CN115377332A - Method for manufacturing light-emitting device and method for manufacturing display panel - Google Patents

Abstract

The invention relates to a method for preparing a light-emitting device and a method for preparing a display panel. In the manufacturing method of the light-emitting device, a peeling layer is formed on the surface of the first pixel defining layer away from the substrate, and then a functional layer is formed in the pixel unit. After the functional layer is formed, the peeling layer is removed, and at this time the height difference between the functional layer and the first pixel defining layer is small or the functional layer can be flush with the first pixel defining layer. Then when the electrode layer is formed on the surface of the functional layer and the first pixel defining layer, the electrode layer does not need to cover the steps formed due to the large height difference, so that the electrode layer can be formed stably, and each part of the electrode layer can be kept uniform. The thickness can effectively improve the thickness uniformity of the electrode layer and improve the display performance of the display panel.

Description

Method for manufacturing light-emitting device and method for manufacturing display panel

technical field

The invention relates to the technical field of display panels, in particular to a method for preparing a light-emitting device and a method for preparing a display panel.

Background technique

Organic light-emitting diodes (OLEDs) are widely used in light-emitting devices due to their advantages of active light emission, thinness, low power consumption, and large viewing angle. In the preparation process of the light-emitting device, ink can be printed into the pixel unit formed by the pixel defining layer by inkjet printing to obtain the corresponding functional layer, and then an electrode layer is formed on the surface of the functional layer. Through such a preparation method, it can be compared Light emitting devices are conveniently obtained.

However, please refer to FIG. 1 , which shows a light-emitting device 100 obtained by a conventional method. The light-emitting device 100 includes a substrate 101 and a pixel defining layer 102 on the substrate 101. The pixel defining layer 102 forms a pixel unit 103. The pixel unit 103 has a functional layer 104 inside, and the surface of the functional layer 104 and the pixel defining layer 102 has an electrode layer 105 . In the light-emitting device 100, there is a large height difference between the functional layer 104 and the edge of the pixel defining layer 102, so that when the electrode layer 105 is fabricated, the electrode layer 105 needs to cover the steps formed by the large height difference. Defects such as discontinuity and thinning of the electrode layer 105 at the step are prone to occur, resulting in uneven thickness of the electrode layer 105 , which may adversely affect the display of the device.

Contents of the invention

Based on this, it is necessary to provide a method for manufacturing a light-emitting device and a method for manufacturing a display panel that can effectively improve the thickness uniformity of an electrode layer.

In order to solve the above technical problems, the technical solution of the present application is:

A method for preparing a light-emitting device, comprising the steps of:

forming a first pixel defining layer with an opening on the substrate, the sidewall of the opening and the surface of the substrate forming a pixel unit;

forming a peeling layer on the surface of the first pixel defining layer away from the substrate;

forming a functional layer in the pixel unit, the thickness of the functional layer is less than or equal to the thickness of the first pixel defining layer;

The peel layer is removed.

In one of the embodiments, the following steps are further included before forming the functional layer in the pixel unit:

Hydrophilic treatment is performed on the sidewall of the opening.

In one embodiment, before forming the functional layer in the pixel unit, the following step is further included: performing hydrophobic treatment on the sidewall of the peeling layer.

In one of the embodiments, the peeling layer is made of magnetic material.

In one of the embodiments, removing the peeling layer comprises the following steps:

The peeling layer is arranged towards the magnetic piece, and the peeling layer is removed under the attraction of the magnetic piece.

In one of the embodiments, when the peeling layer is removed, the following steps are also included before the peeling layer is arranged towards the magnetic member:

The substrate is subjected to heat treatment, and the temperature of the substrate is controlled to be 100° C. to 300° C.

In one of the embodiments, the absolute value of the difference between the angle formed by the sidewall of the peeling layer and the surface of the substrate and the angle formed by the sidewall of the first pixel defining layer and the surface of the substrate is less than or equal to 30°.

