CN115265428A - Composite ultrasonic thickness gauge and thickness measuring method thereof - Google Patents
Composite ultrasonic thickness gauge and thickness measuring method thereof Download PDFInfo
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Abstract
The invention discloses a composite ultrasonic thickness gauge and a thickness measuring method thereof, belonging to the technical field of electromagnetic ultrasonic thickness measurement, and comprising a core processing unit, wherein the core processing unit is connected with a high-voltage pulse emission control unit, an ultrasonic probe, a data storage unit and a data display unit, the high-voltage pulse emission control unit is connected with a signal channel selection control unit, the high-voltage pulse emission control unit is connected with the ultrasonic probe through the signal channel selection control unit, the ultrasonic probe converts an electric signal into an ultrasonic signal and enters a measured object on the upper surface of the measured object through the ultrasonic signal, the signal channel selection control unit is also connected with an ADC (analog-to-digital converter) and an FPGA (field programmable gate array) processing unit, the type of the probe is automatically identified through a probe identification chip technology, and the corresponding emission circuit is automatically matched through the switching of an internal algorithm and a hardware circuit of the thickness gauge according to the type of the probe. The problems in the prior art are solved.
Description
Technical Field
The invention relates to a composite ultrasonic thickness gauge and a thickness measuring method thereof, belonging to the technical field of electromagnetic ultrasonic thickness measurement.
Background
Conventional thickness measurement mainly comprises a piezoelectric thickness meter and an electromagnetic ultrasonic thickness meter at present.
The principle of the thickness gauge is mainly to measure the propagation time of the sound beam pulse in the material, and to calculate the thickness of the material according to the following formula by using the sound velocity of the measured material.
In this equation, D represents the thickness of the material, t represents the pulse propagation time, and V represents the acoustic velocity of the material. Since the transit time is the time required to complete the round trip, the product of transit time and speed of sound is divided by 2. The ultrasonic generation principle of piezoelectric ultrasonic thickness measurement is that a negative high-voltage pulse signal excites a piezoelectric ceramic wafer to generate an ultrasonic signal, and the receiving principle is that an ultrasonic pressure signal acts on a ceramic lens to generate a pulse voltage signal.
The principle of ultrasound generation in electromagnetic ultrasonic thickness gauges is that an alternating high voltage pulse signal excites a coil in a constant magnetic field, and a relatively high frequency (RF) field generated by the coil interacts with a low frequency or static field generated by a magnet to generate lorentz forces in a manner similar to an electric motor. This disturbance is transferred to the lattice of the material, generating an ultrasonic wave. The reception principle is that, in the reciprocal process, the interaction of the elastic waves in the presence of a magnetic field generates an induced current in the receiving coil circuit.
Because the excitation signals of the two measurement modes are completely different, different ultrasonic thickness measuring equipment is required to drive the probe to work. The waste of equipment is caused, the learning cost of users is increased, and two different devices are inconvenient to carry in actual use. Therefore, how to realize that the thickness gauge can identify the type of the probe, automatically match a corresponding transmitting circuit and switch and control internal data becomes a technical problem which needs to be solved urgently at present.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a composite ultrasonic thickness gauge and a thickness measuring method thereof, and solves the problems in the prior art.
The invention relates to a composite ultrasonic thickness gauge which comprises a core processing unit, wherein the core processing unit is connected with a high-voltage pulse emission control unit, an ultrasonic probe, a data storage unit and a data display unit, the high-voltage pulse emission control unit is connected with a signal channel selection control unit, the high-voltage pulse emission control unit is connected with the ultrasonic probe through the signal channel selection control unit, the core processing unit is used for reading an internal digital identification code of the ultrasonic probe, reading probe information of the digital identification code stored in the data storage unit through the digital identification code, the core processing unit controls the high-voltage pulse emission unit to generate a corresponding emission signal according to the probe information, the emission channel selected and controlled by the signal channel selection control unit is transmitted to the ultrasonic probe, the ultrasonic probe converts an electric signal into an ultrasonic signal and enters a measured object through the upper surface of the measured object, the signal channel selection control unit is further connected with an ADC analog-to-digital conversion unit and an FPGA processing unit, and the ADC analog-to-digital conversion unit and the FPGA processing unit are connected with the core processing unit.
