CN115910822A - Metal connecting wire electrical property test structure - Google Patents
Metal connecting wire electrical property test structure Download PDFInfo
- Publication number
- CN115910822A CN115910822A CN202110945206.1A CN202110945206A CN115910822A CN 115910822 A CN115910822 A CN 115910822A CN 202110945206 A CN202110945206 A CN 202110945206A CN 115910822 A CN115910822 A CN 115910822A
- Authority
- CN
- China
- Prior art keywords
- metal
- pad
- electrically connected
- test
- metal connecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The application provides a metal connecting line electrical property test structure, includes: a test subject comprising: the first metal connecting wires are sequentially arranged along a first direction, and first through holes are formed in the surfaces of two ends of each first metal connecting wire; the second metal connecting wires are sequentially arranged along a second direction, second through holes are formed in the surfaces of two ends of each second metal connecting wire, and the at least one second metal connecting wire is arranged corresponding to the at least one first metal connecting wire; the first welding pad is positioned on one side of the test main body and is electrically connected with the first through hole or the second through hole through a first metal connecting structure; and the second welding pad is positioned on the other side of the test main body and is electrically connected with the first through hole or the second through hole through a second metal connecting structure. The electric leakage condition between the metal connecting wires with the same structure and different structures can be tested in a targeted manner by ingenious metal connecting wire distribution and the most time-efficient electric test.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a metal connecting line electrical property testing structure.
Background
In the FINFET technology, a metal connecting wire for connecting a source electrode and a drain electrode and a metal connecting wire for connecting a grid electrode are key processes for connecting front and rear sections, and the processes are characterized by small opening size and deep depth. Specifically, the line width and the gap of the manufacturing process are the minimum values in the front section size, and the depth ratio is more than 50, so that the defect of short circuit of the connection between the same structures is very easy to occur. Meanwhile, the gap between the two metal connecting wires is also the minimum limit value, and the short-circuit defect is very easy to occur between the two metal connecting wires.
Because the depth ratio is too high, the appearance of the side wall of the slot is complex, the monitoring capability of the manufacturing process is poor, and the stability of the manufacturing process cannot be effectively monitored. At present, higher requirements are placed on a metal connecting line process for connecting a source and a drain, a process for expanding an opening is introduced, the process complexity is increased, the side wall of a groove is more complex in shape, and the process monitoring is harder. The current measuring means can not accurately measure and monitor the sidewall appearance of the metal connecting line.
Therefore, there is a need to provide more efficient and reliable solutions.
Disclosure of Invention
The application provides a metal connecting line electrical property test structure which can test the electric leakage condition between metal connecting lines with the same structure and different structures in a targeted mode.
The application provides a metal connecting line electrical property test structure, includes: a test subject comprising: the first metal connecting wires are sequentially arranged along a first direction, and first through holes are formed in the surfaces of two ends of each first metal connecting wire; the second metal connecting wires are sequentially arranged along a second direction, second through holes are formed in the surfaces of two ends of each second metal connecting wire, and the at least one second metal connecting wire is arranged corresponding to the at least one first metal connecting wire; the first welding pad is positioned on one side of the test main body and is electrically connected with the first through hole or the second through hole through a first metal connecting structure; and the second welding pad is positioned on the other side of the test main body and is electrically connected with the first through hole or the second through hole through a second metal connecting structure.
In some embodiments of the present application, when testing the leakage of the adjacent first metal lines, the first pad is electrically connected to the first metal line through the first through hole, the second pad is electrically connected to the first metal line through the first through hole, and the first metal line electrically connected to the first pad and the first metal line electrically connected to the second pad are alternately distributed at intervals.
In some embodiments of the present application, when testing the leakage of the adjacent second metal connection line, the first pad is electrically connected to the second metal connection line through the second through hole, the second pad is electrically connected to the second metal connection line through the second through hole, and the second metal connection line electrically connected to the first pad and the second metal connection line electrically connected to the second pad are alternately distributed at intervals.
In some embodiments of the present application, when testing the leakage between the first metal line and the second metal line, the first pad is electrically connected to the first metal line through the first via, and the second pad is electrically connected to the second metal line through the second via.
In some embodiments of the present application, first dummy metal wires are further disposed on two sides of the at least one first metal wire, and second dummy metal wires are further disposed on two sides of the at least one second metal wire.
