown in fig. 25 (a), there are some cases where there are areas supported by the finger 162A and areas not supported by the finger, and therefore, there are a small amount of undulation, and it is difficult to mount the substrate P2 on the substrate holder 28A without deformation. On the other hand, as shown in fig. 16 (a) and 16 (b), in the substrate carrying-in hand 161G of the second embodiment, the finger 162G adjacent to the-X side is continuous and not free, and the-X side end of the substrate P2 can be supported in a planar form. As a result, as shown in fig. 25 (b), the-X side edge of the substrate P2, which is to be set in front of the substrate holder 28G, is less likely to undulate. Therefore, the substrate carrier 161G of the second embodiment can set the substrate P2 on the substrate holder 28G without deformation, as compared with the substrate carrier 161A.

In addition, according to the second embodiment, the substrate carrying portion 160G (substrate carrying-in hand 161G) and the stage device 20G (substrate holder 28G) are moved in opposite directions, whereby the substrate carrying-in hand 161G is retracted from between the substrate P2 and the substrate holder 28G. This shortens the carry-in time of the substrate P2 to the substrate holder 28G.

Further, according to the second embodiment, among the finger portions 162G of the substrate carrying-in hand 161G, the inner finger portions 162G2 other than the finger portions 162G1 at both ends have a smaller thickness on the port side than the finger portions 162G1 at both ends (see, for example, (b) of fig. 16). This reduces the weight of the substrate carrying-in hand 161G.

Further, according to the second embodiment, the arms 168 of the substrate carrier 161G are attached to the finger portions 162G1 at both ends, so that the substrate carrier 161G can support the central portion of the substrate P2, and the substrate carrier 161G can be reduced. Further, since the arms 168 of the substrate carrier 161G are attached to the finger portions 162G1 at both ends, the center of gravity of the entire substrate carrier 161G is supported, and therefore, deflection of the substrate carrier 161G can be suppressed.

(first modification)

In the second embodiment, the Z position (pass line) for transferring the substrate between the external transfer device 300 and the beam unit 152 of the port portion 150G is set at a position higher than the upper surface of the substrate holder 28G, but the height of the pass line can be freely set (without limitation).

Fig. 26 (a) and 26 (b) are diagrams for explaining the substrate replacement operation according to the first modification.

As shown in fig. 26 (a) and 26 (b), the external conveyance device 300 mounts the substrate P2 on the beam unit 152 stopped at a position lower than the upper surface TS of the substrate holder 28G.

Then, as shown in fig. 17 (a) and 17 (b) of the second embodiment, when the beam unit 152 is raised to a position higher than the highest portion of the substrate carrying-in hand 161G, the substrate P2 can be transferred to the substrate carrying-in hand 161G even when there is no driving device for moving the substrate carrying-in hand 161G up and down. Thus, for example, when a defect occurs in the exposure apparatus, when an operation such as initial setting is performed, the substrate that has been carried out to the port 150G (beam unit 152) can be transferred again to the substrate carrying-in hand 161G and carried in to the substrate holder 28G without the external carrying apparatus 300.

(second modification)

The second modification is an example in which the configuration of the substrate transfer apparatus is changed.

In the substrate transfer apparatus 100I of the second modification, the substrate transfer section 160I includes a drive system for rotationally moving the substrate transfer hand 161I about the Y axis. That is, the substrate carrying-in hand 161I can tilt the substrate holding surface around the Y axis by the driving system.

In the second modification, as shown in fig. 27 (a), the substrate pickup hand 167I provided in the substrate carry-in hand 161I has a longer stroke than the substrate pickup hand 167G of the second embodiment. In the second modification, as shown in fig. 27 (a), the distance from the-X side end of the substrate carrying hand 161I to the root of the finger 162I, that is, the width of the connecting member 163I in the X-axis direction is longer than that of the connecting member 163G of the second embodiment.

The substrate replacement operation of the substrate transfer apparatus 100I according to the second modification will be described with reference to fig. 27 (a) to 30 (b). The states of fig. 27 (a) and 27 (b) correspond to the states of fig. 17 (a) and 17 (b), respectively, in the second embodiment.

