CN116001118A - Silicon carbide multi-wire cutting cooling system, cutting device and method - Google Patents
Silicon carbide multi-wire cutting cooling system, cutting device and method Download PDFInfo
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- CN116001118A CN116001118A CN202211638100.8A CN202211638100A CN116001118A CN 116001118 A CN116001118 A CN 116001118A CN 202211638100 A CN202211638100 A CN 202211638100A CN 116001118 A CN116001118 A CN 116001118A
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- silicon carbide
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- barrel
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- 238000005520 cutting process Methods 0.000 title claims abstract description 178
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 59
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 238000001816 cooling Methods 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000004570 mortar (masonry) Substances 0.000 claims abstract description 111
- 239000007921 spray Substances 0.000 claims abstract description 13
- 238000005507 spraying Methods 0.000 claims abstract description 8
- 239000002002 slurry Substances 0.000 claims abstract description 6
- 238000005086 pumping Methods 0.000 claims abstract description 4
- 239000013078 crystal Substances 0.000 claims description 19
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 239000004576 sand Substances 0.000 claims description 2
- 238000004891 communication Methods 0.000 claims 2
- 230000003213 activating effect Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 abstract description 14
- 239000003795 chemical substances by application Substances 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 description 15
- 239000011343 solid material Substances 0.000 description 4
- 239000003082 abrasive agent Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The invention relates to the field of semiconductor processing, in particular to a silicon carbide multi-wire cutting cooling system, a cutting device and a method, wherein the cooling system comprises a mortar barrel, the mortar barrel is used for storing mortar, and an ultrasonic transmitter for releasing ultrasonic waves to the mortar is arranged on the mortar barrel; the device also comprises a conveying system, a spray nozzle assembly and a spray nozzle assembly, wherein the conveying system comprises a mortar pump and a conveying pipeline for pumping mortar in the mortar barrel, and the spray nozzle assembly is communicated with the conveying pipeline and is used for spraying the silicon carbide cutting surface; the cutting chamber, its inside is provided with the cutting chamber that is used for cutting carborundum, the cutting chamber is linked together with the mortar bucket to can retrieve the mortar. According to the invention, the ultrasonic transmitter is arranged on the mortar barrel, so that the solid grinding agent in the mortar slurry can be uniformly dispersed in the mortar slurry, the solid grinding agent is prevented from being deposited at the bottom of the mortar barrel and causing pipeline blockage, and meanwhile, the cooling effect on the cutting process is improved.
Description
Technical Field
The invention relates to the field of semiconductor processing, in particular to a silicon carbide multi-wire cutting cooling system, a cutting device and a cutting method.
Background
Currently existing methods for multi-wire sawing of solid materials, such as hard and brittle crystalline materials like silicon, silicon carbide, alumina, diamond, etc., generally include the steps of: the cutting line is distributed into a certain wire net through the grooved pulley, the cutting line moves at a high speed to perform cutting movement, the solid material to be cut is in contact with the cutting wire net at the cutting side, the cutting of the solid material to be cut is realized through the cutting force action of the cutting line or the cutting action of grinding mortar carried by the cutting line, and the cutting process is cooled through water or cooling liquid.
In the multi-wire cutting device in the prior art, solid grinding agents in the mortar liquid are easy to deposit at the bottom of a mortar barrel due to higher density in the working process of a cooling system of the multi-wire cutting device, so that after clear liquid on the upper layer of the mortar liquid is extracted and sprayed to a cutting surface, the cutting efficiency of solid materials is reduced due to lower content of the solid grinding agents. Meanwhile, after the lower layer of the mortar liquid is extracted, the pipeline is easy to be blocked due to higher content of the solid abrasive, so that the flow of the mortar liquid sprayed out in the cooling process is reduced, and the cooling speed of the cutting surface is reduced.
Disclosure of Invention
The invention provides a silicon carbide multi-wire cutting cooling system, a cutting device and a method, which are used for overcoming the defects that a cooling system in a multi-wire cutting device in the prior art is easy to cause solid grinding agent deposition, so that cutting efficiency is reduced, a pipeline is blocked and the like.
