CN115038312A - Power packaging module of motor controller - Google Patents
Power packaging module of motor controller Download PDFInfo
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- CN115038312A CN115038312A CN202210727248.2A CN202210727248A CN115038312A CN 115038312 A CN115038312 A CN 115038312A CN 202210727248 A CN202210727248 A CN 202210727248A CN 115038312 A CN115038312 A CN 115038312A
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- 238000004806 packaging method and process Methods 0.000 title abstract description 15
- 230000017525 heat dissipation Effects 0.000 claims abstract description 140
- 238000001816 cooling Methods 0.000 claims abstract description 24
- 239000000110 cooling liquid Substances 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 239000003990 capacitor Substances 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 41
- 238000005538 encapsulation Methods 0.000 claims description 13
- 239000004033 plastic Substances 0.000 claims description 10
- 238000004382 potting Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 abstract description 2
- 239000000498 cooling water Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 150000001879 copper Chemical class 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- 230000005611 electricity Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/72—Electric energy management in electromobility
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Inverter Devices (AREA)
Abstract
The invention provides a power packaging module of a motor controller. The power package module includes a plurality of power cells and a cooler for cooling the power cells, the cooler including: the cooling box defines a containing cavity for containing cooling liquid; the heat dissipation part comprises a heat dissipation body in sealing connection with the cooling box and a plurality of first heat dissipation needles arranged on the heat dissipation body at intervals, and the plurality of first heat dissipation needles are positioned in the accommodating cavity; the plurality of second heat dissipation pins are positioned in the accommodating cavity, the plurality of second heat dissipation pins are arranged on the bottom plate of the cooling box at intervals, and the first heat dissipation pins and the second heat dissipation pins are alternately arranged; wherein, each power unit is located the one side that deviates from first heat dissipation needle of heat dissipation body, and first heat dissipation body sets up with each power unit laminating to dispel the heat to a plurality of power units. The technical scheme of the invention solves the problem of poor heat dissipation capability of the power packaging module of the motor controller in the prior art.
Description
Technical Field
The invention relates to the technical field of motor controllers, in particular to a power packaging module of a motor controller.
Background
The demand of the new energy vehicle on an electric drive system is the core driving force of technical innovation, and researches are mainly carried out around high power density, high safety, reliability, low cost and the like. The motor controller power unit assembly is an electric drive system electric energy conversion core assembly, determines key attributes such as vehicle dynamic property, economy and reliability, and is 40% of the cost of the super electric drive system.
However, the power unit assembly in the prior art has poor heat dissipation capability, and is difficult to perform good heat dissipation on the power unit.
Disclosure of Invention
The invention mainly aims to provide a power encapsulation module of a motor controller, which is used for solving the problem of poor heat dissipation capability of the power encapsulation module of the motor controller in the prior art.
In order to achieve the above object, the present invention provides a power pack module of a motor controller, the power pack module including a plurality of power units and a cooler for cooling the power units, the cooler including: the cooling box defines a containing cavity for containing cooling liquid; the heat dissipation part comprises a heat dissipation body hermetically connected with the cooling box and a plurality of first heat dissipation needles arranged on the heat dissipation body at intervals, and the plurality of first heat dissipation needles are positioned in the accommodating cavity; the plurality of second heat dissipation needles are positioned in the accommodating cavity, the plurality of second heat dissipation needles are arranged on the bottom plate of the cooling box at intervals, and the first heat dissipation needles and the second heat dissipation needles are alternately arranged; wherein, each power unit is located the one side that deviates from first heat dissipation needle of heat dissipation body, and first heat dissipation body sets up with each power unit laminating to dispel the heat to a plurality of power units.
Furthermore, a plurality of first heat dissipation pins are arranged on the first heat dissipation body in a staggered manner; the plurality of second heat dissipation pins are arranged on the bottom plate in a staggered mode.