In some embodiments of the present application, the number of the at least one first metal line is the same as the number of the at least one second metal line.
In some embodiments of the present application, the at least one first metal line and the at least one second metal line are arranged in an L-like shape.
In some embodiments of the present application, the first direction is perpendicular to the second direction.
In some embodiments of the present application, the structure further comprises: the test main body is arranged between the second welding pad and the third welding pad and between the third welding pad and the fourth welding pad, wherein the first welding pad and the second welding pad are electrically connected with a first metal connecting wire of the test main body positioned between the first welding pad and the second welding pad, and the first metal connecting wire electrically connected with the first welding pad and the first metal connecting wire electrically connected with the second welding pad are alternately distributed at intervals; the second welding pad and the third welding pad are electrically connected with a second metal connecting line of the test main body between the second welding pad and the third welding pad, and the second metal connecting line electrically connected with the second welding pad and the second metal connecting line electrically connected with the third welding pad are alternately distributed at intervals; the third welding pad is electrically connected with a first metal connecting line of the test main body between the third welding pad and the fourth welding pad, and the fourth welding pad is electrically connected with a second through hole metal connecting line of the test main body between the third welding pad and the fourth welding pad.
In some embodiments of the present application, the first pad, the second pad, the third pad, and the fourth pad are arranged along a same straight line.
The application provides a metal connecting wire electrical test structure, through ingenious metal connecting wire distribution, utilize the most ageing electric test, can pointed test the electric leakage condition between the metal connecting wire of same structure and different structures.
Drawings
The following drawings describe in detail exemplary embodiments disclosed in the present application. Wherein like reference numerals refer to similar structures throughout the several views of the drawings. Those of ordinary skill in the art will understand that the present embodiments are non-limiting, exemplary embodiments and that the accompanying drawings are for illustrative and descriptive purposes only and are not intended to limit the scope of the present application, as other embodiments may equally fulfill the inventive intent of the present application. It should be understood that the drawings are not to scale.
Wherein:
fig. 1 is a schematic structural view of a test main body in a metal connection electrical property test structure according to an embodiment of the present disclosure;
FIG. 2 is a schematic cross-sectional view of a test body in an electrical testing structure of a metal line according to an embodiment of the present disclosure;
FIG. 3 is a second cross-sectional view of a test body in the electrical testing structure of a metal wire according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a metal connection electrical testing structure according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a metal connection electrical testing structure according to a second embodiment of the present application;
fig. 6 is a schematic structural diagram of a metal connection electrical testing structure according to a third embodiment of the present application;
fig. 7 is a schematic structural diagram of a metal connection electrical property testing structure according to a fourth embodiment of the present application.
Detailed Description
The following description is presented to enable any person skilled in the art to make and use the present disclosure, and is provided in the context of a particular application and its requirements. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present application. Thus, the present application is not limited to the embodiments shown, but is to be accorded the widest scope consistent with the claims.
The technical solution of the present invention is described in detail below with reference to the examples and the accompanying drawings.
The embodiment of the application provides a metal connecting wire electrical property testing structure which is used for testing the electric leakage and short circuit conditions of a metal connecting wire. The metal connecting line electrical property test structure mainly comprises a test main body, and a first welding pad and a second welding pad which are respectively and electrically connected with the test main body. The test main body is a metal connecting line structure manufactured by the same process as the actual on-line process, and the layout of the metal connecting line structure in the test main body can be correspondingly arranged according to the actual structure to be tested. The embodiments of the present application are described with a first metal line connecting the source and drain and a second metal line connecting the gate in a FINFET structure as an example.
Fig. 1 is a schematic structural diagram of a test body in a metal connection electrical property test structure according to an embodiment of the present disclosure.
Referring to fig. 1, a metal line electrical testing structure according to the present application includes a testing main body 100. The test body 100 includes: at least one first metal connecting line 110 is sequentially arranged along a first direction, and first through holes 111 are formed on the surfaces of two ends of the first metal connecting line 110. First dummy metal wires 112 are further disposed on two sides of the at least one first metal wire 110.
