CN115214927A - Vacuum film pasting device - Google Patents
Vacuum film pasting device Download PDFInfo
- Publication number
- CN115214927A CN115214927A CN202210987338.5A CN202210987338A CN115214927A CN 115214927 A CN115214927 A CN 115214927A CN 202210987338 A CN202210987338 A CN 202210987338A CN 115214927 A CN115214927 A CN 115214927A
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- Prior art keywords
- film
- die
- pressing die
- plate
- roller
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- 238000003825 pressing Methods 0.000 claims abstract description 110
- 238000007789 sealing Methods 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims description 39
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 33
- 239000000741 silica gel Substances 0.000 claims description 32
- 229910002027 silica gel Inorganic materials 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 20
- 238000007599 discharging Methods 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 10
- 239000012528 membrane Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000013461 design Methods 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 abstract 1
- 239000012212 insulator Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B33/00—Packaging articles by applying removable, e.g. strippable, coatings
- B65B33/02—Packaging small articles, e.g. spare parts for machines or engines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B47/00—Apparatus or devices for forming pockets or receptacles in or from sheets, blanks, or webs, comprising essentially a die into which the material is pressed or a folding die through which the material is moved
- B65B47/02—Apparatus or devices for forming pockets or receptacles in or from sheets, blanks, or webs, comprising essentially a die into which the material is pressed or a folding die through which the material is moved with means for heating the material prior to forming
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a vacuum film sticking device, which is used for solving the technical problems of poor film sticking quality and low production efficiency caused by easy generation of bubbles and complex operation in the film sticking process. The film pressing mechanism comprises an upper pressing die and a lower pressing die, and a closed cavity can be formed by enclosing the upper pressing die and the lower pressing die when the upper pressing die and the lower pressing die are combined; the film pressing mechanism is also connected with a negative pressure control mechanism for reducing the air pressure in the closed cavity; the film-carrying retracting mechanism comprises a film carrier and is used for conveying a wafer plate into the sealed cavity; the upper pressing die is also provided with a pressing part, and when the upper pressing die and the lower pressing die are combined, the pressing part is controlled to press the carrier film and the wafer plate. By the aid of the design, the problem that bubbles appear between the crystal round plate and the carrier film due to the fact that the sealing environment is poor and is influenced by redundant gas in the film pasting process is solved, production efficiency is improved, and product quality is improved.
Description
Technical Field
The invention relates to the technical field of film pasting equipment, in particular to a vacuum film pasting device.
Background
A film applicator generally refers to an apparatus for applying a film to a substrate. For example, in the electronic industry, various flexible or rigid films are often required to be bonded to electronic devices such as semiconductor devices, circuit devices, and display panels to protect the electronic devices.
The existing film sticking device generally needs to manually place an electronic device in a pressing die, so that dangerous accidents are easy to happen due to careless operation; on the other hand, the conventional sealing mode generally has the problem that air bubbles are easily generated in the film pasting process due to poor sealing performance, so that the film pasting quality is influenced; and during the evacuation of the interior of the die, the impact pressure may cause damage to the electronic device and components within the device.
Therefore, it is an important subject of research by those skilled in the art to find a vacuum film pasting device capable of solving the above technical problems.
Disclosure of Invention
The invention discloses a vacuum film sticking device, which is used for solving the technical problems of poor film sticking quality and low production efficiency caused by easy generation of bubbles and complex operation in the film sticking process.
In order to achieve the purpose, the invention adopts the following technical scheme:
a vacuum film sticking device comprises a built-in film pressing mechanism and a film carrying retracting mechanism, wherein the film pressing mechanism comprises an upper pressing die and a lower pressing die, and a closed cavity can be formed by the upper pressing die and the lower pressing die in a surrounding mode when the upper pressing die and the lower pressing die are combined;
the film pressing mechanism is also connected with a negative pressure control mechanism for reducing the air pressure in the closed cavity;
the film-loading retracting and releasing mechanism comprises a film loading used for conveying a wafer plate into the closed cavity;
the upper pressing die is also provided with a pressurizing part, and when the upper pressing die and the lower pressing die are closed, the pressurizing part is controlled to press the carrier film and the wafer plate.
