CN115548234A - Display module, preparation method thereof and display device - Google Patents
Display module, preparation method thereof and display device Download PDFInfo
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- CN115548234A CN115548234A CN202211145053.3A CN202211145053A CN115548234A CN 115548234 A CN115548234 A CN 115548234A CN 202211145053 A CN202211145053 A CN 202211145053A CN 115548234 A CN115548234 A CN 115548234A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 195
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 115
- 239000010931 gold Substances 0.000 claims abstract description 115
- 229910052737 gold Inorganic materials 0.000 claims abstract description 115
- 230000001681 protective effect Effects 0.000 claims abstract description 69
- 239000000853 adhesive Substances 0.000 claims abstract description 60
- 230000001070 adhesive effect Effects 0.000 claims abstract description 60
- 239000003292 glue Substances 0.000 claims abstract description 43
- 239000000084 colloidal system Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 16
- 230000000694 effects Effects 0.000 abstract description 12
- 239000010408 film Substances 0.000 description 75
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
- G02F1/1679—Gaskets; Spacers; Sealing of cells; Filling or closing of cells
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/37—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being movable elements
- G09F9/372—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being movable elements the positions of the elements being controlled by the application of an electric field
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application discloses a display module, a preparation method thereof and a display device, and relates to the technical field of display. The display module comprises a display panel, a chip on film and a first protective adhesive. The second golden finger in the chip on film can be bound and connected with the first golden finger in the binding area in the display panel. The first protective glue wraps the first part including the second golden finger in the chip on film, so that the first protective glue can completely seal the second golden finger. Therefore, even if the chip on film is subjected to reaction stress, a gap cannot be generated between the chip on film and the first substrate, water vapor can be prevented from invading the binding area, the first gold finger and the second gold finger which are bound and connected in the binding area are prevented from being corroded, the binding effect of the second gold finger and the first gold finger is ensured, and the yield of the display module is improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a display module and a preparation method thereof, and a display device.
Background
The display module includes a display panel and a Chip On Film (COF). The display panel is provided with a display area and a binding area located on one side of the display area, and the display panel comprises a first golden finger located in the binding area. The chip on film includes a second gold finger. The second golden finger of the chip on film and the first golden finger of the display panel can be bound and connected through the conductive adhesive.
In the correlation technique, the external steam or oxygen of display module transmits to display panel's binding district through the clearance between cover brilliant film and the display panel easily, and then probably corrodes and bind first golden finger and the second golden finger of connecting in binding the district, influences the effect of binding of second golden finger and first golden finger, and the yield of display module assembly is lower.
Disclosure of Invention
The application provides a display module, a preparation method thereof and a display device, which can solve the problem that the yield of the display module is low in the related art. The technical scheme is as follows:
in one aspect, a display module is provided, the display module includes:
the display panel is provided with a display area and a binding area positioned on one side of the display area, and comprises a first substrate and a first golden finger positioned on the first substrate and positioned in the binding area;
the chip on film comprises a substrate and a second golden finger positioned on the substrate, wherein the second golden finger is bound and connected with the first golden finger, the substrate and the second golden finger form a first part and a second part which are connected with the chip on film, the first part comprises the second golden finger and one part of the substrate, and the second part comprises the other part of the substrate;
and the first protective adhesive wraps the first part of the flip chip film, the first protective adhesive comprises a first adhesive body and a second adhesive body which are connected, the first adhesive body is positioned on the first part and deviates from the target surface of the first substrate, the first adhesive body is in contact with the target surface, the second adhesive body is at least positioned on the side wall of the first part, and the second adhesive body is in contact with the side wall of the first part and the first substrate.
Optionally, one end of the second portion is connected to a surface of the first portion away from the first substrate, and a surface of the first portion where the second gold finger is disposed intersects with a carrying surface portion of the second portion where a device is disposed.
Optionally, the surface of the first portion for disposing the second gold finger is partially perpendicular to the carrying surface of the second portion for carrying the device.
Optionally, the second encapsulant includes a first target encapsulant located in the first portion and away from the display area, and the first target encapsulant contacts with the sidewall of the first portion and away from the display area and the surface of the first substrate facing the chip on film.
Optionally, the base includes a second substrate, a third substrate and a routing layer;
the second substrate comprises a first sub-substrate forming a first part of the base and a second sub-substrate forming a second part of the base, and the bearing surface of the first sub-substrate and the bearing surface of the second sub-substrate at least partially intersect;
the third substrate comprises a third sub-substrate and a fourth sub-substrate, the third sub-substrate forms the first part of the base, the fourth sub-substrate forms the second part of the base, and the bearing surface of the third sub-substrate and the bearing surface of the fourth sub-substrate at least partially intersect;
the second sub-substrate and the fourth sub-substrate are oppositely arranged, and the wiring layer is positioned between the second sub-substrate and the fourth sub-substrate; the surface of the first sub-substrate far away from the second sub-substrate and the surface of the third sub-substrate far away from the fourth sub-substrate are coplanar, and the second golden finger is positioned on the surface of the first sub-substrate far away from the second sub-substrate and the surface of the third sub-substrate far away from the fourth sub-substrate.
