CN115133994A - 4-channel direct modulation electro-optical conversion assembly based on photoelectric hybrid integration - Google Patents
4-channel direct modulation electro-optical conversion assembly based on photoelectric hybrid integration Download PDFInfo
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- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/25—Arrangements specific to fibre transmission
- H04B10/2575—Radio-over-fibre, e.g. radio frequency signal modulated onto an optical carrier
- H04B10/25752—Optical arrangements for wireless networks
- H04B10/25758—Optical arrangements for wireless networks between a central unit and a single remote unit by means of an optical fibre
- H04B10/25759—Details of the reception of RF signal or the optical conversion before the optical fibre
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Abstract
This scheme belongs to photoelectric communication technical field, concretely relates to 4 passageway direct modulation electro-optical conversion subassemblies based on photoelectricity hybrid integration. The microwave unit comprises a microwave unit, a laser unit, a space light path unit, a temperature control unit and a control circuit unit, wherein the microwave unit comprises: the low noise amplifier comprises a Bias Tee, an LNA (low noise amplifier) and a numerical control attenuator; a laser unit: the device comprises a laser chip and a backlight detector chip; a spatial light path unit: the device comprises an optical fiber, a collimating lens and a focusing lens; a temperature control unit: the device comprises a semiconductor cooler TEC and an NTC thermistor and is used for carrying out stable temperature control on a laser unit; a control circuit unit: the device comprises a temperature controller and a laser controller, and the scheme realizes the mixed integration of a laser unit, a space optical path unit, a microwave unit and a control circuit unit 4 channels in the same shell. The air-tight packaging is realized, the channel isolation is good, the size is small, the power consumption is low, and the integration level of the system is greatly improved.
Description
Technical Field
This scheme belongs to photoelectric communication technical field, concretely relates to 4 passageway direct modulation electro-optical conversion subassemblies based on photoelectricity hybrid integration.
Background
In the last decades, radio frequency communication technology has developed rapidly, however, due to the frequency band characteristics of radio frequency signals, in an application scenario of long-distance transmission, a direct transmission method based on a low-attenuation and anti-interference radio frequency cable is very high in cost; due to the increasing maturity of optical Fiber technology, Radio over Fiber (RoF) is widely used, which modulates high-speed Radio frequency analog signals onto optical signals to implement high-bandwidth, low-loss and long-distance transmission of Radio frequency signals. In an optical carrier radio frequency communication system, an electro-optical conversion module is used as a light source to provide an optical carrier signal, and modulates a radio frequency signal onto the optical carrier signal, which is a very important component in the system; the common electro-optical conversion module is realized in a direct modulation mode taking a laser as a core or an external modulation mode combining the laser and a modulator; the direct modulation laser has the advantages of small volume, simple process, low cost, easy integration and the like, and is widely concerned;
however, as the integration level and the functional requirement of the radio frequency over optical communication system are continuously improved and evolved, more requirements such as high integration level, controllable power and the like are also provided for the electro-optical conversion module, and at present, the microwave module, the optical signal module and the control module which are adopted are separated, and cannot meet the requirement of user miniaturization through a radio frequency cable and an optical fiber interconnection mode.
Chinese patent CN109361463A discloses a multi-channel ROF system and its implementation method, eight paths of radio frequency signals are respectively input to eight electro-optical conversion plug boxes of an optical transceiver, wherein the optical transmission plug box includes a low noise amplifier, a numerical control attenuator, a detector, a laser, an MCU control and LD driving circuit, etc.; however, due to the fact that photoelectric devices such as lasers, microwave modules and PCBs are different in processing technology, the system is built by discrete components such as an electro-optical component, a microwave component and a control circuit component, and electric connection and signal transmission are achieved through optical fibers, radio frequency cables, conducting wires and the like. Such systems have large package size and heavy weight and cannot meet the requirements of high-integration product design.
Disclosure of Invention
The scheme provides a 4-channel direct modulation electro-optical conversion component based on photoelectric hybrid integration, and the integration level of the component is improved.