In one of the embodiments, the following steps are further included before forming the functional layer in the pixel unit:

A second pixel defining layer is formed on the surface of the peeling layer away from the first pixel defining layer, and the angle formed between the sidewall of the second pixel defining layer and the surface of the substrate is the same as that of the first pixel defining layer. The absolute value of the difference of the included angle formed by the side wall and the surface of the substrate is less than or equal to 30°.

In one embodiment, the first pixel defining layer has a thickness of 300nm-700nm, and the peeling layer has a thickness of 200nm-500nm.

A method for manufacturing a display panel, the display panel including a light emitting device, the method for manufacturing a display panel includes the method for manufacturing a light emitting device as described in any one of the above embodiments.

In the above method of manufacturing a light-emitting device, a peeling layer is formed on the surface of the first pixel defining layer away from the substrate, and then a functional layer is formed in the pixel unit. In this process, the thickness of the first pixel defining layer can be set so that the thickness of the functional layer is equal to or slightly smaller than the thickness of the first pixel defining layer to ensure that the functional layer can be completely located in the area defined by the first pixel defining layer. In the pixel unit, it can effectively avoid problems such as color mixing caused by ink overflowing the pixel unit during the printing process, and ensure the display performance of the light-emitting device. After the functional layer is formed, the peeling layer is removed, and at this time the height difference between the functional layer and the first pixel defining layer is small or the functional layer can be flush with the first pixel defining layer. Then when the electrode layer is formed on the surface of the functional layer and the first pixel defining layer, the electrode layer does not need to cover the steps formed due to the large height difference, so that the electrode layer can be formed stably, and each part of the electrode layer can be kept uniform. The thickness can effectively improve the thickness uniformity of the electrode layer and improve the display performance of the light emitting device.

Description of drawings

Fig. 1 is a schematic diagram of defects such as discontinuity and thinning of the electrode layer in the light-emitting device obtained by the traditional preparation method;

Fig. 2 is a schematic structural diagram of a light emitting device in an embodiment of the present invention;

FIG. 3 is a schematic diagram of forming a first pixel defining layer in the manufacturing method of the light emitting device corresponding to FIG. 2;

Fig. 4 is a schematic diagram of forming a peeling layer in the preparation method corresponding to Fig. 3;

Fig. 5 is a schematic diagram of forming a functional layer in the preparation method corresponding to Fig. 4;

6 is a schematic diagram of forming a second pixel defining layer in the preparation method corresponding to FIG. 3;

Fig. 7 is a schematic diagram of forming a functional layer in the preparation method corresponding to Fig. 6;

Fig. 8 is a schematic diagram when the peeling layer is removed in the preparation method corresponding to Fig. 6;

FIG. 9 is a schematic diagram after removing the peeling layer in the preparation method corresponding to FIG. 6 .

Instructions for marks in the figure:

100. Light emitting device; 101. Substrate; 102. Pixel defining layer; 103. Pixel unit; 104. Functional layer; 105. Electrode layer; 200. Light emitting device; 201. Substrate; 202. First pixel defining layer; 203. Opening ; 204, a peeling layer; 205, a second pixel defining layer; 206, a functional layer; 207, a first electrode layer; 300, a magnet.

Detailed ways

In order to make the above objects, features and advantages of the present invention more obvious and comprehensible, specific implementations of the present invention will be described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

In the present invention, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to FIG. 2 , an embodiment of the present invention provides a light emitting device 200 . The light emitting device 200 includes a substrate 201 , a first pixel defining layer 202 , a functional layer 206 and a first electrode layer 207 . The first pixel defining layer 202 has an opening, and the sidewall of the opening and the surface of the substrate 201 form a pixel unit. The functional layer 206 is located in the pixel unit, and the thickness of the functional layer 206 is less than or equal to the thickness of the first pixel defining layer 202 . The first electrode layer 207 is located on the surface of the functional layer 206 and the first pixel defining layer 202 . It can be understood that the number of the first pixel defining layers 202 shown in FIG. 2 is five. In an actual light emitting device, the first pixel defining layer is determined according to the design requirements of the panel.