In order to achieve the aim of the invention, the invention is realized by the following technical scheme:
in a first aspect, the present invention provides a silicon carbide multi-wire saw cooling system,
the mortar storage device comprises a mortar barrel, wherein the mortar barrel is used for storing mortar, and an ultrasonic transmitter used for releasing ultrasonic waves to the mortar is arranged on the mortar barrel;
the conveying system comprises a mortar pump for pumping mortar in the mortar barrel, a conveying pipeline and a nozzle assembly communicated with the conveying pipeline and used for spraying the silicon carbide cutting surface;
the cutting chamber, its inside is provided with the cutting chamber that is used for cutting carborundum, the cutting chamber is linked together with the mortar bucket to can retrieve the mortar.
The silicon carbide multi-wire cutting cooling system is mainly characterized in that an ultrasonic transmitter is arranged on a mortar barrel, ultrasonic waves can directly act on mortar liquid, so that a vibration environment is formed inside the mortar barrel, solid grinding agents in the mortar liquid can be uniformly dispersed in the mortar liquid, the solid grinding agents are prevented from being deposited at the bottom of the mortar barrel, and the solid grinding agents in the mortar liquid can smoothly enter a cutting surface in the process of extracting the mortar liquid, so that an auxiliary effect is achieved for cutting silicon carbide. Meanwhile, the mortar liquid after being uniformly dispersed is not easy to deposit in the pipeline, so that the problem of pipeline blockage is reduced, and the cooling effect on the cutting surface is improved.
Preferably, the bottom of the mortar barrel is provided with a support leg, and the ultrasonic transmitter is arranged at the bottom center of the mortar barrel.
Preferably, the conveying pipeline comprises an output pipe connected with the mortar pump and used for outputting mortar; the method comprises the steps of,
and the input pipe is used for connecting the cutting chamber with the mortar barrel.
Preferably, a collecting portion for collecting mortar is provided at the bottom of the cutting chamber, and the collecting portion communicates with the input pipe.
Preferably, a gas circulation cooling device is arranged on the side surface of the cutting chamber, the gas circulation cooling device comprises a circulation pipeline for circulating gas in the cutting chamber, a fan for driving the gas in the circulation pipeline to flow is arranged in the circulation pipeline, and a heat exchanger is also arranged in the circulation pipeline;
the middle part of cutting room is provided with a plurality of metal fin.
According to the invention, the gas circulation cooling device is arranged on the side surface of the cutting chamber, so that the air in the cutting chamber can be circulated and cooled under the action of the fan and the heat exchanger, and the sprayed mortar can be cooled.
Preferably, the mortar barrel comprises a main barrel body and a secondary barrel body communicated with the main barrel body;
the input pipe is connected with the auxiliary cylinder;
the mortar pump is connected with the main cylinder.
Preferably, the nozzle assembly comprises a connecting pipe connected in series with the output pipe, a three-way pipe is arranged at the end part of the connecting pipe, two spray pipes are further connected and arranged on the three-way pipe, and a spray header is arranged at the end part of the spray pipe.
In a second aspect, the invention also provides a silicon carbide multi-wire cutting device comprising a silicon carbide multi-wire cutting cooling system as described above.
Preferably, the cutting device comprises a workbench, wherein the workbench is arranged at the top of a cutting chamber and can adjust the height up and down, and the end part of the workbench is fixedly connected with a silicon carbide crystal to be cut;
a cutting roller set disposed inside the cutting chamber;
the cutting line group comprises a wire supply wheel, a wire take-up wheel and a cutting line matched with the wire supply wheel and the wire take-up wheel, wherein the wire supply wheel and the wire take-up wheel are arranged outside the cutting chamber, and the cutting line penetrates through the cutting chamber, is wound on the outer side of the cutting roller group and forms a plurality of tangential planes, so that the silicon carbide crystal is cut.
Preferably, the workbench comprises a pedestal and a lifting mechanism arranged on the pedestal, and a fixing device for fixing the silicon carbide crystal to be cut is arranged at the end part of the lifting mechanism;
the cutting line group also comprises a plurality of tensioning wheels which are arranged outside the cutting chamber and used for adjusting the direction and the tensioning degree of the cutting line.
