CN116217891B - Intrinsic antibacterial epoxy resin precursor, composition, preparation method and application thereof - Google Patents
Intrinsic antibacterial epoxy resin precursor, composition, preparation method and application thereof Download PDFInfo
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- CN116217891B CN116217891B CN202310281771.1A CN202310281771A CN116217891B CN 116217891 B CN116217891 B CN 116217891B CN 202310281771 A CN202310281771 A CN 202310281771A CN 116217891 B CN116217891 B CN 116217891B
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- epoxy resin
- intrinsic antibacterial
- intrinsic
- resin precursor
- antibacterial
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- 230000000844 anti-bacterial effect Effects 0.000 title claims abstract description 141
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 131
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 131
- 239000002243 precursor Substances 0.000 title claims abstract description 68
- 239000000203 mixture Substances 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 33
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000004593 Epoxy Substances 0.000 claims description 33
- 150000001412 amines Chemical group 0.000 claims description 15
- 230000009477 glass transition Effects 0.000 claims description 13
- 239000001257 hydrogen Substances 0.000 claims description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims description 13
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- -1 polyphenol organic acid Chemical class 0.000 claims description 10
- 235000013824 polyphenols Nutrition 0.000 claims description 9
- YQUVCSBJEUQKSH-UHFFFAOYSA-N 3,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(O)=C1 YQUVCSBJEUQKSH-UHFFFAOYSA-N 0.000 claims description 8
- 239000003054 catalyst Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 7
- 230000032050 esterification Effects 0.000 claims description 7
- 238000005886 esterification reaction Methods 0.000 claims description 7
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical group CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims description 6
- 241000894006 Bacteria Species 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 4
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 4
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 4
- 241000192125 Firmicutes Species 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims description 4
- QAIPRVGONGVQAS-DUXPYHPUSA-N trans-caffeic acid Chemical compound OC(=O)\C=C\C1=CC=C(O)C(O)=C1 QAIPRVGONGVQAS-DUXPYHPUSA-N 0.000 claims description 4
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011825 aerospace material Substances 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 238000006482 condensation reaction Methods 0.000 claims description 3
- 230000018044 dehydration Effects 0.000 claims description 3
- 238000006297 dehydration reaction Methods 0.000 claims description 3
- 239000011253 protective coating Substances 0.000 claims description 3
- ACEAELOMUCBPJP-UHFFFAOYSA-N (E)-3,4,5-trihydroxycinnamic acid Natural products OC(=O)C=CC1=CC(O)=C(O)C(O)=C1 ACEAELOMUCBPJP-UHFFFAOYSA-N 0.000 claims description 2
- KOGSPLLRMRSADR-UHFFFAOYSA-N 4-(2-aminopropan-2-yl)-1-methylcyclohexan-1-amine Chemical compound CC(C)(N)C1CCC(C)(N)CC1 KOGSPLLRMRSADR-UHFFFAOYSA-N 0.000 claims description 2
- 150000008065 acid anhydrides Chemical class 0.000 claims description 2
- 229940074360 caffeic acid Drugs 0.000 claims description 2
- 235000004883 caffeic acid Nutrition 0.000 claims description 2
- QAIPRVGONGVQAS-UHFFFAOYSA-N cis-caffeic acid Natural products OC(=O)C=CC1=CC=C(O)C(O)=C1 QAIPRVGONGVQAS-UHFFFAOYSA-N 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims description 2
- 229940074391 gallic acid Drugs 0.000 claims description 2
- 235000004515 gallic acid Nutrition 0.000 claims description 2
- 239000011973 solid acid Substances 0.000 claims description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- 238000004132 cross linking Methods 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000009776 industrial production Methods 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 16
- 238000004659 sterilization and disinfection Methods 0.000 description 16
- 230000001954 sterilising effect Effects 0.000 description 15
- 241000588724 Escherichia coli Species 0.000 description 10
- 241000191967 Staphylococcus aureus Species 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 239000012496 blank sample Substances 0.000 description 8
- 150000002431 hydrogen Chemical class 0.000 description 8
- 238000010907 mechanical stirring Methods 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 238000010926 purge Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000001580 bacterial effect Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 4
- 150000007965 phenolic acids Chemical class 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 229920006334 epoxy coating Polymers 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002023 wood Substances 0.000 description 3
- MFAISHWFCBRFBO-UHFFFAOYSA-N 2-(3,4-dihydroxyphenyl)prop-2-enoic acid Chemical compound OC(=O)C(=C)C1=CC=C(O)C(O)=C1 MFAISHWFCBRFBO-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical group 0.000 description 2
- 230000000845 anti-microbial effect Effects 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 210000000170 cell membrane Anatomy 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 235000009048 phenolic acids Nutrition 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229960001124 trientine Drugs 0.000 description 2
- JOLVYUIAMRUBRK-UHFFFAOYSA-N 11',12',14',15'-Tetradehydro(Z,Z-)-3-(8-Pentadecenyl)phenol Natural products OC1=CC=CC(CCCCCCCC=CCC=CCC=C)=C1 JOLVYUIAMRUBRK-UHFFFAOYSA-N 0.000 description 1
- FSYPIGPPWAJCJG-UHFFFAOYSA-N 2-[[4-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1OCC1CO1 FSYPIGPPWAJCJG-UHFFFAOYSA-N 0.000 description 1
- YLKVIMNNMLKUGJ-UHFFFAOYSA-N 3-Delta8-pentadecenylphenol Natural products CCCCCCC=CCCCCCCCC1=CC=CC(O)=C1 YLKVIMNNMLKUGJ-UHFFFAOYSA-N 0.000 description 1
- 244000063299 Bacillus subtilis Species 0.000 description 1
- 235000014469 Bacillus subtilis Nutrition 0.000 description 1
- JOLVYUIAMRUBRK-UTOQUPLUSA-N Cardanol Chemical compound OC1=CC=CC(CCCCCCC\C=C/C\C=C/CC=C)=C1 JOLVYUIAMRUBRK-UTOQUPLUSA-N 0.000 description 1
- FAYVLNWNMNHXGA-UHFFFAOYSA-N Cardanoldiene Natural products CCCC=CCC=CCCCCCCCC1=CC=CC(O)=C1 FAYVLNWNMNHXGA-UHFFFAOYSA-N 0.000 description 1
- 241000237536 Mytilus edulis Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 244000052616 bacterial pathogen Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PTFIPECGHSYQNR-UHFFFAOYSA-N cardanol Natural products CCCCCCCCCCCCCCCC1=CC=CC(O)=C1 PTFIPECGHSYQNR-UHFFFAOYSA-N 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 210000000805 cytoplasm Anatomy 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 235000020638 mussel Nutrition 0.000 description 1
- 238000005580 one pot reaction Methods 0.000 description 1
- 230000003204 osmotic effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 150000008442 polyphenolic compounds Chemical group 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallyl group Chemical group C1(=C(C(=CC=C1)O)O)O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000003612 virological effect Effects 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
- C08G59/5013—Amines aliphatic containing more than seven carbon atoms, e.g. fatty amines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5026—Amines cycloaliphatic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/14—Paints containing biocides, e.g. fungicides, insecticides or pesticides
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A50/00—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE in human health protection, e.g. against extreme weather
- Y02A50/30—Against vector-borne diseases, e.g. mosquito-borne, fly-borne, tick-borne or waterborne diseases whose impact is exacerbated by climate change
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Plant Pathology (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Abstract
本发明公开了一种本征型抗菌环氧树脂前驱体、组合物及其制法与应用。所述本征型抗菌环氧树脂前驱体具有如下式所示的结构:其中,m、n独立地选自1~3。本发明中的本征型抗菌环氧树脂前驱体的制备流程简单,操作方法简便,可控制性好,易于实施,适用于大规模工业化生产;同时将得到的本征型抗菌环氧树脂前驱体与商用固化剂进行交联固化得到的产品在保持优异热力学性能的同时,还具有优异的本征抗菌性能和粘接性能,在抗菌涂层、涂料领域中有很好地应用前景。
The invention discloses an intrinsic antibacterial epoxy resin precursor, composition, preparation method and application thereof. The intrinsic antibacterial epoxy resin precursor has the structure shown in the following formula: Among them, m and n are independently selected from 1 to 3. The preparation process of the intrinsic antibacterial epoxy resin precursor in the present invention is simple, the operation method is simple, the controllability is good, and it is easy to implement, and is suitable for large-scale industrial production; at the same time, the obtained intrinsic antibacterial epoxy resin precursor is The product obtained by cross-linking and curing with commercial curing agents not only maintains excellent thermodynamic properties, but also has excellent intrinsic antibacterial properties and adhesive properties, and has good application prospects in the field of antibacterial coatings and coatings.
