CN115135006A - Manufacturing method of flexible circuit board - Google Patents
Manufacturing method of flexible circuit board Download PDFInfo
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- CN115135006A CN115135006A CN202110336565.7A CN202110336565A CN115135006A CN 115135006 A CN115135006 A CN 115135006A CN 202110336565 A CN202110336565 A CN 202110336565A CN 115135006 A CN115135006 A CN 115135006A
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- layer
- circuit board
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- separating
- flexible circuit
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 44
- 239000010410 layer Substances 0.000 claims abstract description 157
- 239000012790 adhesive layer Substances 0.000 claims abstract description 68
- 238000010030 laminating Methods 0.000 claims abstract description 10
- 238000004804 winding Methods 0.000 claims description 54
- 239000002184 metal Substances 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 44
- 239000007788 liquid Substances 0.000 claims description 16
- 238000000926 separation method Methods 0.000 claims description 16
- 238000005096 rolling process Methods 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 239000002356 single layer Substances 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 14
- 239000000758 substrate Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000003292 glue Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000003814 drug Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000013043 chemical agent Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A manufacturing method of a flexible circuit board comprises the following steps: providing two copper-clad plates and an adhesive layer, and bonding the two copper-clad plates together through the adhesive layer to obtain an intermediate; forming two circuit layers on two surfaces of the intermediate body so as to obtain a first flexible circuit board and a second flexible circuit board; and then the first flexible circuit board and the second flexible circuit board which are stuck on the adhesive layer are split. The manufacturing method of the flexible circuit board provided by the invention adopts a roll-to-roll laminating production mode, can simultaneously produce two single-layer or multi-layer flexible circuit boards, effectively improves the production efficiency and the productivity on the basis of simplifying the flow, saves materials and reduces the cost.
Description
Technical Field
The invention relates to a printed circuit board technology, in particular to a manufacturing method of a flexible circuit board.
Background
The traditional method for manufacturing the multilayer flexible circuit board is to manufacture each single-layer flexible circuit board separately and then press the separated single-layer flexible circuit boards together to manufacture the subsequent multilayer board.
However, the multiple single-layer flexible circuit boards are long in separate manufacturing period, low in efficiency, high in material consumption and high in cost.
Disclosure of Invention
In view of the above, there is a need for a method for manufacturing a flexible printed circuit board with simple process, high manufacturing efficiency and low cost.
The invention provides a manufacturing method of a flexible circuit board, which comprises the following steps:
the method comprises the steps of providing a first copper-clad plate and a second copper-clad plate, wherein the first copper-clad plate comprises a first metal layer and a second metal layer which are arranged oppositely, and the second copper-clad plate comprises a third metal layer and a fourth metal layer which are arranged oppositely.
And providing an adhesive layer, sequentially laminating the first copper-clad plate, the adhesive layer and the second copper-clad plate, enabling the adhesive layer to be located between the second metal layer and the third metal layer, and then laminating to obtain a first intermediate.
And forming a first circuit layer on the first metal layer on the outermost side of the first intermediate body, electrically connecting the first circuit layer with the second metal layer to form a first flexible circuit board, forming a second circuit layer on the fourth metal layer on the outermost side of the intermediate body, and electrically connecting the second circuit layer with the third metal layer to form a second flexible circuit board.
And separating the first flexible circuit board and the second flexible circuit board on the adhesive layer.
In an embodiment of the present application, the method for manufacturing a flexible printed circuit further includes:
and respectively forming a first blind hole and a second blind hole on two sides of the intermediate body.
And forming a first conductive layer in the first blind hole to electrically connect the first circuit layer with the second metal layer, and forming a second conductive layer in the second blind hole to electrically connect the second circuit layer with the third metal layer.
In an embodiment of the present invention, before the step of separating the first flexible printed circuit board and the second flexible printed circuit board from each other on the adhesive layer, the method further includes:
and adding a layer on the surface of the first circuit layer to form at least one third circuit layer, wherein the third circuit layer is electrically connected with the first circuit layer.
And adding a layer on the surface of the second circuit layer to form at least one fourth circuit layer, wherein the fourth circuit layer is electrically connected with the second circuit layer.
In an embodiment of the present application, the method for manufacturing a flexible printed circuit further includes:
and cutting edges of the first intermediate.
