CN115426441B - Camera module and electronic equipment - Google Patents

Abstract

The application discloses a camera module and electronic equipment, wherein the camera module comprises a lens assembly, a photosensitive chip and a flexible circuit board, the lens assembly is connected with one end of the photosensitive chip, the other end of the photosensitive chip is connected with one end of the flexible circuit board, the other end of the flexible circuit board extends to a position far away from the photosensitive chip, the flexible circuit board is used for supplying power for the lens assembly and the photosensitive chip, and the flexible circuit board is used for realizing heat dissipation of the photosensitive chip. The electronic equipment comprises a first shell, wherein the first shell comprises a camera module. The flexible circuit board is adopted, so that the height and the width of the camera module can be reduced, and the thickness and the top width of the first shell are reduced; and cancel the radiating part, realize the radiating effect by flexible circuit board, further reduce the thickness of first casing, realize the demand of electronic equipment frivolity and narrow frame.

Description

A camera module and electronic equipment

technical field

The present application relates to the field of camera module technology, in particular to a camera module and electronic equipment.

Background technique

The shooting function is an indispensable function for electronic devices (such as mobile phones, notebook computers, tablets, etc.). In order to obtain good image quality and camera effects, camera modules are installed in electronic devices to provide a wide range of shooting functions.

At present, thinner and lighter electronic devices and narrow borders are the development needs of the industry. The camera module is usually set on the frame of the screen of the electronic device. Since the camera module has a certain height and width, when the camera module is set on the frame of the screen of the electronic device, it is difficult for the electronic device to achieve a narrow frame. And it will also increase the thickness of the electronic device, making it difficult to achieve thinner and lighter.

Contents of the invention

The present application provides a camera module and electronic equipment to solve the problem that the existing camera module will affect the electronic equipment and cannot achieve thinner and thinner frames.

In a first aspect, the present application provides a camera module, including: a lens assembly; a photosensitive chip, one end of the photosensitive chip is bonded to the lens assembly; a flexible circuit board, one end of the flexible circuit board is connected to the The other end of the photosensitive chip is bonded and connected, the other end of the flexible circuit board extends to a position away from the photosensitive chip, and the flexible circuit board is used for powering the lens assembly and the photosensitive chip, and the flexible circuit board The circuit board is used for heat dissipation of the photosensitive chip. In this way, the height and width of the camera module can be reduced by replacing the commonly used hard board with a flexible circuit board.

In the embodiment of the present application, a reinforcement component is also included; the reinforcement component is bonded and connected to the flexible circuit board through an adhesive layer, and the reinforcement component is used to increase the rigidity of the flexible circuit board.

In the embodiment of the present application, the flexible circuit board includes a first part, a second part and a bending part; the first part is located between the photosensitive chip and the reinforcing member; the second part is away from The direction of the photosensitive chip extends; the bending part is connected between the first part and the second part, and the bending part is used to change the relative position between the first part and the second part Position; the first part is used to absorb the heat emitted by the photosensitive chip, and transmit the heat to the second part through the bending part, and the second part dissipates the heat. In this way, efficient heat dissipation of the large-area flexible circuit board can be realized.

In the embodiment of the present application, the upper surface of the first part is bonded and connected to the photosensitive chip, and the lower surface of the first part is bonded and connected to the reinforcing member. In this way, the height of the camera module can be reduced by adopting a layout method in which the photosensitive chip and the flexible circuit board are directly bonded and connected.

In the embodiment of the present application, the flexible circuit board further includes a through groove; the through groove is located on the first part at a position corresponding to the photosensitive chip, and the through groove is used to accommodate the photosensitive chip; The photosensitive chip is pasted on the reinforcing component through the through groove. In this way, the height of the camera module can be reduced by adopting the embedding layout of the photosensitive chip and the flexible circuit board.

In the second aspect, the embodiment of the present application provides a camera module, including: a lens assembly; a photosensitive chip, one end of the photosensitive chip is bonded and connected to the lens assembly; a printed circuit board, the printed circuit board is connected to the The other end of the photosensitive chip is connected; the printed circuit board includes a rigid circuit board and a first flexible circuit board connected to each other, and an accommodation groove is opened in the rigid circuit board, and the other end of the photosensitive chip is embedded in the accommodation groove The first flexible circuit board extends to a position away from the photosensitive chip, the rigid circuit board and the first flexible circuit board are used to power the lens assembly and the photosensitive chip, and the first flexible circuit board It is used to realize heat dissipation of the photosensitive chip. In this way, the printed circuit board composed of the rigid circuit board and the first flexible circuit board replaces the commonly used rigid board. The hard circuit board and the photosensitive chip adopt an embedded layout method, and the heat dissipation of the photosensitive chip is realized by the first flexible circuit board, and the heat dissipation component is eliminated to reduce the width of the camera module.

In the embodiment of the present application, at the receiving groove, the left and right sides of the photosensitive chip are respectively connected to the rigid circuit board through gold wires; the gold wires on the left and right sides of the photosensitive chip pass through the rigid circuit board. The top and bottom ends of the board are electrically connected.

In the embodiment of the present application, the printed circuit board further includes a second flexible circuit board; the second flexible circuit board is connected to the top of the rigid circuit board, and the rigid circuit board is located between the first flexible circuit board and the flexible circuit board. Between the second flexible circuit boards; the second flexible circuit boards are used to electrically connect the gold wires on the left and right sides of the photosensitive chip, and the second flexible circuit boards can be bent in any direction.

In the embodiment of the present application, a reinforcing component is further included; the reinforcing component is bonded and connected to the rigid circuit board through an adhesive layer, and the reinforcing component is used to increase the rigidity of the rigid circuit board.