Furthermore, the signal channel selection control unit is further connected with an analog band-pass filter unit and an adjustable gain operational amplifier unit, and the signal channel selection control unit is connected with the ADC analog-to-digital conversion unit through the analog band-pass filter unit and the adjustable gain operational amplifier unit.
Furthermore, the core processing unit is also connected with a data transmission unit which is a USB/WIFI data transmission unit.
Furthermore, the core processing unit is also connected with a system cache unit.
Furthermore, the core processing unit is also connected with a reference clock unit.
Further, the ultrasonic probe is an electromagnetic ultrasonic probe or a piezoelectric ultrasonic probe.
The invention relates to a composite ultrasonic thickness measuring method, which comprises the following steps:
step 1: an ID read-write interface in the core processing unit sends a reading instruction to the ultrasonic probe, the ultrasonic probe receives the reading instruction and returns probe ID data to the core processing unit, and the core processing unit acquires specific information of the ultrasonic probe by inquiring data stored in the core processing unit;
step 2: the core processing unit controls the high-voltage pulse transmitting unit to generate corresponding transmitting signals according to the probe information, the transmitting channels controlled by the signal channels are selected to transmit the transmitting signals to the ultrasonic probe, the ultrasonic probe converts the electric signals into ultrasonic signals, the ultrasonic signals enter the object to be measured on the upper surface of the object to be measured, are transmitted to the lower surface and return to the upper surface, a part of the signals return to the lower surface from the upper surface, and the other part of the signals are captured by the ultrasonic probe;
and step 3: the ultrasonic probe converts the captured ultrasonic signals into electric signals, the core processing unit receives the signals and transmits the signals to the analog band-pass filtering unit through a receiving channel which is selected and controlled by a signal channel, and the analog band-pass filtering unit filters interference signals of ultrasonic signal frequency and transmits the interference signals to the adjustable gain operational amplifier unit.
And 4, step 4: the adjustable gain operational amplifier unit is used for signal amplification, and the core control unit automatically adjusts the signal amplification times of the adjustable gain operational amplifier unit according to an internally set threshold value so as to achieve the best signal amplification effect.
And 5: the amplified signals are converted into digital signals by an ADC (analog-to-digital converter) unit, and then transmitted to an FPGA (field programmable gate array) processing unit by a high-speed parallel bus;
step 6: the FPGA processing unit performs numerical filtering processing on the numerical signals and then transmits the numerical signals to the core processing unit through a high-number serial bus;
and 7: the core processing unit temporarily stores the data in the system cache unit, extracts the primary echo signal and the secondary echo signal through data processing, reads the clock data of P seconds level in the reference clock unit, calculates the time difference of the primary echo signal and the secondary echo signal, and calculates the thickness value of the object to be measured according to the time difference.
Further, the probe information read in step 1 includes: probe frequency, transmit voltage pulse width, and pulse type.
Further, the step of reading the probe information of the digital identification code stored in the data storage unit by the identification code in step 2 specifically includes the following steps:
step 11: programming a fixed ID on the ultrasonic probe through a programmer;
step 12: when the ultrasonic probe is connected to the ultrasonic thickness gauge, the ID read-write interface of the core processing unit sends a reading instruction to the ultrasonic probe;
step 13: the ultrasonic probe receives the reading instruction and returns probe ID data to the core processing unit;
step 14: the core processing unit acquires specific information of the ultrasonic probe through a data table stored in the core processing unit, and outputs a matched transmitting signal according to a corresponding parameter value.
Further, step 7 includes that the core unit performs DAC digital-to-analog conversion on the received digital signal to generate a corresponding analog signal, stores the analog signal data and the thickness data information in the data storage unit, displays the analog signal data and the thickness data information by the data display unit, and transmits the analog signal data and the thickness data information to an external memory or a computer through the data transmission unit.
Compared with the prior art, the invention has the following beneficial effects:
according to the composite ultrasonic thickness gauge and the thickness measuring method thereof, the probe type (piezoelectric type or electromagnetic type) is automatically identified through a probe identification chip technology, and the corresponding transmitting circuit is automatically matched through switching of an internal algorithm and a hardware circuit of the thickness gauge according to the probe type. The technical problem that only a single probe can be detected in the prior art is solved.