Optionally, one end of the second portion is connected to one end of the first portion, the second portion is far away from the display area relative to the first portion, and a surface of the first portion on which the second golden finger is disposed is parallel to a carrying surface of the second portion on which a device is disposed; the first substrate is provided with a groove with a first golden finger far away from the display area, the base is provided with a through hole corresponding to the groove, and the through hole can divide the chip on film into the first part and the second part;
the second colloid comprises a second target colloid which is positioned in the through hole and the groove, and the second target colloid is in contact with the inner wall of the through hole and the inner wall of the groove.
Optionally, an orthographic projection of the through hole on the first substrate is at least partially in the groove, so that the through hole and the groove are communicated.
Optionally, the length of the groove in the first direction is greater than the length of the second gold finger in the first direction, and the area of the second gold finger in the first direction is located within the area of the groove in the first direction;
wherein the first direction is perpendicular to the arrangement direction of the first and second portions.
Optionally, the length of the groove in the second direction is greater than 30 micrometers, and the depth of the groove is greater than a quarter of the thickness of the first substrate and less than a third of the thickness of the first substrate;
wherein the second direction is parallel to an arrangement direction of the first portion and the second portion.
Optionally, the display module further includes: a second protective adhesive;
the second protective glue is contacted with the surface of the chip on film facing to the first substrate and the side wall of the first substrate far away from the display area, and the orthographic projection of the second protective glue on the chip on film is positioned in the second part.
Optionally, the display module further includes: a conductive adhesive;
the conductive adhesive is located between the first golden finger and the second golden finger and used for connecting the first golden finger and the second golden finger.
In another aspect, a method for manufacturing a display module is provided, the method including:
providing a display panel, wherein the display panel is provided with a display area and a binding area positioned on one side of the display area, and the display panel comprises a first substrate and a first gold finger positioned on the first substrate and positioned in the binding area;
providing a chip on film, wherein the chip on film comprises a substrate and a second gold finger positioned on the substrate, the second gold finger is bonded and connected with the first gold finger, the substrate and the second gold finger form a first part and a second part which are connected with the chip on film, the first part comprises the second gold finger and one part of the substrate, and the second part comprises the other part of the substrate;
binding and connecting the second golden finger and the first golden finger;
forming a first protective adhesive to enable the first protective adhesive to wrap the first portion, wherein the first protective adhesive comprises a first adhesive body and a second adhesive body which are connected, the first adhesive body is located on the side wall of the first portion, the side wall of the first portion is at least located on the first protective adhesive body, and the first adhesive body is in contact with the target surface, and the second adhesive body is in contact with the side wall of the first portion and the first substrate.
Optionally, one end of the second portion is connected to a surface of the first portion, which is far away from the first substrate, and a surface of the first portion where the second gold finger is disposed intersects with a carrying surface of the second portion where a device is disposed;
the first gold finger and the second gold finger are connected in a binding mode, and the method comprises the following steps:
sleeving a first pressure head outside the second part, and pressurizing from one side of the first part, which is far away from the display panel, so as to bond and connect the first golden finger and the second golden finger, wherein the first pressure head is provided with a pressure head through hole for the second part to pass through;
or, the binding connection of the first gold finger and the second gold finger includes:
and pressurizing from one side of the first part, which is far away from the display panel, by at least adopting a second pressure head and a third pressure head for multiple times so as to bond and connect the first golden finger and the second golden finger, wherein the pressurizing position of the third pressure head is different from the pressurizing position of the second pressure head.
Optionally, one end of the second portion is connected to one end of the first portion, the second portion is far away from the display area relative to the first portion, and a surface of the first portion where the second gold finger is disposed is parallel to a bearing surface of the second portion where a device is disposed; the first substrate is provided with a groove with a first gold finger far away from the display area, the base is provided with a through hole corresponding to the groove, and the through hole can divide the chip on film into the first part and the second part; the forming a first protective glue comprises:
filling first protective glue into the groove through the through hole, and coating the first protective glue on one side of the first part, which is far away from the display panel;
and curing the first protective adhesive.
In still another aspect, there is provided a display device including: a power supply assembly and a display module according to the above aspects;
the power supply assembly is used for supplying power to the display module.
The beneficial effect that technical scheme that this application provided brought includes at least:
the application provides a display module, a preparation method thereof and a display device. The second golden finger in the chip on film can be bound and connected with the first golden finger in the binding area in the display panel. The first protective glue wraps the first part of the chip on film, which comprises the second gold finger, so that the first protective glue can completely seal the second gold finger. Therefore, even if the chip on film is subjected to reaction stress, a gap cannot be generated between the chip on film and the first substrate, water vapor can be prevented from invading the binding area, the first gold finger and the second gold finger which are bound and connected in the binding area are prevented from being corroded, the binding effect of the second gold finger and the first gold finger is ensured, and the yield of the display module is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a cross-sectional view of a display module in the prior art when the display module is not subjected to reverse stress;
FIG. 2 is a rear view of a display module in the prior art when the display module is not subjected to a reverse stress;
FIG. 3 is a cross-sectional view of a display module under reverse stress in the prior art;
FIG. 4 is a rear view of a display module under reverse stress in the prior art;
fig. 5 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a chip on film according to an embodiment of the present disclosure;
FIG. 7 is a schematic view of another COF structure provided in the present application;
fig. 8 is a schematic structural diagram of another display module provided in the embodiment of the present application;
fig. 9 is a back view of another display module provided in the embodiment of the present application;
fig. 10 is a top view of a display panel provided in an embodiment of the present application;
FIG. 11 is a top view of a chip on film according to an embodiment of the present application;
fig. 12 is a top view of a display panel and a chip on film according to an embodiment of the disclosure;
fig. 13 is a flowchart of a method for manufacturing a display module according to an embodiment of the present disclosure;
FIG. 14 is a diagram illustrating a bonding connection between a second gold finger and a first gold finger according to an embodiment of the present application;
fig. 15 is a schematic structural diagram of a display device according to an embodiment of the present application.
