CN115734659A - Display panel, preparation method thereof and display device - Google Patents
Display panel, preparation method thereof and display device Download PDFInfo
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- CN115734659A CN115734659A CN202111007348.XA CN202111007348A CN115734659A CN 115734659 A CN115734659 A CN 115734659A CN 202111007348 A CN202111007348 A CN 202111007348A CN 115734659 A CN115734659 A CN 115734659A
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Abstract
The application provides a display panel, a preparation method thereof and a display device. The display panel is provided with a display area and a bending area positioned on one side of the display area, the display area is provided with a pixel driving circuit, and the bending area is provided with a lead wire electrically connected with the pixel driving circuit; the display panel comprises a flexible substrate, an insulating layer and a flexible material layer, wherein the insulating layer and the flexible material layer are arranged on the flexible substrate, a groove is formed in the bending area, the groove penetrates through the insulating layer, the lead is arranged in the groove, and the flexible material layer is filled in the groove and is positioned above the lead and in an interval area of the lead. According to the display panel, the bending area is provided with the groove penetrating through the insulating layer, and the flexible material layer is filled on the lead and in the interval area of the lead, so that the occurrence of the fracture condition of the bending area can be effectively reduced, the occurrence of the fracture condition of the lead in the bending area is reduced, and the yield of the lead and the yield of the display panel are improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device.
Background
Currently, flexible AMOLED (Active-matrix organic light emitting diode) display screens are becoming the mainstream configuration and development direction of high-end mobile display devices. Due to the requirements of the mobile display device on the screen occupation ratio and the narrow frame, the flexible substrate needs to fold the driving chip and the lead wires to the back of the screen while reducing the screen frame, so that the occupation ratio of the display area on the front is improved. However, due to the need for folding, the structure of the bent portion and the traces are at risk of damage.
Disclosure of Invention
According to a first aspect of embodiments herein, there is provided a display panel. Display panel has the display area and is located the bending area of display area one side, the display area is equipped with pixel drive circuit, the bending area be equipped with can extend to the display area with the lead wire that pixel drive circuit electricity is connected, display panel includes flexible substrate, is located insulating layer and flexible material layer on the flexible substrate, the bending area is equipped with the slot, the slot runs through the insulating layer, the part of lead wire is located in the slot, the flexible material layer fill in the slot and be located lead wire top and the interval region of lead wire.
In some embodiments, the display region includes a pixel driving circuit layer disposed on the flexible substrate, the pixel driving circuit layer having the pixel driving circuit disposed therein, the pixel driving circuit layer including an isolation buffer layer, a gate insulating layer, an interlayer dielectric layer, and a planarization layer;
the insulating layer comprises the isolation buffer layer covering the bending region, the gate insulating layer and an interlayer dielectric layer.
In some embodiments, the flexible material layer is disposed in a same layer as the planarization layer.
In some embodiments, the trench includes a bottom surface and a first side surface and a second side surface located on both sides of the bottom surface and connected to the bottom surface, a partial region of a surface of the flexible substrate facing the insulating layer serves as the bottom surface of the trench, and the flexible material layer fills a region between the first side surface and the second side surface of the trench except for a region where a lead is disposed.
In some embodiments, the leads include a first conductive lead layer and a second conductive lead layer on a side of the first conductive lead layer facing away from the flexible substrate.
According to a second aspect of embodiments of the present application, there is provided a method of manufacturing a display panel, including:
providing a flexible substrate;
forming an insulating layer on the flexible substrate;
forming a groove penetrating through the insulating layer in the bending area;
forming a lead extending from the bending area to the display area, wherein the part of the bent lead is positioned in the groove;
and filling a flexible material layer in the groove, wherein the flexible material layer is filled above the lead and in the interval region of the lead.
In some embodiments, forming an insulating layer on the flexible substrate comprises:
and forming an isolation buffer layer, a gate insulating layer and an interlayer dielectric layer on the flexible substrate, wherein the isolation buffer layer, the gate insulating layer and the interlayer dielectric layer which are positioned in the bending region form the insulating layer.
In some embodiments, the method comprises: and forming via holes in the gate insulating layer and the interlayer dielectric layer of the display area, wherein the trench and the via holes are formed in the same process.
In some embodiments, after forming the trench, the method comprises:
forming a first metal conductive layer; the first metal conducting layer is at least positioned in the bending area;
forming a second metal conducting layer on the surface of the first metal conducting layer; the second metal conducting layer is positioned in the display area and the bending area;
etching the second metal conductive layer to form a second conductive lead layer;
and etching the first metal conductive layer to form a first conductive lead layer so as to form a lead comprising the first conductive lead layer and the second conductive lead layer.
In some embodiments, the second metal conductive layer is etched by a dry etching method, and the first metal conductive layer is etched by a wet etching method.
In some embodiments, after forming the second metal conductive layer, the method comprises:
and etching the second metal conductive layer to form a second conductive lead layer and a source electrode and a drain electrode which are positioned in the display area.
In some embodiments, after forming the source and drain, the method comprises:
forming a planarization layer; the planarization layer is located above the source electrode, the drain electrode, the exposed interlayer dielectric layer and the groove, wherein the planarization layer in the groove is used as the flexible material layer.
According to a third aspect of embodiments of the present application, there is provided a display device including the display panel described above.
According to the display panel, the preparation method thereof and the display device provided by the embodiment of the application, the groove penetrating through the insulating layer is formed in the bending area of the display panel, and the flexible material layer is filled on the lead and the interval area of the lead, so that the breaking condition of the bending area can be effectively reduced, the breaking condition of the lead in the bending area is reduced, and the yield of the lead and the yield of the display panel are improved.
Drawings
Fig. 1 is a schematic structural diagram of a display panel according to an exemplary embodiment of the present application;
fig. 2 and 3 are partial process flow diagrams for preparing a display panel according to an exemplary embodiment of the present disclosure;
fig. 4 is a flowchart of a method for manufacturing a display panel according to an exemplary embodiment of the present application.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. The word "if," as used herein, may be interpreted as "at \8230; \8230when" or "when 8230; \823030when" or "in response to a determination," depending on the context.
The embodiment of the application provides a display panel, a preparation method thereof and a display device. The display panel, the manufacturing method thereof, and the display device in the embodiments of the present application are described in detail below with reference to the accompanying drawings. The features of the embodiments described below may complement or be combined with each other without conflict.
The embodiment of the application provides a display panel. Referring to fig. 1, and as necessary in conjunction with fig. 2, the display panel has a display area S1, a bending area S2 at one side of the display area S1, and a binding area. The binding region and the display region S1 are located on two opposite sides of the bending region S2, so that after the display panel is bent, the binding region is located on the back of the display panel and connected with an external chip and the like, the display region S1 is provided with a pixel driving circuit for driving the light-emitting structure, the bending region S2 is provided with a lead 60, one end of the lead 60 can extend to the display region to be electrically connected with the pixel driving circuit, and the other end of the lead 60 can extend to the binding region to electrically connect the pixel driving circuit with the external chip.
The display panel comprises a flexible substrate 10, an insulating layer 201 and a flexible material layer 70, wherein the insulating layer 201 and the flexible material layer 70 are located on the flexible substrate 10, a groove 30 is formed in a bending area S2, the groove 30 penetrates through the insulating layer 201, a part of a lead 60 is arranged in the groove 30, and the flexible material layer 70 is filled in the groove 30, located above the lead 60 and in an interval area of the lead 60. The portion of the lead 60 located in the groove 30 is attached to the inner wall of the groove 30.
In some embodiments, the material of the flexible substrate 10 may include one or more of polyimide, polyethylene terephthalate, and polycarbonate.
Referring to fig. 1, in some embodiments, the flexible substrate 10 includes a first substrate layer 11, a second substrate layer 12, and a third substrate layer 13 stacked in sequence. The first substrate layer 11 and the third substrate layer 13 may be formed of an organic material, for example, one or more of polyimide, polyethylene terephthalate, and polycarbonate. The second substrate layer 12 may be formed of an inorganic material and may serve as a buffer layer of the flexible substrate.
It should be noted that, in other embodiments, the flexible substrate may also be made of other materials or have a layer structure in other forms, which is not limited in this application and may be set according to specific situations.
In some embodiments, the material of the flexible material layer 70 includes an organic material. For example, the material of the flexible material layer 70 may be one or more of resin materials, such as one or more of epoxy resin, phenolic resin, polyamide resin, polyimide, and benzocyclobutene.
The area where the display area S1 is located includes a pixel driving circuit layer 20 disposed on the flexible substrate 10, and the pixel driving circuit is disposed in the pixel driving circuit layer 20. The pixel driving circuit includes a thin film transistor 90. The thin film transistor 90 includes an active layer 91, a gate electrode 92 on a side of the active layer 91 facing away from the flexible substrate 10, a first pole 93, and a second pole 94. One of the first and second electrodes 93 and 94 is a source electrode, and the other is a drain electrode.
The pixel driving circuit layer 20 includes a stacked isolation buffer layer 21, a gate insulating layer 221, an interlayer dielectric layer, and a planarization layer 224. Wherein the active layer 91 is disposed on a side of the isolation buffer layer 21 facing away from the flexible substrate 10. The gate insulating layer 221 is located between the active layer 91 and the gate electrode 92. An interlevel dielectric layer is located on the side of the gate electrode 92 facing away from the flexible substrate 10. The first and second electrodes 93 and 94 are electrically connected to the active layer 91 through a via hole penetrating the gate insulating layer 221 and the interlayer dielectric layer. The planarization layer 224 is disposed on a side of the first and second electrodes 93 and 94 facing away from the flexible substrate 10, and covers the exposed interlayer dielectric layer.
The display panel structure shown in fig. 1 has two layers of gate electrodes 92 spaced apart along the thickness of the display panel. Accordingly, the interlayer dielectric layer may include a first interlayer dielectric layer 222 on a side of the lower gate electrode layer facing away from the flexible substrate 10, and a second interlayer dielectric layer 223 on a side of the upper gate electrode layer facing away from the flexible substrate 10. The upper gate electrode layer is located on the side of the first interlayer dielectric layer 222 away from the flexible substrate 10.
In some embodiments, the material of the planarization layer 224 is an organic material, and may be one or more of resin materials, such as one or more of epoxy resin, phenolic resin, polyamide resin, polyimide, and benzocyclobutene.
The isolation buffer layer 21 is made of inorganic material, such as SiO x 、SiN x 、SiON、Al 2 O 3 And the like, can play a role in preventing water vapor from entering the device from the bottom of the flexible substrate 10, and can prevent impurity atoms from being separated out to enter the pixel driving circuit to form doping. In some embodiments, the isolation buffer layer 21 includes a buffer layer 211 and an isolation layer 212 on a side of the buffer layer 211 facing away from the flexible substrate 10.
Accordingly, the insulating layer 201 includes the isolation buffer layer 21 covering the bending region S2, the gate insulating layer 221, and an interlayer dielectric layer. As shown in fig. 2, the trench 30 of the bending region S2 penetrates through the entire insulating layer 201 along the thickness direction of the insulating layer 201, so that a portion of the flexible substrate 10 below the trench 30 is exposed.
Further, the groove 30 includes a bottom surface 33 and a first side surface 31 and a second side surface 32 located on both sides of the bottom surface 33 and connected to the bottom surface 33. In some embodiments, the trench 30 opens just to the surface of the flexible substrate 10 facing the insulating layer 201. Accordingly, the region of the surface of the flexible substrate 10 facing the insulating layer 201 exposed from the trench 30 serves as the bottom surface of the trench 30. In other embodiments, a chamfered region 301 recessed into the flexible substrate 10 is formed at the junction of the bottom surface 33 and the first side surface 31 and/or at the junction of the bottom surface 33 and the second side surface 32. The lead 60 disposed in the trench 30 may partially fill the bevel region 301. Specifically, the flexible material layer 70 fills the region between the first side surface 31 and the second side surface 32 of the trench 30 except for the region where the lead is provided.
In some embodiments, the lead 60 includes a first conductive lead layer 62 proximate a side of the inner wall of the trench 30 and a second conductive lead layer 61 on a side of the first conductive lead layer 62 facing away from the flexible substrate 10. The first conductive line layer 62 may be made of a metal oxide, such as Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO). The first conductive lead layer 62 may serve as a backing layer for the lead 60. The second conductive lead layer 61 may serve as a main conductive layer of the lead 60. The material of the second conductive lead layer 61 may be the same as the material of the source and drain electrodes.
The lead 60 disposed in the trench 30 may partially fill the bevel region 301, and it is specifically understood that a portion of the first conductive lead layer 62 fills the bevel region 301.
Here, the second conductive lead layer 61 may be formed by dry etching, and the first conductive lead layer 62 may be formed by wet etching. By utilizing the characteristic of poor anisotropy of wet etching, the spacing region of the entire lead 60 can be etched more completely (for example, the portion of the first conductive lead layer 62 located in the chamfered region 301 in the spacing region of the lead 60 can be etched more cleanly), and the etchant used in the wet etching does not react with the second conductive lead layer 61, so that the second conductive lead layer 61 is not affected when the first conductive lead layer is formed. The setting of first electrically conductive lead layer 62 is favorable to reducing the short circuit risk of lead 60, is favorable to improving the anti ability of buckling in whole district, reduces the bending stress in district of buckling, can avoid the district of buckling and bind the risk that district crackle produced to improve display panel's whole performance.
Further, in some embodiments, the flexible material layer 70 is disposed in a same layer as the planarization layer 224, and both are a unitary structure formed in a same process. The material of the flexible material layer 70 is the same as that of the planarization layer 224.
Further, in some embodiments, the display panel further includes a light emitting layer 80 on a side of the pixel driving circuit layer 20 away from the flexible substrate 10. The light emitting layer 80 may include an electrode 81, a pixel defining layer 82, and the like.
Fig. 4 is a flowchart of a method for manufacturing a display panel according to an exemplary embodiment of the present application, where the method for manufacturing a display panel includes the following steps 101 to 105:
103, forming a groove penetrating through the insulating layer in the bending area;
104, forming a lead extending from the bending area to the display area, wherein the part of the lead positioned in the bending area is positioned in the groove;
Referring to fig. 4, a method for manufacturing the display panel will be described in detail with reference to fig. 1 to 3 as necessary.
In step 101, a flexible substrate 10 may be provided. For the flexible substrate 10, reference may be made to the above description, and details thereof are not repeated herein.
In step 102, an isolation buffer layer 21, a gate insulating layer 221, and an interlayer dielectric layer may be formed on the display region S1 and the bending region S2 of the flexible substrate 10. Accordingly, the isolation buffer layer 21, the gate insulating layer 221, and the interlayer dielectric layer at the bending region S2 form an insulating layer 201.
Specifically, step 102 can be implemented by the following steps:
at step 1021, an isolation buffer layer 21 is formed on the flexible substrate 10.
In step 1022, an active layer 91 is formed on a side of the isolation buffer layer 21 away from the flexible substrate 10.
In step 1023, a gate insulating layer 221 is formed on the isolation buffer layer 21 and the active layer 91 on the side away from the flexible substrate 10.
In step 1024, a gate electrode 92 is formed on a side of the gate insulating layer 221 facing away from the flexible substrate 10.
In step 1025, an interlevel dielectric layer is formed.
Thus, the insulating layer 201 at the bending region S2 can be formed through the steps 1021 to 1025.
In step 1024, an entire gate electrode layer may be formed on the side of the gate insulating layer 221 away from the flexible substrate 10, and the entire gate electrode layer may be patterned by etching to form the desired gate electrode 92.
Of course, for a layer structure comprising a plurality of sub-structure layers, the sub-structure layers can also be formed in sequence according to the sequence of the sub-structure layers. For example, for the isolation buffer layer 21 including the buffer layer 211 and the isolation layer 212 located on the side of the buffer layer 211 away from the flexible substrate 10, the buffer layer 211 may be formed on the flexible substrate 10, and then the isolation layer 212 may be formed on the side of the buffer layer 211 away from the flexible substrate 10. For a structure including two layers of gate electrode 92 and interlayer dielectric layers 222 and 223, gate electrode 92 and the corresponding interlayer dielectric layers may also be formed sequentially.
Further, in step 103, a trench 30 penetrating through the insulating layer 201 is formed in the bending region S2, so that the lower surface of the lead 60 can contact with a portion of the flexible substrate 10, which is beneficial to improving the flexibility of the bending region S2 compared to the embodiment in which the trench 30 does not penetrate through the insulating layer.
Specifically, in some embodiments, the trench 30 may be formed in the insulating layer 201 by dry etching.
In some embodiments, the trench 30 may include a chamfered region 301 as shown in FIG. 2.
In some embodiments, the display panel manufacturing method further includes: a first via 40 and a second via 50 are opened in the gate insulating layer 221 of the display region and the interlayer dielectric layer for providing a first pole 93 and a second pole 94 connected to the active layer 91.
In a preferred embodiment, the trench 30 may be formed in the same process as the first via 40 and the second via 50, such as in the same etching process.
Further, in some embodiments, step 104 may be implemented by steps 1041 to 1044 as follows:
step 1041: a first metal conductive layer is formed on the entire surface of the side where the trench 30 is opened. Of course, in other embodiments, the first metal conductive layer may also be located only in the bending region.
Step 1042: forming a second metal conducting layer on the surface of the first metal conducting layer; the second metal conducting layer is positioned in the display area and the bending area;
step 1043: etching the second metal conductive layer to form a second conductive lead layer;
step 1044: and etching the first metal conductive layer to form a first conductive lead layer so as to form a lead comprising the first conductive lead layer and the second conductive lead layer.
At the same time that the second conductive wiring layer is formed in step 1043, the first and second electrodes 93 and 94 located in the display region may be formed, i.e., the source and drain electrodes are formed. In step 1043, the second metal conductive layer is etched to form a second conductive lead layer 61, a source and a drain. I.e., the second conductive lead layer 61, the source electrode and the drain electrode are formed in the same process.
It should be noted that in some embodiments, the first pole 93 and the second pole 94 may be formed by dry etching in this step.
In some embodiments, the second metal conductive layer is etched by dry etching to form the second conductive lead layer 61, and the first metal conductive layer is etched by wet etching to form the first conductive lead layer 62, so as to form the lead 60 including the first conductive lead layer 62 and the second conductive lead layer 61.
The characteristic of poor anisotropy of the wet etching is utilized here, so that the entire spacing region of the lead 60 can be etched more thoroughly (for example, the portion of the first conductive lead layer 62 located in the chamfered region 301 in the spacing region of the lead 60 can be etched more cleanly), and the etchant used in the wet etching does not react with the second conductive lead layer 61, so that the second conductive lead layer 61 is not affected when the first conductive lead layer is formed. The arrangement of the first conductive lead layer 62 is beneficial to reducing the short circuit risk of the lead 60, improving the bending resistance of the whole bending area, reducing the bending stress of the bending area, avoiding the bending area and the risk of crack generation of the binding area, and improving the overall use performance of the display panel.
After step 1044, the trench 30 may be filled with a layer of flexible material 70. The flexible material layer 70 fills the space above the leads 60 and the leads 60, step 105.
Specifically, in some embodiments, after step 1044, planarization layer 224 may be formed. The planarization layer 224 is located over the first pole 93, over the second pole 94, over the exposed interlevel dielectric layer, and in the trench 30. Wherein the planarization layer 224 in the trench 30 forms the flexible material layer 70. In this way, by forming the flexible material layer 70 simultaneously in the process of forming the planarization layer 224, the manufacturing process of the display panel is saved, the manufacturing time of the display panel is saved, and the manufacturing efficiency of the display panel is improved.
Of course, in other embodiments, the flexible material layer may be formed separately and formed in the process of forming the planarization layer.
Subsequently, the light emitting layer 80, the encapsulation layer, the touch layer, and the like may be sequentially disposed on the side of the pixel driving circuit layer 20 away from the flexible substrate 10 to form a complete display panel.
Here, the lead 60 may be a patterned lead or a non-patterned lead.
The embodiment of the application also provides a display device, and the display device comprises the display panel in any embodiment.
In one embodiment, the display device further includes a driver for providing a driving signal for driving the light emitting structures of the light emitting layer to emit light, and a power supply circuit for supplying power to the display panel.
In one embodiment, the display device further comprises a housing, and the display panel is disposed in or assembled on the housing.
The display device provided by the embodiment of the application can be any equipment with a display function, such as a mobile phone, a tablet computer, a television, a notebook computer, a vehicle-mounted equipment and the like.
It is noted that in the drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer or intervening layers may also be present. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element or intervening layers or elements may be present. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer between the two layers or elements, or more than one intermediate layer or element can also be present. Like reference numerals refer to like elements throughout.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (13)
1. The utility model provides a display panel, display panel has the display area and is located the district of buckling of display area one side, the display area is equipped with pixel drive circuit, the district of buckling be equipped with can extend to the display area with the lead wire that pixel drive circuit electricity is connected, a serial communication port, display panel includes flexible substrate, is located insulating layer and flexible material layer on the flexible substrate, the district of buckling is equipped with the slot, the slot runs through the insulating layer, the part of lead wire is located in the slot, the flexible material layer fill in the slot is located lead wire top and the interval region of lead wire.