As shown in fig. 27 (a) and 27 (b), during the exposure process of the stage device 20G, the external conveyance device 300 moves in the-Z direction to place a new substrate P2 on the beam unit 152, and then moves in the +x direction to withdraw from the exposure device 10I.

The substrate carrying-in hand 161I moves in the +x direction, and enters from the-X side (substrate holder 28G side) to the lower side of the beam unit 152. The finger 162I of the substrate carrying hand 161I is stopped at a position where the base thereof does not overlap with the-X side end of the beam unit 152 in a plan view.

Then, as shown in fig. 28 (a) and 28 (b), the stage device 20G, which has completed the exposure process, moves to the substrate transfer position with the port portion 150G.

The substrate carrier 161I is driven to rotate about the Y axis so that the substrate holding surface of the substrate carrier 161I is substantially parallel to the substrate P2 on the beam unit 152. The beam unit 152 moves downward (moves in the-Z direction) while holding the substrate P2, and stops at a position where a part of the substrate P2 on the beam unit 152 contacts the substrate pickup hand 167I of the substrate carry-in hand 161I. The substrate pickup hand 167I suctions and holds the back surface of the substrate P2.

Then, as shown in fig. 29 (a) and 29 (b), in the stage device 20G, the substrate P1 on the substrate holder 28G is shifted in the +x direction by the substrate carrying-out and holding device 183A.

The substrate pickup hand 167I of the substrate carry-in hand 161I moves in the-X direction while holding the substrate P2 on the beam unit 152. Thus, the substrate P2 moves onto the substrate carrier 161I while being held by the substrate carrier 161I and the beam unit 152. At this time, pressurized gas is ejected from the beam unit 152 and the substrate carrier 161I. The substrate pickup hand 167I suctions and holds the substrate P2, so that the substrate P2 is not likely to fall from the beam unit 152 or the substrate carry-out hand 161I. Since the substrate P2 is held by the substrate carrier 161I and the beam unit 152, the load on the substrate P2 is smaller than in the case where the substrate carrier 161I moves in the +z direction relative to the beam unit 152 and the substrate P2 is placed on the substrate carrier 161I from the beam unit 152. Therefore, the risk of breakage of the substrate P2 can be reduced at the time of transfer of the substrate P2 between the substrate carrying-in hand 161I and the beam unit 152.

Then, as shown in fig. 30 (a) and 30 (b), the beam unit 152 is driven downward below the substrate carrier 161I, and the substrate P2 is completely transferred to the substrate carrier 161I. When the substrate P2 is placed on the substrate carrier 161I, the substrate carrier 161I is driven to rotate about the Y axis, and the substrate holding surface of the substrate carrier 161I is inclined with respect to the substrate holding surface of the holder of the substrate holder 28G (the state of fig. 27 (b)).

The following operations are the same as those of the second embodiment, and therefore, description thereof will be omitted.

According to the second modification, the substrate carrying-in hand 161I is rotationally driven about the Y axis so that the substrate holding surface of the substrate carrying-in hand 161I is substantially parallel to the substrate P2 on the beam unit 152, and then the substrate P2 on the beam unit 152 is transferred to the substrate carrying-in hand 161I. This makes it possible to reliably transfer the substrate P2 to the substrate carrier 161I without bending the substrate P2.

In addition, according to the second modification, the width of the connecting member 163I in the X-axis direction is wide. This shortens the length of the finger 162I of the substrate carrier 161I, and improves the rigidity of the entire substrate carrier 161I.

(third modification)

In the second modification, the substrate P2 is moved from the beam unit 152 to the substrate carrier 161I by tilting the substrate carrier 161I, but in the third modification, the substrate P2 is moved from the beam unit 152 to the substrate carrier 161I by tilting the beam unit 152.