The thickness gauge can realize free switching of the ultrasonic probe when the ultrasonic probe is connected, a piezoelectric ultrasonic transmitting circuit and an electromagnetic ultrasonic transmitting circuit are integrated into the same thickness gauge device, data of the probe are stored in an ARM processor chip, the type (piezoelectric type or electromagnetic type) of the probe is automatically identified through a probe identification chip technology, conduction time is calculated through an internal algorithm of the thickness gauge according to the type of the probe, then a core processing unit controls different transmitting channels in a high-voltage pulse transmitting control unit to conduct work and correspondingly output different voltage values, the corresponding transmitting channels in the control unit are selected to conduct through signals, high-voltage pulse signals are transmitted to the corresponding ultrasonic probe, an electromagnetic coil in the sensor generates an induced electric field on the upper surface of a test block according to an electromagnetic induction theorem under the excitation of high-frequency high-voltage alternating current pulse signals, the induced electric field and subsequent circuit output data are transmitted to the core processing unit, and the core processing unit processes the received data to calculate the thickness of the test block according to a formula, so that thickness measuring work is completed. The switching between control and hardware circuits is realized, the corresponding transmitting circuits are automatically matched, the thickness measurement data is accurate, the test is convenient, and the problems in the prior art are solved.
Drawings
FIG. 1 is a block diagram of the internal connection of a thickness gauge in an embodiment of the present invention;
FIG. 2 is a circuit diagram of a piezoelectric ultrasonic probe in an embodiment of the invention;
FIG. 3 is a circuit diagram of an electromagnetic ultrasound probe in an embodiment of the present invention;
FIG. 4 is a circuit diagram of a high voltage pulse emission control unit according to an embodiment of the present invention;
FIG. 5 is a circuit diagram of a signal selection channel according to an embodiment of the present invention;
FIG. 6 is a circuit diagram of an analog bandpass filter unit according to an embodiment of the invention;
FIG. 7 is a circuit diagram of an adjustable gain operational amplifier unit according to an embodiment of the present invention;
FIG. 8 is a circuit diagram of an ADC according to an embodiment of the present invention;
FIG. 9 is a circuit diagram of an FPGA processing unit in an embodiment of the present invention;
FIG. 10 is a circuit diagram of a core processing unit according to an embodiment of the present invention;
FIG. 11 is a circuit diagram of a reference clock unit according to an embodiment of the present invention;
FIG. 12 is a circuit diagram of a data storage unit according to an embodiment of the present invention;
fig. 13 is a circuit diagram of the USB/WIFI data transmission unit in the embodiment of the present invention.
Detailed Description
The invention is further illustrated by the following figures and examples:
example 1:
as shown in fig. 1, the composite ultrasonic thickness gauge of the present invention includes a core processing unit, the core processing unit is connected to a high-voltage pulse emission control unit, an ultrasonic probe, a data storage unit and a data display unit, the high-voltage pulse emission control unit is connected to a signal channel selection control unit, the high-voltage pulse emission control unit is connected to the ultrasonic probe through the signal channel selection control unit, the core processing unit is configured to read an internal digital identification code of the ultrasonic probe, read probe information of the digital identification code stored in the data storage unit through the digital identification code, the core processing unit controls the high-voltage pulse emission unit to generate a corresponding emission signal according to the probe information, the emission channel selected and controlled by the signal channel selection control unit is used for transmitting the electric signal to the ultrasonic probe, the ultrasonic probe converts the electric signal into an ultrasonic signal, the ultrasonic signal enters a measured object through an ultrasonic signal on an upper surface of the measured object, the signal channel selection control unit is further connected to an ADC analog-to-digital conversion unit and an FPGA processing unit, and the ADC analog-digital conversion unit and the FPGA processing unit are connected to the core processing unit.
The signal channel selection control unit is also connected with an analog band-pass filter unit and an adjustable gain operational amplifier unit, and the signal channel selection control unit is connected with the ADC analog-to-digital conversion unit through the analog band-pass filter unit and the adjustable gain operational amplifier unit.
As shown in fig. 11, the core processing unit is also connected with a reference clock unit. The reference clock unit takes a high-precision digital time chip TDC-GP22 as a core and transmits ps-level time signals to a core processing unit through a spi data bus.
As shown in fig. 13, the core processing unit is further connected to a data transmission unit, and the data transmission unit is a USB/WIFI data transmission unit.
The core processing unit is also connected with a system cache unit.
The ultrasonic probe is an electromagnetic ultrasonic probe or a piezoelectric ultrasonic probe.