Detailed Description
To make the objects, technical solutions and advantages of the present application more clear, the following detailed description of the embodiments of the present application will be made with reference to the accompanying drawings.
In the related art, referring to fig. 1 and 2, a display panel of a display module includes a first substrate and a first gold finger on the first substrate. The chip on film of the display module comprises a substrate and a second gold finger. After the second gold finger of the chip on film and the first gold finger of the display panel are bonded (bonded) by the conductive Adhesive (ACF), a first protective adhesive may be coated on a side of the chip on film away from the display panel, and a second protective adhesive may be coated on a side of the chip on film close to the display panel, so as to prevent water and oxygen from entering a gap between the chip on film and the display panel. The conductive adhesive is used for binding and connecting a first golden finger of the display panel and a second golden finger of the chip on film, and binding particles in the conductive adhesive can enable the first golden finger and the second golden finger to be conducted.
However, referring to fig. 3 and 4, if the flip chip film is subjected to an inverse stress, the second protective paste is very likely to be detached (peeling). In this case, a gap (gap) exists between the second protective paste and the edge of the display panel. External water and oxygen easily invade from the gap, so that the mark of the binding particles in the conductive adhesive is weakened under a microscope, or the binding particles are not seen. Therefore, the first golden finger and the second golden finger are possibly separated, the binding is invalid, the electrical conduction of the display module is abnormal, and the yield of the display module is low.
Fig. 5 is a schematic partial structure diagram of a display module according to an embodiment of the present disclosure. As can be seen in fig. 5, the display module 10 may include: a display panel 101, a chip on film 102 and a first protective adhesive 103. Among them, the display panel 101 may have a display region 101a and a binding region 101b at one side of the display region 101a. The display panel 101 includes a first substrate 1011 and a first gold finger 1012 located on the first substrate 1011 and located at the bonding region 101b.
Fig. 6 is a schematic structural diagram of a chip on film according to an embodiment of the present disclosure. Referring to fig. 5 and 6, the flip chip 102 may include a substrate 1021 and a second gold finger 1022 located on the substrate 1021. The second gold finger 1022 may be in bonded connection with the first gold finger 1012. The substrate 1021 and the second gold finger 1022 may constitute a first portion a1 and a second portion a2 connected by the flip-chip film 102. The first portion a1 includes a second gold finger 1022 and a portion of the substrate 1021, and the second portion a2 includes another portion of the substrate 1021.
Referring to fig. 5, the first protective adhesive 103 may wrap the first portion a1 of the flip chip 102, and the first protective adhesive 103 may include a first colloid 1031 and a second colloid 1032 which are connected. The first colloid 1031 may be located on a target surface of the first portion a1 facing away from the first substrate 1011, and the first colloid 1031 is in contact with the target surface. The second colloid 1032 may be located at least at the sidewalls of the first portion a1, and the second colloid 1032 is in contact with the sidewalls of the first portion a1 and the first substrate 1011.
In the embodiment of the present application, since the first protective paste 103 wraps the first portion a1 of the flip chip film 102, the first protective paste 103 can completely seal the gap between the flip chip film 102 and the first substrate 1011, and further can completely seal the second gold finger 1022 in the flip chip film 102. In the case where the flip-chip 102 is under reverse stress, no gap is generated between the flip-chip 102 and the first substrate 1011. Therefore, water vapor can be prevented from invading the binding region 101b, and further the first gold finger 1012 and the second gold finger 1022 which are bound and connected in the binding region 101b are prevented from being corroded, the binding effect of the second gold finger 1022 and the first gold finger 1012 is ensured, and further the yield of the display module 10 is improved.
To sum up, the embodiment of the present application provides a display module, which includes a display panel, a chip on film and a first protective adhesive. The second gold finger in the chip on film can be bound and connected with the first gold finger in the binding area in the display panel. The first protective glue wraps the first part including the second golden finger in the chip on film, so that the first protective glue can completely seal the second golden finger. Therefore, even if the chip on film is subjected to reaction stress, a gap between the chip on film and the first substrate cannot be generated, water vapor can be prevented from invading the binding area, the first golden finger and the second golden finger which are connected in the binding area are prevented from being corroded, the binding effect of the second golden finger and the first golden finger is ensured, and the yield of the display module is improved.
Optionally, the display module may be a display module in a wearable display device. The first protective paste may be an ultraviolet light curing paste (UV paste).
As an alternative implementation, referring to fig. 5 and fig. 6, in the chip on film 102, one end of the second portion a2 may be connected to a surface of the first portion a1 away from the first substrate 1011, and a surface of the first portion a1 provided with the second gold finger 1022 intersects with a carrying surface portion of the second portion a2 provided with a device (e.g., the driving chip 104). Optionally, the surface of the first portion a1 provided with the second gold finger 1022 intersects with the carrying surface portion of the second portion a2 provided with the device. For example, the first portion a1 and the second portion a2 of the chip on film 102 may be T-shaped structures.