The test body 100 further includes: at least one second metal wire 120 sequentially arranged along a second direction, wherein second through holes 121 are formed on two end surfaces of the second metal wire 120, and the at least one second metal wire 120 is disposed corresponding to the at least one first metal wire 110. Second dummy metal wires 122 are further disposed on both sides of the at least one second metal wire 120.
It should be noted that fig. 1 is a schematic diagram, and is used to briefly illustrate the main structure of the test main body 100. The test body 100 further includes dielectric layers and substrates, etc., which are not shown.
The test subject 100 is used to perform a test. The test subject 100 simulates a metal wiring structure to be tested. Therefore, the structure and the manufacturing method of the first metal wire 110 and the second metal wire 120 in the test subject 100 are the same as those of the object to be tested. For example, in the present application, the first metal line 110 simulates a metal line structure connecting source and drain in a FINFET structure. The second metal line 120 simulates a metal line structure for connecting a gate in a FINFET structure.
In some embodiments of the present application, the number of the at least one first metal wire 110 is the same as the number of the at least one second metal wire 120. For example, in the present application, the number of the at least one first metal line 110 and the number of the at least one second metal line 120 are both four. In other embodiments of the present application, the number of the at least one first metal line 110 and the number of the at least one second metal line 120 may be other numbers.
In some embodiments of the present application, the at least one first metal line 110 and the at least one second metal line 120 are arranged in an L-like shape. This arrangement can minimize the area occupied by the test main body 100 while ensuring the test function. The at least one first metal line 110 is arranged in sequence, and may be used to test a leakage condition between adjacent first metal lines 110. The at least one second metal line 120 is sequentially arranged, and may be used to test a leakage condition between adjacent second metal lines 120. The at least one first metal wire 110 and the at least one second metal wire 120 are respectively disposed in a one-to-one correspondence manner (one end of one first metal wire 110 is close to one end of the corresponding second metal wire 120), and may be used to test a leakage condition between the two corresponding first metal wires 110 and second metal wires 120.
In some embodiments of the present application, the first direction is perpendicular to the second direction. In the layout of a semiconductor structure, metal line structures are generally distributed horizontally or vertically along a straight line. That is, the first metal line 110 and the second metal line 120 perpendicular to each other may cover most cases of metal line structures to be tested. Of course, in a few cases, the layouts of the first metal line 110 and the second metal line 120 may also be modified for semiconductor structures in which the metal line structures are not horizontally and vertically disposed.
In some embodiments of the present application, a distance between the at least one first metal wire 110, a distance between the at least one second metal wire 120, a distance between the first metal wire 110 and the first dummy metal wire 112, and a distance between the second metal wire 120 and the second dummy metal wire 122 are all minimum dimensions in corresponding nodes. E.g., minimum size of 28 nm process, etc. Since the test main body 100 is used for testing, directly setting the minimum size facilitates effectively obtaining the test result. For example, if the test subject can satisfy the requirement at the minimum size of the corresponding node (i.e. no leakage condition), it means that the test subject can also satisfy the requirement at other large sizes of the node.
The first dummy metal line 112 and the second dummy metal line 122 are respectively used to ensure the stability of the outermost structure in the at least one first metal line 110 and the at least one second metal line 120. In an actual process, the metal wire located at the outermost side is prone to structural defects due to process limitations, i.e., structural instability, and such metal wire cannot be used for testing. Therefore, the first dummy metal wiring 112 and the second dummy metal wiring 122 are used as sacrificial structures. Even if the structures of the first dummy metal wire 112 and the second dummy metal wire 122 are defective, the test is not affected.
The first via 111 is electrically connected to the first metal wire 110, and the second via 121 is electrically connected to the second metal wire 120.
Fig. 2 is a schematic cross-sectional view of a test body in a metal connection electrical property test structure according to an embodiment of the disclosure. Fig. 2 isbase:Sub>A cross-sectional view taken along the dashed linebase:Sub>A-base:Sub>A in fig. 1.
Referring to fig. 2, the test body 100 includes: a substrate 130; a first dielectric layer 140 on the surface of the substrate 130; a first metal line 110 and a first dummy metal line 112 located at two sides of the first metal line 110, and located in the first dielectric layer 140; a second dielectric layer 150 on the surface of the first dielectric layer 140; and a first via 111 in the second dielectric layer 150 and electrically connected to the first metal line 110.
