CN116277362A

CN116277362A - Sheet processing method and intelligent switch

Info

Publication number: CN116277362A
Application number: CN202310017797.5A
Authority: CN
Inventors: 严德龙
Original assignee: Shenzhen Oribo Technology Co Ltd
Current assignee: Shenzhen Oribo Technology Co Ltd
Priority date: 2023-01-06
Filing date: 2023-01-06
Publication date: 2023-06-23

Abstract

The invention relates to a sheet processing method and an intelligent switch, wherein the sheet processing method comprises the following steps: providing a base plate and wood chips, wherein the deformation degree of the base plate is smaller than that of the wood chips; coating glue on the substrate and/or the wood chips; and (3) bonding the wood chips and/or one side surface of the substrate coated with glue to obtain a sheet. By the arrangement, the sheet obtained by processing can be prevented from buckling deformation. Meanwhile, after the sheet is applied to a finished product, the substrate with small deformation degree exists, so that the whole sheet has low deformation degree, and the sheet can be prevented from being deformed in a humid or high-temperature environment. Therefore, the intelligent home structure with the sheet is more stable and compact. The intelligent switch comprises the sheet material processed by the sheet material processing method, and the sheet material is not easy to deform and break.

Description

Sheet processing method and intelligent switch

Technical Field

The invention relates to the technical field of intelligent home furnishing, in particular to a sheet processing method and an intelligent switch.

Background

With the development of technology, various smart home devices, and central control devices for overall control of the smart home devices, such as smart speakers or smart touch panels, are gradually developed. Current smart homes often provide wooden structures as decorative sheets. Along with the development of the technology of various intelligent devices, the intelligent home is also developed towards miniaturization and light weight.

However, with miniaturization and thinness of smart home, wooden decorative sheets are gradually unable to meet the requirements. Namely, after the wooden decorative sheet is thinned in the prior art, the decorative sheet is easy to deform and break.

Disclosure of Invention

Accordingly, it is necessary to provide a sheet processing method and an intelligent switch for solving the problem of how to process a wooden decorative sheet with small deformation.

A sheet processing method, the sheet processing method comprising:

providing a base plate and wood chips, wherein the deformation degree of the base plate is smaller than that of the wood chips;

coating glue on the substrate and/or the wood chips;

and (3) bonding the wood chips and/or one side surface of the substrate coated with glue to obtain a sheet.

In one embodiment, the substrate and the wood chips are attached and then further comprise grooving, wherein the grooving comprises a plurality of through grooves penetrating through the substrate and the wood chips are formed in the sheet, and the through grooves are distributed at intervals.

In one embodiment, the interval between the adjacent through grooves is larger than 1mm, and the distance between the groove wall of the through groove located in the edge area and the edge outside the sheet is larger than 1mm.

In one embodiment, the width of the through groove is greater than 1mm.

In one embodiment, the substrate when attached to the wood chip further comprises a positioning process, the positioning process comprising: and correspondingly matching the preset positioning columns on the base plate with the preset positioning holes on the wood chips, so that the base plate and the wood chips are positioned with each other.

In one embodiment, the substrate is bonded to the sheet material further including a dwell process, the dwell process including: the base plate is provided with a plurality of buckles in advance, and the buckles are abutted against one side of the wood chip opposite to the base plate when the base plate is attached to the wood chip, so that the base plate is attached to the wood chip.

In one embodiment, the method further comprises air drying after the wood chips are attached to the substrate;

and removing the buckle after the air drying treatment.

In one embodiment, the substrate comprises a fiberglass material or an aluminum alloy material.

In one embodiment, the thickness ratio between the substrate and the wood chips within the sheet is 1:1 to 1:2; and/or

The thickness of the wood chips is greater than 1mm, and the thickness of the sheet is greater than or equal to 3mm.

An intelligent switch comprising a speaker and a sheet made by the sheet processing method of any of the embodiments, the sheet disposed on the speaker.