Optionally, the second colloid 1032 includes a first target colloid 1032a located at the first portion a1 far away from the display area 101a, and the first target colloid 1032a may be in contact with the sidewall of the first portion a1 far away from the display area 101a and the surface of the first substrate 1011 facing the flip chip film 102. That is, the first target colloid 1032a may seal the sidewall of the first portion a1 away from the display region 101a and the surface of the first substrate 1011 facing the flip-chip film 102, so as to prevent water and oxygen from invading into the bonding region 101b from the gap between the sidewall of the first portion a1 away from the display region 101a and the surface of the first substrate 1011 facing the flip-chip film 102. Therefore, the first gold finger 1012 and the second gold finger 1022 bonded and connected in the bonding region 101b can be prevented from being corroded, and the yield of the display module 10 can be ensured.
Of course, the second colloid 1032 may also comprise the remaining target colloids located on the other sidewalls of the first portion a1, so as to achieve the complete encapsulation of the first portion a1 and ensure the sealing effect of the second gold fingers 1022.
Referring to fig. 7, the base 1021 may include a second substrate 10211, a third substrate 10212, and a routing layer 10213. The second substrate 10211 includes a first sub-substrate b1 constituting a first portion a1 of the base 1021 and a second sub-substrate b2 constituting a second portion a2 of the base 1021, the carrying surface of the first sub-substrate b1 and the carrying surface of the second sub-substrate b2 at least partially intersecting. The third substrate 10212 comprises a third sub-substrate c1 constituting the first portion a1 of the base 1021 and a fourth sub-substrate c2 constituting the second portion a2 of the base 1021, the carrying surface of the third sub-substrate c1 and the carrying surface of the fourth sub-substrate c2 at least partially intersecting.
The second sub-substrate b2 and the fourth sub-substrate c2 are disposed opposite to each other, and the wiring layer 10213 is located between the second sub-substrate b2 and the fourth sub-substrate c 2. The surface of the first sub-substrate b1 away from the second sub-substrate b2 and the surface of the third sub-substrate c1 away from the fourth sub-substrate c2 are coplanar, and the second gold finger 1022 is located on the surface of the first sub-substrate b1 away from the second sub-substrate b2 and the surface of the third sub-substrate c1 away from the fourth sub-substrate c 2.
Optionally, routing layer 10213 can include a plurality of signal traces. The material of the signal trace may be a metal material. For example, the material of the signal trace is copper (Cu), and the signal trace may be referred to as a copper trace.
In this implementation, the first sub-substrate b1, the third sub-substrate c1 and the second gold finger 1022 may constitute a first portion a1 of the base 1021, and the second sub-substrate b2 and the fourth sub-substrate c2 may constitute a second portion a2 of the base 1021.
As another alternative implementation, referring to fig. 8 and 9, one end of the second portion a2 may be connected to one end of the first portion a1, and the second portion a2 is distant from the display area 101a with respect to the first portion a 1. The surface of the first portion a1 on which the second gold finger 1022 is disposed is parallel to the carrying surface of the second portion a2 on which the device is disposed.
Referring to fig. 10, the first substrate 1011 has a first gold finger 1012 thereon away from the recess 1011a of the display region 101a. Referring to fig. 11, the substrate 1021 has a through hole 1021a corresponding to the recess 1011a, and the through hole 1021a can divide the flip chip 102 into a first portion a1 and a second portion a2.
The second colloid 1032 may include a second target colloid 1032b located in the through hole 1021a and the groove 1011a, and the second target colloid 1032b is in contact with the inner wall of the through hole 1021a and the inner wall of the groove 1011a. Therefore, the second target colloid 1032b located in the through hole 1021a and the groove 1011a can form a barrier wall for blocking water and oxygen. The barrier wall is located at a side of the bonding region 101b away from the display region 101a, so as to prevent water and oxygen from invading into the bonding region from the gap between the flip-chip film 102 and the first substrate 1011 and prevent the second gold finger 1022 from being corroded, thereby ensuring the yield of the display module 10.
Alternatively, referring to fig. 12, an orthographic projection of the through hole 1021a on the first substrate 1011 is at least partially located in the groove 1011a, so that the through hole 1021a and the groove 1011a are communicated, thereby facilitating the first protective adhesive 103 to be filled into the groove 1011a through the through hole 1021 a.
In the embodiment of the present application, the length of the groove 1011a along the first direction X (the length of the groove 1011 a) may be greater than the length of the second gold finger 1022 along the first direction X, and the area of the second gold finger 1022 in the first direction X is located within the area of the groove 1011a in the first direction X. The first direction X is perpendicular to the arrangement direction of the first portion a1 and the second portion a2. Because the length of the recess 1011a is greater than that of the second gold finger 1022, the barrier wall formed by the first protective adhesive 103 filled in the recess 1011a can completely block water and oxygen, thereby preventing the second gold finger 1022 from being corroded.
Alternatively, the length of the groove 1011a in the second direction Y (the width of the groove 1011 a) may be greater than 30 μm (micrometers). Of course, the length of the groove 1011a along the second direction Y may be widened appropriately according to the actual width of the frame, and the embodiment of the present application does not specifically limit the width of the groove 1011a. The second direction Y is parallel to the arrangement direction of the first portion a1 and the second portion a2.