Optionally, a first heating plate and a second heating plate are further arranged in the closed cavity, a first silica gel backing plate is fixedly connected to the lower surface of the first heating plate, and a first cushion pad is clamped between the first silica gel backing plate and the first heating plate;
the last fixed surface of second hot plate is connected with second silica gel backing plate, second silica gel backing plate with it is equipped with the second blotter to press from both sides between the second hot plate.
Optionally, the film-loading retracting mechanism comprises a material receiving platform and a material discharging platform, wherein the material receiving platform is used for placing the wafer plate needing film pasting, and the material discharging platform is used for placing the wafer plate completing film pasting.
Optionally, the film carrying and retracting mechanism comprises an upper film releasing roller and an upper film retracting roller; the upper film releasing roller releases the carrier film to enable the carrier film to pass through the first silica gel base plate and then be wound on the upper film collecting roller;
the film carrying and retracting mechanism further comprises a lower side film releasing roller and a lower side film retracting roller, the lower side film releasing roller winds the material receiving platform to release a film carrier, the film carrier is made to pass through the second silica gel base plate, and the discharging platform is reeled on the lower side film retracting roller.
Optionally, a first heat insulation piece and a second heat insulation piece are further arranged in the closed cavity, the first heat insulation piece is arranged on one side, away from the second heating plate, of the first heating plate, and the first heat insulation piece is fixedly connected with the upper pressing die through a bolt;
the second heat insulation piece is arranged on one side, away from the first heating plate, of the second heating plate, and the second heat insulation piece is fixedly connected with the lower pressing die through bolts.
Optionally, one side of the upper pressing die is rotatably connected with one side of the lower pressing die, one side of the upper pressing die is further fixedly connected with a fixing rod in an outward extending manner, and the fixing rod is rotatably connected with a first air cylinder;
the first cylinder is used for driving the fixed rod to rotate, so that the upper pressing die rotates relative to the lower pressing die until the upper pressing die is buckled with the lower pressing die, and die assembly is completed.
Optionally, an annular groove is formed in the lower die, the annular groove is arranged around the closed cavity, and a sealing element is embedded in the annular groove; when the upper die and the lower die are matched, the sealing element is attached to the upper die.
Optionally, a front rotating arm and a rear rotating arm are further arranged on the other side of the lower die adjacent to the one side, a fixed pin shaft is further arranged on one side of the front rotating arm and the one side of the rear rotating arm facing the closed cavity, a fixed hole is formed in the upper die corresponding to the fixed pin shaft, and the fixed pin shaft is inserted into the fixed hole so as to fixedly connect the upper die and the lower die;
the fixed pin shaft is connected with a second air cylinder; the second cylinder is used for driving the fixed pin shaft to move towards the direction close to the lower pressing die so as to press the upper pressing die and the sealing element.
Optionally, a first positioning portion is convexly disposed on the outer side of the upper die, and a second positioning portion is convexly disposed on the outer side of the lower die corresponding to the first positioning portion;
the first positioning part and the second positioning part are fixedly connected into a whole through a locking pin shaft so as to fixedly connect the upper pressing die and the lower pressing die.
Optionally, the carrier film has a width greater than the wafer plate.
According to the technical scheme, the embodiment of the invention has the following advantages:
compared with the prior art, the film-loading retracting mechanism conveys the wafer plate and the film-loading into the film-pressing mechanism through retracting the film-loading, the built-in film-pressing mechanism is matched with the lower pressing die through the upper pressing die to form a closed cavity for placing the wafer plate and the film-loading, the closed cavity is formed through the negative pressure control mechanism, a vacuum environment is formed through the negative pressure control mechanism, and then the pressure is applied to the pressure part of the upper pressing die, so that the film-loading is pressed on the surface of the wafer plate to complete film pasting.
1. Compared with the conventional movable frame seal, the sealing effect is better, and the problem that bubbles appear between a wafer plate and a carrier film due to the fact that the sealing environment is poor and is easily influenced by redundant gas in the film pasting process is solved.
2. Different from a conventional external movable plate pressurizing mode, the embodiment effectively prevents the problems that parts are damaged or the film sticking quality is reduced due to external pressure impact between the wafer plate and each part through the built-in film pressing mechanism.
