CN116364837A - LED device reflecting material and use method thereof - Google Patents
LED device reflecting material and use method thereof Download PDFInfo
- Publication number
- CN116364837A CN116364837A CN202211531225.0A CN202211531225A CN116364837A CN 116364837 A CN116364837 A CN 116364837A CN 202211531225 A CN202211531225 A CN 202211531225A CN 116364837 A CN116364837 A CN 116364837A
- Authority
- CN
- China
- Prior art keywords
- titanium dioxide
- light
- reflective material
- led device
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 103
- 238000000034 method Methods 0.000 title claims abstract description 18
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 194
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 97
- 230000001965 increasing effect Effects 0.000 claims abstract description 20
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 19
- 239000010703 silicon Substances 0.000 claims abstract description 19
- 238000000227 grinding Methods 0.000 claims abstract description 8
- 239000008240 homogeneous mixture Substances 0.000 claims abstract description 4
- 239000012258 stirred mixture Substances 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 15
- 239000002253 acid Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000003595 mist Substances 0.000 claims description 9
- 230000007797 corrosion Effects 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims 3
- 229920002050 silicone resin Polymers 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 30
- 238000002360 preparation method Methods 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 17
- 238000009792 diffusion process Methods 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000009826 distribution Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 238000005253 cladding Methods 0.000 description 2
- JZZIHCLFHIXETF-UHFFFAOYSA-N dimethylsilicon Chemical compound C[Si]C JZZIHCLFHIXETF-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- -1 functional group modified silica gel Chemical class 0.000 description 2
- NCWQJOGVLLNWEO-UHFFFAOYSA-N methylsilicon Chemical compound [Si]C NCWQJOGVLLNWEO-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XJWOWXZSFTXJEX-UHFFFAOYSA-N phenylsilicon Chemical compound [Si]C1=CC=CC=C1 XJWOWXZSFTXJEX-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The application provides an LED device reflecting material which comprises the following components in parts by weight: 20-50 parts of titanium dioxide and 50-80 parts of organic silicon, wherein the titanium dioxide and the organic silicon are weighed according to the required weight fraction during preparation; uniformly stirring the weighed titanium dioxide and the organic silicon to enable the titanium dioxide to be completely embedded into the organic silicon; placing the uniformly stirred mixture into a grinding and dispersing machine for grinding, and increasing the wettability of titanium dioxide; the milled homogeneous mixture can be used directly on an LED device. The reflective material provided by the invention can be properly transmitted and has a certain reflective effect when being matched with the use method, so that light rays can be transmitted and can be reflected, and the reflective material is arranged above the LED lamp, so that the angle of reflection to the periphery can be greatly increased, and the uniformity of light spots is improved.
Description
Technical Field
The invention relates to a reflective material of an LED device and a use method thereof, belonging to the technical field of light emitting diodes.
Background
In the field of backlight display, LEDs have successfully replaced CCFL, CFL, incandescent lamps and illumination, LEDs have infinite potential, mini-LEDs have become new kinetic energy for the growth of the LED industry in the next years, the current Mini-LED market uses a semitransparent frame, reflective colloid is coated on the bottom and the inner side of the semitransparent frame, but due to overlarge front light emission, the light spot effect of the product is poor, a plurality of LED lamps are required to be closely distributed, driving current is reduced to achieve the effect of compensating brightness and darkness of the LEDs, on one hand, the manufacturing cost is high due to the adoption of the closely distributed plurality of LED lamps, and on the other hand, the quantity of the LED lamps is large, faults and damages easily occur, so that the maintenance cost is increased.
And because the reflection efficiency of the milky white reflecting glue sold in the market at present is not high, the problem that the reflection efficiency is low in the manufacturing process is found that the reflection and diffusion angle of Mini-LED products is only about 140 degrees when the Mini-LED products are manufactured, so that the light spot effect of the products is uneven, daily requirements cannot be met, the reflecting glue provided by manufacturers is more available, the reflection efficiency of the Mini-LED products prepared by using different batches of reflecting glue is different, the light spot effect difference of the products is larger, and the products cannot be standardized is solved.
Therefore, finding a reflective material which can make the light emitted from the periphery and the periphery of a Mini-LED lamp uniform, so that LEDs do not need to be closely distributed, the number of LEDs used is reduced, and a good light spot effect is achieved, and the technical problem to be solved by the skilled man is urgent.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide the reflecting material which can transmit light properly and has a certain reflecting effect, so that light rays can be reflected while transmitting light, and the angle of reflection to the periphery can be greatly increased by arranging the reflecting material above the LED lamp, so that the uniformity of light spots is increased.