The substrate 130 is a semiconductor substrate, such as a silicon substrate or the like. The material of the first dielectric layer 140 is, for example, an insulating material such as silicon oxide. The material of the first metal line 110 and the first dummy metal line 112 is, for example, copper. The material of the second dielectric layer 150 is, for example, an insulating material such as silicon oxide. The material of the first via 111 is, for example, tungsten.
In some embodiments of the present application, to improve the test accuracy, the material of each portion in the test body 100 is the same as the material in the structure that actually needs to be tested.
Fig. 3 is a second cross-sectional view of a test body in the electrical testing structure of a metal wire according to the embodiment of the present disclosure. Fig. 3 is a cross-sectional view taken along the dashed line B-B in fig. 1.
Referring to fig. 3, the test body 100 includes: a substrate 130; a first dielectric layer 140 on the surface of the substrate 130; a second metal line 120 and a second dummy metal line 122 located at two sides of the second metal line 120, and located in the first dielectric layer 140; a second dielectric layer 150 on the surface of the first dielectric layer 140; and a second via 121 located in the second dielectric layer 150 and electrically connected to the second metal line 120.
The material of the second metal line 120 and the second dummy metal line 122 is, for example, copper. The material of the second through hole 121 is, for example, tungsten.
Fig. 1 to 3 show a structure of a test body in an electrical testing structure of a metal wire according to an embodiment of the present disclosure. In the technical scheme of the application, the layout of the test main body is skillfully designed. The at least one first metal connecting line 110 is sequentially arranged in parallel in an echelon manner, and is electrically connected with the first metal connecting line 110 through the first through hole 111, so that the electric leakage condition of the adjacent first metal connecting lines 110 can be tested; the at least one second metal connecting line 120 is sequentially arranged in parallel in a echelon manner, and is electrically connected with the second metal connecting line 120 through the second through hole 121, so that the electric leakage condition of the adjacent second metal connecting lines 120 can be tested; the at least one first metal connecting line 110 and the at least one second metal connecting line 120 are distributed in a one-to-one correspondence manner like "L", are electrically connected to the first metal connecting line 110 and the second metal connecting line 120, respectively, and can test the leakage condition between the first metal connecting line 110 and the second metal connecting line 120. According to the test main body structure in the technical scheme, the test efficiency and the accuracy can be improved.
As described above, when performing a test, it is necessary to electrically connect the first metal line and the second metal line. The test structure thus further comprises a first pad and a second pad for electrically connecting the power supply and the test body. Since the electrical connection conditions are different in different test requirements (that is, the electrical connection conditions of the first pad and the second pad and the first metal wire and the second metal wire are different), different embodiments are listed in the present application to describe the technical solution of the present application.
Example one
Fig. 4 is a schematic structural diagram of a metal connection electrical property testing structure according to a first embodiment of the present application. It should be noted that, for the sake of brevity, the detailed structure of the test subject 100 is not labeled in fig. 4, and the detailed structure of the test subject 100 is described above.
Referring to fig. 4, the test structure further includes a first pad 160 and a second pad 180 for electrically connecting the test body 100. The test body 100 is located between the first pad 160 and the second pad 180.
With continued reference to fig. 4, the first pads 160 are located on one side of the test body 100. The first pad 160 is electrically connected to the first through hole 111 in the test body 100 through a first metal connection structure 170, and further electrically connected to the first metal wire 110.
The second pad 180 is located at the other side of the test body 100. The second pad 180 is electrically connected to the first via 111 in the test main body 100 through a second metal connection structure 190, and further electrically connected to the first metal wire 110.
The first metal wires 110 electrically connected to the first pads 160 and the first metal wires 110 electrically connected to the second pads 180 are alternately distributed at intervals. The alternate spacing distribution means that when the first pad 160 is electrically connected to one first metal line 110, the second pad 180 is electrically connected to one first metal line 110 adjacent to the first metal line 110. In such an electrical connection manner, the first pad 160 and the second pad 180 are electrically connected to two adjacent first metal lines 110, so that the leakage between the two adjacent first metal lines 110 can be tested.
The first pad 160 and the second pad 180 are not electrically connected to the second metal line 120.
With continued reference to fig. 4, the connection condition shown in the first embodiment is used to test the leakage condition between the adjacent first metal lines 110.