As shown in fig. 31 (a), in the substrate transport apparatus 100J of the third modification, the port portion 150J includes a leg 154a and a leg 154b, the upper ends of which are connected to the cross beam 153 of the cross beam unit 152. The port 150J includes Z actuators 158a and 158b capable of independently expanding and contracting the legs 154a and 154b in the Z axis direction. The inclination of the upper surface of the beam unit 152 can be changed by changing the amounts of expansion and contraction of the legs 154a and 154b by the Z actuators 158a and 158b. Fig. 31 (a) illustrates the beam unit 152 disposed between the finger 162I1 at both ends and the finger 162I2 on the inner side.

Next, a description will be given of a transfer of the substrate P2 from the beam unit 152 to the substrate carrier 161I.

Fig. 31 (a) shows a state in which the substrate P2 has been set on the beam unit 152 by the external conveyance device 300. At this time, the substrate carrying-in hand 161I moves from the-X side to the +x direction of the beam unit 152, and stops at a position where the root of the finger 162G does not overlap with the-X side end of the beam unit 152 in a plan view.

Then, as shown in fig. 31 (b), the amounts of expansion and contraction of the legs 154a and 154b are changed by the Z actuators 158a and 158b, and the beam unit 152 is tilted so that the upper surface of the beam unit 152 is substantially flush with the substrate holding surface of the substrate carrying-in hand 161I.

Then, as the beam unit 152 descends, the substrate P2 held by the beam unit 152 is gripped by the substrate pickup hand 167I, and transferred to the substrate carry-in hand 161I while the substrate position is shifted by the movement of the substrate pickup hand 167I.

As in the third modification, the substrate P2 may be moved from the beam unit 152 to the substrate carrying-in hand 161I by tilting the beam unit 152.

(fourth modification)

The fourth modification is an example in which the configuration of the finger portion of the substrate carrying-in finger is changed.

As shown in fig. 32 (a) and 33 (a), the substrate carrier 161K of the fourth modification has a finger 162K having a length substantially equal to the substrate size in the X-axis direction. As shown in fig. 32 (b) and the like, the substrate carrying-in hand 161K has a diamond shape with both sharp ends in a side view, and the arm 168 is attached to a portion having a thickness in the central portion.

A substrate transfer from the beam unit 152 to the substrate carrier hand 161K according to a fourth modification will be described with reference to fig. 32 (a) to 33 (b).

As shown in fig. 32 (a) and 32 (b), the substrate carrying-in hand 161K is disposed at a position where the root of the finger 162K and the-X side end of the beam unit 152 do not overlap in a plan view.

Then, when the external conveyance device 300 transfers the substrate P2 onto the beam unit 152, the beam unit 152 moves in the-Z direction as shown in fig. 33 (a) and 33 (b). Since the length of the finger 162K of the substrate carrier 161K is substantially the same as the length of the substrate P2, the substrate P2 is placed on the substrate carrier 161K by the movement of the beam unit 152 in the-Z axis direction. Thereafter, the substrate P2 is slid to the bevel side by the substrate pickup hand 167K. Thereby, a part of the substrate P2 is inclined with respect to the holder substrate holding surface of the substrate holder 28G. The following operations are basically the same as those of the second embodiment, and thus detailed description thereof will be omitted.

According to the fourth modification, since the length (length in the X-axis direction) of the finger 162K of the substrate carrying-in hand 161K is substantially the same as the length of the substrate, when the substrate P2 placed on the beam unit 152 is received by the substrate carrying-in hand 161K, the substrate P2 can be scooped up by merely passing the substrate carrying-in hand 161K from below the beam unit 152. Therefore, the operation is simple, and damage or dust emission of the substrate P2 is not easily caused.

(fifth modification)

The fifth modification is an example in which the substrate is directly transferred from the external conveyance device 300 to the substrate carrier 161K.

In the fifth modification, as shown in fig. 34 (a), the forks of the external conveyance device 300 are arranged so that the Y-axis direction positions do not overlap with the finger portions 162K of the substrate carrying hand 161K in a plan view. The cross member 153 of the cross member unit 152 is disposed so as not to overlap the fork of the external conveying device 300 in a plan view. As a result, in the fifth modification, the finger 162K of the substrate carrying-in hand 161K and the cross beam 153 of the cross beam unit 152 are arranged at positions overlapping in a plan view.