According to an embodiment of the present invention, there is provided a first aspect of:
the LED device reflecting material comprises the following components in parts by weight: 20-50 parts of titanium dioxide and 50-80 parts of organosilicon. Preferably 24-46 parts of titanium dioxide, more preferably 29-39 parts of titanium dioxide, more preferably 33-36 parts of titanium dioxide, more preferably 35 parts of titanium dioxide, preferably 50-80 parts of organosilicon, more preferably 54-76 parts of organosilicon, more preferably 58-72 parts of organosilicon, more preferably 63-68 parts of organosilicon, more preferably 65 parts of organosilicon.
It should be noted that, this reflective material utilizes titanium dioxide to have certain hiding power and scattering effect to the visible light, but the luminousness of reflective material is adjusted through controlling titanium dioxide's content, and the current input that often uses in the LED lamp makes the LED light have certain luminance, makes reflective material can have the luminousness that is fit for the LED lamp and passes through luminance through the content of titanium dioxide, makes the luminance of the light that sees out and the light luminance balance that reflects away, forms even facula.
Further, the particle diameter of the titanium dioxide is 1.5 to 800nm, preferably 20 to 780nm, more preferably 80 to 740nm, more preferably 140 to 650nm, more preferably 200 to 550nm, more preferably 250 to 450nm, more preferably 500 to 650nm.
It should be noted that, the smaller the equivalent titanium dioxide particle size, the larger the specific surface area, the smaller the titanium dioxide particle size is in favor of increasing the scattering of titanium dioxide to light, and because the visible light wavelength is 400-700nm, when the titanium dioxide particle size is in the visible light wavelength range, the titanium dioxide particle size has higher scattering power to visible light, and the light intensity is weakened because of interference or diffraction of light waves, so when the corresponding titanium dioxide particle size is set, the light intensity of the LED needs to be matched for adjustment, the light intensity of the reflection and transmission of the reflective material is equivalent, and the uniform-effect light spot is convenient to form.
Further, the organic silicon is any one of dimethyl silicon rubber, phenyl silicon resin, organic functional group modified silica gel, epoxy resin modified silica gel and methyl silicon resin. The epoxy resin modified silica gel is preferably selected, the organic silicon is in a transparent state, after the epoxy resin modified silica gel is modified, the transparent effect is good, the reflection and scattering effects of titanium dioxide are more favorably realized, the influence of the organic silicon on light is reduced, and therefore, the refraction and scattering of light can be more accurately controlled through the titanium dioxide.
Further, the outer surface of the titanium dioxide is coated with alumina, and the coating amount of the alumina is 2-5%, preferably 3-4%, more preferably 3% of the mass of the titanium dioxide.
When the alumina content of the surface coating of the titanium dioxide is 2-5%, the scattering capability of the titanium dioxide is improved along with the coating of the alumina, and the alumina hydrate on the surface of the titanium dioxide causes a steric hindrance effect among particles of the titanium dioxide to play a role in dispersing the titanium dioxide, so that the scattering effect of the titanium dioxide is improved.
Further, acid mist pitting is used in the preparation of the titanium dioxide, so that tiny pits are formed on the surfaces of titanium dioxide particles.
It should be noted that, after the surface of titanium dioxide adopts acid mist pitting, tiny pits are formed, so that the surface area of titanium dioxide is greatly increased, thereby increasing the refractive index, and meanwhile, increasing the roughness of the surface of titanium dioxide particles, enhancing the coating effect of alumina, and adjusting the reflection and refraction capacities of the surface of titanium dioxide through the control of the degree of acid mist pitting and the coating amount of alumina, thereby adapting to the light intensity in the LED lamp and improving the facula effect.
Further, the preparation method comprises the following steps:
weighing titanium dioxide and organic silicon according to the required weight fraction;
uniformly stirring the weighed titanium dioxide and the organic silicon to enable the titanium dioxide to be completely embedded into the organic silicon;
placing the uniformly stirred mixture into a grinding and dispersing machine for grinding, and increasing the wettability of titanium dioxide;
the milled homogeneous mixture can be used directly on an LED device.
It should be noted that, titanium dioxide and opportunity utilize to grind the dispenser fully to grind after mixing according to the proportion of predetermineeing can greatly increase the wettability of silicon dioxide to increase the dispersion effect of titanium dioxide in organosilicon, make the light that whole reflective material reflection and scattering come out more even, the facula is effectual.