In the sheet processing method, the deformation degree of the base plate is smaller than that of the wood chips, namely the base plate is less prone to deformation relative to the wood chips. When the wood chip is attached to the base plate by gluing, the wood chip can be kept attached to the base plate under the constraint of the base plate and glue. By the arrangement, the sheet obtained by processing can be prevented from buckling deformation. Meanwhile, after the sheet is applied to a finished product, the substrate with small deformation degree exists, so that the whole sheet has low deformation degree, and the sheet can be prevented from being deformed in a humid or high-temperature environment. Therefore, the intelligent home structure with the sheet is more stable and compact.

It can be understood that a small degree of deformation means that the less likely deformation occurs under the influence of the external environment; and if the deformation degree is large, the deformation degree is opposite.

Drawings

FIG. 1 is a block flow diagram of a sheet processing method according to an embodiment of the present invention;

FIG. 2 is a further block flow diagram of the sheet processing method of FIG. 1;

FIG. 3 is a front view of a sheet processed by the sheet processing method of FIG. 2;

FIG. 4 is an enlarged view of a portion of FIG. 3 at A;

FIG. 5 is an isometric view of the base plate as it is being attached to the wood chips;

FIG. 6 is an isometric view of the substrate of FIG. 5;

fig. 7 is an axial schematic diagram of an intelligent switch according to an embodiment of the invention.

Reference numerals; 100. a sheet; 101. a through groove; 110. a substrate; 111. positioning columns; 112. a buckle; 120. wood chips; 121. positioning holes; 200. a speaker; 300. and (3) an intelligent switch.

Detailed Description

In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Referring to fig. 1, a sheet processing method according to an embodiment of the present invention includes the steps of:

step 10, providing a base plate 110 and a wood chip 120, wherein the deformation degree of the base plate 110 is smaller than that of the wood chip 120.

Step 20, coating glue on the substrate 110 and/or the wood chip 120.

Step 40, the side of the wood piece 120 and/or the substrate 110 coated with the glue is used for bonding, so that the wood piece 120 is bonded to the substrate 110 to obtain the sheet 100.

In the processing method of the sheet 100, the deformation degree of the base plate 110 is smaller than that of the wood pieces 120, that is, the base plate 110 is less likely to deform relative to the wood pieces 120. When the wood pieces 120 are attached to the base plate 110 by gluing, the wood pieces 120 can be kept attached to the base plate 110 by the gluing action of the glue. By doing so, the sheet 100 obtained by processing can be prevented from buckling. Meanwhile, in practical application, the substrate 110 with small deformation degree exists in the finished product of the sheet 100, so that the whole sheet 100 has low deformation degree, and the sheet 100 can be prevented from being deformed in a humid or high-temperature environment. Thus, the smart home structure to which the sheet 100 is applied is ensured to be more stable and compact.

In one embodiment, the glue may be specifically applied only to the substrate 110. The wood pieces 120 are then attached to the side of the base plate 110 coated with the glue, so that the wood pieces 120 and the base plate 110 can be attached to each other.

In one embodiment, the substrate 110 comprises a fiberglass material or an aluminum alloy material. It will be appreciated that the degree of deformation of the base plate 110 with fiberglass or aluminum alloy material is greater than the degree of deformation of the strands 120. In this manner, a carrier can be provided for the wood pieces 120 by the base plate 110. Bonding the base plate 110 to the strands 120 by glue results in a sheet 100 having less deformability, i.e., less tendency to deform, than a single strand 120.

Further, since the substrate 110 includes a glass fiber material or an aluminum alloy material, the flatness of the substrate 110 is better than the strands 120. Thus, the sheet 100 obtained by attaching the strands 120 to the base plate 110 has better flatness than the single strands 120. When the sheet 100 is used as a decorative sheet, the electronic device with the decorative sheet is more compact.

Still further, since the base plate 110 includes a glass fiber material or an aluminum alloy material, the strength of the base plate 110 is also better than that of the strands 120.

Referring to fig. 2, in one embodiment, the substrate 110 is bonded to the wood chips 120 and further includes a grooving process 70. The grooving process 70 includes a plurality of through grooves 101 formed in the sheet 100 so as to penetrate the substrate 110 and the wood chips 120, and the plurality of through grooves 101 are spaced apart from each other. Since the base plate 110 is adhered to the strands 120 by glue, and the deformation degree of the base plate 110 is smaller than that of the strands 120. It will be appreciated that the slotting process 70 is more convenient after the lamination process 40. And so configured, the degree of deformation of the sheet 100 resulting from the bonding process 40 is less than that of a single wood chip 120, and deformation of the sheet 100 due to the grooving force during grooving can be avoided.