Next, a substrate transfer from the external conveyance device 300 to the substrate loading hand 161K according to a fifth modification will be described with reference to fig. 34 (a) to 35 (b).

As shown in fig. 34 (a) and 34 (b), the substrate carrying-in hand 161K is driven in the +x direction to be placed at the substrate transfer position with the external carrier device 300. The external conveyance device 300 moves in the-X direction while holding the substrate P2 until reaching the substrate transfer position with the substrate carrying-in hand 161K.

Then, as shown in fig. 35 (a) and 35 (b), the stage device 20G, which has completed the exposure process, moves to the substrate transfer position with the beam unit 152. In the stage device 20G, the substrate P1 on the substrate holder 28G is shifted in the +x direction by the substrate carrying-out and holding device 183A.

When the external conveyance device 300 moves in the-Z direction, the lower surface of the substrate P2 contacts the substrate pickup hand 167K. The substrate pickup hand 167K suctions and holds the lower surface of the substrate P2.

The suction is performed to drive the substrate pick-up hand 167K holding the lower surface of the substrate P2 in the-X direction. Thereby, the substrate P2 on the external conveyance device 300 moves toward the substrate carry-in hand 161K. When the substrate P2 is completely transferred onto the substrate carrying-in hand 161K while being held by the external transfer device 300 through the lowering drive, the external transfer device is driven in the +x direction and is withdrawn from the exposure device 10L.

The beam unit 152 moves in the-Z direction and the-X direction toward the substrate transfer position with the stage device 20G.

The following operations are basically the same as those of the second embodiment, and thus detailed description thereof will be omitted.

As described above, according to the fifth modification, the substrate carrying-in hand 161K can directly receive the substrate P2 from the external carrier device 300 without passing through the port 150G at the time of carrying in the substrate P2. Accordingly, compared to the two transfer operations of transferring the substrate P2 from the external transfer device 300 to the port 150G and transferring the substrate P2 from the port 150G to the substrate carrier 161K, the transfer operation is performed only once from the external transfer device 300 to the substrate carrier 161K, and the number of times of transferring the substrate P2 is reduced, so that the time required for carrying in the substrate P2 can be shortened and damage or dust emission of the substrate P2 can be prevented.

In the fifth modification, the substrate P1 is transferred from the beam unit 152 to the external conveyance device 300 in the same manner as in the second embodiment with respect to the recovery (carry-out) of the substrate P1.

In the fifth modification, the cross member 153 of the cross member unit 152 and the finger 162K of the substrate carrying-in hand 161K are arranged so as not to overlap each other in a plan view so that the cross member 152 and the finger of the robot of the external carrying device 300 do not overlap each other in a plan view. The beam 153 of the beam unit 152 and the finger 162K of the substrate carrying hand 161K may not overlap each other in a plan view. In this case, the beam unit 152 may be offset by one finger 162K in the Y-axis direction. Thus, the substrate carried out from the substrate holder 28G to the port 150G can be picked up again by the substrate carry-in hand.

In the case of transferring the substrate, the external conveyance device 300 may be deviated in the Y-axis direction, or the substrate carrying-in hand 161K may be deviated in the Y-axis direction, so that the beam 153 does not overlap the finger 162K in a plan view.

(sixth modification)

The sixth modification changes the configuration of the substrate carrier.

Fig. 36 is a perspective view showing a substrate carrier 161L according to a sixth modification. As shown in fig. 36, the board carrying-in hand 161L includes a plate portion 263 having a triangular XZ cross section, and an arm portion 265 supporting the plate portion 263. The upper surface of the plate 263 is inclined with respect to the XY plane.

As shown in the sixth modification, the substrate carrier may not have a finger. That is, the substrate carrier may not have a fork shape.

As shown in fig. 37 (a), the upper surface of the plate 263 of the substrate carrying-in hand 161L may be curved. In this way, by bending the upper surface (holder substrate holding surface) of the plate portion 263, the section coefficient of the substrate can be increased. That is, the same effect as that the thickness of the substrate is actually several times to several hundred times larger with respect to the deflection of the substrate can be obtained.