In addition, the depth of the groove 1011a may be greater than 1/4 of the thickness of the first substrate 1011 and less than 1/3 of the thickness of the first substrate 1011. Assuming that the thickness of the first substrate 1011 is h, the depth m of the recess 1011a may satisfy: 1/4h woven fabric m woven fabric 1/3h. By designing the depth of the groove 1011a, the influence on the mechanical strength of the first substrate 1011 can be avoided on the premise of ensuring that the first protective adhesive 103 filled into the groove 1011a can effectively block water and oxygen.
In the embodiment of the present application, referring to fig. 11, the shape of the orthographic projection of the through hole 1021a on the first substrate 1011 may be circular. Of course, the shape of the orthographic projection of the through hole 1021a on the first substrate 1011 may be other shapes, such as a rectangle. The embodiment of the present application does not limit the shape of the orthographic projection of the through hole 1021a on the first substrate 1011.
Alternatively, taking the shape of the orthographic projection of the through hole 1021a on the first substrate 1011 as a circle as an example, the diameter of the through hole 1021a may be smaller than the gap of the interface (pin) in the flip chip 102. For example, the diameter of the through hole 1021a may range from 30 μm to 50 μm. Of course, if the gap of the interface is too narrow to be sufficient to provide the through hole 1021a, a small number of through holes 1021a may be separately reserved at the fixing position and the interface may be avoided at the fixing position.
Optionally, the number of the through holes 1021a formed on the substrate 1021 of the flip chip package 102 may be set based on the state of the first protective adhesive 103 filled in the recess 1011a, and is not particularly limited in relation to the size of the recess 1011a and the size of the through holes 1021 a.
Optionally, referring to fig. 11, a plurality of through holes 1021a disposed on a substrate 1021 of the flip chip 102 may be disposed in a row, or may be disposed in multiple rows, which is not limited in this embodiment of the application, and it is only necessary that an orthographic projection of each through hole 1021a on the first substrate 1011 is at least partially located in an orthographic projection of the groove 1011a on the first substrate 1011.
Referring to fig. 8, the display module 10 may further include a second protective adhesive 105. The second protection paste 105 may contact the surface of the chip on film 102 facing the first substrate 1011 and the sidewall of the first substrate 1011 away from the display region 101a. The orthographic projection of the second protective glue 105 on the chip on film 102 is located in the second portion a2. By coating the second protective paste 105 on the backside of the chip on film 102, the chip on film 102 can be further protected and sealed, so as to ensure that the first gold fingers 1012 and the second gold fingers 1022 are not corroded, and ensure the yield of the display module 10.
Optionally, the display module 10 may further include a conductive adhesive. The conductive glue may be located between the first gold finger 1012 and the second gold finger 1022 for connecting the first gold finger 1012 and the second gold finger 1022.
Optionally, the display module 10 may further include an encapsulation layer 106. The encapsulation layer 106 may be located in the display area 101a of the display panel 101 for encapsulating the pixel units designed in the display area 101a of the display panel.
To sum up, the embodiment of the present application provides a display module, which includes a display panel, a chip on film, and a first protective adhesive. The second golden finger in the chip on film can be bound and connected with the first golden finger in the binding area in the display panel. The first protective glue wraps the first part including the second golden finger in the chip on film, so that the first protective glue can completely seal the second golden finger. Therefore, even if the chip on film is subjected to reaction stress, a gap cannot be generated between the chip on film and the first substrate, water vapor can be prevented from invading the binding area, the first gold finger and the second gold finger which are bound and connected in the binding area are prevented from being corroded, the binding effect of the second gold finger and the first gold finger is ensured, and the yield of the display module is improved.
Fig. 13 is a flowchart of a method for manufacturing a display module according to an embodiment of the present disclosure. The method can be used for preparing the display module provided by the embodiment. Referring to fig. 13, the method may include:
step S101, a display panel is provided.
In the embodiment of the present application, the display panel may have a display area and a binding area located at one side of the display area. The display panel may include a first substrate and a first gold finger on the first substrate and in the bonding region.
In a first alternative implementation manner, no groove is provided on the first substrate in the display panel. In a second alternative implementation manner, the first substrate in the display panel has a groove on which the first gold finger is far away from the display area.
Step S102, providing a chip on film.
In the embodiment of the present application, the chip on film may include a substrate and a second gold finger disposed on the substrate. The substrate and the second gold fingers form a first part and a second part which are connected by the flip-chip thin film, the first part comprises the second gold fingers and one part of the substrate, and the second part comprises the other part of the substrate.
In a first alternative implementation, one end of the second portion may be connected to a surface of the first portion remote from the first substrate, and a surface of the first portion provided with the second gold finger may intersect, e.g., be perpendicular to, a carrying surface of the second portion provided with the device.
In a second alternative implementation, the substrate has a through hole corresponding to the groove. The through hole on the substrate can divide the chip on film into a first part and a second part. One end of the second portion of the chip on film can be connected with one end of the first portion, and the second portion is far away from the display area relative to the first portion. The surface of the first part provided with the second golden finger is parallel to the bearing surface of the second part provided with the device.
And step S103, binding and connecting the first golden finger and the second golden finger.
In the embodiment of the present application, the second gold finger of the chip on film and the first gold finger of the display panel may be bound and connected by using a conductive adhesive. And the binding particles in the conductive adhesive can conduct the second golden finger and the first golden finger.