According to an embodiment of the present invention, the use method of the reflective material of the LED device in the first aspect provided by the present invention provides a second aspect, which is:
according to the application method of the LED device reflecting material, the LED lamp is arranged in the semitransparent container, the reflecting material is arranged right above the LED lamp and is positioned on the lower surface of the semitransparent container, so that part of light rays emitted by the LED lamp are emitted out through the reflecting material, and the other part of light rays are reflected outwards by the reflecting material.
It should be noted that, the semitransparent container may be configured to have a structure in which the lower tank body and the upper cover body are matched, the LED lamp is disposed at the bottom of the tank body, and the upper cover body directly covers the upper opening of the tank body. The traditional method is to smear the reflective material on the inner side of the groove body, so that the LED lamp light is reflected upwards in an inclined way and forms light spots together with the light rays which are directly outwards scattered by the LED lamp, the formed light spots are strong in light rays which are directly scattered, the reflected light rays are more, the light spots are uneven, the light rays which are directly emitted are too strong, the current needs to be controlled to weaken the light intensity, the reflected light rays are weaker, and the formed light spots are poor in effect and difficult to control. The utility model provides a prepare into the reflective material that can control the refracting index and the transmissivity of light through using titanium dioxide and organosilicon in this application, with reflective material setting at the lower surface of lid, forward relatively with the LED lamp, the light that the LED lamp launched is penetrated reflective material through reflective material part and is penetrated reflective material and is penetrated, and another part is through reflective material refraction, and the outside slope of refraction is downwards, forms the facula of wide-angle in the container outside, but also steerable transmission and the volume of refracting light through the content of titanium dioxide among the control reflective material to adjust the facula effect.
Further, the input current of the LED lamp is 5-20mA. Preferably 8-17mA, more preferably 15mA.
It should be noted that, the size of the input current of the LED lamp in the application needs to be matched with the thickness of the reflective material on the translucent container, a part of the light generated under the current is transmitted, a part of the light spots formed by refraction are uniform in brightness, and the generated light effect is good.
Further, the reflective material is disposed on the translucent container to a thickness of 100-500um. Preferably 130 to 450um, more preferably 180 to 380um, more preferably 250 to 320um, more preferably 270 to 300um.
The thickness of the reflective material can be adjusted according to the amount of titanium dioxide added in the reflective material, and the larger the thickness of the titanium dioxide is, the larger the reflection intensity of the titanium dioxide to light is increased.
Further, the surface of the reflecting material is a plane or a concave surface with the middle being a plane and the peripheral edges tilting outwards.
It should be noted that, when the face that reflective material is located is the plane, the light angle that the light that the LED light source launched was gone out in the refraction of the different positions on same plane is different, and because reflective material directly over the light source, the light of reflection and scattering can outwards slope downward-fire, increases the light angle that whole light source diverged to increase the facula effect, and make light softer even through the scattering of titanium dioxide, increase facula homogeneity. When the middle of the surface where the reflective material is located is a plane and the periphery edges of the reflective material are outwards tilted concave, the light reflected by the middle plane part is more towards the outside, the reflected light is more towards the horizontal line, the periphery of the reflective material is outwards tilted and tilted, the tilted angle can be gradually increased, the width of each 0.2-0.3cm is increased by 1-2 degrees, the gradually increased inclination can enable the reflected light to be uniformly dispersed, the light distribution exists at each angle, and the formed facula effect is better.
Compared with the prior art, the LED lamp reflecting material and the application method thereof have the following technical effects:
1. the reflective material is prepared by combining the titanium dioxide and the organic silicon, the silicon dioxide has a good scattering effect on light, light is uniformly scattered, the organic silicon is made of a transparent material, and can be used as a base material of the titanium dioxide without influencing light transmission and scattering, so that the quantity of reflected light and transmitted light can be controlled by controlling the content of the titanium dioxide without adjusting the content of other substances, so that the light of each part is balanced, and the light spot effect is good;
2. this application is through using titanium dioxide directly over the LED lamp, and the position that sets up with traditional LED lamp reflective material is different, sets up the reflective material that uses directly over the LED lamp and need possess certain luminousness and reflectivity, and the principle with traditional luminescent material is different, and the component that uses is also different, and the reflective material raw materials of this application is simpler, and adjusts titanium dioxide content in order to adjust the luminousness according to light intensity, is convenient for adjust according to the in service behavior.