Furthermore, the power encapsulation module further comprises a bus capacitor electrically connected with the power unit, the bus capacitor is attached to the heat dissipation body, and the bus capacitor and the power unit are located on the same side of the heat dissipation body.
Further, the bus capacitor comprises a laminated busbar and a plurality of capacitor cores arranged on the laminated busbar, the laminated busbar is attached to the heat dissipation body, and the laminated busbar is electrically connected with the power unit.
Furthermore, the power unit comprises a copper-clad substrate arranged on the heat dissipation body and a discharge resistor electrically connected with the copper-clad substrate, wherein the discharge resistor is electrically connected with the bus capacitor.
The power packaging module further comprises a positive input terminal, a negative input terminal and an output terminal which are electrically connected with the copper-clad substrate, wherein the upper bridge arm switch power device chip is connected between the positive input terminal and the output terminal, and the lower bridge arm power device chip is connected between the negative input terminal and the output terminal.
Furthermore, the power unit also comprises a lower bridge arm filter element and an upper bridge arm filter element which are electrically connected with the copper-clad substrate, wherein the upper bridge arm filter element is connected between the positive input terminal and the output terminal, and the lower bridge arm filter element is connected between the negative input terminal and the output terminal.
Further, the power unit further comprises a temperature sensor electrically connected with the copper-clad substrate.
Further, the power unit further comprises a current sensor electrically connected with the copper-clad substrate, and the output terminal is electrically connected with the current sensor.
Furthermore, the power package module further comprises a plastic package shell arranged on one side of the radiating part, which is far away from the cooling box, and a potting body positioned between the plastic package shell and the radiating part.
By applying the technical scheme of the invention, the plurality of first heat dissipation needles and the plurality of second heat dissipation needles are arranged, and the first heat dissipation needles and the second heat dissipation needles are alternately arranged, so that a cooling water channel formed between the adjacent first heat dissipation needles and the adjacent second heat dissipation needles is smaller than the sectional area of the cooling water channel formed between the adjacent two first heat dissipation needles (namely, the original cooling water channel is subdivided into a plurality of smaller branch water channels), thereby increasing the water resistance, further enhancing the heat dissipation capacity of the cooler and better dissipating heat of the power unit.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 shows a schematic structural diagram of one embodiment of a power pack module of a motor controller of the present invention;
FIG. 2 illustrates a schematic structural diagram of another embodiment of a power pack module of the motor controller of the present invention;
fig. 3 shows an electrically defined schematic diagram of a power pack module of a motor controller of an embodiment of the invention;
FIG. 4 illustrates a schematic structural diagram of a power pack module of the motor controller of FIG. 2;
FIG. 5 shows a schematic diagram of a power cell of the power pack module of the motor controller of FIG. 4;
FIG. 6 is an exploded schematic view of a cooler of the power pack module of the motor controller of FIG. 1;
FIG. 7 shows a schematic diagram of a cooler of the power pack module of the motor controller of FIG. 1; and
fig. 8 illustrates a bottom view of the heat sink portion of the cooler of fig. 7.
Wherein the figures include the following reference numerals:
102. a discharge resistor; 103. an upper bridge arm switch power device chip; 104. a lower bridge arm power switch device chip; 105. a copper-clad substrate; 106. a lower bridge arm filter element; 107. a temperature sensor; 108. a current sensor; 109. an upper bridge arm filter element; 110. welding the binding line; 111. each signal terminal; 3. a cooler; 4. plastic packaging the shell; 301. a heat dissipation body; 302. a first heat radiation pin; 303. a base plate; 304. a second heat radiation pin; 15. and (6) bus capacitance.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 4, 6 and 7, an embodiment of the present invention provides a power pack module of a motor controller. The power package module includes a plurality of power cells and a cooler 3 for cooling the power cells, and the cooler 3 includes a cooling box, a heat dissipation part, and a plurality of second heat dissipation pins 304. The cooling box defines a containing cavity for containing cooling liquid; the heat dissipation part comprises a heat dissipation body 301 connected with the cooling box in a sealing mode and a plurality of first heat dissipation pins 302 arranged on the heat dissipation body 301 at intervals, and the first heat dissipation pins 302 are located in the accommodating cavity; the plurality of second heat dissipation pins 304 are positioned in the accommodating cavity, the plurality of second heat dissipation pins 304 are arranged on the bottom plate 303 of the cooling box at intervals, and the first heat dissipation pins 302 and the second heat dissipation pins 304 are alternately arranged; each power unit is located on one side of the heat dissipation body 301 away from the first heat dissipation pin 302, and the first heat dissipation body 301 is attached to each power unit to dissipate heat of the plurality of power units.