Specific example 1:
as shown in fig. 2, after the ultrasonic sensor is connected to the thickness measurement, the core processing unit reads the data of the ID chip in the ultrasonic sensor to be 001, and the core processor obtains the sensing information by querying the data stored in the data storage unit to be: the piezoelectric ultrasonic sensor has the voltage of 150V, negative pressure pulse and pulse frequency of 5M Hz.
As shown in fig. 4, the core processing unit controls pwm signal to control the switching tube Q3, and boosts 12VVCC provided by the power management unit to HV through the L1 transformer: 150V. Since time t =1/f, f is the pulse frequency, t =0.0000002s. With a duty cycle of 50%, the on-time is t1= t × 50% =0.0000002s × 0.5=0.0000001s. The core processing unit controls the UP1 and DOWN2 in the high-voltage pulse emission control unit to output high level and keep 0.0000001s. And the UP1 controls the Q1 to work, the DOWN2 controls the Q5 to work, the Q1 and the Q5 are simultaneously conducted, and a transmitting channel outputs-150V and 5MHz pulse signals. At this point the high precision reference clock unit begins timing T0.
As shown in fig. 5, the core processing unit controls the transmission channel of the K1 signal relay to be turned on, so that the high-voltage pulse signal is transmitted to the piezoelectric ultrasonic sensor, and the internal piezoelectric transduction wafer converts the electrical signal into a 5Mhz ultrasonic signal. The piezoelectric sensor contacts the test block, and the ultrasonic signal is transmitted from the upper surface to the lower surface of the test block and then returns to the upper surface. The returned ultrasonic signal is converted into an electric signal by the piezoelectric transduction wafer. The received signal is transmitted to the analog band-pass filtering unit through a receiving channel of the K1 signal relay.
As shown in fig. 6, the high-frequency small signal received by the analog band-pass filtering unit is transmitted to the U6-1 high-speed amplifier through a 50 Ω single-ended signal to be low-pass filtered, so as to filter out noise signals with frequencies above 10MHz, and then transmitted to the U6-2 high-speed amplifier to be high-pass filtered, so as to filter out noise signals below 1 MHz. After the action of a band-pass filter consisting of high-pass and low-pass filtering, the signal is transmitted to the adjustable gain operational amplifier unit.
As shown in fig. 7, the signal is coupled by C1 to filter out the dc signal, and then input to the adjustable gain operational amplifier unit. The core processing unit controls the signal amplification times of the adjustable gain operational amplifier unit, so that the output signals are converted into differential signals with the voltage value of 2V, which is required by the ADC analog-to-digital conversion unit. The differential signal is transmitted to the ADC analog-to-digital conversion unit through C2 and C3 coupling.
As shown in fig. 8, the ADC analog-to-digital conversion unit converts the differential signal into a high-speed parallel digital signal through the U8 conversion chip, and transmits the high-speed parallel digital signal to the FPGA processing unit.
As shown in fig. 9, the FPGA programmable logic chip transmits the high-speed serial data of the high-speed parallel data conversion layer to the core processing unit.
As shown in fig. 10, the ARM processor chip processes the received data. The time for extracting the maximum voltage value is T1=0.000004. According to the path formula s = v × T, T is half of the ultrasonic round trip time T = (T1-T0)/2 = (0.000004 s-0)/2 =0.000002s. Because the test block is made of alloy steel, the sound velocity is fixed at 5000m/s. The test piece thickness s = v × t =5000m/s × 0.000002s =0.01m =10mm. And finishing thickness measurement operation.
Specific example 2:
as shown in fig. 3, after the ultrasonic sensor is connected to the thickness measurement, the core processing unit reads the data of the ID chip in the ultrasonic sensor to be 006, and the core processor obtains the sensing information by querying the data stored in the data storage unit to be: electromagnetic ultrasonic sensor, voltage 500V, alternating current pulse, pulse frequency 4M Hz.
As shown in fig. 4, the core processing unit controls pwm signal to control the switching tube Q3, and boosts 12VVCC provided by the power management unit to HV through the L1 transformer: 500V. Since time t =1/f, f is the pulse frequency, t =0.00000025s. With a duty cycle of 50%, the on time t1= t × 50% =0.00000025s × 0.5=0.000000125s.