By setting in this manner, even when the substrate P is placed on the substrate carrying-in hand 161L in the state where the-X end is exposed as in fig. 37 (b), the occurrence of deflection (sagging) at the-X end of the substrate P can be suppressed. Further, since the occurrence of deflection (sagging) of the substrate P is suppressed, the substrate P can be brought into contact with the Y-axis direction central portion of the-X side when the substrate P is brought into contact with the substrate holder, and therefore wrinkles can be hardly generated at the-X end portion of the substrate P.

As shown in fig. 38, the substrate transport units 160A to 160L may be provided with a cover 199. By providing the cover 199, adhesion of the garbage on the substrate P can be prevented, and the temperature of the substrate P can be set to be constant.

In the second embodiment and the modification thereof, the stage device 20A of the first embodiment may be used instead of the stage device 20G. The stage device 20G may be applied to the first embodiment and its modification.

In the first embodiment, the second embodiment, and the modification thereof, as shown in fig. 39, the vicinity of the +x side end portion of the fixed disk 30 called the upper cylinder, which supports the projection optical system 16, the mask stage 14, and the like, may be partially chamfered (30 a) so as not to interfere with the substrate carrying-in. Fig. 39 shows a case where the substrate carrier is a substrate carrier 161G according to the second embodiment. Thereby, the height of the entire exposure apparatus can be reduced.

In the first and second embodiments and modifications thereof, as shown in fig. 40 (a) and 40 (b), the stage Device 20A and 20G include a Charge-Coupled Device (CCD) camera 31x and a CCD camera 31y (image processing edge detection) for detecting the edge of the substrate P as the above-described substrate position measuring Device. The CCD camera 31X is disposed so as to be able to observe two places on the-X side of the substrate P placed in front of the substrate holders 28A, 28G. The CCD camera 31Y is disposed so that one portion of the-Y side (or +y side) of the substrate P can be seen from below. Thus, the X position, Y position, and θz position of the substrate P with respect to the stage devices 20A and 20G can be obtained. These pieces of information can be used for stage control as positional correction of the substrate P2 before placement or positional information of the substrate P2 after placement. For example, a known edge sensor including a light source and a light receiving portion may be used instead of the CCD camera 31x and the CCD camera 31y for detecting the edge of the substrate P. The light source is disposed at the same position as the CCD cameras 31x and 31y, and the light receiving portion is disposed so as to face the light source through the substrate P. The light receiving portion receives the measurement light emitted from the light source and detects an end portion of the substrate P. In this way, the X position, Y position, and θz position of the substrate P with respect to the stage device 20A and the stage device 20G can be detected based on the detection results of the end in the X axis direction and the end in the Y axis direction of the measurement substrate P.

In the first and second embodiments and modifications thereof, the platform device 20M shown in fig. 41 (a) to 41 (c) may be used.

In the stage device 20M, as shown in fig. 41 (a), two substrate carrying-in and holding devices 182M are provided at the-X side end of the substrate holder 28M. As shown in fig. 41 (b), the substrate loading and holding device 182M is set as follows: in a state where a part thereof is received in the notch 28a formed at the-X side end portion of the substrate holder 28M, the height of the upper surface of the holding pad 184a becomes substantially the same as the height of the upper surface of the substrate holder 28M. Therefore, even after the placement of the substrate P2, the holding pad 184a can be retracted from the substrate holder 28M without moving in the-X direction.

As shown in fig. 41 (c), the substrate loading and holding device 182M can be tilted so as to reliably adsorb and fix the rear surface of the obliquely loaded substrate P2. The substrate loading and holding device 182M is movable in the horizontal direction (X-axis direction or X-axis and Y-axis direction) so as to adjust (align) the relative position of the substrate P2 with respect to the substrate holder 28M.

According to the stage device 20M, the holding pad 184a can be inclined, and thus the back surface of the substrate P2 can be reliably sucked and fixed.

In the first and second embodiments and modifications thereof, the stage device 20N shown in fig. 42 (a) and 42 (b) may be used.