In a first optional implementation manner, the process of binding and connecting the second gold finger and the first gold finger may include: referring to fig. 14, the first pressing head may be sleeved outside the second portion, and a side of the first portion facing away from the display panel may be pressed to bond the first gold finger and the second gold finger. Wherein the first ram may have a ram through hole for the second portion to pass through. That is, the first ram may be a unitary structure having a ram through-hole. Or, the process of binding and connecting the second gold finger and the first gold finger may include: and pressurizing from the side of the first part, which is far away from the display panel, by adopting at least a second pressure head and a third pressure head for multiple times so as to bond and connect the first golden finger and the second golden finger. The pressing position of the third ram is different from the pressing position of the second ram. Of course, a larger number of pressing heads can be used for pressing in a plurality of times to ensure the binding effect of the first golden finger and the second golden finger in binding connection.
In the embodiment of the present application, since the pressing head cannot press the position where the second portion is connected to the first portion, the second gold finger at the corresponding position may not be connected to the first gold finger. Therefore, in order to ensure the reliable connection of the second golden finger and the first golden finger, the sizes of the second golden finger and the first golden finger can be properly increased so as to meet the minimum conducting area of the second golden finger and the first golden finger.
Alternatively, if the diameter of the ram through hole in the first ram is 150 μm, it indicates that there may be a 150 μm range in which the second gold finger and the area in the first gold finger cannot conduct. Therefore, the sizes of the second golden finger and the first golden finger can be increased by 150 μm so as to meet the minimum conducting area of the second golden finger and the first golden finger.
In a second optional implementation manner, the process of binding and connecting the second gold finger and the first gold finger may include: and pressing one side of the first part, which is far away from the display panel, by using a fourth pressure head so as to bond and connect the first golden finger and the second golden finger. Wherein, the fourth pressure head can be an integrated structure without a pressure head through hole.
Step S104, forming a first protective glue to make the first protective glue wrap the first part of the flip chip film.
In a first optional implementation manner, after the second gold finger and the first gold finger are bound and connected, a first protective glue may be coated on the first portion of the chip on film, so that the first protective glue wraps the first portion. The first protective glue comprises a first glue body and a second glue body which are connected. The first colloid is positioned on the target surface of the first part, which is far away from the first substrate, and the first colloid is in contact with the target surface. The second colloid is at least positioned on the side wall of the first part, and the second colloid is contacted with the side wall of the first part and the first substrate.
Wherein, the second colloid is at least positioned on the side wall of the first part, and the second colloid is at least positioned on the side wall of the first part: the first target colloid in the second colloid, which is positioned at the position where the first part is far away from the display area, can be in contact with the side wall of the first part which is far away from the display area and the surface of the first substrate facing the flip chip film.
Because the first protective glue wraps the first part of the chip on film in the prepared display module, the first protective glue can completely seal the gap between the chip on film and the first substrate, and further can completely seal the first golden finger in the display panel and the second golden finger in the chip on film. Under the condition that the chip on film is subjected to reverse stress, a gap between the chip on film and the first substrate cannot be generated. Therefore, the water vapor can be prevented from invading the binding area, the first golden finger and the second golden finger which are connected in the binding area are corroded, the binding effect of the second golden finger and the first golden finger is ensured, and the yield of the display module is high.
In a second alternative implementation, the process of forming the first protective glue may include: and filling the first protective glue into the groove through the through hole on the substrate of the chip on film, and coating the first protective glue on one side of the first part, which is far away from the display panel. And then, curing the first protective adhesive.
The first protective glue after curing may include the first glue and the second glue connected. The first colloid may be located on a target surface of the first portion facing away from the first substrate and in contact with the target surface. The second colloid is at least positioned on the side wall of the first part and is in contact with the side wall of the first part and the first substrate.
Wherein, the second colloid is located on the side wall of the first part, which can mean: and a second target colloid in the second colloid is positioned in the through hole and the groove. Therefore, the second target colloid can form a barrier wall for blocking water and oxygen, so that the water and oxygen can be prevented from invading a binding region from a gap between the flip chip film and the first substrate. Furthermore, the first golden finger and the second golden finger which are bound and connected in the binding area can be prevented from being corroded, and the yield of the display module is ensured.
In summary, the embodiment of the present application provides a method for manufacturing a display module, where the display module manufactured by the method includes a display panel, a chip on film, and a first protective adhesive. The second golden finger in the chip on film can be bound and connected with the first golden finger in the binding area in the display panel. The first protective glue wraps the first part including the second golden finger in the chip on film, so that the first protective glue can completely seal the second golden finger. Therefore, even if the chip on film is subjected to reaction stress, a gap between the chip on film and the first substrate cannot be generated, water vapor can be prevented from invading the binding area, the first golden finger and the second golden finger which are connected in the binding area are prevented from being corroded, the binding effect of the second golden finger and the first golden finger is ensured, and the yield of the display module is improved.
Fig. 15 is a schematic structural diagram of a display device according to an embodiment of the present application. Referring to fig. 15, the display device may include: a power supply assembly 20 and the display module 10 provided in the above embodiments. The power supply assembly 20 can be used to supply power to the display module 10.
