CN115038231B - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN115038231B CN115038231B CN202110247210.0A CN202110247210A CN115038231B CN 115038231 B CN115038231 B CN 115038231B CN 202110247210 A CN202110247210 A CN 202110247210A CN 115038231 B CN115038231 B CN 115038231B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- silica gel
- board body
- protective layer
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 90
- 239000000741 silica gel Substances 0.000 claims abstract description 88
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 88
- 239000011241 protective layer Substances 0.000 claims abstract description 72
- 239000010410 layer Substances 0.000 claims description 43
- 230000002093 peripheral effect Effects 0.000 claims description 18
- 238000000926 separation method Methods 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 6
- 239000012188 paraffin wax Substances 0.000 claims description 6
- 239000006260 foam Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 16
- 230000032683 aging Effects 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 9
- 230000007613 environmental effect Effects 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 4
- 229920001296 polysiloxane Polymers 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 238000005507 spraying Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000011324 bead Substances 0.000 description 2
- 231100000956 nontoxicity Toxicity 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The embodiment of the invention discloses a circuit board and a manufacturing method thereof. The circuit board comprises: the circuit board comprises a circuit board body, wherein the circuit board body comprises a first surface and a second surface which are oppositely arranged, and a radiator is arranged on the first surface of the circuit board body; the circuit board further comprises a silica gel protective layer, wherein the silica gel protective layer covers the second surface, the area of the first surface, where the radiator is not arranged, and the edge area of the radiator. The scheme of the embodiment of the invention realizes better protection of the circuit board, and simultaneously ensures that the working temperature range of the circuit board is wider, the flame resistance level is higher, the processing process is safer, the environmental protection level is higher, the ageing resistance is better, the service life is longer, and the manufacturing cost is lower.
Description
Technical Field
The embodiment of the invention relates to the technical field of circuit boards, in particular to a circuit board and a manufacturing method thereof.
Background
With the continuous development of electronic technology, circuit boards are widely used in various fields. In some applications, environmental factors can cause degradation of board electrical performance, such as moisture and dust in the air, or corrosive gases or chemicals in extreme environments, which can affect the electrical performance of the circuit board. Especially in railway systems, the environment in which the equipment operates is more severe. In order to ensure the working performance of the circuit board in a severe environment, protection measures must be taken.
Disclosure of Invention
The invention provides a circuit board and a manufacturing method thereof, which are used for realizing better protection of the circuit board, and simultaneously, the circuit board has wider working temperature range, higher flame-retardant grade, safer processing process, higher environmental protection grade, better ageing resistance, longer service life and lower manufacturing cost.
In a first aspect, an embodiment of the present invention provides a circuit board, including:
the circuit board comprises a circuit board body, wherein the circuit board body comprises a first surface and a second surface which are oppositely arranged, and a radiator is arranged on the first surface of the circuit board body;
The circuit board further comprises a silica gel protective layer, wherein the silica gel protective layer covers the second surface, the area of the first surface, where the radiator is not arranged, and the edge area of the radiator.
Optionally, the circuit board body includes a device region and a peripheral region surrounding the device region, and the device region of the circuit board body includes a component;
a separation layer is arranged between the silica gel protective layer and the circuit board body in the device region;
And the edge area of the radiator is in direct contact with the silica gel protective layer.
Optionally, the circuit board includes a heat generating device, and the heat radiator is disposed at a side of the heat generating device away from the circuit board body;
And a filling layer is arranged between the radiator and the circuit board body and surrounds the area of the heating device.
Optionally, the filling layer is foam or sponge.
Optionally, the width of the peripheral region is 2-5mm.
Optionally, the separating layer is made of paraffin or oily glue.
Optionally, the peripheral area of the circuit board body and the edge area of the radiator both include fixing holes, and a fixing pressing strip is arranged on the surface of the silica gel protective layer far away from the circuit board body; the fixing pressing strip is arranged in the fixing hole.
Optionally, the thickness of the silica gel protective layer is greater than or equal to 0.3mm and less than or equal to 0.5mm.
Optionally, the circuit board further includes:
the electrostatic protection layer is arranged on the surface, far away from the circuit board body, of the silica gel protection layer.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a circuit board, including:
Providing a circuit board body, wherein the circuit board body comprises a first surface and a second surface which are oppositely arranged, and the first surface of the circuit board body is provided with a radiator;
and setting a silica gel protective layer, wherein the silica gel protective layer covers the second surface, the area of the first surface, where the radiator is not arranged, and the edge area of the radiator.