In order to achieve the above purpose, the present scheme provides a 4-channel direct modulation electro-optical conversion assembly based on photoelectric hybrid integration, which comprises a microwave unit, a laser unit, a spatial light path unit, a temperature control unit and a control circuit unit;
a microwave unit: the low noise amplifier comprises a Bias Tee, an LNA (low noise amplifier) and a numerical control attenuator;
the microwave unit is connected with the laser unit through a microstrip line and is used for amplifying and filtering an input microwave signal and providing the microwave signal for the laser unit;
the Bias-Tee is connected with the LNA low noise amplifier to realize intermediate frequency amplification;
a digital control attenuator is used in a microwave communication system with gain setting and control function requirements and is responsible for equalizing the gains of different channels,
a laser unit: the device comprises a laser chip and a backlight detector chip;
the laser unit is connected with the space light path unit, directly loads the microwave signal into the optical signal to realize electro-optic conversion, and directly modulates and outputs the optical signal;
a spatial light path unit: the device comprises an optical fiber, a collimating lens and a focusing lens;
converting diverging light of the LD into collimated light rays through a collimating lens, focusing the collimated light to a point through a focusing lens, and coupling the focused light into one end of an optical fiber through the focusing lens;
a temperature control unit: the device comprises a semiconductor cooler TEC and an NTC thermistor and is used for carrying out stable temperature control on a laser unit;
a control circuit unit: the temperature controller is connected with the semiconductor refrigerator and the thermistor to realize temperature control; the laser controller is connected with the laser chip and the backlight detector to realize the control of the output power of the laser;
the microwave unit, the laser unit, the space optical path unit and the control circuit unit are integrally packaged and integrated by the packaging shell, the requirement of channel isolation is met between multi-channel integration, and the external interface of the shielding shell comprises a microwave input interface, an optical signal output interface, a low-frequency feed and a control interface.
The principle of the scheme is as follows: the control circuit unit provides a driving current to enable the laser chip to generate an optical carrier signal of electro-optic conversion, and the optical carrier signal is respectively transmitted to the focusing lens and the backlight detector chip; the backlight detector chip is used for monitoring the output light power of the laser, feeding back the monitored light power intensity and further feeding back the light power intensity to the laser chip unit.
After the laser unit receives the signals, the signals are input to the LNA through the radio frequency microstrip to be amplified, the amplified signals sequentially flow through the attenuator and the Bisa Tee and are input to the LD chip after passing through the Bisa Tee; then the LD chip emits the received electric signal through the LD chip by the electro-optical effect, and the electric signal is transmitted.
The effect of this scheme: and the laser unit, the space optical path unit, the microwave unit and the control circuit unit 4 are integrated in a same shell in a channel mixing way. The air-tight packaging is realized, the channel isolation is good, the size is small, the power consumption is low, and the integration level of the system is greatly improved.
Further, the cavity structure in the shell is designed into four channels, each channel is independent of the space, and an electric lead terminal is designed into an H-shaped structure and is led out from the bottom through a glass sintering process; and the upper layer is welded by cover plate laser. The space independence is realized on the structure of the shell, and the good channel isolation is ensured; the air tightness of the product is ensured.
Further, the packaging shell adopts a metalized shielding shell. The shell structure is used for shielding radio frequency interference signals generated among the outside, the component and the multi-channel component channel.
Further, the laser chip is not limited to FB, DFB, and VCSEL chips. The chip selection range is wide, the application threshold of the conversion assembly is low, and the application range is wide.
Further, the backlight detector chip is connected with the control circuit by adopting a PIN type detector chip. The application scene of the PIN chip is not limited to a conventional packaging form, and the PIN chip can be applied to complex environments such as various curved surfaces and flexible devices.
Further, the NTC thermistor and the LD chip are mounted on the same substrate. The working temperature of the LD chip is ensured to be within a fixed range.