3. The film-loading retracting mechanism is additionally arranged to convey the wafer plate to the film pressing mechanism, so that the complexity of manual operation is avoided, the labor cost is saved, and the use safety of the device is improved.
Through the design, the automatic conveying of the wafer plate to the film pasting device is realized, the complexity in operation is eliminated, the problem of bubbles between the wafer plate and the carrier film in the film pasting process is solved, the production efficiency is improved, and the film pasting quality is also improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic view of a vacuum lamination apparatus;
FIG. 2 is a schematic view of a built-in lamination mechanism;
FIG. 3 is a schematic view of another angle of the built-in lamination mechanism;
FIG. 4 is a schematic structural diagram of a built-in film pressing mechanism;
FIG. 5 is a schematic view of a carrier film retracting mechanism;
FIG. 6 is a schematic view of a wafer plate;
illustration of the drawings: the film pressing mechanism 1, the film loading and unloading mechanism 2, the upper pressing die 11, the lower pressing die 12, the film loading 21, the pressurizing part 111, the first heating plate 3, the second heating plate 4, the first silica gel pad 31, the first cushion pad 32, the second silica gel pad 41, the second cushion pad 42, the first heat insulator 5, the second heat insulator 6, the fixing rod 112, the first cylinder 113, the sealing member 121, the front rotating arm 122, the rear rotating arm 123, the fixing pin 124, the fixing hole 114, the second cylinder 7, the first positioning part 115, the second positioning part 125, the positioning hole 8, the locking pin 9, the receiving platform 22, the discharging platform 23, the upper film loading roller 24, the upper film loading roller 25, the lower film loading roller 26, the lower film loading roller 27, the power film guiding roller 28, the connecting rod 33, the stopper 71, the roller 72, the connecting rod 73, the wafer plate 100 and the resin film 101.
Detailed Description
The invention discloses a vacuum film sticking device, which is used for solving the technical problems of poor film sticking quality and low production efficiency caused by easy generation of bubbles and complicated operation in the film sticking process.
In order that those skilled in the art will better understand the disclosure, reference will now be made in detail to the embodiments of the disclosure as illustrated in the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
A vacuum film sticking device comprises a built-in film pressing mechanism 1 and a film carrying retraction jack 2, wherein the film pressing mechanism 1 comprises an upper pressing die 11 and a lower pressing die 12, and a closed cavity can be formed by enclosing the upper pressing die 11 and the lower pressing die 12 when the upper pressing die 11 and the lower pressing die 12 are closed;
the film pressing mechanism 1 is also connected with a negative pressure control mechanism for reducing the air pressure in the closed cavity;
the film carrying and retracting mechanism 2 comprises a film carrier 21 for conveying a wafer plate into the closed cavity;
the upper die 11 is further provided with a pressing part 111, and when the upper die 11 and the lower die 12 are clamped, the pressing part 111 is controlled to press the carrier film 21 and the wafer plate.
The present embodiment is not limited to the film lamination of the wafer board, but is also applicable to various electronic devices such as a PCB board and a display screen.
Specifically, a wafer plate is placed on a carrier film 21, the carrier film retracting mechanism 2 conveys the wafer plate and the carrier film 21 into the film pressing mechanism 1 through retracting the carrier film 21, a closed cavity can be formed by enclosing the upper pressing die 11 and the lower pressing die 12 when the upper pressing die and the lower pressing die are closed, a negative pressure control mechanism vacuumizes the closed cavity to form a negative pressure environment, and then the pressurizing portion 111 is controlled to press down to enable the carrier film 21 and the wafer plate to be pressed together, so that the film pasting operation is completed. The film-carrying retracting mechanism 2 is used for automatically conveying the wafer plate to the film pressing mechanism, so that the complexity of manual operation is avoided, meanwhile, the built-in film pressing mechanism 1 is used for pasting the film on the wafer plate, the sealing effect is better, the interference of redundant gas is avoided, the problem that bubbles are generated between the wafer plate and the film-carrying film 21 in the film pasting process is solved, the production efficiency is improved, and the film pasting quality is also improved.