The core processing unit controls the UP1 and DOWN2 in the high-voltage pulse transmission control unit to output high level and keeps 0.000000125s. The UP1 controls the Q1 to work, the DOWN2 controls the Q5 to work, the Q1 and the Q5 are simultaneously conducted, and a-500V and-5MHz negative pressure pulse signal is output by an emission channel; the core processing unit controls the UP1 and DOWN2 output low levels while the UP2 and DOWN1 output low levels remain 0.000000125s. And the UP1 controls the Q1 to work, the DOWN2 controls the Q5 to work, the Q1 and the Q5 are simultaneously conducted, and the transmitting channel outputs 500V,4Mz positive pressure pulse signals. The positive and negative pulse signals constitute an alternating current pulse signal with a frequency of 4MHz. At this point the high precision reference clock unit begins timing T0.
As shown in fig. 5, the core processing unit controls the signal selection control unit to switch on the transmission channel of the K1 signal relay, so that the high-voltage pulse signal is transmitted to the electromagnetic ultrasonic sensor, the electromagnetic coil inside the sensor generates an induced electric field on the upper surface of the test block according to the electromagnetic induction theorem under the excitation of the high-frequency high-voltage alternating-current pulse signal, the induced electric field induces a high-frequency lorentz force on the upper surface of the test block under the left-right force of the constant magnetic field provided by the strong magnetic permanent magnet, 4MHz ultrasonic waves are generated on the upper surface of the metal test block under the action of the lorentz force, and the ultrasonic signal is transmitted from the upper surface of the test block to the lower surface and then returns to the upper surface. The ultrasonic signals returned by the returned ultrasonic signals form Lorentz force on the upper surface of the test block, the Lorentz force enables the upper surface of the test block to form current under the constant magnetic field provided by the strong magnet, and the coil forms induced current signals according to the electromagnetic induction theorem. And the received signals are transmitted to the analog band-pass filtering unit through a receiving channel of the K1 signal relay.
As shown in fig. 6, the high-frequency small signal received by the analog band-pass filtering unit is transmitted to the U6-1 high-speed amplifier through a 50 Ω single-ended signal to be low-pass filtered, so as to filter out a noise signal with a frequency above 10MHz, and then transmitted to the U6-2 high-speed amplifier to be high-pass filtered, so as to filter out a noise signal at 1 MHz. After the action of a band-pass filter consisting of high-pass and low-pass filtering, the signal is transmitted to the adjustable gain operational amplifier unit.
As shown in fig. 7, in the adjustable gain operational amplifier unit, the signal is coupled by C1 to filter out the dc signal, and then input to the adjustable gain operational amplifier unit. The core processing unit controls the signal amplification times of the adjustable gain operational amplifier unit, so that the output signals are converted into differential signals with the voltage value of 2V, which is required by the ADC analog-to-digital conversion unit. The differential signal is coupled and transmitted to an ADC analog-to-digital conversion unit through C2 and C3.
As shown in fig. 8, the ADC analog-to-digital conversion unit converts the differential signal into a high-speed parallel digital signal through the U8 conversion chip, and transmits the high-speed parallel digital signal to the FPGA processing unit.
As shown in fig. 9, the FPGA programmable logic chip transmits the high-speed serial data of the high-speed parallel data conversion layer to the core processing unit.
As shown in fig. 10, the ARM processor chip processes the received data. The time for extracting the maximum voltage value is T1=0.000002. According to the path formula s = v × T, T is half of the ultrasonic round trip time T = (T1-T0)/2 = (0.000002 s-0)/2 =0.000001s. The sound velocity is fixed at 5000m/s because the test block is made of alloy steel. The test block thickness s = v t =5000m/s 0.000001s =0.05m =50mm. And finishing thickness measurement operation. The device integrates the piezoelectric ultrasonic transmitting circuit and the electromagnetic ultrasonic transmitting circuit into the same thickness gauge equipment, automatically identifies the type of the probe (piezoelectric type or electromagnetic type) through a probe identification chip technology, and automatically matches the corresponding transmitting circuit through switching of an internal algorithm and a hardware circuit of the thickness gauge according to the type of the probe, so that thickness measurement data are accurate.