3. This application makes the particle of titanium dioxide through at titanium dioxide surface cladding aluminium oxide have the steric hindrance effect between, plays the dispersion to titanium dioxide to increase titanium dioxide's scattering effect, thereby increase the scattering effect to light, make the facula even, carry out the pitting at titanium dioxide surface acid mist and be convenient for increase titanium dioxide surface area, and titanium dioxide's scattering effect, make aluminium oxide more easily cladding on the titanium dioxide surface simultaneously.
Drawings
FIG. 1 is a schematic diagram of a light exit route of an LED device of the present invention;
reference numerals:
the LED lamp comprises a groove body 1, a cover body 2 and an LED lamp 3.
Detailed Description
In order to better understand the technical solutions in the present application, the following description will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
It is noted that when an element is referred to as being "fixed" or "disposed on" another element, it can be directly on the other element or be indirectly disposed on the other element; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or components referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" or "a number" is two or more, unless explicitly defined otherwise.
It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the scope of the present disclosure, since any structural modifications, proportional changes, or dimensional adjustments made by those skilled in the art should not be made in the present disclosure without affecting the efficacy or achievement of the present disclosure.
The existing LED lamp is characterized in that a reflecting material is smeared on the inner side of a transparent groove body, the reflecting material on the inner side of the groove body reflects light of an LED lamp light source to two sides to enable the light to incline upwards, so that the light spot area is enlarged, but because the reflected light is inclined upwards, the light spot area diffusion effect is limited, the light intensity directly emitted from the upper part is larger, and the light spot intensity is uneven, so that the method for finding the LED lamp device is very important.
The application discloses a reflective material of an LED device, which comprises the following components in parts by weight: 20-50 parts of titanium dioxide and 50-80 parts of organosilicon. Wherein the particle size of the titanium dioxide is 1.5-800nm, the organic silicon is any one of dimethyl silicon rubber, phenyl silicon resin, organic functional group modified silica gel, epoxy resin modified silica gel and methyl silicon resin, the outer surface of the titanium dioxide is coated with alumina, and the coating amount of the alumina is 2-5% of the mass of the titanium dioxide. When titanium dioxide is prepared, acid mist is used for pitting corrosion, so that tiny pits are formed on the surfaces of titanium dioxide particles. The acid mist pitting corrosion can increase the surface area of titanium dioxide, so that the multidirectional property of transmitted light and reflected light is increased, and the softness of light is increased.
The preparation method of the LED device reflective material comprises the following steps: weighing titanium dioxide and organic silicon according to the required weight fraction; uniformly stirring the weighed titanium dioxide and the organic silicon to enable the titanium dioxide to be completely embedded into the organic silicon; placing the uniformly stirred mixture into a grinding and dispersing machine for grinding, and increasing the wettability of titanium dioxide; the milled homogeneous mixture can be used directly on an LED device.
The use method of the reflecting material is that the LED lamp is arranged in the semitransparent container, the reflecting material is arranged right above the LED lamp and is positioned on the lower surface of the semitransparent container, so that part of light rays emitted by the LED lamp are emitted out through the reflecting material, and the other part of the light rays are reflected outwards by the reflecting material. Wherein the input current of the LED lamp is 5-20mA. The reflective material is disposed on the translucent container at a thickness of 100-500um. The surface of the reflective material is a plane or a concave surface with the middle being a plane and the peripheral edges tilting outwards
Example 1
The LED device reflecting material comprises the following components in parts by weight: 20 parts of titanium dioxide and 80 parts of organosilicon.
Example 2
The LED device reflecting material comprises the following components in parts by weight: 35 parts of titanium dioxide and 65 parts of organosilicon.
Example 3
The LED device reflecting material comprises the following components in parts by weight: 50 parts of titanium dioxide and 50 parts of organosilicon.
Example 4
The LED device reflecting material comprises the following components in parts by weight: 40 parts of titanium dioxide and 60 parts of organosilicon.
The reflective material prepared in examples 1-3 and the conventional reflective material plastic lens were set in the same LED device, which is a translucent container comprising a structure in which a lower tank body 1 and an upper cover body 2 are fitted, an LED lamp 3 is set at the bottom inside the tank body, and the upper cover body directly covers the upper opening of the tank body.
The traditional method is to smear reflective materials on the inner side of the groove body, so that the LED lamp light is reflected upwards in an inclined mode, light spots are formed together with light rays which are directly outwards diffused by the LED lamp, and the diffusion angle of the light spots is tested.
