CN115499769A - Bone voiceprint vibration sensor - Google Patents
Bone voiceprint vibration sensor Download PDFInfo
- Publication number
- CN115499769A CN115499769A CN202211257987.6A CN202211257987A CN115499769A CN 115499769 A CN115499769 A CN 115499769A CN 202211257987 A CN202211257987 A CN 202211257987A CN 115499769 A CN115499769 A CN 115499769A
- Authority
- CN
- China
- Prior art keywords
- substrate
- plate
- capacitor
- capacitor plate
- asic chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000988 bone and bone Anatomy 0.000 title claims abstract description 37
- 239000003990 capacitor Substances 0.000 claims abstract description 149
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 239000000463 material Substances 0.000 claims abstract description 20
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000010410 layer Substances 0.000 claims 7
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000003292 glue Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000012546 transfer Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- 230000008859 change Effects 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention discloses a bone voiceprint vibration sensor, which comprises: the adapter plate is arranged on the first surface of the substrate, and an adapter circuit is arranged on the adapter plate; the vibrating diaphragm is arranged on one side of the adapter plate, which is far away from the substrate, and comprises an edge area and a central area; the vibrating diaphragm comprises a flexible insulating layer, a first connecting circuit and a first capacitor polar plate, wherein the first connecting circuit and the first capacitor polar plate are arranged in the flexible insulating layer; the surface, far away from the substrate, of the ASIC chip arranged on the first surface of the substrate is provided with a second capacitor plate, the vertical projection of the first capacitor plate on the ASIC chip is overlapped with the second capacitor plate, and a set distance is reserved between the two capacitor plates; the second capacitor plate is electrically connected with the ASIC chip, and the ASIC chip is electrically connected with the second connecting pin. The sensor of the invention can reduce the size of the packaged chip and reduce the material cost.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a bone voiceprint vibration sensor.
Background
The traditional MEMS microphone adopts a conduction mode that an MEMS chip diaphragm receives voice transmitted by air, and a sound pressure signal is sensed by a high-sensitivity vibrating film of the MEMS chip through a sound inlet hole to convert the sound signal into an electric signal. And the ASIC chip electrically connected with the MEMS chip outputs the signal after operational amplification.
The sensor of the traditional MEMS microphone receives the voice transmitted through the air, and includes the voice of the speaker and the noise from the surroundings, and when the noise is large, the microphone is interfered by the noise, such as the surrounding people, mechanical equipment, wind noise, etc., which seriously affects the quality of the call.
The bone voiceprint sensor on the market at present utilizes the packaging structure of the traditional MEMS microphone, and a vibration module is added into the structure of the traditional MEMS microphone: the sound is transmitted to the sensor along the human skeleton, the film in the sensor drives the MEMS vibrating diaphragm to vibrate under the action of sound wave vibration, and the capacitance change generated by the MEMS chip is read by the ASIC chip and is operated and amplified. Due to the addition of the vibration module, the chip size becomes larger, which is not favorable for the application of the increasingly miniaturized chip requirements.
Disclosure of Invention
The invention provides a bone voiceprint vibration sensor, which aims to reduce the size of a packaged chip and reduce the material cost.
According to an aspect of the present invention, there is provided a bone voiceprint vibration sensor comprising:
the circuit board comprises a substrate, wherein a first connecting pin and a second connecting pin are arranged on a first surface of the substrate;
an interposer disposed on the first surface of the substrate; the adapter plate is provided with an adapter circuit;
the vibrating diaphragm is arranged on one side, far away from the substrate, of the adapter plate and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate is arranged opposite to the edge area of the vibrating diaphragm; the vibrating diaphragm comprises a flexible insulating layer, a first connecting circuit and a first capacitor polar plate, wherein the first connecting circuit and the first capacitor polar plate are arranged in the flexible insulating layer;
the ASIC chip is arranged on the first surface of the substrate, the surface, far away from the substrate, of the ASIC chip is provided with a second capacitor plate, the vertical projection of the first capacitor plate on the ASIC chip is overlapped with the second capacitor plate, and a set distance is reserved between the second capacitor plate and the first capacitor plate; the second capacitor plate is electrically connected with the ASIC chip, and the ASIC chip is electrically connected with the second connecting pin.