The circuit board provided by the embodiment of the invention comprises a circuit board body and the silica gel protective layers arranged on the first surface and the second surface of the circuit board body, and because the silica gel has the characteristics of good high-low temperature characteristics, excellent water repellency, strong film forming capability, corrosion resistance, aging resistance, convenience in demolding, low price and the like, the circuit board is covered by the silica gel protective layers, so that the circuit board has wider working temperature range, higher flame resistance level, safe processing process, no toxicity and pollution, higher environmental protection level, better ageing resistance, longer service life and lower manufacturing cost when the circuit board is better protected. And through setting up the marginal zone of silica gel protective layer cover radiator, when not influencing the radiating effect of radiator, can seal the device of radiator below, play better guard action.
Drawings
Fig. 1 is a schematic diagram of a circuit board according to the present embodiment;
fig. 2 is a schematic top view of a circuit board according to the present embodiment;
FIG. 3 is a schematic cross-sectional view of the circuit board of FIG. 2 along section line AA;
Fig. 4 is a schematic diagram of still another circuit board according to the present embodiment;
fig. 5 is a schematic diagram of still another circuit board according to the present embodiment;
Fig. 6 is a flowchart of a method for manufacturing a circuit board according to the present embodiment.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
The present embodiment provides a circuit board, fig. 1 is a schematic diagram of the circuit board provided in the present embodiment, and referring to fig. 1, the circuit board includes:
The circuit board comprises a circuit board body 10, wherein the circuit board body 10 comprises a first surface 11 and a second surface 12 which are oppositely arranged, and the first surface 11 of the circuit board body 10 is provided with a radiator 101;
the circuit board further includes a silicone protection layer 20, where the silicone protection layer 20 covers the second surface 11, a region of the first surface 11 where the heat spreader 101 is not disposed, and an edge region of the heat spreader 101.
The first surface 11 and the second surface 12 of the circuit board body 10 may further have other components besides the heat sink 101. Silica gel is an alias silicic acid gel, is a high-activity adsorption material, and belongs to amorphous substances. Silica gel is mainly composed of silicon dioxide, has stable chemical property and is not burnt, and is widely used in food-grade products and industrial protective articles. The silica gel has the characteristics of good high-low temperature characteristics, excellent water repellency, strong film forming capability, corrosion resistance, aging resistance, convenient demolding, low price and the like, the silica gel protective layer 20 can be formed on the surface of the circuit board body 10 by adopting a simpler process, and compared with the traditional protection mode, the circuit board is protected by adopting the silica gel protective layer 10, the circuit board has wider working temperature range, higher flame resistance level, safe processing process, no toxicity and pollution, higher environmental protection level, better ageing resistance, longer service life and lower manufacturing cost. And through setting up silica gel protective layer 20 and covering the marginal zone of radiator 101, when not influencing the radiating effect of radiator 101, can seal the device of radiator 101 below, play better guard action.
In addition, since the types of the silica gel are various, different types of silica gel bring further effects while protecting the circuit board, and if the used silica gel is a silica gel with heat conduction property, the silica gel protective layer 20 also has good heat dissipation performance; if the silicone used is antistatic, the silicone protective layer 20 will also have good electrostatic protection properties.
The circuit board that this embodiment provided includes the circuit board body and sets up in the silica gel protective layer of circuit board body first surface and second surface, because silica gel has good high low temperature characteristic, excellent water repellency, film forming ability is strong, corrosion-resistant, ageing-resistant, the drawing of patterns is convenient, characteristics such as low price, consequently adopt the silica gel protective layer to cover the circuit board body when realizing carrying out better protection to the circuit board for circuit board operating temperature range is wider, fire-resistant grade is higher, the course of working is safe, nontoxic pollution-free, environmental protection grade is higher, ageing resistance is better and life is longer, circuit board cost of manufacture is lower. And through setting up the marginal zone of silica gel protective layer cover radiator, when not influencing the radiating effect of radiator, can seal the device of radiator below, play better guard action.
When it should be noted that, in this embodiment, only the silica gel protection layer is exemplarily shown to be disposed on the first surface and the second surface of the circuit board body, but the invention is not limited to the foregoing embodiment, and in other embodiments, the silica gel protection layer may be disposed on more surfaces of the circuit board body, for example, the circuit board body is covered entirely, so as to achieve better protection of the circuit board body.