In the embodiment of the present application, the display device may be any product or component having a display function, such as an active-matrix organic light-emitting diode (AMOLED) display device, a passive-matrix organic light-emitting diode (PMOLED) display device, a quantum dot light-emitting diode (QLED) display device, electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, or a navigator.
Since the display device may have substantially the same technical effects as the display panel described in the previous embodiment, for the sake of brevity, the technical effects of the display device will not be described repeatedly herein.
The terminology used in the description of the embodiments section of the present application is for the purpose of explanation only and is not intended to be limiting of the present application. Unless otherwise defined, technical or scientific terms used in the embodiments of the present application should have the ordinary meaning as understood by those having ordinary skill in the art to which the present application belongs. The use of "first," "second," "third," and similar terms in the description and claims of this application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms a, an, etc. do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprise" or "comprises", and the like, means that the element or item listed before "comprises" or "comprising" covers the element or item listed after "comprising" or "comprises" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, which may also change accordingly when the absolute position of the object being described changes.
The above description is only exemplary of the present application and should not be taken as limiting, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (15)
1. A display module, characterized in that, display module (10) includes:
a display panel (101), the display panel (101) having a display area (101 a) and a bonding area (101 b) located at one side of the display area (101 a), the display panel (101) comprising a first substrate (1011) and a first gold finger (1012) located on the first substrate (1011) and located at the bonding area (101 b);
a chip on film (102), wherein the chip on film (102) includes a substrate (1021), and a second gold finger (1022) located on the substrate (1021), the second gold finger (1022) is in bonding connection with the first gold finger (1012), the substrate (1021) and the second gold finger (1022) constitute a first part (a 1) and a second part (a 2) connected to the chip on film (102), the first part (a 1) includes the second gold finger (1022) and a part of the substrate (1021), and the second part (a 2) includes another part of the substrate (1021);
and a first protective adhesive (103), wherein the first protective adhesive (103) wraps a first portion (a 1) of the flip chip film (102), the first protective adhesive (103) comprises a first adhesive body (1031) and a second adhesive body (1032) which are connected, the first adhesive body (1031) is located on a target surface of the first portion (a 1) which is far away from the first substrate (1011), the first adhesive body (1031) is in contact with the target surface, the second adhesive body (1032) is at least located on a side wall of the first portion (a 1), and the second adhesive body (1032) is in contact with a side wall of the first portion (a 1) and the first substrate (1011).
2. A display module according to claim 1, wherein one end of the second portion (a 2) is connected to the surface of the first portion (a 1) away from the first substrate (1011), and the surface of the first portion (a 1) provided with the second gold finger (1022) intersects the carrying surface portion of the second portion (a 2) provided with the device.
3. The display module according to claim 2, wherein the surface of the first portion (a 1) for disposing the second gold finger (1022) is perpendicular to the carrying surface of the second portion (a 2) for carrying a device.
4. The display module according to claim 2, wherein the second colloid (1032) comprises a first target colloid (1032 a) located at the first portion (a 1) away from the display area (101 a), and the first target colloid (1032 a) is in contact with the sidewall of the first portion (a 1) away from the display area (101 a) and the surface of the first substrate (1011) facing the flip-chip film (102).
5. A display module according to claim 2, wherein the base (1021) comprises a second substrate (10211), a third substrate (10212) and a routing layer (10213);
the second substrate (10211) comprises a first sub-substrate (b 1) constituting a first portion (a 1) of the base (1021) and a second sub-substrate (b 2) constituting a second portion (a 2) of the base (1021), the carrying surface of the first sub-substrate (b 1) and the carrying surface of the second sub-substrate (b 2) at least partially intersecting;
the third substrate (10212) comprises a third sub-substrate (c 1) constituting a first portion (a 1) of the base (1021), and a fourth sub-substrate (c 2) constituting a second portion (a 2) of the base (1021), a carrying surface of the third sub-substrate (c 1) and a carrying surface of the fourth sub-substrate (c 2) at least partially intersecting;
wherein the second sub-substrate (b 2) and the fourth sub-substrate (c 2) are oppositely arranged, and the routing layer (10213) is located between the second sub-substrate (b 2) and the fourth sub-substrate (c 2); the surface of the first sub-substrate (b 1) far away from the second sub-substrate (b 2) and the surface of the third sub-substrate (c 1) far away from the fourth sub-substrate (c 2) are coplanar, and the second gold finger (1022) is located on the surface of the first sub-substrate (b 1) far away from the second sub-substrate (b 2) and the surface of the third sub-substrate (c 1) far away from the fourth sub-substrate (c 2).
6. The display module according to claim 1, wherein one end of the second portion (a 2) is connected to one end of the first portion (a 1), and the second portion (a 2) is away from the display area (101 a) relative to the first portion (a 1), and a surface of the first portion (a 1) on which the second golden finger (1022) is disposed is parallel to a carrying surface of the second portion (a 2) on which the device is disposed; the first substrate (1011) is provided with a first golden finger (1012) away from a groove (1011 a) of the display area (101 a), the base (1021) is provided with a through hole (1021 a) corresponding to the groove (1011 a), and the through hole (1021 a) can divide the flip chip (102) into the first part (a 1) and the second part (a 2);
the second colloid (1032) comprises a second target colloid (1032 b) positioned in the through hole (1021 a) and the groove (1011 a), and the second target colloid (1032 b) is in contact with the inner wall of the through hole (1021 a) and the inner wall of the groove (1011 a).