Optionally, the bone voiceprint vibration sensor further comprises:
and the balancing weight is arranged on one side of the vibrating diaphragm away from the substrate.
Optionally, the ASIC chip is electrically connected to the second connection pin through a solder ball.
According to another aspect of the present invention, there is provided a bone voiceprint vibration sensor comprising:
the first surface of the substrate is provided with a second capacitor plate and a first connecting pin;
the adapter plate is arranged on one side of the first surface of the substrate; the adapter plate is provided with an adapter circuit;
the vibrating diaphragm is arranged on one side, far away from the substrate, of the adapter plate and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm comprises a flexible insulating layer and a second connecting circuit arranged in the flexible insulating layer;
the surface of the vibrating diaphragm, which is adjacent to the substrate, is provided with an ASIC chip, and the ASIC chip is arranged in the central area of the vibrating diaphragm; the surface of the ASIC chip, which is adjacent to the substrate, is provided with a first capacitor plate, the vertical projection of the first capacitor plate on the substrate is overlapped with a second capacitor plate, and a set distance is reserved between the second capacitor plate and the first capacitor plate;
the first capacitor plate is electrically connected with the ASIC chip, the ASIC chip is electrically connected with a second connecting circuit on the vibrating diaphragm, and the second connecting circuit is electrically connected with the first connecting pin on the substrate through the transfer circuit.
Optionally, the ASIC chip is electrically connected to the second connection circuit through a solder ball.
According to another aspect of the present invention, there is provided a bone voiceprint vibration sensor comprising:
the first surface of the substrate is provided with a second capacitor plate and a first connecting pin;
the adapter plate is arranged on the first surface of the substrate; the adapter plate is provided with an adapter circuit;
the vibrating diaphragm is arranged on one side, far away from the substrate, of the transfer plate and comprises an edge area and a central area, the edge area surrounds the central area, and the transfer plate is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm comprises a flexible insulating layer, a second connecting circuit, a third connecting circuit and a first capacitor plate, wherein the second connecting circuit, the third connecting circuit and the first capacitor plate are arranged in the flexible insulating layer; the vertical projection of the first capacitor plate on the substrate is overlapped with the second capacitor plate, and a set distance is reserved between the second capacitor plate and the first capacitor plate; the first capacitor plate is electrically connected with the third connecting circuit;
one side that the base plate was kept away from to the vibrating diaphragm is provided with the ASIC chip, and the ASIC chip is connected with second interconnecting link and third interconnecting link on the vibrating diaphragm respectively, and second interconnecting link passes through transfer circuit and is connected with the first connecting pin electricity on the base plate.
Optionally, the ASIC chip is electrically connected to the third connection line by a wire.
Optionally, the sensor according to any embodiment of the present invention further includes:
the glue layer is arranged on one side, adjacent to the first capacitor plate, of the second capacitor plate and used for adjusting the dielectric constant of a medium between the first capacitor plate and the second capacitor plate.
Optionally, in the sensor according to any embodiment of the present invention, the thickness of the diaphragm is 5 to 50 μm;
the material of the flexible insulating layer includes polyimide.
Optionally, the sensor according to any embodiment of the present invention further includes:
the metal casing, metal casing and the first surface fixed connection of base plate, vibrating diaphragm, keysets and ASIC chip all set up in the accommodation space that base plate and metal casing formed.
According to the technical scheme of the embodiment of the invention, when the vibration signal is transmitted to the sensor, the vibration of the internal vibrating diaphragm drives the first capacitor polar plate to vibrate, and the capacitance between the first capacitor polar plate and the second capacitor polar plate changes, so that the vibration signal is converted into an electric signal, and the detection of the vibration signal is realized by detecting the electric signal. The embodiment of the invention adopts a parallel plate capacitor structure to replace the traditional MEMS chip, reduces the material cost, and greatly reduces the size of a packaged finished product because only an ASIC chip is arranged in the sensor.