Example two
Fig. 5 is a schematic structural diagram of a metal line electrical testing structure according to a second embodiment of the present application. It should be noted that, for the sake of brevity, the detailed structure of the test subject 100 is not labeled in fig. 5, and the detailed structure of the test subject 100 is described above.
Referring to fig. 5, the test structure further includes a first pad 160 and a second pad 180 for electrically connecting the test body 100. The test body 100 is located between the first pad 160 and the second pad 180.
With continued reference to fig. 5, the first pads 160 are located on one side of the test body 100. The first pad 160 is electrically connected to the second via 121 in the test main body 100 through a first metal connection structure 170, and further electrically connected to the second metal wire 120.
The second pad 180 is located at the other side of the test body 100. The second pad 180 is electrically connected to the second via 121 in the test body 100 through a second metal connection structure 190, and further electrically connected to the second metal wire 120.
Wherein, the second metal wires 120 electrically connected to the first pads 160 and the second metal wires 120 electrically connected to the second pads 180 are alternately distributed at intervals. The alternate spacing distribution means that when the first pad 160 is electrically connected to one second metal line 120, the second pad 180 is electrically connected to one second metal line 120 adjacent to the second metal line 120. In such an electrical connection manner, the first pad 160 and the second pad 180 are electrically connected to two adjacent second metal lines 120, so that the leakage between the two adjacent second metal lines 120 can be tested.
The first pad 160 and the second pad 180 are not electrically connected to the first metal line 110.
With continued reference to fig. 5, the connection condition shown in the second embodiment is used to test the leakage condition between the adjacent second metal lines 120.
EXAMPLE III
Fig. 6 is a schematic structural diagram of a metal connection electrical testing structure according to a third embodiment of the present application. It should be noted that, for the sake of brevity, the detailed structure of the test subject 100 is not labeled in fig. 6, and the detailed structure of the test subject 100 is described above.
Referring to fig. 6, the test structure further includes a first pad 160 and a second pad 180 for electrically connecting the test body 100. The test body 100 is located between the first pad 160 and the second pad 180.
With continued reference to fig. 6, the first pads 160 are located on one side of the test body 100. The first pad 160 is electrically connected to the first through hole 111 in the test body 100 through a first metal connection structure 170, and further electrically connected to the first metal wire 110.
The second pad 180 is located at the other side of the test body 100. The second pad 180 is electrically connected to the second via 121 in the test body 100 through a second metal connection structure 190, and further electrically connected to the second metal wire 120.
The first metal lines 110 electrically connected to the first pads 160 correspond to the second metal lines 120 electrically connected to the second pads 180 in a one-to-one manner. The one-to-one correspondence means that one end of the first metal wire 110 electrically connected to the first pad 160 and one end of the second metal wire 120 electrically connected to the second pad 180 are close to each other and have an L-like shape. In such an electrical connection manner, the first pad 160 and the second pad 180 are electrically connected to the first metal wire 110 and the second metal wire 120 which are closest to each other, so that the leakage between the first metal wire 110 and the second metal wire 120 can be tested.
With continued reference to fig. 6, the connection condition shown in the third embodiment is used to test the leakage condition between the adjacent first metal line 110 and second metal line 120.
Example four
Fig. 7 is a schematic structural diagram of a metal connection electrical testing structure according to a fourth embodiment of the present application. It should be noted that the detailed structure of the test main body 100 and the connection structure with the corresponding test pad are not shown in fig. 7, and the detailed structure of the test main body 100 and the connection structure with the corresponding test pad are described in detail in the foregoing.
The first to third embodiments respectively show corresponding test structures designed according to different test requirements. However, instead of designing one test structure for one test requirement alone, a plurality of test requirements may be combined to design one test structure combining the first to third embodiments.
Referring to fig. 7, the electrical testing structure 200 of the metal wire according to the fourth embodiment includes: a first pad 210, a second pad 220, a third pad 230, and a fourth pad 240. A test body 250 is included between each adjacent two of the test pads.
Example four combines examples one to three. Specifically, the first pad 210, the second pad 220, and the test body 250 between the first pad 210 and the second pad 220 correspond to embodiment one. The second pad 220, the third pad 230, and the test body 250 between the second pad 220 and the third pad 230 correspond to embodiment two. The third pad 230, the fourth pad 240, and the test body 250 between the third pad 230 and the fourth pad 240 correspond to embodiment three.