The pressurizing unit 111 may be a power device such as a hydraulic cylinder, an air cylinder, a servo motor, etc., and the present embodiment preferably applies the film-sticking pressure by the oil cylinder under the pressurizing condition set in the range of 0.4 to 1.5 MPa. The negative pressure control mechanism comprises pipelines respectively arranged in the upper pressing die 11 and the lower pressing die 12, the pipelines are connected with a vacuum pump, the vacuum pump is used for vacuumizing the closed cavity, the pressure value is reduced to the atmospheric pressure, and the pressure value is adjustable. The carrier film 21 may be a photosensitive dry film, an ink dry film, an ABF film, a PET film, etc., and the embodiment is not limited thereto.
Further, a first heating plate 3 and a second heating plate 4 are arranged in the closed cavity, a first silica gel cushion plate 31 is fixedly connected to the lower surface of the first heating plate 3, and a first cushion pad 32 is clamped between the first silica gel cushion plate 31 and the first heating plate 3;
the upper surface fixed connection of second hot plate 4 has second silica gel backing plate 41, presss from both sides between second silica gel backing plate 41 and the second hot plate 4 and is equipped with second blotter 42.
Specifically, the first heating plate 3 heats the upper carrier film 21 attached to the upper surface of the wafer plate, and the second heating plate 4 heats the lower carrier film 21 attached to the lower surface of the wafer plate. It should be noted that, the device may apply a film on the upper surface and/or the lower surface of the wafer plate according to actual needs, which is not limited herein. The first silica gel pad 31 and the second silica gel pad 41 are of flexible silica gel structures, so that the carrier film 21 can be respectively attached to the upper surface and the lower surface of the wafer plate, and air between the carrier film 21 and the wafer plate is extruded to be discharged through the material characteristics of the carrier film, so that the preparation for the subsequent film pressing is well performed in the early stage. It should be noted that, the first silica gel pad 31 and the second silica gel pad 41 fix the silica gel plate on the stainless steel plate by means of adhesion methods such as vulcanization adhesion, and the above design can facilitate replacement of the silica gel pad and subsequent maintenance of the film pasting device.
Specifically, first heating plate 3 passes through first silica gel backing plate 31 of bolt fixed connection, and press from both sides first blotter 32 tightly between first heating plate 3 and first silica gel pad 31, first heating plate 3 passes through bolt fixed connection on connecting rod 33, connecting rod 33 sets up in the sliding tray that last moulding-die 11 was seted up, connecting rod 33 receives the drive of pressurization portion 111, can slide along the sliding tray, and drive first heating plate 3 and be close to lower moulding-die 12, first silica gel backing plate 31 is close to second silica gel backing plate 41 simultaneously, make first silica gel backing plate 31 and second silica gel backing plate 41 contradict respectively in the upper surface and the lower surface of wafer board, with the realization will carry the mesh of membrane 21 pressfitting in the upper surface and the lower surface of wafer board, accomplish the pad pasting to the wafer board.
Specifically, the second heating plate 4 is fixedly connected to the second silicone pad 41 by a bolt, and the second cushion pad 42 is clamped between the second heating plate 4 and the second silicone pad 41.
Further, the film loading and unloading mechanism 2 includes a material receiving platform 22 and a material discharging platform 23, the material receiving platform 22 is used for placing the wafer board to be subjected to film pasting, and the material discharging platform 23 is used for placing the wafer board subjected to film pasting.
Further, the film carrying retracting mechanism 2 includes an upper film releasing roller 24 and an upper film retracting roller 25; the upper film releasing roller 24 releases the carrier film 21 to pass through the first silica gel backing plate 31 and then is wound on the upper film collecting roller 25;
the film carrying and retracting mechanism 2 further comprises a lower side film releasing roller 26 and a lower side film retracting roller 27, wherein the lower side film releasing roller 26 releases the film carrying film 21 around the receiving platform 22, so that the film carrying film passes through the second silica gel backing plate 41 and is wound on the lower side film retracting roller 27 through the discharging platform 23.
Specifically, the material receiving platform 22 is tiled with the carrier film 21 released by the lower side film releasing roller 26, then the wafer plate is placed on the carrier film 21 of the material receiving platform 22, the servo motor applies twisting tension to enable the lower side film releasing roller 26 to continuously release the lower side carrier film 21, the lower side film collecting roller 27 collects the lower side carrier film 21, the wafer plate is driven into the sealed cavity along with the collection and release of the lower side carrier film 21, and the wafer plate is transmitted to the material discharging platform 23 after film pasting is completed.