In a third aspect, the present invention also provides a method for multi-wire cutting of silicon carbide, based on the device as described above, comprising the steps of:
(S.1) fixing a workpiece to be cut on a workbench;
(s.2) injecting mortar liquid into the mortar barrel and starting the ultrasonic transmitter;
(S.3) starting the cutting line group so that the wire supply wheel and the wire receiving wheel drive the cutting line to move;
(S4) gradually moving the workbench downwards so that the silicon carbide crystal is contacted with the cutting line, thereby cutting the workpiece to be cut, and spraying mortar liquid on the cutting surface through the nozzle assembly
(S.5) cutting is completed.
Therefore, the invention has the following beneficial effects:
(1) According to the invention, the ultrasonic transmitter is arranged on the mortar barrel, so that the solid grinding agent in the mortar slurry can be uniformly dispersed in the mortar slurry, and the solid grinding agent is prevented from depositing at the bottom of the mortar barrel and causing pipeline blockage;
(2) The cooling effect in the cutting process is improved.
Drawings
Fig. 1 is a schematic structural diagram of a silicon carbide multi-wire cutting cooling system provided by the invention.
Fig. 2 is a schematic structural diagram of a silicon carbide multi-wire cutting device provided by the invention.
Wherein: mortar barrel 100, main barrel 101, sub-barrel 102, ultrasonic emitter 110, foot 120, delivery system 200, mortar pump 210, delivery line 220, output pipe 221, input pipe 222, nozzle assembly 230, connection pipe 231, tee 232, shower 233, shower header 234, cutting chamber 300, cutting chamber 310, gas circulation cooling device 320, circulation line 330, inlet section 331, outlet section 332, fan 340, heat exchanger 350, metal heat sink 360, cutting assembly 400, table 410, pedestal 411, lifting mechanism 412, fixture 413, silicon carbide crystal 420, cutting roller set 430, upper roller 431, lower roller 432, cutting line set 500, wire supply wheel 510, take-up wheel 520, cutting line 530, tension wheel 540, wire wheel 550, linear guide 560, drive assembly 570.
Detailed Description
The invention is further described below with reference to the drawings and specific examples. Those of ordinary skill in the art will be able to implement the invention based on these descriptions. In addition, the embodiments of the present invention referred to in the following description are typically only some, but not all, embodiments of the present invention. Therefore, all other embodiments, which can be made by one of ordinary skill in the art without undue burden, are intended to be within the scope of the present invention, based on the embodiments of the present invention.
Example 1
As shown in fig. 1-2, the present embodiment provides a multi-wire cutting apparatus for silicon carbide, which mainly includes a cutting assembly 400, a cutting wire set 500 for matching with the cutting assembly 400 to perform a cutting function on a silicon carbide crystal 420, and a multi-wire cutting cooling system for silicon carbide, which performs a cooling function on a cutting surface during the cutting process.
Wherein: the silicon carbide multi-wire cutting cooling system comprises a mortar barrel 100 for storing mortar, the silicon carbide multi-wire cutting cooling system comprises a main barrel 101 and an auxiliary barrel 102 communicated with the main barrel, a plurality of supporting legs 120 which encircle the main barrel 101 and play a supporting role on the main barrel are arranged at the bottom of the main barrel 101, an ultrasonic transmitter 110 which can release ultrasonic waves to the mortar inside the mortar barrel 100 is further arranged at the center of the bottom of the mortar barrel 100, the ultrasonic waves generated by the ultrasonic transmitter 110 can directly act on the mortar, so that a vibration environment is formed inside the mortar barrel 100, solid abrasives in the mortar can be uniformly dispersed in the mortar, the solid abrasives in the mortar are prevented from being deposited at the bottom of the mortar barrel 100, and the solid abrasives in the mortar can smoothly enter a cutting surface in the process of extracting the mortar, so that the silicon carbide cutting is assisted. Meanwhile, the mortar liquid after being uniformly dispersed is not easy to deposit in the pipeline, so that the problem of pipeline blockage is reduced, and the cooling effect on the cutting surface is improved.