It should be understood that the statements in this section are not intended to identify key or critical features of the embodiments of the present invention, nor are they intended to limit the scope of the invention. Other features of the present invention will become apparent from the following description.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a bone voiceprint vibration sensor according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another bone voiceprint vibration sensor according to a second embodiment of the present invention;
fig. 3 is a schematic structural diagram of another bone voiceprint vibration sensor provided in the third embodiment of the present invention;
fig. 4 is a schematic structural diagram of another bone voiceprint vibration sensor according to a fourth embodiment of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Moreover, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Example one
An embodiment of the present invention provides a bone voiceprint vibration sensor, fig. 1 is a schematic structural diagram of a bone voiceprint vibration sensor provided in an embodiment of the present invention, and referring to fig. 1, the bone voiceprint vibration sensor includes:
a substrate 100, a first surface of the substrate 100 being provided with a first connection pin 101 and a second connection pin 102; an interposer 200 disposed on the first surface of the substrate 100; the patch panel 200 is provided with a patch cord 201.
The vibrating diaphragm is arranged on one side, far away from the substrate, of the transfer plate 200 and comprises an edge area and a central area, the edge area surrounds the central area, and the transfer plate 200 is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm comprises a flexible insulating layer 300, and a first connection line 301 and a first capacitor plate 700 which are arranged in the flexible insulating layer 300, wherein the first capacitor plate 700 is located in the central area, the first capacitor plate 700 is electrically connected with the first connection line 301, and the first connection line 301 is electrically connected with a first connection pin 101 on the substrate 100 through a transfer line 201.
The ASIC chip 500 is arranged on the first surface of the substrate 100, the surface of the ASIC chip 500 far away from the substrate 100 is provided with a second capacitor plate 800, the vertical projection of the first capacitor plate 700 on the ASIC chip 500 is overlapped with the second capacitor plate 800, and a set distance is reserved between the second capacitor plate 800 and the first capacitor plate 700; the second capacitor plate 800 is electrically connected to the ASIC chip 500, and the ASIC chip 500 is electrically connected to the second connection pin 102.
The substrate 100 is provided with a first connection pin 101 and a second connection pin 102, the first connection pin 101 may connect the first capacitor plate 700 with an external power source for charging, and the second connection pin 102 is used to enable the ASIC chip 500 to perform signal interaction with the external power source or a signal terminal. The patch cord 201 inside the patch panel 200 may be used to connect the first capacitor plate 700 and the first connection pin 101 inside the diaphragm, and the patch panel 200 may also function to support the diaphragm. The vibrating diaphragm adopts the FPC flexible board production technology, and the insulating layer, the first connecting circuit 301 and the capacitor plate are bonded together by using the adhesive to form the vibrating diaphragm. The insulating layer is used for forming the flexible insulating layer 300, the flexible insulating layer 300 can play a role in insulation protection, and the flexible insulating layer 300 can be made of polyimide materials or other flexible insulating materials. The first connection line 301 and the first capacitor plate 700 may be made of a conductive material such as metal, the metal material may be copper, and the first connection line 301 and the first capacitor plate 700 may be formed of copper foil.
The surface of the ASIC chip 500 far from the substrate 100 is further provided with a second capacitor plate 800, the ASIC chip 500 processes a layer of capacitor material on the back surface to form the second capacitor plate 800 during tape-out, and a set distance is provided between the second capacitor plate 800 and the first capacitor plate 700, so that the first capacitor plate 700 and the second capacitor plate 800 form a capacitor with an air medium therebetween, and the distance between the first capacitor plate 700 and the second capacitor plate 800 can be adjusted by changing the height of the interposer 200, thereby adjusting the capacitance of the capacitor.
Specifically, vibration signals such as sound are transmitted to the sensor along human bones or other solid materials, the sensor vibrates integrally, the vibrating diaphragm inside the sensor vibrates accordingly, the first capacitor plate 700 vibrates accordingly when the vibrating diaphragm vibrates, the distance between the capacitor plates changes, capacitance changes are caused, and the sound signals are converted into capacitance signals. The ASIC chip 500 is used to output the electrical signals on the first capacitor plate 700 and the second capacitor plate 800 through the connection pins of the substrate 100 after operational amplification. In addition, the larger the vibration amplitude of the diaphragm is, the larger the change of the capacitance is, that is, the larger the deformation amount of the diaphragm during vibration is, the larger the change of the capacitance is, and the deformation amount of the diaphragm can be adjusted by changing the thickness of the diaphragm, so that the capacitance change rate of the device can be adjusted.