Through the foregoing specific embodiments 1 and 2, the thickness gauge of the present invention may implement free switching of the ultrasonic probe when connected to the ultrasonic probe, integrate the piezoelectric ultrasonic transmitting circuit and the electromagnetic ultrasonic transmitting circuit into the same thickness gauge device, store data of the probe in the ARM processor chip, automatically identify the type of the probe (piezoelectric or electromagnetic type) through the probe identification chip technology, calculate the conduction time according to the type of the probe through an internal algorithm of the thickness gauge, then control different transmitting channels in the high-voltage pulse transmission control unit to conduct and output different voltage values, select a corresponding transmitting channel in the control unit to conduct through a signal selection, transmit the high-voltage pulse signal to a corresponding ultrasonic probe, generate an induced electric field on the upper surface of the test block according to an electromagnetic induction theorem by an electromagnetic coil inside the sensor under excitation of a high-frequency high-voltage ac pulse signal, transmit the generated induced electric field and subsequent circuit output data to the core processing unit, and process the received data to calculate the thickness of the test block according to the formula, thereby completing the thickness measurement. The control and hardware circuit switching is realized, the corresponding transmitting circuit is automatically matched, and the thickness measuring data is accurate.
Example 2:
the invention relates to a composite ultrasonic thickness measuring method, which comprises the following steps:
step 1: an ID reading and writing interface in the core processing unit sends a reading instruction to the ultrasonic probe, the ultrasonic probe receives the reading instruction and returns probe ID data to the core processing unit, and the core processing unit acquires specific information of the ultrasonic probe by inquiring data stored in the core processing unit;
step 2: the core processing unit controls the high-voltage pulse transmitting unit to generate corresponding transmitting signals according to the probe information, the transmitting channels controlled by the signal channels are selected to transmit the transmitting signals to the ultrasonic probe, the ultrasonic probe converts the electric signals into ultrasonic signals, the ultrasonic signals enter the object to be measured on the upper surface of the object to be measured, are transmitted to the lower surface and return to the upper surface, a part of the signals return to the lower surface from the upper surface, and the other part of the signals are captured by the ultrasonic probe;
and step 3: the ultrasonic probe converts the captured ultrasonic signals into electric signals, the core processing unit receives the signals and transmits the signals to the analog band-pass filtering unit through a receiving channel which is selected and controlled by a signal channel, and the analog band-pass filtering unit filters interference signals of ultrasonic signal frequency and transmits the interference signals to the adjustable gain operational amplifier unit.
And 4, step 4: the adjustable gain operational amplifier unit is used for signal amplification, and the core control unit automatically adjusts the signal amplification times of the adjustable gain operational amplifier unit according to an internally set threshold value so as to achieve the best signal amplification effect.
And 5: the amplified signals are converted into digital signals by an ADC (analog-to-digital converter) unit, and then transmitted to an FPGA (field programmable gate array) processing unit by a high-speed parallel bus;
and 6: the FPGA processing unit carries out numerical value filtering processing on the numerical value signal and then transmits the numerical value signal to the core processing unit through the high-number serial bus;
and 7: the core processing unit temporarily stores the data in the system cache unit, extracts the primary echo signal and the secondary echo signal through data processing, reads the clock data of P seconds level in the reference clock unit, calculates the time difference of the primary echo signal and the secondary echo signal, and calculates the thickness value of the object to be measured according to the time difference.
The probe information read in step 1 includes: probe frequency, transmit voltage pulse width, and pulse type.
The step of reading the probe information of the digital identification code stored in the data storage unit by the identification code in the step 2 specifically includes the following steps:
step 11: programming a fixed ID on the ultrasonic probe through a programmer;
step 12: when the ultrasonic probe is connected to the ultrasonic thickness gauge, the ID read-write interface of the core processing unit sends a reading instruction to the ultrasonic probe;
step 13: the ultrasonic probe receives the reading instruction and returns probe ID data to the core processing unit;
step 14: the core processing unit obtains the specific information of the ultrasonic probe through a data table stored in the core processing unit, and outputs a matched transmitting signal according to a corresponding parameter value.
The working principle of the embodiment is as follows:
the core processing unit reads a digital identification code inside the sensor, namely the ID of the probe, and reads probe information of the digital identification code stored in the data storage unit through the identification code, wherein the probe information comprises probe frequency, transmission voltage pulse width and pulse type.