Further, the temperature control unit is mounted below the laser chip. The semiconductor refrigerator receives a control signal of the control circuit unit and provides working current of the semiconductor refrigerator to realize temperature control; the thermistor monitors the temperature value, converts the temperature value into an electrical signal and reports the electrical signal to the control circuit unit.
Further, the power supply converter is also included. The power converter converts the voltage or current accessed to the electronic equipment to obtain an output power supply suitable for supplying power to different circuit modules, so that the power supply to the different circuit modules of the electronic equipment is realized.
Further, the temperature control unit is used for performing stable temperature control on the laser unit, and the temperature control unit is assembled below the laser chip. The semiconductor refrigerator receives a control signal of the control circuit unit and provides working current of the semiconductor refrigerator to realize temperature control; the thermistor monitors the temperature value, converts the temperature value into an electrical signal and reports the electrical signal to the control circuit unit.
Further, the chip also comprises an ADN8834 chip. The NTC thermistor and the LD chip are mounted on the same substrate, the resistance of the NTC thermistor changes along with the change of temperature (the temperature rises, and the resistance decreases); after the resistance is changed, a signal is transmitted to an ADN8834 chip, the ADN8834 chip controls the TEC to work through an internal algorithm and a surrounding link, and when the temperature is higher, the TEC is controlled to refrigerate; when the temperature is lower, the TEC is controlled to heat; the working temperature of the chip is ensured to be within a fixed range.
Further, the chip also comprises an ADN2830 chip. When the LD chip works, the change of current can affect the light-emitting optical power, when the driving current is larger than the threshold current of the chip, the chip starts emitting light (both sides of the chip emit light), and at the moment, the MPD chip at the rear end of the LD can receive the light and convert the light into current; then the voltage is transmitted to an ADN2830 chip, and the ADN2830 chip calculates the voltage value output to the LD chip through an internal algorithm and a surrounding link, so that the control of the power is realized.
Drawings
Fig. 1 is a cross-sectional view of a single pass configuration of an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of an embodiment of the present invention.
FIG. 3 is a cross-sectional view of a four-channel configuration in accordance with an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a microwave unit according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of an operating principle of a microwave unit according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a spatial light path according to an embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a temperature control principle of the control circuit according to the embodiment of the present invention.
Fig. 8 is a schematic structural diagram of a power control principle of the control circuit according to the embodiment of the present invention.
Fig. 9 is a sectional view of the heat dissipating device according to embodiment 2 of the present invention.
Fig. 10 is a top view of a housing according to embodiment 2 of the present invention, in which a disk and heat dissipation holes overlap.
Fig. 11 is a top view of a structure in which a disk is separated from heat dissipation holes in embodiment 2 of the present invention.
Fig. 12 is a structural left side view of the casing of embodiment 2 of the present invention.
Fig. 13 is an enlarged view of a portion a in fig. 11 according to embodiment 2 of the present invention.
Detailed Description
The following is further detailed by way of specific embodiments:
the reference numbers in the drawings attached hereto include: the device comprises a microwave unit 1, a laser unit 2, a laser chip 2-1, a backlight detector chip 2-2, a spatial light path unit 3, a temperature control unit 4, a semiconductor refrigerator 4-1, a thermistor 4-2, a control circuit unit 5, a first cylinder 6, a micro fan 7, a piston 8, an installation plate 9, a bump 10, a forward rotation switch 11, a reverse rotation switch 12, a hollow net 13, a heat dissipation device 14, a shell 15, a lower side wall 16, a second cylinder 17, a heat dissipation hole 18, a slide rail 19, a disc 20 and a piston rod 21.