Fig. 2 is a schematic top view of a circuit board provided in this embodiment, and fig. 3 is a schematic cross-sectional view of the circuit board along a section line AA in fig. 2, optionally, referring to fig. 2 and fig. 3, a circuit board body 101 includes a device region 13 and a peripheral region 14 surrounding the device region 13, and the device region 13 of the circuit board body 10 includes components;
a separation layer 30 is arranged between the silica gel protective layer 20 and the circuit board body 10 in the device region 13;
The edge region of the heat sink 101 is in direct contact with the silicone protective layer 20.
The silicone protection layer 20 in the peripheral region 14 and the edge region of the heat sink 101 is in direct contact with the circuit board body 10 or the heat sink 101, and the part of the region is tightly combined with the silicone protection layer 20 after being cleaned. The separation layer 30 is used for separating the silica gel protective layer 20 and the circuit board body 10, so that the silica gel protective layer can be conveniently removed when the circuit board needs to be repaired, and the circuit board can be reused.
Fig. 4 is a schematic view of still another circuit board provided in this embodiment, optionally, referring to fig. 4, the circuit board includes a heat generating device 102, and a heat spreader 101 is disposed on a side of the heat generating device 102 away from the circuit board body 10;
A filler layer 103 is provided between the heat sink 101 and the circuit board body 10 in a region surrounding the heat generating device 102.
Specifically, since there may be a larger gap between the heat sink 101 and the heat generating device 102, if the silicone protection layer 20 is directly manufactured, more silicone material may be consumed, and the filling layer 103 is disposed between the heat sink 101 and the circuit board body 10 in the area surrounding the heat generating device 102, so that the silicone is directly formed into a film outside the filling layer 103, thereby reducing waste of raw materials.
Optionally, the filling layer 103 is foam or sponge.
Specifically, the foam and the sponge have strong plasticity and low price, and the foam or the sponge can be used for well filling the gap between the radiator 101 and the heating device 102.
Alternatively, the width D of the peripheral region 14 is 2-5mm.
The peripheral area 13 is a fixed area of the silica gel protective layer 20, when the width of the peripheral area 13 is too small, the contact area between the silica gel protective layer 20 and the circuit board body 10 is easily caused to be too small, the silica gel protective layer 20 is easily dropped off, and when the peripheral area 13 is too large, the time required for removing the silica gel protective layer 20 during repair is long. Through setting up the width of peripheral zone 13 to 2-5mm, guarantee that silica gel protective layer 20 has great area of contact with circuit board body 10, when having better bonding strength, can be faster when having guaranteed the circuit board and reprocessed and get rid of silica gel protective layer 20, improve the speed of reprocessing. Illustratively, the width of the peripheral zone 13 may be 3mm.
Alternatively, the spacer layer 30 may be made of a material including paraffin or oil based glue.
Specifically, a method of using a silica gel product in a demolding process may be utilized, a separation layer 30 is covered on the device region 13 by spraying paraffin or oil glue, and then a silica gel layer 20 is formed by spraying silica gel on a surface of the separation layer 30 far from the circuit board body 10. The external substances are blocked outside by the silica gel protective layer 20, and the circuit board and the device are enclosed in a closed environment, so that the protective effect is achieved. By forming the separation layer by adopting paraffin, oily glue or other materials, the circuit board body 10 can be separated from the silica gel protective layer 20 without complex process, and the circuit board can be repaired.
Optionally, referring to fig. 4, the peripheral area 14 of the circuit board body 10 and the edge area of the heat sink 101 each include a fixing hole 15, and a fixing bead 40 is disposed on the surface of the silica gel protective layer 20 away from the circuit board body 10; the fixing bead 40 is installed in the fixing hole 15.
Specifically, the fixing pressing strip 40 can further press the silica gel protective layer 20 and the circuit board body 10, plays a role in fixing the silica gel protective layer 20, further prevents the silica gel protective layer 20 from falling off, and improves the protection stability of the silica gel protective layer 20.
It should be noted that, when the edge area of the heat sink 101 is smaller in size, the size of the fixing hole 15 in the edge area of the heat sink 101 may be smaller than the size of the fixing hole 15 in the peripheral area 14 of the circuit board body.
Alternatively, the thickness of the silicone protective layer 20 may be greater than or equal to 0.3mm and less than or equal to 0.5mm.