The process of using the vacuum film sticking device is as follows:
firstly, a wafer plate is placed on the material receiving platform 22, and the first heating plate 3 and the second heating plate 4 are started. Next, the upper film-releasing roller 24 and the lower film-releasing roller 26 are driven by the servo motor to release the carrier film 21, and the upper film-receiving roller 25 and the lower film-receiving roller 27 simultaneously take up the carrier film 21, so that the carrier film 21 conveys the wafer sheet into the film pressing mechanism 1. Then, the upper die 11 and the lower die 12 are closed to maintain the airtight state in the sealed cavity, and then pressure is applied to the pressurizing portion 111 to bring the first heating plate 3 closer to the second heating plate 4, thereby pressing the carrier film 21 onto the upper and lower surfaces of the wafer plate. Finally, after the film pasting is completed, the upper pressing die 11 is opened, the wafer plate subjected to the film pasting is conveyed to the discharging platform 23, and the next wafer plate is placed on the material receiving platform 22. Thereby realize continuous pad pasting, and need not the manual work and put brilliant plectane to press the membrane mechanism in, ensured operation safety, still improved production efficiency.
It should be noted that, since the upper and lower film deposition rollers 24 and 26 are always applied with torque in opposite directions, the upper and lower carrier films 21 are required to maintain the same level of tension so as to be able to bear the weight of the wafer plate, and the tension is usually set within the range of 20 to 80 kN.
Preferably, the upper film collecting roller 25 and the lower film collecting roller 27 are driven by the power film guiding roller 28, and the speed of conveying the carrier film 21 is set to be 1-20m/min.
Furthermore, a first heat insulating piece 5 and a second heat insulating piece 6 are arranged in the closed cavity, the first heat insulating piece 5 is arranged on one side, away from the second heating plate 4, of the first heating plate 3, and the first heat insulating piece 5 is fixedly connected with the upper pressing die 11 through bolts;
the second heat insulation piece 6 is arranged on one side, far away from the first heating plate 3, of the second heating plate 4, and the second heat insulation piece 6 is fixedly connected with the lower pressing die 12 through bolts.
Specifically, the first heat insulator 5 and the second heat insulator 6 are used for blocking heat transfer to the upper pressing die 11 and the lower pressing die 12 during the film-sticking heating process, so that the device is prevented from being damaged by high temperature.
Furthermore, one side of the upper pressing die 11 is rotatably connected with one side of the lower pressing die 12, one side of the upper pressing die 11 is fixedly connected with a fixing rod 112 in an outward extending manner, and the fixing rod 112 is rotatably connected with a first air cylinder 113;
the first cylinder 113 is used for driving the fixing rod 112 to rotate, so that the upper die 11 rotates relative to the lower die 12 until the upper die is buckled with the lower die 12.
Specifically, the first cylinder 113 is controlled to rotate a certain angle, which drives the fixing rod 112 connected to one side of the upper die 11 to rotate, so that the upper die 11 rotates around the rotating shaft to open or close the upper die 11.
Further, an annular groove is formed in the lower pressing die 12, the annular groove is arranged around the closed cavity, and a sealing element 121 is embedded in the annular groove; when the upper die 11 and the lower die 12 are clamped, the seal member 121 is attached to the upper die 11.
Specifically, the sealed cavity includes an upper processing groove and a lower processing groove, the sealing element 121 is disposed at the groove edge of the lower processing groove, and when the upper die 11 and the lower die 12 are clamped, the sealing element 121 is attached to the groove edge of the upper processing groove, so as to achieve the purpose of keeping the airtight property in the sealed cavity all the time. Preferably, the sealing member 121 is an O-ring.