Among the above-mentioned technical scheme, through setting up a plurality of first heat dissipation needles 302 and a plurality of second heat dissipation needles 304, and first heat dissipation needle 302 and second heat dissipation needle 304 set up in turn, like this, the cooling water course that forms between adjacent first heat dissipation needle 302 and the second heat dissipation needle 304 is littleer (being about to original one cooling water course is refined into a plurality of less branch water courses) than the cooling water course that directly forms between two adjacent first heat dissipation needles 302 to increase the water resistance, and then strengthen the heat-sinking capability of cooler, dispel the heat to the power unit better.
Further, the heat dissipation body 301 is mounted on the cooling box, so that the first heat dissipation pins 302 and the second heat dissipation pins 304 are alternately arranged, the cross-sectional area of the cooling water channel in the accommodating cavity is smaller, and compared with the method that the number of the first heat dissipation pins 302 is directly increased, the difficulty of the production process can be reduced.
Further, the heat dissipation body 301 may transfer heat generated by the power unit to the cooling liquid in the accommodating cavity through the first heat dissipation pins 302, so as to cool the power unit.
Specifically, in the embodiment of the present invention, the heat dissipation body 301 and the plurality of first heat dissipation pins 302 are integrally formed to constitute the upper portion of the cooler 3, the bottom plate 303 and the second heat dissipation pins 304 are integrally formed to constitute the lower portion of the cooler 3, and the upper portion of the cooler 3 and the lower portion of the cooler are butt-welded, which facilitates the processing.
Preferably, in the embodiment of the present invention, the heat dissipation body 301 is welded to the cooling box or connected to the cooling box through a sealing ring and a bolt, so as to achieve the sealing connection between the heat dissipation body 301 and the cooling box.
Preferably, as shown in fig. 8, in the embodiment of the present invention, the first heat dissipation pins 302 and the second heat dissipation pins 304 are oblong pin pins, which can increase the heat dissipation area, thereby increasing the heat dissipation capability of the heat dissipation part.
Specifically, as shown in fig. 4, in the embodiment of the present invention, the number of the power units is three, specifically, the power units 1-0, 2-0, and 3-0, and the lower surfaces of the power units 1-0, 2-0, and 3-0 are welded on the surface of the heat dissipation body 301 facing away from the first heat dissipation pin 302, so that the mounting stability of the power units can be increased.
As shown in fig. 7, in the embodiment of the present invention, a plurality of first heat dissipation pins 302 are disposed on the first heat dissipation body 301 in a staggered manner; the plurality of second heat dissipation pins 304 are arranged on the bottom plate 303 in a staggered manner. This can make the distribution of the plurality of first heat dissipation pins 302 on the heat dissipation body 301 more uniform, and also can make the distribution of the plurality of second heat dissipation pins 304 on the bottom plate 303 more uniform, thereby enhancing the heat dissipation capability of the cooler 3.
It should be noted that, in the embodiment of the present invention, the staggered arrangement refers to that the first heat dissipation pins 302 in two adjacent rows are arranged in a staggered manner, and the first heat dissipation pins 302 in two adjacent columns are arranged in a staggered manner; alternatively, two adjacent rows of the second heat dissipation pins 304 are arranged in a staggered manner, and two adjacent columns of the second heat dissipation pins 304 are arranged in a staggered manner.