The silicon carbide multi-wire saw cooling system further comprises a conveying system 200 for conveying and collecting mortar in the mortar barrel 100, and the conveying system comprises a mortar pump 210 for pumping the mortar in the mortar barrel 100 to a cutting surface, and the mortar pump is connected with the main barrel 101 of the mortar barrel 100. A delivery line 220 for delivering the mortar is also included, the delivery line 220 being connected to the mortar pump 210 and being adapted to deliver a delivery line 221 of the mortar.
The end of the output pipe 221 is provided with a nozzle assembly 230 for spraying the silicon carbide cutting surface, the nozzle assembly 230 comprises a connecting pipe 231 connected in series with the output pipe 221, the end of the connecting pipe 231 is provided with a three-way pipe 232 for dividing mortar, the three-way pipe 232 is also connected with two spray pipes 233, and the end of the spray pipe 233 is provided with a spray header 234 aligned with the cutting surface for spraying and cooling the cutting surface.
In order to recover the mortar sprayed from the spray header 234, the cooling system of the present embodiment further includes a cutting chamber 300 having a cutting chamber 310 for cutting silicon carbide therein, a collecting part 130 for collecting the mortar is disposed at the bottom of the cutting chamber 300, an input pipe 222 is connected to the bottom of the collecting part 130, the input pipe 222 is connected to the sub-cylinder 102 of the mortar tub 100, so that the mortar can circulate in the cooling system,
in addition, in order to prevent the temperature of the mortar from rising, a gas circulation cooling device 320 is specially disposed at the side of the cutting chamber 300, which specifically includes a circulation pipeline 330 for circulating the gas inside the cutting chamber 300, the circulation pipeline 330 includes an air inlet section 331 above the cutting chamber 300 and an air outlet section 332 below the cutting chamber 300, wherein a fan 340 for introducing the air above the cutting chamber 300 into the circulation pipeline 330 and driving the air to flow out from the air outlet section 332 is disposed inside the air inlet section 331, and a heat exchanger 350 for exchanging heat from the external environment between the air inlet section 331 and the air outlet section 332 to reduce the temperature of the air flow inside the air outlet section 332 is disposed between the air inlet section 331 and the air outlet section 332.
In order to further improve the cooling effect on the mortar, in this embodiment, a plurality of metal cooling fins 360 are further disposed in the middle of the cutting chamber 300, and when the mortar sprayed from the nozzle assembly 230 falls down to the metal cooling fins 360, the mortar spreads out along the metal cooling fins 360 and slowly falls down, and at this time, the cold air flowing out from the air outlet section 332 can cool the mortar on the surface of the metal cooling fins 360.
The cutting assembly 400 in this embodiment specifically includes a workbench 410 disposed at the top of the cutting chamber 300 and capable of adjusting the height up and down, and includes a pedestal 411 and a lifting mechanism 412 disposed on the pedestal 411, where the lifting mechanism 412 may be any one of a hydraulic lifting cylinder, a pneumatic lifting cylinder and a screw rod, and may be flexibly selected according to actual use conditions, and the end of the lifting mechanism 412 is provided with a fixing device 413 for fixing the silicon carbide crystal 420 to be cut, so as to prevent the silicon carbide crystal 420 to be cut from falling during the cutting process. When the lifting mechanism 412 is activated, the silicon carbide crystal 420 to be cut can be moved downward, thereby gradually completing the cut.
The cutting chamber 300 is further provided with a cutting roller set 430 for winding the cutting line 530, which is composed of two upper rollers 431 having the same horizontal position and one lower roller 432 disposed below the upper rollers 431, wherein an inverted triangle structure is formed between the two upper rollers 431 and the lower roller 432, and a cutting area for cutting the silicon carbide crystal 420 is formed between the two upper rollers 431 after the cutting line 530 is wound on the surface of the cutting roller set 430.