According to the technical scheme of the embodiment of the invention, when the vibration signal is transmitted to the sensor, the vibration of the internal vibrating diaphragm drives the first capacitor plate 700 to vibrate, and the capacitance between the first capacitor plate 700 and the second capacitor plate 800 changes, so that the vibration signal is converted into an electric signal, and the detection of the vibration signal is realized by detecting the electric signal. The embodiment of the invention adopts a parallel plate capacitor structure to replace the traditional MEMS chip, reduces the material cost, and only the ASIC chip 500 is arranged in the sensor, thereby greatly reducing the size of the packaged finished product.
Optionally, the bone voiceprint vibration sensor further comprises: the weight 600 is disposed on one side of the diaphragm away from the substrate 100.
Wherein, balancing weight 600 can play the effect of counter weight, can adjust the size of vibrating diaphragm deformation volume, when having the noise in the environment, balancing weight 600 can be so that the interference of noise is avoided because of the less easy vibration that produces of noise of vibrating diaphragm.
Optionally, the ASIC chip 500 is electrically connected to the second connection pins 102 through solder balls 502.
The solder ball 502 is implanted on the front surface of the ASIC chip 500 during tape out, and the solder ball 502 can be used as a pin of the ASIC chip 500 to electrically interconnect with the second connection pin 102.
Optionally, the bone voiceprint vibration sensor further comprises: the metal shell 400, the metal shell 400 and the first surface of the substrate 100 are fixedly connected, and the diaphragm, the interposer 200 and the ASIC chip 500 are all disposed in the accommodating space formed by the substrate 100 and the metal shell 400.
Among other things, the metal case 400 may function as a protection device.
Specifically, the bone voiceprint vibration sensor of the present embodiment is manufactured by the following steps:
s110, processing a layer of capacitance material on the back surface of the ASIC chip 500 during chip flowing to form a second capacitance plate 800, and implanting solder balls 502 on the front surface.
S120, pressing and welding the vibrating diaphragm and the adapter plate 200;
s130, soldering the solder balls 502 of the ASIC chip 500 on the substrate 100;
s140, cutting the assembled adapter plate 200 into single pieces, attaching the single pieces to the substrate 100, and performing reflow soldering;
s150, dispensing and pasting a balancing weight 600 on the vibrating diaphragm, and baking and curing;
s160, scribing solder paste and adhering the metal shell 400, and performing reflow soldering;
and S170, cutting the substrate 100.
Example two
An embodiment of the present invention provides a bone voiceprint vibration sensor based on the above-mentioned embodiment, fig. 2 is a schematic structural diagram of another bone voiceprint vibration sensor provided in a second embodiment of the present invention, and referring to fig. 2, the bone voiceprint vibration sensor includes: a substrate 100, a first surface of the substrate 100 being provided with a second capacitor plate 800 and a first connection pin 101; an interposer 200 disposed on one side of the first surface of the substrate 100; the adapter plate 200 is provided with an adapter line 201; the vibrating diaphragm is arranged on one side, far away from the substrate 100, of the adapter plate 200 and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate 200 is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm includes a flexible insulating layer 300 and a second connection line 302 disposed in the flexible insulating layer 300.
The surface of the diaphragm adjacent to the substrate 100 is provided with an ASIC chip 500, and the ASIC chip 500 is arranged in the central area of the diaphragm; the surface of the ASIC chip 500 adjacent to the substrate is provided with a first capacitor plate 700, a vertical projection of the first capacitor plate 700 on the substrate 100 overlaps with a second capacitor plate 800, and a set distance is provided between the second capacitor plate 800 and the first capacitor plate 700; the first capacitor plate 700 is electrically connected to the ASIC chip 500, the ASIC chip 500 is electrically connected to the second connection line 302 on the diaphragm, and the second connection line 302 is electrically connected to the first connection pin 101 on the substrate 100 through the transfer line 201.