Description
技术领域Technical field
本发明属于高分子材料技术领域,涉及一种本征型抗菌环氧树脂前驱体、组合物及其制法与应用,尤其涉及一种本征型抗菌环氧树脂前驱体、组合物、固化物及其制备方法,及其在抗菌涂层中的用途。The invention belongs to the technical field of polymer materials, and relates to an intrinsic antibacterial epoxy resin precursor, composition, preparation method and application thereof, and in particular to an intrinsic antibacterial epoxy resin precursor, composition and cured product. Methods for their preparation, and their use in antibacterial coatings.
背景技术Background technique
环氧树脂因其具有优异的机械强度、粘接强度、优良的耐化学性、耐热性以及对各种材质都具有较高的附着力等优点,被广泛应用于交通运输、建筑设施、航空航天等领域。然而,大多数商用环氧树脂在作为涂层、涂料等应用时,经常由于细菌污染物的附着而造成大面积的细菌滋生和病毒污染,即使经过严格的清洁、消杀工作也难以根除顽固的细菌生物膜。因此,为了减少细菌污染和附着和因此给人们造成的不良影响,开发具备本征型抗菌环氧树脂成为当前热固性树脂功能化的主要研究重点之一。Epoxy resin is widely used in transportation, construction facilities, aviation, etc. due to its excellent mechanical strength, bonding strength, excellent chemical resistance, heat resistance, and high adhesion to various materials. aerospace and other fields. However, when most commercial epoxy resins are used as coatings, coatings, etc., they often cause large-scale bacterial growth and viral contamination due to the attachment of bacterial contaminants. Even after strict cleaning and disinfection work, it is difficult to eradicate stubborn bacteria. Bacterial biofilm. Therefore, in order to reduce bacterial contamination and attachment and the resulting adverse effects on people, the development of intrinsic antibacterial epoxy resins has become one of the main research focuses of current thermosetting resin functionalization.
有研究指出,本征型抗菌以酚类物质为主,而酚类物质的抗菌机制主要是通过破坏细胞膜、内容物渗出、细胞质凝结和改变细胞膜渗透压等过程来达到抗菌抑菌的目的。Cui和Ngo等人分别以腰果酚和苯酚支链脂肪酸酰胺为原料制备出苯酚型支链固化剂,以此制备的环氧涂层对大肠杆菌、枯草芽孢杆菌以及革兰氏阳性和革兰氏阴性细菌具有良好的抗菌抑菌活性[Progress in Organic Coatings,2018,115,9-17;Progress in OrganicCoatings,2020,141,105536.]。然而,这些涂层存在制备路线复杂、有机溶剂量大、耐久性差和固化时间长等问题,制约了它们的实际应用。因此,提供一种制备方法简单的本征型抗菌环氧树脂前驱体、组合物、固化物是亟待解决的问题。Some studies have pointed out that intrinsic antibacterial substances are mainly phenolic substances, and the antibacterial mechanism of phenolic substances mainly achieves antibacterial and antibacterial purposes by destroying cell membranes, exuding contents, condensing the cytoplasm, and changing the osmotic pressure of the cell membrane. Cui and Ngo et al. respectively prepared phenol-type branched chain curing agents using cardanol and phenol branched-chain fatty acid amide as raw materials. The epoxy coating prepared with this method was effective against Escherichia coli, Bacillus subtilis, Gram-positive and Gram-positive bacteria. Negative bacteria have good antibacterial and antibacterial activity [Progress in Organic Coatings, 2018, 115, 9-17; Progress in Organic Coatings, 2020, 141, 105536.]. However, these coatings have problems such as complex preparation routes, large amounts of organic solvents, poor durability, and long curing times, which restrict their practical application. Therefore, providing an intrinsic antibacterial epoxy resin precursor, composition, and cured product with a simple preparation method is an urgent problem to be solved.
发明内容Contents of the invention
本发明的主要目的在于提供一种本征型抗菌环氧树脂前驱体、组合物及其制法与应用,以克服现有技术的不足。The main purpose of the present invention is to provide an intrinsic antibacterial epoxy resin precursor, composition, preparation method and application thereof, so as to overcome the shortcomings of the existing technology.
为实现前述发明目的,本发明采用的技术方案包括:In order to achieve the foregoing invention objectives, the technical solutions adopted by the present invention include:
本发明实施例提供了一种本征型抗菌环氧树脂前驱体,它具有如式(I)所示的结构:The embodiment of the present invention provides an intrinsic antibacterial epoxy resin precursor, which has a structure shown in formula (I):
其中,m、n独立地选自1~3;R1、R2独立地选自 Among them, m and n are independently selected from 1 to 3; R 1 and R 2 are independently selected from
R3选自 *代表键连接位置。 R 3 is selected from *Represents key connection location.