The stage device 20N does not include the substrate loading/holding device described in the first and second embodiments that move independently. In the stage device 20N, an adsorption region (a receiving region) 187 for adsorbing and gripping the front end portion of the carried-in substrate is provided at one or more positions near the-X side end surface of the substrate holder, so that a part of the upper surface of the substrate holder 28N also serves as a holding pad 184a for adsorbing and gripping the front end portion of the carried-in substrate.

Further, the stage device 20N is not provided with a substrate carry-in and hold device that moves independently, and thus the relative position adjustment (alignment) of the carried-in substrate P with respect to the substrate holder 28N cannot be performed by the substrate carry-in and hold device, but for example, the position adjustment of the substrate P on the substrate carry-in hand may be performed by using a pair of substrate carry-out hands before the substrate is suctioned by the hold region 187. When the relative position of the substrate P with respect to the substrate holder 28N is to be adjusted (aligned) after the substrate P is placed on the substrate holder 28N, the substrate removal and support device 183A may be used.

In addition, when the stage device is not provided with the independently movable substrate loading and holding device, as shown in fig. 43 (a) to 43 (c), for example, the substrate loading hand 161A is retracted from between the substrate P and the substrate holder 28N, and when the substrate P2 is placed on the substrate holder 28N, the substrate holder 28N sucks air to adsorb the substrate P2 to the substrate holding surface of the holder, so that the loading of the substrate P2 can be stably performed.

In the first and second embodiments and modifications thereof, the support pad on the finger of the substrate carrying hand may be omitted.

In the above embodiments, the projection optical system 16 is an equivalent system, but the present invention is not limited to this, and a reduction system or an enlargement system may be used.

The use of the exposure apparatus is not limited to the exposure apparatus for liquid crystal in which a liquid crystal display device pattern is transferred onto a square glass plate, and can be widely used for example, exposure apparatuses for manufacturing organic Electroluminescence (EL) panels, exposure apparatuses for manufacturing semiconductors, thin film magnetic heads, micro-devices, and exposure apparatuses for deoxyribonucleic acid (Deoxyribonucleic acid, DNA) chips (chips), and the like. In addition, the present invention is applicable not only to micro-devices such as semiconductor devices, but also to exposure apparatuses in which a circuit pattern is transferred onto a glass substrate, a silicon dioxide wafer, or the like in order to manufacture masks or photomasks used in a photo exposure apparatus, an extreme ultraviolet (Extreme Ultraviolet, EUV) exposure apparatus, an X-ray exposure apparatus, an electron beam exposure apparatus, or the like.

The substrate to be exposed is not limited to a glass plate, and may be, for example, a wafer (wafer), a ceramic substrate, a film member, or other objects such as a mask blanks (mask blanks). In the case where the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and may include, for example, a film shape (a flexible sheet-like member). The exposure apparatus according to the present embodiment is particularly effective when a substrate having a length of one side or a diagonal length of 500mm or more is an exposure target. In the case where the substrate to be exposed is a flexible sheet, the sheet may be formed into a roll shape.

Method for manufacturing element

Next, a method of manufacturing a micro device using the exposure apparatuses 10A to 10L according to the above embodiments in a photolithography step will be described. By forming a predetermined pattern (circuit pattern, electrode pattern, or the like) on a substrate by the exposure apparatus 10A to the exposure apparatus 10L of the above embodiment, a liquid crystal display device as a micro element can be obtained.

< patterning step >)

First, a so-called photolithography step of forming a pattern image on a photosensitive substrate (a glass substrate coated with a resist, or the like) using the exposure apparatus of each of the above embodiments is performed. By the photolithography step, a predetermined pattern including a plurality of electrodes and the like is formed on the photosensitive substrate. Then, the exposed substrate is subjected to various steps such as a developing step, an etching step, and a resist stripping step, whereby a predetermined pattern is formed on the substrate.

< color Filter Forming step >)

Then, a color filter in which a plurality of groups of three dots corresponding to R (red), G (green), and B (blue) are arranged in a matrix or a plurality of groups of 3 stripe filters of R, G, B are arranged in the horizontal scanning line direction is formed.