Specifically, the thickness of the silica gel protective layer 20 is too large to reduce the volume of the circuit board, the requirement on the film forming process is too high when the thickness of the silica gel protective layer 20 is too low, and the thickness of the silica gel protective layer is larger than or equal to 0.3mm and smaller than or equal to 0.5mm, so that the preparation process difficulty of the silica gel protective layer 20 is reduced, and meanwhile, the volume of the circuit board is reduced.
Fig. 5 is a schematic diagram of yet another circuit board provided in this embodiment, and optionally, referring to fig. 5, the circuit board further includes:
The electrostatic protection layer 50, the electrostatic protection layer 50 is disposed on a surface of the silica gel protection layer 20 away from the circuit board body 10.
The electrostatic protection layer 50 may be a conductive coating such as a conductive paint. By spraying conductive paint on the outer side of the silica gel protective layer 20, the effect similar to a shielding case can be achieved, and electrostatic protection of components on a circuit board is achieved. The embodiment adopts the form of combining the silica gel protective layer 20 and the electrostatic protection layer 50, realizes the electrostatic protection of components while realizing the protection effects of water resistance, corrosion resistance, environmental pollution prevention and the like on the components on the circuit board body 10, and the manufacture process of the silica gel protective layer 20 and the electrostatic protection layer 50 is simple, the thickness is small and the weight is light, so the scheme of the embodiment simultaneously reduces the manufacture cost, the weight and the volume of the circuit board. And through setting up the marginal zone of silica gel protective layer cover radiator, when not influencing the radiating effect of radiator, can seal the device of radiator below, play better guard action.
The embodiment also provides a method for manufacturing a circuit board, and fig. 6 is a flowchart of the method for manufacturing a circuit board provided in the embodiment, and referring to fig. 6, the method includes:
Step 110, providing a circuit board body, wherein the circuit board body comprises a first surface and a second surface which are oppositely arranged, and the first surface of the circuit board body is provided with a radiator;
Step 120, a silica gel protective layer is disposed, and the silica gel protective layer covers the second surface, the area of the first surface where the radiator is not disposed, and the edge area of the radiator.
According to the circuit board manufacturing method, the silica gel protective layers are arranged on the first surface and the second surface, and the silica gel has the characteristics of good high-low temperature characteristics, excellent water repellency, strong film forming capability, corrosion resistance, ageing resistance, convenience in demolding, low price and the like. And through setting up the marginal zone of silica gel protective layer cover radiator, when not influencing the radiating effect of radiator, can seal the device of radiator below, play better guard action.
Optionally, before the first surface and the second surface are provided with the silica gel protective layer, the method further includes:
a separation layer is arranged between the silica gel protective layer and the circuit board body;
The circuit board body comprises a device area and a peripheral area surrounding the device area, and the device area of the circuit board body comprises components;
the separation layer is arranged between the silica gel protective layer of the device region and the circuit board body.
Specifically, the separation layer may be formed on the circuit board body by spraying or the like. The separating layer may be paraffin or oily glue.
Optionally, providing a silica gel protective layer includes:
and forming a silica gel protective layer by adopting a spraying mode.
Specifically, can adopt hydraulic silica gel, through the spraying, form the membrane that one deck has toughness, silica gel protective layer promptly, the thickness of silica gel protective layer can change according to the difference of protection level.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, and that various obvious changes, rearrangements, combinations, and substitutions can be made by those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (9)
1. A circuit board, comprising:
the circuit board comprises a circuit board body, wherein the circuit board body comprises a first surface and a second surface which are oppositely arranged, and a radiator is arranged on the first surface of the circuit board body;
the circuit board further comprises a silica gel protective layer, wherein the silica gel protective layer covers the second surface, the area of the first surface where the radiator is not arranged and the edge area of the radiator;
the silica gel protective layer covers other surfaces of the circuit board body except the first surface and the second surface;
The circuit board body comprises a device region and a peripheral region surrounding the device region, and the device region of the circuit board body comprises components;
a separation layer is arranged between the silica gel protective layer and the circuit board body in the device region;
the edge area of the radiator is in direct contact with the silica gel protective layer; the silica gel protective layer is sprayed on the surface of the separation layer far away from the circuit board body.
2. The circuit board of claim 1, wherein:
the circuit board comprises a heating device, and the radiator is arranged on one side, far away from the circuit board body, of the heating device;
And a filling layer is arranged between the radiator and the circuit board body and surrounds the area of the heating device.
3. The circuit board of claim 2, wherein:
the filling layer is foam or sponge.
4. The circuit board of claim 1, wherein:
The width of the peripheral zone is 2-5mm.