本发明实施例还提供了前述的本征型抗菌环氧树脂前驱体的制备方法,其包括:使包含环氧树脂前驱体、多酚有机酸和酯化催化剂的混合反应体系于80~100℃进行脱水缩合反应3~6h,制得本征型抗菌环氧树脂前驱体。Embodiments of the present invention also provide a method for preparing the aforementioned intrinsic antibacterial epoxy resin precursor, which includes: heating a mixed reaction system containing an epoxy resin precursor, a polyphenol organic acid and an esterification catalyst at 80 to 100°C Carry out dehydration and condensation reaction for 3 to 6 hours to obtain an intrinsic antibacterial epoxy resin precursor.
本发明实施例还提供了一种本征型抗菌环氧树脂组合物,其包括前述的本征型抗菌环氧树脂前驱体及环氧固化剂。Embodiments of the present invention also provide an intrinsic antibacterial epoxy resin composition, which includes the aforementioned intrinsic antibacterial epoxy resin precursor and an epoxy curing agent.
本发明实施例还提供了一种本征型抗菌环氧树脂固化物的制备方法,其包括:使前述的本征型抗菌环氧树脂组合物于25~90℃进行梯度固化,制得本征型抗菌环氧树脂固化物。Embodiments of the present invention also provide a method for preparing an intrinsic antibacterial epoxy resin cured product, which includes: gradient curing the aforementioned intrinsic antibacterial epoxy resin composition at 25 to 90° C. to prepare an intrinsic antibacterial epoxy resin cured product. Antibacterial epoxy resin cured product.
本发明实施例还提供了由前述的制备方法制得的本征型抗菌环氧树脂固化物,所述本征型抗菌环氧树脂固化物的玻璃化转变温度为25~120℃,拉伸强度为10~100MPa,剪切强度为2~14MPa,粘接强度为4~15MPa,对革兰氏阴性菌的杀灭率在95%以上,对革兰氏阳性菌的杀灭率在90%以上。Embodiments of the present invention also provide an intrinsic antibacterial epoxy resin cured product prepared by the aforementioned preparation method. The intrinsic antibacterial epoxy resin cured product has a glass transition temperature of 25 to 120°C and a tensile strength of It is 10-100MPa, the shear strength is 2-14MPa, the bonding strength is 4-15MPa, the killing rate for Gram-negative bacteria is more than 95%, and the killing rate for Gram-positive bacteria is more than 90% .
本发明实施例还提供了前述的本征型抗菌环氧树脂组合物或本征型抗菌环氧树脂固化物于轨道交通运输、室内外建筑设施或航空航天材料的防护涂层领域中的用途。Embodiments of the present invention also provide the use of the aforementioned intrinsic antibacterial epoxy resin composition or intrinsic antibacterial epoxy resin cured product in the fields of rail transportation, indoor and outdoor building facilities, or protective coatings for aerospace materials.
本发明实施例还提供了一种抗菌涂层,所述抗菌涂层由前述的本征型抗菌环氧树脂组合物充分混合并施加于基体表面,再经干燥处理获得。Embodiments of the present invention also provide an antibacterial coating, which is obtained by thoroughly mixing the aforementioned intrinsic antibacterial epoxy resin composition and applying it to the surface of a substrate, followed by drying.
与现有技术相比,本发明的有益效果在于:Compared with the prior art, the beneficial effects of the present invention are:
(1)本发明制备的本征型抗菌环氧树脂前驱体直接采用环氧树脂前驱体与酚酸类物质作为原料,经过简单的一步法得到,制备方法简单,加工周期短,可控性好,利用普通的加工设备就可以进行大规模生产;(1) The intrinsic antibacterial epoxy resin precursor prepared by the present invention directly uses epoxy resin precursor and phenolic acid substances as raw materials, and is obtained through a simple one-step method. The preparation method is simple, the processing cycle is short, and the controllability is good. , large-scale production can be carried out using ordinary processing equipment;
(2)本发明所使用的酚酸类物质为可再生资源,且可以抑制的致病菌种类较多,因此,这种本征型抗菌环氧树脂类产品的开发对抗菌涂层领域的发展具有重要意义,可以解决现有涂层细菌污染严重,细菌生物膜难以清除等问题;(2) The phenolic acids used in the present invention are renewable resources and can inhibit many types of pathogenic bacteria. Therefore, the development of this intrinsic antibacterial epoxy resin product has a great impact on the development of the field of antibacterial coatings. It is of great significance and can solve the problems of serious bacterial contamination of existing coatings and difficulty in removing bacterial biofilms;
(3)本发明在制备环氧树脂前躯体中以及固化样条的过程中不添加任何溶剂,避免了大量有机溶剂的使用,减少了材料的加工成本以及存在的健康隐患。(3) The present invention does not add any solvent in the process of preparing the epoxy resin precursor and curing the spline, avoiding the use of a large amount of organic solvents, reducing material processing costs and existing health risks.
附图说明Description of the drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明中记载的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only These are some embodiments recorded in the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting creative efforts.
图1是本发明实施例1中制得的本征型抗菌环氧树脂前驱体的核磁共振氢谱图;Figure 1 is a hydrogen nuclear magnetic resonance spectrum of the intrinsic antibacterial epoxy resin precursor prepared in Example 1 of the present invention;
图2是本发明实施例1-5中制得的本征型抗菌环氧树脂前驱体的抗菌测试图。Figure 2 is an antibacterial test chart of the intrinsic antibacterial epoxy resin precursor prepared in Examples 1-5 of the present invention.
具体实施方式Detailed ways
鉴于现有技术的缺陷,本案发明人经长期研究和大量实践,得以提出本发明的技术方案,下面将对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。In view of the shortcomings of the prior art, the inventor of this case was able to propose the technical solution of the present invention after long-term research and extensive practice. The technical solution of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the present invention. Examples, not all examples. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.
具体的,作为本发明技术方案的一个方面,其所涉及的一种本征型抗菌环氧树脂前驱体具有如式(I)所示的结构:Specifically, as an aspect of the technical solution of the present invention, an intrinsic antibacterial epoxy resin precursor has a structure shown in formula (I):
其中,m、n独立地选自1~3;R1、R2独立地选自 Among them, m and n are independently selected from 1 to 3; R 1 and R 2 are independently selected from
R3选自 *代表键连接位置。 R 3 is selected from *Represents key connection location.
本发明提供的本征型抗菌环氧树脂的前驱体在制备环氧树脂时,所获产物具有非常优异的抗菌性能,优异的耐摩擦性能和较高的玻璃化转变温度。When the precursor of the intrinsic antibacterial epoxy resin provided by the invention is used to prepare the epoxy resin, the product obtained has very excellent antibacterial properties, excellent friction resistance and a high glass transition temperature.