In the embodiment of the present application, the accommodating groove runs through the upper and lower ends of the rigid circuit board, and the photosensitive chip passes through the accommodating groove and is attached to the reinforcing member.

In a third aspect, the embodiment of the present application further provides an electronic device, including: a first casing, the first casing includes a front casing and a rear casing, and the front casing is buckled on the rear casing to form a closed A cavity, the closed cavity includes the camera module described in any one of the first aspect and the second aspect. In this way, the height and width of the camera module are reduced, and the heat dissipation parts are eliminated, and the heat dissipation is realized by the flexible circuit board in the camera module, which reduces the thickness of the first housing in the electronic device and realizes the demand for lightness and thinning. At the same time, reducing the width of the camera module can reduce the width of the top of the first casing in the electronic device, so as to realize the requirement of a narrow frame.

Description of drawings

In order to illustrate the technical solution of the present application more clearly, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, for those of ordinary skill in the art, on the premise of not paying creative labor, Additional drawings can also be derived from these drawings.

FIG. 1 is a schematic structural diagram of an electronic device 100 provided by an embodiment of the present application.

FIG. 2 is a side view of an electronic device 100 provided by an embodiment of the present application.

Fig. 3 is a partial schematic diagram of the first housing 101 provided in the prior art.

FIG. 4 is a schematic structural diagram of a camera module 30 provided in the prior art.

FIG. 5A is a partial schematic diagram of a camera module 30 provided in the prior art.

FIG. 5B is a partial width schematic diagram of the camera module 30 provided in the prior art.

FIG. 6 is a schematic structural diagram of the first type of camera module 30 provided by the embodiment of the present application.

FIG. 7 is an exploded schematic diagram of the structure of the first camera module 30 provided by the embodiment of the present application.

FIG. 8 is a schematic structural diagram of a second type of camera module 30 provided by an embodiment of the present application.

FIG. 9 is an exploded schematic diagram of the structure of the second camera module 30 provided by the embodiment of the present application.

FIG. 10A is a partial schematic diagram of a flexible circuit board 306 corresponding to the embedded layout provided by the embodiment of the present application.

FIG. 10B is a schematic longitudinal cross-sectional view of the flexible circuit board 306 corresponding to the embedded layout provided by the embodiment of the present application.

FIG. 11 is a schematic structural diagram of the first type of printed circuit board 50 provided by the embodiment of the present application.

Fig. 12 is a schematic view of the section A-A in Fig. 11 .

FIG. 13 is a schematic structural diagram of a second type of printed circuit board 50 provided by the embodiment of the present application.

FIG. 14 is a schematic structural diagram of a second flexible circuit board 504 in a bent state provided by an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Apparently, the described embodiments are some of the embodiments of the present application, not all of them. Based on the embodiments of the present application, other embodiments obtained by persons of ordinary skill in the art without making creative efforts all belong to the protection scope of the present application.

Hereinafter, the terms "first", "second", etc. are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first", "second", etc. may expressly or implicitly include one or more of that feature. In the description of the present application, unless otherwise specified, "plurality" means two or more.

In addition, in this application, orientation terms such as "upper", "lower", "left", "right", "top", and "bottom" are defined relative to the schematic placement orientations of components in the drawings, It should be understood that these directional terms are relative concepts, which are used for description and clarification relative to each other, and which may change accordingly according to changes in the orientation in which components are placed in the drawings.

The electronic devices described in the embodiments of the present application include but are not limited to mobile phones, notebook computers, tablet computers, laptop computers, personal digital assistants, or wearable devices. In the following, the electronic device is described as a notebook computer.

FIG. 1 is a schematic structural diagram of an electronic device 100 provided by an embodiment of the present application.

As shown in FIG. 1 , the electronic device 100 may include a first housing 101 and a second housing 102 . The first housing 101 and the second housing 102 are connected by a rotating shaft, so that the opening and closing angles of the first housing 101 and the second housing 102 can be changed through the action of the rotating shaft, and maintained at the opening and closing angle required by the user. Exemplarily, when the electronic device 100 is a notebook computer, the first housing 101 may be a display, and the second housing 102 may be a keyboard host.

The first case 101 may include a front case 10 , a rear case 20 and a display screen 40 . The display screen 40 is arranged on the front case 10 , and the front case 10 with the display screen 40 is buckled on the rear case 20 to form a closed cavity, which includes the camera module 30 . The camera module 30 is used to realize the shooting function, and the number of camera modules 30 can be one or more.

The front case 10 can be understood as wrapping the frame of the display screen 40 , the camera module 30 is located at the top of the frame, and can be further understood as the camera module 30 is located at the top of the first casing 101 . In order to accommodate the camera module 30 , the top width of the frame (that is, the top width of the first housing 101 ) W ₁₀₁ needs to be adapted to the width of the camera module 30 .

FIG. 2 is a side view of an electronic device 100 provided by an embodiment of the present application.

As shown in Figure 2, in the first housing 101, the closed cavity formed by the front shell 10 and the rear shell 20 can accommodate the camera module 30, and the thickness of the cavity (ie the thickness of the first housing 101 )H ₁₀₁ needs to adapt to the height of the camera module 30 .

Fig. 3 is a partial schematic diagram of the first housing 101 provided in the prior art.

As shown in FIG. 3 , an existing camera module 30 may include a lens assembly 301 , a photosensitive chip 302 , a hard board 304 and the like. The lens assembly 301 is connected to one end of the photosensitive chip 302 , and the other end of the photosensitive chip 302 is connected to the hard board 304 . Exemplarily, the rigid board 304 may be a PCB board.

When the existing camera module 30 is installed in the first casing 101, at the top position of the front casing 10, the lens assembly 301, Photosensitive chip 302 and hard board 304 etc. The lens assembly 301 is located near the front case 10 , and the hard plate 304 is located near the rear case 20 .