As shown in fig. 4, in the embodiment of the present invention, the power package module further includes a bus capacitor 15 electrically connected to the power unit, the bus capacitor 15 is attached to the heat dissipation body 301, and the bus capacitor 15 and the power unit are located on the same side of the heat dissipation body 301.
Through the arrangement, the bus capacitor 15 and the power units can share the same cooler 3, so that the structure of the packaged power module is more compact and the integration level is high.
Further, the bus capacitor 15 and the plurality of power units share one cooler 3, which can improve the heat dissipation efficiency of the cooler 3.
Further, the bus capacitor 15 and the power units share one cooler 3, so that on the basis of realizing strong heat dissipation, a capacitor with a small volume can be selected, the volume of the capacitor is effectively reduced, and the volume of the power packaging module is further reduced.
Further, under the condition that the power package module has a good heat dissipation effect, the power density of the power package module can be improved by reducing the volume of the power package module.
Specifically, in the embodiment of the present invention, the bus capacitor 15 includes a laminated bus bar and a plurality of capacitor cores disposed on the laminated bus bar, the laminated bus bar is attached to the heat dissipation body 301, and the laminated bus bar is electrically connected to the power unit.
Through the arrangement, the plurality of capacitor cores are electrically connected with the power unit through the laminated busbar, so that stray parameters can be reduced; further, the copper bars on the lower surface of the laminated busbar are arranged on the heat dissipation body 301, so that heat generated by a plurality of capacitor cores can be transferred to the cooler 3 through the laminated busbar, and heat dissipation is performed on the bus capacitors 15.
Furthermore, the laminated busbar is used for connecting the plurality of capacitor cores together, so that the plurality of capacitor cores can be electrically connected, and stray parameters can be reduced.
It should be noted that, in the embodiment of the present invention, the laminated busbar may be a laminated copper bar.
In the embodiment of the present invention, the bus capacitor 15 is attached to the heat dissipating body 301, and the attachment is not limited to the attachment, welding, screwing, and the like.
Fig. 3 is an electrical definition schematic diagram of a power package module according to an embodiment of the present invention, which corresponds to the structural diagram of the power package structure in fig. 4, and the electrical schematic diagram includes three-phase full-bridge six-power switching devices Q1-Q6 (i.e., upper bridge arm switching power device chip 103 and lower bridge arm power switching device chip 104 of three power units), a bus capacitor C (i.e., bus capacitor 15), discharge units R1-R3 (i.e., discharge resistors 102 of three power units), filter absorption capacitors C1-C6 (i.e., lower bridge arm filter elements 106 and upper bridge arm filter elements 109 of three power units), temperature sensors T1-T3 (i.e., temperature sensors 107 of three power units), current sensors I1-I3 (i.e., current sensors 108 of three power units), and specific signal pin definitions are in one-to-one correspondence with fig. 1 and fig. 2.
As shown in fig. 3 and 5, in the embodiment of the present invention, the power unit includes the copper-clad substrate 105 disposed on the heat dissipation body 301 and the discharge resistor 102 electrically connected to the copper-clad substrate 105, and the discharge resistor 102 is electrically connected to the bus capacitor 15.
Among the above-mentioned technical scheme, through being connected discharge resistor 102 with bus capacitor 15 electricity, can form the discharge circuit, can bleed the residual voltage in bus capacitor 15 like this to guarantee that whole car flame-out back bus capacitor 15 does not have the high voltage to remain after the certain time, and then realize the protection to power encapsulation module.
Further, by arranging the discharge resistor 102 on the copper-clad substrate 105, wiring can be reduced, the discharge resistor 102 can be directly packaged on the copper-clad substrate 105, the discharge resistor with a smaller size can be selected, and connecting pieces such as bolts can be reduced, so that the integrated arrangement mode can achieve the effects of easiness in installation, small size and good heat dissipation.