具体而言,基于本发明提供的本征型抗菌环氧树脂前驱体所得的环氧树脂相比于传统的环氧树脂在多种性能上有很大提高,尤其是抗菌性能以及机械强度和粘附性能的改善,以酚酸类物质为原料与环氧树脂前驱体通过简单的一步法制备得到的环氧树脂前驱体不仅具有优异的抗菌性能和粘附性能,同时还具有较高的玻璃化转变温度,在交通运输、生活设施中具有广泛的应用前景。Specifically, the epoxy resin obtained based on the intrinsic antibacterial epoxy resin precursor provided by the present invention has greatly improved various properties compared with traditional epoxy resin, especially antibacterial performance, mechanical strength and adhesion. To improve the adhesion properties, the epoxy resin precursor prepared by a simple one-step method using phenolic acids as raw materials and epoxy resin precursor not only has excellent antibacterial properties and adhesion properties, but also has high vitrification Transition temperature has broad application prospects in transportation and living facilities.
本发明实施例的另一个方面还提供了前述的本征型抗菌环氧树脂前驱体的制备方法,其包括:使包含环氧树脂前驱体、多酚有机酸和酯化催化剂的混合反应体系于80~100℃进行脱水缩合反应3~6h,制得本征型抗菌环氧树脂前驱体。Another aspect of the embodiments of the present invention also provides a method for preparing the aforementioned intrinsic antibacterial epoxy resin precursor, which includes: allowing a mixed reaction system containing an epoxy resin precursor, a polyphenol organic acid and an esterification catalyst to Carry out dehydration condensation reaction at 80-100°C for 3-6 hours to obtain an intrinsic antibacterial epoxy resin precursor.
在一些优选实施方案中,所述环氧树脂前驱体具有如下式所示结构中的任一者:In some preferred embodiments, the epoxy resin precursor has any one of the structures shown in the following formula:
其中,m、n独立地选自1~3。Among them, m and n are independently selected from 1 to 3.
在一些优选实施方案中,所述环氧树脂前驱体包括乙二醇二缩水甘油醚、双酚F二缩水甘油醚、双酚A二缩水甘油醚、对苯二醇二缩水甘油醚中的任意一种或两种以上的组合且不限于此。In some preferred embodiments, the epoxy resin precursor includes any of ethylene glycol diglycidyl ether, bisphenol F diglycidyl ether, bisphenol A diglycidyl ether, and p-phenylene glycol diglycidyl ether. One or a combination of two or more and not limited to this.
在一些优选实施方案中,所述多酚有机酸包括没食子酸、原儿茶酸、咖啡酸中的任意一种或两种以上的组合,且不限于此。In some preferred embodiments, the polyphenol organic acid includes any one or a combination of two or more of gallic acid, protocatechuic acid, and caffeic acid, and is not limited thereto.
在一些优选实施方案中,所述酯化催化剂包括对甲基苯磺酸、磷酸、硫酸、硝酸、盐酸、固体酸中的任意一种或两种以上的组合,且不限于此。In some preferred embodiments, the esterification catalyst includes any one or a combination of two or more of p-toluenesulfonic acid, phosphoric acid, sulfuric acid, nitric acid, hydrochloric acid, solid acid, and is not limited thereto.
在一些优选实施方案中,所述环氧树脂前驱体、多酚有机酸与酯化催化剂的摩尔比为1:0.1~0.5:0.01~0.03。In some preferred embodiments, the molar ratio of the epoxy resin precursor, polyphenol organic acid and esterification catalyst is 1:0.1~0.5:0.01~0.03.
综上,本发明提供的一种本征型抗菌环氧树脂前驱体及其制备方法,在环氧树脂前驱体中引入酚酸类物质,相比于传统的环氧树脂,含有多酚结构可以赋予环氧树脂优良的抗菌性能,与固化剂进行交联固化得到的产品表现出来更优异的热力学性能、粘附性能以及抗细菌黏附性能;同时,该本征型抗菌环氧树脂前驱体的制备方法简单,操作易懂,反应条件可控,易于实施,适合大规模生产。In summary, the present invention provides an intrinsic antibacterial epoxy resin precursor and its preparation method, which introduces phenolic acid substances into the epoxy resin precursor. Compared with traditional epoxy resins, the polyphenol structure can It gives the epoxy resin excellent antibacterial properties, and the product obtained by cross-linking and curing with the curing agent shows better thermodynamic properties, adhesion properties and anti-bacterial adhesion properties; at the same time, the preparation of the intrinsic antibacterial epoxy resin precursor The method is simple, the operation is easy to understand, the reaction conditions are controllable, it is easy to implement, and it is suitable for large-scale production.
本发明实施例的另一个方面还提供了一种本征型抗菌环氧树脂组合物,其包括:前述的本征型抗菌环氧树脂前驱体及环氧固化剂。Another aspect of the embodiment of the present invention also provides an intrinsic antibacterial epoxy resin composition, which includes: the aforementioned intrinsic antibacterial epoxy resin precursor and an epoxy curing agent.
在一些优选实施方案中,所述环氧固化剂包括胺类固化剂,所述胺类固化剂包括聚醚胺D230、聚醚胺D400、二乙烯三胺、三乙烯四胺、四乙烯五胺、异佛尔酮二胺、孟烷二胺、聚酰胺固化剂中的任意一种或两种以上的组合,且不限于此。In some preferred embodiments, the epoxy curing agent includes an amine curing agent, and the amine curing agent includes polyetheramine D230, polyetheramine D400, diethylene triamine, triethylene tetraamine, and tetraethylene pentamine. , isophorone diamine, manganese diamine, polyamide curing agent, any one or a combination of two or more, and is not limited thereto.
在一些优选实施方案中,所述本征型抗菌环氧树脂前驱体的环氧当量值与环氧固化剂的活性氢或者酸酐基团的当量值的比值为100:(10~100)。In some preferred embodiments, the ratio of the epoxy equivalent value of the intrinsic antibacterial epoxy resin precursor to the equivalent value of the active hydrogen or anhydride group of the epoxy curing agent is 100: (10~100) .
进一步的讲,所述本征型抗菌环氧树脂组合物主要包括以下几个组分:Furthermore, the intrinsic antibacterial epoxy resin composition mainly includes the following components:
(A)前述本征型抗菌环氧树脂前驱体;(A) The aforementioned intrinsic antibacterial epoxy resin precursor;
(B)一种或多种环氧固化剂;(B) One or more epoxy curing agents;
其中,所述本征型抗菌环氧树脂前驱体具有如下式所示结构:Wherein, the intrinsic antibacterial epoxy resin precursor has the structure shown in the following formula:
其中,m、n选自1、2或3;R1、R2独立地选自 Among them, m and n are selected from 1, 2 or 3; R 1 and R 2 are independently selected from
R3选自 *代表键连接位置。 R 3 is selected from *Represents key connection location.
在一些实施例中,组分B的环氧固化剂为胺类以及酸酐类等,但不限于此。In some embodiments, the epoxy curing agent of component B is amines, acid anhydrides, etc., but is not limited thereto.