7. A display module according to claim 6, wherein an orthographic projection of the through hole (1021 a) on the first substrate (1011) is at least partly within the recess (1011 a) such that the through hole (1021 a) and the recess (1011 a) are in communication.
8. A display module according to claim 6, wherein the length of the groove (1011 a) in the first direction (X) is greater than the length of the second golden finger (1022) in the first direction (X), and the area of the second golden finger (1022) in the first direction (X) is located within the area of the groove (1011 a) in the first direction (X);
wherein the first direction (X) is perpendicular to the arrangement direction of the first portion (a 1) and the second portion (a 2).
9. A display module according to claim 6, wherein the length of the recess (1011 a) in the second direction (Y) is more than 30 micrometers, and the depth of the recess (1011 a) is more than a quarter of the thickness of the first substrate (1011) and less than a third of the thickness of the first substrate (1011);
wherein the second direction (Y) is parallel to the arrangement direction of the first portion (a 1) and the second portion (a 2).
10. The display module according to any one of claims 6 to 9, wherein the display module further comprises: a second protective glue (105);
the second protective adhesive (105) is in contact with the surface of the flip chip film (102) facing the first substrate (1011) and the side wall of the first substrate (1011) far away from the display area (101 a), and the orthographic projection of the second protective adhesive (105) on the flip chip film (102) is positioned in the second part (a 2).
11. The display module according to any one of claims 1 to 9, wherein the display module (10) further comprises: a conductive adhesive;
the conductive adhesive is positioned between the first golden finger (1012) and the second golden finger (1022) and is used for connecting the first golden finger (1012) and the second golden finger (1022).
12. A preparation method of a display module is characterized by comprising the following steps:
providing a display panel (101), wherein the display panel (101) is provided with a display area (101 a) and a binding area (101 b) located on one side of the display area (101 a), and the display panel (101) comprises a first substrate (1011) and a first golden finger (1012) located on the first substrate (1011) and located in the binding area (101 b);
providing a chip on film (102), wherein the chip on film (102) comprises a substrate (1021) and a second gold finger (1022) positioned on the substrate (1021), the second gold finger (1022) is in binding connection with the first gold finger (1012), the substrate (1021) and the second gold finger (1022) form a first part (a 1) and a second part (a 2) connected with the chip on film (102), the first part (a 1) comprises the second gold finger (1022) and a part of the substrate (1021), and the second part (a 2) comprises another part of the substrate (1021);
binding the second gold finger (1022) and the first gold finger (1012);
-forming a first protective glue (103) such that the first protective glue (103) wraps around the first portion (a 1), the first protective glue (103) comprising a first glue body (1031) and a second glue body (1032) in connection, the first glue body (1031) being located at a target surface of the first portion (a 1) facing away from the first substrate (1011), and the first glue body (1031) being in contact with the target surface, the second glue body (1032) being located at least at sidewalls of the first portion (a 1), and the second glue body (1032) being in contact with sidewalls of the first portion (a 1) and the first substrate (1011).
13. The method according to claim 12, characterized in that one end of the second portion (a 2) is connected to the surface of the first portion (a 1) remote from the first substrate (1011), and the surface of the first portion (a 1) provided with the second gold finger (1022) intersects the carrying surface of the second portion (a 2) provided with the device;
the first gold finger (1012) and the second gold finger (1022) are in binding connection, including:
sleeving a first pressure head outside the second part (a 2) and pressing the first pressure head from one side of the first part (a 1) away from the display panel (101) to bond and connect the first golden finger (1012) and the second golden finger (1022), wherein the first pressure head is provided with a pressure head through hole for the second part (a 2) to pass through;
or, the first gold finger (1012) and the second gold finger (1022) are connected in a binding manner, including:
and pressing from the side of the first part (a 1) far away from the display panel (101) by adopting at least a second pressing head and a third pressing head for bonding and connecting the first golden finger (1012) and the second golden finger (1022), wherein the pressing position of the third pressing head is different from the pressing position of the second pressing head.
14. The manufacturing method according to claim 12, wherein one end of the second portion (a 2) is connected to one end of the first portion (a 1), and the second portion (a 2) is away from the display area (101 a) relative to the first portion (a 1), and a surface of the first portion (a 1) on which the second gold finger (1022) is disposed is parallel to a carrying surface of the second portion (a 2) on which the device is disposed; the first substrate (1011) is provided with a first golden finger (1012) away from a groove (1011 a) of the display area (101 a), the base (1021) is provided with a through hole (1021 a) corresponding to the groove (1011 a), and the through hole (1021 a) can divide the flip chip (102) into the first part (a 1) and the second part (a 2); the forming a first protective glue (103) comprises:
filling a first protective adhesive (103) into the groove (1011 a) through the through hole (1021 a), and coating the first protective adhesive (103) on one side of the first part (a 1) far away from the display panel (101);
and curing the first protective adhesive (103).
15. A display device, characterized in that the display device comprises: a power supply assembly (20) and a display module (10) according to any one of claims 1 to 11;
the power supply assembly (20) is used for supplying power to the display module (10).
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| CN202211145053.3A CN115548234A (en) | 2022-09-20 | 2022-09-20 | Display module, preparation method thereof and display device |
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| CN202211145053.3A CN115548234A (en) | 2022-09-20 | 2022-09-20 | Display module, preparation method thereof and display device |
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