That is, the connection situation as described in the first to third embodiments is described. The first pad 210 and the second pad 220 are electrically connected to a first metal wire of the test body 250 between the first pad 210 and the second pad 220, and the first metal wire electrically connected to the first pad 210 and the first metal wire electrically connected to the second pad 220 are alternately spaced.
The second pad 220 and the third pad 230 are electrically connected to a second metal wire of the test body 250 located between the second pad 220 and the third pad 230, and the second metal wire electrically connected to the second pad 220 and the second metal wire electrically connected to the third pad 230 are alternately distributed at intervals.
The third pad 230 is electrically connected to the first metal line of the test body 250 between the third pad 230 and the fourth pad 240, and the fourth pad 240 is electrically connected to the second via metal line of the test body 250 between the third pad 230 and the fourth pad 240.
The detailed structure of the test main body 250 and the connection structure of the test main body 250 and the corresponding first pad 210, second pad 220, third pad 230, and fourth pad 240 refer to embodiments one to three, and are not repeated herein. Fig. 7 is a schematic structural diagram of a combination of the first embodiment and the second embodiment.
In some embodiments of the present application, the first pad 210, the second pad 220, the third pad 230, and the fourth pad 240 are arranged along a same straight line.
With reference to fig. 7, in the test structure according to the fourth embodiment, a leakage condition between the adjacent first metal lines, a leakage condition between the adjacent second metal lines, and a leakage condition between the adjacent first metal lines and the adjacent second metal lines may be tested at the same time. The test structure improves the test efficiency.
The application provides a metal connecting wire electrical test structure, through ingenious metal connecting wire distribution, utilize the most ageing electric test, can pointed test the electric leakage condition between the metal connecting wire of same structure and different structures.
In view of the above, it will be apparent to those skilled in the art upon reading the present application that the foregoing application content may be presented by way of example only, and may not be limiting. Those skilled in the art will appreciate that the present application is intended to cover various reasonable variations, adaptations, and modifications of the embodiments described herein, although not explicitly described herein. Such alterations, modifications, and variations are intended to be within the spirit and scope of the exemplary embodiments of this application.
It should be understood that the term "and/or" as used in this embodiment includes any and all combinations of one or more of the associated listed items. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present.
Similarly, it will be understood that when an element such as a layer, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, the term "directly" means that there are no intervening elements. It will be further understood that the terms "comprises," "comprising," "includes" or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It will be further understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, a first element in some embodiments may be termed a second element in other embodiments without departing from the teachings of the present application. The same reference numerals or the same reference characters denote the same elements throughout the specification.
Further, the present specification describes example embodiments with reference to idealized example cross-sectional and/or plan and/or perspective views. Accordingly, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, example embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of exemplary embodiments.
Claims (10)
1. A kind of metal connecting wire electrical property test structure, characterized by that, comprising:
a test body comprising:
the first metal connecting wires are sequentially arranged along a first direction, and first through holes are formed in the surfaces of two ends of each first metal connecting wire;
the second metal connecting wires are sequentially arranged along a second direction, second through holes are formed in the surfaces of two ends of each second metal connecting wire, and the at least one second metal connecting wire is arranged corresponding to the at least one first metal connecting wire;
the first welding pad is positioned on one side of the test main body and is electrically connected with the first through hole or the second through hole through a first metal connecting structure;
and the second welding pad is positioned on the other side of the test main body and is electrically connected with the first through hole or the second through hole through a second metal connecting structure.
2. The electrical testing structure of claim 1, wherein when testing the leakage of the first metal wire, the first pad is electrically connected to the first metal wire through the first via, the second pad is electrically connected to the first metal wire through the first via, and the first metal wire electrically connected to the first pad and the first metal wire electrically connected to the second pad are alternately spaced.
3. The electrical testing structure of claim 1, wherein when testing leakage of the second metal lines, the first pad is electrically connected to the second metal line through the second via, the second pad is electrically connected to the second metal line through the second via, and the second metal line electrically connected to the first pad and the second metal line electrically connected to the second pad are alternately spaced.