The data storage unit is connected with the core processing module through a parallel data bus by adopting an EMMC data storage chip as shown in figure 12, and the core processing unit controls the high-voltage pulse transmitting unit to generate a corresponding transmitting signal according to the probe information and transmits the corresponding transmitting signal to the electromagnetic ultrasonic/pressure point ultrasonic sensor by selecting a controlled transmitting channel through a signal channel. The transducer converts the electrical signal into an ultrasonic signal. The ultrasonic signals enter the object to be measured on the upper surface of the object to be measured, are transmitted to the lower surface and return to the upper surface, a part of signals return to the lower surface from the upper surface, and the other part of signals are captured by the sensor. Typically, the sensor is able to capture 4 or 5 return signals, and the sensor converts the ultrasonic signal into an electrical signal. The received signal is transmitted to the analog band-pass filtering unit through the receiving channel selected and controlled by the signal channel. The analog band-pass filtering unit filters unexpected interference signals with the ultrasonic signal frequency of 1-10MHz and transmits the unexpected interference signals to the adjustable gain operational amplifier unit. Because the received signal intensity is very low, the adjustable gain operational amplifier unit is required to amplify the signal, and the core control unit automatically adjusts the signal amplification factor of the adjustable gain operational amplifier unit according to an internal set threshold value so as to achieve the best signal amplification effect.
The amplified signals are converted into digital signals by the ADC analog-to-digital conversion unit, and then transmitted to the FPGA processing unit by the high-speed parallel central line. The FPGA processing unit carries out numerical value filtering processing on the numerical value signal and then transmits the numerical value signal to the core processing unit through the high-number serial bus. The core processing unit temporarily stores the data in a system cache unit, and extracts a primary echo signal and a secondary echo signal through data processing. The core processing unit reads clock data of P seconds level in the high-precision reference clock unit, calculates the time difference between the primary echo signal and the secondary echo signal, and calculates the thickness value of the measured object according to the formula of S = V × t/2.
A single bus IC is integrated in the ultrasonic probe, and data can be read and written in through a single data line. When the probe is produced, a fixed ID is programmed on the probe through a programming device according to the model of the probe as shown in the following table 1. When the ultrasonic probe is linked to the ultrasonic thickness measuring host, the core processing unit ID read-write interface sends a reading instruction to the ultrasonic probe, the ultrasonic probe receives the reading instruction, the probe ID data is returned to the core processing unit, the core processing unit obtains the mode of the specific information (model, frequency, wafer, contact area, measuring range and temperature) of the probe by inquiring the data stored in the core processing unit, and matched transmitting signals are output according to corresponding parameter values. The specific information of the probe stored inside the core processing unit is shown in table 1 below.
TABLE 1
By adopting the composite ultrasonic thickness gauge and the thickness measuring method thereof, which are described by the embodiment of the invention in combination with the drawings, the piezoelectric ultrasonic transmitting circuit and the electromagnetic ultrasonic transmitting circuit are integrated into the same thickness gauge equipment, the type of the probe is automatically identified by the probe identification chip technology, and the corresponding transmitting circuit is automatically matched by switching the internal algorithm and the hardware circuit of the thickness gauge according to the type of the probe. The problems in the prior art are solved. The present invention is not limited to the embodiments described, but rather, variations, modifications, substitutions and alterations are possible without departing from the spirit and scope of the present invention.
Claims (10)
1. The utility model provides a compound supersound calibrator which characterized in that: including core processing unit, core processing unit is connected with high-voltage pulse transmission control unit, ultrasonic transducer, data storage unit and data display unit, high-voltage pulse transmission control unit is connected with signal channel and selects the control unit, and high-voltage pulse transmission control unit selects the control unit through signal channel and connects ultrasonic transducer, core processing unit is used for reading ultrasonic transducer's inside digital identification code, reads the probe information of this digital identification code of storage in data storage unit through digital identification code, and core processing unit produces corresponding transmitting signal according to probe information control high-voltage pulse transmission unit, selects the transmitting channel that the control unit was selected to control through signal channel and transmits for ultrasonic transducer, ultrasonic transducer converts the signal of telecommunication into ultrasonic signal, gets into the testee through ultrasonic signal on the testee upper surface, signal channel selects the control unit still to be connected with ADC analog-to-digital conversion unit and FPGA processing unit, ADC analog-digital conversion unit and FPGA processing unit connect core processing unit.