Specifically, in the embodiment of the present invention, the discharge resistor 102 is disposed at the periphery of the bus capacitor 15 so as to bleed off the residual voltage in the bus capacitor 15.
As shown in fig. 3, 4 and 5, in the embodiment of the present invention, the power unit includes a copper-clad substrate 105 disposed on the heat dissipation body 301, and an upper arm switching power device chip 103 and a lower arm power device chip 104 electrically connected to the copper-clad substrate 105, and the power package module further includes a positive input terminal, a negative input terminal and an output terminal electrically connected to the copper-clad substrate 105, where the upper arm switching power device chip 103 is connected between the positive input terminal and the output terminal, and the lower arm power device chip 104 is connected between the negative input terminal and the output terminal.
Through the arrangement, on one hand, the heat generated by the upper bridge arm switching power device chip 103 and the lower bridge arm switching power device chip 104 can be instantly conducted to the cooler 3 through the arrangement of the copper-clad substrate 105 with low thermal resistance, so that the heat dissipation of the power unit is realized; on the other hand, in the present embodiment, the copper-clad substrate 105 having a small thickness dimension is used for a substrate having a large thickness dimension, so that the thickness dimension of the power unit can be reduced, the volume of the power package module can be reduced, and the miniaturization of the power package module can be realized.
Specifically, as shown in fig. 4, in the embodiment of the present invention, the power terminals of the upper bridge arm switching power device chip 103 and the lower bridge arm switching power device chip 104 are connected to the internal power terminals of the plurality of capacitor cores through the laminated copper bars, and the positive input terminal and the negative input terminal are both connected to the laminated copper bars of the bus capacitor 15, so as to realize the connection between the upper bridge arm switching power device chip 103 and the positive input terminal, and the connection between the lower bridge arm switching power device chip 104 and the negative input terminal.
Specifically, the internal power terminals of the plurality of capacitor cores are welded on the copper-clad substrate 105 through laminated copper bars, and the external power terminals of the plurality of capacitor cores are led out through the positive input terminal and the negative input terminal.
The positive input terminal, the negative input terminal and the output terminal are all welded copper bars. This may increase the conductivity.
Specifically, in the embodiment of the present invention, the upper arm switching power device chip 103 and the lower arm switching power device chip 104 are soldered on the copper-clad substrate 105, and the copper-clad substrate 105 is soldered on the heat sink. This can improve the heat conduction effect.
Specifically, as shown in fig. 1, fig. 2 and fig. 4, in the embodiment of the present invention, the number of the positive input terminals is three, specifically, the positive input terminals 1-1, 2-1 and 3-1, and the positive input terminals 1-1, 2-1 and 3-1 are respectively arranged in a one-to-one correspondence with the power cells 1-0, 2-0 and 3-0; the number of the negative input terminals is three, specifically negative input terminals 1-2, 2-2 and 3-2, the negative input terminals 1-2, 2-2 and 3-2 are respectively arranged corresponding to the power units 1-0, 2-0 and 3-0 one by one, and the positive input terminal and the negative input terminal are respectively connected with the positive power input terminal and the negative power input terminal of the high-voltage battery.
Specifically, as shown in fig. 1, fig. 2 and fig. 4, in the embodiment of the present invention, the number of the output terminals is three, specifically, the output terminals 1 to 14, 2 to 14 and 3 to 14 are respectively arranged in one-to-one correspondence with the power units 1 to 0, 2 to 0 and 3 to 0, and the output terminals 1 to 14, 2 to 14 and 3 to 14 are respectively connected with the three-phase output terminals of the motor.
Specifically, as shown in fig. 1 and fig. 2, in the embodiment of the present invention, the connection manner of the three output terminals and the three-phase output terminal of the motor may be a high-power connection manner such as bolt connection or laser welding.
Preferably, the three output terminals are respectively connected with the three-phase output terminals of the motor in a laser welding mode, so that the connection stray inductance can be reduced, and the EMC performance and the thermal performance of the system are improved.