The reflective materials prepared in examples 1-4 were disposed on the lower surface of the cover, and were forward-facing to the LED lamp, and the light emitted from the LED lamp was partially transmitted through the reflective material, and the other was refracted by the reflective material, and the refraction was outward inclined downward, so as to form a large-angle spot on the outside of the container, and the spread angle of the spot was measured.
The light spot diffusion angle is measured by light angle intensity distribution, wherein the measuring temperature is 25 ℃, the measuring humidity is 60%, and the forward current is 15mA. In the test results, the light spot spread angles of the LED devices using the conventional reflective material plastic lenses were 139.4 °, and the light spot spread angles of the LED devices using the reflective materials of examples 1 to 4 were 142.2 °, 147.8 °, 146 °, 145.8 °, respectively.
Therefore, the light-reflecting material can better increase the light spot diffusion angle, and the formed light spots are uniform in effect and large in diffusion area.
Example 5
The LED device reflecting material comprises the following components in parts by weight: 35 parts of titanium dioxide and 65 parts of organosilicon. The use method of the reflecting material comprises the steps that firstly, the LED lamp is arranged in the semitransparent container, the reflecting material is arranged right above the LED lamp and is positioned on the lower surface of the semitransparent container, so that part of light rays emitted by the LED lamp are emitted out through the reflecting material, and the other part of light rays are reflected outwards by the reflecting material. Wherein the input current of the LED lamp is 15mA. The reflective material is disposed on the translucent container at a thickness of 250um. The middle part of the surface where the reflective material is positioned is a plane, and the peripheral edges are tilted upwards to form a whole body with an inclined edge.
The embodiment is used for carrying out light angle strong distribution test, the test conditions are consistent with the test conditions, the light spot diffusion angle of the LED device is 149.6 degrees, and the transition of light at the joint of the transmitted light and the refracted light in the light spot is more uniform, so that the light rays with different angles can be refracted through the position arrangement of the reflecting material and the angle difference between the reflecting material and the light rays of the light source, the light rays of the transmitted light and the reflected light rays can be fused and transited to the greatest extent, and the light spot effect is better.
Example 6
The LED device reflecting material comprises the following components in parts by weight: 35 parts of titanium dioxide and 65 parts of organosilicon. Wherein the surface of the titanium dioxide is coated with alumina, and the coating amount of the alumina is 3% of the mass of the titanium dioxide. The use method of the reflecting material comprises the steps that firstly, the LED lamp is arranged in the semitransparent container, the reflecting material is arranged right above the LED lamp and is positioned on the lower surface of the semitransparent container, so that part of light rays emitted by the LED lamp are emitted out through the reflecting material, and the other part of light rays are reflected outwards by the reflecting material. Wherein the input current of the LED lamp is 15mA. The reflective material is disposed on the translucent container at a thickness of 250um. The surface of the reflective material is a plane.
The light angle intensity distribution test is carried out by using the embodiment, the test conditions are consistent with the test conditions, the light spot diffusion angle of the LED device is 147.8 degrees, but the formed light spots are more uniform, soft and comfortable compared with the transition of the embodiment 2, and the brightness is more average, so that after the aluminum oxide coating is added into the titanium dioxide, the light spots formed by refraction or transmission can be more uniformly and softly dispersed after the steric hindrance effect of the titanium dioxide is increased.
Example 7
The LED device reflecting material comprises the following components in parts by weight: 35 parts of titanium dioxide and 65 parts of organosilicon. The titanium dioxide is prepared by using acid mist to pitting corrosion, so that tiny pits are formed on the surfaces of titanium dioxide particles. The use method of the reflecting material comprises the steps that firstly, the LED lamp is arranged in the semitransparent container, the reflecting material is arranged right above the LED lamp and is positioned on the lower surface of the semitransparent container, so that part of light rays emitted by the LED lamp are emitted out through the reflecting material, and the other part of light rays are reflected outwards by the reflecting material. Wherein the input current of the LED lamp is 15mA. The reflective material is disposed on the translucent container at a thickness of 250um. The surface of the reflective material is a plane.
The embodiment is used for carrying out light angle strong distribution test, the test conditions are consistent with the test conditions, the light spot diffusion angle of the LED device is 147.4 degrees, the formed light spot is softer and more comfortable than the light of the embodiment 2, and the brightness is uniform, so that after the surface of the titanium dioxide is subjected to acid mist pitting corrosion, the reflection angle of the light is increased after a plurality of tiny pits are formed on the surface of the titanium dioxide, the light spot is more dispersed and softer, and the formed light spot transition is also more uniform.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The LED device reflecting material is characterized by comprising the following components in parts by weight: 20-50 parts of titanium dioxide and 50-80 parts of organosilicon.