In the light emitting device 200 of this embodiment, the height difference between the functional layer 206 and the first pixel defining layer 202 is very small or the functional layer 206 is flush with the first pixel defining layer 202, so that when the first electrode layer 207 is formed, The first electrode layer 207 does not need to cover the steps formed by the large height difference, and the first electrode layer 207 has good thickness uniformity.

Further, another embodiment of the present invention provides a method for manufacturing the above-mentioned light emitting device 200 . This preparation method comprises the steps:

S101 : Form a first pixel defining layer 202 having an opening 203 on the substrate 201 , and a sidewall of the opening 203 and a surface of the substrate 201 form a pixel unit. At this time, the structure of the light emitting device is shown in FIG. 3 .

S102 : Form a peeling layer 204 on the surface of the first pixel defining layer 202 away from the substrate 201 . As shown in Figure 4.

S103: Form a functional layer 206 in the pixel unit, the thickness of the functional layer 206 is less than or equal to the thickness of the first pixel defining layer 202 . At this time, the structure of the light emitting device is shown in FIG. 5 .

S104: Remove the peeling layer 204. The structure of the light emitting device at this time is shown in FIG. 9 .

Further, after removing the peeling layer 204, the following steps are also included:

S105: Form a first electrode layer 207 on the surface of the functional layer 206 and the first pixel defining layer 202 . At this time, the structure of the light emitting device is shown in FIG. 2 .

It can be understood that, in the light emitting device 200, the thickness of the functional layer 206 is generally 200nm˜700nm. The functional layer 206 refers to a functional layer that does not include an electrode layer. Specifically, the functional layer 206 includes but is not limited to a hole injection layer, a hole transport layer, an electron blocking layer, a light emitting layer, a hole blocking layer, an electron transport layer, an electron injection layer, and a light extraction layer. The thickness of the functional layer 206 refers to the thickness after removing the electrode layer, which includes but is not limited to the thickness of the hole injection layer, the thickness of the hole transport layer, the thickness of the electron blocking layer, the thickness of the light emitting layer, and the thickness of the hole blocking layer. thickness, the thickness of the electron transport layer, the thickness of the electron injection layer and the thickness of the light extraction layer. During the inkjet printing process, the corresponding functional ink is injected into the pixel unit to obtain the required functional layer 206 . It can also be understood that in different pixel units, the functional layer may have different thicknesses, for example, in the red pixel unit, green pixel unit and blue pixel unit, the functional layers with appropriate thicknesses can be independently selected according to the design requirements , so that the functional layers in the red pixel unit, the green pixel unit and the blue pixel unit have the same or different thicknesses.

In the manufacturing method of the light emitting device 200 in this embodiment, the peeling layer 204 is formed on the surface of the first pixel defining layer 202 away from the substrate 201 , and then the functional layer 206 is formed in the pixel unit. In this process, the thickness of the first pixel defining layer 202 can be set so that the thickness of the functional layer 206 is equal to or slightly smaller than the thickness of the first pixel defining layer 202 so as to ensure that the functional layer 206 can be completely positioned on the first pixel defining layer. In the pixel units defined by the layer 202 , problems such as color mixing caused by ink overflowing the pixel units during the printing process are avoided, and the display performance of the light emitting device 200 is ensured. After the functional layer 206 is formed, the peeling layer 204 is removed. At this time, the height difference between the functional layer 206 and the first pixel defining layer 202 is small or the functional layer 206 can be flush with the first pixel defining layer 202 . Then the first electrode layer 207 is formed on the surface of the functional layer 206 and the first pixel defining layer 202. At this time, the first electrode layer 207 does not need to cover the steps formed due to the large height difference, so that the first electrode layer 207 is stably formed, and keeps each part of the first electrode layer 207 uniform in thickness, effectively improving the thickness uniformity of the first electrode layer 207 and improving the display performance of the light emitting device 200 .

In a specific example, before forming the first pixel defining layer 202 with the opening 203 on the substrate 201, the following steps are further included: forming a second electrode layer (not shown in the figure) on the substrate 201, so that the functional layer 206 can on the surface of the second electrode. During the preparation process of the light emitting device 200 , the second electrode layer is formed on the substrate 201 , and the second electrode layer cooperates with the first electrode layer 207 to form a conductive circuit, so that the light emitting device 200 can display normally.

It can be understood that, in some specific light emitting devices, the first electrode is a cathode, and the corresponding second electrode is an anode. Optionally, the material of the cathode is one or more of indium zinc oxide, indium tin oxide and zinc oxide. The anode is indium tin oxide. Optionally, the first electrode is a transparent electrode.

As a preferred solution, before forming the functional layer 206 in the pixel unit, the following step is further included: performing hydrophilic treatment on the sidewall of the opening 203 . The side wall of the opening 203 is hydrophilized, which is beneficial to reduce the diffusion effect of the ink along the side wall of the opening 203, so that the ink can be better stabilized in the pixel unit, improve the stability of the ink in the pixel unit, and make the pixel unit more stable. The amount of ink is more in line with the theoretical value, thereby improving the accuracy of inkjet printing. It can be understood that after the hydrophilization treatment, the contact angle of the sidewall of the opening 203 is less than 90°.

Further preferably, the following step is further included before forming the functional layer 206 in the pixel unit: performing hydrophobic treatment on the sidewall of the peeling layer 204 . Hydrophobizing the sidewall of the release layer 204 can effectively prevent the ink from adhering to the sidewall of the release layer 204, further confine the ink to the pixel unit formed by the first pixel defining layer 202, and further improve the ink flow in the pixel unit. The internal stability makes the amount of ink in the pixel unit more in line with the theoretical value, further improving the accuracy of inkjet printing. It can be understood that after the hydrophobization treatment, the contact angle of the sidewall of the peeling layer 204 is greater than 90°.

Optionally, when the sidewall of the opening 203 is hydrophilized, the sidewall of the opening 203 can be hydrophilized according to the material of the first pixel defining layer 202 by means of UV irradiation, ozone activation, and attachment of hydrophilic materials. deal with. Optionally, when the sidewall of the peeling layer 204 is hydrophobized, the sidewall of the peeling layer 204 can be hydrophobized by UV irradiation, ozone activation, and hydrophobic material attachment according to the material of the peeling layer 204 .

As one of the examples of the peeling layer 204, the material of the peeling layer 204 is a magnetic material. It can be understood that the magnetic material refers to a material that can be attracted by a magnetic piece. Specifically, the material of the peeling layer 204 may be at least one of iron, iron-containing alloys, cobalt, cobalt-containing alloys, nickel, and nickel-containing alloys. At this time, please refer to FIG. 8 , removing the peeling layer 204 includes the following steps: disposing the peeling layer 204 toward the magnetic element, and removing the peeling layer 204 under the attraction of the magnetic element. Wherein, the magnetic member may be a magnet 300 . Under the attraction of the magnet 300 , the peeling layer 204 is attracted by the magnet 300 , so that the peeling layer 204 moves toward the magnet 300 , and then the peeling layer 204 can be removed, and the peeling layer 204 is separated from the first pixel defining layer 202 . Preferably, when removing the peeling layer 204 , before arranging the peeling layer toward the magnetic element, the following steps are further included: heating the substrate 201 , and controlling the temperature of the substrate 201 to be 100°C-300°C. By heating the substrate 201 , the binding force between the peeling layer 204 and the first pixel defining layer 202 can be reduced, so that the peeling layer 204 can be separated from the first pixel defining layer 202 more easily. Specifically, the temperature of the substrate 201 cannot exceed the withstand temperature of the functional layer 206 , the first pixel defining layer 202 and the substrate 201 . More specifically, when the peeling layer 204 is removed, the movement of the substrate is controlled, and the peeling layer 204 is removed during the moving process of the substrate, so as to improve the removal efficiency of the peeling layer 204 .

It can be understood that when removing the peeling layer 204 , the peeling layer 204 can be removed in a corresponding manner according to the material of the peeling layer 204 . For example, the peeling layer 204 can be removed by means of sublimation, cracking, liquefaction, dissolution, etc. according to the material of the peeling layer 204 .

In a specific example, the absolute value of the difference between the angle formed by the sidewall of the peeling layer 204 and the surface of the substrate 201 and the angle formed by the sidewall of the first pixel defining layer 202 and the surface of the substrate 201 is less than or equal to 30° . Preferably, the angle formed by the sidewall of the peeling layer 204 and the surface of the substrate 201 is equal to the angle formed by the sidewall of the first pixel defining layer 202 and the surface of the substrate 201 . Please refer to FIG. 4 again, the angle formed between the sidewall of the peeling layer 204 and the surface of the substrate 201 is β, the angle formed between the sidewall of the first pixel defining layer 202 and the surface of the substrate 201 is α, and the difference between β and α is The absolute value is less than or equal to 30°. Optionally, the absolute value of the difference between β and α is 0, 2°, 5°, 10°, 15°, 20° or 25°. When β and α are equal, the sidewalls of the peeling layer 204 and the sidewalls of the first pixel defining layer 202 have the same inclination angle, and the sidewalls of the first pixel defining layer 202 and the sidewalls of the peeling layer 204 are located on the same plane. In this way, the ink can enter the pixel unit more smoothly during printing, and the consistency of solvent volatilization can be improved in the subsequent drying process, which is beneficial to maintain the stability of the functional layer 206 in the pixel unit.

It can be understood that the angle formed between the sidewall of the first pixel defining layer 202 and the surface of the substrate 201 is less than or equal to 90°. Preferably, the angle formed between the sidewall of the first pixel defining layer 202 and the surface of the substrate 201 is 70°-90°. For example, the angle formed between the sidewall of the first pixel defining layer 202 and the surface of the substrate 201 may be, but not limited to, 70°, 71°, 72°, 73°, 74°, 75°, 76°, 77°, 78° °, 79°, 80°, 81°, 82°, 83°, 84°, 85°, 86°, 87°, 88°, 89°, or 90°.

Referring to FIG. 6 , in a specific example, the following step is further included before forming the functional layer 206 in the pixel unit: forming a second pixel defining layer 205 on the surface of the release layer 204 away from the first pixel defining layer 202 . In the case of being limited by the manufacturing process or manufacturing cost, the thickness of the peeling layer 204 may be difficult to reach the actual required thickness. , the thickness of the peeling layer 204 can be effectively compensated to achieve the effect that the ink does not overflow during the printing process.

It can be understood that the absolute value of the difference between the angle formed by the sidewall of the second pixel defining layer 205 and the surface of the substrate 201 and the angle formed by the sidewall of the first pixel defining layer 202 and the surface of the substrate 201 is less than or equal to 30 °. Preferably, the angle formed between the sidewall of the second pixel defining layer 205 and the surface of the substrate 201 is equal to the angle formed between the sidewall of the first pixel defining layer 202 and the surface of the substrate 201 . In FIG. 6 , the angle formed between the sidewall of the second pixel defining layer 205 and the surface of the substrate 201 is γ, the angle formed between the sidewall of the first pixel defining layer 202 and the surface of the substrate 201 is α, and the difference between γ and α The absolute value of the value is less than or equal to 30°. Optionally, the absolute value of the difference between γ and α is 0, 2°, 5°, 10°, 15°, 20° or 25°. When γ is equal to α. At this time, the sidewalls of the second pixel defining layer 205 and the sidewalls of the first pixel defining layer 202 have the same inclination angle, and the sidewalls of the second pixel defining layer 205 and the sidewalls of the first pixel defining layer 202 are located on the same plane , which is beneficial to maintain the stability of the functional layer 206 in the pixel unit.

It can also be understood that, before forming the functional layer 206 in the pixel unit, the following step is further included: performing hydrophobic treatment on the sidewall of the second pixel defining layer 205 . Hydrophobizing the sidewall of the second pixel defining layer 205 can effectively prevent the ink from adhering to the sidewall of the second pixel defining layer 205, and can further confine the ink in the pixel unit formed by the first pixel defining layer 202, Improve the stability of the ink in the pixel unit, make the amount of ink in the pixel unit more consistent with the theoretical value, and further improve the accuracy of inkjet printing. It can be understood that after the hydrophobization treatment, the contact angle of the sidewall of the second pixel defining layer 205 is greater than 90°.

Optionally, when performing hydrophobic treatment on the sidewall of the second pixel defining layer 205, the sidewall of the peeling layer 204 can be treated by UV irradiation, ozone activation, and hydrophobic material attachment according to the material of the second pixel defining layer 205. Perform hydrophobization treatment.

It can be understood that when the second pixel defining layer 205 exists, the second pixel defining layer 205 needs to be removed when removing the peeling layer 204 . Preferably, when the peeling layer 204 is removed, the second pixel defining layer 205 is removed at the same time. For example, when the material of the peeling layer 204 is a magnetic material, and the peeling layer 204 is removed in the manner shown in FIG. .

Further, the material of the first pixel defining layer 202 is the same as that of the second pixel defining layer 205 . At this time, the sidewall of the first pixel defining layer 202 may be subjected to hydrophilic treatment in different ways, and the sidewall of the second pixel defining layer 205 may be subjected to hydrophobic treatment.

It should be noted that, regarding the formation method of the first pixel defining layer 202 and the peeling layer 204, the first pixel defining layer 202 and the peeling layer 204 can be stacked on the substrate 201 first, and then the pixel unit is formed by etching. It is also possible to form pixel units on the first pixel defining layer 202 by etching first, and then process the peeling layer 204 on the first pixel defining layer 202 .

When the second pixel defining layer 205 exists, the first pixel defining layer 202 , the peeling layer 204 and the second pixel defining layer 205 can be laminated on the substrate 201 firstly, and then the pixel unit can be formed by etching. It is also possible to first form pixel units on the first pixel defining layer 202 by etching, and then sequentially process on the first pixel defining layer 202 to obtain the peeling layer 204 and the second pixel defining layer 205 .

In a specific example, when the second pixel defining layer 205 exists, the manufacturing method of the light emitting device 200 includes the following steps:

S201 : Form a first pixel defining layer 202 having an opening 203 on the substrate 201 ; the sidewalls of the opening 203 and the surface of the substrate 201 form a pixel unit. At this time, the structure of the light emitting device 200 is as shown in FIG. 3 .

S202 : Form a peeling layer 204 on the surface of the first pixel defining layer 202 away from the substrate 201 . At this time, the structure of the light emitting device 200 is as shown in FIG. 4 .

S203: Form a second pixel defining layer 205 on the surface of the peeling layer 204 away from the first pixel defining layer 202 . At this time, the structure of the light emitting device 200 is as shown in FIG. 6 .

S204: Form a functional layer 206 in the pixel unit, the thickness of the functional layer 206 is less than or equal to the thickness of the first pixel defining layer 202 . At this time, the structure of the light emitting device 200 is as shown in FIG. 7 .

S205: Remove the peeling layer 204 and the second pixel defining layer 205. At this time, the structure of the light emitting device 200 is as shown in FIG. 9 .

S206: Form a first electrode layer 207 on the surfaces of the functional layer 206 and the first pixel defining layer 202 . At this time, the structure of the light emitting device 200 is as shown in FIG. 2 .