Specifically, as shown in fig. 5, in the embodiment of the present invention, the upper bridge arm switching power device chip 103 may be formed by connecting a plurality of chips in parallel according to the output requirement of the system power performance, and similarly, the lower bridge arm switching power device chip 104 may also be formed by connecting a plurality of chips in parallel, so that the power expandability of the power encapsulation module is good.
Preferably, in the embodiment of the present invention, the copper-clad substrate 105 is a double-sided copper-clad substrate including a ceramic plate and copper sheets on upper and lower sides of the ceramic plate.
As shown in fig. 3 and 5, in the embodiment of the present invention, the power unit further includes a lower arm filter element 106 and an upper arm filter element 109 electrically connected to the copper-clad substrate 105, the upper arm filter element 109 is connected between the positive input terminal and the output terminal, and the lower arm filter element 106 is connected between the negative input terminal and the output terminal.
Through the arrangement, the upper bridge arm filter element 109 and the upper bridge arm switching power device chip 103 can be arranged in parallel, and the lower bridge arm filter element 106 and the lower bridge arm switching power device chip 104 are arranged in parallel, so that clutter generated in a power loop can be effectively absorbed, the power device can be ensured to be safely and reliably switched on and off, and the EMC performance of the system can be improved.
Specifically, the upper arm filter element 109 is arranged around the upper arm switching power device chip 103, and the lower arm filter element 106 is arranged around the lower arm switching power device chip 104, and the closer distance is the better the effect is.
As shown in fig. 3 and 5, in an embodiment of the invention, the power cell further includes a temperature sensor 107 electrically connected to the copper-clad substrate 105.
Through the arrangement, the temperature sensor 107 can be arranged around the upper bridge arm switching power device chip 103 and the lower bridge arm switching power device chip 104, so that the temperatures of the upper bridge arm switching power device chip 103, the lower bridge arm switching power device chip 104 and the copper-clad substrate 105 can be detected, and the detected temperatures are output, so that technicians can observe and ensure safe and reliable operation of the system.
As shown in fig. 3 and 5, in the embodiment of the present invention, the power unit further includes a current sensor 108 electrically connected to the copper-clad substrate 105, and the output terminal is electrically connected to the current sensor 108.
Through the arrangement, the current sensor 108 can detect the phase current of each power unit in real time and output the detected current, so that technicians can observe and ensure safe and reliable operation of the system; and the current sensor 108 is disposed on the copper-clad substrate 105, so that the current sensor 108 can transfer the generated heat to the cooler 3 through the copper-clad substrate 105, thereby achieving effective heat dissipation.
Preferably, in the embodiment of the present invention, compared to a conventional hall current sensor, the resistive sensor used in the present embodiment has a smaller volume and is easy to install, and the use of connecting members such as bolts can be reduced, so that the installation space can be saved.
As shown in FIGS. 1 and 2, in the embodiment of the invention, the power package module further comprises a plurality of signal terminals electrically connected to the copper-clad substrate 105, wherein the plurality of signal terminals are signal terminals 1-5, 1-6, 1-7, 1-8, 1-9, 1-10, 1-11, 1-12 and 1-13 corresponding to the power unit 1-0, signal terminals 2-5, 2-6, 2-7, 2-8, 2-9, 2-10, 2-11, 2-12 and 2-13 corresponding to the power unit 2-0, and signal terminals 3-5, 3-6, 3-7, 3-8, 3-9, 3-10, 3-11, 3-12 and 3-13 corresponding to the power unit 3-0, 3-13, wherein the specific signal terminals are defined in a one-to-one correspondence with fig. 3, so that the signal terminals 1-5-3-13 can communicate the signals of the power unit with the corresponding circuits of the driving circuit board.
Specifically, as shown in fig. 4, in the embodiment of the present invention, each signal terminal 111 is led out by a soldering auxiliary wiring terminal and connected to a driving circuit board outside the module.