In an embodiment of the present invention, before the step of separating the first flexible printed circuit board and the second flexible printed circuit board from each other on the adhesive layer, the method further includes:
and forming a plurality of through holes or third blind holes on the first flexible circuit board and the second flexible circuit board to form the identification code.
In an embodiment of the present application, the dividing the first flexible printed circuit board and the second flexible printed circuit board on the adhesive layer specifically includes:
the utility model provides a bundling device, bundling device includes minute winding wheel group and rolling wheel group, minute winding wheel group is including relative first minute winding wheel group and the second minute winding wheel group that sets up, minute winding wheel group be used for with first flexible line way board with the second flexible line way board divides the book, the rolling wheel group is used for after will dividing the book first flexible line way board with the second flexible line way board carries out the rolling respectively.
And penetrating the first flexible circuit board and the second flexible circuit board which are attached to the adhesive layer between the first coiling wheel group and the second coiling wheel group, wherein the first flexible circuit board and the second flexible circuit board are respectively contacted with the first coiling wheel group and the second coiling wheel group.
The first flexible circuit board and the second flexible circuit board are respectively separated by the first separating roller set and the second separating roller set.
And the winding wheel set is used for winding the first flexible circuit board and the second flexible circuit board after the split winding respectively.
In an embodiment of the present application, the separating device further includes a separating mechanism, and the separating mechanism is configured to separate the first flexible printed circuit board and the second flexible printed circuit board on the second intermediate body from the adhesive layer.
In the embodiment of the application, separating mechanism set up in the partial winding wheel group is close to winding wheel group one side, separating mechanism is including corresponding respectively first partial winding wheel group with two separation sword that the second partial winding wheel group set up.
In an embodiment of the application, the separating mechanism is disposed on a side of the partial winding wheel set away from the winding wheel set, the separating mechanism includes a separating groove and a separating liquid accommodated in the separating groove, and the separating liquid is used for reducing viscosity of the adhesive layer, so that the adhesive layer is separated from the first flexible circuit board and the second flexible circuit board.
In this application embodiment, the bundling device still including set up in the rolling wheel group is kept away from the washing stoving mechanism of rolling wheel group one side, wash stoving mechanism be used for with after the bundling first flexible line way board with the second flexible line way board washs the stoving.
Compared with the prior art, the manufacturing method of the flexible circuit board provided by the invention adopts a roll-to-roll laminating production mode, can be used for simultaneously producing two single-layer or multi-layer flexible circuit boards, effectively improves the production efficiency and the productivity on the basis of simplifying the process, saves materials and reduces the cost.
Drawings
Fig. 1 is a schematic structural diagram of a first copper-clad plate, a second copper-clad plate and an adhesive layer provided in an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a first intermediate according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a second intermediate according to an embodiment of the present invention.
Fig. 4 is a schematic structural view of an adhesive layer according to an embodiment of the present invention.
Fig. 5 is a flowchart of a manufacturing process of a flexible printed circuit board according to an embodiment of the invention.
FIG. 6 is a comparison diagram of two identification codes provided by an embodiment of the present invention.
FIG. 7 is a flow chart of the volume splitting process according to an embodiment of the present invention.
Fig. 8 is a flowchart of a volume splitting process according to another embodiment of the present invention.
FIG. 9 is a flow chart of the volume splitting according to another embodiment of the present invention.
Description of the main elements
First flexible wiring board 100
Intermediate 10
Second intermediate 20
First copper-clad plate 1
First intermediate layer 11
First blind hole 15
First conductive layer 16
Second flexible wiring board 200
Second copper clad laminate 2
Second intermediate layer 21
Second blind hole 25
Second conductive layer 26
First adhesive layer 32
Second adhesive layer 33
Separate winding wheel set 5
First rewind wheel set 51
Second sub-winding wheel set 52
Winding wheel set 6
First winding wheel 61
Second winding wheel 62
Third winding wheel 63
Separating means 7,8
Separated liquid 82
Cleaning and drying mechanism 9
Through hole a
Third blind hole b
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 5, a method for manufacturing a flexible printed circuit board according to an embodiment of the present invention includes the following steps:
s1, referring to fig. 1 in combination, a first copper clad laminate 1 and a second copper clad laminate 2 are provided, where the first copper clad laminate 1 includes a first intermediate layer 11, and a first metal layer 12 and a second metal layer 13 disposed on two opposite surfaces of the first intermediate layer 11. The second copper-clad plate 2 comprises a second middle layer 21, and a third metal layer 22 and a fourth metal layer 23 which are arranged on two opposite surfaces of the second middle layer 21.