The cutting line set 500 includes a wire supply wheel 510 and a wire take-up wheel 520 disposed outside the cutting chamber 300, and a cutting line 530 cooperating with the wire supply wheel 510 and the wire take-up wheel 520, wherein the cutting line 530 passes through the cutting chamber 300 and is wound around the outer side of the cutting roller set 430 to form a plurality of cut surfaces, thereby cutting the silicon carbide crystal 420, and the number of wafers formed after the silicon carbide crystal 420 is cut and the thickness of the wafers are determined by the number of windings of the cutting line 530 on the cutting roller set 430 and the interval between the cutting lines 530.
In order to better control the cutting effect of the cutting line 530 on the workpiece 130, several tensioning wheels 540 for adjusting the direction and the tensioning degree of the cutting line 530 are added outside the cutting chamber 300 in the embodiment, so that the tightness of the cutting line can be controlled according to different cutting processes.
Meanwhile, in order to assist the wire feeding and paying-off of the wire feeding wheel 510 and the wire receiving wheel 520, in this embodiment, a wire guiding wheel 550 is further added in the wire cutting line set 500, which can move horizontally during the wire feeding and paying-off process, so as to prevent the wire cutting 530 from knotting, the horizontal movement of the wire cutting wheel is formed by a linear guide rail 560 and a driving component 570 adapted to the guide rail 560, and the driving component 570 can be a motor or a belt connected with the wire guiding wheel, and this function can be implemented in a plurality of ways, which are not listed herein.
Example 2
A method of multi-wire cutting of silicon carbide based on the apparatus described in example 1, comprising the steps of:
s.1, fixing devices 413 for fixing the workpiece to be cut on the workbench 400;
s.2, injecting mortar liquid into the mortar barrel 100 and starting the ultrasonic transmitter 110;
s.3, starting the cutting line group 500 to enable the wire supply wheel 510 and the wire take-up wheel 520 to drive the cutting line 530 to move, and adjusting the tension of the cutting line 530 by adjusting the tension wheel 540;
s.4, gradually moving the workbench 410 downwards so that the silicon carbide crystal 420 is contacted with the cutting line 530, cutting the workpiece to be cut, and spraying sand slurry at the cutting surface through the nozzle assembly 230;
s.5, cutting is completed.
Claims (10)
1. A silicon carbide multi-wire cutting cooling system is characterized in that,
comprises a mortar barrel (100) for storing mortar, wherein an ultrasonic transmitter (110) for releasing ultrasonic waves to the mortar is arranged on the mortar barrel (100);
a delivery system (200) comprising a mortar pump (210) for pumping mortar inside the mortar barrel (100) and a delivery pipeline (220), and further comprising a nozzle assembly (230) in communication with the delivery pipeline (220) for spraying the silicon carbide cut surface;
and a cutting chamber (300) in which a cutting chamber (310) for cutting silicon carbide is provided, the cutting chamber (300) being in communication with the mortar barrel (100) so that mortar can be recovered.
2. A silicon carbide multi-wire saw cooling system according to claim 1,
the bottom of the mortar barrel (100) is provided with a support leg (120), and the ultrasonic transmitter (110) is arranged at the bottom center of the mortar barrel (100).
3. A silicon carbide multi-wire saw cooling system according to claim 1,
the conveying pipeline (220) comprises an output pipe (221) connected with the mortar pump (210) and used for outputting mortar; the method comprises the steps of,
and an input pipe (222) for connecting the cutting chamber (300) with the mortar barrel (100).
4. A silicon carbide multi-wire saw cooling system according to claim 3 wherein,
the nozzle assembly (230) comprises a connecting pipe (231) which is used for being connected with the output pipe (221) in series, a three-way pipe (232) is arranged at the end part of the connecting pipe (231), two spray pipes (233) are further connected to the three-way pipe (232), and a spray header (234) is arranged at the end part of the spray pipe (233).
5. A silicon carbide multi-wire saw cooling system according to claim 4 wherein,
the bottom of the cutting chamber (300) is provided with a collecting part (130) for collecting mortar, and the collecting part (130) is communicated with the input pipe (222).