< step of assembling Unit >

Then, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having a predetermined pattern obtained in the pattern forming step, the color filter obtained in the color filter forming step, and the like. For example, a liquid crystal panel (liquid crystal cell) is manufactured by injecting liquid crystal between the substrate having a predetermined pattern obtained in the patterning step and the color filter obtained in the color filter forming step.

< Module Assembly step >)

Thereafter, a circuit for causing the assembled liquid crystal panel (liquid crystal cell) to perform a display operation, and various components such as a backlight are mounted to complete the liquid crystal display device.

In this case, in the pattern forming step, the exposure of the substrate is performed with high yield and high accuracy using the exposure apparatus of each of the embodiments, so that as a result, the productivity of the liquid crystal display device can be improved.

The described embodiments are preferred embodiments of the present invention. However, the present invention is not limited thereto, and various modifications may be made without departing from the spirit of the present invention.

Claims

1. A substrate carrying device that carries a substrate to a holding device, comprising:

a first holding portion that holds the substrate above the holding device;

a second holding portion that holds a part of the substrate held by the first holding portion; and

a driving unit that moves one of the holding device and the second holding unit relative to the other so that the first holding unit is retracted from above the holding device; and is also provided with

The holding device, the first holding portion, and the second holding portion hold the substrate during relative movement by the driving portion.

2. The substrate conveyance device according to claim 1, wherein the driving portion relatively moves the first holding portion with respect to the substrate so that an area of the substrate held by the first holding portion is reduced and an area of the substrate held by the holding device is increased.

3. The substrate transport apparatus according to claim 1 or 2, wherein the driving section moves the first holding section so that a distance between the first holding section and the second holding section becomes larger,

the holding means holds an area between an area held by the first holding portion and an area held by the second holding portion in the substrate.

4. The substrate transport apparatus according to claim 3, wherein the driving unit moves the first holding unit to a position not overlapping the holding unit in the up-down direction so as to retract from above the holding unit in a state where the second holding unit holds a part of the substrate,

the holding means holds the region of the first holding portion where the holding of the substrate is released.

5. The substrate conveyance device according to any one of claims 1 to 4, wherein the second holding portion conveys a part of the substrate to the holding device.

6. The substrate transfer apparatus according to claim 5, wherein the driving portion relatively moves the first holding portion with respect to the holding device and the second holding portion from one end side of the holding device to the other end side of the holding device, where the second holding portion transfers a part of the substrate.

7. The substrate carrying device according to claim 6, wherein the holding device holds other portions of the substrate at the other end side of the holding device.

8. The substrate conveyance device according to any one of claims 1 to 7, wherein the first holding portion holds the substrate in a state in which a distance in a vertical direction of a part of the substrate from the holding device is shorter than a distance in other parts of the substrate from the holding device.

9. The substrate conveyance device according to any one of claims 1 to 8, wherein the driving portion relatively moves one of the holding device and the second holding portion and the first holding portion with respect to the other in a direction along a holding surface of the holding device that holds the substrate.

10. The substrate carrying device according to any one of claims 1 to 9, wherein the first holding portion moves above the holding device in the relative movement.

11. The substrate carrying device according to any one of claims 1 to 10, wherein the second holding portion is provided to the holding device.

12. The substrate transfer apparatus according to claim 11, wherein the second holding portion is provided on an upper surface of the holding apparatus.

13. The substrate conveyance device according to any one of claims 1 to 12, wherein the second holding portion adjusts a position of the substrate with respect to the holding device in a state where a part of the substrate is held.

14. The substrate carrying device according to any one of claims 1 to 13, comprising a carry-out device for carrying out another substrate different from the substrate from the holding device,

The carry-out device carries out the other substrates during the relative movement of the holding device and the second holding portion and the first holding portion by the driving portion.

15. The substrate transfer apparatus according to claim 14, wherein the carry-out device moves the other substrate to a position between the first holding portion and the holding device in an up-down direction.

16. The substrate handling apparatus according to claim 14 or 15, wherein the carry-out device is provided to the first holding portion,

the driving unit moves the first holding unit relative to the second holding unit and the holding device, and moves the carry-out device.

17. The substrate handling apparatus according to any one of claims 14 to 16, wherein the holding means has a suction hole for supplying a gas for floating the other substrate,

the carry-out device moves the other substrate floating on the holding device along a holding surface of the holding device.