When the camera module 30 is running, the lens assembly 301 , the photosensitive chip 302 and the hard board 304 all generate heat. To facilitate heat dissipation, a heat dissipation component 60 is attached to the bottom of the hard board 304 . Exemplarily, the heat dissipation component 60 may use copper foil or other materials with heat dissipation. Wherein, the heat dissipation component 60 can be used as a component of the camera module 30 or as a component of the electronic device 100 .

One end of the heat dissipation component 60 is attached to the hard board 304 , the other end of the heat dissipation component 60 extends to the back of the display screen 40 , and the extended end of the heat dissipation component 60 is close to the rear case 20 . One end of the heat dissipation component 60 attached to the hard plate 304 is used to absorb the heat emitted by the camera module 30, and transfer the heat to the extended end of the heat dissipation component 60, and the extended end of the heat dissipation component 60 transfers the heat to the rear shell 20, and Out from the rear shell 20.

In the thickness direction of the first housing 101, the thickness H ₁₀₁ of the first housing 101 is subject to the influence of the height H ₃₀ of the camera module 30 and the thickness H ₆₀ of the heat dissipation member 60, etc., and cannot be further reduced, and the second housing 101 cannot be realized. A casing 101 is light and thin. In the width direction of the first housing 101, the top width W ₁₀₁ of the first housing 101 is subject to the influence of the width W ₃₀ of the camera module 30, etc., and cannot be further reduced, and the narrow frame of the first housing 101 cannot be realized. .

Thinning and narrowing of the frame of the electronic device 100 are demands for the development of the industry. In order to realize thinner and thinner frame of the electronic device 100, in the embodiment of the present application, the thickness H 101 of the first casing 101 in the electronic device 100 is reduced by reducing the height H ₃₀ of the camera module 30 and canceling the heat dissipation component ₆₀ , to achieve the demand for thinner and lighter. And, by reducing the width W ₃₀ of the camera module 30 , the width W ₁₀₁ of the top of the first casing 101 in the electronic device 100 is reduced to meet the requirement of a narrow frame.

FIG. 4 is a schematic structural diagram of a camera module 30 provided in the prior art.

As shown in FIG. 4 , in the camera module 30 , the lens assembly 301 , the photosensitive chip 302 and the hard board 304 are connected in sequence. Exemplarily, the photosensitive chip 302 and the hard board 304 can be connected through an adhesive layer 303 .

In the height direction of the camera module 30, the height _H30 of the camera module 30 is subject to the influence of the thickness a of the lens assembly 301, the thickness b of the photosensitive chip 302, the thickness c of the adhesive layer 303, and the thickness d of the hard plate 304, etc. . H ₃₀ >a+b+c+d, an increase in the thickness of any one of a, b, c or d will lead to an increase in the height H ₃₀ of the camera module 30 . Moreover, in order to avoid affecting the performance, the thickness of the above-mentioned components cannot be further reduced, resulting in the height _H30 of the camera module 30 cannot be further reduced, and thus the thickness of the first housing 101 cannot be reduced, and the electronic device 100 cannot be realized. Thin and light.

FIG. 5A is a partial schematic diagram of a camera module 30 provided in the prior art.

As shown in FIG. 5A , inside the camera module 30 , besides the photosensitive chip 302 and the lens assembly 301 , an image processing unit 305 is also bonded to the hard board 304 . The image processing unit 305 and the photosensitive chip 302 are bonded on the hard board 304 at intervals.

FIG. 5B is a partial width schematic diagram of the camera module 30 provided in the prior art.

As shown in (a) and (b) of Figure 5B, in the width direction of the camera module 30, the width W ₃₀ of the camera module 30 is limited by the root diameter width W ₃₀₁ of the lens assembly 301 and the position width of the photosensitive chip 302. The influence of W ₃₀₂ and/or the position width W ₃₀₅ of the image processing unit 305 etc. W ₃₀ >W ₃₀₁ , W ₃₀ >W ₃₀₂ , W ₃₀ >W ₃₀₅ , any increase in the width of W ₃₀₁ , W ₃₀₂ , and W ₃₀₅ will lead to an increase in the width W ₃₀ of the camera module 30 . Moreover, in order to avoid affecting the performance, the thicknesses of the above-mentioned components cannot be further reduced, resulting in the inability to further reduce the width W ₃₀ of the camera module 30, which in turn leads to the inability to reduce the top width of the first housing 101, and the electronic device 100 cannot be realized. narrow border.

The embodiment of the present application provides a camera module 30, which can reduce the height and width of the camera module 30, thereby reducing the thickness and top width of the first housing 101 in the electronic device 100, and realizing thinning and narrowing of the electronic device 100. specialty.

FIG. 6 is a schematic structural diagram of the first type of camera module 30 provided by the embodiment of the present application.

In some embodiments, as shown in FIG. 6 , the camera module 30 may include a lens assembly 301 , a photosensitive chip 302 , a flexible circuit board 306 and the like. One end of the photosensitive chip 302 is bonded to the lens assembly 301 , the other end of the photosensitive chip 302 is bonded to one end of the flexible circuit board 306 , and the other end of the flexible circuit board 306 extends to a position away from the photosensitive chip 302 .

The flexible circuit board 306 is a printed circuit made of a flexible insulating substrate, which can be freely bent, wound, and folded, and can be arranged arbitrarily according to the internal space layout requirements of the camera module 30 . The flexible circuit board 306 provides excellent electrical performance and can meet the design requirements of smaller and higher density installation. The flexible circuit board 306 can greatly reduce the volume and weight of electronic products, and is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability.

Replacing the commonly used hard board 304 with the flexible circuit board 306 can ensure that the electrical performance is not affected or improve the electrical performance. The thickness of the flexible circuit board 306 is smaller than that of the rigid board 304 , and the height H ₃₀ of the camera module 30 can be reduced by reducing the thickness of the circuit board. At the same time, the flexible circuit board 306 is extended to a position far away from the photosensitive chip 302 in a large area, for example, the flexible circuit board 306 is extended to the back of the display screen 40 in a large area to play a role in heat dissipation.

The flexible circuit board 306 can not only supply power to the lens assembly 301 and the photosensitive chip 302 , but also realize heat dissipation of itself and the photosensitive chip 302 . In this way, the functions realized by the original two components are realized by the same component, which can reduce the occupied space. Then, when the camera module 30 provided by the embodiment of the present application is installed in the first casing of the electronic device 100 , in combination with the content shown in FIG. 3 , it is not necessary to separately arrange the heat dissipation component 60 to realize heat dissipation. The thickness H ₁₀₁ of the first casing 101 in the electronic device 100 can be further reduced by eliminating the heat dissipation component 60 and reducing the height H ₃₀ of the camera module 30 by reducing the thickness of the circuit board.

FIG. 7 is an exploded schematic diagram of the structure of the first camera module 30 provided by the embodiment of the present application.

In some embodiments, as shown in FIG. 7 and in combination with the content shown in FIG. 6 , the camera module 30 may further include a reinforcement component 307 . The reinforcing component 307 is bonded under the flexible circuit board 306 to increase the rigidity of the flexible circuit board 306 . The reinforcing component 307 can be bonded to the flexible circuit board 306 through the adhesive layer 303 to ensure the stability of the combination of the reinforcing component 307 and the flexible circuit board 306 .

Exemplarily, the thickness of the reinforcing component 307 may be 0.1mm˜0.15mm, and the thickness of the adhesive layer 303 may be about 0.03mm.

The flexible circuit board 306 can be bent in any direction, so when using a large-area flexible circuit board 306 to realize heat dissipation, the flexible circuit board 306 can include a first part 3061 , a second part 3062 and a bent part 3063 .

The first part 3061 is located between the photosensitive chip 302 and the reinforcing member 307 . In one layout, the upper surface of the first part 3061 is bonded to the photosensitive chip 302 to absorb the heat emitted by the photosensitive chip 302 through the first part 3061; Reinforcing member 307 is attached and connected, so that the rigidity of first part 3061 is increased by reinforcing member 307, so that the first part 3061 of flexible circuit board 306 can support the various components (such as photosensitive chip 302, camera lens) on the first part 3061 Component 301 and image processing unit, etc.).

The bent portion 3063 is connected between the first portion 3061 and the second portion 3062 so that the second portion 3062 can extend away from the photosensitive chip 302 . Exemplarily, the second portion 3062 of the flexible circuit board 306 extends to the back of the display screen 40 , and the second portion 3062 is located between the display screen 40 and the rear case 20 .

The bending part 3063 is used to change the relative position of the first part 3061 and the second part 3062, so that the first part 3061 and the second part 3062 are not on the same horizontal line, so as to realize heat conduction. Exemplarily, the distance between the first part 3061 and the rear case 20 is greater than the distance between the second part 3062 and the rear case 20 , and the second part 3062 is closer to the position of the rear case 20 .

When realizing heat dissipation, the first part 3061 absorbs the heat generated by the photosensitive chip 302 and transmits the heat to the second part 3062 through the bent part 3063 . The second part 3062 transfers the heat to the rear case 20 and dissipates it from the rear case 20 .

In some embodiments, the flexible circuit board 306 can increase the trace area. Under the premise of ensuring the same electrical performance, the flexible circuit board 306 can reduce the wiring area in the width direction, increase the wiring area in the length direction, and reduce the number of wiring layers. Reducing the routing area in the width direction can reduce the width W ₃₀ of the camera module 30 . Increasing the wiring area in the length direction can facilitate the flexible circuit board 306 to extend from the position of the photosensitive chip 302 to the back position of the display screen 40 to form a large-area flexible circuit board 306 for heat dissipation. Reducing the number of wiring layers can reduce the thickness of the flexible circuit board 306 . Exemplarily, the flexible circuit board 306 may include two layers of traces, and the thickness of the flexible circuit board 306 may be about 0.1 mm.

Combining with the content shown in FIG. 3 again, the commonly used rigid board 304 has many routing layers, for example, at least 4 layers of routing, so that the thickness of the rigid board 304 is at least 0.3 mm. The thickness of the flexible circuit board 306 used in the embodiment of the present application is thinner than that of the hard board 304 , which can reduce the height H ₃₀ of the camera module 30 .

Replacing the commonly used hard board 304 with a combined structure of the flexible circuit board 306 and the reinforcing component 307 can ensure that the overall thickness of the combined structure is smaller than that of the hard board 304 under the same or greater rigidity requirements. Exemplarily, the overall thickness of the combined structure of the flexible circuit board 306 and the reinforcing member 307 is 0.1 mm˜0.2 mm smaller than that of the hard board 304 . That is to say, the height H ₃₀ of the camera module 30 will be reduced by 0.1mm˜0.2mm.

Meanwhile, the thickness _H30 of the heat dissipation member 60 is about 0.1mm. In the embodiment of the present application, the heat dissipation component 60 is omitted, and the large-area flexible circuit board 306 realizes heat dissipation, which can further reduce the height H ₃₀ of the camera module 30 by 0.1 mm. Then, in the height direction of the camera module 30 , the embodiment of the present application can realize that the height H ₃₀ of the camera module 30 can be reduced by 0.2mm˜0.3mm as a whole.

In the camera module 30 provided in the embodiment of the present application, the commonly used hard board 304 is replaced by a combined structure of a flexible circuit board 306 and a reinforcing part 307, and a layout method in which the photosensitive chip 302 and the flexible circuit board 306 are directly bonded and connected is adopted. , to reduce the height H ₃₀ of the camera module 30 ; and combined with the way of canceling the heat dissipation component 60 , the flexible circuit board 306 realizes heat dissipation, reduces the thickness H ₁₀₁ of the first housing 101 in the electronic device 100 , and realizes the demand for lightness and thinning. At the same time, the use of the flexible circuit board 306 can reduce the width W ₃₀ of the camera module 30 , thereby reducing the width W ₁₀₁ of the top of the first housing 101 in the electronic device 100 , so as to realize the requirement of a narrow frame.

FIG. 8 is a schematic structural diagram of a second type of camera module 30 provided by an embodiment of the present application.

In some embodiments, as shown in FIG. 8, the difference between the structure of the camera module 30 provided in the embodiment of the present application and the structure of the camera module 30 shown in FIG. 6 lies in the layout of the photosensitive chip 302 and the flexible circuit board 306, and For the structural characteristics, reference can be made to the corresponding content of the camera module 30 shown in FIG. 6 , which will not be repeated here. Wherein, one layout of the photosensitive chip 302 and the flexible circuit board 306 shown in FIG. 6 is to attach and connect the upper surface of the first part 3061 and the photosensitive chip 302 directly.

In another layout, the embodiment of the present application may embed the photosensitive chip 302 into the flexible circuit board 306 to further reduce the height H ₃₀ of the camera module 30 .

FIG. 9 is an exploded schematic diagram of the structure of the second camera module 30 provided by the embodiment of the present application.

In some embodiments, as shown in FIG. 9 and combined with what is shown in FIG. 8 , the flexible circuit board 306 may include a first portion 3061 , a second portion 3062 , a bent portion 3063 and a through slot 308 . The through groove 308 is located on the first portion 3061 at a position corresponding to the photosensitive chip 302 , and the through groove 308 is used for accommodating the photosensitive chip 302 .

Exemplarily, the through groove 308 may be a through groove that runs through the upper and lower ends of the first part 3061 , or may be a groove that is inwardly depressed from the upper surface of the first part 3061 , that is, the upper and lower surfaces of the first part 3061 are not connected. The embodiment of the present application is described by taking the through groove 308 as a through groove passing through the upper and lower ends of the first portion 3061 as an example.

The photosensitive chip 302 is embedded in the through groove 308 , and the bottom surface of the photosensitive chip 302 is pasted on the reinforcing member 307 through the adhesive layer 303 through the through groove 308 .

FIG. 10A is a partial schematic diagram of a flexible circuit board 306 corresponding to the embedded layout provided by the embodiment of the present application.

In some embodiments, as shown in FIG. 10A , a through groove 308 is provided on the first portion 3061 of the flexible circuit board 306, and the cross-sectional area of the through groove 308 is larger than that of the photosensitive chip 302, so that the photosensitive chip 302 is inserted into the When the groove 308 is penetrated, there is a gap between the photosensitive chip 302 and the flexible circuit board 306 around the through groove 308 to avoid interference between the photosensitive chip 302 and the flexible circuit board 306 . The photosensitive chip 302 and the flexible circuit board 306 around the through groove 308 can be connected by gold wires (not shown).

The photosensitive chip 302 embedded in the through groove 308 is pasted on the reinforcement member 307 , and the width of the reinforcement member 307 can be smaller than the width of the through groove 308 , and can also be greater than or equal to the width of the through groove 308 . The width of the reinforcement member 307 is greater than or equal to the width of the photosensitive chip 302 to sufficiently support the photosensitive chip 302 .

FIG. 10B is a schematic longitudinal cross-sectional view of the flexible circuit board 306 corresponding to the embedded layout provided by the embodiment of the present application.

In some embodiments, as shown in FIG. 10B , after the photosensitive chip 302 is embedded in the through groove 308 , the bottom surface of the photosensitive chip 302 is pasted on the reinforcing member 307 through the adhesive layer 303 . The thickness of the photosensitive chip 302 is greater than that of the flexible circuit board 306 . After the photosensitive chip 302 is inserted into the through groove 308 , the photosensitive chip 302 will protrude a certain height relative to the through groove 308 . Exemplarily, when the thickness of the photosensitive chip 302 is 0.15 mm and the thickness of the flexible circuit board 306 is 0.1 mm, the photosensitive chip 302 protrudes a height of 0.05 mm relative to the through groove 308 . If the thickness of the photosensitive chip 302 is less than or equal to the thickness of the flexible circuit board 306 , the photosensitive chip 302 will not protrude relative to the through groove 308 .

After the photosensitive chip 302 is inserted into the through groove 308 , in the height direction of the camera module 30 , the height _H30 of the camera module 30 will be reduced by the height corresponding to the thickness of the flexible circuit board 306 . Exemplarily, the height H ₃₀ of the camera module 30 is reduced by 0.1mm. However, the overall thickness of the combined structure of the flexible circuit board 306 and the reinforcing component 307 is 0.1 mm to 0.2 mm smaller than that of the hard board 304 . That is to say, the height H ₃₀ of the camera module 30 will be reduced by 0.2mm˜0.3mm. At the same time, the removal of the heat dissipation component 60 can further reduce the height H ₃₀ of the camera module 30 by 0.1 mm. Then, in the height direction of the camera module 30 , the embodiment of the present application can realize that the height H ₃₀ of the camera module 30 can be reduced by 0.3mm˜0.4mm as a whole. Therefore, the embodiment of the present application adopts the embedded layout method to reduce the height H ₃₀ of the camera module 30 , thereby reducing the thickness H ₁₀₁ of the first casing 101 in the electronic device 100 .

In some embodiments, the photosensitive chip 302 in the camera module 30 can be made by using different packaging methods, and different packaging methods have different structures of the photosensitive chip 302 . Exemplarily, the packaging manner may include a CSP (Chip Scale Package, chip scale package) packaging manner and a COB (Chip on Board, chip on board packaging) packaging manner. The CSP-type photosensitive chip 302 is made by CSP packaging, and the COB-type photosensitive chip 302 is made by COB packaging.

The intuitive difference between the CSP type photosensitive chip 302 and the COB type photosensitive chip 302 is the chip height, and the chip height of the CSP type photosensitive chip 302 is greater than that of the COB type photosensitive chip 302 . Referring to FIG. 6 and FIG. 8 again, the photosensitive chip 302 used in the camera module 30 shown in FIG. 6 is a CSP type, and the photosensitive chip 302 used in the camera module 30 shown in FIG. 8 is a COB type.

When different types of photosensitive chips 302 are used in the camera module 30 , different layouts may be adopted for the connection of the photosensitive chips 302 and the flexible circuit board 306 . Exemplarily, the layout of the direct bonding connection shown in FIG. 6 is applicable to the CSP type photosensitive chip 302 and the COB type photosensitive chip 302 . The embedded layout shown in FIG. 8 is suitable for the COB type photosensitive chip 302 .

In the camera module 30 provided in the embodiment of the present application, the commonly used hard board 304 is replaced by a combined structure of a flexible circuit board 306 and a reinforcing part 307, and the embedded layout of the photosensitive chip 302 and the flexible circuit board 306 is adopted to reduce the The height H ₃₀ of the module 30 ; combined with the way of canceling the heat dissipation component 60 , the flexible circuit board 306 realizes heat dissipation, reduces the thickness H ₁₀₁ of the first housing 101 in the electronic device 100 , and realizes the demand for lightness and thinning. At the same time, the use of the flexible circuit board 306 can reduce the width W ₃₀ of the camera module 30 , thereby reducing the width W ₁₀₁ of the top of the first housing 101 in the electronic device 100 , so as to realize the requirement of a narrow frame.

In some embodiments, in order to reduce the height and width of the camera module 30 , the camera module 30 provided in the embodiment of the present application may also use a printed circuit board 50 to replace the commonly used hard board 304 . The structure of the camera module 30 using the printed circuit board 50 can refer to the structure of the camera module 30 using the flexible circuit board 306 shown in Figure 6 and Figure 8, the difference is that the structure of the printed circuit board 50 is different from that of Figure 6 and Figure 8 The structure of the flexible circuit board 306 shown in FIG. 8 will not be described repeatedly. The following only describes the structure of the printed circuit board 50 that can reduce the height and width of the camera module 30 .

FIG. 11 is a schematic structural diagram of the first type of printed circuit board 50 provided by the embodiment of the present application.

In some embodiments, as shown in FIG. 11 , the camera module 30 provided by the embodiment of the present application adopts a printed circuit board 50 , and the printed circuit board 50 is bonded to the photosensitive chip 302 .

The printed circuit board 50 may include a rigid circuit board 501 and a first flexible circuit board 502, one end of the first flexible circuit board 502 is connected to the rigid circuit board 501, and the other end of the first flexible circuit board 502 is connected to the connector in the electronic device 100 80 to connect.

In order to reduce the height of the camera module 30 , an accommodating groove 503 is opened in the rigid circuit board 501 , and the photosensitive chip 302 is embedded in the accommodating groove 503 . The accommodating groove 503 can be a through groove that runs through the upper and lower ends of the rigid circuit board 501 , or a groove that is inwardly depressed from the upper surface of the rigid circuit board 501 , that is, the upper and lower surfaces of the rigid circuit board 501 are not connected. In the embodiment of the present application, the accommodating groove 503 is a through groove penetrating through the upper and lower ends of the rigid circuit board 501 as an example for illustration. In addition, the structural characteristics of the accommodating groove 503 may refer to the structural characteristics of the through groove 308 adopted in the foregoing embodiments, which will not be repeated here.

After the photosensitive chip 302 is embedded in the receiving groove 503 on the rigid circuit board 501 , the left and right sides of the photosensitive chip 302 are respectively connected to the rigid circuit board 501 through gold wires 70 . Due to the existence of the receiving groove 503 , the gold wires 70 on the left and right sides of the photosensitive chip 302 are electrically connected through the top and bottom of the rigid circuit board 501 . Wherein, the bottom end of the rigid circuit board 501 refers to the end connected to the first flexible circuit board 502 , and the top end of the rigid circuit board 501 refers to the end opposite to the end connected to the first flexible circuit board 502 .

The first flexible circuit board 502 extends to a position away from the photosensitive chip 302, the rigid circuit board 501 and the first flexible circuit board 502 are used to supply power to the lens assembly 301 and the photosensitive chip 302, and the first flexible circuit board 502 is used to realize photosensitive Heat dissipation of the chip 302 . The relevant characteristics of the first flexible circuit board 502 may refer to the characteristics of the flexible circuit board 306 provided in the foregoing embodiments, and details are not described here.

Fig. 12 is a schematic view of the section A-A in Fig. 11 .

In some embodiments, as shown in FIG. 12 , a reinforcing component 307 is pasted on the lower surface of the rigid circuit board 501, and the reinforcing component 307 supports the photosensitive chip 302 embedded in the receiving groove 503, and increases the rigidity of the rigid circuit board 501 . At the receiving groove 503, the reinforcing component 307 can be bonded and connected to the photosensitive chip 302 through the first adhesive layer; at the rigid circuit board 501, the reinforcing component 307 can be bonded and connected to the rigid circuit board 501 through the second adhesive layer. Wherein, the first adhesive layer may be glue suitable for the photosensitive chip 302 , and the second glue layer may be glue suitable for the rigid circuit board 501 . The first adhesive layer and/or the second adhesive layer may also use the adhesive layer 303 used in the foregoing embodiments.

The rigid circuit board 501 may be a PCB board, so the thickness of the rigid circuit board 501 may be relatively large. The rigid circuit board 501 is provided with a receiving groove 503, and the photosensitive chip 302 is inserted into the rigid circuit board 501 through the receiving groove 503, so that the height of the camera module 30 can be reduced by the height corresponding to the thickness of the rigid circuit board 501. Exemplarily, if the height of the rigid circuit board 501 is 0.3 mm, the height H ₃₀ of the camera module 30 will be reduced by 0.3 mm, thereby reducing the thickness H ₁₀₁ of the first casing 101 in the electronic device 100 .

In the camera module 30 provided in the embodiment of the present application, the printed circuit board 50 composed of a rigid circuit board 501 and a first flexible circuit board 502 replaces the commonly used rigid board 304 . The rigid circuit board 501 and the photosensitive chip 302 adopt an embedded layout method, and the heat dissipation of the photosensitive chip 302 is realized by the first flexible circuit board 502, and the heat dissipation component 60 is canceled to reduce the width W ₃₀ of the camera module 30, thereby reducing the electronic device 100. The thickness H ₁₀₁ of the first housing 101 in the middle is to realize the requirement of lightness and thinness.

FIG. 13 is a schematic structural diagram of a second type of printed circuit board 50 provided by the embodiment of the present application.

In some embodiments, as shown in FIG. 13 , the difference between the structure of the printed circuit board 50 provided by the embodiment of the present application and the printed circuit board 50 shown in FIG. 11 is that the printed circuit board 50 provided by the embodiment of the present application It also includes a second flexible circuit board 504, and other structural features can refer to the content of the printed circuit board 50 shown in FIG. 11 , which will not be repeated here.

The second flexible circuit board 504 is disposed on the top of the rigid circuit board 501 such that opposite ends of the rigid circuit board 501 are respectively connected to the first flexible circuit board 502 and the second flexible circuit board 504 . The first flexible circuit board 502 , the rigid circuit board 501 and the second flexible circuit board 504 can be integrally formed.

Referring to FIG. 11 again, after the photosensitive chip 302 is embedded in the receiving groove 503 on the rigid circuit board 501, since the gold wires 70 on the left and right sides of the photosensitive chip 302 are electrically connected through the top and bottom ends of the rigid circuit board 501, a rigid circuit board is required. The top and bottom of the 501 have enough room for electrical connections. In this way, the width W ₅₀₁ of the rigid circuit board 501 will increase, thereby increasing the width W 30 of the camera module ₃₀ .

In order to ensure the electrical connection of the gold wires 70 on the left and right sides of the photosensitive chip 302 and to reduce the width W ₅₀₁ of the rigid circuit board 501 , in the embodiment of the present application, the second flexible circuit board 504 implements the gold wires 70 on the left and right sides of the photosensitive chip 302 . Electrical connection of wire 70. In this way, the top and bottom widths of the rigid circuit board 501 can be reduced to reduce the width W ₅₀₁ of the rigid circuit board 501 , thereby reducing the width W 30 of the camera module ₃₀ . Wherein, the top width refers to the distance between the top of the receiving groove 503 and the top of the rigid circuit board 501 , and the bottom width refers to the distance between the bottom of the receiving groove 503 and the bottom of the rigid circuit board 501 .

11 and FIG. 13, in the electrical connection scheme of the gold wires 70 on the left and right sides of the photosensitive chip 302 realized by the top and bottom ends of the rigid circuit board 501 illustrated in FIG. 11, the width of the top of the rigid circuit board 501 is L ₁₁ , and the bottom width of the rigid circuit board 501 is L ₁₂ . In the electrical connection scheme in which the gold wires 70 on the left and right sides of the photosensitive chip 302 are realized by the second flexible circuit board 504 illustrated in _FIG . L ₂₂ . Wherein, L ₂₁ <L ₁₁ , L ₂₂ <L ₁₂ .

FIG. 14 is a schematic structural diagram of a second flexible circuit board 504 in a bent state provided by an embodiment of the present application.

In some embodiments, as shown in FIG. 14 , the second flexible circuit board 504 can be bent in any direction. Exemplarily, when the rigid circuit board 501 is placed horizontally, the second flexible circuit board 504 can be bent upwards, and the bent second flexible circuit board 504 can be vertical to the rigid circuit board 501 .

The second flexible circuit board 504 can be bent toward the height direction of the camera module 30, while ensuring that the second flexible circuit board 504 realizes the electrical connection of the gold wires 70 on the left and right sides of the photosensitive chip 302, and reduces the size of the rigid circuit board 501. The width W ₅₀₁ of the camera module 30 is reduced further to reduce the width W ₃₀ of the camera module 30 . At the same time, without affecting the width _W30 of the camera module 30, the second flexible circuit board 504 can be provided with a large-area structure, and made of heat-dissipating materials such as copper, so as to increase the number of photosensitive chips 302 through the second flexible circuit board 504. cooling effect.