进一步地,所述胺类固化剂包括聚醚胺D230、聚醚胺D400、二乙烯三胺、三乙烯四胺、四乙烯五胺、异佛尔酮二胺、孟烷二胺和聚酰胺固化剂中的任意一种或两种以上的组合。Further, the amine curing agents include polyetheramine D230, polyetheramine D400, diethylene triamine, triethylene tetramine, tetraethylene pentamine, isophorone diamine, menthane diamine and polyamide curing agent. Any one or a combination of two or more agents.
在一些实施方式中,所述组分A本征型抗菌环氧树脂前驱体的环氧当量值(摩尔数)与组分B环氧固化剂的活性氢或酸酐基团当量值(摩尔数)的配比范围比例是10:(1~10)。In some embodiments, the epoxy equivalent value (moles) of the intrinsic antibacterial epoxy resin precursor of component A is the same as the active hydrogen or anhydride group equivalent value (moles) of the epoxy curing agent of component B. The proportion range of (number) is 10: (1~10).
本发明实施例的另一个方面还提供了一种本征型抗菌环氧树脂固化物的制备方法,其包括:使前述的本征型抗菌环氧树脂组合物于25~90℃进行梯度固化,制得本征型抗菌环氧树脂固化物。Another aspect of the embodiment of the present invention also provides a method for preparing an intrinsic antibacterial epoxy resin cured product, which includes: gradient curing the aforementioned intrinsic antibacterial epoxy resin composition at 25 to 90°C, Preparation of intrinsic antibacterial epoxy resin cured product.
在一些优选实施方案中,所述梯度固化处理包括:将所述本征型抗菌环氧树脂组合物于25~50℃固化2h,再于50~70℃固化2h,然后于70~90℃固化2h。In some preferred embodiments, the gradient curing treatment includes: curing the intrinsic antibacterial epoxy resin composition at 25-50°C for 2 hours, then curing at 50-70°C for 2 hours, and then curing at 70-90°C 2h.
进一步地,所述本征型抗菌环氧树脂固化物的制备方法由以下两个组分制备得到:Further, the preparation method of the intrinsic antibacterial epoxy resin cured product is prepared from the following two components:
(A)前述本征型抗菌环氧树脂前驱体;(A) The aforementioned intrinsic antibacterial epoxy resin precursor;
(B)一种或多种环氧固化剂。(B) One or more epoxy curing agents.
在一些实施方式中,所述本征型抗菌环氧树脂固化物的制备方法包括:将组分A本征型抗菌环氧树脂前驱体和组分B环氧固化剂在25~90℃温度范围内进行充分混合,刷涂在一些材料表面形成涂层,在30~100℃下烘干后。In some embodiments, the preparation method of the intrinsic antibacterial epoxy resin cured product includes: mixing the component A intrinsic antibacterial epoxy resin precursor and the component B epoxy curing agent at a temperature range of 25 to 90°C. Mix it thoroughly, brush it on the surface of some materials to form a coating, and dry it at 30 to 100°C.
其中一些材料包括金属、玻璃、聚合物、木头、瓷砖中的任意一种,且不限于此。Some of these materials include, but are not limited to, any of metal, glass, polymer, wood, ceramic tile.
本发明实施例的另一个方面还提供了前述的制备方法制得的本征型抗菌环氧树脂固化物,所述本征型抗菌环氧树脂固化物的玻璃化转变温度为25~120℃,拉伸强度为10~100MPa,剪切强度为2~14MPa,粘接强度为4~15MPa,对革兰氏阴性菌的杀灭率在95%以上,对革兰氏阳性菌的杀灭率在90%以上。Another aspect of the embodiment of the present invention also provides an intrinsic antibacterial epoxy resin cured product prepared by the aforementioned preparation method. The intrinsic antibacterial epoxy resin cured product has a glass transition temperature of 25 to 120°C. The tensile strength is 10-100MPa, the shear strength is 2-14MPa, and the bonding strength is 4-15MPa. The killing rate against Gram-negative bacteria is over 95%, and the killing rate against Gram-positive bacteria is over 95%. More than 90.
本发明实施例的另一个方面还提供了前述的本征型抗菌环氧树脂组合物或本征型抗菌环氧树脂固化物于轨道交通运输、室内外建筑设施或航空航天材料的防护涂层领域中的用途。Another aspect of the embodiment of the present invention also provides the aforementioned intrinsic antibacterial epoxy resin composition or intrinsic antibacterial epoxy resin cured product in the field of protective coatings for rail transportation, indoor and outdoor building facilities, or aerospace materials. uses in.
例如,抗菌涂层或抗菌涂料。For example, antimicrobial coatings or antimicrobial paints.
本发明实施例的另一个方面还提供了一种抗菌涂层,所述抗菌涂层由前述的本征型抗菌环氧树脂组合物充分混合并施加于基体表面,再经干燥处理获得。Another aspect of the embodiment of the present invention also provides an antibacterial coating, which is obtained by thoroughly mixing the aforementioned intrinsic antibacterial epoxy resin composition and applying it to the surface of a substrate, and then drying it.
进一步地,所述抗菌涂层由前述的本征型抗菌环氧树脂组合物中的本征型抗菌环氧树脂前驱体与环氧固化剂在25~90℃温度范围内进行充分混合,之后采用辊涂、刷涂、喷涂、浸涂等中的任一种方式施加于基体表面,然后于30~100℃下烘干。Further, the antibacterial coating is composed of the intrinsic antibacterial epoxy resin precursor and the epoxy curing agent in the aforementioned intrinsic antibacterial epoxy resin composition, which are thoroughly mixed in a temperature range of 25 to 90°C, and then used Apply to the surface of the substrate by any method such as roller coating, brush coating, spray coating, dip coating, etc., and then dry at 30 to 100°C.
进一步地,所述基体的材质包括金属、玻璃、聚合物、木头、瓷砖中的任意一种,且不限于此。Further, the material of the substrate includes any one of metal, glass, polymer, wood, and ceramic tiles, but is not limited thereto.
本发明通过将酚酸类化合物经过无溶剂“一锅法”的加工方式制备得到一系列本征型抗菌环氧树脂前驱体及其组合物,并通过调配组分制成涂料和固化等手段获得优异抗菌性能的本征型抗菌环氧涂层。与此同时,在本发明中,本征型抗菌环氧涂层交联结构中存在大量的邻苯二酚和/或邻苯三酚结构,具有与贻贝丝足蛋白主要成分聚多巴胺相似的强粘接性能,因此,发挥抗菌抑菌作用的同时,更表现出与包括金属、玻璃、聚合物、木头、瓷砖等在内的多种材质优异的粘接效果。The present invention prepares a series of intrinsic antibacterial epoxy resin precursors and their compositions by processing phenolic acid compounds through a solvent-free "one-pot method", and prepares them by blending the components to form coatings and curing them. Intrinsic antibacterial epoxy coating with excellent antibacterial properties. At the same time, in the present invention, there are a large number of catechol and/or pyrogallol structures in the cross-linked structure of the intrinsic antibacterial epoxy coating, which has a strong affinity similar to polydopamine, the main component of mussel podoprotein. Therefore, it not only exerts antibacterial and antibacterial effects, but also shows excellent bonding effects with a variety of materials including metal, glass, polymer, wood, ceramic tiles, etc.