5. The circuit board of claim 1, wherein:
The separating layer is made of paraffin or oily glue.
6. The circuit board of claim 1, wherein:
the peripheral area of the circuit board body and the edge area of the radiator both comprise fixing holes, and a fixing pressing strip is arranged on the surface of the silica gel protective layer, which is far away from the circuit board body; the fixing pressing strip is arranged in the fixing hole.
7. The circuit board of claim 1, wherein:
The thickness of the silica gel protective layer is more than or equal to 0.3mm and less than or equal to 0.5mm.
8. The circuit board of claim 1, further comprising:
the electrostatic protection layer is arranged on the surface, far away from the circuit board body, of the silica gel protection layer.
9. A method of manufacturing a circuit board, comprising:
Providing a circuit board body, wherein the circuit board body comprises a first surface and a second surface which are oppositely arranged, and the first surface of the circuit board body is provided with a radiator;
A silica gel protective layer is arranged, and the silica gel protective layer covers the second surface, the area of the first surface, where the radiator is not arranged, and the edge area of the radiator;
the silica gel protective layer covers other surfaces of the circuit board body except the first surface and the second surface;
The circuit board body comprises a device region and a peripheral region surrounding the device region, and the device region of the circuit board body comprises components; a separation layer is arranged between the silica gel protective layer and the circuit board body in the device region; the edge area of the radiator is in direct contact with the silica gel protective layer; the silica gel protective layer is sprayed on the surface of the separation layer far away from the circuit board body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110247210.0A CN115038231B (en) | 2021-03-05 | 2021-03-05 | Circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110247210.0A CN115038231B (en) | 2021-03-05 | 2021-03-05 | Circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115038231A CN115038231A (en) | 2022-09-09 |
| CN115038231B true CN115038231B (en) | 2024-06-11 |
Family
ID=83118000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110247210.0A Active CN115038231B (en) | 2021-03-05 | 2021-03-05 | Circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115038231B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105555015A (en) * | 2014-10-28 | 2016-05-04 | 罗伯特·博世有限公司 | Electrical apparatus for use in a contaminating medium and a method for producing same |
| CN206564724U (en) * | 2016-12-15 | 2017-10-17 | 艾默生网络能源系统北美公司 | A kind of cooling circuit board, circuit board assemblies and electronic equipment |
| CN107613674A (en) * | 2017-08-01 | 2018-01-19 | 深圳明阳电路科技股份有限公司 | The preparation method of one stepped PCB board |
| US10187984B1 (en) * | 2017-09-27 | 2019-01-22 | Avary Holding (Shenzhen) Co., Limited. | Circuit board and method for making the same |
| CN210694473U (en) * | 2019-10-14 | 2020-06-05 | 黄秋虎 | Novel circuit board with dampproofing and waterproofing function |
| CN211184404U (en) * | 2019-11-25 | 2020-08-04 | 深圳市鑫宇新科技有限公司 | PCBA circuit board with heat radiation structure |
| CN214315740U (en) * | 2021-03-05 | 2021-09-28 | 北京全路通信信号研究设计院集团有限公司 | Circuit board |
-
2021
- 2021-03-05 CN CN202110247210.0A patent/CN115038231B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555015A (en) * | 2014-10-28 | 2016-05-04 | 罗伯特·博世有限公司 | Electrical apparatus for use in a contaminating medium and a method for producing same |
| CN206564724U (en) * | 2016-12-15 | 2017-10-17 | 艾默生网络能源系统北美公司 | A kind of cooling circuit board, circuit board assemblies and electronic equipment |
| CN107613674A (en) * | 2017-08-01 | 2018-01-19 | 深圳明阳电路科技股份有限公司 | The preparation method of one stepped PCB board |
| US10187984B1 (en) * | 2017-09-27 | 2019-01-22 | Avary Holding (Shenzhen) Co., Limited. | Circuit board and method for making the same |
| CN210694473U (en) * | 2019-10-14 | 2020-06-05 | 黄秋虎 | Novel circuit board with dampproofing and waterproofing function |
| CN211184404U (en) * | 2019-11-25 | 2020-08-04 | 深圳市鑫宇新科技有限公司 | PCBA circuit board with heat radiation structure |
| CN214315740U (en) * | 2021-03-05 | 2021-09-28 | 北京全路通信信号研究设计院集团有限公司 | Circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115038231A (en) | 2022-09-09 |
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