6. A silicon carbide multi-wire saw cooling system according to claim 1 or 5,
the side of the cutting chamber (300) is provided with a gas circulation cooling device (320), the gas circulation cooling device comprises a circulation pipeline (330) for circulating gas in the cutting chamber (300), a fan (340) for driving the gas in the circulation pipeline (330) to flow is arranged in the circulation pipeline (330), and a heat exchanger (350) is also arranged in the circulation pipeline (330);
the middle part of the cutting chamber (300) is provided with a plurality of metal cooling fins (360).
7. A silicon carbide multi-wire cutting device is characterized in that,
a multi-wire saw cooling system comprising silicon carbide according to any one of claims 1 to 6.
8. The silicon carbide multi-wire saw of claim 7, comprising
The cutting assembly (400) comprises a workbench (410) which is arranged at the top of the cutting chamber (300) and can adjust the height up and down, the end part of the workbench (410) is fixedly connected with a silicon carbide crystal (420) to be cut, and the cutting assembly also comprises a cutting roller group (430) which is arranged in the cutting chamber (300);
the cutting line group (500) comprises a wire supply wheel (510), a wire receiving wheel (520) and a cutting line (530) matched with the wire supply wheel (510) and the wire receiving wheel (520) which are arranged outside the cutting chamber (300), wherein the cutting line (530) penetrates through the cutting chamber (300) and is wound on the outer side of the cutting roller group (430) to form a plurality of sections so as to cut the silicon carbide crystal (420).
9. A silicon carbide multi-wire cutting apparatus according to claim 8 wherein,
the workbench (410) comprises a pedestal (411) and a lifting mechanism (412) arranged on the pedestal (411), wherein a fixing device (413) for fixing a silicon carbide crystal (420) to be cut is arranged at the end part of the lifting mechanism (412);
the cutting line set (500) further comprises a plurality of tensioning wheels (540) which are arranged outside the cutting chamber (300) and used for adjusting the direction and the tensioning degree of the cutting line (530).
10. A method for multi-wire cutting of silicon carbide, characterized in that it is based on the device according to any one of claims 7 to 9, comprising the following steps:
(s.1) fixing the silicon carbide crystal (420) to be cut on a table (400);
(s.2) injecting mortar into the mortar barrel (100) and activating the ultrasonic transmitter (110);
(S.3) starting the cutting line group (500) so that the wire supply wheel (510) and the wire receiving wheel (520) drive the cutting line (530) to move;
(s.4) gradually moving the table (410) downward so that the silicon carbide crystal (420) is brought into contact with the cutting line (530), thereby cutting the silicon carbide crystal (420) to be cut, and spraying a slurry of sand at the cut surface through the nozzle assembly (230);
(S.5) cutting is completed.
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US20060249134A1 (en) * | 2003-10-27 | 2006-11-09 | Takafumi Kawasaki | Multi-wire saw |
CN101855045A (en) * | 2007-12-19 | 2010-10-06 | 信越半导体股份有限公司 | Method for cutting work by wire saw and wire saw |
JP2011167810A (en) * | 2010-02-19 | 2011-09-01 | Takatori Corp | Wire saw |
CN111015498A (en) * | 2019-12-27 | 2020-04-17 | 福建北电新材料科技有限公司 | Wafer polishing apparatus and method |
CN217372944U (en) * | 2022-03-18 | 2022-09-06 | 徐州鑫晶半导体科技有限公司 | Multi-wire saw mortar nozzle flow control device and multi-wire saw |
-
2022
- 2022-12-20 CN CN202211638100.8A patent/CN116001118A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060249134A1 (en) * | 2003-10-27 | 2006-11-09 | Takafumi Kawasaki | Multi-wire saw |
CN101855045A (en) * | 2007-12-19 | 2010-10-06 | 信越半导体股份有限公司 | Method for cutting work by wire saw and wire saw |
JP2011167810A (en) * | 2010-02-19 | 2011-09-01 | Takatori Corp | Wire saw |
CN111015498A (en) * | 2019-12-27 | 2020-04-17 | 福建北电新材料科技有限公司 | Wafer polishing apparatus and method |
CN217372944U (en) * | 2022-03-18 | 2022-09-06 | 徐州鑫晶半导体科技有限公司 | Multi-wire saw mortar nozzle flow control device and multi-wire saw |
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