下面结合若干优选实施例及附图对本发明的技术方案做进一步详细说明,本实施例在以发明技术方案为前提下进行实施,给出了详细的实施方式和具体的操作过程,但本发明的保护范围不限于下述的实施例。The technical solution of the present invention will be further described in detail below with reference to several preferred embodiments and the accompanying drawings. This embodiment is implemented on the premise of the technical solution of the invention and provides detailed implementation modes and specific operating processes. However, the present invention The scope of protection is not limited to the following examples.
下面所用的实施例中所采用的实验材料,如无特殊说明,均可由常规的生化试剂公司购买得到。The experimental materials used in the following examples can be purchased from conventional biochemical reagent companies unless otherwise specified.
实施例1Example 1
将1份乙二醇二缩水甘油醚、1份3,4-二羟基苯甲酸及0.01份对甲基苯磺酸置于带有机械搅拌和氮气吹扫的三口瓶中,在90℃下反应10小时,得到本征型抗菌环氧树脂前驱体1,产率为80%,其结构式如下式:Place 1 part of ethylene glycol diglycidyl ether, 1 part of 3,4-dihydroxybenzoic acid and 0.01 part of p-toluenesulfonic acid in a three-necked flask with mechanical stirring and nitrogen purging, and react at 90°C After 10 hours, intrinsic antibacterial epoxy resin precursor 1 was obtained with a yield of 80%. Its structural formula is as follows:
将得到的产品在烘箱中抽气两个小时,得到的产品的核磁谱图如图1所示,由图1可知,该单体被成功的制备。The obtained product was evacuated in the oven for two hours, and the NMR spectrum of the obtained product is shown in Figure 1. From Figure 1, it can be seen that the monomer was successfully prepared.
将得到的本征型抗菌环氧树脂前驱体与固化剂聚醚胺D230按照环氧和胺基活泼氢一比一的摩尔比下混合均匀后在鼓风烘箱进行加热固化,室温到80℃间隔20℃保温2h进行梯度升温固化,得到环氧树脂固化物。所述本征型抗菌环氧树脂固化物的玻璃化转变温度为25℃,拉伸强度为10MPa,剪切强度为12MPa,粘接强度为13MPa,所得的固化产物与空白样品进行抗菌测试,所得环氧固化物对大肠杆菌的抑制率为95.6%,对金黄葡萄球菌的杀菌率为93.5%,抗菌性能图如图2所示。Mix the obtained intrinsic antibacterial epoxy resin precursor and the curing agent polyetheramine D230 at a molar ratio of one to one between epoxy and amine active hydrogen, then heat and solidify in a blast oven at room temperature to 80°C. Keep the temperature at 20°C for 2 hours for gradient temperature curing to obtain a cured epoxy resin. The glass transition temperature of the intrinsic antibacterial epoxy resin cured product is 25°C, the tensile strength is 10MPa, the shear strength is 12MPa, and the bonding strength is 13MPa. The obtained cured product is subjected to an antibacterial test with a blank sample, and the result The epoxy cured product has an inhibition rate of 95.6% against E. coli and a sterilization rate of 93.5% against Staphylococcus aureus. The antibacterial performance diagram is shown in Figure 2.
实施例2Example 2
将2份双酚A二缩水甘油醚、1份3,4,5-三羟基苯甲酸及0.05份磷酸置于带有机械搅拌和氮气吹扫的三口瓶中,在100℃下反应8小时,得到本征型抗菌环氧树脂前驱体2,产率为85%,其结构式如下式:Place 2 parts of bisphenol A diglycidyl ether, 1 part of 3,4,5-trihydroxybenzoic acid and 0.05 part of phosphoric acid in a three-necked flask with mechanical stirring and nitrogen purging, and react at 100°C for 8 hours. The intrinsic antibacterial epoxy resin precursor 2 was obtained with a yield of 85% and its structural formula is as follows:
将得到的本征型抗菌环氧树脂前驱体与聚醚胺D400按照环氧和胺基活泼氢一比一的摩尔比下混合均匀后在鼓风烘箱进行加热固化,室温到100℃间隔20℃保温2h进行梯度升温固化,得到环氧树脂固化物。所述本征型抗菌环氧树脂固化物的玻璃化转变温度为120℃,拉伸强度为100MPa,剪切强度为14MPa,粘接强度为15MPa,所得的固化产物与空白样品进行抗菌测试,所得环氧固化物对大肠杆菌的杀菌率为95.3%对金黄葡萄球菌的杀菌率为94.7%,抗菌性能图如图2所示。Mix the obtained intrinsic antibacterial epoxy resin precursor and polyetheramine D400 at a molar ratio of one to one between epoxy and amine active hydrogen, then heat and solidify in a blast oven at intervals of 20°C from room temperature to 100°C. Keep the temperature for 2 hours for gradient temperature curing to obtain an epoxy resin cured product. The glass transition temperature of the intrinsic antibacterial epoxy resin cured product is 120°C, the tensile strength is 100MPa, the shear strength is 14MPa, and the bonding strength is 15MPa. The obtained cured product is subjected to an antibacterial test with a blank sample, and the result The sterilization rate of the epoxy cured product against Escherichia coli was 95.3%, and the sterilization rate against Staphylococcus aureus was 94.7%. The antibacterial performance diagram is shown in Figure 2.
实施例3Example 3
将3份乙二醇二缩水甘油醚、1份3,4,5-三羟基苯甲酸及0.01份硫酸置于带有机械搅拌和氮气吹扫的三口瓶中,在100℃下反应5小时,得到本征型抗菌环氧树脂前驱体3,产率为89%,其结构式如下式:Place 3 parts of ethylene glycol diglycidyl ether, 1 part of 3,4,5-trihydroxybenzoic acid and 0.01 part of sulfuric acid in a three-necked flask with mechanical stirring and nitrogen purging, and react at 100°C for 5 hours. The intrinsic antibacterial epoxy resin precursor 3 was obtained with a yield of 89% and its structural formula is as follows:
将得到的本征型抗菌环氧树脂前驱体与固化剂二乙烯三胺按照环氧和胺基活泼氢一比一的摩尔比下混合均匀后在鼓风烘箱进行加热固化,室温到60℃间隔20℃保温2h进行梯度升温固化,,得到环氧树脂固化物。所述本征型抗菌环氧树脂固化物的玻璃化转变温度为34℃,拉伸强度为25MPa,剪切强度为14MPa,粘接强度为15MPa,所得的固化产物与空白样品进行抗菌测试,所得环氧固化物对大肠杆菌的杀菌率为93.6%,对金黄葡萄球菌的杀菌率为92.3%,抗菌性能图如图2所示。Mix the obtained intrinsic antibacterial epoxy resin precursor and the curing agent diethylenetriamine at a molar ratio of one to one between epoxy and amine active hydrogen, and then heat and solidify in an air blast oven at intervals from room temperature to 60°C. Keep the temperature at 20°C for 2 hours for gradient temperature curing to obtain a cured epoxy resin. The glass transition temperature of the intrinsic antibacterial epoxy resin cured product is 34°C, the tensile strength is 25MPa, the shear strength is 14MPa, and the bonding strength is 15MPa. The obtained cured product is subjected to an antibacterial test with a blank sample, and the result The sterilization rate of the epoxy cured product against Escherichia coli is 93.6%, and the sterilization rate against Staphylococcus aureus is 92.3%. The antibacterial performance diagram is shown in Figure 2.