2. The compound ultrasonic thickness gauge according to claim 1, characterized in that: the signal channel selection control unit is also connected with an analog band-pass filter unit and an adjustable gain operational amplifier unit, and the signal channel selection control unit is connected with the ADC analog-to-digital conversion unit through the analog band-pass filter unit and the adjustable gain operational amplifier unit.
3. The compound ultrasonic thickness gauge according to claim 1, characterized in that: the core processing unit is further connected with a data transmission unit which is a USB/WIFI data transmission unit.
4. The compound ultrasonic thickness gauge according to claim 1, characterized in that: the core processing unit is also connected with a system cache unit.
5. The compound ultrasonic thickness gauge according to claim 1, characterized in that: the core processing unit is also connected with a reference clock unit.
6. The compound ultrasonic thickness gauge according to claim 1, characterized in that: the ultrasonic probe is an electromagnetic ultrasonic probe or a piezoelectric ultrasonic probe.
7. A composite ultrasonic thickness measuring method is applied to the composite ultrasonic thickness measuring instrument of any one of claims 1 to 6, and is characterized in that: the method comprises the following steps:
step 1: an ID reading and writing interface in the core processing unit sends a reading instruction to the ultrasonic probe, the ultrasonic probe receives the reading instruction and returns probe ID data to the core processing unit, and the core processing unit acquires specific information of the ultrasonic probe by inquiring data stored in the core processing unit;
and 2, step: the core processing unit controls the high-voltage pulse transmitting unit to generate corresponding transmitting signals according to the probe information, the transmitting channels controlled by the signal channels are selected to transmit the corresponding transmitting signals to the corresponding ultrasonic probes, the ultrasonic probes convert the electric signals into ultrasonic signals, the ultrasonic signals enter the object to be measured on the upper surface of the object to be measured, are transmitted to the lower surface and return to the upper surface, part of the signals return to the lower surface from the upper surface, and the other part of the signals are captured by the ultrasonic probes;
and 3, step 3: the ultrasonic probe converts the captured ultrasonic signals into electric signals, the core processing unit receives the signals and transmits the signals to the analog band-pass filtering unit through a receiving channel which is selected and controlled by a signal channel, and the analog band-pass filtering unit filters interference signals of ultrasonic signal frequency and transmits the interference signals to the adjustable gain operational amplifier unit.
And 4, step 4: the adjustable gain operational amplifier unit is used for signal amplification, and the core control unit automatically adjusts the signal amplification times of the adjustable gain operational amplifier unit according to an internally set threshold value so as to achieve the best signal amplification effect.
And 5: the amplified signals are converted into digital signals by an ADC (analog-to-digital converter) unit, and then transmitted to an FPGA (field programmable gate array) processing unit by a high-speed parallel bus;
step 6: the FPGA processing unit carries out numerical value filtering processing on the numerical value signal and then transmits the numerical value signal to the core processing unit through the high-number serial bus;
and 7: the core processing unit temporarily stores the data in the system cache unit, extracts a primary echo signal and a secondary echo signal through data processing, reads clock data of a P second level in the reference clock unit, calculates the time difference of the primary echo signal and the secondary echo signal, and calculates the thickness value of the measured object according to the time difference and the path formula.
8. The composite ultrasonic thickness measuring method according to claim 7, characterized in that: the probe information read in the step 1 comprises: probe frequency, transmit voltage pulse width, and pulse type.
9. The composite ultrasonic thickness measuring method according to claim 7, wherein: the step of reading the probe information of the digital identification code stored in the data storage unit by the identification code in the step 2 specifically includes the following steps:
step 11: programming a fixed ID on the ultrasonic probe through a programmer;
step 12: when the ultrasonic probe is connected to the ultrasonic thickness gauge, the ID read-write interface of the core processing unit sends a reading instruction to the ultrasonic probe;
step 13: the ultrasonic probe receives the reading instruction and returns probe ID data to the core processing unit;
step 14: the core processing unit acquires specific information of the ultrasonic probe through a data table stored in the core processing unit, and outputs a matched transmitting signal according to a corresponding parameter value.
10. The composite ultrasonic thickness measuring method according to claim 7, wherein: the step 7 further comprises that the core unit converts the received digital signals into corresponding analog signals through DAC, stores the analog signal data and the thickness data information into the data storage unit, displays the analog signal data and the thickness data information by the data display unit, and transmits the analog signal data and the thickness data information to an external memory or a computer through the data transmission unit.
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