It can be understood that the thickness of the first pixel defining layer 202 is 300nm˜700nm. For example, the thickness of the first pixel defining layer 202 can be but not limited to 300nm, 350nm, 400nm, 450nm, 500nm, 550nm, 600nm, 650nm or 700nm. The peeling layer 204 has a thickness of 200 nm to 500 nm. For example, the thickness of the peeling layer 204 can be but not limited to 300nm, 250nm, 300nm, 350nm, 400nm, 450nm or 500nm. The thickness of the second pixel defining layer 205 is 100 nm˜500 nm. For example, the thickness of the second pixel defining layer 205 may be, but not limited to, 100 nm, 150 nm, 200 nm, 250 nm, 300 nm, 350 nm, 400 nm, 450 nm or 500 nm. The thickness of the first electrode layer 207 is 15nm˜25nm. For example, the thickness of the first electrode layer 207 may be but not limited to 15nm, 18nm, 20nm, 22nm or 25nm. It can also be understood that, in the actual manufacturing process, the corresponding thicknesses of the first pixel defining layer 202 , the peeling layer 204 , the second pixel defining layer 205 and the first electrode layer 207 can be selected according to the thickness of the functional layer 206 .

Still another embodiment of the present invention provides a method for manufacturing a display panel, where the display panel includes a light-emitting device, and the method for manufacturing the display panel includes the method for manufacturing the above-mentioned light-emitting device.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be determined by the appended claims, and the description and drawings can be used to explain the content of the claims.

Claims (10)

1. A method for preparing a light-emitting device, comprising the steps of: forming a first pixel defining layer with an opening on the substrate, the sidewall of the opening and the surface of the substrate forming a pixel unit; forming a peeling layer on the surface of the first pixel defining layer away from the substrate; forming a functional layer in the pixel unit, the thickness of the functional layer is less than or equal to the thickness of the first pixel defining layer; The peel layer is removed. 2. The method for manufacturing a light-emitting device according to claim 1, further comprising the following steps before forming a functional layer in the pixel unit: Hydrophilic treatment is performed on the sidewall of the opening. 3. The method for manufacturing a light-emitting device according to claim 1, further comprising the following steps before forming a functional layer in the pixel unit: Hydrophobizing treatment is performed on the sidewall of the peeling layer. 4. The method for manufacturing a light-emitting device according to claim 1, wherein the material of the peeling layer is a magnetic material. 5. The method for manufacturing a light-emitting device according to claim 4, wherein removing the peeling layer comprises the following steps: The peeling layer is arranged towards the magnetic piece, and the peeling layer is removed under the attraction of the magnetic piece. 6. The method for manufacturing a light-emitting device according to claim 5, wherein when removing the peeling layer, the step of arranging the peeling layer toward the magnetic member further comprises the following steps: The substrate is subjected to heat treatment, and the temperature of the substrate is controlled to be 100° C. to 300° C. 7. The method for manufacturing a light-emitting device according to any one of claims 1 to 6, wherein the angle formed between the side wall of the peeling layer and the surface of the substrate is the same as the side of the first pixel defining layer. The absolute value of the difference of the included angle formed by the wall and the surface of the substrate is less than or equal to 30°. 8. The method for manufacturing a light-emitting device according to any one of claims 1 to 6, further comprising the following steps before forming a functional layer in the pixel unit: A second pixel defining layer is formed on the surface of the peeling layer away from the first pixel defining layer, and the angle formed between the sidewall of the second pixel defining layer and the surface of the substrate is the same as that of the first pixel defining layer. The absolute value of the difference of the included angle formed by the side wall and the surface of the substrate is less than or equal to 30°. 9 . The method for manufacturing a light emitting device according to claim 1 , wherein the first pixel defining layer has a thickness of 300 nm to 700 nm, and the peeling layer has a thickness of 200 nm to 500 nm. 10. A method for manufacturing a display panel, characterized in that the display panel comprises a light emitting device, and the method for manufacturing a display panel comprises the method for manufacturing a light emitting device according to any one of claims 1-9.

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