The difference between this embodiment and the above embodiments is that the ASIC chip 500 is attached to the diaphragm upside down, and the chip itself plays a role of weight balancing, and no additional weight balancing block is needed, thereby reducing the process steps and reducing the material cost. A layer of capacitive material is processed on the first surface of the substrate 100 to form a second capacitive plate 800, the second capacitive plate 800 is electrically connected to the third connection pin 103 of the substrate 100, and signal interaction is performed with the outside through the third connection pin 103. The ASIC chip 500 is provided with a first capacitor plate 700 on a surface adjacent to the substrate 100, and the first capacitor plate 700 and the second capacitor plate 800 form a capacitor with an air medium therebetween, and the capacitance of the capacitor can be adjusted by changing the height of the interposer 200.
Specifically, vibration signals such as sound are transmitted to the sensor along the solid bodies such as the bones of the human body, the sensor vibrates integrally, and the vibrating diaphragm inside the sensor vibrates accordingly to drive the distance between the first capacitor plate 700 and the second capacitor plate 800 to change, so that the capacitance changes, and the vibration signals are converted into electric signals. After the electrical signal is arithmetically amplified by the ASIC chip 500, the amplified electrical signal is transmitted to the substrate 100 through the second connection line 302 in the flexible insulation layer 300, and the electrical signal is transmitted to the outside through the substrate 100.
Optionally, the ASIC chip 500 is electrically connected to the second connection line 302 through solder balls 502.
The solder balls 502 can be used as pins of the ASIC chip 500, so as to electrically interconnect with the second connection lines 302. And the ASIC chip 500 can be directly fixed on the surface of the vibrating diaphragm by adopting the solder balls 502 without adopting materials such as glue and the like for fixing, so that the material cost is reduced.
Specifically, the bone voiceprint vibration sensor of the present embodiment is manufactured by the following steps:
s210, processing a layer of capacitance material on the back surface of the ASIC chip 500 during tape-out to form a first capacitance plate 700, and implanting solder balls 502 on the front surface.
S220, processing a layer of capacitance material on the first surface of the substrate 100 to form a second capacitance plate 800;
s230, pressing and welding the vibrating diaphragm and the adapter plate 200;
s240, the ASIC chip 500 is inversely pasted on the vibrating diaphragm and is subjected to reflow soldering;
s250, cutting the assembled adapter plate 200 into single pieces, attaching the single pieces on the substrate 100, and performing reflow soldering;
s260, scribing solder paste, attaching a metal shell 400, and performing reflow soldering;
s270, cutting the substrate 100.
When the vibration signal is transmitted to the sensor, the vibration of the internal diaphragm drives the first capacitor plate 700 to vibrate, and the capacitance between the first capacitor plate 700 and the second capacitor plate 800 changes accordingly, so that the vibration signal is converted into an electrical signal, and the electrical signal is detected through the ASIC chip 500, thereby realizing the detection of the vibration signal. The embodiment of the invention adopts a parallel plate capacitor structure to replace the traditional MEMS chip, and the ASIC chip 500 plays a role of counterweight, thereby reducing the process manufacturing steps and the material cost, and the ASIC chip is only arranged in the sensor, thereby greatly reducing the size of the packaged finished product.
EXAMPLE III
An embodiment of the present invention provides a bone acoustic print vibration sensor based on the above-mentioned embodiment, fig. 3 is a schematic structural diagram of another bone acoustic print vibration sensor provided in a third embodiment of the present invention, and referring to fig. 3, a bone acoustic print vibration sensor includes: a substrate 100, a first surface of the substrate 100 being provided with a second capacitor plate 800 and a first connection pin 101; an interposer 200 disposed on the first surface of the substrate 100; the patch panel 200 is provided with a patch cord 201.
The vibrating diaphragm is arranged on one side, far away from the substrate 100, of the adapter plate 200 and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate 200 is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm comprises a flexible insulating layer 300, and a second connecting line 302, a third connecting line 303 and a first capacitor plate 700 which are arranged in the flexible insulating layer, wherein the first capacitor plate 700 is positioned in the central area; the vertical projection of the first capacitor plate 700 on the substrate 100 overlaps the second capacitor plate 800, and a set distance is provided between the second capacitor plate 800 and the first capacitor plate 700; the first capacitor plate 700 is electrically connected to the third connection line 303.
The side of the diaphragm far away from the substrate 100 is provided with an ASIC chip 500, the ASIC chip 500 is respectively connected with a second connection line 302 and a third connection line 303 on the diaphragm, and the second connection line is electrically connected with the first connection pin 101 on the substrate 100 through a transfer line 201.