Example 1 is substantially as shown in figures 1-2 of the accompanying drawings:
a4-channel direct modulation electro-optical conversion component based on photoelectric hybrid integration; each channel comprises a microwave unit 1, a laser unit 2, a space light path unit 3, a temperature control unit 4 and a control circuit unit 5;
as shown in fig. 3:
the microwave unit 1, the laser unit 2, the space optical path unit 3 and the control circuit unit 5 are integrally packaged and integrated through the packaging shell 6 and the packaging shell 6, the requirement of channel isolation is met between multi-channel integration, and external interfaces of the shielding shell 6 comprise a microwave input interface, an optical signal output interface, a low-frequency feed and control interface and the like. The package housing 6 is a metallized shielding housing structure for shielding radio frequency interference signals generated between the outside, the component itself and the multi-channel component channel.
As shown in figures 4-5:
the microwave unit 1 comprises a Bias Tee, an LNA low noise amplifier and a numerical control attenuator;
the microwave unit 1 is connected with the laser unit 2 through a microstrip line and is used for amplifying and filtering an input microwave signal and providing the microwave signal for the laser unit 2;
as shown in fig. 6:
the digital control attenuator is used in a microwave communication system with the requirements of gain setting and control functions and is responsible for equalizing the gains of different channels, and the Bias-Tee is connected with the LNA low noise amplifier to realize intermediate frequency amplification;
an amplifier and an attenuator in the microwave unit 1 are changed from a module level to a chip level, and are integrated into the same cavity together with a light path part; the separation devices are integrated into a whole, and the purposes of reducing the size and reducing the power consumption are achieved.
The working principle of the whole microwave unit 1 is as follows: after receiving a radio-frequency signal, the radio-frequency signal is input to an LNA (low-noise amplifier) through a radio-frequency microstrip to realize amplification of the signal, the amplified signal flows through an attenuator (the impedance matching is improved by buffering the change of impedance), and the amplified signal comes to a Bisa Tee (the Bisa Tee consists of an ultra-wideband, a high-frequency inductor and a capacitor which are close to an ideal and have no resonance point), and is input to an LD (laser diode) chip after passing through the Bisa Tee; then the LD emits the received electric signal through the LD by the electro-optic effect, and the electric signal is carried out.
The laser unit 2 is connected with the spatial light path unit 3, the laser unit 2 directly loads the microwave signal into the optical signal to realize electro-optic conversion, and directly modulates and outputs the optical signal;
as shown in fig. 6:
the temperature control unit 4 is used for performing stable temperature control on the laser chip 2-1 unit 2, and the control circuit unit 5 is respectively connected with the temperature control unit 4 and the laser unit 2 in a modulation mode.
The laser chip 2-1 unit 2 comprises a laser chip 2-1 and a backlight detector chip 2-2, the control circuit unit 5 provides a driving current to enable the laser chip 2-1 to generate an electro-optical converted optical carrier signal, and the optical carrier signal is respectively transmitted to the focusing lens and the backlight detector chip 2-2; the backlight detector 2-2 chip can be connected with the control circuit 5 by adopting a PIN type detector chip, and the backlight detector 2-2 chip is used for monitoring the output light power of the laser and feeding back the monitored light power intensity to further form the feedback control of the laser unit 2.
Spatial light path unit 3: the device comprises an optical fiber, a collimating lens and a focusing lens;
the collimating lens is used for focusing and converting divergent light emitted by the LD chip into collimated light; the focus of the collimating lens is positioned on the light emitting surface of the LD chip;
a focusing lens for coupling the larger free-space beam into the optical fiber;
converting diverging light of the LD into collimated light rays through a collimating lens, focusing the collimated light to a point through a focusing lens, and coupling the focused light into one end of an optical fiber through the focusing lens;
as shown in figures 7-8:
the temperature regulation and control unit 4 is assembled below the laser chip 2-1, the temperature regulation and control unit 4 comprises a semiconductor refrigerator 4-1 for temperature control and a thermistor 4-2 for temperature monitoring, and the semiconductor refrigerator 4-1 receives a control signal of the control circuit unit 5 and provides working current of the semiconductor refrigerator 4-1 to realize temperature control; the thermistor 4-2 monitors the temperature value, converts the temperature value into an electrical signal and reports the electrical signal to the control circuit unit 5.