18. An exposure apparatus comprising:

the substrate handling apparatus according to any one of claims 1 to 17; and

and an optical system for irradiating the substrate conveyed to the holding device with an energy beam and exposing the substrate.

19. The exposure apparatus according to claim 18, wherein at least one side of the substrate has a length or a diagonal length of 500mm or more and is used for a flat panel display.

20. A method of manufacturing a flat panel display, comprising:

exposing a substrate using the exposure apparatus according to claim 19; and

developing the exposed substrate.

21. A method of manufacturing a device, comprising:

exposing a substrate using the exposure apparatus according to claim 18 or 19; and

developing the exposed substrate.

22. A substrate carrying method carries a substrate to a holding device and includes:

holding the substrate by a first holding portion and a second holding portion above the holding device; and

one of the holding device and the second holding portion and the first holding portion is moved relative to the other so that the first holding portion is retracted from above the holding device; and is also provided with

The holding device, the first holding portion, and the second holding portion hold the substrate during the relative movement.

23. The substrate transfer method according to claim 22, wherein the first holding portion is moved relative to the substrate by the relative movement so that an area of the substrate held by the first holding portion is reduced and an area of the substrate held by the holding device is increased.

24. The substrate conveying method according to claim 22 or 23, wherein the first holding portion is moved so that a distance between the first holding portion and the second holding portion becomes larger by the relative movement, and a region between a region held by the first holding portion and a region held by the second holding portion in the substrate is held by the holding device.

25. The substrate transport method according to claim 24, wherein the relative movement moves the first holding portion so as to retract from above the holding device to a position not overlapping the holding device in the up-down direction in a state where the second holding portion holds a part of the substrate, and holds the region of the substrate, the holding of which is released, in the holding device.

26. The substrate conveying method according to any one of claims 22 to 25, comprising conveying a part of the substrate to the holding device by the second holding portion.

27. The substrate transfer method according to claim 26, wherein the first holding portion is moved relative to the holding device and the second holding portion from one end side of the holding device to the other end side of the holding device, in which the second holding portion transfers a part of the substrate, by the relative movement.

28. The substrate carrying method according to any one of claims 22 to 27, wherein the substrate in a state in which a distance in an up-down direction of a part of the substrate from the holding device is shorter than a distance in other parts of the substrate from the holding device is held by the first holding device by the holding.

29. The substrate transfer method according to any one of claims 22 to 28, wherein one of the holding device and the second holding portion and the first holding portion is moved relative to the other in a direction along a holding surface of the holding device holding the substrate by the relative movement.

30. The substrate carrying method according to any one of claims 22 to 29, wherein the first holding portion is moved above the holding device by the relative movement.

31. The substrate conveying method according to any one of claims 22 to 30, comprising adjusting a position of the substrate with respect to the holding device in a state where the second holding portion holds a part of the substrate.

32. The substrate handling method according to any one of claims 22 to 31, comprising carrying out another substrate different from the substrate from the holding device,

And carrying out the other substrate by the carrying-out while the holding device and the second holding portion are relatively moving with respect to the first holding portion.

33. The substrate transfer method according to claim 32, wherein the other substrate is moved to a position between the first holding portion and the holding device in an up-down direction by the carry-out.

34. The substrate transfer method according to claim 32 or 33, wherein the first holding portion is moved relative to the second holding portion and the holding device by the relative movement, and the other substrate is carried out.

35. The substrate transport method according to any one of claims 32 to 35, wherein the other substrate floating on the holding device is moved along a holding surface of the holding device by the carry-out.

36. An exposure method, comprising:

handling the substrate to the holding device by a substrate handling method according to any one of claims 22 to 35; and

and irradiating the substrate with an energy beam, and exposing the substrate.

37. A method of manufacturing a flat panel display, comprising:

exposing the substrate using the exposure method according to claim 36; and

Developing the exposed substrate.

38. A method of manufacturing a device, comprising:

exposing the substrate using the exposure method according to claim 36; and

developing the exposed substrate.