The grooving process 70 allows the sheet 100 to be processed to have a plurality of through grooves 101, so that the sheet 100 can be used as a decorative sheet. For example, when the sheet 100 is provided as a decorative sheet on a speaker 200 to be mentioned later, the above-described plurality of through grooves 101 can secure the sound emitting area of the speaker 200.

Referring to fig. 3 and 4, in one embodiment, the interval between adjacent through grooves 101 is greater than 1mm, and the distance between the groove wall of the through groove 101 located at the edge area and the edge outside the sheet 100 is greater than 1mm. It will be appreciated that, since the sheet 100 obtained by bonding the base plate 110 and the wood pieces 120 has a small degree of deformation and high strength, the interval between the adjacent through grooves 101 can be made to be 1mm at a minimum without deformation or breakage. It is understood that deformation and breakage are less likely to occur when the interval between the adjacent through grooves 101 is greater than 1mm. In the same manner, since the sheet 100 obtained by bonding the base plate 110 and the wood pieces 120 has a small degree of deformation and high strength, the distance between the groove wall of the through groove 101 located in the edge region and the edge outside the sheet 100 can be made to be 1mm at the minimum without deformation or breakage. The interval between the adjacent through grooves 101 is shown by reference numeral M in fig. 4, and the distance between the groove wall of the through groove 101 located in the edge region and the edge outside the sheet 100 is shown by reference numeral K.

With continued reference to FIG. 4, in one embodiment, the width of the through slot 101 is greater than 1mm. Because the sheet 100 has good strength and deformability, the requirement of the size of the through groove 101 can be met conveniently. The width of the through groove 101 is shown as N in fig. 4.

Referring again to fig. 2, in one embodiment, the substrate 110 further includes a positioning process 30 when it is bonded to the wood chips 120, i.e., the bonding process 40 further includes a positioning process 30. The positioning process 30 includes: the base plate 110 and the wood pieces 120 are positioned with each other by corresponding cooperation of the positioning posts 111 preset on the base plate 110 and the positioning holes 121 preset on the wood pieces 120. Thus, the substrate 110 and the wood pieces 120 can be aligned accurately, and the structure of the laminated sheet 100 is ensured to be stable.

Referring to fig. 5 and fig. 6, in one embodiment, a plurality of positioning posts 111 are protruded on the substrate 110, and a plurality of positioning holes 121 are formed on the wood chip 120 at positions corresponding to the plurality of positioning posts 111 of the substrate 110. Thus, the substrate 110 and the wood chip 120 can be aligned accurately by matching the positioning posts 111 with the positioning holes 121.

Of course, in some embodiments, the positioning posts 111 may be disposed on the wood chip 120, and correspondingly, the positioning holes 121 may be formed on the base plate 110.

In one embodiment, the length of the positioning posts 111 is less than or equal to the depth of the positioning holes 121. So arranged, after the wood chip 120 is attached to the substrate 110, the positioning posts 111 will be located in the positioning holes 121 and not extend out of the positioning holes 121, so that the positioning posts 111 do not need to be cut off again to ensure that the overall structure of the sheet 100 is uniform and regular.

With continued reference to fig. 2, in one embodiment, the substrate 110 is bonded to the sheet 100 further including a dwell process 50. The dwell treatment 50 includes: the base plate 110 is preset with a plurality of buckles 112, and when the base plate 110 is attached to the wood pieces 120, the plurality of buckles 112 abut against one side of the wood pieces 120 opposite to the base plate 110, so that the base plate 110 is attached to the wood pieces 120. That is, in the present embodiment, the attachment between the wood pieces 120 and the base plate 110 can be maintained by the buckle 112 disposed on the base plate 110, and the attachment between the wood pieces 120 and the base plate 110 is not required to be maintained by an additional pressure maintaining device. It will be appreciated that since the buckle 112 is disposed on the base plate 110, the pressure maintaining process 50 is started after the wood chip 120 is attached to the base plate 110, and no additional pressure maintaining step is required. Thus, the sheet 100 can be processed more conveniently and rapidly.