In an embodiment, the first copper-clad plate 1 and the second copper-clad plate 2 may be double-sided copper-clad plates, the first intermediate layer 11 and the second intermediate layer 21 may be an insulating layer, the first intermediate layer 11 and the second intermediate layer 21 may be made of polyimide, and the first metal layer 12, the second metal layer 13, the third metal layer 22 and the fourth metal layer 23 may be copper foil layers.
In another embodiment, the first copper-clad plate 1 and the second copper-clad plate 2 may be multi-layer flexible plates, and the first intermediate layer 11 and the second intermediate layer 21 may include multi-layer inner-layer circuit layers.
S2, referring to fig. 1 and fig. 2, providing an adhesive layer 3, stacking the first copper-clad plate 1, the adhesive layer 3, and the second copper-clad plate 2 in sequence, such that the adhesive layer 3 is located between the second metal layer 13 and the third metal layer 22, and then performing a press-fitting process to obtain the first intermediate 10.
In an embodiment, the adhesive layer 3 is a double-sided tape, and specifically includes a substrate 31, and a first adhesive layer 32 and a second adhesive layer 33 disposed on opposite surfaces of the substrate 31, wherein the first adhesive layer 32 is adhered to the second metal layer 13, and the second adhesive layer 33 is adhered to the third metal layer 22.
Adopt adhesive layer 3 in this application to be in the same place two copper-clad plates laminating, this adhesive layer 3 requires to have certain bearing effect, moreover, needs peracid alkaline's liquid medicine in the technology of production flexible line way board, still needs the environment of excess high temperature, consequently, the substrate 31 that chooses for use just needs to have certain stiffness, needs acid and alkali corrosion resistance and high temperature resistance moreover.
In one embodiment, the substrate 31 may be a plastic film, and a PET film with high temperature resistance and low shrinkage is specifically selected as the substrate 31.
In one embodiment, the substrate 31 should have a certain thickness, and the thickness of the substrate 31 is too thick to form the through hole a in the subsequent process, and the cost is high, so that the substrate cannot bear the copper clad laminate. In the present embodiment, the base material 31 may be 10 μm to 18 μm, and more specifically, may be about 12 μm.
In one embodiment, the first adhesive layer 32 and the second adhesive layer 33 may be acrylic adhesive or other conventional adhesive, and the viscosity is not too high, and the viscosity is too high, which is difficult to separate the first flexible circuit board 100 and the second flexible circuit board 200 from the adhesive layer 3, and the first flexible circuit board 100 and the second flexible circuit board 200 are easily broken during the separation process, as shown in fig. 3.
In one embodiment, the first adhesive layer 32 and the second adhesive layer 33 have substantially the same thickness, and the entire adhesive layer 3 has a thickness of substantially 20 μm to 30 μm.
In one embodiment, the release film 4 is attached to the surfaces of the first adhesive layer 32 and the second adhesive layer 33 before the adhesive layer 3 is used.
S3, referring to fig. 3, forming a first blind via 15 and a second blind via 25 on two sides of the first intermediate body 10, respectively, where the first blind via 15 penetrates through the first metal layer 12 and the first intermediate layer 11, and the second blind via 25 penetrates through the fourth metal layer 23 and the second intermediate layer 21.
In one embodiment, the first blind hole 15 and the second blind hole 25 are formed by a laser or mechanical via-forming method.
S4, referring to fig. 3 again, a first circuit layer 14 and a second circuit layer 24 are formed on the outermost first metal layer 12 and the outermost fourth metal layer 23 of the first intermediate 10 where the first via hole 15 and the second via hole 25 are formed, respectively.
In one embodiment, the first circuit layer 14 and the second circuit layer 24 may be obtained by exposing and developing the first metal layer 12 and the fourth metal layer 23.