An ADN8834 chip is also included. The NTC thermistor and the LD chip are mounted on the same substrate, the resistance of the NTC thermistor changes along with the change of temperature (the temperature rises, and the resistance decreases); after the resistance is changed, a signal is transmitted to an ADN8834 chip, the ADN8834 chip controls the TEC to work through an internal algorithm and a surrounding link, and when the temperature is higher, the TEC is controlled to refrigerate; when the temperature is lower, the TEC is controlled to heat; the working temperature of the chip is ensured to be within a fixed range.
Also includes ADN2830 chip. When the LD chip works, the change of current can affect the light-emitting optical power, when the driving current is larger than the threshold current of the chip, the chip starts emitting light (both sides of the chip emit light), and at the moment, the MPD chip at the rear end of the LD can receive the light and convert the light into current; then the voltage is transmitted to an ADN2830 chip, and the ADN2830 chip calculates the voltage value output to the LD chip through an internal algorithm and a surrounding link, so that the control of the power is realized.
And the control circuit unit 5 comprises a temperature controller and a laser controller, and the temperature controller is connected with the semiconductor refrigerator 4-1 and the thermistor 4-2 to realize temperature control. The laser controller is connected with the laser chip 2-1 and the backlight detector to realize the control of the output power of the laser.
The power supply converter is used for converting voltage or current of the electronic equipment to obtain an output power supply suitable for supplying power to different circuit modules, and power supply to the different circuit modules of the electronic equipment is realized.
Example 2, as shown in FIGS. 9-11:
the embodiment is different from embodiment 1 in that the heat dissipation device further comprises a heat dissipation device, the heat dissipation device comprises a first air cylinder 6 and a micro fan 7, the micro fan 7 comprises a motor and fan blades, the fan blades are fixedly arranged on an output shaft of the motor, the first air cylinder 6 is fixedly arranged on the outer portion of the shell 15, a piston 8 is arranged on the side wall of the first air cylinder 6 in a sliding mode, the piston 8 and the first air cylinder 6 form a closed space, and liquid with a boiling point of 30-40 degrees is arranged in the closed space.
Be equipped with mounting panel 9 on the port of first cylinder 6, be equipped with the ventilation hole on the mounting panel 9, the bottom of motor is fixed on mounting panel 9, is equipped with lug 10 on the piston 8 near 7 directions of miniature fan, is equipped with on the mounting panel 9 to be used for controlling motor pivoted switch, and switch and lug 10 phase-match are equipped with the through-hole on the mounting panel 9, and the through-hole is used for breathing freely and balanced atmospheric pressure.
The side wall of the first cylinder 6 is made of metal. The metal material heat conductivility is good, can be better feel the temperature variation of casing 15 to in can be in time with the temperature transmission to the liquid in confined space on the casing 15, and then first cylinder 6 also can reduce the temperature of casing 15 with heat transfer for liquid.
Four heat dissipation devices are disposed on the upper and lower sides of the housing 15, and correspond to each channel. The heat dissipation effect is better.
The fan is provided with a protection shell which is a hollow net 13, so that the fan blades are prevented from being damaged by external impact.
The switches on the heat dissipation devices comprise forward switches 11 for controlling the forward transmission of the motor and reverse switches 12 for controlling the reverse rotation of the motor, and the distances between the forward switches 11 of the four heat dissipation devices and the bumps 10 are shorter than the distances between the reverse switches 12.
The forward switch 11 of the first heat sink is also used to control the conduction of the lower sidewall 16 of the housing 15, and the upper and lower sidewalls of the housing 15 are provided with corresponding heat dissipation holes 18.
As shown in figures 12-13:
a second cylinder 17 and a slide rail 19 are further arranged between the heat dissipation devices on the two sides of the shell 15, a piston rod 21 of the second cylinder 17 is fixedly connected with a disc 20, the disc 20 is slidably arranged in the slide rail 19, and the disc 20 is used for opening and closing the heat dissipation holes 18; and a piston 8 is arranged on the side wall in the second cylinder 17 in a sliding manner, the piston 8 and the second cylinder 17 form a sealed space, and liquid with a boiling point of 30-40 degrees is arranged in the sealed space.