4. The electrical testing structure of claim 1, wherein the first pad is electrically connected to the first metal trace through the first via and the second pad is electrically connected to the second metal trace through the second via when testing for leakage between the first metal trace and the second metal trace.
5. The electrical property test structure of claim 1, wherein a first dummy metal wire is further disposed on both sides of the at least one first metal wire, and a second dummy metal wire is further disposed on both sides of the at least one second metal wire.
6. The electrical testing structure of claim 1, wherein the number of the at least one first metal line is the same as the number of the at least one second metal line.
7. The electrical testing structure of claim 1, wherein the at least one first metal line and the at least one second metal line are arranged in an L-like shape.
8. The electrical testing structure of claim 1, wherein the first direction is perpendicular to the second direction.
9. The electrical testing structure of claim 1, further comprising:
a third bonding pad and a fourth bonding pad, the test body being disposed between the second bonding pad and the third bonding pad and between the third bonding pad and the fourth bonding pad,
the first welding pad and the second welding pad are electrically connected with a first metal connecting line of the test main body between the first welding pad and the second welding pad, and the first metal connecting line electrically connected with the first welding pad and the first metal connecting line electrically connected with the second welding pad are alternately distributed at intervals;
the second welding pad and the third welding pad are electrically connected with a second metal connecting line of the test main body between the second welding pad and the third welding pad, and the second metal connecting line electrically connected with the second welding pad and the second metal connecting line electrically connected with the third welding pad are alternately distributed at intervals;
the third welding pad is electrically connected with a first metal connecting line of the test main body between the third welding pad and the fourth welding pad, and the fourth welding pad is electrically connected with a second through hole metal connecting line of the test main body between the third welding pad and the fourth welding pad.
10. The electrical testing structure of claim 9, wherein the first pad, the second pad, the third pad, and the fourth pad are arranged along a same line.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110945206.1A CN115910822A (en) | 2021-08-17 | 2021-08-17 | Metal connecting wire electrical property test structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110945206.1A CN115910822A (en) | 2021-08-17 | 2021-08-17 | Metal connecting wire electrical property test structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115910822A true CN115910822A (en) | 2023-04-04 |
Family
ID=86494108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110945206.1A Pending CN115910822A (en) | 2021-08-17 | 2021-08-17 | Metal connecting wire electrical property test structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115910822A (en) |
-
2021
- 2021-08-17 CN CN202110945206.1A patent/CN115910822A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6690187B2 (en) | Apparatus for testing reliability of interconnection in integrated circuit | |
CN104849880B (en) | Display pannel TEG test suites and forming method thereof and method of testing | |
CN203631539U (en) | Through silicon via testing structure | |
US6693446B2 (en) | Apparatus for testing reliability of interconnection in integrated circuit | |
CN115910822A (en) | Metal connecting wire electrical property test structure | |
CN205248238U (en) | Reliability test structure | |
TW200413740A (en) | Adapter for testing one or more conductor assemblies | |
CN106981476B (en) | Semiconductor devices and forming method thereof | |
CN116148617A (en) | Test adapter plate and test device | |
TWI516772B (en) | Printed circuit board of probing card | |
CN103681620B (en) | Interconnect electromigratory test structure | |
KR102124628B1 (en) | Test structures of semiconductor device | |
KR20090088158A (en) | A test pattern of semiconductor device and method for forming the same | |
CN101819940B (en) | Method and structure for testing wafer | |
KR20100013977A (en) | A test pattern of a semiconductor device and method for manufacturing the same | |
WO2023240596A1 (en) | Semiconductor test structure and test method thereof | |
CN107870294A (en) | The evaluation method of evaluating apparatus, semiconductor device | |
US20080122446A1 (en) | Test pattern | |
JP5012530B2 (en) | Semiconductor device, semiconductor substrate, and monitoring device inspection method | |
JP3055506B2 (en) | IC socket | |
TWI548880B (en) | Printed circuit board of probing card | |
CN117607540A (en) | Resistance testing method of superconducting quantum interference device and quantum chip | |
CN118800763A (en) | Semiconductor test structure and test method thereof | |
KR20090074490A (en) | Method for forming a metal line of semiconductor memory device | |
KR20090068662A (en) | Test pattern of semicondictor device and method of manufacturing thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |