CN115648622A - Array nozzle device and method for printing large-area high-density fine circuit - Google Patents
Array nozzle device and method for printing large-area high-density fine circuit Download PDFInfo
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- CN115648622A CN115648622A CN202211295673.5A CN202211295673A CN115648622A CN 115648622 A CN115648622 A CN 115648622A CN 202211295673 A CN202211295673 A CN 202211295673A CN 115648622 A CN115648622 A CN 115648622A
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- 238000007639 printing Methods 0.000 title claims abstract description 75
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
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- 229920001940 conductive polymer Polymers 0.000 claims description 2
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Abstract
The application provides an array nozzle device and a method for printing a large-area high-density fine circuit. Utilize array shower nozzle device to combine single dull and stereotyped electrode electric field drive to spray the deposit and receive 3D printing technique a little, can realize that the high efficiency of large tracts of land high density fine circuit and low-cost are made, but also have the fine circuit interval of printing and adjust wantonly, especially can also realize the high-efficient printing of the parallel of super high density, super small interval through the subdivision function of multiunit array shower nozzle.
Description
Technical Field
The application belongs to the technical field of micro-nano 3D printing and fine circuit additive manufacturing, particularly relates to an array nozzle device and method for printing a large-area high-density fine circuit, and particularly relates to a variable linear spacing high-density array nozzle and method suitable for electric field driven injection micro-nano 3D printing flexible manufacturing.
Background
In order to meet the requirements of high performance, miniaturization, integration and multi-functionalization, the requirements on line width and line distance are higher and higher, namely the requirements on line width and line distance are smaller and smaller. For example, high performance transparent electromagnetic shielding glass requires line width less than 10 microns, line spacing (pitch or period) less than 200 microns, and glass substrate size in excess of 500mm by 500mm; the size of the electric heating defogging and defrosting glass of the front windshield of the automobile, the ship and the like exceeds the size of more than m grade. High density interconnect circuits require line widths and spacings of less than 75 microns, and some require line widths and spacings of even less than 10 microns.
Therefore, there is an increasing industrial demand for large-sized, high-density, and high-precision fine circuits in the industry. However, how to realize the fabrication of large-area high-density fine circuits, especially how to efficiently fabricate large-area high-density fine circuits at low cost, is a challenging problem.
The current techniques for fabricating fine circuits mainly include: photoetching, laser micromachining, aerosol jet printing, electrospraying, electric field driven jet micro-nano 3D printing, ink-jet printing, silk screen printing and the like. Screen printing and ink jet printing have difficulty in producing fine circuits having a line width of 20 μm or less, and the produced circuits have poor line edge roughness. The manufacturing of submicron-scale and nanoscale fine circuits can be realized by combining photoetching with etching and other processes, but the manufacturing cost is high, the period is long, the material waste is serious, the production environment requirement is high, and particularly, more three wastes are generated, and the environmental pollution is serious. Not only is it difficult to manufacture a fine circuit with a line width of 10 μm or less by laser micromachining, but also line edge roughness of the machined fine circuit is poor. Aerosol jet printing can produce a fine circuit having a line width of 10 μm or less, but the appearance of the fine circuit, particularly the line edge roughness, is very poor, and particularly when the pitch is less than 20 μm, scattering dots jetted around the circuit easily cause short circuits, and it is not possible to produce a high-density fine circuit. In addition, aerosol spraying is basically a single nozzle, and the production efficiency is low. The electro-jet printing and the electric field driven jet micro-nano 3D printing have obvious advantages in the aspect of manufacturing large-area high-density micro circuits, but on one hand, most of the micro-jet printing and the electric field driven jet micro-nano 3D printing use a single spray head, and the production efficiency is low; on the other hand, due to crosstalk of an electric field, the nozzles are arranged in a multi-nozzle array, the spacing size of the nozzles is large (generally larger than 3 mm), and the spacing is fixed, so that the nozzles cannot be adjusted flexibly according to actual needs. It is also difficult to realize the production of a large-area high-density fine circuit. Therefore, there is a need to develop new techniques and devices to achieve efficient and low cost fabrication of large area, high density, fine circuits.
The above information disclosed in this background section is only for enhancement of understanding of the background of the application and therefore it may comprise prior art that does not constitute known to a person of ordinary skill in the art.
Disclosure of Invention
In order to overcome the defects of the prior art, the application discloses an array nozzle device and a method for printing a large-area high-density fine circuit, the array nozzle device is utilized, and a micro-nano 3D printing technology of single-plate electrode electric field driving jet deposition is combined, so that the large-area high-density fine circuit can be efficiently manufactured at low cost, the interval of the printing fine circuit can be adjusted at will, and particularly, the ultrahigh-density and ultra-small-interval parallel high-efficiency printing can be realized through the subdivision function of a plurality of groups of array nozzles.
In order to achieve the purpose, the following technical scheme is adopted in the application:
in some embodiments of the present application, an array head apparatus for printing a large-area high-density fine circuit includes a plurality of sets of head modules located at a lowermost end of the array head apparatus, and configured to array-print a printing material into a desired circuit;
the connecting frame (40) is positioned above the spray head module and connected with the spray head module;
the rotary platform module (50) is connected with the connecting frame (40), and the rotation of the rotary platform module drives a plurality of groups of spray head modules below the connecting frame to rotate under the condition of avoiding electric field and flow field crosstalk so as to reduce the printing interval;
each group of the sprayer modules comprises a plurality of nozzles, a transfer plate for fixing the sprayer modules and a motion module for driving the transfer plate of the sprayer modules to horizontally move, the motion module is arranged in the connecting frame, the sprayer of each group of the sprayer modules is arranged at the lowest end, the upper end of each sprayer is connected with the lower end of the transfer plate, and the upper end of the transfer plate is connected with the motion module; the end face of one side of the adapter plate is provided with a printing material feeding hole, and the end face of the other side of the adapter plate is provided with an air inlet;
the array sprayer module is driven to horizontally move through the motion module, and the rotating platform module drives the whole sprayer module to rotate so as to further reduce the printing interval, so that the printing interval is further reduced under the condition of avoiding electric field and flow field crosstalk, and the large-area high-density fine circuit is manufactured.
In some embodiments of the present application, the feed port of the adapter plate of the showerhead module is in communication with each nozzle and the gas inlet is in communication with each nozzle.
In some embodiments of the present application, the number of showerhead modules is at least 3 groups.
In some embodiments of the present application, the connection frame connects at least 3 sets of showerhead modules.
In some embodiments of the present application, the showerhead module includes at least 4 nozzles, the material of which includes, but is not limited to, metal nozzles, glass nozzles, plastic nozzles, ceramic nozzles, silicon-based nozzles, and the like.
In some embodiments of the present application, the nozzle has a size of 100 nanometers to 500 micrometers.
In some embodiments of the present application, the manner in which the motion module drives the nozzle module adaptor plate to horizontally move includes, but is not limited to, manual driving and electric driving, the electric driving includes a stepping motor, a servo motor, a piezoelectric driving, and the like, and the positioning accuracy is not lower than 1 micron.
In some embodiments of the present application, the rotating platform module includes both manual and power modes, and the positioning accuracy is not less than 5 arcsec.
In some embodiments of the present application, the spacing dimension of the nozzles in the showerhead module is 1mm to 10mm.
In some embodiments of the present application, the array nozzle device for printing large-area high-density fine circuits can realize at least ultra-small spacing of 1um-5mm.
In some embodiments of the present application, the distance between adjacent arrays of showerhead module nozzles in the vertical direction is 1-10mm.
In some embodiments of the present application, there is also provided a method of printing a large area high density microcircuit, comprising the steps of:
step 1: adjusting and setting the printing nozzle:
setting the number of array nozzle modules to be N1, wherein each array nozzle module comprises N2 nozzles, the inner diameter of each nozzle is D, the distance between adjacent nozzles in the same array nozzle module is L1, and the vertical distance between adjacent nozzle modules is L2; according to the characteristic size of a micro circuit to be printed, firstly, optimally designing the position of each group of spray head modules, and determining the displacement distance S1-SN1 of the array spray head modules and the rotation angle theta of the rotary platform module;
then, the horizontal movement module of each group of spray head modules adjusts the designed positions of the spray head modules, and the rotating platform module drives the connecting frame according to actual needs, so that the whole spray head modules rotate to the designed angular positions, and the space between printing micro circuits is further reduced; the horizontal movement module is combined to drive an array spray head module and the rotary platform module to drive the whole spray head module to rotate, so that the printing space is further reduced, and the high-density fine circuit manufacturing, especially the high-efficiency manufacturing of the high-density fine circuit is realized under the condition of avoiding the crosstalk of an electric field and a flow field;
step 2: feeding materials to each spray head module through a feeding device; then opening an air inlet and setting the required starting pressure;
and 3, step 3: setting printing process parameters;
setting printing voltage, back pressure, printing speed, heating temperature of a printing platform and printing height parameters of a flat plate electrode, and starting printing according to a printing program;
after the first layer is printed, correspondingly adjusting printing technological parameters, and printing the next layer;
printing layer by layer until printing is finished;
and 4, step 4: post-treatment;
and sintering the printed workpiece, and performing electric conduction treatment.
In some embodiments of the present application, the material supplied to each head module includes, but is not limited to, nano conductive silver paste, conductive ink, conductive polymer, carbon paste, and the like, and any combination thereof.
Compared with the prior art, the beneficial effects of this application are:
(1) Under the condition that the distance between adjacent nozzles is large (the minimum critical distance that crosstalk caused by an electric field, a flow field and the like cannot occur), the printing distance is further reduced by subdividing the spray head module and driving the whole spray head module to rotate by a certain angle by the rotating platform module, and the manufacturing of a large-area high-density fine circuit is realized. In the existing array nozzles used for electro-jet printing, electric field driven jet micro-nano 3D printing, material extrusion 3D printing (ink direct writing) and the like, in order to avoid crosstalk or interference and the like of adjacent nozzles, the distance between the adjacent nozzles is generally larger than 3 millimeters, on one hand, parallel manufacturing of high-density fine circuits cannot be realized, and in addition, the distance between the nozzles is fixed, especially, the distance between the printed fine circuits cannot be adjusted at will.
(2) By utilizing the array nozzle device and the working method, and combining the micro-nano 3D printing process of the single-plate electrode, the high-efficiency and low-cost manufacture of the large-size high-density micro circuit can be realized.
(3) The pitch of the fine circuit can be arbitrarily adjusted. The adaptability, high flexibility and flexibility of the printing nozzle are improved under the condition of not changing a mechanical structure.
(4) The printing nozzle can also be used for other micro-nano 3D printing processes such as extrusion, jetting and the like.
(5) Combining different printing materials, the manufacture of large-area heterogeneous fine circuits can be realized.
(6) The device has simple structure and low cost.
(7) The array nozzle device for efficiently printing the large-area high-density fine circuit has the advantages of simple working method realization process and high adaptability and flexibility.
The application provides an industrial-grade solution for parallel and efficient manufacturing of large-area and high-density fine circuits.
Drawings
FIG. 1 is a schematic diagram of an array head device with large area and high density micro-circuits according to some embodiments of the present application.
Fig. 2 is a schematic view of an array head module of an array head apparatus for large area high density micro circuit according to some embodiments of the present application.
FIG. 3 is a cross-sectional view of an interposer in some embodiments of the present application.
In the figure, 1-a first spray head module, 1011-a spray nozzle, 102-an adapter plate, 103-a motion module, 1023-a material feeding hole, 1024-an air inlet, 2-a second spray head module, 3-a spray head module, 40-a connecting frame and 50-a rotary platform module.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In some embodiments of the present application, a print head apparatus includes at least 3 sets of head modules (1, 2,3, N, etc.), a link carriage (40), and a rotary platform module (50). Wherein, the spray head modules (1, 2,3, N, etc.) are arranged at the lowest end and are connected with the connecting frame (40), and the connecting frame (40) is connected with the rotating platform (50). The first spray head module (1) comprises at least 4 spray nozzles, an adapter plate (102) for fixing the spray head module (1) and a motion module (103) for driving the adapter plate (102) of the spray head module (1) to horizontally move; the spray heads of the spray head module (1) are arranged at the lowest end, the upper end of each spray head is connected with the lower end of the adapter plate (102), and the upper end of the adapter plate (102) is connected with the motion module (103); a printing material feeding port (1023) is formed in one end face (1021) of the adapter plate (102), and an air inlet (1024) is formed in the other end face (1022).
The second sprayer module (2) comprises at least 4 nozzles, an adapter plate for fixing the sprayer module and a motion module for driving the adapter plate of the sprayer module (2) to move horizontally. The shower nozzle of shower nozzle module (2) is arranged in the lower extreme, and every shower nozzle upper end is connected with the lower extreme of keysets, and the upper end of keysets is connected with the motion module. The end face of one side of the adapter plate is provided with a printing material feeding hole, and the end face of the other side of the adapter plate is provided with an air inlet. The third spray head module (3) comprises at least 4 nozzles, an adapter plate for fixing the spray head module and a motion module for driving the adapter plate of the spray head module to horizontally move.
The shower nozzle of shower nozzle module (3) is arranged in the lower extreme, and every shower nozzle upper end is connected with the lower extreme of keysets, and the upper end of keysets is connected with the motion module, and one side terminal surface of keysets sets up the printing material feed inlet, and the other side terminal surface sets up the air inlet.
In some embodiments of the present application, an array head apparatus for efficiently printing a large area of high density fine circuits is provided, as shown in fig. 1, which includes a head module 1, a head module 2, a head module 3, a link 40, and a rotary platform 50. The connecting frame 40 is connected to the positioning hole of the rotary platform 50 through a bolt, the horizontal movement module 103 at the top end of the spray head module 1 is fixed at the foremost end of the connecting frame, the horizontal movement module 203 at the top end of the spray head module 2 is fixed in the middle of the connecting frame, and the horizontal movement module 303 at the top end of the spray head module 3 is fixed at the rearmost end of the connecting frame.
As shown in fig. 2, the head module 1 includes a nozzle 1011, a nozzle 1012, a nozzle 1013, a nozzle 1014, a nozzle 1015, a nozzle 1016, a nozzle 1017, an adapter plate 102, and a horizontal movement module 103, wherein the nozzle 1011, the nozzle 1012, the nozzle 1013, the nozzle 1014, the nozzle 1015, the nozzle 1016, and the nozzle 1017 are fixed at the bottom of the adapter plate 102, and the top end of the adapter plate 102 is connected to the bottom of the horizontal movement module 103.
The cross-sectional view of the internal flow channel of the adapter plate 1 is shown in fig. 3, and the right side of the cross-sectional view is provided with a feed inlet 1023 and the left side is provided with an air inlet 1024.
The number N1 of the array nozzle modules is 3, and the number N2 of the nozzles included in each array nozzle module is 7.
The interval L1 of adjacent nozzles in the same array nozzle module is 5mm, and the vertical distance L2 between the nozzles of adjacent array nozzle modules is 5mm.
The nozzle all chooses the glass nozzle that internal diameter D is 40um for use.
The rotary platform module 50 adopts a precise electric rotary platform, adopts worm and gear transmission, is driven by a servo motor, and has the repeated positioning precision not lower than 0.001 degrees and the working stroke of 200mm.
In order to make the technical solutions of the present application more clearly understood by those skilled in the art, the technical solutions of the present application will be described in detail below with reference to specific embodiments.
The embodiment chooses nanometer conductive silver thick liquid as the printing material for use, chooses to print the ordinary glass that the substrate chose to choose to use 3000X 2mm for use, and 3500X 5 mm's copper is chosen for use to dull and stereotyped electrode, and the printing area is 2500X 2500mm, and the line interval is 200um, and the line width is 20 um's conductive silver wire grating pattern, and concrete printing process is as follows:
step 1: according to the characteristic dimensions such as the line width, the space and the like of the fine circuit to be printed, the distance S2 required by the second array nozzle module to move rightwards is 43.033mm, the distance S2 required by the second array nozzle module to move rightwards is 86.066mm, and the angle theta required by the rotary platform module to rotate anticlockwise is 83.108 degrees. The sprayer module 2 was then moved 43.033mm to the right by the horizontal movement module 203, the third sprayer module 3 was moved 86.066mm to the right by the horizontal movement module 303, and the three sprayer modules were rotated 83.108 ° counterclockwise by the rotary platform module 50.
Step 2: nanometer conductive silver paste is filled into each spray head module through the feed port 1023, the feed port 2023 and the feed port 3023 respectively; subsequently, the air inlet 1024, the air inlet 2024, and the air inlet 3024 are opened, and the activation pressure is set to 200kPa.
And step 3: setting the printing voltage of the flat plate electrode to be 900V, the back pressure to be 180kPa, the printing speed to be 20mm/s, the heating temperature of the printing platform to be 60 ℃ and the printing height to be 0.09mm, inputting the printing program of the pattern and starting printing.
And printing the first layer, wherein the printing height is increased by 0.02mm, the voltage is increased by 20V, and the next layer is printed layer by layer until the printing is finished.
And 4, step 4: and sintering the printed workpiece at 135 ℃ for 40 minutes, and carrying out conductive treatment.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not necessarily depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (10)
1. An array nozzle device for printing large-area high-density fine circuits is characterized by comprising a plurality of groups of nozzle modules, wherein the nozzle modules are positioned at the lowest end of the array nozzle device and used for printing materials into required circuits;
the connecting frame is positioned above the spray head module and connected with the spray head module;
the rotary platform module is connected with the connecting frame, and the rotation of the rotary platform module drives a plurality of groups of sprayer modules below the connecting frame to rotate under the condition of avoiding electric field and flow field crosstalk so as to reduce the printing interval;
each group of the sprayer modules comprises a plurality of nozzles, a transfer plate for fixing the sprayer modules and a motion module for driving the transfer plate of the sprayer modules to horizontally move, the sprayer of each group of the sprayer modules is arranged at the lowest end, the upper end of each sprayer is connected with the lower end of the transfer plate, and the upper end of the transfer plate is connected with the motion module; the end face of one side of the adapter plate is provided with a printing material feeding hole, and the end face of the other side of the adapter plate is provided with an air inlet;
the array sprayer module is driven to horizontally move through the moving module, and the rotating platform module drives the whole sprayer module to rotate so as to further reduce the printing interval, so that the printing interval is reduced under the condition of avoiding electric field and flow field crosstalk, and the manufacturing of a large-area high-density fine circuit is realized.
2. The array head apparatus of claim 1, wherein the feed port of the adapter plate of the head module is in communication with each nozzle and the gas inlet is in communication with each nozzle.
3. The array head apparatus of claim 1, wherein the number of head modules is at least 3; the link is connected 3 groups shower nozzle modules at least.
4. The array head apparatus of claim 1, wherein the head module comprises at least 4 nozzles, and the material of the nozzles includes, but is not limited to, metal nozzles, glass nozzles, plastic nozzles, ceramic nozzles, silicon-based nozzles.
5. The array head device of claim 1, wherein the size of the nozzles is 100 nm-500 μm, and preferably, the pitch size of the nozzles in the head module is 1mm-10mm; preferably, the distance between the nozzles of the adjacent array nozzle modules in the vertical direction is 1-10mm.
6. The array head apparatus of claim 1, wherein the array head apparatus is capable of at least ultra-fine pitch of 1um-5mm.
7. The array nozzle device of claim 1, wherein the moving module drives the nozzle module adapter plate to move horizontally by manual or electric driving, the electric driving comprises a stepping motor, a servo motor and a piezoelectric driving, and the positioning precision is not lower than 1 micron.
8. The array head apparatus of claim 1, wherein the rotating platform module includes both manual and motorized modes, and the positioning accuracy is no less than 5 arcsec.
9. A method for printing large-area high-density fine circuits is characterized by comprising the following steps:
step 1: adjusting and setting the printing nozzle:
setting the number of array nozzle modules to be N1, wherein each array nozzle module comprises N2 nozzles, the inner diameter of each nozzle is D, the distance between adjacent nozzles in the same array nozzle module is L1, and the vertical distance between adjacent nozzle modules is L2; according to the characteristic size of a micro circuit to be printed, firstly, optimally designing the position of each group of spray head modules, and determining the displacement distance S1-SN1 of the array spray head modules and the rotation angle theta of the rotary platform module;
then, the horizontal movement module of each group of spray head modules adjusts the designed position of each group of spray head modules, and the rotating platform module drives the connecting frame according to actual needs, so that the whole spray head module rotates to the designed angular position, and the space between printing micro circuits is further reduced; the horizontal movement module is combined to drive an array spray head module and the rotating platform module to drive the whole spray head module to rotate, so that the printing space is further reduced, and the high-density fine circuit manufacturing, especially the high-density fine circuit efficient manufacturing is realized under the condition of avoiding the crosstalk of an electric field and a flow field;
step 2: feeding materials to each spray head module through a feeding device; then opening the air inlet to set the required starting pressure;
and step 3: setting printing process parameters;
setting printing voltage, back pressure, printing speed, heating temperature of a printing platform and printing height parameters of a flat plate electrode, and starting printing according to a printing program;
after the first layer is printed, correspondingly adjusting printing process parameters, and printing the next layer;
printing layer by layer until printing is finished;
and 4, step 4: post-treatment;
and sintering and conducting the printed workpiece.
10. The method of claim 9, wherein the material supplied to each head module comprises one or more of nano conductive silver paste, conductive ink, conductive polymer, and carbon paste.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211295673.5A CN115648622A (en) | 2022-10-21 | 2022-10-21 | Array nozzle device and method for printing large-area high-density fine circuit |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211295673.5A CN115648622A (en) | 2022-10-21 | 2022-10-21 | Array nozzle device and method for printing large-area high-density fine circuit |
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| CN115648622A true CN115648622A (en) | 2023-01-31 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117067775A (en) * | 2023-08-31 | 2023-11-17 | 武汉国创科光电装备有限公司 | Nozzle adjusting device and method for arrayed electrofluidic spray nozzle |
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2022
- 2022-10-21 CN CN202211295673.5A patent/CN115648622A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117067775A (en) * | 2023-08-31 | 2023-11-17 | 武汉国创科光电装备有限公司 | Nozzle adjusting device and method for arrayed electrofluidic spray nozzle |
| CN117067775B (en) * | 2023-08-31 | 2024-02-23 | 武汉国创科光电装备有限公司 | Nozzle adjusting device and method for arrayed electrofluidic spray nozzle |
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