The process of forming the first circuit layer 14 and the second circuit layer 24 specifically includes:
s41, soaking the first intermediate 10 with the first blind holes 15 and the second blind holes 25 in the shadow solution. The purpose is to deposit a layer of compact, firm and conductive semi-conductive film on the hole walls of the first blind hole 15 and the second blind hole 25 formed after drilling, and the semi-conductive film is used as a substrate for subsequent copper electroplating so as to facilitate the next step of copper electroplating.
And S42, cutting edges of the first intermediate body 10 subjected to the shading treatment, cutting the edges of the first intermediate body 10, and removing redundant parts.
S43, performing film pressing, exposure, and development on the first intermediate 10 after the edge cutting process to manufacture a circuit, so as to form the first circuit layer 14 and the second circuit layer 24.
Wherein this application carries out the circuit preparation through laminating two copper-clad plates together, has not only improved the efficiency of circuit preparation, has reduced the use of consumptive material moreover, does benefit to the press mold in-process and compares in two solitary flexible line way board preparations and has reduced half the consumptive material.
S5, referring to fig. 3 again, a first conductive layer 16 is formed in the first blind via 15 formed with the semiconductive film to electrically connect the first circuit layer 14 and the second metal layer 13, so as to form the first flexible circuit board 100. Forming a second conductive layer 26 in the second blind via 25 formed with the semiconductive film to electrically connect the second circuit layer 24 and the third metal layer 22, so as to form a second flexible printed circuit board 200. The first flexible wiring board 100 and the second flexible wiring board 200 are respectively located on both sides of the adhesive layer 3 to obtain a second intermediate 20.
In one embodiment, first conductive layer 16 and second conductive layer 26 are formed by electroplating.
In one embodiment, a film removing process is further included after the first flexible printed circuit board 100 and the second flexible printed circuit board 200 are formed, and a film attached during circuit manufacturing is removed.
In an embodiment, after the first flexible wiring board 100 and the second flexible wiring board 200 are formed, the method further includes:
a layer is added on the surface of the first circuit layer 14 to form at least one third circuit layer (not shown), and the third circuit layer is electrically connected to the first circuit layer 14.
And adding a layer on the surface of the second circuit layer 24 to form at least a fourth circuit layer (not shown), wherein the fourth circuit layer is electrically connected to the second circuit layer 24.
The online manufacturing of the multilayer flexible circuit board can be realized through the steps, and specifically, the layer adding method is only required to be realized by adopting a traditional layer adding method.
S6, referring to fig. 3 and 6, a plurality of through holes a or third blind holes b are formed on the second intermediate body 20 to form the identification code.
According to the manufacturing method of the flexible circuit board, the identification code needs to be formed on the second intermediate body 20 so as to be connected in series in a factory, and the three blind holes b or the through holes a can be formed in a laser hole forming mode so as to manufacture the two-dimensional code.
In one embodiment, the two-dimensional code for identification is manufactured by forming the through holes a on the second intermediate body 20, and the reading rate of the through holes a is higher than that of the third blind holes b. In the AB process, the problem of poor code reading rate exists when the laser is formed into the third blind hole b two-dimensional code under the condition of not increasing typesetting, namely not increasing cost. There are two solutions to this problem, the first is to increase the light source of the two-dimensional code reading head to increase the reading rate; the second method is to form through holes a at the positions where the second intermediate bodies 20 are all waste material areas by laser to form through hole two-dimensional codes, so that the reading code rate is improved.
S7, referring again to fig. 3, the first flexible wiring board 100 and the second flexible wiring board 200 on the second intermediate body 20, the first flexible wiring board 100 and the second flexible wiring board 200 are separated from the adhesive layer 3, and are separated.
Referring to fig. 7 to 9, the specific method of splitting includes:
s71 provide a bundling device 300, bundling device 300 includes bundling wheel group 5 and winding wheel group 6, bundling wheel group 5 includes relative first bundling wheel group 51 and the second bundling wheel group 52 that sets up, bundling wheel group 5 is used for carrying out the bundling with first flexible line way board 100 and the first flexible line way board 100 of second flexible line way board 200 and second flexible line way board 200, winding wheel group 6 is used for carrying out the rolling respectively with first flexible line way board 100 and the first flexible line way board 100 of second flexible line way board 200 and second flexible line way board 200 after the bundling.