The difference between the present embodiment and the above embodiments is that the ASIC chip 500 is attached to a side of the diaphragm away from the substrate 100, and the ASIC chip 500 itself also plays a role of a weight. The second capacitor substrate 800 disposed on the substrate 100, the first capacitor plate 700 in the flexible insulating layer 300 and the air medium therebetween form a capacitor, and the capacitance of the capacitor can be adjusted by changing the height of the interposer 200.
Specifically, vibration signals such as sound are transmitted to the sensor along the solid bodies such as human bones, the sensor vibrates integrally, the vibrating diaphragm inside the sensor also vibrates accordingly, the distance between the polar plates can be driven to change, capacitance changes are caused, and the vibration signals are converted into electric signals. The electrical signals on the first capacitor plate 700 and the second capacitor plate 800 are transmitted to the ASIC chip 500 through the third connection line 303 in the flexible insulation layer 300, and the ASIC chip 500 amplifies the electrical signals and transmits the amplified electrical signals to the first connection pin 101 of the substrate 100 through the second connection line 302 for output. Alternatively, the ASIC chip 500 is electrically connected to the third connection line 303 by a wire.
The ASIC chip 500 and the third connection line 303 can be electrically connected by a wire bonding process, and the ball mounting of the ASIC chip 500 is not required.
Specifically, the bone voiceprint vibration sensor of the present embodiment is manufactured by the following steps:
s310, processing a layer of capacitance material on the first surface of the substrate 100 to form a second capacitance plate 800;
s320, pressing and welding the vibrating diaphragm and the adapter plate 200;
s330, cutting the assembled adapter plate 200 into single pieces, attaching the single pieces to the substrate 100, and performing reflow soldering;
s340, welding the ASIC chip 500 on the vibrating diaphragm, and then bonding by a lead;
s350, scribing solder paste and adhering the metal shell 400, and performing reflow soldering;
and S360, cutting the substrate 100.
In the technical scheme of the embodiment of the invention, the ASIC chip 500 adopts pressure welding to replace a solder ball during chip flowing on the basis of the embodiment, a ball planting process is not needed, and the size of a packaged finished product can be reduced. In addition, when the vibration signal is transmitted to the sensor according to the technical scheme of this embodiment, the vibration of the internal diaphragm drives the first capacitor plate 700 to vibrate, and the capacitance between the first capacitor plate 700 and the second capacitor plate 800 changes accordingly, so that the vibration signal is converted into an electrical signal, and the electrical signal is detected by the ASIC chip 500, thereby realizing the detection of the vibration signal. The embodiment of the invention adopts a parallel plate capacitor structure to replace the traditional chip, reduces the process manufacturing steps and the material cost by the counterweight effect of the chip, and greatly reduces the size of a packaged finished product because only the ASIC chip 500 is arranged in the sensor.
Example four
The embodiment of the present invention provides a bone voiceprint vibration sensor based on the above embodiment, and optionally, the bone voiceprint vibration sensor further includes: and the glue layer 900 is arranged on one side of the second capacitor plate adjacent to the first capacitor plate, and the glue layer 900 is used for adjusting the dielectric constant of a medium between the first capacitor plate 700 and the second capacitor plate 800.
Glue is coated on the second capacitor plate 800 to form a glue layer 900, the dielectric constant of the parallel plate capacitor intermediate medium is changed, and therefore the size of the capacitor is adjusted, after vibration signals are converted into electric signals, the converted electric signals are large, and detection is easy.
In addition, the glue can be doped with ions, can be doped with metal ions and other materials capable of adjusting dielectric constant, and can be matched with capacitors with different areas by adjusting process parameters such as ion doping concentration, glue amount and the like. Fig. 4 is a schematic structural diagram of another bone voiceprint vibration sensor according to a fourth embodiment of the present invention, and referring to fig. 4, fig. 4 is a diagram that a layer of coating glue is added on an ASIC chip 500 on the basis of fig. 1, and the dielectric constant of the parallel plate capacitor intermediate medium can be changed by adjusting ion doping in the glue.
Optionally, the thickness of the diaphragm is 5-50 micrometers; the material of the flexible insulating layer includes polyimide.