When the 4-channel external modulation electro-optical conversion assembly works, when the temperature of the shell 15 reaches more than 30 degrees, liquid in the first air cylinder 6 is evaporated, the piston 8 moves towards the direction of the fan, the pistons 8 of the four heat dissipation devices contact the forward rotation switch 11 first, the fans corresponding to the four heat dissipation devices start to rotate forward, air is blown to the shell 15 to blow away heat on the surface of the shell 15, the lower side wall 16 of the shell 15 is electrified, due to gravity, dust on the upper side wall of the shell 15 and dust on parts can automatically fall on the lower side wall 16 of the shell 15, the electrified side wall adsorbs the dust, and the dust is prevented from being accumulated on the parts inside the shell 15.
Meanwhile, liquid in the second cylinder 17 evaporates to push the piston towards the direction of the disc 20, so that the disc 20 and the heat dissipation holes 18 are in a state of overlapping to a separated state, at the moment, the heat dissipation holes 18 are completely leaked, the fan blows air through the heat dissipation holes 18, then the heat in the shell 15 is blown out, the purpose of rapid heat dissipation is achieved, the heat of the corresponding shell 15 is prevented from being blown to the side by the heat dissipation device, and the temperature heat dissipation of the shell 15 is slow.
If the temperature continues to rise, the pressure in the first cylinder 6 continues to increase, the piston 8 continues to move towards the direction close to the heat dissipation devices, then the pistons 8 of the four heat dissipation devices contact the reversing switch 12, then the fans corresponding to the four heat dissipation devices start to rotate in the reverse direction, negative pressure is formed between the fans and the shell 15, heat on the shell 15 corresponding to the four heat dissipation devices can be sucked away, meanwhile, the heat in the shell 15 is also sucked away through the heat dissipation holes 18, the fan on the heat dissipation devices rotates in the reverse direction after rotating in the forward direction, the purpose of heat dissipation is achieved, and the service life of the shell 15 is prolonged.
Meanwhile, the four fans rotate reversely, negative pressure is formed between the fans and the shell 15, and then dust in the shell 15 can be sucked out through the heat dissipation holes 18, so that the situation that the dust is adhered to parts and influences the power of the 4-channel external modulation electro-optical conversion assembly is avoided.
After the temperature of the casing 15 is reduced, the temperature of the liquid in the first cylinder and the second cylinder 17 is reduced, and then the piston moves towards the bottom of the cylinder, so that the bump 10 is separated from the forward switch 11 and the reverse switch 12 in sequence, the disc 20 is overlapped with the heat dissipation hole 18, and then the heat dissipation hole 18 is blocked, and dust is prevented from entering the casing 15.
Meanwhile, the reversing switches 12 of the second heat dissipation device and the fourth heat dissipation device are in contact with the bumps 10, so that the fans on the second heat dissipation device and the fourth heat dissipation device are reversed, negative pressure is formed between the fans on the second heat dissipation device and the fourth heat dissipation device and the shell 15, heat on the shell 15 corresponding to the second heat dissipation device and the fourth heat dissipation device can be absorbed, the purpose of rapid heat dissipation is achieved, the heat of the shell 15 corresponding to the heat dissipation device is prevented from being blown aside by the heat dissipation device, and the shell 15 is enabled to be warm and fast dissipated.
The foregoing is merely an example of the present invention and common general knowledge of known specific structures and features of the embodiments is not described herein in any greater detail. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.