Specifically, as shown in fig. 5, the power unit further includes a bonding wire 110 electrically connected to the copper-clad substrate 105, so that each signal terminal 111 can be electrically connected to the copper-clad substrate 105.
As shown in fig. 1, in the embodiment of the present invention, the power package module further includes a plastic package housing 4 disposed on a side of the heat dissipation portion away from the cooling box, and a potting body located between the plastic package housing 4 and the heat dissipation portion.
In the technical scheme, the plastic package shell 4 and the heat dissipation part can jointly form the encapsulation cavity, and then the encapsulation body is arranged in the encapsulation cavity, so that the integral encapsulation molding is realized, the process is simple, and the integration level is high.
Specifically, in the embodiment of the present invention, the epoxy resin in a molten state is added into the potting cavity, and then the epoxy resin is solidified to form the potting body, so that the plurality of power units and the bus capacitors 15 can be integrally packaged on the cooler, and thus the power packaging module is integrally formed.
Specifically, in the embodiment of the present invention, the positive input terminals 1-1, 2-1, and 3-1, the negative input terminals 1-2, 2-2, and 3-2, and the output terminals 1-14, 2-14, and 3-14 may all extend out of the plastic package housing 4 and be connected to an external structure.
Specifically, in the embodiment of the invention, the signal terminals 1-5-3-13 can extend out of the plastic package housing 4 to be connected with the driving circuit board outside the module.
The power unit assemblies of the motor controller for the vehicle known to the inventor are generally divided into two main categories according to the packaging form of the power device, namely a power unit based on a standard module packaging form and a power unit based on a discrete device packaging form. The modular power unit is simple in design and easy to realize in process, and has the defects of large and limited volume, redundant power level discrete design, large stray parameters of a power loop, high cost, basically identical arrangement form, influence of the appearance of the main box body on the appearance of the module, basically square and positive type, and incapability of realizing special-shaped structure and compact miniaturization; the power unit based on discrete devices has the advantages of expandable structure flexibility, continuous and unlimited power grade, more compact space, complex processing technology, high cost and difficult guarantee of production consistency.
In the power packaging module of the motor controller according to the embodiment of the invention, the upper bridge arm switching power device chip 103, the lower bridge arm switching power device chip 104, the discharge resistor 102, the upper bridge arm filter element 109, the lower bridge arm filter element 106, the bus capacitor 15, the current sensor 108 and the temperature sensor 107 are reasonably arranged on the copper-clad substrate 105, and the copper-clad substrate 105 is arranged on the cooler 3, so that the thermal resistance can be effectively reduced, the heat dissipation can be enhanced, and the miniaturization, high power and integration of the power packaging module can be ensured. Meanwhile, the arrangement of multiple sensors can ensure the safe and reliable work of the system. Furthermore, the compact arrangement among all devices can shorten a transmission path, effectively reduce stray parameters and cost, and improve the electrical stress, the efficiency and the electromagnetic compatibility of the system.
The invention relates to a power packaging module of a motor controller, which can improve the system reliability, dynamic property, efficiency, power density and the like of the motor controller through a deep integration technology.
From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects: through setting up a plurality of first heat dissipation needles and a plurality of second heat dissipation needle, and first heat dissipation needle and second heat dissipation needle set up in turn, like this, the cooling water course that forms between adjacent first heat dissipation needle and the second heat dissipation needle is more meticulous than the cooling water course that forms between two adjacent first heat dissipation needles to increase the water resistance, and then strengthen the heat-sinking capability of cooler, dispel the heat to the power unit better.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A power pack module of a motor controller, characterized in that the power pack module comprises a plurality of power units and a cooler (3) for cooling the power units, the cooler (3) comprising:
the cooling box defines a containing cavity for containing cooling liquid;
the heat dissipation part comprises a heat dissipation body (301) connected with the cooling box in a sealing mode and a plurality of first heat dissipation pins (302) arranged on the heat dissipation body (301) at intervals, and the first heat dissipation pins (302) are located in the accommodating cavity;
a plurality of second heat dissipation pins (304) located in the accommodating cavity, wherein the plurality of second heat dissipation pins (304) are arranged on a bottom plate (303) of the cooling box at intervals, and the first heat dissipation pins (302) and the second heat dissipation pins (304) are alternately arranged;
each power unit is located on one side, away from the first heat dissipation pin (302), of the heat dissipation body (301), and the first heat dissipation body (301) is attached to each power unit so as to dissipate heat of the plurality of power units.