Referring to fig. 2, in one embodiment, after the wood chips 120 are attached to the substrate 110, the air drying process 60 is further included, and the air drying process 60 includes: the sheet 100 is then placed in a ventilation place and air dried. It will be appreciated that the air drying process 60 is located before the grooving process 70, i.e., the sheet 100 is grooved after the glue is dried.

In one embodiment, the clasp 112 is removed after the air drying process 60. Meanwhile, the sheet 100 obtained after the air-drying process 60 may be cut to a desired size for a decorative sheet. The above-mentioned removing buckle 112 and cutting process are not sequential to the grooving process 70, and can be processed sequentially according to the requirement.

In one embodiment, the thickness ratio between the substrate 110 and the strands 120 within the sheet 100 is 1:1 to 1:2. It will be appreciated that the undersize of the thickness of the base plate 110 does not support the strands 120, but rather may deform under the influence of the strands 120. Whereas for ultra-thin decorative pieces, the more wood pieces 120 the better. Therefore, the thickness ratio between the base plate 110 and the wood pieces 120 in the sheet 100 is 1:1 to 1:2, which not only can meet the requirement of the base plate 110 for supporting the wood pieces 120, but also can meet the requirement of the wood pieces 120 in the decorative sheet. The thickness ratio of the base plate 110 to the wood pieces 120 may be specifically 1:1.

In one embodiment, the wood chips 120 have a thickness greater than 1mm and the sheet 100 has a thickness greater than or equal to 3mm.

Referring to fig. 7, an embodiment of the present invention further provides an intelligent switch 300, where the intelligent switch 300 includes a speaker 200 and a sheet 100. The sheet 100 is produced by the sheet 100 processing method described in each of the embodiments. The sheet 100 is provided on the speaker 200 to serve as a decorative sheet.

In one embodiment, the smart switch 300 includes a sheet 100 having a thickness of 3mm, a length of 101.5mm, and a width of 60.7mm. 44 through grooves 101 can be formed in the sheet 100, and the length of any through groove 101 is 55.5mm and the width is 1mm.

In one embodiment, the sheet 100 applied to the intelligent switch 300, as processed by the sheet processing method described above, is tested for 96 hours in an environment with an ambient temperature of 55 degrees and a humidity of 95%, and the sheet is not deformed and not warped.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims

1. A sheet processing method, characterized by comprising:

coating glue on the substrate and/or the wood chips;

2. The method of claim 1, wherein the substrate and the wood chips are bonded together and further comprising a grooving process, wherein the grooving process comprises forming a plurality of through grooves in the sheet, the through grooves being spaced apart from each other, through the substrate and the wood chips.

3. The sheet processing method according to claim 2, wherein a distance between adjacent through grooves is greater than 1mm, and a distance between a groove wall of the through groove located in an edge region and an edge outside the sheet is greater than 1mm.

4. The sheet processing method according to claim 2, wherein the width of the through groove is greater than 1mm.

5. The sheet processing method of claim 1, wherein said base plate when attached to said wood chips further comprises a positioning process comprising: and correspondingly matching the preset positioning columns on the base plate with the preset positioning holes on the wood chips, so that the base plate and the wood chips are positioned with each other.

6. The sheet processing method according to claim 1, wherein the substrate is bonded to the sheet further comprising a dwell treatment including: the base plate is provided with a plurality of buckles in advance, and the buckles are abutted against one side of the wood chip opposite to the base plate when the base plate is attached to the wood chip, so that the base plate is attached to the wood chip.

7. The sheet processing method of claim 6, further comprising an air drying treatment after said wood chips are bonded to said substrate;

and removing the buckle after the air drying treatment.

8. The sheet processing method according to any one of claims 1 to 7, wherein the substrate comprises a glass fiber material or an aluminum alloy material.

9. The sheet processing method according to any one of claims 1 to 7, characterized in that in the sheet, a thickness ratio between the base plate and the wood chips is 1:1 to 1:2; and/or

10. An intelligent switch comprising a speaker and a sheet material made by the sheet material processing method of any one of claims 1 to 9, said sheet material being disposed on said speaker.