If the thickness of the diaphragm is less than 5 micrometers, the strength of the diaphragm is too poor and the diaphragm is easily damaged, and if the thickness of the diaphragm is more than 50 micrometers, the deformation of the diaphragm is small, so that the thickness of the diaphragm is selected to be in the range of 5-50 micrometers.
On the basis of the above embodiments, the dielectric constant of the capacitor can be adjusted by adding the glue layer 900 between the first capacitor plate 700 and the second capacitor plate 800, so that the size of the capacitor is changed, and detection of a capacitor signal is facilitated. And on the premise of ensuring that the vibrating diaphragm has enough structural strength by setting the thickness of the vibrating diaphragm, the vibrating diaphragm can have larger deformation.
It should be understood that various forms of the flows shown above may be used, with steps reordered, added, or deleted. For example, the steps described in the present invention may be executed in parallel, sequentially, or in different orders, and are not limited herein as long as the desired results of the technical solution of the present invention can be achieved.
The above-described embodiments should not be construed as limiting the scope of the invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made in accordance with design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A bone voiceprint vibration sensor comprising:
the circuit board comprises a substrate, wherein a first connecting pin and a second connecting pin are arranged on a first surface of the substrate;
an interposer disposed on the first surface of the substrate; a switching circuit is arranged on the switching plate;
the vibrating diaphragm is arranged on one side, far away from the substrate, of the adapter plate and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm comprises a flexible insulating layer, and a first connecting circuit and a first capacitor polar plate which are arranged in the flexible insulating layer, wherein the first capacitor polar plate is positioned in the central area, the first capacitor polar plate is electrically connected with the first connecting circuit, and the first connecting circuit is electrically connected with a first connecting pin on the substrate through the switching circuit;
the ASIC chip is arranged on the first surface of the substrate, a second capacitor plate is arranged on the surface, far away from the substrate, of the ASIC chip, the vertical projection of the first capacitor plate on the ASIC chip is overlapped with the second capacitor plate, and a set distance is reserved between the second capacitor plate and the first capacitor plate; the second capacitor plate is electrically connected with the ASIC chip, and the ASIC chip is electrically connected with the second connecting pin.
2. The sensor of claim 1, further comprising:
the balancing weight is arranged on one side, far away from the substrate, of the vibrating diaphragm.
3. The sensor of claim 1, wherein:
the ASIC chip is electrically connected with the second connecting pin through a solder ball.
4. A bone voiceprint vibration sensor comprising:
the first surface of the substrate is provided with a second capacitor polar plate and a first connecting pin;
the adapter plate is arranged on one side of the first surface of the substrate; a switching circuit is arranged on the switching plate;
the vibrating diaphragm is arranged on one side, far away from the substrate, of the adapter plate and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm comprises a flexible insulating layer and a second connecting circuit arranged in the flexible insulating layer;
an ASIC chip is arranged on the surface of the vibrating diaphragm, which is close to the substrate, and the ASIC chip is arranged in the central area of the vibrating diaphragm; the surface of the ASIC chip, which is close to the substrate, is provided with a first capacitor plate, the vertical projection of the first capacitor plate on the substrate is overlapped with a second capacitor plate, and a set distance is reserved between the second capacitor plate and the first capacitor plate;
the first capacitor plate is electrically connected with the ASIC chip, the ASIC chip is electrically connected with the second connecting circuit on the vibrating diaphragm, and the second connecting circuit is electrically connected with the first connecting pin on the substrate through the switching circuit.
5. The sensor of claim 4, wherein:
the ASIC chip is electrically connected with the second connecting circuit through a solder ball.
6. A bone voiceprint vibration sensor comprising:
the first surface of the substrate is provided with a second capacitor polar plate and a first connecting pin;
the adapter plate is arranged on the first surface of the substrate; a switching circuit is arranged on the switching plate;
the vibrating diaphragm is arranged on one side, far away from the substrate, of the adapter plate and comprises an edge area and a central area, the edge area surrounds the central area, and the adapter plate is arranged opposite to the edge area of the vibrating diaphragm; the diaphragm comprises a flexible insulating layer, and a second connecting circuit, a third connecting circuit and a first capacitor plate which are arranged in the flexible insulating layer, wherein the first capacitor plate is positioned in the central area; the vertical projection of the first capacitor plate on the substrate is overlapped with the second capacitor plate, and a set distance is reserved between the second capacitor plate and the first capacitor plate; the first capacitor plate is electrically connected with the third connecting line;
the side of the vibrating diaphragm, which is far away from the substrate, is provided with an ASIC chip, the ASIC chip is respectively connected with a second connecting circuit and a third connecting circuit on the vibrating diaphragm, and the second connecting circuit is electrically connected with a first connecting pin on the substrate through the switching circuit.