2. The LED device reflective material of claim 1, wherein said titanium dioxide has a particle size of 1.5-800nm.
3. The LED device reflective material according to claim 2, wherein the silicone is any one of dimethyl silicone rubber, phenyl-containing silicone resin, organofunctional modified silicone, epoxy modified silicone, methyl silicone resin.
4. The LED device reflecting material according to claim 1, wherein the outer surface of the titanium dioxide is coated with aluminum oxide, and the coating amount of the aluminum oxide is 2-5% of the mass of the titanium dioxide.
5. The LED device reflecting material according to claim 4, wherein the titanium dioxide is prepared by using acid mist to pitting corrosion, so that tiny pits are formed on the surface of titanium dioxide particles.
6. The LED device retroreflective material of claim 1, wherein the method of making comprises the steps of:
weighing titanium dioxide and organic silicon according to the required weight fraction;
uniformly stirring the weighed titanium dioxide and the organic silicon to enable the titanium dioxide to be completely embedded into the organic silicon;
placing the uniformly stirred mixture into a grinding and dispersing machine for grinding, and increasing the wettability of titanium dioxide;
the milled homogeneous mixture can be used directly on an LED device.
7. The method of using the reflective material of the LED device according to any one of claims 1 to 6, wherein the LED lamp is disposed in the translucent container, and the reflective material is disposed directly above the LED lamp and on the lower surface of the translucent container, such that a portion of the light emitted from the LED lamp is emitted through the reflective material, and a portion of the light is reflected by the reflective material.
8. The method of claim 7, wherein the LED lamp has an input current of 5-20mA.
9. The method of efficiently depositing a single crystal of silicon carbide according to claim 7 wherein said retroreflective material is disposed on said translucent container to a thickness of 100-500um.
10. The method of claim 7, wherein the surface of the reflective material is a plane or a concave surface with a plane middle and tilted periphery.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211531225.0A CN116364837A (en) | 2022-12-01 | 2022-12-01 | LED device reflecting material and use method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211531225.0A CN116364837A (en) | 2022-12-01 | 2022-12-01 | LED device reflecting material and use method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN116364837A true CN116364837A (en) | 2023-06-30 |
Family
ID=86925853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202211531225.0A Pending CN116364837A (en) | 2022-12-01 | 2022-12-01 | LED device reflecting material and use method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN116364837A (en) |
-
2022
- 2022-12-01 CN CN202211531225.0A patent/CN116364837A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USRE48601E1 (en) | Optical sky-sun diffuser | |
JP5301899B2 (en) | Light source device and lighting apparatus using the same | |
JP5336474B2 (en) | Recyclable backlight with semi-specular components | |
CN1839279A (en) | Surface light source device | |
WO2020025055A1 (en) | Led light source, surface light source display module, and preparation method for led light source | |
CN1839280A (en) | Surface light source | |
JP5351354B2 (en) | Light distribution control lens, light source device using the same, and lighting fixture | |
CN1816719A (en) | Light source device and light deflection element | |
CN103836412B (en) | Illuminator | |
CN100416317C (en) | Luminous body | |
CN101118043A (en) | Hollow type plate illuminating device | |
CN104603521B (en) | Lighting device | |
CN108803142A (en) | Light source and preparation method thereof, backlight module, display panel | |
CN104704286B (en) | Flux control member, light-emitting device and lighting device | |
US12072513B2 (en) | Lighting device and optical member | |
CN116364837A (en) | LED device reflecting material and use method thereof | |
KR20060029391A (en) | Optical film, and backlight assembly and display device having the same | |
CN110888190A (en) | High-uniformity quantum dot multifunctional optical composite board | |
CN218783048U (en) | LED four-side light-emitting device | |
US9784428B2 (en) | Lighting device with optoelectronic light source | |
CN106908960A (en) | Eliminate the porous core and laser-activated liquid crystal cells display of laser picture speckle | |
CN102418851A (en) | Light emitting diode light source, manufacturing method thereof and backlight source with light emitting diode light source | |
CN207264030U (en) | Eliminate porous sand core and the laser-activated liquid crystal cells display of laser picture speckle | |
CN109148428A (en) | A kind of direct backlight source structure and its manufacturing method applied to mini and micro backlight | |
CN215297926U (en) | Wavelength conversion module and projection device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |