CN115323451A - 一种塑料薄膜表面电镀铜的方法 - Google Patents
一种塑料薄膜表面电镀铜的方法 Download PDFInfo
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 239000010949 copper Substances 0.000 title claims abstract description 55
- 239000002985 plastic film Substances 0.000 title claims abstract description 55
- 229920006255 plastic film Polymers 0.000 title claims abstract description 55
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 51
- 238000009713 electroplating Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000004140 cleaning Methods 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 239000002253 acid Substances 0.000 claims abstract description 12
- 238000007733 ion plating Methods 0.000 claims abstract description 12
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 20
- 238000005406 washing Methods 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 238000007747 plating Methods 0.000 claims description 17
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 16
- 239000003513 alkali Substances 0.000 claims description 14
- 238000000151 deposition Methods 0.000 claims description 11
- 238000001465 metallisation Methods 0.000 claims description 10
- 238000002791 soaking Methods 0.000 claims description 10
- 239000011734 sodium Substances 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 9
- 239000013077 target material Substances 0.000 claims description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- -1 polyethylene Polymers 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 230000003213 activating effect Effects 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 6
- 239000000080 wetting agent Substances 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 4
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 4
- 230000000996 additive effect Effects 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 239000012495 reaction gas Substances 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 4
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 239000004800 polyvinyl chloride Substances 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 abstract description 18
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 238000004070 electrodeposition Methods 0.000 abstract description 2
- 238000005238 degreasing Methods 0.000 abstract 1
- 238000005265 energy consumption Methods 0.000 abstract 1
- 238000004146 energy storage Methods 0.000 abstract 1
- 238000006467 substitution reaction Methods 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
- 239000002131 composite material Substances 0.000 description 13
- 239000002585 base Substances 0.000 description 8
- 238000007605 air drying Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
- 238000005282 brightening Methods 0.000 description 2
- 238000009661 fatigue test Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007655 standard test method Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WGJCBBASTRWVJL-UHFFFAOYSA-N 1,3-thiazolidine-2-thione Chemical compound SC1=NCCS1 WGJCBBASTRWVJL-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- SKOLWUPSYHWYAM-UHFFFAOYSA-N carbonodithioic O,S-acid Chemical compound SC(S)=O SKOLWUPSYHWYAM-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
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- Electroplating Methods And Accessories (AREA)
Abstract
本发明公开了一种塑料薄膜表面电镀铜的方法,属于表面处理技术领域。该方法具有生产效率高、设备简单,膜基结合力好,涂层致密度高,强度和耐久性好,附着力好,选用高酸低铜的镀液具有溶液导电性好,槽电压低,节约能耗,电沉积得到的镀层均匀细致、韧性好等特点。通过对塑料薄膜表面清洗除油、多弧离子镀使塑料薄膜表面金属化、除油、活化、电镀光亮酸性铜,获得表面平滑、光亮,与基材结合良好的薄膜铜层,可用于动力电池或者储能电池负极的集流材料,与电解铜箔等为替代关系。
Description
技术领域
本发明属于复合铜箔制备技术领域,具体而言涉及一种塑料薄膜表面电镀铜的方法。
背景技术
为了解决铜箔的安全问题,行业里面现在引入一种新的材料来代替电解铜箔,PET复合铜箔。PET复合铜箔主要由三部分组成,中间是厚度为3.6-6μm的绝缘树脂层,外面两层为厚度1μm的铜箔。制作过程为在厚度3.5~6μm的不导电的PP超薄超宽膜表面先采用真空溅镀铜的方式,制作一层20~80nm的金属层,将薄膜金属化,然后采用水介质离子置换的方式,将铜层加厚到1-2μm。与传统铜箔相比,用PET复合铜箔作为负极集流体的锂电池具有安全性高、能量密度高、寿命长的优势。
现有技术中也有一些关于复合铜箔的报道。如申请号为CN202111350391.6的发明申请中公开了一种复合导电铜箔,包括薄膜基底、设置到所述薄膜基底顶面的第一金属化层、设置到所述薄膜基底底面的第二金属化层、设置到所述第一金属化层的远离薄膜基底的一面的第一铜膜层以及设置到所述第二金属化层的远离薄膜基底的一面的第二铜膜层。所述薄膜基底为PET薄膜基底、PP薄膜基底或PI薄膜基底。还公开了该复合导电铜箔的制备方法,包括以下步骤:S2、选择宽度为0.4m-2m的薄膜作为薄膜基底;S4、在薄膜基底的顶面和底面分别通过沉积的方法沉积出第一金属化层、第二金属化层;S6、在第一金属化层的远离薄膜基底的一面、第二金属化层的远离薄膜基底的一面分别进行电镀铜处理,从而形成第一铜膜层、第二铜膜层,如此,复合导电铜箔即制备完成。
然而,现有技术中由于制备方法上的限制,导致复合铜箔的膜基结合力不理想,涂层的致密度、强度、耐久性和附着力也不够高。
发明内容
针对现有技术的不足,本发明的目的在于提供一种塑料薄膜表面电镀铜的方法,可获得表面结合力好,平整光滑、均匀性好、韧性好的复合铜层,为复合铜箔的生产提供技术借鉴。
本发明解决技术问题所采用的技术方案是:一种塑料薄膜表面电镀铜的方法,所述方法包括以下步骤:
S1、塑料薄膜基片表面清洁;所述表面清洁包括水洗、碱洗、丙酮超声清洗、水洗、晾干;
S2、多弧离子镀表面金属化;在塑料薄膜表面形成厚度为10-30nm的铜涂层,使塑料薄膜表面金属化;
S3、除油;表面金属化的塑料薄膜除油选择混合碱液浸泡5-10min,确保表面无油污;
S4、活化;
S5、电镀光亮酸性铜;选择“高酸低铜”的镀液,以硫酸铜盐、硫酸为镀液基础,加入有机组合的光亮剂与添加剂,进行二次电镀厚铜,便可得到表面电镀铜的塑料薄膜,其总厚度为5.5-8μm。
进一步地,所述塑料薄膜包括聚氯乙烯、聚乙烯、聚丙烯、聚苯乙烯以及其他树脂制成的薄膜。
进一步地,步骤S1中,所述塑料薄膜基片表面清洁具体为,纯水清洗,碱洗采用质量分数5-10%的NaOH溶液浸泡10-20min,丙酮清洗浸泡5-10min,纯水清洗,晾干。
进一步地,步骤S2中,所述多弧离子镀表面金属化具体操作条件为:基体沉积温度120-150℃、靶源电流80A、基体负偏压20V、基体沉积时间1-2min,惰性保护气体为氩气,反应气体压强与流量比为80sccm、以Cu为阴极靶材,阴极靶材发射金属蒸气,在空间中形成等离子体沉积在塑料薄膜表面形成厚度为10-30nm的Cu涂层,使塑料薄膜表面金属化,得到表面电镀铜的塑料薄膜。
进一步地,步骤S3中,所述除油采用的混合碱液组成为:NaOH:5-10g/L、Na2CO3:10-15g/L、Na2HPO4:5-10g/L。
进一步地,步骤S4中,所述活化具体为,选择质量浓度为20-30%浓盐酸,活化3-5min,两道纯水清洗。
进一步地,步骤S5中,所述“高酸低铜”的镀液组成为80-150g/L CuSO4、150-200g/L H2SO4、20-80mg/L Cl-;操作温度为55-65℃;电流密度为2500-5000A/m2;循环流量为10-15m3/h,阳极选用P含量为0.03~0.06%的磷铜饼,阴极为表面电镀铜的塑料薄膜;电镀时间依据厚度要求进行调整。
进一步地,步骤S5中,所述添加剂包括润湿剂和整平剂;所述润湿剂为1-3ml/L聚乙二醇;所述整平剂为2-5ml/L 2-四氢噻唑硫酮;所述光亮剂为3-8ml/L苯基聚二硫丙烷磺酸钠。
本发明的有益效果是:与现有技术相比,本发明提供的一种塑料薄膜表面电镀铜的方法,具有生产效率高、设备简单,而且膜基结合力好,涂层的致密度高,强度和耐久性好,附着力好等优势。
(1)塑料薄膜表面金属化选择多弧离子镀的方式,因其具有以下优势①入射粒子能量高,涂层的致密度高,强度和耐久性好,附着力好;②离化率高,一般可达60~80%;③沉积速度快、效率高、绕镀性好;④设备较为简单,整个设备主要由真空镀膜室、弧源、真空获得系统、偏压源等几大部分组成,采用低电压电源工作比较安全;⑤一弧多用,电弧既是蒸发源和离化源,又是加热源和离子溅射清洗的离子源;⑥蒸发、离化、加速都集中在阴极斑点及其附近很小的区域内,从阴极直接产生等离子体,不用熔池,阴极靶可根据工件形状在任意方向布置,使夹具大为简化,而且从实际生产应用方面比较,其突出优点是蒸镀速率快、效率高。外加磁场可以改善电弧放电,使电弧细碎,细化涂层微粒,增加带电粒子的速率,并可以改善阴极靶面刻蚀的均匀性,提高靶材的利用率等技术优势。
(2)二次电镀厚铜选用“高酸低铜”的镀液具有以下优势①溶液导电性好,槽电压低,节约电能的消耗;②具有极好的分散能力和覆盖能力,电沉积得到的镀层均匀细致、韧性好;可获得表面结合力好,平整光滑、均匀性好、韧性好的复合铜层,为复合铜箔的生产提供技术借鉴。
(3)采用多弧离子镀使塑料薄膜金属化导电,其在薄膜表面形成的铜层厚度仅为30-70纳米,且多弧离子镀能量过大时,易使薄膜变形;因此,通过二次电镀厚铜在多弧离子镀的基础上将铜层增厚。多弧离子镀与二次电镀厚铜两种方式配合使用,使得到的塑料薄膜具有更好的性能。
具体实施方式
下面通过具体实施例来进一步说明本发明。但这些实例仅用于说明本发明而不用于限制本发明的范围。
实施例1