Further, a front rotating arm 122 and a rear rotating arm 123 are further disposed on the other side of the lower pressing die 12 adjacent to one side, a fixing pin 124 is further disposed on one side of the front rotating arm 122 and one side of the rear rotating arm 123 facing the sealed cavity, a fixing hole 114 is disposed at a position of the upper pressing die 11 corresponding to the fixing pin 124, and the fixing pin 124 is inserted into the fixing hole 114 to fixedly connect the upper pressing die 11 with the lower pressing die 12;
the fixed pin shaft 124 is connected with a second cylinder 7; the second cylinder 7 is used for driving the fixed pin 124 to move in a direction close to the lower die 12 so as to press the upper die 11 and the sealing element 121.
Specifically, the second cylinder 7 is linked with a stopper 71, the stopper 71 is in contact with the roller 72, the roller 72 is further connected with a connecting rod 73, and the other end face of the connecting rod 73 away from the roller 72 is clamped into the fixing grooves of the front rotating arm 122 and the rear rotating arm 123. The second cylinder 7 raises the stopper 71, the roller 72 is driven to rotate the connecting rod 73 downwards around the roller 72, the front end surface of the connecting rod 73 presses the front rotating arm 122 and the rear rotating arm 123 downwards, and drives the fixed pin shaft 124 to press the upper die 11 downwards, so that the upper die 11 moves towards the lower die 12 to ensure the compression between the upper die 11 and the sealing element 121, and the sealed cavity is sealed without air leakage.
Further, a first positioning portion 115 is protruded on the outer side of the upper die 11, and a second positioning portion 125 is protruded on the outer side of the lower die 12 corresponding to the first positioning portion 115;
the first positioning portion 115 and the second positioning portion 125 are fixedly connected together by a locking pin 9 to fixedly connect the upper die 11 and the lower die 12.
Specifically, the first positioning portion 115 is protruded outside the other side of the upper die 11 away from the rotation axis, the second positioning portion 125 is protruded outside the other side of the lower die 12 away from the rotation axis, when the upper die 11 is rotationally locked with the lower die 12, the positioning hole 8 on the first positioning portion 115 is aligned with the positioning hole 8 on the second positioning portion, and the locking pin 9 is slidably inserted into the positioning hole 8 to fixedly connect the upper die 11 with the lower die 12.
Further, the carrier film 21 has a width larger than that of the wafer plate.
In order to prevent the outer edge of the wafer plate from being heated and then oozing out of the carrier film 21, which may contaminate or damage the components in the film pressing mechanism 1, the width of the carrier film 21 is set to be 10 to 30mm wider than the width of the wafer plate, thereby ensuring the film-attaching quality, protecting the device from damage and contamination, and reducing the subsequent maintenance cost.
Referring to fig. 6, the upper surface and the lower surface of the wafer plate 100 are respectively wrapped with a resin film 101, and a carrier film 21 is laminated on the upper surface and the lower surface of the wafer plate by a vacuum film laminating apparatus.
It should be noted that the above embodiments are only preferred embodiments of the present invention and the technical principles applied, and not limiting. For those skilled in the art, according to the idea of the embodiments of the present invention, various obvious changes, rearrangements and substitutions can be made to the technical solutions described in the foregoing embodiments without departing from the scope of the present invention. Accordingly, the description is not to be construed as limiting the invention.
Claims (10)
1. A vacuum film sticking device is characterized by comprising a built-in film pressing mechanism (1) and a film carrying retraction jack (2), wherein the film pressing mechanism (1) comprises an upper pressing die (11) and a lower pressing die (12), and the upper pressing die (11) and the lower pressing die (12) can form a closed cavity in an enclosing mode when being matched;
the film pressing mechanism (1) is also connected with a negative pressure control mechanism for reducing the air pressure in the closed cavity;
the film-loading retracting and releasing mechanism (2) comprises a film loading (21) which is used for conveying a wafer plate into the closed cavity;
the upper pressing die (11) is further provided with a pressing part (111), and when the upper pressing die (11) and the lower pressing die (12) are matched, the pressing part (111) is controlled to press the carrier film (21) and the wafer plate.
2. The vacuum film pasting device according to claim 1, wherein a first heating plate (3) and a second heating plate (4) are further arranged in the closed cavity, a first silica gel pad (31) is fixedly connected to the lower surface of the first heating plate (3), and a first cushion pad (32) is clamped between the first silica gel pad (31) and the first heating plate (3);
the last fixed surface of second hot plate (4) is connected with second silica gel backing plate (41), second silica gel backing plate (41) with press from both sides between second hot plate (4) and be equipped with second blotter (42).