In one embodiment, the first rewind wheel set 51 includes two rollers (r) and the second rewind wheel set 52 includes two rollers (r).
And S72, enabling a second intermediate body 20 to penetrate between the first coiling wheel group 51 and the second coiling wheel group 52, and enabling the first flexible circuit board 100 and the second flexible circuit board 200, the first flexible circuit board 100 and the second flexible circuit board 200 to be respectively in contact with the first coiling wheel group 51 and the second coiling wheel group 52.
And S73, the first coiling wheel group 51 and the second coiling wheel group 52 respectively coil the first flexible circuit board 100 and the second flexible circuit board 200.
And S74, the winding wheel set 6 respectively winds the first flexible circuit board 100 and the second flexible circuit board 200 after being wound, and the first flexible circuit board 100 and the second flexible circuit board 200 are wound.
In an embodiment, the winding wheel set 6 includes a first winding wheel 61 (including a roller), a second winding wheel 62 (including a roller), and a third winding wheel 63 (including a roller), the first winding wheel 61 is configured to wind the first flexible printed circuit board 100, the second winding wheel 62 is configured to wind the adhesive layer 3, and the third winding wheel 63 is configured to wind the second flexible printed circuit board 200.
After the copper plating process is completed by roll-to-roll lamination, the first flexible circuit board 100 and the second flexible circuit board 200 are separated from each other, and then the subsequent multilayer circuit board is manufactured. The difficulty in separating the first flexible wiring board 100 and the second flexible wiring board 200 which are attached together is how to not damage the first flexible wiring board 100 and the second flexible wiring board 200. So the split device selection is critical. Referring to fig. 7 to 9, the present application adopts three methods for splitting.
As shown in fig. 7, the principle of the first roll-separating mode is that separating films (not shown) are respectively disposed on the roller of the first roll-separating wheel set 51 and the roller of the second roll-separating wheel set 52, and the two separating films are respectively bonded with the first flexible circuit board 100 and the second flexible circuit board 200. The two separation films are respectively wound on the first sub-winding wheel set 51 and the second sub-winding wheel set 52 and wound on the first winding wheel 61 and the third winding wheel 63, and the middle adhesive layer 3 is directly received and fed onto the second winding wheel 62, so that the sub-winding action is realized. The key point at this time is that the first flexible circuit board 100 and the second flexible circuit board 200 are too tight to be attached to the adhesive layer 3, and the adhesive layer 3 is selected to have low viscosity according to actual needs.
As shown in fig. 8, the second roll-separating method is based on the principle that the roll-separating device 300 further includes a separating mechanism 7, and the separating mechanism 7 is used for separating the first flexible printed circuit board 100 and the second flexible printed circuit board 200 on both sides of the adhesive layer 3. Specifically, the separating mechanism 7 is disposed on one side of the partial winding wheel set 5 close to the winding wheel set 6, and the separating mechanism 7 includes two separating knives respectively corresponding to the first partial winding wheel set 51 and the second partial winding wheel set 52. The blade of the separating knife is perpendicular to the running direction of the first flexible circuit board 100 and the second flexible circuit board 200, the blade of the separating knife is arranged close to the roller and the roller, the blade of the separating knife is arranged close to the adhesive layer 3, and the first flexible circuit board 100 and the second flexible circuit board 200 are separated through the blades of the two separating knives and the rolling pulling force of the rollers.
As shown in fig. 9, the third roll-separating method is based on the principle that a wet process is added during the separation process, and a chemical agent capable of chemically reacting with the first glue layer 32 and the second glue layer 33 on the intermediate adhesive layer 3 is added, and by configuring a suitable concentration, the chemical agent can reduce the viscosity of the first glue layer 32 and the second glue layer 33, but does not damage the first flexible printed circuit board 100 and the second flexible printed circuit board 200, thereby separating the first flexible printed circuit board 100 and the second flexible printed circuit board 200. Specifically, the separating device 300 includes a separating mechanism 8, the separating mechanism 8 is disposed on a side of the partial winding wheel set 5 away from the winding wheel set 6, the separating mechanism 8 includes a separating groove 81 and a separating liquid 82 accommodated in the separating groove 81, and the separating liquid 82 is used for reducing the viscosity of the first adhesive layer 32 and the second adhesive layer 33 on the adhesive layer 3, so as to separate the adhesive layer 3 from the first flexible printed circuit board 100 and the second flexible printed circuit board 200.