Claims (10)
1. A4-channel direct modulation electro-optical conversion component based on photoelectric hybrid integration is characterized in that: the device comprises a microwave unit (1), a laser unit (2), a space optical path unit (3), a temperature control unit (4) and a control circuit unit (5);
microwave unit (1): the system comprises a Bias Tee, an LNA low noise amplifier and a numerical control attenuator;
the microwave unit (1) is connected with the laser unit (2) through a microstrip line and is used for amplifying and filtering an input microwave signal and providing the microwave signal for the laser unit (2);
the Bias-Tee is connected with the LNA low noise amplifier to realize intermediate frequency amplification;
a numerically controlled attenuator is used in a microwave communication system with the requirements of gain setting and control functions, and is responsible for equalizing the gains of different channels,
laser unit (2): the device comprises a laser chip (2-1) and a backlight detector chip (2-2);
the laser unit (2) is connected with the spatial light path unit (3), the laser unit (2) directly loads microwave signals into optical signals to realize electro-optic conversion, and the optical signals are directly modulated and then output;
spatial light path unit (3): the device comprises an optical fiber, a collimating lens and a focusing lens;
converting diverging light of the LD into collimated light rays through a collimating lens, focusing the collimated light to a point through a focusing lens, and coupling the focused light into one end of an optical fiber through the focusing lens;
temperature control unit (4): comprises a semiconductor refrigerator (4-1), a TEC and an NTC thermistor (4-2) for performing stable temperature control on a laser unit (2);
control circuit unit (5): the temperature controller is connected with the semiconductor refrigerator (4-1) and the thermistor (4-2) to realize temperature control; the laser controller is connected with the laser chip (2-1) and the backlight detector to realize the control of the output power of the laser;
the microwave integrated packaging device is characterized by further comprising a packaging shell, wherein the microwave unit (1), the laser unit (2), the space optical path unit (3) and the control circuit unit (5) are integrally packaged and integrated, the requirement of channel isolation is met between multi-channel integration, and an external interface of the shielding shell comprises a microwave input interface, an optical signal output interface, a low-frequency feed and a control interface.
2. The 4-channel direct modulation electro-optical conversion component based on the optoelectronic hybrid integration according to claim 1, wherein: the cavity structure in the packaging shell is designed into four channels, each channel is independent of the other channel, an electric lead terminal is designed into an H-shaped structure and is led out from the bottom through a glass sintering process; and the upper layer is welded by cover plate laser.
3. The 4-channel direct modulation electro-optical conversion component based on the optoelectronic hybrid integration according to claim 1, wherein: the packaging shell adopts a metalized shielding shell.
4. The 4-channel direct modulation electro-optical conversion component based on the optoelectronic hybrid integration according to claim 1, wherein: the laser chip (2-1) is not limited to FB, DFB, and VCSEL chips.
5. The 4-channel direct modulation electro-optical conversion component based on the optoelectronic hybrid integration according to claim 1, wherein: the backlight detector chip (2-2) is connected with the control circuit by adopting a PIN type detector chip.
6. The 4-channel direct modulation electro-optical conversion component based on the optoelectronic hybrid integration according to claim 1, wherein: the NTC thermistor (4-2) and the LD chip are mounted on the same substrate.
7. The 4-channel direct modulation electro-optical conversion component based on the optoelectronic hybrid integration according to claim 1, wherein: the temperature control unit (4) is assembled below the laser chip (2-1).
8. The 4-channel direct modulation electro-optical conversion component based on the optoelectronic hybrid integration according to claim 1, wherein: also included is a power converter.
9. The 4-channel direct modulation electro-optical conversion component based on the optoelectronic hybrid integration according to claim 1, wherein: the temperature control unit (4) is used for performing stable temperature control on the laser unit (2), and the temperature control unit (4) is assembled below the laser chip (2-1).
10. The 4-channel direct modulation electro-optical conversion component based on the optoelectronic hybrid integration according to claim 1, wherein: also included is an ADN8834 chip.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117539052A (en) * | 2024-01-09 | 2024-02-09 | 深圳市维度科技股份有限公司 | Single-channel optical attenuation module and optical attenuator |
| CN117906586A (en) * | 2024-03-19 | 2024-04-19 | 西安中科华芯测控有限公司 | Four-channel integrated PIN-FET detector assembly and manufacturing method thereof |
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