3. The vacuum film sticking device according to claim 2, wherein the film loading and unloading mechanism (2) comprises a material receiving platform (22) and a material discharging platform (23), the material receiving platform (22) is used for placing the wafer plates needing film sticking, and the material discharging platform (23) is used for placing the wafer plates after film sticking.
4. The vacuum film laminating device according to claim 3, wherein the film carrying and retracting mechanism (2) comprises an upper film releasing roller (24) and an upper film retracting roller (25); the upper film releasing roller (24) releases the carrier film (21), so that the carrier film passes through the first silica gel base plate (31) and is wound on the upper film winding roller (25);
film roller (26) and downside receipts membrane roller (27) are put still including the downside to year membrane jack (2), the downside is put membrane roller (26) and is wound connect material platform (22) to emit year membrane (21), make it pass through second silica gel backing plate (41), warp again ejection of compact platform (23) roll-up in on downside receipts membrane roller (27).
5. The vacuum film sticking device according to claim 2, wherein a first heat insulating piece (5) and a second heat insulating piece (6) are further arranged in the closed cavity, the first heat insulating piece (5) is arranged on one side of the first heating plate (3) far away from the second heating plate (4), and the first heat insulating piece (5) is fixedly connected with the upper pressing die (11) through bolts;
the second heat insulation piece (6) is arranged on one side, away from the first heating plate (3), of the second heating plate (4), and the second heat insulation piece (6) is fixedly connected with the lower pressing die (12) through bolts.
6. The vacuum film laminating apparatus according to claim 1, wherein one side of the upper die (11) is rotatably connected with one side of the lower die (12), one side of the upper die (11) is further fixedly connected with a fixing rod (112) extending outwards, and the fixing rod (112) is rotatably connected with a first air cylinder (113);
the first air cylinder (113) is used for driving the fixing rod (112) to rotate, so that the upper pressing die (11) rotates relative to the lower pressing die (12) until the upper pressing die is buckled with the lower pressing die (12), and die assembly is completed.
7. The vacuum film laminating device according to claim 6, wherein an annular groove is arranged on the lower pressing die (12), the annular groove is arranged around the closed cavity, and a sealing member (121) is embedded in the annular groove; when the upper die (11) and the lower die (12) are clamped, the sealing member (121) is attached to the upper die (11).
8. The vacuum film laminating device according to claim 7, wherein a front rotating arm (122) and a rear rotating arm (123) are further disposed on the other side of the lower die (12) adjacent to the one side, a fixing pin (124) is further disposed on one side of the front rotating arm (122) and the rear rotating arm (123) facing the closed cavity, a fixing hole (114) is disposed on the upper die (11) corresponding to the fixing pin (124), and the fixing pin (124) is inserted into the fixing hole (114) to fixedly connect the upper die (11) and the lower die (12);
the fixed pin shaft (124) is connected with a second cylinder (7); the second air cylinder (7) is used for driving the fixed pin shaft (124) to move towards the direction close to the lower pressing die (12) so as to press the upper pressing die (11) and the sealing element (121).
9. The vacuum film laminating apparatus according to claim 1, wherein a first positioning portion (115) is protruded from the outer side of the upper die (11), and a second positioning portion (125) is protruded from the outer side of the lower die (12) at a position corresponding to the first positioning portion (115);
the first positioning part (115) and the second positioning part (125) are fixedly connected into a whole through a locking pin shaft (9) so as to fixedly connect the upper pressing die (11) and the lower pressing die (12).
10. The vacuum film pasting device according to claim 1, wherein the width of the carrier film (21) is larger than that of the wafer plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210987338.5A CN115214927A (en) | 2022-08-17 | 2022-08-17 | Vacuum film pasting device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210987338.5A CN115214927A (en) | 2022-08-17 | 2022-08-17 | Vacuum film pasting device |
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| CN115214927A true CN115214927A (en) | 2022-10-21 |
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| CN202210987338.5A Pending CN115214927A (en) | 2022-08-17 | 2022-08-17 | Vacuum film pasting device |
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Application publication date: 20221021 |