7. The sensor of claim 6, wherein:
the ASIC chip is electrically connected with the third connecting line through a lead.
8. The sensor of any one of claims 1-7, further comprising:
and the adhesive layer is arranged on one side of the second capacitor plate, which is adjacent to the first capacitor plate, and is used for adjusting the dielectric constant of a medium between the first capacitor plate and the second capacitor plate.
9. The sensor of any one of claims 1-7, wherein:
the thickness of the diaphragm is 5-50 microns;
the material of the flexible insulating layer comprises polyimide.
10. The sensor of any one of claims 1-7, further comprising:
the metal shell is fixedly connected with the first surface of the substrate, and the vibrating diaphragm, the adapter plate and the ASIC chip are all arranged in an accommodating space formed by the substrate and the metal shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211257987.6A CN115499769A (en) | 2022-10-13 | 2022-10-13 | Bone voiceprint vibration sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211257987.6A CN115499769A (en) | 2022-10-13 | 2022-10-13 | Bone voiceprint vibration sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115499769A true CN115499769A (en) | 2022-12-20 |
Family
ID=84474059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211257987.6A Pending CN115499769A (en) | 2022-10-13 | 2022-10-13 | Bone voiceprint vibration sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115499769A (en) |
-
2022
- 2022-10-13 CN CN202211257987.6A patent/CN115499769A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7239714B2 (en) | Microphone having a flexible printed circuit board for mounting components | |
| EP2384019B1 (en) | Microphone unit | |
| CN101237719B (en) | Silicon capacitor type microphone and manufacturing method thereof | |
| CN113411731B (en) | Bone voiceprint sensor and electronic equipment | |
| US20120020510A1 (en) | Microphone unit | |
| CN104219609B (en) | A kind of piezoelectricity vocal structure and mobile terminal | |
| JP2011114506A (en) | Microphone unit | |
| WO2007126179A1 (en) | Silicon condenser microphone having additional back chamber | |
| CN104394496B (en) | A kind of MEMS silicon microphone of small size high sensitivity high s/n ratio | |
| CN107113485B (en) | The chip carrier based on lead frame used in the manufacture of MEMS transducer packaging part | |
| CN218336424U (en) | Bone voiceprint vibration sensor | |
| CN114786104A (en) | Microphone structure and voice communication equipment | |
| CN204291390U (en) | A kind of MEMS microphone | |
| CN115499769A (en) | Bone voiceprint vibration sensor | |
| CN210629859U (en) | Novel anti-radio frequency interference micro-electro-mechanical system microphone structure | |
| CN209072739U (en) | A kind of MEMS microphone of side opening | |
| CN204180270U (en) | A kind of MEMS silicon microphone of small size high sensitivity high s/n ratio | |
| US20160309264A1 (en) | Acoustic Apparatus Using Flex PCB Circuit With Integrated I/O Fingers | |
| CN212134933U (en) | Packaging structure of acoustic wave sensor | |
| CN204180271U (en) | A kind of MEMS silicon microphone of high sensitivity high s/n ratio | |
| CN204119513U (en) | A kind of piezoelectricity vocal structure and mobile terminal | |
| CN114598977A (en) | MEMS microphone and voice communication equipment | |
| CN208971806U (en) | Terminal assembly structure of MEMS microphone | |
| CN104581588A (en) | High-sensitivity high-SNR MEMS silicon microphone | |
| CN209120482U (en) | A kind of microphone assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20240510 Address after: 214135 China Sensor Network International Innovation Park F2, 200 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Applicant after: SV SENSTECH (WUXI) CO.,LTD. Country or region after: China Address before: 214131 F2, China Sensor Network International Innovation Park, 200 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Applicant before: Huajing Technology Wuxi Co.,Ltd. Country or region before: China |