The first flexible line way board 100 of adhesive layer 3 laminating and second flexible line way board 200 are earlier weakened the viscidity of first glue film 32 and second glue film 33 through parting liquid 82 (wet process), through the concentration of control parting liquid 82, the line speed of production line, avoid violent chemical reaction with parting liquid 82 contact time's factor such as, guarantee not to destroy first flexible line way board 100 and second flexible line way board 200, guarantee simultaneously that the enough gyro wheel of intensity of PET substrate the pulling force of roller seventeen does not break, reach the purpose of retrieving the PET substrate.
In one embodiment, the separation solution 82 is acetone (CH) 3 COCH 3 ) PH 7, the neutral separation liquid 82 does not corrode or damage the first flexible printed circuit board 100 and the second flexible printed circuit board 200, and the first adhesive layer 32 and the second adhesive layer 33 of the adhesive layer 3 are acrylic acid (C) 3 H 4 O 2 ) The acetone-soluble acrylic does not damage the dielectric layers (i.e., the first intermediate layer 11 and the second intermediate layer 21) of the flexible wiring board. It is understood that the separation liquid 82 may also be selected from other solvents capable of dissolving the adhesive layer 3, such as cyclohexanone, chloroform, ethyl acetate, methanol, and the like.
Acetone with the concentration of 50% -80% is added into the separation tank 81, the length of the tank body of the separation tank 81 is 1mm-2mm, the tank body is filled with acetone liquid medicine, the flexible circuit board is contacted with the acetone liquid medicine in a soaking or spraying mode, the linear speed of the separation equipment is controlled to be 3m/min-4m/min, and therefore the time of the separation tank 81 is controlled to be 15s-40s, the acetone and acrylic acid on the double-sided adhesive tape can be guaranteed to react and dissolve, the viscosity is reduced, and the separation purpose is achieved.
In an embodiment, the split winding device 300 further includes a cleaning and drying mechanism 9 disposed on a side of the winding wheel set 6 far away from the split winding wheel set 5, and the cleaning and drying mechanism 9 is configured to clean and dry the split first flexible printed circuit board 100 and the split second flexible printed circuit board 200. After separation, the separation method needs a section of cleaning and drying process to wash away the acetone liquid medicine on the copper foil and dry the flexible circuit board. Acetone is a neutral solvent, and is soluble in water, so that the cleaning can be carried out by water.
The method is adopted to prepare a plurality of single-layer or multi-layer flexible circuit boards, the inner-layer circuit layers can be further manufactured on the plurality of single-layer or multi-layer flexible circuit boards at the later stage, and the multi-layer flexible circuit boards are formed by a conventional layer increasing method. The method for manufacturing the first flexible printed circuit board 100 and the second flexible printed circuit board 200 of the present application requires only one process, which is named as "AB process" herein, as shown in fig. 5. And (2) rolling and pasting after blanking, pasting the two copper-clad plates together by using an adhesive layer, simultaneously cutting edges and copper plating by using a laser process to form blind holes after pasting, then coiling, and finally finishing a manufacturing process to obtain two single-layer or multi-layer flexible circuit boards. Then making the single-layer or multi-layer flexible circuit board into an inner-layer circuit, and forming various required multi-layer flexible circuit boards by a conventional layer increasing method. The manufacturing method effectively improves the production efficiency and saves materials on the basis of simplifying the flow.
Compared with the prior art, the manufacturing method of the flexible circuit board provided by the invention adopts a roll-to-roll laminating production mode, can be used for simultaneously producing two single-layer or multi-layer flexible circuit boards, effectively improves the production efficiency and the productivity on the basis of simplifying the process, saves materials and reduces the cost.
Claims (10)
1. A manufacturing method of a flexible circuit board is characterized by comprising the following steps:
providing a first copper-clad plate and a second copper-clad plate, wherein the first copper-clad plate comprises a first metal layer and a second metal layer which are oppositely arranged, and the second copper-clad plate comprises a third metal layer and a fourth metal layer which are oppositely arranged;
providing an adhesive layer, sequentially laminating the first copper-clad plate, the adhesive layer and the second copper-clad plate to enable the adhesive layer to be located between the second metal layer and the third metal layer, and then laminating to obtain a first intermediate;
forming a first circuit layer on the first metal layer on the outermost side of the first intermediate body, and electrically connecting the first circuit layer with the second metal layer to form a first flexible circuit board, forming a second circuit layer on the fourth metal layer on the outermost side of the intermediate body, and electrically connecting the second circuit layer with the third metal layer to form a second flexible circuit board; and
and splitting the first flexible circuit board and the second flexible circuit board on the adhesive layer.