In the camera module 30 provided in the embodiment of the present application, the printed circuit board 50 composed of a rigid circuit board 501 and a first flexible circuit board 502 replaces the commonly used rigid board 304 . Embedding the photosensitive chip 302 into the rigid circuit board 501 can reduce the height of the camera module 30 and reduce the thickness H ₁₀₁ of the first casing 101 in the electronic device 100 , so as to realize the requirement of lightness and thinning. At the same time, setting the second flexible circuit board 504 on the top of the rigid circuit board 501 can reduce the width W ₅₀₁ of the rigid circuit board 501 , thereby reducing the width W ₃₀ of the camera module 30 and lowering the first housing in the electronic device 100 The top width of 101 is W ₁₀₁ to meet the requirement of a narrow frame.

It should be noted that other embodiments of the present application will be readily conceivable to those skilled in the art after considering the specification and practicing the application disclosed herein. This application is intended to cover any modification, use or adaptation of the application, these modifications, uses or adaptations follow the general principles of the application and include common knowledge or conventional technical means in the technical field not disclosed in the application . The specification and examples are to be considered exemplary only, with a true scope and spirit of the application indicated by the following claims.

It should be understood that the present application is not limited to the precise constructions which have been described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims (10)

1. A camera module, comprising:

a lens assembly (301);

the photosensitive chip (302), one end of the photosensitive chip (302) is connected with the lens assembly (301) in a bonding way;

the flexible circuit board (306), one end of the flexible circuit board (306) is connected with the other end of the photosensitive chip (302) in a bonding mode, the other end of the flexible circuit board (306) extends to a position far away from the photosensitive chip (302), the flexible circuit board (306) is used for supplying power to the lens assembly (301) and the photosensitive chip (302), and the flexible circuit board (306) is used for achieving heat dissipation of the photosensitive chip (302); wherein,,

the flexible circuit board (306) comprises a first part (3061), a second part (3062) and a bending part (3063), the first part (3061) is in fit connection with the other end of the photosensitive chip (302), the bending part (3063) is connected between the first part (3061) and the second part (3062), the bending part (3063) extends to a rear shell of the electronic device from a direction close to the photosensitive chip (302) to a direction far away from the photosensitive chip (302) so as to change the relative positions of the first part (3061) and the second part (3062), and the second part (3062) extends from the inner side of the rear shell of the electronic device to a direction far away from the photosensitive chip (302);

the first portion (3061) is used for absorbing heat emitted by the photosensitive chip (302) and transmitting the heat to the second portion (3062) through the bending portion (3063), and the second portion (3062) transmits the heat to the rear shell.

2. The camera module according to claim 1, further comprising a stiffening member (307);

the reinforcing component (307) is in fit connection with the flexible circuit board (306) through the adhesive layer (303), and the reinforcing component (307) is used for increasing the rigidity of the flexible circuit board (306).

3. The camera module of claim 2, wherein the camera module comprises a camera module having a camera module body,

the first portion (3061) is located between the photosensitive chip (302) and the reinforcing member (307).

4. A camera module according to claim 3, wherein the upper surface of the first portion (3061) is in abutting connection with the light sensitive chip (302), and the lower surface of the first portion (3061) is in abutting connection with the reinforcement member (307).

5. A camera module according to claim 3, wherein the flexible circuit board (306) further comprises a through slot (308);

the through groove (308) is positioned on the first part (3061) at a position corresponding to the photosensitive chip (302), and the through groove (308) is used for accommodating the photosensitive chip (302);

the photosensitive chip (302) is attached to the reinforcing member (307) through the through groove (308).

6. A camera module, comprising:

a lens assembly (301);

the photosensitive chip (302), one end of the photosensitive chip (302) is connected with the lens assembly (301) in a bonding way;

a printed circuit board (50), wherein the printed circuit board (50) is connected with the other end of the photosensitive chip (302);

the printed circuit board (50) comprises a hard circuit board (501) and a first flexible circuit board (502), the first flexible circuit board (502) is connected to the first end of the hard circuit board (501), a containing groove (503) is formed in the hard circuit board (501), and the other end of the photosensitive chip (302) is embedded into the containing groove (503);

the first flexible circuit board (502) extends to a position far away from the photosensitive chip (302), the hard circuit board (501) and the first flexible circuit board (502) are used for supplying power to the lens assembly (301) and the photosensitive chip (302), and the first flexible circuit board (502) is used for realizing heat dissipation of the photosensitive chip (302); wherein,,

the printed circuit board (50) further comprises a second flexible circuit board (504), the second flexible circuit board (504) is connected to a second end of the hard circuit board (501), the second end is opposite to the first end, and the second flexible circuit board (504) is used for increasing heat dissipation area;

both sides of the photosensitive chip (302) comprise gold wires (70), the gold wires (70) are electrically connected through the second flexible circuit board (504), and the second flexible circuit board (504) is bent relative to the hard circuit board (501) so as to reduce the total width of the second flexible circuit board (504) and the hard circuit board (501);

the width of the second flexible circuit board (504) is greater than the width of the photosensitive chip (302).

7. The camera module according to claim 6, wherein the photosensitive chip (302) is connected to the hard circuit board (501) through the gold wire (70).

8. Camera module according to any of claims 6-7, further comprising a stiffening member (307);

the reinforcing component (307) is in fit connection with the hard circuit board (501) through the adhesive layer (303), and the reinforcing component (307) is used for increasing the rigidity of the hard circuit board (501).

9. The camera module according to claim 8, wherein the accommodating groove (503) penetrates through the upper and lower ends of the rigid circuit board (501), and the photosensitive chip (302) penetrates through the accommodating groove (503) and is attached to the reinforcing member (307).

10. An electronic device, comprising:

the camera module comprises a first shell (101), wherein the first shell (101) comprises a front shell (10) and a rear shell (20), the front shell (10) is buckled on the rear shell (20) to form a closed cavity, and the closed cavity comprises the camera module (30) according to any one of claims 1-9.