(1)表面清洁:纯水洗-碱洗-丙酮超声清洗-水洗-晾干。碱洗选用质量分数5%的NaOH溶液浸泡20min,然后丙酮清洗浸泡10min,纯水清洗、晾干。
(2)多弧离子镀表面金属化:批量生产可选择卷对卷的方式对塑料薄膜进行多弧离子镀,使其表面金属化,将4×10-3Pa以上的真空度,接通电源。操作条件为:基体沉积温度130℃、靶源电流80A、基体负偏压20V、基体沉积时间2min,惰性保护气体为氩气,反应气体压强与流量比为80sccm、以Cu为阴极靶材,阴极靶材发射金属蒸气,在空间中形成等离子体沉积在塑料薄膜表面形成厚度为20nm的Cu涂层,使塑料薄膜表面金属化。
(3)二次除油:表面金属化的塑料薄膜除油选择混合碱液浸泡5min,确保表面无油污,混合碱液组成为:NaOH:10g/L、Na2CO3:15g/L、Na2HPO4:10g/L。
(4)活化:选择质量浓度为30%的浓盐酸,活化3min后纯水清洗。
(5)电镀酸性光亮铜:选择“高酸低铜”的镀液,以硫酸铜盐、硫酸为镀液基础,加入有机组合的光亮剂与添加剂。镀液组成为:CuSO4 80g/L、H2SO4 150g/L、Cl-20mg/L、润湿剂为聚乙二醇1ml/L、光亮剂为苯基聚二硫丙烷磺酸钠3ml/L、整平剂为2-四氢噻唑硫酮2ml/L,操作温度:55℃、电流密度:2500A/m2、循环流量10m3/h,阳极选用磷铜饼(P含量为0.03%),阴极为表面金属化的塑料薄膜,电镀时间依据厚度要求进行调整。
测试结果:
依据ASTM E345-16金属箔拉伸测试的标准试验方法测试涂层与基体间的结合力。以国产KDX-1型微机控制电子万能疲劳试验机测试铜箔力学性能。
项目 | 涂层结合力 | 抗拉强度 | 延伸率 |
参数 | 18.3N/cm | 547MPa | 6.5% |
实施例2
(1)表面清洁:纯水洗-碱洗-丙酮超声清洗-水洗-晾干。碱洗选用质量分数10%的NaOH溶液浸泡10min,然后丙酮清洗浸泡5min,纯水清洗、晾干。
(2)多弧离子镀表面金属化:批量生产可选择卷对卷的方式对塑料薄膜进行多弧离子镀,使其表面金属化,将4×10-3Pa以上的真空度,接通电源。操作条件为:基体沉积温度150℃、靶源电流80A、基体负偏压20V、基体沉积时间2min,惰性保护气体为氩气,反应气体压强与流量比为80sccm、以Cu为阴极靶材,阴极靶材发射金属蒸气,在空间中形成等离子体沉积在塑料薄膜表面形成厚度为30nm的Cu涂层,使塑料薄膜表面金属化。
(3)二次除油:表面金属化的塑料薄膜除油选择混合碱液浸泡5min,确保表面无油污,混合碱液组成为:NaOH:10g/L、Na2CO3:15g/L、Na2HPO4:10g/L。
(4)活化:选择质量浓度为30%的浓盐酸,活化3min后纯水清洗。
(5)电镀酸性光亮铜:选择“高酸低铜”的镀液,以硫酸铜盐、硫酸为镀液基础,加入有机组合的光亮剂与添加剂。镀液组成为:CuSO4 100g/L、H2SO4 200g/L、Cl-80mg/L、润湿剂为聚乙二醇3ml/L、光亮剂为苯基聚二硫丙烷磺酸钠8ml/L、整平剂为2-四氢噻唑硫酮5ml/L,操作温度:65℃、电流密度:3000A/m2、循环流量15m3/h,阳极选用磷铜饼(P含量为0.06%),阴极为表面金属化的塑料薄膜,电镀时间依据厚度要求进行调整。
测试结果:
依据ASTM E345-16金属箔拉伸测试的标准试验方法测试涂层与基体间的结合力。以国产KDX-1型微机控制电子万能疲劳试验机测试铜箔力学性能。
项目 | 涂层结合力 | 抗拉强度 | 延伸率 |
参数 | 15.3N/cm | 587MPa | 5.5% |
以上实施方式仅用于说明本发明,而并非对本发明的限制,有关技术领域的普通技术人员,在不脱离本发明的精神和范围的情况下,还可以做出各种变化和变型,因此所有等同的技术方案也属于本发明的范畴,本发明的专利保护范围应由权利要求限定。
Claims (8)
1.一种塑料薄膜表面电镀铜的方法,其特征在于,所述方法包括以下步骤:
S1、塑料薄膜基片表面清洁;所述表面清洁包括水洗、碱洗、丙酮超声清洗、水洗、晾干;
S2、多弧离子镀表面金属化;在塑料薄膜表面形成厚度为10-30nm的铜涂层,使塑料薄膜表面金属化;
S3、除油;表面金属化的塑料薄膜除油选择混合碱液浸泡5-10min,确保表面无油污;
S4、活化;
S5、电镀光亮酸性铜;选择“高酸低铜”的镀液,以硫酸铜盐、硫酸为镀液基础,加入有机组合的光亮剂与添加剂,进行二次电镀厚铜,便可得到表面电镀铜的塑料薄膜,其总厚度为5.5-8μm。
2.如权利要求1所述的一种塑料薄膜表面电镀铜的方法,其特征在于:所述塑料薄膜包括聚氯乙烯、聚乙烯、聚丙烯、聚苯乙烯以及其他树脂制成的薄膜。
3.如权利要求1所述的一种塑料薄膜表面电镀铜的方法,其特征在于:步骤S1中,所述塑料薄膜基片表面清洁具体为,纯水清洗,碱洗采用质量分数5-10%的NaOH溶液浸泡10-20min,丙酮清洗浸泡5-10min,纯水清洗,晾干。
4.如权利要求1所述的一种塑料薄膜表面电镀铜的方法,其特征在于:步骤S2中,所述多弧离子镀表面金属化具体操作条件为:基体沉积温度120-150℃、靶源电流80A、基体负偏压20V、基体沉积时间1-2min,惰性保护气体为氩气,反应气体压强与流量比为80sccm、以Cu为阴极靶材,阴极靶材发射金属蒸气,在空间中形成等离子体沉积在塑料薄膜表面形成厚度为10-30nm的Cu涂层,使塑料薄膜表面金属化,得到表面电镀铜的塑料薄膜。
5.如权利要求1所述的一种塑料薄膜表面电镀铜的方法,其特征在于:步骤S3中,所述除油采用的混合碱液组成为:NaOH:5-10g/L、Na2CO3:10-15g/L、Na2HPO4:5-10g/L。
6.如权利要求1所述的一种塑料薄膜表面电镀铜的方法,其特征在于:步骤S4中,所述活化具体为,选择质量浓度为20-30%浓盐酸,活化3-5min后,两道纯水清洗。
7.如权利要求1所述的一种塑料薄膜表面电镀铜的方法,其特征在于:步骤S5中,所述“高酸低铜”的镀液组成为80-150g/L CuSO4、150-200g/L H2SO4、20-80mg/L Cl-;操作温度为55-65℃;电流密度为2500-5000A/m2;循环流量为10-15m3/h,阳极选用P含量为0.03~0.06%的磷铜饼,阴极为表面电镀铜的塑料薄膜;电镀时间依据厚度要求进行调整。
8.如权利要求1或7所述的一种塑料薄膜表面电镀铜的方法,其特征在于:步骤S5中,所述添加剂包括润湿剂和整平剂;所述润湿剂为1-3ml/L聚乙二醇;所述整平剂为2-5ml/L 2-四氢噻唑硫酮;所述光亮剂为3-8ml/L苯基聚二硫丙烷磺酸钠。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115961469A (zh) * | 2022-12-27 | 2023-04-14 | 广东蒙泰高新纤维股份有限公司 | 一种镀铜pp纤维膜的制备方法及在锂离子电池负极集流体的应用 |
CN116145085A (zh) * | 2023-04-24 | 2023-05-23 | 湖南辰皓真空科技有限公司 | 一种锂电池集流体双面镀膜连续生产线及工艺 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004300538A (ja) * | 2003-03-31 | 2004-10-28 | Gunze Ltd | めっき方法および装置 |
CN101481810A (zh) * | 2009-01-12 | 2009-07-15 | 梅县金象铜箔有限公司 | 高延伸率双面光超薄电解铜箔的制造方法 |
CN114369798A (zh) * | 2021-12-14 | 2022-04-19 | 核工业西南物理研究院 | 一种塑料表面低温真空离子镀的镀膜方法 |
-
2022
- 2022-09-20 CN CN202211141635.4A patent/CN115323451A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004300538A (ja) * | 2003-03-31 | 2004-10-28 | Gunze Ltd | めっき方法および装置 |
CN101481810A (zh) * | 2009-01-12 | 2009-07-15 | 梅县金象铜箔有限公司 | 高延伸率双面光超薄电解铜箔的制造方法 |
CN114369798A (zh) * | 2021-12-14 | 2022-04-19 | 核工业西南物理研究院 | 一种塑料表面低温真空离子镀的镀膜方法 |
Non-Patent Citations (1)
Title |
---|
初级职业技术教育培训教材编审委员会: "《电镀基础知识》", vol. 1, 31 August 1993, 上海科学技术出版社, pages: 65 - 66 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115961469A (zh) * | 2022-12-27 | 2023-04-14 | 广东蒙泰高新纤维股份有限公司 | 一种镀铜pp纤维膜的制备方法及在锂离子电池负极集流体的应用 |
CN116145085A (zh) * | 2023-04-24 | 2023-05-23 | 湖南辰皓真空科技有限公司 | 一种锂电池集流体双面镀膜连续生产线及工艺 |
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