实施例4Example 4
将5份双酚F二缩水甘油醚、1份3,4-二羟基苯甲酸及0.1份硝酸置于带有机械搅拌和氮气吹扫的三口瓶中,在90℃下反应8小时,得到本征型抗菌环氧树脂前驱体4,产率为93%,其结构式如下式:Place 5 parts of bisphenol F diglycidyl ether, 1 part of 3,4-dihydroxybenzoic acid and 0.1 part of nitric acid in a three-necked flask with mechanical stirring and nitrogen purging, and react at 90°C for 8 hours to obtain this product Typical antibacterial epoxy resin precursor 4, with a yield of 93%, and its structural formula is as follows:
将得到的本征型抗菌环氧树脂前驱体与固化剂三乙烯四胺按照环氧和胺基活泼氢一比一的摩尔比下混合均匀后在鼓风烘箱进行加热固化,室温到60℃间隔20℃保温2h进行梯度升温固化,,得到环氧树脂固化物。所述本征型抗菌环氧树脂固化物的玻璃化转变温度为110℃,拉伸强度为86MPa,剪切强度为12MPa,粘接强度为13MPa,所得的固化产物与空白样品进行抗菌测试,所得环氧固化物对大肠杆菌的杀菌率为92.5%,对金黄葡萄球菌的杀菌率为90.1%,抗菌性能图如图2所示。Mix the obtained intrinsic antibacterial epoxy resin precursor and the curing agent triethylenetetramine at a molar ratio of one to one between epoxy and amine active hydrogen, and then heat and solidify in a blast oven at room temperature to 60°C. Keep the temperature at 20°C for 2 hours for gradient temperature curing to obtain a cured epoxy resin. The glass transition temperature of the intrinsic antibacterial epoxy resin cured product is 110°C, the tensile strength is 86MPa, the shear strength is 12MPa, and the bonding strength is 13MPa. The obtained cured product was subjected to an antibacterial test with a blank sample, and the result The sterilization rate of the epoxy cured product against Escherichia coli is 92.5%, and the sterilization rate against Staphylococcus aureus is 90.1%. The antibacterial performance diagram is shown in Figure 2.
实施例5Example 5
将10份双酚F二缩水甘油醚、1份3,4-二羟基苯基丙烯酸及0.2份盐酸置于带有机械搅拌和氮气吹扫的三口瓶中,在100℃下反应6小时,得到本征型抗菌环氧树脂前驱体5,产率为89.5%,其结构式如下式:Place 10 parts of bisphenol F diglycidyl ether, 1 part of 3,4-dihydroxyphenyl acrylic acid and 0.2 parts of hydrochloric acid in a three-necked flask with mechanical stirring and nitrogen purging, and react at 100°C for 6 hours to obtain Intrinsic antibacterial epoxy resin precursor 5 has a yield of 89.5% and its structural formula is as follows:
将得到的本征型抗菌环氧树脂前驱体与固化剂四乙烯五胺按照环氧和胺基活泼氢一比一的摩尔比下混合均匀后在鼓风烘箱进行加热固化,室温到40℃间隔20℃保温2h进行梯度升温固化,,得到环氧树脂固化物。所述本征型抗菌环氧树脂固化物的玻璃化转变温度为105℃,拉伸强度为82MPa,剪切强度为14MPa,粘接强度为14MPa,所得的固化产物与空白样品进行抗菌测试,所得环氧固化物对大肠杆菌的杀菌率为94.9%,对金黄葡萄球菌的杀菌率为94.6%,抗菌性能图如图2所示。Mix the obtained intrinsic antibacterial epoxy resin precursor and the curing agent tetraethylene pentamine at a molar ratio of one to one between epoxy and amine active hydrogen, and then heat and solidify in a blast oven at room temperature to 40°C. Keep the temperature at 20°C for 2 hours for gradient temperature curing to obtain a cured epoxy resin. The glass transition temperature of the intrinsic antibacterial epoxy resin cured product is 105°C, the tensile strength is 82MPa, the shear strength is 14MPa, and the bonding strength is 14MPa. The obtained cured product was subjected to an antibacterial test with a blank sample, and the result The sterilization rate of the epoxy cured product against Escherichia coli is 94.9%, and the sterilization rate against Staphylococcus aureus is 94.6%. The antibacterial performance diagram is shown in Figure 2.
实施例6Example 6
将13份对苯二甲醇二缩水甘油醚、1份3,4-二羟基苯基丙烯酸及0.01份硫酸置于带有机械搅拌和氮气吹扫的三口瓶中,在100℃下反应6小时,得到本征型抗菌环氧树脂前驱体5,产率为88.7%,其结构式如下式:Place 13 parts of terephthalenedimethanol diglycidyl ether, 1 part of 3,4-dihydroxyphenylacrylic acid and 0.01 part of sulfuric acid in a three-necked flask with mechanical stirring and nitrogen purging, and react at 100°C for 6 hours. The intrinsic antibacterial epoxy resin precursor 5 was obtained with a yield of 88.7% and its structural formula is as follows:
将得到的本征型抗菌环氧树脂前驱体与固化剂异佛尔酮二胺按照环氧和胺基活泼氢一比一的摩尔比下混合均匀后在鼓风烘箱进行加热固化,室温到100℃间隔20℃保温2h进行梯度升温固化,,得到环氧树脂固化物。所述本征型抗菌环氧树脂固化物的玻璃化转变温度为76℃,拉伸强度为54MPa,剪切强度为8MPa,粘接强度为11MPa,所得的固化产物与空白样品进行抗菌测试,所得环氧固化物对大肠杆菌的杀菌率为91.2%,对金黄葡萄球菌的杀菌率为89.7%。Mix the obtained intrinsic antibacterial epoxy resin precursor and the curing agent isophorone diamine at a molar ratio of one to one between epoxy and amine active hydrogen, then heat and solidify in a blast oven at room temperature to 100 The temperature was maintained at an interval of 20°C for 2 hours for gradient temperature curing to obtain a cured epoxy resin. The glass transition temperature of the intrinsic antibacterial epoxy resin cured product is 76°C, the tensile strength is 54MPa, the shear strength is 8MPa, and the bonding strength is 11MPa. The obtained cured product was subjected to an antibacterial test with a blank sample, and the result The sterilization rate of the epoxy cured product against Escherichia coli was 91.2%, and the sterilization rate against Staphylococcus aureus was 89.7%.