2. The display panel according to claim 1, wherein the display region includes a pixel driving circuit layer provided on the flexible substrate, the pixel driving circuit layer having the pixel driving circuit provided therein, the pixel driving circuit layer including an isolation buffer layer, a gate insulating layer, an interlayer dielectric layer, and a planarization layer;
the insulating layer comprises the isolation buffer layer, the grid insulating layer and the interlayer dielectric layer which cover the bending region.
3. The display panel according to claim 2, wherein the flexible material layer is disposed in a same layer as the planarization layer.
4. The display panel according to claim 1, wherein the groove includes a bottom surface, and first and second side surfaces located on both sides of the bottom surface and connected to the bottom surface, a partial region of a surface of the flexible substrate facing the insulating layer serves as the bottom surface of the groove, and the flexible material layer fills a region between the first and second side surfaces of the groove other than a region where the lead is provided.
5. The display panel of claim 1, wherein the leads comprise a first conductive lead layer and a second conductive lead layer on a side of the first conductive lead layer facing away from the flexible substrate.
6. A method for manufacturing a display panel, comprising:
providing a flexible substrate;
forming an insulating layer on the flexible substrate;
forming a groove penetrating through the insulating layer in the bending area;
forming a lead wire extending from the bending area to the display area, wherein the part of the lead wire positioned in the bending area is positioned in the groove;
and filling a flexible material layer in the groove, wherein the flexible material layer is filled above the lead and in the interval region of the lead.
7. The method of manufacturing a display panel according to claim 6, wherein the forming of the insulating layer on the flexible substrate includes:
and forming an isolation buffer layer, a gate insulating layer and an interlayer dielectric layer on the flexible substrate, wherein the isolation buffer layer, the gate insulating layer and the interlayer dielectric layer which are positioned in the bending region form the insulating layer.
8. The method for manufacturing a display panel according to claim 7, wherein the method comprises: and forming via holes in the gate insulating layer and the interlayer dielectric layer of the display area, wherein the trench and the via holes are formed in the same process.
9. The method for manufacturing a display panel according to claim 7 or 8, wherein after the forming of the groove, the method comprises:
forming a first metal conductive layer; the first metal conducting layer is at least positioned in the bending area;
forming a second metal conducting layer on the surface of the first metal conducting layer; the second metal conducting layer is positioned in the display area and the bending area;
etching the second metal conductive layer to form a second conductive lead layer;
and etching the first metal conductive layer to form a first conductive lead layer so as to form a lead comprising the first conductive lead layer and the second conductive lead layer.
10. The display panel according to claim 9, wherein the second metal conductive layer is etched by a dry etching method, and the first metal conductive layer is etched by a wet etching method.
11. The display panel of claim 9, wherein after forming the second metal conductive layer, the method comprises:
and etching the second metal conductive layer to form a second conductive lead layer and a source electrode and a drain electrode which are positioned in the display area.
12. The display panel of claim 11, wherein after forming the source and drain electrodes, the method comprises:
forming a planarization layer; the planarization layer is located above the source electrode, above the drain electrode, above the exposed interlayer dielectric layer and in the groove, wherein the planarization layer in the groove serves as the flexible material layer.
13. A display device characterized by comprising the display panel according to any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111007348.XA CN115734659A (en) | 2021-08-30 | 2021-08-30 | Display panel, preparation method thereof and display device |
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| CN202111007348.XA CN115734659A (en) | 2021-08-30 | 2021-08-30 | Display panel, preparation method thereof and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117717343A (en) * | 2024-02-07 | 2024-03-19 | 深圳市前海蛇口自贸区医院(深圳市南山区蛇口人民医院) | Flexible surface myoelectric device |
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2021
- 2021-08-30 CN CN202111007348.XA patent/CN115734659A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117717343A (en) * | 2024-02-07 | 2024-03-19 | 深圳市前海蛇口自贸区医院(深圳市南山区蛇口人民医院) | Flexible surface myoelectric device |
| CN117717343B (en) * | 2024-02-07 | 2024-09-20 | 深圳市前海蛇口自贸区医院(深圳市南山区蛇口人民医院) | Flexible surface myoelectric device |
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