2. The method of manufacturing a flexible wiring board according to claim 1, further comprising:
forming a first blind hole and a second blind hole on two sides of the intermediate body respectively; and
and forming a first conductive layer in the first blind hole to electrically connect the first circuit layer with the second metal layer, and forming a second conductive layer in the second blind hole to electrically connect the second circuit layer with the third metal layer.
3. The method of manufacturing a flexible wiring board according to claim 1, wherein before the step of separating the first flexible wiring board and the second flexible wiring board on the adhesive layer, the method further comprises:
adding a layer on the surface of the first circuit layer to form at least one third circuit layer, wherein the third circuit layer is electrically connected with the first circuit layer; and
and adding a layer on the surface of the second circuit layer to form at least one fourth circuit layer, wherein the fourth circuit layer is electrically connected with the second circuit layer.
4. The method of manufacturing a flexible wiring board according to claim 1, further comprising:
and cutting edges of the first intermediate.
5. The method of manufacturing a flexible wiring board according to claim 1, wherein before the step of separating the first flexible wiring board and the second flexible wiring board on the adhesive layer, the method further comprises:
and forming a plurality of through holes or a plurality of third blind holes on the first flexible circuit board and the second flexible circuit board to form the identification code.
6. The method for manufacturing a flexible printed circuit according to claim 1, wherein the step of dividing the first flexible printed circuit and the second flexible printed circuit on the adhesive layer specifically comprises:
providing a decoiling device, wherein the decoiling device comprises a decoiling wheel group and a winding wheel group, the decoiling wheel group comprises a first decoiling wheel group and a second decoiling wheel group which are arranged oppositely, the decoiling wheel group is used for decoiling the first flexible circuit board and the second flexible circuit board, and the winding wheel group is used for respectively winding the decoiled first flexible circuit board and the decoiled second flexible circuit board;
enabling the first flexible circuit board and the second flexible circuit board attached to the adhesive layer to penetrate through the space between the first partial rolling wheel set and the second partial rolling wheel set, and enabling the first flexible circuit board and the second flexible circuit board to be respectively contacted with the first partial rolling wheel set and the second partial rolling wheel set;
the first flexible circuit board and the second flexible circuit board are respectively reeled by the first reeling wheel group and the second reeling wheel group; and
the winding wheel set respectively winds the first flexible circuit board and the second flexible circuit board after the split winding.
7. The method of manufacturing a flexible wiring board according to claim 6, wherein said separating device further comprises a separating mechanism for separating said first flexible wiring board and said second flexible wiring board from said adhesive layer.
8. The method according to claim 7, wherein the separating mechanism is disposed on a side of the unwinding wheel set adjacent to the winding wheel set, and the separating mechanism includes two separating knives disposed corresponding to the first unwinding wheel set and the second unwinding wheel set, respectively.
9. The method for manufacturing a flexible printed circuit board according to claim 7, wherein the separating mechanism is disposed on a side of the sub-winding wheel set away from the winding wheel set, the separating mechanism includes a separating groove and a separating liquid accommodated in the separating groove, and the separating liquid is used to reduce the viscosity of the adhesive layer, so that the adhesive layer is separated from the first flexible printed circuit board and the second flexible printed circuit board.
10. The method for manufacturing the flexible printed circuit board according to claim 9, wherein the separating device further comprises a cleaning and drying mechanism disposed on a side of the winding wheel set away from the separating wheel set, and the cleaning and drying mechanism is configured to clean and dry the first flexible printed circuit board and the second flexible printed circuit board after separation.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110336565.7A CN115135006A (en) | 2021-03-29 | 2021-03-29 | Manufacturing method of flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110336565.7A CN115135006A (en) | 2021-03-29 | 2021-03-29 | Manufacturing method of flexible circuit board |
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