实施例7Example 7
将5份双酚F二缩水甘油醚、1份3,4,5-三羟基苯甲酸及0.1份硝酸置于带有机械搅拌和氮气吹扫的三口瓶中,在90℃下反应8小时,得到本征型抗菌环氧树脂前驱体4,产率为93%,其结构式如下式:Place 5 parts of bisphenol F diglycidyl ether, 1 part of 3,4,5-trihydroxybenzoic acid and 0.1 part of nitric acid in a three-necked flask with mechanical stirring and nitrogen purging, and react at 90°C for 8 hours. The intrinsic antibacterial epoxy resin precursor 4 was obtained with a yield of 93% and its structural formula is as follows:
将得到的本征型抗菌环氧树脂前驱体与固化剂孟烷二胺按照环氧和胺基活泼氢一比一的摩尔比下混合均匀后在鼓风烘箱进行加热固化,室温到80℃间隔20℃保温2h进行梯度升温固化,得到环氧树脂固化物。所述本征型抗菌环氧树脂固化物的玻璃化转变温度为112℃,拉伸强度为88MPa,剪切强度为11MPa,粘接强度为12MPa,所得的固化产物与空白样品进行抗菌测试,所得环氧固化物对大肠杆菌的杀菌率为98.1%,对金黄葡萄球菌的杀菌率为95.6%。Mix the obtained intrinsic antibacterial epoxy resin precursor and the curing agent Mengdiamine at a molar ratio of one to one between epoxy and amine active hydrogen, and then heat and solidify in a blast oven at room temperature to 80°C. Keep the temperature at 20°C for 2 hours for gradient temperature curing to obtain a cured epoxy resin. The glass transition temperature of the intrinsic antibacterial epoxy resin cured product is 112°C, the tensile strength is 88MPa, the shear strength is 11MPa, and the bonding strength is 12MPa. The obtained cured product was subjected to an antibacterial test with a blank sample, and the result The sterilization rate of the epoxy cured product against Escherichia coli was 98.1%, and the sterilization rate against Staphylococcus aureus was 95.6%.
实施例8Example 8
将3份乙二醇二缩水甘油醚、1份,3,4,5--三羟基苯甲酸及0.01份硫酸置于带有机械搅拌和氮气吹扫的三口瓶中,在100℃下反应5小时,得到本征型抗菌环氧树脂前驱体3,产率为89%,其结构式如下式:Place 3 parts of ethylene glycol diglycidyl ether, 1 part of 3,4,5-trihydroxybenzoic acid and 0.01 part of sulfuric acid in a three-necked flask with mechanical stirring and nitrogen purging, and react at 100°C for 5 hours, the intrinsic antibacterial epoxy resin precursor 3 was obtained with a yield of 89%, and its structural formula is as follows:
将得到的本征型抗菌环氧树脂前驱体与聚酰胺固化剂按照环氧和胺基活泼氢一比一的摩尔比下混合均匀后在鼓风烘箱进行加热固化,室温到60℃间隔20℃保温2h进行梯度升温固化,得到环氧树脂固化物。所述本征型抗菌环氧树脂固化物的玻璃化转变温度为33℃,拉伸强度为46MPa,剪切强度为11MPa,粘接强度为12MPa,所得的固化产物与空白样品进行抗菌测试,所得环氧固化物对大肠杆菌的杀菌率为95.1%,对金黄葡萄球菌的杀菌率为93.6%。Mix the obtained intrinsic antibacterial epoxy resin precursor and polyamide curing agent evenly according to the molar ratio of epoxy and amine active hydrogen to one to one, and then heat and solidify in a blast oven at intervals of 20°C from room temperature to 60°C. Keep the temperature for 2 hours for gradient temperature curing to obtain an epoxy resin cured product. The glass transition temperature of the intrinsic antibacterial epoxy resin cured product is 33°C, the tensile strength is 46MPa, the shear strength is 11MPa, and the bonding strength is 12MPa. The obtained cured product was subjected to an antibacterial test with a blank sample, and the result The sterilization rate of the epoxy cured product against Escherichia coli was 95.1%, and the sterilization rate against Staphylococcus aureus was 93.6%.
对比例1Comparative example 1
将乙二醇二缩水甘油醚与固化剂聚醚胺D230按照环氧和胺基活泼氢一比一的摩尔比下混合均匀后在鼓风烘箱进行加热固化,室温到80℃间隔20℃保温2h进行梯度升温固化,得到环氧树脂固化物。所述本征型抗菌环氧树脂固化物的玻璃化转变温度为21℃,拉伸强度为20MPa,剪切强度为4MPa,粘接强度为6MPa,所得的固化产物对大肠杆菌的抑制率为0%,对金黄葡萄球菌的杀菌率为0%。Mix the ethylene glycol diglycidyl ether and the curing agent polyetheramine D230 at a molar ratio of one to one between epoxy and amine active hydrogen, and then heat and solidify in a blast oven. Keep the temperature at 20°C for 2 hours between room temperature and 80°C. Carry out gradient temperature curing to obtain an epoxy resin cured product. The glass transition temperature of the intrinsic antibacterial epoxy resin cured product is 21°C, the tensile strength is 20MPa, the shear strength is 4MPa, and the bonding strength is 6MPa. The inhibition rate of the obtained cured product against E. coli is 0 %, the bactericidal rate against Staphylococcus aureus is 0%.
此外,本案发明人还参照前述实施例,以本说明书述及的其它原料、工艺操作、工艺条件进行了试验,并均获得了较为理想的结果。In addition, the inventor of the present case also conducted experiments with other raw materials, process operations, and process conditions mentioned in this specification with reference to the aforementioned embodiments, and achieved relatively ideal results.
应当理解,本发明的技术方案不限于上述具体实施案例的限制,凡是在不脱离本发明宗旨和权利要求所保护的范围情况下,根据本发明的技术方案做出的技术变形,均落于本发明的保护范围之内。It should be understood that the technical solution of the present invention is not limited to the above-mentioned specific implementation examples. Any technical modifications made based on the technical solution of the present invention without departing from the purport of the present invention and the scope protected by the claims will fall within the scope of this invention. within the scope of protection of the invention.
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CN112142951A (en) * | 2020-09-11 | 2020-12-29 | 中国林业科学研究院林产化学工业研究所 | Bio-based latent waterborne epoxy resin and preparation method thereof |
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