2. The power pack module of the motor controller according to claim 1, wherein a plurality of the first heat dissipation pins (302) are alternately disposed on the first heat dissipation body (301); the second heat dissipation pins (304) are arranged on the bottom plate (303) in a staggered mode.
3. The power package module of the motor controller according to claim 1, further comprising a bus capacitor (15) electrically connected to the power unit, wherein the bus capacitor (15) is attached to the heat dissipation body (301), and the bus capacitor (15) and the power unit are located on the same side of the heat dissipation body (301).
4. The power package module of the motor controller according to claim 3, wherein the bus capacitor (15) comprises a laminated bus bar and a plurality of capacitor cores arranged on the laminated bus bar, the laminated bus bar is attached to the heat dissipation body (301), and the laminated bus bar is electrically connected with the power unit.
5. The power package module of the motor controller according to claim 3, wherein the power unit comprises a copper-clad substrate (105) disposed on the heat dissipation body (301) and a discharge resistor (102) electrically connected to the copper-clad substrate (105), the discharge resistor (102) being electrically connected to the bus capacitor (15).
6. The power package module of the motor controller according to any one of claims 1 to 5, wherein the power unit comprises a copper-clad substrate (105) disposed on the heat dissipation body (301), and an upper bridge arm switching power device chip (103) and a lower bridge arm switching power device chip (104) electrically connected to the copper-clad substrate (105), and the power package module further comprises a positive input terminal, a negative input terminal and an output terminal electrically connected to the copper-clad substrate (105), wherein the upper bridge arm switching power device chip (103) is connected between the positive input terminal and the output terminal, and the lower bridge arm power device chip (104) is connected between the negative input terminal and the output terminal.
7. The power pack module of the motor controller according to claim 6, wherein the power unit further comprises a lower arm filter element (106) and an upper arm filter element (109) electrically connected to the copper-clad substrate (105), the upper arm filter element (109) is connected between the positive input terminal and the output terminal, and the lower arm filter element (106) is connected between the negative input terminal and the output terminal.
8. The power pack module of the motor controller of claim 6, wherein the power cell further comprises a temperature sensor (107) electrically connected to the copper-clad substrate (105).
9. The power pack module of the motor controller of claim 6, wherein the power cell further comprises a current sensor (108) electrically connected to the copper-clad substrate (105), the output terminal being electrically connected to the current sensor (108).
10. The power encapsulation module of the motor controller according to any one of claims 1 to 5, characterized in that the power encapsulation module further comprises a plastic encapsulation housing (4) disposed at a side of the heat dissipation portion facing away from the cooling box and a potting body located between the plastic encapsulation housing (4) and the heat dissipation portion.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210727248.2A CN115038312A (en) | 2022-06-24 | 2022-06-24 | Power packaging module of motor controller |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210727248.2A CN115038312A (en) | 2022-06-24 | 2022-06-24 | Power packaging module of motor controller |
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| US20220095493A1 (en) * | 2020-09-24 | 2022-03-24 | Dana Tm4 Inc. | High density power module |
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| US20110310585A1 (en) * | 2010-06-21 | 2011-12-22 | Hitachi Automotive Systems, Ltd. | Power Semiconductor Device and Power Conversion Device |
| CN108233820A (en) * | 2016-12-16 | 2018-06-29 | 上海电驱动股份有限公司 | A kind of BSG electric machine controllers integrated electrical module |
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